A small device manual flip chip mounting mold

Abstract

The application provides a small device manual flip chip mounting mold, which comprises a positioning plate, a demolding plate, a positioning column, a fixing hole, a positioning hole, a clamping groove and an auxiliary fixing hole. The positioning plate and the positioning hole are matched with each other, the position of the positioning hole is pushed, the positioning plate and the positioning column are horizontally separated from the demolding plate, the positioning column and the positioning plate are matched with each other, the positioning plate is pulled, the positioning column and the hole on the demolding plate are matched with each other and slide, the positioning plate and the demolding plate are close to or away from each other, the demolding plate and the positioning column are matched with each other, the device is hung on the positioning column, the device can be limited by the demolding plate and separated from the positioning column during demolding, and the device cannot be deviated, when non-standard devices or devices with small intervals are required to be mounted, corresponding molds are processed according to the diameters and thicknesses of the devices, time, labor and cost are saved compared with the large chip mounter which is newly manufactured according to the requirements, and the application has the characteristics of simple structure, low processing cost, time saving and labor saving.

Description

Technical Field

[0001] This application relates to the field of mold manufacturing, and in particular to a manual flip-mount mold for small parts. Background Technology

[0002] A pick-and-place machine is an automated device specifically designed for the electronic components industry. It is mainly used for the placement of various loose electronic components. It is a device that accurately places surface mount components onto PCB pads by moving the placement head. It is divided into manual and fully automatic types. Flip-chip placement molds are auxiliary molds used to position the components, flip-mount the product onto the components, and then assist the components in demolding.

[0003] In existing technologies, normal component placement involves placing the product at the bottom and attaching the component from top to bottom. Because the outer surface of the component must be free of any defects (scratches, defects, deformation, burrs, etc.), the positioning fixture and component separation adhesive cannot guarantee that human error will not lift or misalign the component from the product. Furthermore, when faced with higher and more detailed placement requirements, existing pick-and-place machines cannot meet the positioning space and processing needs required for placement.

[0004] With the diversification and increasingly rapid pace of semiconductor packaging, companies generally face the challenge that existing equipment cannot meet the demands of new products and processes. When non-standard components need to be mounted, traditional pick-and-place machines lack suitable component pick-and-place heads and feeding mechanisms. Researching new equipment or purchasing automated production lines that meet the requirements is both time-consuming and costly. Therefore, it is necessary to propose a manual flip-chip mounting mold for small components to solve the above problems. Summary of the Invention

[0005] The purpose of this application is to provide a manual flip-chip mounting mold for small components to solve the problem that existing pick-and-place machines cannot meet the requirements for mounting non-standard or small-spaced components.

[0006] This application provides a manual flip-mount mold for small components, including: a positioning plate, a release plate, a positioning post, a fixing hole, a positioning hole, a clamping groove, and an auxiliary fixing hole.

[0007] The positioning plate is located below the template. The positioning post is welded to the positioning plate. The positioning plate has four fixing holes, which are located at the corners of the four edges of the positioning plate. The positioning plate also has two positioning holes, which are located at the midpoints of the left and right edges of the positioning plate. The positioning plate has two clamping grooves, which are located at the middle of the upper and lower edges of the positioning plate. There are five auxiliary fixing holes, which are located inside the positioning holes.

[0008] Furthermore, the template is provided with a number of holes, the number of which is the same as the number of positioning posts.

[0009] Furthermore, the diameter of the hole is 0.2 mm larger than the diameter of the positioning post, the groove and the positioning post slide together, and the template can be close to or away from the positioning plate.

[0010] Furthermore, the height of the positioning post is greater than the thickness of the template.

[0011] Furthermore, the difference between the height of the positioning post and the thickness of the template should be less than 1 mm or more than the height of the device.

[0012] Furthermore, the fixing hole and the auxiliary fixing hole are configured as holes that penetrate the positioning plate, and the holes are threaded.

[0013] Furthermore, both the positioning column and the demolding template are made of stainless steel.

[0014] Furthermore, the positioning plate is made of aluminum alloy.

[0015] Furthermore, the spacing between the positioning post and the hole is consistent with the spacing of the required mounting device.

[0016] This application provides a manual flip-chip mounting mold for small components, comprising: a positioning plate, a release plate, positioning posts, fixing holes, positioning holes, clamping grooves, and auxiliary fixing holes. The positioning plate and positioning holes cooperate to push the positioning holes, causing the positioning plate and positioning posts to move horizontally away from the release plate. The positioning posts cooperate with the positioning plate; when the positioning plate is pulled, it causes the positioning posts to slide in conjunction with the holes on the release plate, bringing the positioning plate closer to or away from the release plate. The release plate and positioning posts cooperate to hang the components on the positioning posts, allowing the components to be positioned by the release plate and move away from the positioning posts during demolding without being misaligned. When mounting non-standard components or components with extremely small spacing, processing the corresponding mold according to the component diameter and thickness is more cost-effective than remaking a large pick-and-place machine to meet the requirements. This application features a simple structure and low processing cost. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A side view of a manual flip-chip mounting mold for small components provided in an embodiment of this application;

[0019] Figure 2A front view of a manual flip-chip mounting mold for small components provided in an embodiment of this application;

[0020] Figure 3 A cross-sectional view of the connection between the fixed demolding template and the positioning plate when demolding is completed in a manual flip-mount mold for small components provided in this application embodiment;

[0021] Illustration: 1-Positioning plate; 2-Removal template; 3-Positioning post; 4-Fixing hole; 5-Positioning hole; 6-Clamping groove; 7-Auxiliary fixing hole; 8-Hole; 9-Component. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application. To facilitate the explanation of the technical solutions of the application, some concepts involved in this application will be explained first below.

[0023] In existing technologies, normal component placement involves placing the product at the bottom and attaching the component from top to bottom. Because the outer surface of the component must be free of any defects (scratches, defects, deformation, burrs, etc.), the positioning fixture and component separation adhesive cannot guarantee that human error will not lift or misalign the component from the product. Furthermore, when faced with higher and more detailed placement requirements, existing pick-and-place machines cannot meet the positioning space and processing needs required for placement.

[0024] To address the aforementioned problems, embodiments of this application provide a manual flip-chip mounting mold for small components. For example... Figures 1 to 3 As shown in the figure, a manual flip-mount mold for small components according to an embodiment of this application includes: a positioning plate 1, a stripping template 2, a positioning post 3, a fixing hole 4, a positioning hole 5, a clamping groove 6, and an auxiliary fixing hole 7.

[0025] The positioning plate 1 is located below the demolding template 2. The positioning plate 1 is made of aluminum alloy, and the demolding template 2 is made of stainless steel.

[0026] The positioning post 3 is welded to the positioning plate 1. Since both the template 2 and the positioning post 3 are in frequent contact with the device 9, the positioning post 3 and the template 2 are made of stainless steel to prevent iron products from remaining on the positioning post.

[0027] The positioning plate 1 has four fixing holes, which are located at the corners of the four edges of the positioning plate. The function of the four fixing holes 1 is to fix the positioning plate 1 to a screw on a vertical plane. The positioning plate 1 also has two positioning holes 5, which are located at the midpoints of the left and right edges of the positioning plate. The purpose of the positioning holes 5 is to adjust the position of the positioning holes 5 when the positioning plate 1 is pushed away from the release template 2, so as to ensure that the positioning plate 1 moves on a horizontal line and does not fall to the left or right or up or down during the movement, thus avoiding damage to the device.

[0028] Two clamping grooves 6 are machined on the positioning plate 1, respectively located in the middle of the upper and lower edges of the positioning plate, to facilitate the removal of the mold. There are five auxiliary fixing holes 7, which are located inside the positioning holes 5. The auxiliary fixing holes 7 have a similar function to the fixing holes. According to the fixing point of the fixing end, the mold can be fixed by choosing the fixing holes or the auxiliary fixing holes.

[0029] Specifically, the template 1 is provided with a plurality of holes 8, the number of holes 8 being the same as the number of positioning posts 3, so that the positioning posts 3 can pass smoothly through the holes 8 and form a sliding connection.

[0030] Specifically, the diameter of the hole is 0.2 mm larger than the diameter of the positioning post, thereby preventing the positioning post 3 from getting stuck when passing through the hole 8. The hole 8 and the positioning post 3 slide together, and the positioning plate 1 drives the positioning post 3 to slide in the hole 8. The template 2 can be close to or away from the positioning plate 1.

[0031] Specifically, the height of the positioning post 3 is greater than the thickness of the template 2, so that when the positioning plate 1 is close to the template 2, the positioning post can pass through the hole 8, allowing the device to hang on the positioning post without falling off.

[0032] Specifically, the difference between the height of the positioning post 3 and the thickness of the template 2 should be more than 1mm less than the height of the device 9. The difference between the height of the positioning post 3 and the thickness of the template 2 is the length of the positioning post 3 that extends through the hole 8. This length is less than the height of the device 9. In this way, when the device 9 is flipped and mounted, the device 9 will be connected and fixed to the product, and the positioning post 3 will not come into contact with the product.

[0033] Specifically, the fixing hole 4 and the auxiliary fixing hole 7 are configured as holes that pass through the positioning plate 1. The fixing hole 4 and the auxiliary fixing hole 7 are threaded. This design allows the fixing hole 4 to be fixed to the nut at the required position and increases the frictional resistance during demolding, making demolding smoother.

[0034] The following is a method for using a manual flip-mount mold for small components: When processing is required, the mold is customized according to the required spacing, diameter, and height of the components 9. The spacing between the positioning pins 3 and the holes 8 must be consistent with the required spacing. The difference between the height of the positioning pins 3 and the thickness of the release template is less than 1mm more than the height of the component 9 to be mounted. When using the mold, the operator holds the clamping groove 5 and places the mold vertically. The positioning pins 3 are passed through the holes 8, so that the positioning plate 1 is close to the release template 2. The mold is connected to the external screw through the fixing holes 4. The product is flip-mounted onto the positioning pins 3, and a gap greater than the length of the positioning pin is left between the positioning plate 1 and the connection point to allow sufficient pulling space during demolding. After fixing, the positioning plate 1 is pushed according to the position of the positioning holes 5. Through the limiting of the release template 2, the positioning pins 3 are moved away from the component 9. When the cylindrical surface of the positioning pins 3 is lower than the release template, the positioning plate and the release template are clamped and removed from the component and product together. The positioning plate and positioning holes work together to push the positioning holes, causing the positioning plate and positioning posts to move horizontally away from the demolding template. The positioning posts and positioning plate work together to pull the positioning plate, causing the positioning posts to slide against the holes on the demolding template, bringing the positioning plate closer to or away from the template. The demolding template and positioning posts work together to hang the components on the positioning posts, allowing them to pass through the template's limits and leave the positioning posts during demolding without being misaligned. When mounting non-standard components or components with extremely small spacing, a corresponding mold is fabricated based on the component diameter and thickness. This mold has only three main structures, saving time, labor, and money compared to the existing technology that requires the fabrication of large pick-and-place machines to meet specific requirements. The small component manual flip-chip placement mold provided in this application features a simple structure, low processing cost, and saves time and labor.

[0035] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A manual flip-mount mold for small components, characterized in that, include: Positioning plate (1), template (2), positioning post (3), fixing hole (4), positioning hole (5), clamping groove (6), auxiliary fixing hole (7); The positioning plate (1) is located below the demolding template (2), the positioning column (3) is welded to the positioning plate (1), the positioning plate (1) has four fixing holes (4) respectively located at the corners of the four edges of the positioning plate (1), the positioning plate (1) has two positioning holes (5) respectively located at the midpoints of the left and right edges of the positioning plate (1), the positioning plate (1) has two clamping grooves (6) respectively located at the middle part of the upper and lower edges of the positioning plate (1), and there are five auxiliary fixing holes (7) respectively located inside the two positioning holes (5); The template (2) is provided with a number of holes (8), and the number of holes (8) is the same as the number of positioning posts (3); The diameter of the hole (8) is 0.2 mm larger than the diameter of the positioning post (3). The hole (8) and the positioning post (3) slide together to make the template (2) close to or away from the positioning plate (1). The height of the positioning post (3) is greater than the thickness of the template (2); The difference between the height of the positioning post (3) and the thickness of the template (2) is more than 1 mm less than the height of the device (9); The fixing hole (4) and the auxiliary fixing hole (7) are configured to penetrate the positioning plate (1), and the fixing hole (4) and the auxiliary fixing hole (7) are threaded. When using the mold, the operator holds the clamping groove (6) part, places the mold vertically, passes the positioning column (3) through the hole (8), and makes the positioning plate (1) close to the demolding template (2). The mold is connected to the external screw through the fixing hole (4). The device (9) is hung on the positioning column (3), and the positioning plate (1) and the connection are left with a gap greater than the length of the positioning column (3) so that there is enough pulling space when demolding. After fixing, push the positioning plate (1) according to the position of the positioning hole (5). Through the limit of the demolding template (2), the positioning column (3) is moved away from the device (9). When the cylindrical surface of the positioning column (3) is lower than the demolding template (2), the positioning plate (1) and the demolding template (2) are clamped and removed from the device (9) and the product together.

2. The manual flip-mount mold for small components according to claim 1, characterized in that, Both the positioning column (3) and the template (2) are made of stainless steel.

3. The manual flip-mount mold for small components according to claim 1, characterized in that, The positioning plate (1) is made of aluminum alloy.

4. The manual flip-mount mold for small components according to claim 1, characterized in that, The spacing between the positioning post (3) and the hole (8) is consistent with the spacing of the required mounting device.

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