Light emitting device and method of manufacturing a light emitting device

Abstract

A light emitting apparatus and a manufacturing method thereof are disclosed. A light emitting apparatus includes a substrate, a unit light emitting area provided on the substrate, a first electrode and a second electrode provided in the unit light emitting area in a manner separated from each other, a plurality of rod-shaped LEDs provided between the first electrode and the second electrode, a reflective contact electrode provided at opposite ends of the rod-shaped LEDs to electrically connect the rod-shaped LEDs to the first electrode and the second electrode, and a light-transmissive structure provided between the first electrode and the second electrode and extended to cross the rod-shaped LEDs.

Description

[0001] This application is a divisional application of application number 201711318223.2 filed on December 12, 2017, entitled "Light-emitting device and method of manufacturing light-emitting device".

[0002] Cross-references to related applications

[0003] This application claims priority and benefit to Korean Patent Application No. 10-2016-0173864, filed on December 19, 2016, which is incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0004] Exemplary embodiments of the present invention relate to a light-emitting device and a method for manufacturing the light-emitting device. Background Technology

[0005] Light-emitting diodes (LEDs) exhibit relatively good durability even under adverse environmental conditions, and demonstrate excellent performance in terms of lifespan and brightness. In recent years, research has been conducted on the application of LEDs in various light-emitting devices.

[0006] As part of the research, techniques are being developed for fabricating ultra-small rod-shaped LEDs, such as those reaching the micrometer or nanometer scale, using inorganic crystal structures (e.g., structures in which nitride-based semiconductors are grown). For example, rod-shaped LEDs can be fabricated to a size small enough to form pixels in a self-emissive display panel.

[0007] The information disclosed in this background section is only intended to enhance the understanding of the background of the inventive concept, and therefore, the information may not contain information that constitutes prior art known to those skilled in the art. Summary of the Invention

[0008] An exemplary embodiment provides a light-emitting device including a rod-shaped LED and having uniform light-emitting characteristics, as well as a method for manufacturing the light-emitting device.

[0009] Other aspects will be set forth in the following detailed description and will be apparent in part from this disclosure or may be learned by practice of the inventive concept.

[0010] According to an exemplary embodiment, a light-emitting device includes: a substrate; a unit light-emitting area disposed on the substrate; a first electrode and a second electrode disposed separately from each other in the unit light-emitting area; a plurality of rod-shaped LEDs disposed between the first electrode and the second electrode; a reflective contact electrode disposed at opposite ends of the plurality of rod-shaped LEDs to electrically connect the rod-shaped LEDs to the first electrode and the second electrode; and a light-transmitting structure disposed between the first electrode and the second electrode and extending to intersect with the rod-shaped LEDs.

[0011] In some exemplary embodiments, the light-transmitting structure may be configured to at least overlap with the central portion of the rod-shaped LED and protrude above and below the rod-shaped LED in a direction intersecting the plane on which the substrate is disposed, such that light emitted from the rod-shaped LED is directed toward the front of the substrate.

[0012] In some exemplary embodiments, the first electrode and the second electrode may be configured to be separated from each other in at least one region of the unit light-emitting area, and the light-transmitting structure may extend between the first electrode and the second electrode in a direction parallel to the first electrode and the second electrode to overlap with a plurality of rod-shaped LEDs.

[0013] In some exemplary embodiments, the reflective contact electrode may include: a first contact electrode, wherein one end of the first electrode and the rod-shaped LED is connected to the first contact electrode; and a second contact electrode, wherein the other end of the second electrode and the rod-shaped LED is connected to the second contact electrode.

[0014] In some exemplary embodiments, the reflective contact electrode may include at least one metal layer, which includes at least one of Ag, Cu, Ti / Al / Ti, ITO / Ag / ITO, and Mo / Al / Mo.

[0015] In some exemplary embodiments, the light-transmitting structure may include silicon oxide (SiO2). x ), silicon nitride (SiN) x ( ) and at least one of the following: silicone resin containing a scatterer.

[0016] In some exemplary embodiments, the scatterer may contain at least one of TiO2 and SiO2.

[0017] In some exemplary embodiments, the light-transmitting structure may have a sloping side whose width gradually decreases closer to the substrate.

[0018] In some exemplary embodiments, the light-transmitting structure may have a top surface protruding above the rod-shaped LED, and the top surface may have an uneven surface.

[0019] In some exemplary embodiments, the light-transmitting structure may have a width that gradually decreases from the lower part near the substrate to the upper part away from the substrate, and may have curved sides.

[0020] In some exemplary embodiments, a plurality of pixels may be disposed on a substrate, and each pixel may include at least one unit light-emitting area.

[0021] In some exemplary embodiments, the rod-shaped LED may each include an insulating film that exposes at least opposite ends and surrounds the sides, and the exposed opposite ends may be located at the first electrode and the second electrode, respectively.

[0022] In some exemplary embodiments, the light-transmitting structure may have a lower refractive index than that of a rod-shaped LED.

[0023] An exemplary embodiment of a method for manufacturing a light-emitting device includes: providing a first electrode and a second electrode on a substrate; providing a plurality of rod-shaped LEDs on the substrate on which the first electrode and the second electrode are provided, and arranging the rod-shaped LEDs between the first electrode and the second electrode; providing a light-transmitting structure between the first electrode and the second electrode, the light-transmitting structure exposing opposite ends of the rod-shaped LEDs and intersecting the rod-shaped LEDs; and providing a reflective contact electrode that electrically connects opposite ends of the rod-shaped LEDs to the first electrode and the second electrode, respectively.

[0024] In some exemplary embodiments, providing a light-transmitting structure may include: providing a light-transmitting insulating layer on a substrate in which rod-shaped LEDs are arranged; and patterning the insulating layer using an optical process of using a mask to provide a light-transmitting structure.

[0025] In some exemplary embodiments, the insulating layer may be disposed at a height higher than that of the rod-shaped LED.

[0026] In some exemplary embodiments, the insulating layer may be patterned to have a sloping side that has an inverted conical shape between the first and second electrodes.

[0027] In some exemplary embodiments, the manufacturing method may further include providing a non-uniform pattern on the top surface of the insulating layer or the light-transmitting structure.

[0028] In some exemplary embodiments, setting the light-transmitting structure may include: applying a liquid organic insulating material between the first electrode and the second electrode to expose the opposite ends of the rod-shaped LED; and hardening the liquid organic insulating material.

[0029] In some exemplary embodiments, during the application of the liquid organic insulating material, the liquid organic insulating material with scatterers distributed thereon can be applied at a height higher than that of the rod-shaped LED.

[0030] According to various exemplary embodiments of the present invention, a light-emitting device comprising a plurality of rod-shaped LEDs disposed in each unit light-emitting region and emitting light uniformly in each unit light-emitting region, and a method for manufacturing the light-emitting device, can be provided.

[0031] The above general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed subject matter. Attached Figure Description

[0032] The accompanying drawings, which are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept.

[0033] Figure 1 A rod-shaped LED is shown as an exemplary embodiment of the concept according to the present invention.

[0034] Figure 2 This is a view showing a configuration diagram of a light-emitting device according to an exemplary embodiment of the present invention.

[0035] Figures 3A to 3E This is a view showing a circuit diagram of a unit area of ​​a light-emitting device according to an exemplary embodiment of the present invention, particularly an example of a pixel forming a passive light-emitting display panel.

[0036] Figure 4A , Figure 4B and Figure 4C This is a view showing a circuit diagram of a unit area of ​​a light-emitting device according to an exemplary embodiment of the present invention, particularly an example of a pixel forming an active light-emitting display panel.

[0037] Figure 5 This is a top plan view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention, particularly a top plan view of the light-emitting area of ​​each pixel.

[0038] Figure 6 Showing the section along line I-I' Figure 5 A sectional view.

[0039] Figure 7 It shows through Figure 5 and Figure 6 A top view of the brightness uniformity effect achieved by the exemplary embodiment shown.

[0040] Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8EThis is a cross-sectional view showing the sequence of a method for manufacturing a light-emitting device according to an exemplary embodiment of the present invention.

[0041] Figure 9 This is a cross-sectional view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention.

[0042] Figure 10 This is a cross-sectional view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention.

[0043] Figure 11 This is a cross-sectional view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention.

[0044] Figure 12A , Figure 12B , Figure 12C and Figure 12D This is a cross-sectional view showing the sequence of a method for manufacturing a light-emitting device according to an exemplary embodiment of the present invention. Detailed Implementation

[0045] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of the exemplary embodiments. However, it will be apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are illustrated in block diagram form to avoid unnecessarily obscuring the exemplary embodiments.

[0046] In the accompanying drawings, for clarity and descriptive purposes, the dimensions and relative dimensions of layers, films, panels, areas, etc., may be enlarged. Furthermore, the same reference numerals indicate the same elements.

[0047] When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, the element or layer may be directly on, directly connected to, or coupled to the other element or layer, or intermediate elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, no intermediate elements or layers are present. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. The same reference numerals refer to the same elements throughout. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0048] While the terms “first,” “second,” etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or segment from another. Therefore, without departing from the teachings of this disclosure, the first element, component, region, layer, and / or segment discussed below may be referred to as the second element, component, region, layer, and / or segment.

[0049] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “above,” and “over” are used herein to describe the relationship of one element or feature to another, as illustrated in the accompanying drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are intended to cover different orientations during the use, operation, and / or manufacture of the apparatus. For example, if the apparatus in the drawings is flipped, an element described as “below” or “under” other elements or features would be oriented “above” other elements or features. Thus, the exemplary term “below” can encompass both the above and below orientations. Furthermore, the apparatus may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore the spatial relative descriptors used herein are interpreted accordingly.

[0050] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. The singular forms “a” and “the” as used herein are intended to include the plural forms as well, unless explicitly stated in the context. Furthermore, when used in this specification, the terms “comprising” and / or “including” designate the stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0051] The exemplary embodiments will be described herein with reference to cross-sectional views that serve as schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, variations in the illustrated shapes can be expected, for example, due to manufacturing techniques and / or tolerances. Consequently, the exemplary embodiments disclosed herein should not be construed as limited to the shapes of the specifically shown areas, but will include deviations in shape, for example, due to manufacturing processes. Therefore, the areas shown in the figures are substantially schematic, and their shapes do not necessarily represent the actual shapes of areas of the device, and are therefore not intended to be limiting.

[0052] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art as to which this disclosure is a part. Terms such as those defined in common dictionaries shall be interpreted as having meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0053] Figure 1 A perspective view of a rod-shaped LED 100 according to an exemplary embodiment of the present invention is shown. In some embodiments, in Figure 1 The image shows a rod-shaped LED 100 with a cylindrical shape, but the shape of the rod-shaped LED 100 according to the present invention is not limited to this.

[0054] refer to Figure 1 The rod-shaped LED 100 according to the present exemplary embodiment of the present invention includes: a first conductive semiconductor layer 110 and a second conductive semiconductor layer 130, and an active layer 120 inserted between the first conductive semiconductor layer 110 and the second conductive semiconductor layer 130. For example, the rod-shaped LED 100 can be implemented as a stack in which the first conductive semiconductor layer 110, the active layer 120, and the second conductive semiconductor layer 130 are sequentially stacked. Furthermore, in some embodiments, the rod-shaped LED 100 may also include an insulating film 140, and in addition to the insulating film 140, may also include one or more electrode layers.

[0055] In a present exemplary embodiment of the present invention, the rod-shaped LED 100 may be configured to have a rod-shaped (or strip-shaped) shape extending along one direction. Assuming the rod-shaped LED 100 extends along the first direction and has a length of L, the rod-shaped LED 100 has a first end and a second end extending along the first direction. In the present exemplary embodiment, one of the first conductive semiconductor layer 110 and the second conductive semiconductor layer 130 is disposed at the first end, while the other of the first conductive semiconductor layer 110 and the second conductive semiconductor layer 130 is disposed at the second end. On the other hand, in another exemplary embodiment, when at least one electrode layer is further disposed on at least one end of the rod-shaped LED 100, the electrode layer (not shown) may also be disposed on at least one of the first and second ends.

[0056] In some exemplary embodiments, the rod-shaped LED 100 may be configured to have, for example... Figure 1The cylindrical shape shown is not limited to this; however, the shape of the rod-shaped LED 100 is not limited to this. In this case, "rod-shaped" includes rod-shaped or strip-shaped shapes such as cylinders, polygonal pillars, etc., having a length L (i.e., an aspect ratio greater than 1) along the first direction. For example, the rod-shaped LED 100 may have a length L greater than its diameter D.

[0057] The rod-shaped LED 100 can be manufactured small enough to have, for example, a diameter D and / or a length L in the micrometer or nanometer range. For example, the rod-shaped LED 100 can have a diameter D ranging from tens of nanometers (nm) to several micrometers (μm) and a length L ranging from hundreds of nanometers (nm) to tens of micrometers (μm). However, the size of the rod-shaped LED 100 in the present embodiment of the invention is not necessarily limited thereto. For example, the size of the rod-shaped LED 100 can be varied to meet the requirements of light-emitting devices in which the rod-shaped LED 100 is applied.

[0058] The first conductive semiconductor layer 110 may include, for example, at least one n-type semiconductor layer. For instance, the first conductive semiconductor layer 110 may include any semiconductor material selected from InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include a semiconductor layer doped with a first conductive dopant such as Si, Ge, Sn, etc. The materials used to form the first conductive semiconductor layer 110 are not limited thereto; furthermore, the first conductive semiconductor layer 110 may be made of various materials.

[0059] An active layer 120 is disposed above the first conductive semiconductor layer 110 and may be formed having a single or multiple quantum well structures. In some exemplary embodiments, a cladding layer (not shown) doped with a conductive dopant may also be formed above and / or below the active layer 120. For example, the cladding layer may be implemented as an AlGaN layer or an InAlGaN layer. Furthermore, materials such as AlGaN and AlInGaN may be used as the active layer 120. When an electric field corresponding to a predetermined voltage or higher is applied to opposite ends of the rod-shaped LED 100, electron-hole pairs are bound in the active layer 120, thereby causing the rod-shaped LED 100 to emit light.

[0060] The second conductive semiconductor layer 130 is disposed above the active layer 120 and may include a semiconductor layer different from the first conductive semiconductor layer 110. For example, the second conductive semiconductor layer 130 may include at least one p-type semiconductor layer. For example, the second conductive semiconductor layer 130 includes at least one semiconductor material selected from InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include a semiconductor layer doped with a second conductive dopant such as Mg. The materials used to form the second conductive semiconductor layer 130 are not limited thereto, and the second conductive semiconductor layer 130 may also be made of various materials.

[0061] Furthermore, in some exemplary embodiments, in addition to the first conductive semiconductor layer 110, the active layer 120, and the second conductive semiconductor layer 130 described above, the rod-shaped LED 100 may also include other phosphor layers, active layers, semiconductor layers, and / or electrode layers above and / or below each layer. For example, the rod-shaped LED 100 may also include a first electrode layer and / or a second electrode layer disposed at at least one end. For example, the first electrode layer is disposed at the end of the rod-shaped LED 100 not covered by the insulating film 140 (e.g., Figure 1 In the middle, on the bottom surface of the rod-shaped LED 100 not covered by the insulating film 140), and the second electrode layer can be disposed at the other end of the rod-shaped LED 100 not covered by the insulating film 140 (e.g., Figure 1 In the middle, on the top surface of the rod-shaped LED 100 that is not covered by the insulating film 140.

[0062] In some exemplary embodiments, the rod-shaped LED 100 may also include an insulating film 140, but is not limited thereto. That is, in some exemplary embodiments, the insulating film 140 may be selectively included.

[0063] The insulating film 140 can be configured to cover at least one region of the first conductive semiconductor layer 110, the active layer 120, and the second conductive semiconductor layer 130. For example, the insulating film 140 can be disposed in a portion of the rod-shaped LED 100 in which opposite ends are not present, thereby exposing the opposite ends of the rod-shaped LED 100. For better understanding and ease of description, in Figure 1 A portion of the insulating film 140 is omitted. For example, due to... Figure 1A portion of the insulating film 140 is omitted, so the first conductive semiconductor layer 110, the active layer 120, and the second conductive semiconductor layer 130 are partially exposed. However, in practice, the cylindrical side surface of the rod LED 100 can be completely surrounded by the insulating film 140. Furthermore, in some exemplary embodiments, the insulating film 140 may also expose at least one region of the side surface of the first conductive semiconductor layer 110 and / or the second conductive semiconductor layer 130 (e.g., the upper and / or lower ends of the side surface of the rod LED 100).

[0064] The insulating film 140 may be formed to surround at least some of the outer peripheral surfaces of the first conductive semiconductor layer 110, the active layer 120, and / or the second conductive semiconductor layer 130. For example, the insulating film 140 may be formed to at least surround the outer peripheral surface of the active layer 120. In some exemplary embodiments, the insulating film 140 may be formed of a light-transmitting insulating material (i.e., a transparent insulating material) capable of allowing light to pass through. For example, the insulating film 140 may include one or more insulating materials selected from SiO2, Si3N4, Al2O3, and TiO2, but is not limited thereto. That is, in addition to the insulating materials described above, the insulating film 140 may also be manufactured using various transparent insulating materials.

[0065] In exemplary embodiments related to the insulating film 140, the insulating film 140 itself may be made of a hydrophobic material, or a hydrophobic coating made of a hydrophobic material may be formed on the insulating film 140. In some exemplary embodiments, the hydrophobic material may be a fluorinated material exhibiting hydrophobic properties. Furthermore, in some embodiments, the hydrophobic material may be applied to the rod-shaped LED 100 in the form of a self-assembled monolayer (SAM), and in this case, the hydrophobic material may include octadecyltrichlorosilane and fluoroalkyltrichlorosilane, perfluoroalkyltriethoxysilane, etc. Additionally, the hydrophobic material may be such as TEFLON (Teflon... TM ) or cytop(Cytop TM Commercially available fluorine-containing materials, or materials that correspond to them.

[0066] When the insulating film 140 is provided (or formed), short circuits between the active layer 120 and the first and / or second electrodes (not shown) can be prevented. Furthermore, by forming the insulating film 140, surface defects of the rod-shaped LED 100 can be minimized, thereby improving lifespan and efficiency. Additionally, when multiple rod-shaped LEDs 100 are closely arranged, the insulating film 140 can prevent undesirable short circuits that could occur between the rod-shaped LEDs 100.

[0067] Furthermore, if the insulating film 140 itself is made of a hydrophobic material, or if a hydrophobic coating is provided on the insulating film 140, the rod-shaped LEDs 100 can be relatively uniformly dispersed in the LED solution when the LED solution comprising a plurality of rod-shaped LEDs 100 is applied. Therefore, the rod-shaped LEDs 100 can be uniformly applied to the interior of each unit area forming the light-emitting device.

[0068] The bar LED 100 can be used as a light source for various light-emitting devices. For example, the bar LED 100 can be used as a light source for lighting devices or self-emissive display panels.

[0069] Figure 2 This is a configuration diagram of a light-emitting device according to an exemplary embodiment of the present invention. In some exemplary embodiments, the light-emitting display device is... Figure 2 The example shown is a light-emitting device using a rod-shaped LED 100, but the light-emitting device according to the present invention is not limited thereto. For example, the light-emitting device of the exemplary embodiment of the present invention can be other types of light-emitting devices such as lighting devices.

[0070] refer to Figure 2 The light-emitting device according to the present exemplary embodiment of the present invention includes: a timing controller 210, a scan driver 220, a data driver 230, and an emission region 240. When the light-emitting device is a light-emitting display device as in the present exemplary embodiment, the emission region 240 may represent the entire pixel area implemented on the display panel, i.e., the display area.

[0071] The timing controller 210 receives various control signals and image data required to drive the transmission area 240 from an external source (e.g., a system for transmitting image data). The timing controller 210 rearranges the received image data for transmission to the data driver 230. Furthermore, the timing controller 210 generates scan control signals and data control signals required to drive the scan driver 220 and data driver 230, and sends these generated signals to the scan driver 220 and data driver 230, respectively.

[0072] The scan driver 220 receives a scan control signal from the timing controller 210 and generates a scan signal based on the scan control signal. The scan signal generated from the scan driver 220 is provided to the unit area (e.g., pixel) 260 via scan lines S1 to Sn.

[0073] The data driver 230 receives data control signals and image data from the timing controller 210 and generates data signals accordingly. The data signals generated by the data driver 230 are output to data lines D1 to Dm. The data signals output to data lines D1 to Dm are input to a unit region (e.g., pixel) 260 of a horizontal pixel line selected by a scan signal.

[0074] The emission area 240 may include a plurality of unit areas 260, which are disposed in the areas where scan lines S1 to Sn and data lines D1 to Dm intersect each other. In some exemplary embodiments, each unit area 260 may be a pixel 250 of a light-emitting display device.

[0075] Each pixel 250 can include, for example Figure 1 The diagram shows a plurality of bar-shaped LEDs 100. When a scan signal is provided from scan lines S1 to Sn, pixel 250 selectively emits light according to the data signal received from data lines D1 to Dm. For example, for each frame cycle of the light-emitting display device, pixel 250 emits light with a brightness corresponding to the received data signal. Pixel 250 provided with a data signal corresponding to the brightness of black displays black by not emitting light during the corresponding frame cycle. On the other hand, when the emitting region 240 is a pixel region of an active matrix type light-emitting display panel, in addition to the scan signal and the data signal, the emitting region 240 may also be provided with a first pixel power supply and a second pixel power supply. In some exemplary embodiments, the first pixel power supply and the second pixel power supply may be a high-potential pixel power supply ELVDD and a low-potential pixel power supply ELVSS, respectively.

[0076] Figures 3A to 3E This is a circuit diagram of a unit region 260 of a light-emitting device according to an exemplary embodiment of the present invention, particularly a circuit diagram of an example of pixels forming a passive light-emitting display panel. For ease of description, [the following will be used]. Figures 3A to 3E The image shows the j-th pixel (where j is a natural number) located on the i-th (where i is a natural number) horizontal pixel line (i.e., the pixel positioned in the i-th row and j-th column). In some exemplary embodiments, Figures 3A to 3E The pixel shown can be one of red, green, blue, and white pixels, but is not limited to these.

[0077] refer to Figure 3APixel 250 includes a rod-shaped LED 100 connected between a scan line Si and a data line Dj. In some exemplary embodiments, a first electrode (e.g., an anode) of the rod-shaped LED 100 may be connected to the scan line Si, and a second electrode (e.g., a cathode) may be connected to the data line Dj. When a voltage higher than a threshold voltage is applied between the first and second electrodes, the rod-shaped LED 100 emits light with a brightness corresponding to the magnitude of the applied voltage. That is, the emission of pixel 250 can be controlled by controlling the voltage of the scan signal applied to the scan line Si and / or the voltage of the data signal applied to the data line Dj.

[0078] refer to Figure 3B In some exemplary embodiments, pixel 250 may include two or more bar LEDs 100 connected in parallel. In this case, the brightness of pixel 250 may correspond to the sum of the brightness of the multiple bar LEDs 100. As mentioned above, when pixel 250 includes multiple bar LEDs 100, particularly a large number of bar LEDs 100, even if some of the bar LEDs 100 are defective, such defects may not cause pixel 250 to be defective.

[0079] refer to Figure 3C In some exemplary embodiments, the connection orientation of the bar LED 100 included in pixel 250 can be changed. For example, the first electrode (anode) of the bar LED 100 can be connected to data line Dj, and the second electrode (cathode) of the bar LED 100 can be connected to scan line Si. Figure 3A Exemplary embodiments and Figure 3C In an exemplary embodiment, the voltages applied to the scan line Si and the data line Dj can be opposite to each other.

[0080] refer to Figure 3D ,according to Figure 3C The pixel 250 of the exemplary embodiment may also include two or more rod-shaped LEDs 100 connected in parallel to each other.

[0081] refer to Figure 3E In some exemplary embodiments, pixel 250 may include a plurality of bar LEDs 100 connected in different directions. For example, pixel 250 may include one or more bar LEDs 100 with a first electrode (anode) connected to scan line Si and a second electrode (cathode) connected to data line Dj, and one or more bar LEDs 100 with a first electrode (anode) connected to data line Dj and a second electrode (cathode) connected to scan line Si.

[0082] In some exemplary embodiments, Figure 3EThe 250 pixels can be DC driven or AC driven. When Figure 3E When pixel 250 is DC driven, the forward-connected rod LED 100 can emit light, while the reverse-connected rod LED 100 may not emit light. On the other hand, when Figure 3E When pixel 250 is AC driven, the forward-connected rod-shaped LED 100 emits light according to the direction of the applied voltage. That is, when AC driven, the LEDs included... Figure 3E The bar LEDs 100 in the 250 pixels can emit light alternately according to the direction of the voltage.

[0083] Figures 4A to 4C This is a circuit diagram of a unit region 260 of a light-emitting device according to an exemplary embodiment of the present invention, particularly showing an example of a pixel forming an active matrix light-emitting display panel. Figures 4A to 4C In the figures, the same reference numerals are used to represent the same figures. Figures 3A to 3E The same or similar parts will be omitted, and their detailed descriptions will be omitted.

[0084] refer to Figure 4A Pixel 250 includes one or more bar LEDs 100 and pixel circuitry 252 connected to one or more bar LEDs 100.

[0085] A first electrode (e.g., anode) of the rod-shaped LED 100 is connected to a first pixel power supply ELVDD via pixel circuit 252, and a second electrode (e.g., cathode) is connected to a second pixel power supply ELVSS. The first pixel power supply ELVDD and the second pixel power supply ELVSS may have different potentials. For example, the second pixel power supply ELVSS may have a potential that is lower than the threshold voltage of the rod-shaped LED 100 by more than the potential of the first pixel power supply ELVDD. Each rod-shaped LED 100 emits light with a brightness corresponding to the drive current controlled by the pixel circuit 252.

[0086] On the other hand, Figure 4A The present invention discloses an exemplary embodiment in which pixel 250 includes only one rod-shaped LED 100, but the inventive concept is not limited thereto. For example, pixel 250 may include a plurality of rod-shaped LEDs 100 connected in parallel with each other.

[0087] In some exemplary embodiments, the pixel circuit 252 includes a first transistor M1, a second transistor M2, and a storage capacitor Cst. However, the structure of the pixel circuit 252 is not limited to... Figure 4A The exemplary embodiments shown are shown, and can be changed in different ways.

[0088] exist Figure 4AIn one exemplary embodiment, the first electrode of the first transistor (switching transistor) M1 is connected to the data line Dj, and the second electrode of the first transistor M1 is connected to the first node N1. In this case, the first electrode and the second electrode of the first transistor M1 can be different from each other. For example, if the first electrode is the source electrode, the second electrode can be the drain electrode. Furthermore, the gate electrode of the first transistor M1 is connected to the scan line Si. When a scan signal with a voltage for turning on the first transistor M1 (e.g., a low-level turn-on voltage) is provided from the scan line Si, the first transistor M1 turns on, thereby electrically connecting the data line Dj and the first node N1. In this case, the data signal of the corresponding frame is provided to the data line Dj, and accordingly, the data signal is sent to the first node N1. The data signal sent to the first node N1 is charged into the storage capacitor Cst.

[0089] The first electrode of the second transistor (driving transistor) M2 is connected to the first pixel power supply ELVDD, and the second electrode of the second transistor M2 is connected to the first electrode of the rod LED 100. Furthermore, the gate electrode of the second transistor M2 is connected to the first node N1. The second transistor M2 controls the amount of driving current supplied to the rod LED 100 based on the voltage of the first node N1.

[0090] One electrode of the storage capacitor Cst is connected to the first pixel power supply ELVDD, while the other electrode is connected to the first node N1. The storage capacitor Cst is charged with a voltage corresponding to the data signal supplied to the first node N1, and the charged voltage is maintained until the data signal of the next frame is provided.

[0091] For ease of description, Figure 4A The diagram illustrates a pixel circuit 252 with a relatively simple structure. Pixel circuit 252 includes a first transistor M1 for transmitting data signals to the interior of pixel 250, a storage capacitor Cst for storing the data signals, and a second transistor M2 for providing a drive current corresponding to the data signals to the rod LED 100. However, the inventive concept is not limited to this, and the structure of pixel circuit 252 can be modified in different ways. For example, pixel circuit 252 may also include other circuit elements such as at least one transistor element for compensating the threshold voltage of the second transistor M2, at least one transistor element for initializing the voltage of the first node N1 or the voltage applied to one electrode of the rod LED 100, and / or at least one transistor element for controlling the light emission period, or a boost capacitor for boosting the voltage of the first node N1.

[0092] In addition, Figure 4AIn the diagram, all transistors (e.g., the first transistor M1 and the second transistor M2) included in the pixel circuit 252 are shown as P-type transistors, but the inventive concept is not limited thereto. That is, at least one of the transistors M1 and M2 included in the pixel circuit 252 can be changed to an N-type transistor.

[0093] refer to Figure 4B In some exemplary embodiments, the first transistor M1 and the second transistor M2 can be implemented as N-type transistors. Aside from some changes in the position of the connecting components due to the change in transistor type, Figure 4B The pixel circuit 252 shown has the same characteristics as... Figure 4A The pixel circuit 252 in the image has the same configuration. Therefore, its detailed description will be omitted. In some exemplary embodiments, Figure 4B The pixel 250 shown may also include a plurality of rod-shaped LEDs 100 connected in parallel to each other.

[0094] refer to Figure 4C In some exemplary embodiments, pixel 250 may further include a plurality of rod-shaped LEDs 100 connected in different directions. In this case, pixel 250 may be DC-driven or AC-driven. Since the above has already referenced... Figure 3E A description has already been provided, so a detailed description will be omitted.

[0095] Figure 5 This is a top plan view of a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention, particularly a top plan view of the light-emitting area of ​​each pixel. Additionally, Figure 6 It is intercepted along line I-I' Figure 5 The sectional view, and Figure 7 yes Figure 5 and Figure 6 The illustrated exemplary embodiment demonstrates the brightness uniformity as shown in a top plan view. For ease of description, in Figures 5 to 7 The image will show the rod-shaped LED used as the light source in each unit light-emitting area, along with the components around it.

[0096] refer to Figure 5 and Figure 6 The light-emitting device according to a present exemplary embodiment of the present invention includes a substrate 301 and a unit light-emitting region 300 disposed on the substrate 301. In some exemplary embodiments, the unit light-emitting region 300 of the present exemplary embodiment of the present invention may be, for example, formed as... Figure 2 The emitting region 240 shown is the light-emitting region of each pixel in the pixel 250. That is, the light-emitting device of the present exemplary embodiment of the present invention may include a plurality of such light-emitting regions on the substrate 301. Figure 5The light-emitting display device shown is a unit light-emitting area 300. For example, a light-emitting device according to a present exemplary embodiment of the present invention may include a plurality of pixels disposed on a substrate 301. Figure 2 The 250 in the image shows that each of the plurality of pixels includes at least one unit light-emitting region 300. However, the inventive concept is not limited thereto. That is, the inventive concept can also be applied to other light-emitting devices besides the light-emitting display device described above.

[0097] In some exemplary embodiments, the substrate 301 may be a rigid substrate or a flexible substrate. For example, the substrate 301 may be a rigid substrate made of glass or tempered glass, or a flexible substrate made of a thin-film flexible plastic material. Furthermore, in some exemplary embodiments, the substrate 301 may be a substrate made of a transparent material, i.e., the substrate 301 may be a light-transmitting substrate, but is not limited thereto. For example, in another exemplary embodiment, the substrate 301 may also be a non-transparent substrate and / or a reflective substrate.

[0098] In some exemplary embodiments, each unit light-emitting region 300 includes: a first electrode 310 and a second electrode 320, and a plurality of rod-shaped LEDs 100 disposed between the first electrode 310 and the second electrode 320, configured to electrically connect the rod-shaped LEDs 100 to contact electrodes 340 and 350 of the first electrode 310 and the second electrode 320, and a light-transmitting structure 330 disposed between the first electrode 310 and the second electrode 320 to overlap with at least one region of the rod-shaped LEDs 100. In some exemplary embodiments, one or more insulating layers (not shown) may be disposed between the substrate 301 and the first electrode 310 and the second electrode 320. For example, a buffer layer may be disposed between the substrate 301 and the first electrode 310 and the second electrode 320 to form a smooth surface on the upper part of the substrate 301 and to prevent impurities from penetrating. The insulating layer may include, for example, SiO2. x or SiN x An oxide or nitride layer, etc., but not limited to these. An insulating layer may be optional.

[0099] In some exemplary embodiments, the first electrode 310 and the second electrode 320 are separated from each other in each unit light-emitting region 300. For example, the first electrode 310 and the second electrode 320 may be separately disposed and parallel to each other in at least one region of each unit light-emitting region 300. In some exemplary embodiments, the first electrode 310 and the second electrode 320 may be configured to be paired within the unit light-emitting region 300, such that at least one region of the first electrode 310 faces at least one region of the second electrode 320.

[0100] For example, the first electrode 310 and the second electrode 320 may each include main electrode portions 310a and 320a and at least one of sub-electrode portions 310b and 320b branching from the main electrode portions 310a and 320a. Furthermore, the sub-electrode portions 310b of the first electrode 310 and 320b of the second electrode 320 may be arranged parallel to each other and separated by a predetermined distance.

[0101] In this case, the main electrode portions 310a and 320a, and the sub-electrode portions 310b and 320b, are not particularly limited to a certain shape. For example, the main electrode portions 310a and 320a, and the sub-electrode portions 310b and 320b are in... Figure 5 The electrode portions 310a and 320a are shown as having rectangular stripes, but the main electrode portions 310b and 320b and the sub-electrode portions 310b and 320b can have various shapes different from stripes, and can be modified into vortex shapes, for example. Furthermore, the number of sub-electrode portions 310b and 320b branching from each of the main electrode portions 310a and 320a is not particularly limited. For example, Figure 5 Two second sub-electrode portions 320b are shown positioned on opposite sides to insert a first sub-electrode portion 310b, but the sub-electrode portions 310b and 320b can be modified in different ways. For example, as in... Figure 7 In the exemplary embodiment shown, the same number of first sub-electrode portions 310b and second sub-electrode portions 320b can be provided, and they can be alternately arranged in the unit light-emitting area 300.

[0102] In some exemplary embodiments, the first electrode 310 and the second electrode 320 may be disposed in the same layer on one surface of the substrate 301, while being separate from each other. For example, the first electrode 310 and the second electrode 320 may be disposed at the same height and parallel to each other, such that the first electrode 310 and the second electrode 320 are separate from each other on the top surface of the substrate 301, and may be disposed alternately relative to each other. However, the inventive concept is not limited thereto. In another exemplary embodiment, the first electrode 310 and the second electrode 320 may be disposed in different layers or at different heights.

[0103] In some exemplary embodiments, the first electrode 310 and / or the second electrode 320 may comprise at least one of a metal or alloy, a conductive polymer, and a conductive metal oxide. Examples of metals used to form the first electrode 310 and / or the second electrode 320 include Ti, Cu, Mo, Al, Au, Cr, TiN, Ag, Pt, Pd, Ni, Sn, Co, Rh, Ir, Fe, Ru, Os, Mn, W, Nb, Ta, Bi, Sb, and Pb; various other metals may also be used. Examples of alloys used to form the first electrode 310 and / or the second electrode 320 include MoTi and AlNiLa; various other alloys may also be used. Examples of multilayers used to form the first electrode 310 and / or the second electrode 320 include Ti / Cu, Ti / Au, Mo / Al / Mo, ITO / Ag / ITO, TiN / Ti / Al / Ti, and TiN / Ti / Cu / Ti; various conductive materials having multilayer structures may also be used. Examples of conductive polymers used to form the first electrode 310 and / or the second electrode 320 include polythiophene compounds, polypyrrole compounds, polyaniline compounds, polyacetylene compounds, polyphenylene compounds, and mixtures thereof, and particularly in polythiophene compounds, PEDOT / PSS compounds may be used. Examples of conductive metal oxides used to form the first electrode 310 and / or the second electrode 320 include ITO, IZO, AZO, ITZO, ZnO, and SnO2. Furthermore, in addition to the conductive materials described above, any material may be used to form the first electrode 310 and / or the second electrode 320, as long as it is a conductive material. The first electrode 310 and / or the second electrode 320 are not particularly limited to having a specific electrode structure, and the first electrode 310 and / or the second electrode 320 may be formed in various different ways to have a single-layer or multi-layer structure.

[0104] The first electrode 310 and the second electrode 320 can be electrically connected to predetermined signal lines or power lines, or circuit elements, respectively. For example, the first electrode 310 and the second electrode 320 can be connected to the aforementioned reference. Figures 3A to 4C The exemplary embodiments described include scan line Si, data line Dj, first pixel power supply or second pixel power supply (ELVDD, ELVSS) and / or pixel circuit 252.

[0105] Multiple rod-shaped LEDs 100 are disposed between the first electrode 310 and the second electrode 320. On the other hand, Figure 5 The exemplary embodiments shown are, for example, with having Figure 3B The structure shown corresponds to pixel 250, and when the structure of pixel 250 is changed, the connection structure between the first electrode 310 and / or the second electrode 320 and the rod-shaped LED 100 can also be changed. For example, as Figures 4A to 4CThe pixel circuit 252 shown can also be set within each unit light-emitting area 300.

[0106] In some exemplary embodiments, the pixel circuit 252 is disposed on the same surface of the substrate 301 together with the first electrode 310 and the second electrode 320, such that the pixel circuit 252 can be disposed in the same layer as the first electrode 310 and the second electrode 320, or it can be disposed in a different layer than the first electrode 310 and the second electrode 320. For example, the pixel circuit 252 is disposed in an intermediate layer (not shown), which is inserted between the substrate 301 and a predetermined layer on which the first electrode 310 and the second electrode 320 are disposed, and can be electrically connected to the first electrode 310 and / or the second electrode 320 through contact holes or through-holes. In this case, the first electrode 310 and / or the second electrode 320 may not be connected to the scan line Si or the data line Dj, but may be connected to... Figures 4A to 4C The pixel circuit 252 shown may alternatively be electrically connected to the first pixel power supply or the second pixel power supply (ELVDD, ELVSS).

[0107] In some exemplary embodiments, at least some of the rod-shaped LEDs 100 disposed in each unit light-emitting region 300 may be disposed between the first electrode 310 and the second electrode 320, such that at least some of the rod-shaped LEDs are electrically coupled to the first electrode 310 and the second electrode 320. For example, multiple rod-shaped LEDs 100 disposed in each unit light-emitting region 300 may be electrically connected between the first electrode 310 and the second electrode 320, with one end of each rod-shaped LED 100 physically and / or electrically connected to the first electrode 310 and the other end physically and / or electrically connected to the second electrode 320. In this case, the rod-shaped LEDs 100 may have a length greater than the shortest distance between adjacent first electrodes 310 and second electrodes 320. Figure 1 L in the middle.

[0108] In some exemplary embodiments, a plurality of rod-shaped LEDs 100 may be disposed in each unit light-emitting area 300, but the number of rod-shaped LEDs is not particularly limited. For example, a plurality of rod-shaped LEDs 100 may be disposed between a first sub-electrode portion 310b and a second sub-electrode portion 320b, which are a pair facing each other.

[0109] In some exemplary embodiments, the opposite ends of at least some of the rod-shaped LEDs 100 may be respectively disposed on the first sub-electrode portion 310b and the second sub-electrode portion 320b, but all the rod-shaped LEDs 100 disposed in the unit light-emitting area 300 are not limited to the above-described positions. For example, the number of rod-shaped LEDs 100 connected between the first electrode 310 and the second electrode 320 or how the rod-shaped LEDs 100 are distributed is not particularly limited. In addition, although not shown, at least one rod-shaped LED 100 may also be disposed in each unit light-emitting area 300 that is not connected as a whole between the first electrode 310 and the second electrode 320 but is randomly disposed. That is, at least one rod-shaped LED 100 that is not arranged between the first electrode 310 and the second electrode 320 but is randomly disposed may also exist in the unit light-emitting area 300 and / or the area around it.

[0110] For ease of description, Figure 5 The diagram shows each of the rod-shaped LEDs 100 connected between the first electrode 310 and the second electrode 320, such that each rod-shaped LED is uniformly arranged in a specific direction (e.g., horizontal) perpendicular to the direction in which the first sub-electrode portion 310b and the second sub-electrode portion 320b extend (e.g., vertical direction). However, the arrangement of the rod-shaped LEDs 100 is not limited to this. For example, at least some of the rod-shaped LEDs 100 may be arranged in an inclined direction between the first electrode 310 and the second electrode 320. That is, the direction in which the rod-shaped LEDs 100 are connected and / or arranged is not particularly limited.

[0111] As previously referenced Figure 1 As described, each rod-shaped LED in the rod-shaped LED 100 includes at least a first conductive semiconductor layer 110, an active layer 120, and a second conductive semiconductor layer 130. Furthermore, in some exemplary embodiments, each rod-shaped LED of the rod-shaped LED 100 may also include: an insulating film 140 covering at least the active layer 120, and / or at least one electrode layer disposed at one end of the first conductive semiconductor layer 110 or the second conductive semiconductor layer 130. For example, each rod-shaped LED of the rod-shaped LED 100 includes an insulating film 140 that completely covers the side of the active layer 120 and covers at least some of the side surfaces of the first conductive semiconductor layer 110 and the second conductive semiconductor layer 130, and an electrode layer 150 disposed at one end of the rod-shaped LED 100 (e.g., the end where the second conductive semiconductor layer 130 is disposed).

[0112] In some exemplary embodiments, contact electrodes 340 and 350 are disposed at opposite ends of the rod-shaped LED 100. Accordingly, even if the sides of the rod-shaped LED 100 are covered by the insulating film 140, the opposite ends of the rod-shaped LED 100 not covered by the insulating film 140 can be electrically connected to the first electrode 310 and the second electrode 320 respectively via contact electrodes 340 and 350. Furthermore, when contact electrodes 340 and 350 are provided, it is possible to prevent the rod-shaped LED 100 from moving away from its arranged position.

[0113] Contact electrodes 340 and 350 allow the rod-shaped LED 100 to be electrically connected between the first electrode 310 and the second electrode 320. For example, contact electrodes 340 and 350 may be disposed at opposite ends of the rod-shaped LED 100 such that opposite ends of the rod-shaped LED 100 are electrically connected to the first electrode 310 and the second electrode 320, respectively.

[0114] In some exemplary embodiments, contact electrodes 340 and 350 may include a first contact electrode 340 for connecting one end of all of the plurality of rod-shaped LEDs 100 to the first electrode 310, the first contact electrode 340 being disposed between the same pair of first sub-electrode portions 310b and second sub-electrode portions 320b. Contact electrodes 340 and 350 may also include a second contact electrode 350 for connecting the other end of all of the plurality of rod-shaped LEDs 100 to the second electrode 320. For example, when each rod-shaped LED in the rod-shaped LED 100 includes an insulating film 140 that exposes at least opposite ends and surrounds the sides, and the exposed opposite ends are respectively disposed on the first electrode 310 and the second electrode 320, the contact electrodes 340 and 350 may include: a first contact electrode 340 that directly contacts one exposed end of the rod-shaped LED 100 and the first electrode 310, and covers one end of the rod-shaped LED 100 and the first electrode 310; and a second contact electrode 350 that directly contacts the other exposed end of the rod-shaped LED 100 and the second electrode 320, and covers the other end of the rod-shaped LED 100 and the second electrode 320. In some exemplary embodiments, the widths of the first electrode 310 and the second electrode 320, and the first contact electrode 340 and the second contact electrode 350, and / or the areas where the first electrode 310 and the second electrode 320, and the first contact electrode 340 and the second contact electrode 350 overlap with each other, can be varied in various ways. For example, Figure 5The exemplary embodiment shows that each of the first electrode 310 and the second electrode 320 has a wider width than the first contact electrode 340 and the second contact electrode 350, and the opposing (e.g., left / right) sides of the first electrode 310 and the second electrode 320 are exposed outside the first contact electrode 340 and the second contact electrode 350. However, the structure in which the first electrode 310 and the second electrode 320, as well as the first contact electrode 340 and the second contact electrode 350 are arranged can be modified. For example, as... Figure 6 As shown, the first contact electrode 340 and the second contact electrode 350 can cover the first electrode 310 and the second electrode 320 on one side.

[0115] on the other hand, Figure 5 The exemplary embodiment shown illustrates that each of the first contact electrode 340 and the second contact electrode 350 extends toward the direction in which the first sub-electrode portion 310b and the second sub-electrode portion 320b extend, such that a plurality of rod-shaped LEDs 100 disposed between the first electrode 310 and the second electrode 320 are connected to the first electrode 310 and the second electrode 320. That is, according to Figure 5 In an exemplary embodiment, multiple rod-shaped LEDs 100 may each share a first contact electrode 340 and a second contact electrode 350. However, the inventive concept is not limited thereto. For example, in another exemplary embodiment, the first contact electrode 340 and the second contact electrode 350 may be configured to be separately separated at opposite ends of each rod-shaped LED 100.

[0116] In exemplary embodiments of the present invention, contact electrodes 340 and 350 can be implemented as reflective electrodes. For this purpose, contact electrodes 340 and 350 may include at least one reflective metal layer. For example, contact electrodes 340 and 350 may be implemented as reflective electrodes comprising a metal layer containing at least one of Ag and Cu, or as a multilayer comprising at least one of Ti / Al / Ti, ITO / Ag / ITO, and Mo / Al / Mo. However, the structure of the conductive material used to form contact electrodes 340 and 350 is not limited to the exemplary embodiments described above. For example, contact electrodes 340 and 350 can be formed using various conductive materials used to form electrodes, and in particular, can be implemented to have reflective properties.

[0117] In some exemplary embodiments, the metals used to form contact electrodes 340 and 350 may include Ti, Cu, Mo, Al, Au, Cr, TiN, Ag, Pt, Pd, Ni, Sn, Co, Rh, Ir, Fe, Ru, Os, Mn, W, Nb, Ta, Bi, Sb, and Pb; in addition, various metals may be used. Examples of alloys used to form contact electrodes 340 and 350 may include MoTi and AlNiLa; in addition, various alloys may be used. Examples of multilayers used to form contact electrodes 340 and 350 may include Ti / Al / Ti, Ti / Cu, Ti / Au, Mo / Al / Mo, ITO / Ag / ITO, TiN / Ti / Al / Ti, and TiN / Ti / Cu / Ti; in addition, various multilayers may be used.

[0118] Contact electrodes 340 and 350 are formed in the active layer 120 of the rod-shaped LED 100, such that light emitted via opposite ends of the rod-shaped LED 100 is reflected to alter its path. Light reflected from the contact electrodes 340 and 350 can be emitted towards the front (e.g., top or front) of the substrate 301 via the rod-shaped LED 100 and / or the light-transmitting structure 330. In this example, light emitted towards the front of the substrate 301 means that the light... Figure 6 The light reflected from the upper part of the substrate 301 is emitted in a direction intersecting the plane on which the substrate 301 is placed (e.g., including directions perpendicular to the plane on which the substrate 301 is placed and directions inclined at a predetermined angle relative to the plane). For example, when the substrate 301 is disposed on the XY plane, the light reflected from the contact electrodes 340 and 350 can be emitted from the upper part of the substrate 301 in a direction intersecting the XY plane (e.g., in the Z direction or in a direction inclined towards the Z direction).

[0119] The light-transmitting structure 330 can be transparent or translucent, used to transmit light from the rod-shaped LED 100 to the outside, for example, to transmit light in the direction of the light-emitting surface of the light-emitting device. The light-transmitting structure 330 can be disposed between the first electrode 310 and the second electrode 320 to overlap with at least one region of the rod-shaped LED 100. For example, the light-transmitting structure 330 can be configured to overlap at least the central portion of the rod-shaped LED 100, except for the opposite ends of the rod-shaped LED 100 that are provided with reflective contact electrodes 340 and 350, thereby fixing the rod-shaped LED 100 in its arrangement position.

[0120] In some exemplary embodiments, the light-transmitting structure 330 may extend to intersect with a plurality of rod-shaped LEDs 100. For example, at least one light-transmitting structure 330 is provided in each unit light-emitting region 300, and each light-transmitting structure 330 may extend in a direction parallel to the first electrode 310 and the second electrode 320 and between the first electrode 310 and the second electrode 320 to overlap with a plurality of rod-shaped LEDs 100. For example, the light-transmitting structure 330 may extend in a direction parallel to the first sub-electrode portion 310b and the second sub-electrode portion 320b and between pairs of first sub-electrode portions 310b and second sub-electrode portions 320b, thereby intersecting and overlapping with a plurality of rod-shaped LEDs 100 disposed between the first sub-electrode portions 310b and the second sub-electrode portions 320b. For example, the light-transmitting structure 330 may be perpendicular to the length of the rod-shaped LEDs 100. Figure 1 It is set according to the L direction.

[0121] For example, the light-transmitting structure 330 may be rectangular strip-shaped, extending in a direction parallel to the first sub-electrode portion 310b and the second sub-electrode portion 320b and between the paired first sub-electrode portions 310b and 320b, to overlap with a plurality of rod-shaped LEDs 100 disposed between the first sub-electrode portions 310b and 320b. However, in the present exemplary embodiment of the inventive concept, the shape of the light-transmitting structure 330 is not limited to this, and the shape of the light-transmitting structure 330 may be changed in various different ways.

[0122] refer to Figure 6 The light-transmitting structure 330 has a predetermined height H along a direction intersecting the plane (e.g., the XY plane) of the substrate 301 for emitting light, and the height H of the light-transmitting structure 330 can be greater than the height of the rod-shaped LED 100. For example, the light-transmitting structure 330 can be configured to protrude across the rod-shaped LED 100 in the Z direction perpendicular to the plane of the substrate 301. Furthermore, the bottom surface of the light-transmitting structure 330 can contact the substrate 301. Light emitted from the rod-shaped LED 100 passes through the light-transmitting structure 330 towards the front of the substrate 301 (e.g., towards the upper part of the substrate 301, such as...). Figure 6(As shown) emission. Specifically, the light-transmitting structure 330 is provided to cause light reflected from the contact electrodes 340 and 350 and re-entering the rod LED 100 to be emitted in front of the substrate 301 after light is emitted from the rod LED 100. For example, the light-transmitting structure 330 has a higher refractive index than air and may have a lower refractive index than the rod LED 100. In some exemplary embodiments, a reflective layer (not shown) may be further provided on one surface of the substrate 301. For example, one or more reflective layers may be further provided on the bottom surface of the substrate 301 or between the substrate 301 and the light-transmitting structure 330.

[0123] The light-transmitting structure 330 can be implemented as a substantially transparent light-transmitting structure through which light can be transmitted (i.e., having high light transmittance). For example, the light-transmitting structure 330 can be composed of at least one transparent inorganic insulator and / or organic insulator. Examples of inorganic insulators used to form the light-transmitting structure 330 may include silicon oxide (SiO₂). x ), silicon nitride (SiN) x Furthermore, the light-transmitting structure 330 can also be composed of various light-transmitting inorganic insulators. Examples of organic insulators used to form the light-transmitting structure 330 may include silicone resin, etc. In addition, the light-transmitting structure 330 can also be composed of various light-transmitting organic insulators. In some exemplary embodiments, when the light-transmitting structure 330 is made of silicone resin, the light-transmitting structure 330 may include a plurality of scatterers distributed within the silicone resin. For example, the light-transmitting structure 330 may be made of a silicone resin composition containing scatterers, the scatterers comprising at least one of TiO2 and SiO2.

[0124] In the present exemplary embodiment of the inventive concept described above, reflective contact electrodes 340 and 350 are disposed at opposite ends of the rod-shaped LEDs 100. Furthermore, a light-transmitting structure 330 is configured to extend between the first electrode 310 and the second electrode 320 to intersect with the plurality of rod-shaped LEDs 100. According to the exemplary embodiment, light reflected from the opposite ends of the rod-shaped LEDs 100 by the contact electrodes 340 and 350 and re-entering the rod-shaped LEDs 100 can be emitted (or transmitted) towards the front of the substrate 301 through the light-transmitting structure 330. Therefore, even if the rod-shaped LEDs 100 are not uniformly distributed in each unit light-emitting area 300, the light emission uniformity of the unit light-emitting area 300 can be improved.

[0125] For example, such as Figure 7 The unit luminescent region 300 formed as shown in (a) can be as follows Figure 7As shown in (b), light is emitted from the region where the light-transmitting structure 330 is provided. Therefore, when the light-transmitting structure 330 is uniformly disposed in each unit light-emitting region 300, uniform light-emitting characteristics can be achieved regardless of how uniformly (or dispersed) the rod-shaped LEDs 100 are arranged.

[0126] Conversely, in the comparative example light-emitting device that does not include reflective contact electrodes 340 and 350 and / or transmissive light-transmitting structure 330, separate reflective structures may be required to alter the path of light emitted from opposite ends of the rod-shaped LEDs 100, and the light emission of the rod-shaped LEDs 100, dispersed in each unit light-emitting area 300, can be visually identified as point-like emission. Furthermore, in the comparative example light-emitting device, the emission points can be randomly dispersed according to the position of each rod-shaped LED 100. Therefore, when compared to the light-emitting device of the present exemplary embodiment conceived according to the present invention, the comparative example light-emitting device may exhibit non-uniform light emission characteristics.

[0127] Figures 8A to 8E This is a sectional view showing the sequence of a method for manufacturing a light-emitting device according to an exemplary embodiment of the present invention. Figures 8A to 8E The manufacturing method of the light-emitting device according to the exemplary embodiment can be applied to the manufacture of devices based on Figures 5 to 7 The exemplary embodiment of the light-emitting device is shown, but is not limited thereto. On the other hand, Figures 8A to 8E Only a portion of the unit light-emitting area is shown, for example, only one rod-shaped LED is shown within the unit light-emitting area. However, as... Figures 5 to 7 As described in the exemplary embodiment, multiple rod-shaped LEDs can be arranged in each unit light-emitting area. Therefore, the following will describe the situation according to... Figures 8A to 8E The exemplary embodiment of the manufacturing method of the light-emitting device assumes that a plurality of rod-shaped LEDs are provided in each unit light-emitting area.

[0128] refer to Figure 8A The first electrode 310 and the second electrode 320 are disposed (or formed) on the substrate 301 in a manner separate from each other. Specifically, the substrate 301 is first prepared, and then each unit light-emitting region 300 can be defined on the substrate 301. Furthermore, the first electrode 310 and the second electrode 320, which are separate from each other, can be disposed (or formed) in each unit light-emitting region 300. In some exemplary embodiments, a conductive layer is formed over the entire substrate 301, and then the conductive layer is patterned, thereby forming both the first electrode 310 and the second electrode 320. Alternatively, in another exemplary embodiment, different conductive materials can be used to sequentially form the first electrode 310 and the second electrode 320.

[0129] refer to Figure 8B ,like Figures 5 to 7A plurality of rod-shaped LEDs 100 are disposed on a substrate 301 on which a first electrode 310 and a second electrode 320 are provided, and the rod-shaped LEDs 100 are arranged between the first electrode 310 and the second electrode 320. Specifically, the plurality of rod-shaped LEDs 100 can be placed in each unit light-emitting region 300 in which the first electrode 310 and the second electrode 320 are provided. For example, an LED solution containing the plurality of rod-shaped LEDs 100 can be applied or dropped into each unit light-emitting region 300 using an inkjet printing method. In some exemplary embodiments, the LED solution can be ink or can be in a paste state. As a solvent, a solvent-containing photoresist or an organic layer can be used, but is not limited thereto. Furthermore, in some exemplary embodiments, the solvent can be a volatile solvent.

[0130] After the LED solution is applied to each unit light-emitting area 300, or while the LED solution is being applied, a voltage is applied between the first electrode 310 and the second electrode 320 to generate an electric field. Then, rod-shaped LEDs 100, randomly dispersed in the unit light-emitting areas 300, are arranged between the first electrode 310 and the second electrode 320. For example, if a DC or AC voltage is applied between the first electrode 310 and the second electrode 320, the electric field generated between the first electrode 310 and the second electrode 320 causes the rod-shaped LEDs 100 to become bipolar, resulting in self-alignment of the rod-shaped LEDs 100 between the first electrode 310 and the second electrode 320. After the arrangement of the rod-shaped LEDs 100 is completed, the solvent in the LED solution is removed. For example, after the arrangement of the rod-shaped LEDs 100 is completed, the solvent in the LED solution may evaporate and then be removed.

[0131] refer to Figure 8C A light-transmitting insulating layer 330a is disposed (or formed) on a surface of a substrate 301 on which the rod-shaped LEDs 100 are arranged. In some exemplary embodiments, the rod-shaped LEDs 100 are covered by the insulating layer 330a, which may be disposed (or formed) to have a height greater than the height of the arranged rod-shaped LEDs 100. In some exemplary embodiments, the insulating layer 330a is provided to form a light-transmitting structure 330 and may be composed of one or more light-transmitting insulators. For example, the insulating layer 330a may be composed of SiO2. x and SiN x An inorganic insulating layer of at least one of the following, but not limited to this.

[0132] refer to Figure 8D The insulating layer 330a is patterned to form (or create) a light-transmitting structure 330 between the first electrode 310 and the second electrode 320. For example, the insulating layer 330a can be patterned using an optical process employing a mask, such as... Figure 5 As shown, the light-transmitting structure 330 can be configured (or formed) to expose the opposite ends of the rod-shaped LEDs 100 and intersect with the plurality of rod-shaped LEDs 100. For example, the light-transmitting structure 330 can be patterned to extend between the first electrode 310 and the second electrode 320 in a direction overlapping at least one region of the plurality of rod-shaped LEDs 100, particularly in a direction overlapping with and intersecting the central portions of the rod-shaped LEDs 100. In some exemplary embodiments, the light-transmitting structure 330 can be formed to have a height higher than the height of the arranged rod-shaped LEDs 100. Furthermore, in some exemplary embodiments, the light-transmitting structure 330 can allow the rod-shaped LEDs 100 to be fixed in their arrangement position.

[0133] refer to Figure 8E Reflective contact electrodes 340 and 350 are disposed (or formed) at opposite ends of the rod-shaped LED 100. In some exemplary embodiments, the reflective contact electrodes 340 and 350 may be disposed (or formed) to electrically connect opposite ends of the rod-shaped LED 100 to a first electrode 310 and a second electrode 320, respectively. For example, the reflective contact electrodes 340 and 350 may include a first contact electrode 340 disposed at one end of the rod-shaped LED 100 and electrically connecting one end of the rod-shaped LED 100 to the first electrode 310, and a second contact electrode 350 disposed at the other end of the rod-shaped LED 100 and electrically connecting the other end of the rod-shaped LED 100 to the second electrode 320.

[0134] Figure 9 This is a cross-sectional view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention. Figure 9 Show Figure 6 A variation of the exemplary embodiment shown. In Figure 9 In the figures, the same or similar reference numerals correspond to Figure 6 The same elements in the text will be omitted, and their detailed descriptions will be omitted.

[0135] refer to Figure 9 In the light-emitting device of the present exemplary embodiment conceived according to the present invention, the light-transmitting structure 330 may have an inclined side surface 331, the width of which gradually decreases toward the substrate 301. For example, the vertical cross-section of the light-transmitting structure 330 may have an inverted trapezoidal shape. To form the light-transmitting structure 330, for example, in providing Figures 8C to 8D During the process of creating the light-transmitting structure 330 shown, an insulating layer 330a can be patterned between the first electrode 310 and the second electrode 320, such that the insulating layer 330a has an inclined side surface with an inverted conical shape.

[0136] The light-emitting device in the above exemplary embodiments according to the present invention can realize the following: Figures 5 to 7 The exemplary embodiment shown exhibits uniform light emission characteristics and can also increase the amount of light transmitted or emitted toward the front of the substrate 301. That is, in the present exemplary embodiment of the inventive concept, the light-transmitting structure 330 can have various shapes or structures, such that more light is generated from each unit light-emitting area 300.

[0137] Figure 10 This is a cross-sectional view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention. Figure 10 Show Figure 6 A variation of the illustrated embodiment. In Figure 10 In the figures, the same or similar reference numerals correspond to Figure 6 The same elements in the text will be omitted, and their detailed descriptions will be omitted.

[0138] refer to Figure 10 In the light-emitting device of the present exemplary embodiment conceived according to the present invention, the light-transmitting structure 330 has a top surface 332 protruding above the rod-shaped LED 100, and the top surface 332 may be a rough surface in the form of protrusions and depressions. To provide (or form) the light-transmitting structure 330 (e.g., similar to...), Figures 8C to 8D The light-transmitting structure 330 shown may further include the step of providing (or forming) an uneven pattern on the top surface of the insulating layer 330a or the light-transmitting structure 330.

[0139] The light-emitting device according to the present exemplary embodiment of the inventive concept described above can provide, according to Figures 5 to 7 The above-described exemplary embodiments show uniform light emission characteristics and can also increase the roughness of a surface (e.g., the top surface) of the light-transmitting structure 330 through which light can be transmitted or emitted, thereby increasing the amount of light emitted from each unit light-emitting region 300 toward the front of the substrate 301. That is, in the present exemplary embodiments of the inventive concept, the light-transmitting structure 330 can have various shapes or structures to improve the luminous efficiency of light generated from each unit light-emitting region 300.

[0140] Figure 11 This is a cross-sectional view showing a unit light-emitting area of ​​a light-emitting device according to an exemplary embodiment of the present invention. Figure 11 Show Figure 6 A variation of the illustrated embodiment. In Figure 11 In the figures, the same or similar reference numerals correspond to Figure 6 The same elements in the text will be omitted, and their detailed descriptions will be omitted.

[0141] refer to Figure 11In the light-emitting device of the present exemplary embodiment conceived according to the present invention, the light-transmitting structure 330 may have a width that gradually decreases from the lower part near the substrate 301 to the upper part away from the substrate 301 along a first direction (e.g., the Z direction) intersecting the plane (e.g., the XY plane) on which the substrate 301 is placed. Furthermore, in some exemplary embodiments, the light-transmitting structure 330 may have a curved surface. For example, the light-transmitting structure 330 may have a smooth curvature. Additionally, as in the above exemplary embodiments, the light-transmitting structure 330 may extend, for example, in a direction perpendicular to the length (L) direction of the rod-shaped LED 100, to intersect with a plurality of rod-shaped LEDs 100 disposed in the same column.

[0142] In some exemplary embodiments, Figure 11 The light-transmitting structure 330 shown may consist of at least one layer of organic insulator. For example, the light-transmitting structure 330 may be made of silicone resin. Furthermore, in some exemplary embodiments, a plurality of scatterers 333 may be distributed within the light-transmitting structure 330 made of silicone resin. For example, the light-transmitting structure 330 may be made of a silicone resin composition containing scatterers, wherein the scatterers contain at least one of TiO2 and SiO2.

[0143] The light-emitting device according to the present exemplary embodiment of the present invention described above can provide uniform light-emitting characteristics, and the diffuser 333 can be used to increase the amount of light emitted from each unit light-emitting region 300. That is, in the present exemplary embodiment of the present invention, the light-transmitting structure 330 can include various materials to improve the luminous efficiency of light generated from each unit light-emitting region 300.

[0144] Figures 12A to 12D This is a sequential cross-sectional view of a method for manufacturing a light-emitting device according to another exemplary embodiment of the present invention. According to Embodiments 12A to... Figure 12D The manufacturing method of the light-emitting device can be applied, for example, to the manufacture of according to Figure 11 The exemplary embodiment of the light-emitting device is shown, but is not limited thereto. Figures 12A to 12D The diagram shows only one rod-shaped LED disposed in a unit light-emitting area, but as in the exemplary embodiment described above, multiple rod-shaped LEDs can be disposed in each unit light-emitting area. Therefore, the following will describe the situation according to... Figures 12A to 12D The exemplary embodiment of the method for manufacturing a light-emitting device assumes that multiple rod-shaped LEDs are disposed in each unit light-emitting area. Furthermore, in Figures 12A to 12D In the figures, the same or similar reference numerals correspond to Figures 8A to 8E The same elements in the text will be used, and a detailed description of them will be omitted.

[0145] refer to Figures 12A to 12BThe first electrode 310 and the second electrode 320 are disposed (or formed) on the substrate 301 in a manner separate from each other, and a plurality of rod-shaped LEDs 100 are arranged between the first electrode 310 and the second electrode 320. For example, an LED solution is applied to each unit light-emitting region 300 on which the first electrode 310 and the second electrode 320 are disposed, and an electric field is applied to the first electrode 310 and the second electrode 320, thereby arranging the plurality of rod-shaped LEDs 100 between the first electrode 310 and the second electrode 320.

[0146] refer to Figure 12C A light-transmitting structure 330 is disposed (or formed) between the first electrode 310 and the second electrode 320 to overlap with at least one region of the rod-shaped LED 100. In some exemplary embodiments, the step of providing the light-transmitting structure 330 may include applying a liquid organic insulating material between the first electrode 310 and the second electrode 320 to expose the opposite ends of the plurality of rod-shaped LEDs 100 and overlapping the liquid organic insulating material with at least one region (e.g., the central portion) of the rod-shaped LED 100, and applying light and / or heat to the liquid organic insulating material and hardening the liquid organic insulating material to provide (or form) the light-transmitting structure 330.

[0147] In some exemplary embodiments, a plurality of scatterers 333 may be distributed in a liquid organic insulating material applied between the first electrode 310 and the second electrode 320. As described above, the organic insulating material with the scatterers 333 distributed thereon is applied at a height above the rod-shaped LED 100 and then cured, thereby providing (or forming) a light-transmitting structure 330 according to an exemplary embodiment of the present invention.

[0148] refer to Figure 12D Reflective contact electrodes 340 and 350 are disposed (or formed) at opposite ends of the rod-shaped LED 100, thereby electrically connecting the rod-shaped LED 100 between the first electrode 310 and the second electrode 320. For example, the first contact electrode 340 is disposed (or formed) at one end of the rod-shaped LED 100 disposed on the first electrode 310, and the second contact electrode 350 is disposed (or formed) at the other end of the rod-shaped LED 100 disposed on the second electrode 320, so that the opposite ends of the rod-shaped LED 100 can be electrically connected to the first electrode 310 and the second electrode 320, respectively.

[0149] According to an exemplary embodiment of the inventive concept described above, reflective contact electrodes 340 and 350 and a light-transmitting structure 330 are disposed (or formed) in each unit light-emitting region 300 to provide (or form) a light-emitting device. Accordingly, a light-emitting device that emits light uniformly in each unit light-emitting region 300 and a method for manufacturing the light-emitting device can be provided. That is, according to an exemplary embodiment of the inventive concept, a light-emitting device comprising a plurality of rod-shaped LEDs 100 can achieve uniformity in light emission.

[0150] While the technical concept of the present invention has been specifically described with reference to the above embodiments, it should be noted that the exemplary embodiments described above are intended to be illustrative and not restrictive. It will be apparent to those skilled in the art that various modifications can be made without departing from the scope of the present invention.

[0151] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the claims and various obvious modifications and equivalent arrangements.

Claims

1. A light-emitting device, comprising: basal layer; A rod-shaped light-emitting diode is disposed on the substrate layer, the rod-shaped light-emitting diode having a first end and a second end opposite to the first end; A first electrode and a second electrode are disposed on the substrate layer, and the first electrode and the second electrode are electrically connected to the first end and the second end of the rod-shaped light-emitting diode respectively through contact electrodes; as well as A light-transmitting structure is disposed on the rod-shaped light-emitting diode and between the first electrode and the second electrode to overlap with at least one region of the rod-shaped light-emitting diode.

2. The light-emitting device according to claim 1, wherein, The light-transmitting structure includes a scatterer.

3. The light-emitting device according to claim 2, wherein, The scatterer includes at least one of TiO2 and SiO2.

4. The light-emitting device according to claim 3, wherein, The light-transmitting structure also includes silicone resin, and the scatterer is distributed within the silicone resin.

5. The light-emitting device according to claim 1, wherein, Light emitted from the rod-shaped light-emitting diode passes through the light-transmitting structure.

6. The light-emitting device according to claim 1, further comprising: Pixels, disposed on the substrate layer, each of the pixels including a light-emitting region. The rod-shaped light-emitting diode and the light-transmitting structure are disposed in the light-emitting region of each of the pixels.

7. The light-emitting device according to claim 1, wherein, The light-transmitting structure has inclined sides, and The width of the inclined side gradually decreases toward the base layer.

8. The light-emitting device according to claim 1, wherein, The light-transmitting structure includes a top surface. The top surface protrudes above the rod-shaped light-emitting diode, and The top surface is not flat.

9. The light-emitting device according to claim 1, wherein, The light-transmitting structure has a width that gradually decreases from the substrate layer toward the direction away from the substrate layer. The light-transmitting structure also includes curved sides.

10. The light-emitting device according to claim 1, wherein, The first electrode and the second electrode are disposed on the same layer.

11. The light-emitting device according to claim 1, wherein, The first electrode and the second electrode are disposed on the rod-shaped light-emitting diode.

12. The light-emitting device according to claim 1, wherein, Each of the first electrode and the second electrode includes at least one metal selected from Ti, Cu, Mo, Al, Au, Cr, TiN, Ag, Pt, Pd, Ni, Sn, Co, Rh, Ir, Fe, Ru, Os, Mn, W, Nb, Ta, Bi, Sb and Pb, or at least one metal oxide selected from ITO, IZO, AZO, ITZO, ZnO and SnO2.

13. The light-emitting device according to claim 1, wherein the contact electrode further comprises: The first contact electrode partially overlaps with the first electrode in the plan view; as well as The second contact electrode partially overlaps with the second electrode in the plan view, wherein... The first end of the rod-shaped light-emitting diode is disposed between the first electrode and the first contact electrode, and The second end of the rod-shaped light-emitting diode is disposed between the second electrode and the second contact electrode.

14. The light-emitting device according to claim 1, wherein, The rod-shaped light-emitting diode includes: First conductive semiconductor layer; Active layer; The second conductive semiconductor layer; and The electrode layers are arranged sequentially in a direction parallel to the substrate layer.

15. The light-emitting device according to claim 1, wherein the light-transmitting structure contacts the rod-shaped light-emitting diode and exposes the first end and the second end of the rod-shaped light-emitting diode.

16. A light-emitting device, comprising: basal layer; The first electrode and the second electrode are disposed on the substrate layer; A rod-shaped light-emitting diode is disposed on the substrate layer. The rod-shaped light-emitting diode has a first end on the first electrode and a second end on the second electrode opposite to the first end. The first end and the second end are electrically connected to the first electrode and the second electrode respectively through contact electrodes. as well as A light-transmitting structure is disposed on the rod-shaped light-emitting diode and between the first electrode and the second electrode to overlap with at least one region of the rod-shaped light-emitting diode.

17. The light-emitting device according to claim 16, wherein the contact electrode further comprises: The first contact electrode partially overlaps with the first electrode in a plan view and is electrically connected to the first end of the rod-shaped light-emitting diode; as well as The second contact electrode partially overlaps with the second electrode in the plan view and is electrically connected to the second end of the rod-shaped light-emitting diode.

18. The light-emitting device according to claim 17, wherein, The first end of the rod-shaped light-emitting diode is disposed between the first electrode and the first contact electrode, and The second end of the rod-shaped light-emitting diode is disposed between the second electrode and the second contact electrode.

19. The light-emitting device according to claim 17, wherein, The light-transmitting structure is disposed between the first contact electrode and the second contact electrode.

20. The light-emitting device according to claim 16, wherein, The light-transmitting structure includes a scatterer.

21. The light-emitting device according to claim 20, wherein, The scatterer includes at least one of TiO2 and SiO2.

22. The light-emitting device according to claim 21, wherein, The light-transmitting structure also includes silicone resin, and the scatterer is distributed within the silicone resin.

23. The light-emitting device according to claim 16, wherein, The rod-shaped light-emitting diode includes: The first semiconductor layer in the first end; The second semiconductor layer in the second end; and An active layer between the first semiconductor layer and the second semiconductor layer in a direction parallel to the substrate layer.

24. The light-emitting device according to claim 16, further comprising: Pixels, disposed on the substrate layer, each of the pixels including a light-emitting region. The rod-shaped light-emitting diode and the light-transmitting structure are disposed in the light-emitting region of each of the pixels.

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