A mixed pressure step high frequency multilayer blind hole circuit board

Abstract

The application discloses a mixed-pressure step high-frequency multilayer blind-hole circuit board and belongs to the technical field of circuit boards. The mixed-pressure step high-frequency multilayer blind-hole circuit board comprises a circuit board and a protection plate, the protection plate is arranged on the upper side of the circuit board, two quick-release mechanisms arranged in a left-right symmetry mode are arranged in the protection plate, a part of the quick-release mechanism is fixedly connected to the upper surface of the circuit board, and a heat dissipation mechanism is arranged in the protection plate. In the application, the heat dissipation mechanism is arranged, the motor can drive the first gear to rotate when the motor works, the first gear can drive the two second gears to rotate simultaneously, the second gear can drive the fan blades to rotate through the first rotating shaft, the rotation of the fan blades can draw the external air through the multiple air holes on the upper side, the external air is sprayed out through the multiple air holes on the lower side after entering the cavity, the sprayed air flow blows on the circuit board, and the air that absorbs heat can be sprayed out through the multiple flow holes, so that the circuit board can be effectively heat-dissipated.

Description

Technical Field

[0001] This invention belongs to the field of circuit board technology, and particularly relates to a mixed-voltage stepped high-frequency multilayer blind via circuit board. Background Technology

[0002] Printed circuits are generally defined as conductive patterns, including printed lines, printed components, or a combination of both, fabricated on insulating materials according to a predetermined design. Conductive patterns on insulating substrates that provide electrical connections between components are called printed lines. The finished board containing printed circuits or printed lines is thus called a printed circuit board, also known as a printed circuit board or printed circuit board. Circuit boards can be classified according to function as follows: single-sided circuit boards, double-sided circuit boards, multilayer circuit boards, aluminum-based circuit boards, impedance circuit boards, flexible printed circuit boards (FPCs), etc.

[0003] Existing multilayer blind via circuit boards still have significant shortcomings in heat dissipation. They do not have excellent heat dissipation capabilities, and the circuit boards are exposed and cannot be effectively protected. If water seeps into the electrical components, it may directly splash onto the circuit boards, resulting in poor protection and heat dissipation, which can easily cause damage or rapid aging of the circuit boards. Summary of the Invention

[0004] The purpose of this invention is to address the problems that circuit boards themselves lack excellent heat dissipation capabilities and are exposed, making them unable to receive effective protection. If water seeps into the electrical components, it may directly splash onto the circuit board, resulting in poor protection and heat dissipation, which can easily cause damage or rapid aging of the circuit board. Therefore, this invention proposes a mixed-voltage stepped high-frequency multilayer blind via circuit board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A mixed-voltage stepped high-frequency multilayer blind via circuit board includes a circuit board and a protective plate. The protective plate is disposed on the upper side of the circuit board. Two quick-release mechanisms are disposed symmetrically on the left and right sides inside the protective plate. A part of the quick-release mechanism is fixedly connected to the upper surface of the circuit board. A heat dissipation mechanism is disposed inside the protective plate. Heat dissipation acceleration mechanisms are disposed on both the left and right sides of the circuit board. A part of the heat dissipation acceleration mechanism is attached to the upper surface of the circuit board.

[0007] As a further description of the above technical solution:

[0008] The heat dissipation mechanism includes a slot formed on the upper surface of the protective plate, a motor fixedly connected in the slot, a first gear fixedly connected to the output shaft of the motor, and second gears meshing on both the left and right sides of the first gear.

[0009] As a further description of the above technical solution:

[0010] The lower surface of the second gear is fixedly connected to a fan blade via a first rotating shaft. The fan blade is set in a cavity opened inside the protective plate. Multiple air holes are opened on the upper and lower sides of the protective plate corresponding to the cavity. A rectangular frame is fixedly connected to the lower surface of the protective plate. Multiple flow holes are opened on the left and right sides of the rectangular frame.

[0011] As a further description of the above technical solution:

[0012] The quick-release mechanism includes limiting holes on the left and right sides of the upper surface of the protective plate. A second connecting rod is provided in the limiting hole. A first connecting rod is fixedly connected to one side of the second connecting rod. A U-shaped rod is fixedly connected to the upper surface of the two first connecting rods.

[0013] As a further description of the above technical solution:

[0014] The bottom end of the second connecting rod is fixedly connected to a slider. The slider is slidably connected in a cavity opened inside the protective plate. One side of the slider is fixedly connected to one side of the inner wall of the cavity by a spring. A locking block is fixedly connected to the side of the slider away from the spring. The locking block is inserted into a slot opened on one side of the plug. The plug is inserted into a slot opened on the lower surface of the protective plate. The plug is fixedly connected to the upper surface of the circuit board.

[0015] As a further description of the above technical solution:

[0016] The heat dissipation acceleration mechanism includes a support plate fixedly connected to one side of the protective plate. A baffle is fixedly connected to the side of the support plate away from the protective plate. The baffle is U-shaped. Multiple conical covers are fixedly connected to one side of the baffle. Multiple heat dissipation holes are opened on the outer surface of the conical covers.

[0017] As a further description of the above technical solution:

[0018] Both the front and rear sides of one side of the baffle are fixedly connected to support rods, which are inserted into the rod grooves opened on the left side of the support plate. One side of the support plate has a groove, and a threaded column is fixedly connected to one side of the inner wall of the groove. A threaded cap is threadedly connected to the outer surface of the threaded column. Fixed rods are fixedly connected to both the front and rear sides of the threaded cap. A connecting plate is fixedly connected to one end of the fixed rod. A second rotating shaft is fixedly connected to the side of the connecting plate away from the threaded column. The second rotating shaft is sleeved in the second bearing that is engaged inside the baffle. A screw block is fixedly connected to the other end of the second rotating shaft.

[0019] As a further description of the above technical solution:

[0020] The heat dissipation acceleration mechanism also includes a thermal silicone pad attached to the circuit board. Multiple heat-conducting wires are fixedly connected to the upper surface of the thermal silicone pad. The heat-conducting wires penetrate the interior of the protective plate, and one end of each heat-conducting wire is evenly distributed between each two adjacent conical covers.

[0021] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0022] 1. In this invention, a heat dissipation mechanism is provided, wherein when the motor is working, it can drive the first gear to rotate, the first gear can drive two second gears to rotate simultaneously, and the second gears can drive the fan blades to rotate through the first rotating shaft. The rotation of the fan blades can draw in external air through multiple air holes on the upper side. After the external air enters the cavity, it is ejected through multiple air holes on the lower side. The ejected airflow blows onto the circuit board, and the air that has absorbed heat can be ejected through multiple flow holes, which can effectively dissipate heat from the circuit board.

[0023] 2. In this invention, a heat dissipation acceleration mechanism is provided, wherein the heat-absorbing silicone pad can absorb the heat generated by the circuit board and transfer the heat to multiple heat-conducting wires. The airflow ejected from the flow hole can blow into the conical shroud. After entering the conical shroud, the air is evenly ejected through multiple heat dissipation holes. The air ejected from the heat dissipation holes is evenly sprayed onto multiple heat-conducting wires, which can accelerate the dissipation of heat from one end of the heat-conducting wires. The heat-conducting wires can continuously conduct the heat generated by the circuit board, so the circuit board can be continuously cooled, thereby accelerating and improving the heat dissipation effect. By setting threaded columns and screw blocks, controlling the rotation of the screw blocks can pass through the first The two rotating shafts drive the connecting plate to rotate. The connecting plate can drive the threaded cap to rotate through two fixed rods, thereby allowing the threaded column to move and drive the support plate to move. Since the support plate is fixed and cannot move, the baffle can move. The distance between the baffle and the circuit board can be effectively adjusted according to the size of the circuit board installation space to avoid the baffle and the circuit board being installed too tightly together and affecting the heat dissipation effect. By setting the support rod and the rod groove, the support rod can move in the rod groove, so that the baffle will not rotate when the threaded cap is rotated, and can move stably in a straight line along a horizontal trajectory without misalignment with the circuit board.

[0024] 3. In this invention, by setting a quick-release mechanism, when it is necessary to remove the protective plate to inspect the circuit board, the two U-shaped rods are moved closer to each other. The U-shaped rods can drive the slider to move through the first connecting rod and the second connecting rod. The slider drives the locking block to move and disengage from the slot. At this time, the insertion post is no longer fixed, so the insertion post can be taken out from the slot, thereby allowing the protective plate to be removed from the circuit board, which is convenient for staff to inspect the circuit board. By setting a spring, the spring can extend through its own elasticity to push the slider to move. The slider can drive the locking block to be tightly locked into the slot, preventing the locking block from arbitrarily disengaging from the slot and affecting the protection of the circuit board by the protective plate. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a mixed-voltage stepped high-frequency multilayer blind via circuit board proposed in this invention;

[0026] Figure 2 This is a top view schematic diagram of a mixed-voltage stepped high-frequency multilayer blind via circuit board proposed in this invention.

[0027] Figure 3 This is an enlarged structural diagram of A in a mixed-voltage stepped high-frequency multilayer blind via circuit board proposed in this invention;

[0028] Figure 4 This is a top-view cross-sectional view of the heat dissipation acceleration mechanism in a mixed-voltage stepped high-frequency multilayer blind via circuit board proposed in this invention.

[0029] Figure 5 This is an enlarged structural diagram of B in a mixed-voltage stepped high-frequency multilayer blind via circuit board proposed in this invention.

[0030] Legend:

[0031] 1. Circuit board; 2. Protective plate; 3. Quick release mechanism; 31. U-shaped rod; 32. First connecting rod; 33. Second connecting rod; 34. Limiting hole; 35. Spring; 36. Slider; 37. Locking block; 38. Insert post; 4. Heat dissipation mechanism; 41. Motor; 42. First gear; 43. Second gear; 44. First rotating shaft; 45. Air hole; 46. Rectangular frame; 47. Flow hole; 5. Heat dissipation acceleration mechanism; 51. Support plate; 52. Baffle; 53. Heat dissipation hole; 54. Conical cover; 55. Support rod; 56. Threaded post; 57. Fixing rod; 58. Groove; 59. Second rotating shaft; 510. Connecting plate; 511. Tightening block; 512. Thermal silicone pad; 513. Heat-conducting wire. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please see Figure 1-5This invention provides a technical solution: a mixed-voltage stepped high-frequency multilayer blind via circuit board, comprising a circuit board 1 and a protective plate 2. The protective plate 2 is disposed on the upper side of the circuit board 1. Two quick-release mechanisms 3 are symmetrically arranged inside the protective plate 2. A portion of each quick-release mechanism 3 is fixedly connected to the upper surface of the circuit board 1. Each quick-release mechanism 3 includes limiting holes 34 formed on the left and right sides of the upper surface of the protective plate 2. A second connecting rod 33 is disposed within each limiting hole 34. A first connecting rod 32 is fixedly connected to one side of each second connecting rod 33. A U-shaped rod 31 is fixedly connected to the upper surface of the first connecting rod 32, and a slider 36 is fixedly connected to the bottom end of the second connecting rod 33. The slider 36 is slidably connected in a sliding cavity opened inside the protective plate 2. One side of the slider 36 is fixedly connected to one side of the inner wall of the sliding cavity through a spring 35. A locking block 37 is fixedly connected to the side of the slider 36 away from the spring 35. The locking block 37 is inserted into a slot opened on one side of the plug 38. The plug 38 is inserted into a slot opened on the lower surface of the protective plate 2. The plug 38 is fixedly connected to the upper surface of the circuit board 1.

[0034] The specific implementation method is as follows: By setting up a quick-release mechanism 3, when it is necessary to remove the protective plate 2 to inspect the circuit board 1, the two U-shaped rods 31 are moved closer to each other. The U-shaped rods 31 can drive the slider 36 to move through the first connecting rod 32 and the second connecting rod 33. The slider 36 drives the locking block 37 to move and disengage from the slot. At this time, the insertion post 38 is no longer fixed, so the insertion post 38 can be taken out from the post slot, thereby allowing the protective plate 2 to be removed from the circuit board 1, which is convenient for the staff to inspect the circuit board 1. By setting up a spring 35, the spring 35 can extend through its own elasticity to push the slider 36 to move. The slider 36 can drive the locking block 37 to be tightly locked into the slot, preventing the locking block 37 from arbitrarily disengaging from the slot and affecting the protection of the circuit board 1 by the protective plate 2.

[0035] The protective plate 2 is provided with a heat dissipation mechanism 4. The heat dissipation mechanism 4 includes a slot opened on the upper surface of the protective plate 2. A motor 41 is fixedly connected in the slot. A first gear 42 is fixedly connected to the output shaft of the motor 41. A second gear 43 meshes with both the left and right sides of the first gear 42. A fan blade is fixedly connected to the lower surface of the second gear 43 through a first rotating shaft 44. The fan blade is set in a cavity opened inside the protective plate 2. Multiple air holes 45 are opened on both the upper and lower sides of the protective plate 2 corresponding to the cavity. A rectangular frame 46 is fixedly connected to the lower surface of the protective plate 2. Multiple flow holes 47 are opened on both the left and right sides of the rectangular frame 46.

[0036] The specific implementation method is as follows: by setting up a heat dissipation mechanism 4, the motor 41 can drive the first gear 42 to rotate when it is working. The first gear 42 can drive two second gears 43 to rotate simultaneously. The second gears 43 can drive the fan blades to rotate through the first rotating shaft 44. The rotation of the fan blades can draw in external air through multiple air holes 45 on the upper side. After the external air enters the cavity, it is ejected through multiple air holes 45 on the lower side. The ejected airflow blows onto the circuit board 1, and the air that has absorbed heat can be ejected through multiple flow holes 47, which can effectively dissipate heat from the circuit board 1.

[0037] Heat dissipation acceleration mechanisms 5 are provided on both the left and right sides of the circuit board 1. A portion of the heat dissipation acceleration mechanism 5 is attached to the upper surface of the circuit board 1. The heat dissipation acceleration mechanism 5 includes a support plate 51 fixedly connected to one side of the protective plate 2. A baffle 52 is fixedly connected to the side of the support plate 51 away from the protective plate 2. The baffle 52 is U-shaped. Multiple conical covers 54 are fixedly connected to one side of the baffle 52. Multiple heat dissipation holes 53 are opened on the outer surface of the conical covers 54. Support rods 55 are fixedly connected to both the front and rear sides of one side of the baffle 52. The support rods 55 are inserted into the rod groove opened on the left side of the support plate 51. A groove 58 is opened on one side of the support plate 51. A threaded post 56 is fixedly connected to one side of the inner wall of the groove 58. The outer surface of the threaded column 56 is threaded with a threaded cap. The front and rear sides of the threaded cap are fixedly connected with a fixing rod 57. One end of the fixing rod 57 is fixedly connected with a connecting plate 510. The side of the connecting plate 510 away from the threaded column 56 is fixedly connected with a second rotating shaft 59. The second rotating shaft 59 is sleeved in the second bearing that is snapped in the baffle 52. The other end of the second rotating shaft 59 is fixedly connected with a screw block 511. The heat dissipation acceleration mechanism 5 also includes a thermal silicone pad 512 attached to the circuit board 1. The upper surface of the thermal silicone pad 512 is fixedly connected with a plurality of heat-conducting wires 513. The heat-conducting wires 513 penetrate the interior of the protective plate 2. One end of the plurality of heat-conducting wires 513 is evenly distributed between each two adjacent conical covers 54.

[0038] The specific implementation method is as follows: By setting a heat dissipation acceleration mechanism 5, the heat-absorbing silicone pad 512 can absorb the heat generated by the circuit board 1, and the heat can be transferred to multiple heat-conducting wires 513. The airflow ejected from the flow hole 47 can blow into the conical cover 54. After the air enters the conical cover 54, it is evenly sprayed out through multiple heat dissipation holes 53. The air ejected from the heat dissipation holes 53 is evenly sprayed onto the multiple heat-conducting wires 513, which can accelerate the dissipation of heat from one end of the heat-conducting wires 513. The heat-conducting wires 513 can continuously conduct the heat generated by the circuit board 1, so the circuit board 1 can be continuously cooled, thereby accelerating and improving the heat dissipation effect. By setting a threaded post 56 and a screw block 511, controlling the rotation of the screw block 511 can... The connecting plate 510 is rotated by the second rotating shaft 59. The connecting plate 510 can rotate the threaded cap through the two fixed rods 57, so that the threaded post 56 can move and drive the support plate 51 to move. The support plate 51 is fixed and cannot move, so the baffle 52 can move. The distance between the baffle 52 and the circuit board 1 can be effectively adjusted according to the size of the installation space of the circuit board 1, so as to avoid the baffle 52 and the circuit board 1 being installed too tightly and affecting the heat dissipation effect. By setting the support rod 55 and the rod groove, the support rod 55 can move in the rod groove, so that the baffle 52 will not rotate when the threaded cap is rotated, and can move stably in a straight line along the horizontal trajectory, without misalignment with the circuit board 1.

[0039] Working principle: During use, the motor 41 drives the first gear 42 to rotate, which in turn drives two second gears 43 to rotate simultaneously. The second gears 43 drive the fan blades to rotate via the first shaft 44. The rotating fan blades draw in external air through multiple air holes 45 on the upper side. After entering the cavity, the external air is ejected through multiple air holes 45 on the lower side. The ejected airflow blows onto the circuit board 1, while the heat-absorbing air is ejected through multiple flow holes 47, effectively dissipating heat from the circuit board 1. The heat-absorbing silicone pad 512 absorbs the heat generated by the circuit board 1, and the heat can be transferred to multiple heat-conducting wires 513. The airflow ejected from the flow holes 47 blows into the conical cover 54, where air enters and is then... Multiple heat dissipation holes 53 spray air evenly onto multiple heat-conducting wires 513, which can accelerate the dissipation of heat from one end of the heat-conducting wires 513. The heat-conducting wires 513 can continuously conduct the heat generated by the circuit board 1, so the circuit board 1 can be continuously cooled, thereby accelerating the improvement of the heat dissipation effect. When the protective plate 2 needs to be removed to repair the circuit board 1, the two U-shaped rods 31 are moved closer to each other. The U-shaped rods 31 can drive the slider 36 to move through the first connecting rod 32 and the second connecting rod 33. The slider 36 drives the locking block 37 to move out of the slot. At this time, the insertion post 38 is no longer fixed, so the insertion post 38 can be taken out from the slot, thereby removing the protective plate 2 from the circuit board 1, which is convenient for the staff to repair the circuit board 1.

[0040] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A mixed-voltage stepped high-frequency multilayer blind via circuit board, comprising a circuit board (1) and a protective plate (2), characterized in that, The protective plate (2) is set on the upper side of the circuit board (1). Two quick-release mechanisms (3) are set inside the protective plate (2) and are arranged symmetrically on the left and right. A part of the quick-release mechanism (3) is fixedly connected to the upper surface of the circuit board (1). A heat dissipation mechanism (4) is set inside the protective plate (2). Heat dissipation acceleration mechanism (5) is set on both the left and right sides of the circuit board (1). A part of the heat dissipation acceleration mechanism (5) is attached to the upper surface of the circuit board (1). The heat dissipation mechanism (4) includes a slot on the upper surface of the protective plate (2), a motor (41) is fixedly connected in the slot, a first gear (42) is fixedly connected on the output shaft of the motor (41), a second gear (43) meshes on both the left and right sides of the first gear (42), a fan blade is fixedly connected to the lower surface of the second gear (43) through a first rotating shaft (44), the fan blade is set in a cavity opened inside the protective plate (2), a plurality of air holes (45) are opened on the upper and lower sides of the protective plate (2) corresponding to the cavity, and a rectangular frame (46) is fixedly connected to the lower surface of the protective plate (2), and a plurality of flow holes (47) are opened on both the left and right sides of the rectangular frame (46). The quick-release mechanism (3) includes limiting holes (34) on the left and right sides of the upper surface of the protective plate (2). A second connecting rod (33) is provided in the limiting holes (34). A first connecting rod (32) is fixedly connected to one side of the second connecting rod (33). A U-shaped rod (31) is fixedly connected to the upper surface of the two first connecting rods (32). A slider (36) is fixedly connected to the bottom end of the second connecting rod (33). The slider (36) is slidably connected in the sliding cavity opened inside the protective plate (2). One side of the slider (36) is fixedly connected to one side of the inner wall of the sliding cavity through a spring (35). A locking block (37) is fixedly connected to the side of the slider (36) away from the spring (35). The locking block (37) is inserted into the slot opened on one side of the plug (38). The plug (38) is inserted into the slot opened on the lower surface of the protective plate (2). The plug (38) is fixedly connected to the upper surface of the circuit board (1). The heat dissipation acceleration mechanism (5) includes a support plate (51) fixedly connected to one side of the protective plate (2). A baffle (52) is fixedly connected to the side of the support plate (51) away from the protective plate (2). The baffle (52) is U-shaped. Multiple conical covers (54) are fixedly connected to one side of the baffle (52). Multiple heat dissipation holes (53) are opened on the outer surface of the conical covers (54). Support rods (55) are fixedly connected to both the front and rear sides of one side of the baffle (52). The support rods (55) are inserted into the rod groove opened on the left side of the support plate (51). A groove (58) is opened on one side of the support plate (51). A threaded post (56) is fixedly connected to one side of the inner wall of the groove (58). A threaded cap is threadedly connected to the outer surface of the threaded post (56). The front and rear sides are fixedly connected with a fixing rod (57). One end of the fixing rod (57) is fixedly connected with a connecting plate (510). The side of the connecting plate (510) away from the threaded column (56) is fixedly connected with a second rotating shaft (59). The second rotating shaft (59) is sleeved in the second bearing that is snapped in the baffle (52). The other end of the second rotating shaft (59) is fixedly connected with a screw block (511). The heat dissipation acceleration mechanism (5) also includes a heat-conducting silicone pad (512) attached to the circuit board (1). Multiple heat-conducting wires (513) are fixedly connected to the upper surface of the heat-conducting silicone pad (512). The heat-conducting wires (513) penetrate the interior of the protective plate (2). One end of the multiple heat-conducting wires (513) is evenly distributed between each two adjacent conical covers (54).

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