Display panel and display device

Abstract

The application discloses a display panel and a display device. The display panel comprises a first substrate, the first substrate comprises a plurality of arrayed sub-pixel regions, each of the sub-pixel regions comprises a main binding pad and a backup binding pad arranged on the first substrate, and a micro light emitting diode electrically connected with the main binding pad or the backup binding pad. The main binding pad and the backup binding pad are in a first symmetrical mode with respect to a first symmetrical reference object. The sub-pixel region is in a second symmetrical mode with respect to a second symmetrical reference object. The first symmetrical mode is the same as the second symmetrical mode. The distance between the vertical projection of the first symmetrical reference object on the first substrate and the vertical projection of the second symmetrical reference object on the first substrate is S1, and S1 is less than or equal to 10 microns. The problem that the micro light emitting diode is damaged and the sub-pixel cannot display is solved. Even if the sub-pixel is repaired, the light emitting effect of the sub-pixel is still consistent with that when the sub-pixel is not repaired, and the display uniformity is ensured.

Description

[0001] This application is a divisional application of application number 202011379140.6, application date November 30, 2020, and invention title "A display panel and display device". Technical Field

[0002] This invention relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0003] Currently, micro light-emitting diode (Micro LED) display panels are attracting increasing attention in the display market due to their advantages such as high brightness, low operating voltage, low power consumption, long lifespan, impact resistance, and stable performance.

[0004] Existing Micro-LED display panels include multiple sub-pixels arranged in an array. Each sub-pixel includes a main bonding pad and a backup bonding pad. When the micro-LED on the main bonding pad is damaged, the micro-LED on the backup bonding pad is activated to ensure the display of the sub-pixel.

[0005] However, in existing technologies, the primary bonding pads and backup bonding pads are positioned differently relative to the sub-pixels. Because the intensity of light emitted by a micro LED varies in different directions, the light emission effect after sub-pixel repair will be significantly different from that before repair. Undoubtedly, this will affect the display uniformity of the display panel. Summary of the Invention

[0006] This invention provides a display panel and display device that, even if a sub-pixel is repaired, still ensures that the light emission effect of the sub-pixel is consistent with that of the unrepaired sub-pixel, thus ensuring display uniformity.

[0007] In a first aspect, embodiments of the present invention provide a display panel, the display panel comprising:

[0008] A first substrate, comprising a plurality of sub-pixel regions arranged in an array, each sub-pixel region comprising:

[0009] The main bonding pad and the spare bonding pad are disposed on the first substrate;

[0010] A miniature light-emitting diode electrically connected to the main bonding pad or the spare bonding pad;

[0011] The primary bonding pad and the backup bonding pad are symmetrical about a first symmetrical reference object; the sub-pixel region is symmetrical about a second symmetrical reference object.

[0012] The first symmetry method and the second symmetry method are the same;

[0013] The distance between the vertical projection of the first symmetrical reference object on the first substrate and the vertical projection of the second symmetrical reference object on the first substrate is S1, where S1≤10μm.

[0014] Secondly, embodiments of the present invention also provide a display device, which includes the display panel described in the first aspect.

[0015] The display panel and display device provided in this invention solve the problem in the prior art where the sub-pixel cannot be displayed when the micro-light-emitting diode on the main bonding pad is damaged, by setting a main bonding pad and a backup bonding pad in each sub-pixel area. Furthermore, because the main bonding pads and the backup bonding pads are symmetrical about a first symmetrical reference object, and the sub-pixel areas where the main bonding pads and the backup bonding pads are located are symmetrical about a second symmetrical reference object, the positions of the main bonding pads and the backup bonding pads relative to the sub-pixel are basically the same. That is, the positions of the micro-LEDs electrically connected to the main bonding pads and the micro-LEDs electrically connected to the backup bonding pads relative to the sub-pixel are basically the same. This avoids differences in the light emission effect of the sub-pixel when the positions of the main bonding pads and the backup bonding pads relative to the sub-pixel are different. Even if the subsequent film layer affects the light emitted by the micro-LEDs, because the morphology of the subsequent film layer is symmetrically set, the influence of the subsequent film layer on the light emitted by the micro-LEDs electrically connected to the main bonding pads and the micro-LEDs electrically connected to the backup bonding pads is basically the same. Thus, even if the sub-pixel is repaired, the light emission effect after repair is basically the same as before repair, avoiding significant differences in the light emission effect after sub-pixel repair and affecting the display uniformity of the display panel. Attached Figure Description

[0016] Other features, objects, and advantages of the invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0017] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0018] Figure 2 yes Figure 1 Enlarged view of the dashed box;

[0019] Figure 3 This is a schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present invention;

[0020] Figure 4 This is a partial structural schematic diagram of a display panel provided in an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the structure of a single-electrode micro light-emitting diode provided in an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the structure of a dual-electrode micro light-emitting diode provided in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention;

[0024] Figure 8 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0025] Figure 9 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0026] Figure 10 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0027] Figure 11 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0028] Figure 12 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0029] Figure 13 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0030] Figure 14 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention;

[0031] Figure 15 This is a partial structural schematic diagram of another display panel provided in an embodiment of the present invention;

[0032] Figure 16 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings in the embodiments of this invention, through specific implementation methods. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort fall within the protection scope of this invention.

[0034] In view of the problems in the background art, embodiments of the present invention provide a display panel. Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. Figure 2 yes Figure 1 Enlarged view of the dashed box, as shown Figure 1 and Figure 2 As shown, the display panel 100 provided in this embodiment of the invention includes: a first substrate 10, the first substrate 10 including a plurality of sub-pixel regions BB arranged in an array, each sub-pixel region BB including: a main bonding pad 20 and a spare bonding pad 30 disposed on the first substrate 10; a micro light-emitting diode (not shown) electrically connected to the main bonding pad 20 or the spare bonding pad 30; the main bonding pad 20 and the spare bonding pad 30 are in a first symmetrical arrangement with respect to a first symmetrical reference object 40; the sub-pixel region BB is in a second symmetrical arrangement with respect to a second symmetrical reference object 50; the first symmetrical arrangement and the second symmetrical arrangement are the same; the distance between the vertical projection of the first symmetrical reference object 40 on the first substrate 10 and the vertical projection of the second symmetrical reference object 50 on the first substrate 10 is S1, where S1 ≤ 10 μm. It should be noted that when dealing with the size of different products, S1 can be set with reference to the following formula, i.e., S1 / Q1 < 50%; where Q1 is the size of the long side of the micro light-emitting diode.

[0035] Specifically, in this embodiment, a primary bonding pad 20 is provided in each sub-pixel region BB, while a backup bonding pad 30 is also provided. When the micro LED on the primary bonding pad 20 is damaged, the micro LED with the same light emission color on the backup bonding pad 30 is activated. That is, the micro LED on the backup bonding pad 30 emits light in place of the damaged micro LED on the primary bonding pad 20, thereby realizing the display of the sub-pixel. This solves the problem in the prior art that when the micro LED in the sub-pixel region is damaged, the sub-pixel where the micro LED is located cannot be displayed, affecting the display effect.

[0036] Furthermore, considering that the intensity of light emitted by a micro-LED varies in different directions, and the position of the bonding pad determines the position of the micro-LED, which in turn determines the light emission effect of the sub-pixel containing that micro-LED, when the positions of the main bonding pad 20 and the spare bonding pad 30 relative to the sub-pixel are different, the positions of the micro-LED electrically connected to the main bonding pad 20 and the micro-LED electrically connected to the spare bonding pad 30 relative to the sub-pixel will also be different, thus causing differences in the light emission effect of the sub-pixel. In addition, considering that some film layers on the side of the micro-LED away from the first substrate 10 may exhibit different morphologies at the edges and center during fabrication—for example, when printing quantum dot structures using inkjet printing technology, a coffee ring effect may occur where the quantum dot structure at the edge of the sub-pixel region BB is thicker than the one in the center; similarly, when fabricating a color resist structure, a bull's horn-shaped protrusion may form at the overlap between the color resist structure and the blocking structure. Therefore, when the positions of the primary bonding pad 20 and the secondary bonding pad 30 relative to the sub-pixel are different, the light emitted by the micro-LED electrically connected to the primary bonding pad 20 and the light emitted by the micro-LED electrically connected to the secondary bonding pad 30 will have different effects on the subsequent film layers when passing through the sub-pixel, thus leading to differences in the light emission effect of the sub-pixel. For example, Figure 3 This is a schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present invention, as shown below. Figure 3As shown, the main bonding pad 20 is located near the center of the sub-pixel region BB, while the spare bonding pad 30 is located near the edge of the sub-pixel region BB. That is, the positions of the main bonding pad 20 and the spare bonding pad 30 relative to the sub-pixel are significantly different. When a color resist structure 60 is provided on the side of the micro-LED 21 facing away from the first substrate 10, the light emitted by the micro-LED 21 electrically connected to the main bonding pad 20 and the light emitted by the micro-LED 21 electrically connected to the spare bonding pad 30 pass through the color resist structure 60. Due to the different morphologies of the edge and center of the color resist structure 60, the light will... The color resist structure 60 has different effects on the light emitted by the micro-LED 21 electrically connected to the main bonding pad 20 at the center of the sub-pixel area BB and the light emitted by the micro-LED 21 electrically connected to the backup bonding pad 30 at the edge of the sub-pixel area BB, resulting in differences in the light emission effect of the sub-pixel. In other words, when the micro-LED 21 on the main bonding pad 20 is damaged and the micro-LED 21 on the backup bonding pad 30 is activated to ensure that the sub-pixel emits light, the light emission effect of the sub-pixel is significantly different, thus affecting the display effect. Therefore, in this embodiment, by setting the main bonding pad 20 and the spare bonding pad 30 to be in a first symmetrical manner with respect to the first symmetrical reference object 40, and the sub-pixel region BB to be in a second symmetrical manner with respect to the second symmetrical reference object 50, the first and second symmetrical manners are the same, so that the positions of the main bonding pad 20 and the spare bonding pad 30 relative to the sub-pixel are basically the same. That is, the micro-light-emitting diodes electrically connected to the main bonding pad 20 and the micro-light-emitting diodes electrically connected to the spare bonding pad 30 are in the same position relative to the sub-pixel. Even if the subsequent film layer affects the light emitted by the micro-light-emitting diodes, since the morphology of the subsequent film layer is symmetrically set, the influence of the subsequent film layer on the light emitted by the micro-light-emitting diodes electrically connected to the main bonding pad 20 and the micro-light-emitting diodes electrically connected to the spare bonding pad 30 is basically the same. In this way, even if the sub-pixel is repaired, the light emission effect after repair is basically the same as before repair, avoiding significant differences in the light emission effect after sub-pixel repair and affecting the display uniformity of the display panel.

[0037] The first and second symmetry modes can be axially symmetric, centrally symmetric, etc. When the first and second symmetry modes are axially symmetric, the corresponding reference object is the axis of symmetry; when the first and second symmetry modes are centrally symmetric, the corresponding reference object is the center of symmetry.

[0038] For example, see [link to example]. Figure 2Both the first and second symmetry methods are axially symmetric; the first symmetry reference object 40 is the first axis of symmetry, and the second symmetry reference object 50 is the second axis of symmetry; the first and second axes of symmetry are parallel. That is, the main bonding pad 20 and the spare bonding pad 30 are axially symmetric about the first axis of symmetry, and the sub-pixel region BB where the main bonding pad 20 and the spare bonding pad 30 are located are axially symmetric about the second axis of symmetry, and the first and second axes of symmetry are parallel. The distance between the vertical projection of the first axis of symmetry on the first substrate 10 and the vertical projection of the second axis of symmetry on the first substrate 10 is S1, where S1 ≤ 10 μm. For example, if S1 is 0, then the first and second axes of symmetry coincide.

[0039] For example, Figure 4 This is a partial structural diagram of a display panel provided in an embodiment of the present invention, as shown below. Figure 4 As shown, both the first and second symmetry methods are centrally symmetric; the first symmetry reference object 40 is the first symmetry center, and the second symmetry reference object 50 is the second symmetry center. That is, the main bonding pad 20 and the spare bonding pad 30 are centrally symmetric about the first symmetry center, and the sub-pixel region BB where the main bonding pad 20 and the spare bonding pad 30 are located are centrally symmetric about the second symmetry center. The distance between the vertical projection of the first symmetry center on the first substrate 10 and the vertical projection of the second symmetry center on the first substrate 10 is S1, where S1 ≤ 10 μm. For example, if S1 is 0, then the first symmetry center and the second symmetry center coincide.

[0040] Optionally, the first substrate 10 may be a rigid substrate or a flexible substrate. When the first substrate 10 is a rigid substrate, the material of the first substrate 10 may include, for example, glass. When the first substrate 10 is a flexible substrate, the material of the first substrate 10 may include, for example, at least one of polyetherimide (PEI), polyethylene terephthalate (PET), polyimide (PI), and polyethylene naphthalate (PEN).

[0041] Optionally, the micro light-emitting diode may include a single-electrode micro light-emitting diode or a dual-electrode micro light-emitting diode. Those skilled in the art can choose according to the actual situation, and this embodiment does not make specific limitations. Figure 5 This is a schematic diagram of the structure of a single-electrode micro light-emitting diode provided in an embodiment of the present invention, as shown below. Figure 5 As shown, when a micro light-emitting diode includes a single-electrode micro light-emitting diode, the single-electrode micro light-emitting diode includes a first electrode 61, a first type semiconductor layer 62, an active layer 63, a second type semiconductor layer 64, and a second electrode 65, which are sequentially disposed away from the first substrate 10. Figure 6 This is a schematic diagram of the structure of a dual-electrode micro light-emitting diode provided in an embodiment of the present invention, as shown below. Figure 6As shown, when a micro light-emitting diode includes a dual-electrode micro light-emitting diode, the dual-electrode micro light-emitting diode includes a first type semiconductor layer 62, an active layer 63 and a second type semiconductor layer 64 disposed sequentially away from the first substrate 10; it also includes a first electrode 61 and a second electrode 65; wherein, the first electrode 61 is located on the side of the first type semiconductor layer 62 away from the active layer 63; the second electrode 65 is located on the side of the second type semiconductor layer 64 close to the active layer 63.

[0042] It is understood that the display panel 100 in this embodiment of the invention can be an active matrix LED display panel or a passive matrix LED display panel. When the display panel 100 is an active matrix LED display panel, each sub-pixel region BB in the display panel 100 is also provided with a driving circuit (not shown in the figure). This driving circuit is electrically connected to the micro LED and is used to drive the micro LED in the corresponding sub-pixel region BB to emit light. Under the premise of achieving the above functions, this embodiment of the invention does not specifically limit the specific structure of the driving circuit. When the display panel 100 is a passive matrix LED display panel, each micro LED can be driven row by row, column by column, or individually. The specific driving method is not specifically limited in this embodiment of the invention.

[0043] Optional, Figure 7 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention, as shown below. Figure 7 As shown, the sub-pixel region BB also includes a first reflective unit 81 and a second reflective unit 82. The first reflective unit 81 is located on the side of the main bonding pad 20 near the first substrate 10, and the second reflective unit 82 is located on the side of the spare bonding pad 30 near the first substrate 10. The first reflective unit 81 and the second reflective unit 82 are arranged in a seventh symmetrical manner with respect to the seventh symmetrical reference object 83. The first symmetrical manner and the seventh symmetrical manner are the same. The distance between the vertical projection of the seventh symmetrical reference object 83 on the first substrate and the vertical projection of the first symmetrical reference object on the first substrate is S6, where S6 ≤ 10 μm. It should be noted that when dealing with the dimensions of different products, S6 can be set with reference to the following formula, i.e., S6 / Q1 < 50%; where Q1 is the dimension of the long side of the micro light-emitting diode 21. Figure 7Taking S6 as 0, i.e., the first reference object 40, the second reference object 50, and the seventh symmetrical reference object 83 coincide, as an example. When light is emitted by the micro-light-emitting diode 21 connected to the main bonding pad 20, the first reflection unit 81 reflects the emitted light; when the micro-light-emitting diode 21 electrically connected to the spare bonding pad 30 is activated, the second reflection unit 82 reflects the emitted light, i.e., the light emission efficiency of the sub-pixel is improved by setting the reflection units; in addition, since reflection units are set under both the main bonding pad 20 and the spare bonding pad 30, and the first reflection unit 81 and the second reflection unit 82 are in a seventh symmetrical manner with respect to the seventh symmetrical reference object 83; the first symmetrical manner and the seventh symmetrical manner are the same; the distance between the vertical projection of the seventh symmetrical reference object 83 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is small, further making the light emission effect of the sub-pixel after repair basically the same as before repair. Optionally, when the display panel is an active matrix light-emitting diode display panel, the driving circuit in the display panel may include, for example, multiple metal layers. The first reflective layer and the second reflective layer may be disposed in the same layer as the metal layer closest to the main bonding pad in the multiple metal layers, thereby simplifying the process steps.

[0044] In summary, the display panel provided by the embodiments of the present invention solves the problem in the prior art where the sub-pixel cannot be displayed when a micro-LED on the main bonding pad is damaged, by setting a main bonding pad and a backup bonding pad in each sub-pixel area. Furthermore, since the main bonding pad and the backup bonding pad are symmetrical about a first symmetrical reference object, and the sub-pixel areas where the main bonding pad and the backup bonding pad are located are symmetrical about a second symmetrical reference object, the positions of the main bonding pad and the backup bonding pad relative to the sub-pixel are substantially the same, meaning that the micro-LEDs electrically connected to the main bonding pad are also symmetrical about the second symmetrical reference object. The positions of the photodiode and the micro-LED electrically connected to the spare bonding pad are basically the same relative to the sub-pixel. This avoids differences in the light emission effect of the sub-pixel when the positions of the main bonding pad and the spare bonding pad are different relative to the sub-pixel. Furthermore, even if the subsequent film layer affects the light emitted by the micro-LED, since the morphology of the subsequent film layer is symmetrically set, the influence of the subsequent film layer on the light emitted by the micro-LED electrically connected to the main bonding pad is basically the same as the influence on the light emitted by the micro-LED electrically connected to the spare bonding pad. Thus, even if the sub-pixel is repaired, the light emission effect after repair is basically the same as before repair, avoiding significant differences in the light emission effect after sub-pixel repair and affecting the display uniformity of the display panel.

[0045] Optional, see below Figure 2The distance W1 between the primary bonding pad 20 and the secondary bonding pad 30 ranges from 10μm to 50μm. For example, the distance W1 between the primary bonding pad 20 and the secondary bonding pad 30 is 10μm, 15μm, 20μm, 30μm, or 50μm. The distance between the main bonding pad 20 and the spare bonding pad 30 is set to a range of 10μm-50μm. This ensures that the distance between the main bonding pad 20 and the spare bonding pad 30 is not too large, which would cause both the main bonding pad 20 and the spare bonding pad 30 to be located at the edge of the sub-pixel region BB. In this way, whether the micro-LED electrically connected to the main bonding pad 20 emits light or the micro-LED on the spare bonding pad 30 is activated, the light output of the sub-pixel will be reduced, thus affecting the light output effect. Conversely, the distance between the main bonding pad 20 and the spare bonding pad 30 is not too small, which would cause a short circuit between the main bonding pad 20 and the spare bonding pad 30, affecting the display of the micro-LED. Therefore, in this embodiment, it is preferable to set the distance between the main bonding pad 20 and the spare bonding pad 30 to a range of 10μm-50μm to ensure a good light output effect of the display panel 100 without affecting the normal display of the micro-LED.

[0046] Furthermore, short circuits between primary and secondary bonded pads can be prevented not only by limiting the distance between them, but also by setting their positional relationship. Optionally, Figure 8 This is a partial structural diagram of another display panel provided in an embodiment of the present invention, such as... Figure 8 As shown, both the first and second symmetry methods are centrally symmetric; the reference object for the first symmetry is the first center of symmetry, and the reference object for the second symmetry is the second center of symmetry; wherein, Figure 8Taking S1 as 0, i.e., the first and second centers of symmetry coincide, as an example. The main bonding pad 20 includes a first main bonding pad 21 and a second main bonding pad 22; the spare bonding pad 30 includes a first spare bonding pad 31 and a second spare bonding pad 32. That is, the micro-LED electrically connected to the main bonding pad 20 or the micro-LED electrically connected to the spare bonding pad is a dual-electrode micro-LED. Specifically, the projection of the first spare bonding pad 31 onto the line connecting the first main bonding pad 21 and the second main bonding pad 22 is located at the gap EE between the first main bonding pad 21 and the second main bonding pad 22; the projection of the second main bonding pad 22 onto the line connecting the first spare bonding pad 31 and the second spare bonding pad 32 is located at the gap DD between the first spare bonding pad 31 and the second spare bonding pad 32. By staggering the first primary bonding pad 21 and the second primary bonding pad 22 in the primary bonding pad 20 with the first backup bonding pad 31 and the second backup bonding pad 32 in the backup bonding pad 30, short circuits between the first primary bonding pad 21 and the second primary bonding pad 22 and the first backup bonding pad 31 and the second backup bonding pad 32 can be avoided.

[0047] Optionally, when both the first and second symmetry methods are axially symmetric; the first symmetry reference object is the first axis of symmetry, and the second symmetry reference object is the second axis of symmetry; and the first and second axes of symmetry are parallel, the second axes of symmetry of each sub-pixel region are parallel. To illustrate this beneficial effect, the following will compare it with the case where the second axes of symmetry of each sub-pixel region in the display panel are partially parallel and partially perpendicular. Here, we take S1 as 0, i.e., the first and second axes of symmetry coincide, as an example.

[0048] For example, Figure 9 This is a partial structural diagram of another display panel provided in an embodiment of the present invention, as shown below. Figure 9As shown, multiple sub-pixel regions BB include a first sub-pixel region BB1, a second sub-pixel region BB2, and a third sub-pixel region BB3. The second axis of symmetry of the first sub-pixel region BB1 is parallel to the second axis of symmetry of the second sub-pixel region BB2, and the second axis of symmetry of the first sub-pixel region BB1 is perpendicular to the second axis of symmetry of the third sub-pixel region BB3. Since the directions of the symmetry axes are different, indicating different orientations of the micro-LEDs, when transferring micro-LEDs to their respective sub-pixel regions BB, the micro-LEDs in the first sub-pixel region BB1 and the second sub-pixel region BB2 can be transferred simultaneously because the second axis of symmetry of the first sub-pixel region BB1 is parallel to the second axis of symmetry of the second sub-pixel region BB2. However, since the second axis of symmetry of the first sub-pixel region BB1 is perpendicular to the second axis of symmetry of the third sub-pixel region BB3, the same transfer process cannot be used to transfer the micro-LEDs in the third sub-pixel region BB3. Furthermore, because the existing process for transferring micro-LEDs within the display panel is already quite complex, different symmetry axis directions will inevitably further increase the cost and efficiency of display panel manufacturing.

[0049] Figure 10 This is a partial structural diagram of another display panel provided in an embodiment of the present invention, as shown below. Figure 10 As shown, the multiple sub-pixel regions BB include a first sub-pixel region BB1, a second sub-pixel region BB2, and a third sub-pixel region BB3. The second axes of symmetry of the first sub-pixel region BB1, the second sub-pixel region BB2, and the third sub-pixel region BB3 are all parallel. Since the axes of symmetry of each sub-pixel region BB are in the same direction—that is, regardless of whether the micro-LEDs are located on the main bonding pad 20 or the spare bonding pad 30—the placement direction of the micro-LEDs in each sub-pixel region BB is the same. Therefore, the same transfer process can be used to transfer the micro-LEDs corresponding to all sub-pixel regions BB. This ensures that the light emission effect after sub-pixel repair is basically consistent with that before repair, without increasing the process difficulty.

[0050] Optionally, when both the first and second symmetry methods are axially symmetric; the first symmetry reference object is the first axis of symmetry, and the second symmetry reference object is the second axis of symmetry; and the first and second axes of symmetry are parallel, the second axis of symmetry of the sub-pixel region is parallel to the long side of that sub-pixel region. To illustrate this beneficial effect, the following will compare it with the case where the second axis of symmetry of each sub-pixel region in the display panel is parallel to the short side of that sub-pixel region. Here, we take S1 as 0, i.e., the first and second axes of symmetry coincide, as an example.

[0051] For example, Figure 11This is a partial structural diagram of another display panel provided in an embodiment of the present invention, as shown below. Figure 11 As shown, the second axis of symmetry of the sub-pixel region BB is parallel to the short side of the sub-pixel region BB. At this time, if the micro-light-emitting diode on the spare bonding pad 30 is enabled to ensure the sub-pixel display, the distance L2 from the edge of the micro-light-emitting diode to the edge of the area where the main bonding pad 20 is located is relatively long. Therefore, the uniformity of light emission within the sub-pixel region BB covered by the light emitted by the micro-light-emitting diode on the spare bonding pad 30 is poor.

[0052] Figure 12 This is a partial structural diagram of another display panel provided in an embodiment of the present invention, as shown below. Figure 12 As shown, the second axis of symmetry of the sub-pixel region BB is parallel to the long side of the sub-pixel region BB. When the micro-LEDs on the spare bonding pad 30 are used to ensure sub-pixel display, the distance L1 from the edge of the micro-LED to the edge of the area where the main bonding pad 20 is located is shorter. Therefore, the difference in light intensity within the sub-pixel region BB covered by the light emitted from the micro-LEDs on the spare bonding pad 30 is smaller, resulting in more uniform light emission from the sub-pixel and improving the display effect of the display panel.

[0053] Considering that other structures may be set in the sub-pixel region, the specific setting of these structures may also affect the light emission effect of the sub-pixel. The following will be explained in detail with typical examples to ensure that even if the sub-pixel is repaired, the light emission effect after repair is basically the same as before repair. In this case, the first symmetry method and the second symmetry method are axially symmetric, and S1 is 0, that is, the first symmetry reference object and the second reference object coincide.

[0054] Optional, Figure 13 This is a partial structural diagram of another display panel provided in an embodiment of the present invention, as shown below. Figure 13 As shown, the sub-pixel region BB includes a color resist structure 60, which is arranged in a third symmetrical manner with respect to the third symmetrical reference object 80; the first symmetrical manner and the third symmetrical manner are the same; the distance between the vertical projection of the third symmetrical reference object 80 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is S2, where S2 ≤ 10 μm. It should be noted that when dealing with the dimensions of different products, S2 can be set with reference to the following formula, i.e., S2 / Q1 < 50%; where Q1 is the dimension of the long side of the micro light-emitting diode. Figure 13 Taking S2 as 0, that is, when the first reference object 40, the second reference object 50, and the third reference object 80 coincide, as an example.

[0055] The color resist structure 60 allows light of the same color to pass through it, and the color of light emitted by the corresponding sub-pixel is the same. Color display of the display panel is achieved by setting the color resist structure 60. As mentioned above, during the fabrication of the color resist structure 60, a horn-shaped protrusion is formed at the overlap between the color resist structure 60 and the blocking structure, resulting in different morphologies at the edges and center of the color resist structure 60. In this embodiment, the color resist structure 60 is set to be in a third symmetrical manner with respect to the third symmetrical reference object 80. The first symmetrical manner and the third symmetrical manner are the same, and the distance between the vertical projection of the third symmetrical reference object 80 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is small. Even if the shape of the edge and the center of the color resist structure 60 are different, this shape is symmetrically set. Therefore, the light emission effect of the light emitted by the micro light-emitting diode electrically connected to the main bonding pad 20 after passing through the color resist structure 60 is basically consistent with the light emission effect of the light emitted by the micro light-emitting diode electrically connected to the spare bonding pad 30 after passing through the color resist structure 60. That is to say, even if the sub-pixel is repaired, the light emission effect after repair is basically consistent with that before repair, ensuring the display uniformity of the display panel 100.

[0056] Based on the above scheme, optionally, the first substrate includes a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region; wherein, this embodiment does not limit the arrangement of the red, green, and blue sub-pixel regions, for example, it can be a standard arrangement or a diamond arrangement, etc. Each sub-pixel region is provided with a main bonding pad and a spare bonding pad; a red micro-light-emitting diode is provided on the main bonding pad or spare bonding pad of the red sub-pixel region; a green micro-light-emitting diode is provided on the main bonding pad or spare bonding pad of the green sub-pixel region; and a blue micro-light-emitting diode is provided on the main bonding pad or spare bonding pad of the blue sub-pixel region. In this way, color display of the display panel can be achieved, and the light emission effect of the sub-pixels after repair is basically the same as that before repair, ensuring the display uniformity of the display panel.

[0057] Optional, see below Figure 13 The sub-pixel region BB also includes a masking structure 70, which is arranged in a fourth symmetrical manner with respect to the fourth symmetrical reference object 90; the first symmetrical manner and the fourth symmetrical manner are the same; the distance between the vertical projection of the fourth symmetrical reference object 90 on the first substrate and the vertical projection of the first symmetrical reference object 40 on the first substrate is S3, where S3 ≤ 10 μm. It should be noted that when dealing with the dimensions of different products, S3 can be set with reference to the following formula, i.e., S3 / Q1 < 50%; where Q1 is the dimension of the long side of the micro light-emitting diode. Figure 13Taking S3 as 0, that is, the first reference object 40, the second reference object 50 and the fourth reference object 90 coincide.

[0058] The blocking structure 70 can be composed of black material or other light-absorbing materials to absorb most of the light incident upon it. The blocking structure 70 blocks light leakage between sub-pixels. In this embodiment, the blocking structure 70 is configured in a fourth symmetrical manner with respect to the fourth symmetrical reference object 90; the first symmetrical manner is the same as the fourth symmetrical manner; the distance between the vertical projection of the fourth symmetrical reference object 90 on the first substrate and the vertical projection of the first symmetrical reference object on the first substrate is small, ensuring that the blocking effect of the blocking structure 70 is consistent regardless of whether the micro-light-emitting diode on the main bonding pad 20 or the micro-light-emitting diode on the spare bonding pad 30 is activated. This ensures that the light emitted by the sub-pixel is consistent, guaranteeing the display uniformity of the display panel 100.

[0059] Optional, Figure 14 This is a schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present invention, as shown below. Figure 14 As shown, the sub-pixel region also includes a barrier structure 91, which is arranged in a fifth symmetrical manner with respect to the fifth symmetrical reference object 92; the first symmetrical manner is the same as the fifth symmetrical manner; the distance between the vertical projection of the fifth symmetrical reference object 92 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is S4, where S4 ≤ 10 μm. It should be noted that when dealing with the dimensions of different products, S4 can be set with reference to the following formula, i.e., S4 / Q1 < 50%; where Q1 is the dimension of the long side of the micro light-emitting diode. Figure 14 Taking S4 as 0, that is, the first reference object 40, the second reference object 50, the fourth reference object 90 and the fifth symmetrical reference object 92 coincide.

[0060] The barrier structure 91 is used to define the position of the micro-light-emitting diodes and also prevents crosstalk between adjacent sub-pixels. In this embodiment, the barrier structure 91 is set to a fourth symmetrical configuration with respect to the fourth symmetrical reference object 90; the first symmetrical configuration and the fourth symmetrical configuration are the same; the distance between the vertical projection of the fourth symmetrical reference object 90 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is small, so that the light-blocking effect of the barrier structure 91 is consistent whether the micro-light-emitting diode on the main bonding pad 20 or the micro-light-emitting diode on the backup bonding pad 30 is used, thereby ensuring that the light emitted by the sub-pixel is consistent and ensuring the display uniformity of the display panel 100.

[0061] Optional, see below Figure 14At least a portion of the sub-pixel regions BB also include quantum dot structures 93, which exhibit a sixth symmetry about a sixth symmetry reference object 94; the first symmetry is the same as the sixth symmetry; the distance between the vertical projection of the sixth symmetry reference object 94 onto the first substrate 10 and the vertical projection of the first symmetry reference object 40 onto the first substrate 10 is S5, where S5 ≤ 10 μm. It should be noted that when considering the dimensions of different products, S5 can be set using the following formula: S5 / Q1 < 50%; where Q1 is the length of the long side of the micro-LED. Figure 14 Taking S5 as 0, that is, the first reference object 40, the second reference object 50, the fourth reference object 90, the fifth symmetric reference object 92, and the sixth symmetric reference object 94 coincide.

[0062] The quantum dot structure 93 is used to convert the color of the light emitted by the micro LED. The color of the light emitted after passing through the quantum dot structure 93 is the same as the color of the light emitted by the sub-pixel corresponding to the quantum dot structure 93. As mentioned above, when the quantum dot structure 93 is printed using inkjet printing technology, a coffee ring effect occurs, where the thickness of the quantum dot structure 93 at the edge of the sub-pixel region BB is larger, while the thickness of the quantum dot structure 93 in the middle is smaller. This results in different morphologies at the edges and center of the quantum dot structure 93. In this embodiment, the quantum dot structure 93 is set to be in a sixth symmetry mode with respect to the sixth symmetry reference object 94; the first symmetry mode and the sixth symmetry mode are the same; the distance between the vertical projection of the sixth symmetry reference object 94 on the first substrate 10 and the vertical projection of the first symmetry reference object 40 on the first substrate 10 is small. Even if the morphology of the edge and the center of the quantum dot structure 93 is different, this morphology is symmetrically set. Therefore, whether the micro light-emitting diode on the main bonding pad 20 is enabled or the micro light-emitting diode on the backup bonding pad 30 is enabled, the light emitted by the sub-pixel is consistent after the conversion by the quantum dot structure 93. That is to say, even if the sub-pixel is repaired, the light emission effect after repair is basically the same as before repair, ensuring the display uniformity of the display panel 100.

[0063] Optional, see below Figure 14 At least a portion of the sub-pixel regions BB also include a first reflective layer 95 located above the quantum dot structure 93 (i.e., the side of the quantum dot structure 93 facing away from the first substrate 10) and a second reflective layer 96 located below the quantum dot structure 93 (i.e., the side of the quantum dot structure 93 closer to the first substrate 10); that is, the first reflective layer 95 and the second reflective layer 96 are used to form a half-wavelength cavity in order to increase the brightness of the vertically emitted quantum dot structure light source and improve the luminous efficiency of the sub-pixel. Similarly, the first reflective layer 95 and the second reflective layer 96 are symmetrically arranged, for example, centrosymmetric or axially symmetric.

[0064] Based on the above solutions, optional options can be found by referring to [link / reference]. Figure 14 The first substrate 10 includes a red sub-pixel region BB4, a green sub-pixel region BB5, and a blue sub-pixel region BB6; the red sub-pixel region BB4 includes a red quantum dot structure 931; the green sub-pixel region BB5 includes a green quantum dot structure 932; and each sub-pixel region BB is provided with a blue micro light-emitting diode 97.

[0065] Specifically, the red quantum dot structure 931 in the red sub-pixel area BB4 converts the blue light emitted by the blue micro-light-emitting diode 97 into red light, and the green quantum dot structure 932 in the green sub-pixel area BB5 converts the blue light emitted by the blue micro-light-emitting diode 97 into green light. Since the blue micro-light-emitting diode 97 emits blue light, the blue sub-pixel area BB6 does not need to be equipped with a quantum dot structure 93. The color display of the display panel 100 is completed through the above settings.

[0066] Optional, see below Figure 14 At least two of the following symmetrical reference objects 40, 50, 80, 90, 92, and 94 have their vertical projections onto the first substrate 10 overlapping: Figure 14 Taking the first symmetrical reference object 40, the second symmetrical reference object 50, the third symmetrical reference object 80, the fourth symmetrical reference object 90, the fifth symmetrical reference object 92, and the sixth symmetrical reference object 94 as axes of symmetry, and all of their vertical projections onto the first substrate 10 overlapping, as an example: By symmetrically setting the main bonding pad 20 and the spare bonding pad 30, and making the sub-pixel region BB containing the main bonding pad 20 and the spare bonding pad 30 a symmetrical region, and symmetrically setting the structures within this sub-pixel region BB, such as the color resist structure 60, the barrier structure 91, the quantum dot structure 93, and the blocking structure 70, the light emission effect of the micro-LED 97 electrically connected to the main bonding pad 20 is essentially consistent with the light emission effect of the micro-LED 97 electrically connected to the spare bonding pad 30. Thus, even if the sub-pixel is repaired, the light emission effect after repair is essentially the same as before repair.

[0067] Optional, see below Figure 14The display panel 100 also includes a second substrate 99, which encapsulates and protects the display panel 100. Optionally, a color resist structure 60, a quantum dot structure 93, and a shielding structure 91 can be disposed on the second substrate 99, and then the first substrate 10 and the second substrate 99 can be bonded together by a bonding process to form the display panel; alternatively, the above structures can be disposed on the side of the micro-light-emitting diode facing away from the first substrate 10 after the micro-light-emitting diode has been transferred. This embodiment does not limit this, and those skilled in the art can prepare it according to the actual product situation.

[0068] The above embodiments are applicable to both non-curved and curved display panels. However, curved display panels can also be configured separately based on their specific characteristics. Optionally, Figure 15 This is a partial structural diagram of another display panel provided in an embodiment of the present invention, as shown below. Figure 15 As shown, when the display panel 100 is a curved display panel, the display panel 100 includes a curved portion; the bending axis ZZ of the curved portion is perpendicular to both the first axis of symmetry and the second axis of symmetry. Figure 15 Taking the first and second symmetry axes coinciding as an example, the advantage of this setting is that even if the bending part may cause deformation of the film layer (such as color resist structure or quantum dot structure) set in the bending part, since the bending axis ZZ of the bending part is perpendicular to the first and second symmetry axes, the deformation of these film layers is also symmetrical, avoiding the problem that the light emission effect of the sub-pixel after repair is different from that before repair when the deformation is asymmetrical.

[0069] Based on the same inventive concept, embodiments of the present invention also provide a display device. This display device includes the display panel described in any embodiment of the present invention. Therefore, the display device provided by the embodiments of the present invention possesses the corresponding beneficial effects of the display panel provided by the embodiments of the present invention, which will not be elaborated further here. Exemplarily, the display device can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device; embodiments of the present invention do not limit this.

[0070] For example, Figure 16 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Figure 16 As shown, the display device 101 includes the display panel 100 in the above embodiments.

[0071] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: A first substrate, comprising a plurality of sub-pixel regions arranged in an array, wherein the sub-pixel regions include: The main bonding pad and the spare bonding pad are disposed on the first substrate; A miniature light-emitting diode electrically connected to the main bonding pad or the spare bonding pad; The primary bonding pad and the backup bonding pad are symmetrical about a first symmetrical reference object; the sub-pixel region is symmetrical about a second symmetrical reference object. The first symmetry method and the second symmetry method are the same; The distance between the vertical projection of the first symmetrical reference object on the first substrate and the vertical projection of the second symmetrical reference object on the first substrate is S1, where S1≤10μm; The sub-pixel region further includes a masking structure, which is in a fourth symmetry manner with respect to a fourth symmetry reference object; the first symmetry manner and the fourth symmetry manner are the same; the distance between the vertical projection of the fourth symmetry reference object on the first substrate and the vertical projection of the first symmetry reference object on the first substrate is S3, where S3≤10μm.

2. The display panel according to claim 1, characterized in that, Both the first symmetry method and the second symmetry method are axially symmetric; the first symmetry reference object is the first symmetry axis, and the second symmetry reference object is the second symmetry axis; the first symmetry axis and the second symmetry axis are parallel.

3. The display panel according to claim 2, characterized in that, The second axis of symmetry of each of the sub-pixel regions is parallel.

4. The display panel according to claim 2, characterized in that, The second axis of symmetry of the sub-pixel region is parallel to the long side of the sub-pixel region.

5. The display panel according to claim 2, characterized in that, The display panel includes a curved portion; the bending axis of the curved portion is perpendicular to the first axis of symmetry and the second axis of symmetry.

6. The display panel according to claim 1, characterized in that, Both the first symmetry method and the second symmetry method are centrally symmetric; the first symmetry reference object is the first symmetry center, and the second symmetry reference object is the second symmetry center.

7. The display panel according to claim 6, characterized in that, The primary bonding pads include a first primary bonding pad and a second primary bonding pad; the spare bonding pads include a first spare bonding pad and a second spare bonding pad; The projection of the first spare bonding pad onto the line connecting the first primary bonding pad and the second primary bonding pad is located in the gap between the first primary bonding pad and the second primary bonding pad; the projection of the second primary bonding pad onto the line connecting the first spare bonding pad and the second spare bonding pad is located in the gap between the first spare bonding pad and the second spare bonding pad.

8. The display panel according to claim 2, characterized in that, The sub-pixel region includes a color resist structure, which is in a third symmetry manner with respect to a third symmetry reference object; the first symmetry manner and the third symmetry manner are the same; The distance between the vertical projection of the third symmetrical reference object on the first substrate and the vertical projection of the first symmetrical reference object on the first substrate is S2, where S2 ≤ 10 μm.

9. The display panel according to claim 8, characterized in that, The sub-pixel region further includes a barrier structure, which is in a fifth symmetry manner with respect to a fifth symmetry reference object; the first symmetry manner and the fifth symmetry manner are the same; the distance between the vertical projection of the fifth symmetry reference object on the first substrate and the vertical projection of the first symmetry reference object on the first substrate is S4, where S4≤10μm.

10. The display panel according to claim 9, characterized in that, At least a portion of the sub-pixel regions further include quantum dot structures, which are arranged in a sixth symmetry manner with respect to a sixth symmetry reference object; the first symmetry manner and the sixth symmetry manner are the same; the distance between the vertical projection of the sixth symmetry reference object on the first substrate and the vertical projection of the first symmetry reference object on the first substrate is S5, where S5 ≤ 10 μm.

11. The display panel according to claim 10, characterized in that, At least two of the first, second, third, fourth, fifth, and sixth symmetrical reference objects have their vertical projections on the first substrate overlapping.

12. The display panel according to claim 10, characterized in that, The first substrate includes a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region; the red sub-pixel region includes a red quantum dot structure; the green sub-pixel region includes a green quantum dot structure; and each sub-pixel region is provided with a blue micro light-emitting diode.

13. The display panel according to claim 1, characterized in that, The first substrate includes a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region; the red sub-pixel region is provided with a red micro-light-emitting diode; the green sub-pixel region is provided with a green micro-light-emitting diode; and the blue sub-pixel region is provided with a blue micro-light-emitting diode.

14. The display panel according to claim 1, characterized in that, The distance between the primary bonding pad and the backup bonding pad ranges from 10 μm to 50 μm.

15. A display device, characterized in that, Includes the display panel as described in any one of claims 1-14.

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