A MiniLED chip packaging method and module

Abstract

The present application relates to the technical field of LED display, and particularly relates to a Mini LED wafer packaging method and module, the method comprising: preparing a fluorescent lens through a preset process; performing light splitting testing on the obtained fluorescent lens, performing chromaticity grading on the lens based on the testing result and a preset chromaticity grading standard; and selecting the fluorescent lens belonging to the same grade after grading to paste Mini LED wafers on a preset backlight lamp plate. The Mini LED wafer packaging method provided by the present application solves the problem of inconsistent chromaticity of packaging modules packaged by large batches of Mini LED wafers through the way of light splitting and grading of fluorescent lenses.

Description

[Technical Field]

[0001] This invention relates to the field of LED display technology, and particularly to a Mini LED chip packaging method and module. [Background Technology]

[0002] Mini LED is considered by the industry to be a next-generation display technology. Currently, Mini LED backlighting uses a direct-lit design, which distributes a large number of LED chips evenly across the entire display area. This results in a large heat dissipation area and uniform heat distribution, enabling local dimming within a smaller area and achieving better brightness uniformity and higher color contrast within a shorter mixing distance. This, in turn, allows for ultra-thin, high color rendering, and energy-efficient end products. However, due to the massive number of chips used in Mini LED backlighting, current technology struggles to guarantee the color consistency of the packaged modules formed by mass-producing Mini LED chips. [Summary of the Invention]

[0003] To address the issue of inconsistent color in Mini LED chip packaging modules, this invention provides a Mini LED chip packaging method and module.

[0004] The Mini LED chip packaging method includes:

[0005] Fluorescent lenses are fabricated using a pre-defined process;

[0006] The obtained fluorescent lens is subjected to a spectroscopic test, and the lens is classified into different color grades based on the test results and a preset color grade standard.

[0007] Select fluorescent lenses of the same grade after grading to mount Mini LED chips on the preset backlight board.

[0008] Optionally, the step of fabricating the fluorescent lens through a preset process includes:

[0009] A fluorescent material is obtained by mixing a pre-set phosphor and a pre-set adhesive in a certain proportion.

[0010] The fluorescent material is formed on one side of the initial lens to obtain the fluorescent lens, or the fluorescent material is injected into a preset lens mold and injection molded to form the fluorescent lens.

[0011] Optionally, the preset phosphor includes aluminate phosphor, silicate phosphor, nitride phosphor, and chloride phosphor, and the preset adhesive includes epoxy resin adhesive, PC plastic, and silicone.

[0012] Optionally, the particle size of the preset phosphor is 4-30 μm.

[0013] Optionally, before the step of performing a spectroscopic test on the obtained fluorescent lens and performing chromaticity classification on the lens based on the test results and a preset chromaticity classification standard, the method further includes:

[0014] Multiple Mini LED chips are placed on a substrate, wherein the multiple chips have the same wavelength.

[0015] Optionally, after the step of placing multiple Mini LED chips onto the substrate, the method further includes:

[0016] The fluorescent lens is placed on the side of the wafer away from the substrate so that the light emitted by the wafer is scattered and emitted after passing through the fluorescent lens.

[0017] Optionally, before the step of mixing the preset phosphor with the preset adhesive to obtain the fluorescent material, the method further includes:

[0018] The particle size of the phosphor is determined based on the power of the wafer.

[0019] Optionally, the chip power is less than 5W.

[0020] Optionally, after the step of selecting fluorescent lenses of the same grade after grading and mounting the Mini LED chips on the backlight board, the method further includes:

[0021] The mounted backlight panel is baked at a temperature of less than 150°C for a preset time, wherein the preset time is less than 1 hour.

[0022] A Mini LED chip packaging module, said packaging module being made by the method described in any of the preceding claims.

[0023] Compared with the prior art, the Mini LED chip packaging method and module provided by the present invention have the following beneficial effects:

[0024] 1. This invention provides a Mini LED chip packaging method, which includes the following steps: obtaining a fluorescent lens through a preset process; performing a spectral test on the obtained fluorescent lens, and classifying the lens into color grades based on the test results and a preset color grade standard; and selecting the fluorescent lens belonging to the same grade after grading to mount the Mini LED chip on a preset backlight board. Understandably, traditional packaging processes require a huge number of Mini LEDs, and the fluorescent lenses that make up the Mini LEDs are also numerous. When manufacturing a large number of fluorescent lenses, it is difficult to ensure that the amount and uniformity of phosphor in each lens are the same. Different amounts of phosphor lead to different luminous effects in each fluorescent lens, resulting in inconsistent colorimetry among Mini LEDs made from a large number of fluorescent lenses. The packaging method provided by this invention performs a spectral test on the manufactured fluorescent lenses, and then, based on the test results and a preset colorimetry classification standard, classifies the lenses into different grades and places them accordingly. When packaging is required, the same grade of fluorescent lenses is used to mount the Mini LED chips on a preset backlight board. Fluorescent lenses of the same grade have the same luminous effect and emit light with a consistent color temperature. It can be seen that the above design solves the problem of inconsistent colorimetry in packaging modules made from a large number of Mini LED chips by introducing a method of spectral separation and classification of fluorescent lenses.

[0025] 2. In the Mini LED chip packaging method provided by this embodiment of the invention, there are two methods for manufacturing a fluorescent lens through a preset process. One method involves mixing a preset phosphor and a preset adhesive in a certain proportion to obtain a fluorescent material, and then forming the fluorescent material on one side of an initial lens to obtain the fluorescent lens. Specifically, a powder spreading or spraying device is used to directly spread or spray the phosphor onto the inner surface of the preset lens, making the manufacturing process convenient and quick. The other method involves mixing a preset phosphor and a preset adhesive in a certain proportion to obtain a fluorescent material, and then injecting the fluorescent material into a preset lens mold to form the fluorescent lens. Specifically, the mixed phosphor and adhesive are directly used for injection molding, allowing the phosphor and adhesive to fully bond. In practice, a suitable manufacturing process is selected based on the specific circumstances.

[0026] 3. In the Mini LED chip packaging method provided in this embodiment of the invention, the preset phosphor includes aluminate phosphor, silicate phosphor, nitride phosphor, and chloride phosphor. The specific phosphor material is selected according to the color of the chip material, so that the colors of the chip and the phosphor are mixed to emit white light. The preset phosphor particle size is 4-30μm. The phosphor particle size is also related to the chip power. Generally, for chips with a power of less than 5W, the phosphor particle size is determined according to the chip power, resulting in a Mini LED with better light emission performance.

[0027] 4. In the Mini LED chip packaging method provided in this embodiment of the invention, the preset adhesive is a formable adhesive such as epoxy resin, PC adhesive, or silicone. If the first process is used to manufacture the fluorescent lens, the formable adhesive can stably form the fluorescent material on the inner surface of the initial lens. If the second process is used to manufacture the fluorescent lens, the formable adhesive makes the fluorescent lens stably formed.

[0028] 5. In a Mini LED chip packaging method provided by this embodiment of the invention, the step of performing a spectral analysis on the obtained fluorescent lens, and classifying and placing the lens according to the test results and a preset chromaticity classification standard, includes: placing multiple Mini LED chips of the same wavelength band on a substrate, and then placing multiple fluorescent lenses on the side of the multiple chips away from the substrate, so that the light emitted by the chips is scattered through the fluorescent lenses and then emitted for spectral analysis; and classifying the lenses according to the test results and the Class A classification standard of CIE 1931 chromaticity coordinates. Chips of the same wavelength band have the same luminous effect. Using chips of the same wavelength band to perform spectral analysis on the fluorescent lenses, the different results of the spectral analysis of each fluorescent lens indicate that the properties of each fluorescent lens are different. In this way, the fluorescent lenses can be classified into different grades and placed accordingly. During packaging, fluorescent lenses of the same grade can be directly used for mounting, which is convenient and quick.

[0029] 6. Before the step of mixing the preset phosphor and the preset adhesive in a certain proportion to obtain the fluorescent material, the method further includes: determining the particle size of the phosphor according to the power of the wafer. Specifically, when the wafer power is less than 5W, the phosphor particle size is 4-10μm when the wafer power is less than or equal to 0.5W; 10-15μm when the wafer power is 0.5-1W; 15-20μm when the wafer power is 1-2W; 20-25μm when the wafer power is 2-3W; and 25-30μm when the wafer power is 3-5W. The limiting relationship between the phosphor particle size and the wafer power results in better luminescence effect.

[0030] 7. In a Mini LED chip packaging method provided by an embodiment of the present invention, after the step of selecting fluorescent lenses of the same grade after grading to mount the Mini LED chips on a preset backlight board, the method further includes: baking the mounted backlight board at a temperature of less than 150°C for a preset time, wherein the preset time is less than 1 hour, and the control of baking temperature and baking time ensures the baking effect without affecting the performance of the Mini LED.

[0031] 8. The present invention also provides a Mini LED chip packaging module, which has the same beneficial effects as any of the Mini LED chip packaging methods described above, and will not be repeated here. [Attached Image Description]

[0032] Figure 1 A flowchart illustrating a Mini LED chip packaging method provided in this embodiment of the invention. Figure 1 ;

[0033] Figure 2 A flowchart illustrating a Mini LED chip packaging method provided in this embodiment of the invention. Figure 2 ;

[0034] Figure 3 A flowchart illustrating a Mini LED chip packaging method provided in this embodiment of the invention. Figure 3 ;

[0035] Figure 4 A flowchart illustrating a Mini LED chip packaging method provided in this embodiment of the invention. Figure 4 ;

[0036] Figure 5 This is a schematic diagram of lens powder spraying in a Mini LED chip packaging method provided in an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of lens beam splitting and packaging placement for a Mini LED chip packaging method provided in an embodiment of the present invention.

[0038] Explanation of reference numerals in the attached diagram:

[0039] 10. Initial lens; 20. Preset phosphor; 30. Wafer; 40. Substrate; 50. Solder paste.

Detailed Implementation Methods

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0041] The following embodiments of this application will describe the Mini LED chip packaging method and module used in the technical implementation of this application:

[0042] See Figure 1 The first embodiment of the present invention provides a Mini LED chip packaging method, the packaging method comprising:

[0043] Step S100: Fabricate a fluorescent lens using a preset process;

[0044] Step S200: Perform a spectral test on the obtained fluorescent lens, and perform chromaticity classification on the lens based on the test results and a preset chromaticity classification standard;

[0045] Step S300: Select the fluorescent lens that belongs to the same grade after grading to mount the Mini LED chip on the backlight board.

[0046] The packaging method provided in this embodiment performs a spectral splitting test on the manufactured fluorescent lens, and then, based on the test results and a preset colorimetric grading standard, divides the lens into different grades and places them accordingly. When packaging is required, the same grade of fluorescent lens is used to mount the Mini LED chips on the backlight board. Since fluorescent lenses of the same grade have the same light emission effect and emit light with consistent color temperature, the above design solves the problem of inconsistent colorimetric properties in packaging modules made from a large number of Mini LED chips by introducing a method of spectral splitting and grading of fluorescent lenses.

[0047] Optionally, in step S100, the lens 10 can have different angles, sizes, and shapes. Angles may be 60 degrees, 90 degrees, or 120 degrees, and shapes may be cup-shaped, trapezoidal, V-shaped, hemispherical, etc. The specific angles, sizes, and shapes are set according to actual needs.

[0048] For further details, please refer to [link / reference]. Figure 1 and Figure 2 Step S100: The fluorescent lens is fabricated through a preset process, which may include steps S110 and S120.

[0049] Step S110: Mix the preset phosphor 20 with the preset adhesive in a certain proportion to obtain the fluorescent material;

[0050] Furthermore, the particle size range of the preset phosphor 20 is 4-30 μm; furthermore, the particle size range of the preset phosphor 20 can be 4-10 μm, 10-15 μm, 15-20 μm, 20-25 μm and 25-30 μm.

[0051] Optionally, the preset phosphor can be aluminate phosphor, silicate phosphor, nitride phosphor, chloride phosphor, etc. The preset adhesive can be epoxy resin, PC plastic, silicone, or other formable adhesives. The preset phosphor 20 and the preset adhesive are thoroughly and uniformly mixed to obtain the fluorescent material. Specifically, in this embodiment, the preset phosphor is aluminate phosphor, and the preset adhesive is silicone.

[0052] Step S120: The fluorescent material is formed on one side of the initial lens 10 to obtain the fluorescent lens; or,

[0053] The fluorescent material is injected into a pre-set lens mold, and the fluorescent lens is formed by injection molding.

[0054] Two examples of manufacturing processes for fluorescent lenses are given. The first process involves uniformly forming the fluorescent material obtained in step S110 onto one side of a pre-designed lens 10, followed by curing, thereby obtaining the fluorescent lens. (See also...) Figure 3 This embodiment uses a hemispherical lens 10 as an example. (See attached document.) Figure 5 The fluorescent material can be sprayed into the inner side of the lens 10 in the form of a powder spraying device, and the formable adhesive therein can firmly lay the fluorescent material on the inner surface of the initial lens 10.

[0055] The second process involves injecting fluorescent material into a pre-designed lens mold, followed by injection molding and demolding to form a fluorescent lens. The formable adhesive within the mold ensures the fluorescent lens is firmly formed. Specifically, the pre-designed lens mold (10) can be made of plastic, silicone, etc., and its shape, angle, and thickness are selected according to actual needs. Furthermore, before injecting the fluorescent material into the mold, air bubbles can be removed through degassing to prevent voids in the finished fluorescent lens that could affect its luminescence effect.

[0056] Specifically, the first method requires first fabricating an initial lens 10, and then forming the fluorescent material inside the lens 10, which involves two processes. The second method directly injects the fluorescent material into the mold, which involves only one process. Compared to spraying powder into the initial lens 10, directly injecting the mixed fluorescent powder and glue results in better bonding between the two. However, if an initial lens 10 is readily available, the first process is more convenient and faster. The appropriate manufacturing process should be selected based on actual needs.

[0057] For further details, please refer to [link / reference]. Figure 3 Step S200: Perform a spectral test on the obtained fluorescent lens, and perform chromaticity grading on the lens based on the test results and a preset chromaticity grading standard. The steps include steps S210, S220 and S230.

[0058] Step S210: Place a plurality of Mini LED chips 30 onto a substrate, wherein the plurality of chips 30 have the same wavelength band;

[0059] Step S220: Place the fluorescent lens on the side of the wafer 30 away from the substrate 40 so that the light emitted by the wafer 30 is scattered by the fluorescent lens and then emitted to perform a spectroscopic test on the fluorescent lens.

[0060] Step S230: Based on the test results and according to the CIE 1931 Class A chromaticity classification standard, the lens is classified into chromaticity grades.

[0061] It should be noted that chip 30 is the most crucial raw material for LEDs and is the light-emitting component of LEDs.

[0062] See Figure 6 Multiple chips 30 of the same wavelength are placed on the substrate 40, and solder paste 50 is used to fix the chips 30 on the substrate 40. Multiple fluorescent lenses are then placed on the side of the multiple chips 30 away from the substrate 40, with one fluorescent lens placed on top of each chip 30, so that the light emitted by the chip 30 is scattered and emitted after passing through the fluorescent lens.

[0063] Specifically, a suction nozzle can be used to cover the lens 10 onto the wafer 30.

[0064] Furthermore, the phosphor used in step S100 to manufacture the fluorescent lens is related to the selection of the wafer 30 in step S210. Specifically, the phosphor particle size is determined according to the power of the wafer 30, and the relationship between the phosphor particle size and the power of the wafer 30 is shown in Table 1 below:

[0065]

[0066] Table 1

[0067] Table 1 above shows the relationship between phosphor particle size and wafer power in this embodiment. For example, if a wafer with a power of 2-3W is selected in this embodiment, then phosphor with a particle size of 20-25μm is selected.

[0068] In other embodiments, if greater emphasis is placed on the uniformity of the light spot, small-particle-size phosphors can be used in conjunction with high-power chips.

[0069] Furthermore, the color of the phosphor is selected according to the color of the chip, so that the light emitted by the chip is scattered into white light through the fluorescent lens. Specifically, for example, a yellow aluminate phosphor and a blue chip are selected, and the white light is obtained by mixing the blue light emitted by the chip and the yellow light of the phosphor.

[0070] Step S200: Perform a spectral test on the obtained fluorescent lens, and perform chromaticity classification on the lens based on the test results and a preset chromaticity classification standard;

[0071] Since all the crystals 30 have the same wavelength, the luminous effect of crystals 30 with the same wavelength is the same. However, the different amounts of phosphor or the uniformity of the fluorescent material in each fluorescent lens will result in different color temperatures of the lenses, i.e., inconsistent chromaticity. Therefore, it is necessary to split the fluorescent lenses and then place fluorescent lenses of the same grade, i.e., the same chromaticity, together.

[0072] Specifically, the LED is lit up under a standard current and voltage of 30 on the chip, and the fluorescent lens is subjected to spectral analysis using a spectrometer to obtain the test results.

[0073] In this embodiment, the chromaticity classification standard is selected according to the CIE 1931 chromaticity coordinates: Class A standard XY is 0.006 / class; Class B standard XY is 0.008 / class; Class C standard XY is 0.01 / class. Specifically, generally, the smaller the classification value, the better the color consistency. In this embodiment, Class A classification standard is selected, and the lens is classified in chromaticity according to the test results and Class A classification standard.

[0074] After the fluorescent lens is split and segmented, a suction nozzle is used to remove the fluorescent lens from above the crystal.

[0075] Place fluorescent lenses of the same grade together, for example, place lenses with a color temperature of 6000K together, and lenses with a color temperature of 6300K together, etc.

[0076] Step S300: Select the fluorescent lens that belongs to the same grade after grading to mount the Mini LED chip on the backlight board.

[0077] In actual packaging, fluorescent lenses of the same grade stored in different grades can be directly used for mounting. Specifically, fluorescent lenses of the same batch are mounted on the side of the chip 30 away from the backlight board so that the light emitted by the chip 30 can be scattered and emitted through the fluorescent lens.

[0078] For example, a batch of fluorescent lenses, all with a color temperature of 6000K, are mounted onto Mini LED chips on a backlight board. The fluorescent lenses have a consistent color temperature and therefore produce the same luminous effect. Specifically, for large-pitch products such as monitors and TVs, fluorescent lenses are mounted onto the reflowed Mini LED backlight board using surface mount technology (SMT).

[0079] Further, see Figure 4 Step S300: After selecting fluorescent lenses of the same grade after grading and mounting them on the preset backlight panel, the process further includes step S310.

[0080] Step S310: Bake the mounted backlight panel at a temperature of less than 150°C for a preset time, wherein the preset time is less than 1.

[0081] Controlling the baking temperature and time ensures the baking effect without affecting the performance of the Mini LED.

[0082] Once baking is complete, the encapsulation is finished. All the phosphor lenses of the encapsulated Mini LEDs have the same color temperature, and the light-emitting effect of each Mini LED is the same, thus achieving color consistency.

[0083] Another embodiment of the present invention provides a Mini LED chip packaging module, which is manufactured by the Mini LED chip packaging method described above.

[0084] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0085] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0086] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0087] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0088] Compared with the prior art, the Mini LED chip packaging method provided by the present invention has the following beneficial effects:

[0089] 1. This invention provides a Mini LED chip packaging method, which includes the following steps: obtaining a fluorescent lens through a preset process; performing a spectral test on the obtained fluorescent lens, and classifying the lens into color grades based on the test results and a preset color grade standard; and selecting the fluorescent lens belonging to the same grade after grading to mount the Mini LED chip on a preset backlight board. Understandably, traditional packaging processes require a huge number of Mini LEDs, and the fluorescent lenses that make up the Mini LEDs are also numerous. When manufacturing a large number of fluorescent lenses, it is difficult to ensure that the amount and uniformity of phosphor in each lens are the same. Different amounts of phosphor lead to different luminous effects in each fluorescent lens, resulting in inconsistent colorimetry among Mini LEDs made from a large number of fluorescent lenses. The packaging method provided by this invention performs a spectral test on the manufactured fluorescent lenses, and then, based on the test results and a preset colorimetry classification standard, classifies the lenses into different grades and places them accordingly. When packaging is required, the same grade of fluorescent lenses is used to mount the Mini LED chips on a preset backlight board. Fluorescent lenses of the same grade have the same luminous effect and emit light with a consistent color temperature. It can be seen that the above design solves the problem of inconsistent colorimetry in packaging modules made from a large number of Mini LED chips by introducing a method of spectral separation and classification of fluorescent lenses.

[0090] 2. In the Mini LED chip packaging method provided by this embodiment of the invention, there are two methods for manufacturing a fluorescent lens through a preset process. One method involves mixing a preset phosphor and a preset adhesive in a certain proportion to obtain a fluorescent material, and then forming the fluorescent material on one side of an initial lens to obtain the fluorescent lens. Specifically, a powder spreading or spraying device is used to directly spread or spray the phosphor onto the inner surface of the preset lens, making the manufacturing process convenient and quick. The other method involves mixing a preset phosphor and a preset adhesive in a certain proportion to obtain a fluorescent material, and then injecting the fluorescent material into a preset lens mold to form the fluorescent lens. Specifically, the mixed phosphor and adhesive are directly used for injection molding, allowing the phosphor and adhesive to fully bond. In practice, a suitable manufacturing process is selected based on the specific circumstances.

[0091] 3. In the Mini LED chip packaging method provided in this embodiment of the invention, the preset phosphor includes aluminate phosphor, silicate phosphor, nitride phosphor, and chloride phosphor. The specific phosphor material is selected according to the color of the chip material, so that the colors of the chip and the phosphor are mixed to emit white light. The preset phosphor particle size is 4-30μm. The phosphor particle size is also related to the chip power. Generally, for chips with a power of less than 5W, the phosphor particle size is determined according to the chip power, resulting in a Mini LED with better light emission performance.

[0092] 4. In the Mini LED chip packaging method provided in this embodiment of the invention, the preset adhesive is a formable adhesive such as epoxy resin, PC adhesive, or silicone. If the first process is used to manufacture the fluorescent lens, the formable adhesive can stably form the fluorescent material on the inner surface of the initial lens. If the second process is used to manufacture the fluorescent lens, the formable adhesive makes the fluorescent lens stably formed.

[0093] 5. In a Mini LED chip packaging method provided by this embodiment of the invention, the step of performing a spectral analysis on the obtained fluorescent lens, and classifying and placing the lens according to the test results and a preset chromaticity classification standard, includes: placing multiple Mini LED chips of the same wavelength band on a substrate, and then placing multiple fluorescent lenses on the side of the multiple chips away from the substrate, so that the light emitted by the chips is scattered through the fluorescent lenses and then emitted for spectral analysis; and classifying the lenses according to the test results and the Class A classification standard of CIE 1931 chromaticity coordinates. Chips of the same wavelength band have the same luminous effect. Using chips of the same wavelength band to perform spectral analysis on the fluorescent lenses, the different results of the spectral analysis of each fluorescent lens indicate that the properties of each fluorescent lens are different. In this way, the fluorescent lenses can be classified into different grades and placed accordingly. During packaging, fluorescent lenses of the same grade can be directly used for mounting, which is convenient and quick.

[0094] 6. Before the step of mixing the preset phosphor and the preset adhesive in a certain proportion to obtain the fluorescent material, the method further includes: determining the particle size of the phosphor according to the power of the wafer. Specifically, when the wafer power is less than 5W, the phosphor particle size is 4-10μm when the wafer power is less than or equal to 0.5W; 10-15μm when the wafer power is 0.5-1W; 15-20μm when the wafer power is 1-2W; 20-25μm when the wafer power is 2-3W; and 25-30μm when the wafer power is 3-5W. The limiting relationship between the phosphor particle size and the wafer power results in better luminescence effect.

[0095] 7. In a Mini LED chip packaging method provided by an embodiment of the present invention, after the step of selecting fluorescent lenses of the same grade after grading to mount the Mini LED chips on a preset backlight board, the method further includes: baking the mounted backlight board at a temperature of less than 150°C for a preset time, wherein the preset time is less than 1 hour, and the control of baking temperature and baking time ensures the baking effect without affecting the performance of the Mini LED.

[0096] 8. The present invention also provides a Mini LED chip packaging module, which has the same beneficial effects as any of the Mini LED chip packaging methods described above, and will not be repeated here.

Claims

1. A method for packaging a Mini LED wafer, characterized in that, The method includes: Fluorescent lenses are fabricated using a pre-defined process; The obtained fluorescent lens is subjected to a spectral test, and the lens is chromaticity graded based on the test results and a preset chromaticity grading standard; wherein, the process includes: fixing multiple Mini LED chips of the same wavelength band on a substrate, placing multiple fluorescent lenses on the side of the multiple Mini LED chips away from the substrate, and placing one fluorescent lens on top of one Mini LED chip. Select fluorescent lenses of the same grade after grading to mount the Mini LED chips on the backlight board.

2. The Mini LED wafer packaging method of claim 1, wherein, The step of fabricating the fluorescent lens through a preset process includes: A fluorescent material is obtained by mixing a pre-set phosphor and a pre-set adhesive in a certain proportion. The fluorescent material is formed on one side of the initial lens to obtain the fluorescent lens, or the fluorescent material is injected into a preset lens mold and injection molded to form the fluorescent lens.

3. The Mini LED wafer packaging method of claim 2, wherein, The preset phosphor includes aluminate phosphor, silicate phosphor, nitride phosphor, and chloride phosphor, and the preset adhesive includes epoxy resin adhesive, PC plastic, and silicone. 4.The Mini LED wafer packaging method of claim 2, wherein, The particle size of the preset phosphor is 4-30 μm. 5.The Mini LED wafer packaging method of claim 1, wherein, The step of performing a spectroscopic test on the obtained fluorescent lens, and classifying the lens into chromaticity grades based on the test results and a preset chromaticity grading standard, includes: The fluorescent lens is placed on the side of the wafer away from the substrate so that the light emitted by the wafer is scattered by the fluorescent lens and then emitted for spectroscopic testing. The lens was chromaticity graded based on the test results and according to the CIE 1931 Class A chromaticity coordinate system.

6. The Mini LED wafer packaging method of claim 2, wherein, Before the step of mixing the preset phosphor and the preset adhesive in a certain proportion to obtain the fluorescent material, the method further includes: The particle size of the phosphor is determined based on the power of the wafer.

7. The Mini LED wafer packaging method of claim 6, wherein, The chip power is less than 5W. 8.The Mini LED wafer packaging method of claim 6, wherein, When the wafer power is less than or equal to 0.5 W, the phosphor particle size is 4-10 μm; when the wafer power is 0.5-1 W, the phosphor particle size is 10-15 μm; when the wafer power is 1-2 W, the phosphor particle size is 15-20 μm; when the wafer power is 2-3 W, the phosphor particle size is 20-25 μm; and when the wafer power is 3-5 W, the phosphor particle size is 25-30 μm. 9.The Mini LED wafer packaging method of claim 1, wherein, After the step of selecting fluorescent lenses of the same grade after grading and mounting the Mini LED chips on the backlight board, the method further includes: The backlight panel after mounting is baked at a temperature of less than 150°C for a preset time, wherein the preset time is less than 1 hour. 10.A Mini LED wafer packaging module, characterized in that, The packaging module is made by the method as described in any one of claims 1 to 8.

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