Integrated ion wind heat dissipation device

Abstract

Disclosed is an integrated ion wind heat dissipation device, which comprises a cylindrical heat sink and an ion wind generator. The cylindrical heat sink comprises heat dissipation fins and a circular base, and a heat source is located at the center of the base. The ion wind generator comprises a wire electrode and a non-parallel plate electrode, wherein the wire electrode is a metal wire fixed between an insulating disc and the top of the base, and the non-parallel plate electrode is formed by the heat dissipation fins. In the device, the ion wind generator generates ion wind to form forced convection on the surface of the heat sink, thereby promoting the cooling of the heat source. The cylindrical heat sink and the circular heat source are matched in shape, which is conducive to heat dissipation; the non-parallel layout of the heat dissipation fins can form a tapered channel, thereby accelerating the ion wind and improving the forced convection heat exchange performance; the heat dissipation fins can not only be used for heat dissipation, but also be used as the plate electrode of the ion wind generator, and the device realizes the integration of the heat sink and the ion wind generator, which is not only simple and compact in structure, but also good in heat dissipation effect.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology, specifically an integrated ion wind heat dissipation device. Background Technology

[0002] With the increasing heat flux density of electronic devices, some natural convection cooling methods are no longer sufficient to meet the heat dissipation requirements. If heat cannot be dissipated in time, it will affect the lifespan and operating efficiency of electronic devices. When using mechanical fans for forced convection cooling, the size of the fan and heat sink is constantly increasing to meet the cooling requirements, resulting in an excessively large overall cooling device. Mechanical fan cooling also has the following drawbacks: First, it generates noise, including wind noise from the fan driving the airflow and friction and vibration noise from the rotating motor rotor that drives the fan. This noise gradually increases with the duration of operation; second, it reduces cooling performance. Friction and wear of moving parts in the mechanical device reduce the performance of the heat sink, leading to a worse user experience; third, it consumes a lot of energy. Mechanical cooling is driven by a motor, and the power consumption is still quite high, especially at high speeds. Therefore, to overcome the shortcomings of existing mechanical cooling in high-power electronic devices, it is necessary to invent a new cooling device.

[0003] Ion wind technology based on corona discharge has advantages such as low noise, low power consumption, small size, and integrability. Its working principle is that under the action of a strong electric field, the air around the corona electrode is ionized into charged particles. The charged particles move towards the ground electrode under the action of the electric field and collide with neutral molecules during the movement, generating the transfer and transmission of charge and kinetic energy, which produces strong disturbance to the flow of the surrounding fluid, thus forming macroscopic gas movement, i.e., ion wind.

[0004] There are many different implementation schemes for heat dissipation using ion wind technology, but most of them use ion wind as an external fan to force convection heat exchange on the heat source or heat sink. It is an additional structure, which increases the size of the heat dissipation device, and the compactness and integration are not high. Moreover, corresponding design is required during installation and use, which may change the internal structure layout of the original electronic equipment.

[0005] The information disclosed in the background section is only intended to enhance the understanding of the background of the present invention, and therefore may contain information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] To address the problems existing in the prior art, this invention proposes an integrated ion wind heat dissipation device that integrates an ion wind generator for a line-non-parallel plate electrode with a cylindrical heat sink. This compact integrated ion wind heat dissipation device achieves efficient heat dissipation for high-power electronic devices by using ion wind to force convection heat transfer to the heat sink fins.

[0007] The objective of this invention is achieved through the following technical solution: an integrated ion wind heat dissipation device includes,

[0008] The substrate has a centrosymmetric structure, and the heat source is placed on the central axis of the substrate;

[0009] Multiple heat dissipation fins are arranged radially on the base with the central axis as the center. The gap between two adjacent heat dissipation fins gradually decreases in the radial direction extending toward the central axis and the gap is greater than zero.

[0010] An insulating disk, supported on the top of multiple heat dissipation fins, with an embedded conductive ring;

[0011] Multiple wire electrodes are erected between adjacent heat dissipation fins. The bottom end of each wire electrode is mounted on a substrate via an insulating post, and the top end is mounted on an insulating disk via a conductive post. The multiple wire electrodes are electrically connected through the conductive ring. An ion wind is formed between the wire electrodes and the heat dissipation fins. The ion wind impacts the heat dissipation fins and the substrate along the gap to dissipate heat from the heat source.

[0012] In the integrated ion wind heat dissipation device, the substrate, two adjacent heat dissipation fins and the insulating disk form a fan-shaped flow channel, which includes a flow channel outlet near the central axis and a flow channel inlet relative to the flow channel outlet.

[0013] In the integrated ion wind heat dissipation device, the included angle θ between adjacent heat dissipation fins is used as the included angle of the flow channel.

[0014] In the integrated ion wind heat dissipation device, the flow channel angle is 10° to 36°.

[0015] In the integrated ion wind heat dissipation device, the distance from the outlet of the flow channel to the central axis is 15mm, and the distance from the inlet of the flow channel to the central axis is 95mm.

[0016] In the integrated ion wind heat dissipation device, the substrate is a circular substrate, the insulating disk is a hollow annular structure, and the integrated ion wind heat dissipation device is a cylindrical structure.

[0017] In the integrated ion wind heat dissipation device, the heat source is connected to the substrate through a thermal interface material, which includes thermally conductive silicone grease or thermally conductive pads.

[0018] In the integrated ion wind heat dissipation device, the line electrodes are located on the center line between adjacent heat dissipation fins and perpendicular to the base, and their number is between 10 and 36 and is an integer divisible by 360.

[0019] In the integrated ion wind heat dissipation device, the diameter of the wire electrode is 0.1 to 0.4 mm, and the length of the wire electrode is the same as the height of the heat dissipation fins.

[0020] In the integrated ion wind heat dissipation device, the thickness of the heat dissipation fins is no more than 1 mm.

[0021] Compared with the prior art, the present invention has the following advantages: the integrated ion wind heat dissipation device is small in size and easy to install and disassemble. The present invention integrates the heat sink fins and the ion wind generator plate electrode into one, thereby minimizing the size of the device. The overall size is small and the structure is simple and compact. The ion wind device used in this device has no mechanical moving parts during operation, does not generate obvious noise, and has good working stability. By reasonably setting the working voltage, it can flexibly adapt to the heat dissipation needs of electronic devices with power not exceeding 200W under different working conditions for safe and reliable operation. Attached Figure Description

[0022] Various other advantages and benefits of the present invention will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. Furthermore, the same reference numerals denote the same parts throughout the drawings.

[0023] In the attached diagram:

[0024] Appendix Figures 1(a) to 1(b) Figure 1(a) shows the arrangement of the electrodes, and Figure 1(b) shows the arrangement of the heat source.

[0025] Appendix Figures 2(a) to 2(b) Figure 2(a) shows the position and related dimensions of the electrodes in the ion wind generating unit of a single sector during the numerical simulation of the integrated ion wind heat dissipation device, and Figure 2(b) shows the three-dimensional ion wind generating unit of a single sector.

[0026] Appendix Figure 3 The simulation results show the vector distribution of electric potential and electric field intensity caused by the change in the included angle of non-parallel plate electrodes in the flow channel of the integrated ion wind heat dissipation device, as well as the corresponding changes in the flow field streamlines.

[0027] Appendix Figure 4The simulation results show the vector distribution of electric potential and electric field intensity caused by the change in the relative position of the linear electrodes in the flow channel of the integrated ion wind heat dissipation device, as well as the corresponding streamline changes in the flow field.

[0028] Appendix Figures 5(a) to 5(b) The temperature field distribution of the heat source surface before and after structural optimization of the integrated ion wind heat dissipation device is compared. Figure 5(a) shows the simulation results before structural optimization, and Figure 5(b) shows the simulation results after structural optimization.

[0029] The present invention will be further explained below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0030] The following will refer to the appendix. Figures 1(a) to 5(b) Specific embodiments of the invention will be described in more detail below. While specific embodiments of the invention are shown in the accompanying drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey the scope of the invention to those skilled in the art.

[0031] It should be noted that certain terms are used in the specification and claims to refer to specific components. Those skilled in the art will understand that different terms may be used to refer to the same component. This specification and claims do not distinguish components based on differences in terminology, but rather on differences in function. The terms "comprising" or "including" used throughout the specification and claims are open-ended and should be interpreted as "comprising but not limited to." The following descriptions are preferred embodiments for carrying out the invention; however, these descriptions are for the purpose of understanding the general principles of the specification and are not intended to limit the scope of the invention. The scope of protection of this invention is determined by the appended claims.

[0032] To facilitate understanding of the embodiments of the present invention, further explanations and descriptions will be provided below with reference to the accompanying drawings and specific embodiments. The accompanying drawings do not constitute a limitation on the embodiments of the present invention.

[0033] For better understanding, in one embodiment, such as Figures 1(a) to 5(b) As shown, an integrated ion wind heat dissipation device includes,

[0034] The substrate 6 has a centrally symmetrical structure, and the heat source 7 is placed on the central axis of the substrate 6;

[0035] Multiple heat dissipation fins 1 are arranged radially on the base 6 with the central axis as the center. The gap between two adjacent heat dissipation fins 1 gradually decreases in the radial direction extending toward the central axis and the gap is greater than zero.

[0036] An insulating disk 5 is supported on the top of multiple heat dissipation fins 1, and a conductive ring 4 is embedded therein.

[0037] Multiple line electrodes 2 are erected between adjacent heat dissipation fins 1. The bottom end of the line electrode 2 is mounted on the base 6 via an insulating post 8, and the top end is mounted on the insulating disk 5 via a conductive post 3. The multiple line electrodes 2 are electrically connected through the conductive ring 4. An ion wind is formed between the line electrodes 2 and the heat dissipation fins 1. The ion wind impacts the heat dissipation fins 1 and the base 6 along the gap to dissipate heat from the heat source 7.

[0038] In a preferred embodiment of the integrated ion wind heat dissipation device, the substrate 6, two adjacent heat dissipation fins 1 and the insulating disk 5 form a fan-shaped flow channel, the flow channel including a flow channel outlet 11 near the central axis and a flow channel inlet 10 relative to the flow channel outlet 11.

[0039] In a preferred embodiment of the integrated ion wind heat dissipation device, the included angle θ between adjacent heat dissipation fins 1 is used as the included angle of the flow channel.

[0040] In a preferred embodiment of the integrated ion wind heat dissipation device, the flow channel angle is 10° to 36°.

[0041] In a preferred embodiment of the integrated ion wind heat dissipation device, the flow channel outlet 11 is 15mm away from the central axis, and the flow channel inlet 10 is 95mm away from the central axis.

[0042] In a preferred embodiment of the integrated ion wind heat dissipation device, the substrate 6 is a circular substrate 6, the insulating disk 5 is a hollow annular structure, and the integrated ion wind heat dissipation device is a cylindrical structure.

[0043] In a preferred embodiment of the integrated ion wind heat dissipation device, the heat source 7 is connected to the substrate 6 through a thermal interface material, which includes thermally conductive silicone grease or a thermally conductive pad.

[0044] In a preferred embodiment of the integrated ion wind heat dissipation device, the line electrode 2 is located on the center line between adjacent heat dissipation fins 1 and perpendicular to the base 6, and the number is between 10 and 36, which is an integer divisible by 360.

[0045] In a preferred embodiment of the integrated ion wind heat dissipation device, the diameter of the wire electrode 2 is 0.1 to 0.4 mm, and the length of the wire electrode 2 is the same as the height of the heat dissipation fins 1.

[0046] In a preferred embodiment of the integrated ion wind heat dissipation device, the thickness of the heat dissipation fins 1 is no more than 1 mm.

[0047] In one embodiment, the ion wind generator consists of wire electrodes 2 and non-parallel plate electrodes. The wire electrodes 2 are metal wires fixed between the base 6 and the insulating disk 5 on the top of the heat sink, and the wire electrodes 2 are connected by conductive rings 4 embedded in the insulating disk 5. The non-parallel plate electrodes are composed of heat dissipation fins 1 of a cylindrical heat sink, and the plate electrodes are connected by the base 6. The ion wind generator produces ion wind, forming forced convection on the surface of the heat sink, thereby promoting the cooling of the heat source 7. The shape matching of the cylindrical heat sink and the circular heat source is more conducive to its efficient heat dissipation, and it can also be used for heat sources of other shapes; the non-parallel layout of the heat dissipation fins 1 forms a tapering channel, thereby accelerating the ion wind and improving the forced convection heat transfer performance; the heat dissipation fins 1 can not only be used for heat dissipation, but also serve as plate electrodes of the ion wind generator. The device realizes the integration of the heat sink and the ion wind generator, which is not only simple and compact in structure, but also has good heat dissipation effect.

[0048] Preferably, the line electrode 2 is made of a metal material with a work function of less than 5 eV, such as tungsten or tungsten-cerium alloy.

[0049] Preferably, the insulating post 8 is made of high-temperature resistant insulating materials including acrylic, plastic, and polymer materials, and is fixed to the substrate 6 by threads.

[0050] Preferably, the thickness and ring width of the insulating disk 5 are both 10 mm.

[0051] Preferably, the insulating disk 5 is made of high-temperature resistant insulating materials including acrylic, plastic, and polymer materials, and is slotted and clipped onto the radiator fins.

[0052] Preferably, the conductive pillar 3 is made of aluminum or copper, or other materials with a resistivity of less than 0.1 Ω·mm. 2 It is made of metal material of / m and is fixed to the center of the insulating disk 5 ring by threads.

[0053] Preferably, the conductive ring 4 is made of a metal material with a work function of less than 5 eV, such as tungsten or tungsten-cerium alloy, and connects each conductive post 3 and the line electrode 2.

[0054] Preferably, the thickness of the plate electrode is no more than 1 mm, and the height of the plate electrode is 70 mm.

[0055] Preferably, the plate electrode is made of aluminum or copper, or other materials with a resistivity of less than 0.1 Ω·mm. 2 It is made of / m metal material and is fixed to the substrate 6 by welding.

[0056] Preferably, the thickness of the base 6 of the heat sink is 10 mm.

[0057] Preferably, the substrate 6 is made of aluminum or copper, or other materials with a resistivity of less than 0.1 Ω·mm. 2 It is made of metal material of / m and undergoes surface insulation treatment, such as anodizing or coating with an insulating layer, to prevent the line electrode 2 from discharging to the substrate 6, causing breakdown and reducing the ion wind effect.

[0058] Preferably, the heating film serving as the heat source 7 is connected to the substrate 6 of the radiator via a thermal interface material.

[0059] In one embodiment, the integrated ion wind cooling device includes:

[0060] The heat dissipation fin 1 serves as a non-parallel plate electrode, and a heat source 7 is disposed on the substrate 6 of the heat dissipation fin 1.

[0061] The wire electrode 2 is mounted on the base 6 by an insulating post 8 at its bottom end and on the insulating disk 5 by a conductive post 3 at its top end, and is connected by a conductive ring 4 embedded in the insulating disk 5.

[0062] The device is surrounded by an open boundary. Under the action of corona discharge, the air 9 forms an ion wind that impacts the heat dissipation fins 1 and the base 6, thereby dissipating heat from the heat source 7.

[0063] In this embodiment, under the influence of a strong electric field around the online electrode, the air is ionized into charged particles. These charged particles collide with neutral molecules under the influence of the strong electric field, resulting in the transfer and transmission of charge and momentum, and causing strong disturbance to the surrounding fluid. This creates an ion wind flow within the device, which forces convection cooling of the heat dissipation fins. This embodiment uses an ion wind device instead of a mechanical fan to dissipate heat from the fins, effectively reducing operating noise and mechanical wear.

[0064] In this embodiment, as Figures 2(a) to 2(b) As shown, the position P of line electrode 2 w The value is 10 mm, where the position of the wire electrode is defined as the distance in the radial direction from the edge of the plate electrode inlet, with rightward deviation being positive. Plate electrode position P f The diameter is 30mm, and the length L is 50mm.

[0065] Under the influence of a strong electric field, the air around the line electrode is ionized into charged particles. These charged particles move towards the plate electrode under the influence of the electric field. During their movement, they collide with neutral molecules, resulting in the transfer and transmission of charge and momentum. This causes strong disturbance to the air in the area between two adjacent non-parallel plate electrodes, forming macroscopic gas movement. In other words, wind is generated in the channel of the ion wind heat dissipation device, which can force convection cooling of the heat dissipation fins in the device.

[0066] In another embodiment, the diameter of the wire electrode 2 is 0.1–0.4 mm, and the length of the wire electrode is the same as the height of the plate electrode. In this embodiment, if the diameter of the wire electrode 2 is less than 0.1 mm, the wire strength will be reduced; if the diameter of the wire electrode 2 is greater than 0.4 mm, the ion wind flow rate will be reduced and the starting operating voltage will be increased. In another embodiment, the wire electrode 2 is made of a metal material with a work function of less than 5 eV, such as tungsten or tungsten-cerium alloy, and is connected by a conductive ring 4 made of the same material.

[0067] In this embodiment, a high-voltage source is connected to the wire electrode. When the heat dissipation device starts working, the high-voltage source supplies power to the wire electrode, thereby generating a strong electric field between the wire electrode and the two adjacent non-parallel plate electrodes. Furthermore, the wire electrode is made of metals with a work function of less than 5 eV, including tungsten and tungsten-cerium alloys. These metals have low electron work function and strong corrosion resistance, ensuring the generation of more ions under high voltage, thus forming a higher-velocity ion wind.

[0068] In another embodiment, the thickness of the plate electrode is no more than 1 mm, and the height of the plate electrode is 70 mm.

[0069] In this embodiment, in order to reduce the weight of the device while providing support, the thickness of the plate electrode needs to be designed to be no more than 1 mm.

[0070] In another embodiment, each plate electrode is made of a low resistivity metal material and is fixed to the substrate by welding.

[0071] In this embodiment, the plate electrode is a grounding electrode, and its material, including aluminum and copper, has a resistivity of less than 0.1 Ω·mm. 2 / m metal.

[0072] In another embodiment, the base thickness of the heat sink is 10 mm.

[0073] In this embodiment, the substrate is made of aluminum or copper, or other materials with a resistivity of less than 0.1 Ω·mm. 2 It is made of metal material of / m and undergoes surface insulation treatment, such as anodizing or coating with an insulating layer, to prevent the line electrode from discharging to the substrate, causing breakdown, and reducing the ion wind effect.

[0074] In another embodiment, as shown in Figure 2(b), the included angle θ of the non-parallel plate electrodes is 20°, and the outlet position r of the flow channel in the two-dimensional model is taken as the plate electrode position P. f Half of that, i.e., 15mm, is taken as the base radius R0, i.e., 95mm, at the inlet position of the flow channel.

[0075] In this embodiment, simulation demonstrates that the tilt of the plate electrode affects the size of the discharge space between the linear and non-parallel plate electrodes, thereby influencing the magnitude of the electric field strength and the amount of air available for ionization to generate the ion wind. The latter plays the most crucial role in the generation of the ion wind. The tilt of the plate electrode also affects the magnitude and shape of the flow field, thus influencing the flow characteristics of the ion wind. Figure 3 As shown, with the increase of the channel central angle θ, the inclination of the plate electrode gradually increases, the discharge space becomes larger, the range of the annular potential distribution cloud around the conductor gradually expands, the low potential region gradually expands, the magnitude of the electric field strength vector becomes smaller, and the eddies on both sides of the conductor also increase, which suppresses the airflow velocity. However, in a smaller discharge space, there is less air available for ionization, and the generation of ion wind is achieved by accelerating the movement of charged ions between the line electrode and the plate electrode through the electric field. Ions transfer their momentum to neutral particles through collisions, thus generating ion wind macroscopically. Both air ionization and ion collisions are probabilistic events, so it is easier to generate ion wind when a larger amount of air can be drawn into the discharge space. Therefore, although the electric field strength is relatively large when the channel central angle θ is small, the amount of air available for ionization to generate ion wind is too small, which is not conducive to generating ion wind to improve the heat dissipation performance of the heat sink. The size of the channel central angle also determines the number of fins, which directly determines the weight and manufacturing cost of the entire device. Therefore, considering all factors, a channel central angle θ of 18° is chosen.

[0076] The arrangement of the remaining line electrodes and non-parallel plate electrodes is the same as described above. The entire device is simply composed of the above sector representative units connected in parallel in a ring, which will not be described again here.

[0077] Additionally, it should be noted that, as Figure 4 As shown, the position of the line electrode affects the electric field intensity vector distribution in the discharge space between the line and the non-parallel plate electrodes, primarily influencing the direction of the electric field intensity vector, and thus affecting the flow characteristics of the ion wind. As the line electrode gradually moves downstream from the inlet of the flow channel, the magnitude of the electric field intensity vector slightly increases, resulting in a slight enhancement in the driving effect on the ion wind and a slight increase in its velocity. However, the vortex regions on both sides of the wire also increase. More importantly, some electric field intensity vectors are guided in the opposite direction to the rear corner of the plate electrode at the inlet of the flow channel, causing reverse flow and severely reducing the velocity of the ion wind. This effect becomes increasingly pronounced as the position of the line electrode changes, with approximately half of the electric field intensity vectors pointing in the opposite direction to the rear corner of the plate electrode at the inlet of the flow channel, weakening the performance of the ion wind. When the line electrode is located at the edge of the plate electrode inlet, the electric field intensity vectors all point from the inlet to the outlet of the flow channel, resulting in a more reasonable electric field distribution. Furthermore, its proximity to the inlet facilitates the intake of more air into the channel, promoting the formation of the ion wind and achieving a better flow field distribution and a higher ion wind velocity. Based on the above analysis, the position of the line electrode P...w Set it to 0mm.

[0078] In another embodiment, the heat dissipation fins 1 are generally plate fins, arranged in a non-parallel circumferential direction on the substrate 6, with a base radius R0 of 95 mm. The heating film 7, which serves as a heat source, is fixed to the center of the substrate 6 by a thermal interface material.

[0079] In this embodiment, the thermal interface material includes thermal grease or thermal pad.

[0080] In another embodiment, this disclosure also provides an ion wind heat dissipation device, comprising:

[0081] Cylindrical radiator and ion wind generator installed between the heat dissipation fins.

[0082] The cylindrical heat sink consists of heat dissipation fins 1 and a base 6. The heat dissipation fins 1 are arranged circumferentially on the base 6 at position P. f The thickness is 40mm, the radius R0 of the substrate is 105mm, and the heating film 7, which serves as the heat source, is fixed to the center of the substrate 6 through a thermal interface material.

[0083] The ion wind generator is composed of ion wind generating units connected in parallel in a ring, consisting of a wire electrode 2 and a plate electrode. The position of the wire electrode 2 is P. w The diameter is 0mm, the plate electrode tilt angle, i.e. the flow channel central angle θ is 18°, the bottom end of the line electrode 2 is installed on the base 6 by the insulating column 8, the top end is installed on the insulating disk 5 by the conductive column 3, and they are connected by the conductive ring 4 embedded in the insulating disk 5. The air 9 forms an ion wind under the action of corona discharge to impact the heat dissipation fins 1 and the base 6, and dissipate heat from the heat source 7.

[0084] In another embodiment, both the insulating disk and the insulating post are made of high-temperature resistant insulating materials, including any of the following: acrylic, plastic, and polymer materials.

[0085] In one specific embodiment, this disclosure simulated the operation of a heat source with a diameter of 90 mm and a thickness of 3 mm at heating powers of 160, 180, and 200 W. The simulation results comparing the maximum surface temperature of the heat source under different heat source powers before and after structural optimization are shown in the table below: When the ion wind applies a voltage of -15 kV, the maximum surface temperature of the heat source at steady state is already below its safe operating limit of 125°C; after optimizing the device's structural parameters, the maximum surface temperature of the heat source at steady state will decrease by approximately 15°C, significantly improving the heat dissipation performance of the ion wind and ensuring stable and reliable operation of the heat source. For the above-mentioned heat source at 160 W, the temperature field distribution of the heat source surface of the ion wind heat sink before and after optimization is shown in Figures 5(a) and 5(b), respectively: before and after optimization, the maximum surface temperature is higher closer to the center of the heat source. The maximum surface temperature of the heat source after optimization is approximately 78°C, far below the safe temperature, proving that this invention can be used as an efficient heat dissipation device for high-power electronic devices, as detailed in the table below.

[0086]

[0087] Although embodiments of the present invention have been described above in conjunction with the accompanying drawings, the present invention is not limited to the specific embodiments and application fields described above. The specific embodiments described above are merely illustrative and instructive, and not restrictive. Those skilled in the art can make many other forms based on the guidance of this specification and without departing from the scope of protection of the claims of the present invention, and all of these are within the scope of protection of the present invention.

Claims

1. An integrated ion wind heat dissipation device, characterized in that, It includes, The substrate has a centrosymmetric structure, and the heat source is placed on the central axis of the substrate; Multiple heat dissipation fins are arranged radially on the base with the central axis as the center. The gap between two adjacent heat dissipation fins gradually decreases in the radial direction extending toward the central axis and the gap is greater than zero. An insulating disk, supported on the top of multiple heat dissipation fins, with an embedded conductive ring; Multiple wire electrodes are erected between adjacent heat dissipation fins. The bottom ends of the wire electrodes are mounted on a substrate via insulating posts, and the top ends are mounted on an insulating disk via conductive posts. The multiple wire electrodes are electrically connected via conductive rings. An ion wind is formed between the wire electrodes and the heat dissipation fins. This ion wind impacts the heat dissipation fins and the substrate along the gap to dissipate heat from the heat source. The non-parallel arrangement of the heat dissipation fins forms a tapering channel, thereby accelerating the ion wind. The substrate, two adjacent heat dissipation fins, and the insulating disk form a fan-shaped flow channel. The flow channel includes a flow channel outlet near the central axis and a flow channel inlet relative to the flow channel outlet. The included angle between adjacent heat dissipation fins... θ As the included angle of the flow channel, when the included angle θ As the voltage gradually increases, the tilt angle of the non-parallel plate electrode increases, the discharge space continuously expands, the range of the ring potential around the conductor also gradually expands, the low potential region continuously expands, and the magnitude of the electric field gradually decreases.

2. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The flow channel angle is 10°~36°.

3. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The outlet of the flow channel is 15 mm from the central axis, and the inlet of the flow channel is 95 mm from the central axis.

4. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The substrate is circular, the insulating disk is a hollow ring structure, and the integrated ion wind heat dissipation device is a cylindrical structure.

5. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The heat source is connected to the substrate through a thermal interface material, which includes thermally conductive silicone grease or a thermally conductive pad.

6. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The line electrodes are located on the center line between adjacent heat dissipation fins and perpendicular to the base, and their number is between 10 and 36, an integer divisible by 360.

7. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The diameter of the wire electrode is 0.1~0.4 mm, and the length of the wire electrode is the same as the height of the heat dissipation fins.

8. The integrated ion wind heat dissipation device according to claim 1, characterized in that, The thickness of the heat dissipation fins is no more than 1 mm.

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