Footwear airbags with flexible electronic interconnects
Patent Information
- Application Number
- CN202180039162.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-05-29
- Filing Date
- 2021-05-28
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2041-05-28
Smart Images

Figure CN115666311B_ABST
Abstract
Description
[0001] Cross-references to related applications
[0002] This application claims priority to U.S. Provisional Patent Application Serial No. 63 / 032096, filed May 29, 2020, the contents of which are incorporated herein by reference in their entirety. Technical Field
[0003] The subject matter disclosed in this article generally relates to a footwear item comprising an airbag with flexible electronic interconnections. Attached Figure Description
[0004] Some embodiments are shown by way of example and are not limited to the figures in the accompanying drawings.
[0005] Figure 1 This is an exploded perspective view of a footwear item incorporating flexible electronic components in an example embodiment.
[0006] Figure 2 This is an illustration of an airbag assembly incorporating flexible electronic components in an example embodiment.
[0007] Figure 3 This is an illustration of a flexible electronic component in an example embodiment.
[0008] Figure 4 This is a detailed side view of the airbag assembly in the example embodiment, particularly the interconnection between the flexible electronic components and the airbag substrate.
[0009] Figure 5A and 5B The example embodiments shown are manufactured or assembled as described in reference. Figure 4 The process of assembling the airbag.
[0010] Figure 6A and 6B This is a simplified side view of the airbag assembly in different states in the example embodiment, to show the spatial relationship of the capacitive electrodes on the two sheets.
[0011] Figure 7 This is a block diagram of components of a system that can process information from a capacitor electrode in an example embodiment.
[0012] Figure 8 This is an illustration of an airbag assembly that includes alternative electronic components in an example embodiment.
[0013] Figure 9 This is a detailed illustration of the external portion of the electronic component relative to the TPU seal of the airbag assembly in an example embodiment.
[0014] Figure 10 This is an exploded view or pre-assembled view of the airbag assembly in the example embodiment.
[0015] Figure 11 This is a side view of the first sheet in the example embodiment.
[0016] Figure 12A and 12B These are a side view and a perspective view of the airbag assembly in the example embodiment.
[0017] Figure 13 This is a flowchart of the manufacturing process for footwear items in an example embodiment. Detailed Implementation
[0018] The example methods and systems relate to a footwear article including an airbag with flexible electronic interconnections. The examples represent only possible variations. Unless explicitly stated otherwise, components and functions are optional and can be combined or subdivided, and operations can vary in order or be combined or subdivided. In the following description, numerous specific details are set forth for purposes of explanation to provide a full understanding of the example embodiments. However, it will be apparent to those skilled in the art that the subject matter can be practiced without these specific details.
[0019] Footwear items, such as shoes, can include a variety of traditional and non-traditional components. Traditional components can include uppers, soles, and laces or other securing mechanisms to enclose and secure the wearer's foot within the footwear. Soles can include air bladders or cushioning systems. Non-traditionally, electronics can be included to provide sensors, wireless communications, and active systems, such as motorized lacing systems.
[0020] Generally, especially for footwear used in sporting activities, characteristics such as size, form, robustness, and weight can be particularly important. For example, incorporating electronics into footwear can present challenges because electronics are typically relatively inflexible and fragile, while the normal use of footwear often involves bending and flexing, as well as exposure to moisture from sweat and environmental conditions—conditions typical of footwear but not typical of electronics. Furthermore, reliable flexible electronic interconnects between substrates have proven challenging in both development and manufacturing.
[0021] A flexible electrical interconnect has been developed for use in conjunction with or as part of footwear airbags. This interconnect allows for a robust interconnect that withstands the shear forces typically experienced by footwear. The interconnect with the airbag can be achieved without compromising the peripheral seal of the airbag, thereby reducing the risk of airbag leakage. In various examples, the flexible electronic component is made of thermoplastic polyurethane (TPU) composites, for example by radio frequency (RF) bonding or thermal welding, and includes features that are resilient to the relatively large shear forces that may be experienced in footwear, while maintaining the electrical connection using normal forces. In such examples, the bonding with the flexible electronic component is separate from the peripheral bonding with the airbag, thus preventing airbag leakage beyond the parameters of a typical footwear airbag. Conductive elements can be disposed on the airbag to provide electrical connections between sensors on the airbag, which are also disposed on the flexible electronic component. While TPU will be discussed in detail herein, it should be recognized and understood that the principles discussed regarding TPU will also apply to any other suitable material or combination of materials.
[0022] Figure 1 This is an exploded perspective view of a footwear article 10 incorporating a flexible electronic component 12 in an exemplary embodiment. The footwear article 10 may include an upper 14 and a sole assembly 16. The wearer's foot can rest on or inside the sole assembly 16 while the upper 14 surrounds the foot to keep it inserted into the footwear article 10. The sole assembly 16 may include an insole 18, a midsole 20, an air bladder assembly 21, and an outsole 22. The insole 18 can be inserted into the upper 14. The midsole 20 can be attached to the bottom of the upper 14. The outsole 22 can be attached to the bottom of the midsole 20. The air bladder assembly 21 can be incorporated into the sole assembly 16 so that it is visible in a window 23 of the midsole 20. The air bladder assembly 21 can be incorporated into the midsole 20 using any conventional technique, such as foam encapsulation or placement in a cut-out portion of a foam midsole. Alternatively, the midsole 20 and / or outsole 22 may be omitted, and the airbag assembly 21 may replace the midsole 20 and / or outsole 22. The airbag assembly 21 may be configured to include a flexible electrical component 12 embedded therein. The airbag assembly 21 may provide a clean, low-abrasion, safe, and concealed location for the flexible electrical component 12.
[0023] Footwear article 10 has an inner or medial side 24 and an outer or lateral side 26. For general reference purposes, footwear article 10 can be divided into three general parts: a forefoot part 28, a midfoot part 30, and a heel part 32. Parts 28, 30, and 32 are not intended to delineate precise areas of footwear article 10; rather, they are intended to represent general areas of footwear article 10 and provide a framework for reference in the following discussion. Furthermore, although this specification is written with reference to athletic shoes, the disclosure of this application can also be applied to other types of footwear, such as, but not limited to, dress shoes, running shoes, golf shoes, tennis shoes, sandals, boots, slippers, etc.
[0024] The sole assembly 16 is typically positioned between the wearer's foot and the ground, providing attenuation of ground reaction forces (i.e., cushioning), traction, and control of foot movement, such as pronation. The insole 18 typically includes a removable insert positioned on top of the air bladder assembly 21 or the midsole 20, and can provide additional cushioning or ventilation (e.g., through perforations). The midsole 20 may be attached to the upper 14 and serves as the primary shock-absorbing and energy-absorbing component of the footwear article 10. The midsole 20 may be secured to the upper 14 by adhesives or other suitable means. Suitable materials for the midsole 20 include polymeric foam materials, such as ethylene vinyl acetate or polyurethane, or any other elastically compressible material. The outsole 22 may be attached to the lower surface of the midsole 20 by adhesives or other suitable means. Suitable materials for the outsole 22 include polymers, such as polyether block copolyamide polymers (produced by ATOFINA Chemicals of Philadelphia, Pennsylvania). (for sale), and nylon resins, such as those sold by DuPont. In view of the benefits of this disclosure, other suitable materials for the outsole 22 will become apparent to those skilled in the art. In some embodiments, the sole assembly 16 may not include an outer bottom layer separate from the midsole 20; instead, the outsole may include the bottom surface of the midsole 20, which provides an external adhesion surface for the sole assembly 16.
[0025] Various embodiments of the flexible electronic component 12 disclosed herein can be incorporated into various designs of the airbag assembly 21. For example, the airbag assembly 21 may include an airbag substrate forming an airbag comprising two polymer films, as described in U.S. Patent No. 5,802,739 to Potter et al. In another embodiment, a four-layer airbag may be used, as described in U.S. Patent No. 6,402,879 to Tawney et al. In yet another embodiment, a fabric cushioning element may be used, as described in U.S. Patent No. 8,764,931 to Turner. The entire contents of U.S. Patent Nos. 5,802,739; 6,402,879; and 8,764,931 are incorporated herein by reference. In other embodiments, the airbag may be filled with other gases, such as nitrogen, helium, or so-called dense gases, such as sulfur hexafluoride, liquids, or gels. In various examples, although materials are disclosed in U.S. Patent Nos. 5,802,739; 6,402,879; and 8,764,931, the airbag substrate may be formed in part from TPU according to the principles disclosed in those patents. In various embodiments, TPU forms at least one layer and / or a mixture of one or more layers of the airbag substrate.
[0026] Figure 2This is an illustration of an airbag assembly 21 incorporating flexible electronics 12 in an exemplary embodiment. The airbag assembly 21 incorporates flexible electronics 12 in the case of a capacitive sensing system, which will be further disclosed herein. The airbag assembly 21 includes capacitive electrodes 100 coupled to the flexible electronics 12, and conductive elements 102 disposed on an airbag substrate 104. In one example, the conductive element 102 is a silver trace, such as printed silver ink; however, it should be recognized and understood that the conductive element 102 can be any suitable material that can be disposed on the airbag substrate 104, or can be disposed on a material that is itself fixed or disposed on the airbag substrate 104.
[0027] The description of the airbag assembly 21 is general, and it should be recognized and understood that the airbag assembly 21 can be manufactured according to the various principles disclosed herein. In various embodiments, although the flexible electronics assembly 12 is described as extending partially from the airbag substrate 104, in the various embodiments disclosed herein, the flexible electronics assembly 12 may be completely enclosed within the airbag substrate 104. In various examples, conductive elements 102 are disposed on the outer surface, the inner surface, or both of the airbag substrate 104, with some conductive elements 102 disposed on the outer surface and some on the inner surface. Similarly, capacitor electrodes 100 may be disposed on the outer surface, the inner surface, or both of the airbag substrate 104, with some capacitor electrodes 100 disposed on the outer surface and some on the inner surface.
[0028] The flexible electronic component 12 may be or include a flexible printed circuit board (PCB). Alternatively, the flexible electronic component 12 may include a rigid PCB, but may include flexible elements or allow bending of connections to or between conductive elements 102, as described herein. Thus, although the flexible electronic component 12 may not be entirely flexible, it should be recognized and understood that the flexible electronic component 12 does include certain flexible elements.
[0029] In various examples, the flexible electronics assembly 12 does not include active electronics, but rather serves to provide connectivity between the conductive element 102 and electronics included elsewhere in the system. Alternatively, the flexible electronics assembly 12 does include active electronics, such as those associated with the operation of the capacitive electrode 100 in the case of a capacitive sensor system.
[0030] Figure 3 This is an illustration of the flexible electronic component 12 in an exemplary embodiment. In an exemplary embodiment, the flexible electronic component 12 does not include active electronics, but is instead used as a connector or interconnect to electronics located in or away from the footwear article 10. However, as described above, various examples of the flexible electronic component 12 may include active electronics.
[0031] The flexible electronic component 12 includes a PCB 300, a conductive element 302, and a through-hole 304. In various examples, the PCB 300 is a flexible PCB or a rigid PCB. In various examples, the conductive element 302 is disposed on the airbag substrate 104 (…). Figure 2 The conductive elements 102 on the PCB 300 are the same as or similar to those on the PCB 300, such as silver traces disposed on the PCB 300, but any suitable wire capable of being electrically coupled to the conductive traces 104 can be used. The via 304 is a cutout in or formed by the PCB 300 and is configured to allow soldering to be formed through the via 304 to secure the flexible electronic component 12 within the airbag assembly 21.
[0032] Figure 4 This is a detailed side view of the airbag assembly 21 in the exemplary embodiment, particularly showing the interconnection between the flexible electronics assembly 12 and the airbag substrate 104. The flexible electronics assembly 12 is partially located between a first sheet 400 and a second sheet 402 of the airbag substrate 104. A conductive element 102 is disposed on the outer surface 404 of the airbag substrate 104, although, as described in an alternative embodiment, the conductive element may alternatively or additionally be located on the inner surface 406 of the airbag substrate 104. The conductive element 102 is electrically coupled to the conductive element 302 of the flexible electronics assembly 12.
[0033] In the example shown, the interconnection between the flexible electronics component 12 and the airbag substrate 104 is formed by two connections. The outer surface 404 of each sheet 400, 402 contacts the flexible electronics component 12 such that each conductive element 102 is in electrical contact with an associated conductive element 302. The airbag substrate 104 can then be heated, soldered, or otherwise manipulated such that the airbag substrate 104 of each sheet 400, 402 melts or flows into a through-hole 304 (not shown), and upon cooling, a bond, such as a TPU bond, is formed between the first sheet 400 and the second sheet 402 within some or all of the through-holes 304.
[0034] Each sheet 400, 402 also forms folds 408, 410, with an inner surface 406 in contact with itself, and conductive elements 102 following the outer surface 404 around the outer edges 412, 414 of the folds 408, 410, respectively. The airbag substrate 104 is then welded at the welding portion 416, for example by RF bonding or any suitable welding technique for welding the airbag substrate 104, assuming the airbag substrate 104 comprises or is made of TPU, to form a seal between the first and second sheets 400, 402 and to form a pouch in which the flexible electronics component 12 is positioned. This seal may be consistent with a seal around the entire periphery of the airbag substrate 104, providing an appropriate degree of leakage for the airbag assembly 21, allowing the airbag assembly 21 to remain under desired pressure for several years. Therefore, the presence of the flexible electronics component 12 may not provide a measurable increase in leakage of the airbag assembly 21 compared to an airbag without the flexible electronics component 12.
[0035] Figure 5A and 5B The process of manufacturing or assembling airbag assembly 21 in an example embodiment is shown, as referenced Figure 4 As stated above. Figure 5A In this configuration, the first and second sheets 400 and 402 are, as described above, at least partially secured to the flexible electronic assembly 12 by bonding within or through a through-hole 304 (not shown). Figure 5A In the example shown, the first and second sheets 400 and 402 are both substantially perpendicular to the flexible electronic component 12. At this point in the assembly process, folds 408 and 410 are partially, but not fully, formed.
[0036] exist Figure 5B In this embodiment, the first and second sheets 400, 402 are completely folded and welded or joined together to form an airbag assembly 21. In this example, the welding or joining may be performed around the entire periphery 500 of the first and second sheets 400, 402 to seal the first and second sheets 400, 402, thereby forming the airbag of the airbag assembly 21.
[0037] Figure 6A and Figure 6B This is a simplified side view of the airbag assembly 21 in different states in the example embodiment, to show the spatial relationship of the capacitor electrodes 100 on the two sheets 400, 402. Figure 6A In the middle, the airbag assembly 21 is in a relaxed state, while Figure 6B The airbag assembly 21 is compressed because the foot is pressing on the airbag assembly 21.
[0038] Certain capacitive electrodes 100A, 100B on the first sheet 400 have corresponding capacitive electrodes 100C, 100D on the second sheet 402. Thus, when viewed from above the airbag assembly 21, a pair of associated capacitive electrodes, such as 100A, 100C, substantially overlap each other and are located directly above and below each other. Each pair of capacitive electrodes, such as 100A, 100C, has a vertical spacing 600, which can be increased or decreased based on whether the airbag assembly 21 is compressed or uncompressed. In the example shown, where the airbag assembly 21 is in... Figure 6A When in a relaxed state, the vertical spacing of 600A is greater than that of airbag assembly 21. Figure 6B The vertical spacing in the compressed state is 600B.
[0039] Each pair of capacitive electrodes, such as 100A and 100C, has an inherent capacitance between them that varies based on a vertical spacing of 600. As the vertical spacing of 600 decreases, the capacitance between electrodes 100A and 100C increases, and as the vertical spacing increases, the capacitance between electrodes 100A and 100C decreases. The capacitance between two electrodes—whether the electrodes are physical electrodes or another reference point, such as a part of the human body—can be measured according to principles known in the art, for example, in U.S. Patent Application Publication No. 2018 / 0199674, filed March 14, 2018, “FOOT PRESENCE SIGNAL PROCESSING USING VELOCITY”, and Patent Cooperation Treaty Application No. US2020 / 022653, filed March 13, 2020, “TOUCH INTERFACE FOR ACTIVE FOOTWEAR SYSTEMS”, the entire contents of which are incorporated herein by reference.
[0040] As described herein, each capacitive electrode 100 is coupled via a conductive element 102 to an associated conductive element 302 on the flexible electronic assembly 12. In one example, the flexible electronic assembly 12 is then coupled to electronics contained elsewhere to sense changes in voltage or other electrical characteristics between the associated or paired capacitive electrodes 100A, 100C, and, based on these changes in electrical characteristics, to identify that the airbag assembly 21 is being or has been compressed or relaxed, and, by extension, to identify that something such as a foot has been inserted into the associated footwear item 10. Alternatively, some or all of the electronics used to sense changes in voltage or other electrical characteristics and to identify that the airbag assembly 21 has been compressed or relaxed may be included as an integral part of the flexible assembly 12.
[0041] Furthermore, changes in the electrical characteristics between different pairs of capacitive electrodes 100 can indicate different conditions. For example, when a foot is inserted into the footwear 10, the first pair of capacitive electrodes 100B and 100D can be compressed first, thus showing a change in electrical characteristics before the second pair of capacitive electrodes 100A and 100C show a change in electrical characteristics as the foot moves deeper into the footwear 10. Similarly, when the foot is retracted from the footwear 10, the electrical characteristics of the second pair of capacitive electrodes 100A and 100C can change before the electrical characteristics of the first pair of capacitive electrodes 100B and 100D change.
[0042] Similarly, the use of footwear 10 may tend to produce different electrical characteristic changes between different pairs of capacitive electrodes 100. In one example, if footwear 10 is used during running, compression on the airbag assembly 21 may occur at different times, in different ways, and at different locations, for example, due to the occurrence and manner of footsteps. For instance, if the wearer tends to strike the forefoot while running, the vertical distance 600 between the second pair of electrodes 100A, 100C may decrease more at each foot impact than the vertical distance 600 between the first pair of electrodes 100B, 100D, thus indicating that the wearer is striking the forefoot during running. The above examples are presented illustratively, and it should be recognized and understood that the use of capacitive electrodes 100 and the changes in electrical characteristics between capacitive electrodes 100 over time can provide various insights into when and how footwear 10 is used.
[0043] Figure 7 This is a block diagram of components of a system that can process information from capacitor electrode 100 in an example embodiment. The diagram includes components that can be used in self-lacing footwear. In such an example, the output from capacitor electrode 100 can be used for the operation of a lacing engine.
[0044] The lacing engine includes an interface button 200, an interface button actuator 201, and a lacing engine housing surrounding the main PCB 204 and the user interface PCB 206. The user interface PCB 206 includes the button 200, one or more light-emitting diodes (LEDs) 208, an optical encoder unit 210, and an LED driver 212. The LEDs 208 can illuminate the button actuator 201 or provide external illumination for the footwear, and the LED driver 212 can power the LEDs 208. The main PCB 204 includes a processor circuit 214, an electronic data storage device 216, a battery charging circuit 218, a wireless transceiver 220, one or more sensors 222, such as an accelerometer, a gyroscope, etc., and a motor driver 224.
[0045] The lace-up motor includes a foot presence sensor 226 operatively coupled to capacitive electrodes 100 via flexible electronics 12, a motor 228, a transmission 230, a spool 232, a battery or power source 234, and a charging coil 236. The foot presence sensor 226 can receive information indicating electrical characteristics from the capacitive electrodes 100 and identify changes in electrical characteristics between each pair of capacitive electrodes 100. Based on the electrical characteristics and changes in those characteristics, the foot presence sensor 226 can identify the presence of a foot and how the footwear item 10 is worn and / or used by the wearer.
[0046] Processor circuit 214 is configured with instructions from electronic data memory 216 to cause motor driver 224 to start motor 228, thereby rotating spool 232 via transmission device 230 to apply a desired amount of tension to shoelace 238 wound on spool 232. Processor circuit 214 can receive input from various sources, including foot presence sensor 226, sensor 222, and button 200, to determine whether to increase or decrease the tension on shoelace 238 according to instructions. For example, foot presence sensor 226 can detect the presence of a foot in shoe 198, and processor circuit 216 can set the tension to the current tension level. Sensor 222 can detect movement consistent with a specific activity level, such as casual walking, vigorous physical activity, etc., and processor circuit 214 can set the tension to a level consistent with that activity level, such as relatively loose for casual walking and relatively tight for vigorous physical activity. The user can press button actuator 201 to manually control the incremental or linear increase or decrease of tension as needed.
[0047] Battery 234 typically provides power to components of the tethered motor 102 and is a rechargeable battery in the example embodiment. However, alternative power sources, such as non-rechargeable batteries, supercapacitors, etc., may also be considered. In the illustrated example, battery 234 is coupled to charging circuit 218 and recharging coil 236. When recharging coil 236 is placed near external charger 240, charging circuit 242 can energize transmitting coil 244 to induce a current in recharging coil 236, which is then used by charging circuit 218 to recharge battery 234. Alternative recharging mechanisms are contemplated, such as a piezoelectric generator located within shoe 198.
[0048] The wireless transceiver 220 is configured to wirelessly communicate with a remote user equipment 246, such as a smartphone, wearable device, tablet, or personal computer. In this example, the wireless transceiver 220 is configured to communicate using Bluetooth Low Energy mode, although it can communicate using any suitable wireless mode, including Near Field Communication (NFC), 802.11 WiFi, etc. Furthermore, the wireless transceiver 220 can be configured to communicate with multiple external user equipments 246 and / or using multiple different wireless modes. The wireless transceiver 220 can receive instructions from the user equipment 246, such as using an application running on the user equipment 246, for controlling the lacing engine 102, including entering a predetermined operating mode or incrementally or linearly increasing or decreasing the tension on the shoelaces 238. The wireless transceiver 220 can further transmit information about the lacing engine 102 to the user equipment 246, such as the tension on the shoelaces 238 or the orientation of the spool 232, the remaining power on the battery 234, and any other desired information about the lacing engine.
[0049] Figure 8 This is an illustration of an airbag assembly 800 including an alternative electronic component 802 in an example embodiment. The electronic component 802 may be the same as or similar to the flexible electronic component 21, and in various examples, the electronic component 802 is a flexible electronic component. However, in various alternative examples, the electronic component 802 is not a flexible electronic component, but rather a conventional rigid PCB.
[0050] In the example shown, electronic component 802 is partially contained within airbag assembly 800 and includes active electronics contained in an inner portion 804 within the pouch of airbag assembly 800. An outer portion 806 of electronic component 802 extends from airbag assembly 800. The outer portion 806 includes a conductive element 808 configured to couple to a conductor from an external electronic device.
[0051] Electronic component 802 includes active electronics, such as sensor 226, for example, a foot presence sensor 226, or more broadly, a capacitive sensor configured to record changes in electrical characteristics between capacitive electrodes 100. In one example, electronic component 802 further includes MCU 214, memory 216, and power supply 234, such as a battery, piezoelectric generator, etc. The MCU may be a processor for sensor 226, or may support sensor 226. Alternatively, electronic component 802 may not be integrated with sensor 226, but may instead transmit raw or normally unprocessed data from capacitive electrodes 100 to another device, such as user equipment 246, a lacing motor elsewhere contained in footwear 10, or another processing power source, via conductive elements 808 of electronic component 802, and interpretation of the data from capacitive electrodes may be performed at a location remote from electronic component 802.
[0052] In such an example, all conductive elements 810 disposed on the airbag substrate 812 of the airbag assembly 800 are on the inner surface of the airbag substrate 812. In this example, therefore no conductive elements 810 are on the outer surface and are unaffected by any environmental factors. In various examples, all conductive elements 810 disposed on the airbag substrate 812 are coupled to conductive elements 808 of the electronic assembly 802 on the inner portion 804 of the electronic assembly 802.
[0053] The sheets of the airbag substrate 812 are welded or otherwise secured to each other around the entire periphery 814 of the airbag assembly 800. As disclosed herein, the airbag substrate 812 comprises or is formed of TPU, and the welding or securing mechanism is any of a variety of mechanisms forming the TPU seal 816. Thus, the outer portion 806 of the electronic assembly 802 can be understood as the portion of the electronic assembly 802 that extends beyond the seal 816.
[0054] Alternatively, the electronic component 802 may be entirely contained within the airbag assembly 800, with no part extending beyond the seal 816 surrounding the airbag assembly 800. In such an example, the electronic component 802 also includes a wireless transmitter 220 to at least provide wireless transmission, and in some examples, to provide reception of wireless transmission. In such an example, the electronic component 802 may transmit information from the sensor 226, and in some examples receive information for use by other components of the electronic component 802.
[0055] Figure 9 This is a detailed illustration of the external portion 806 of the electronic component 802 relative to the TPU seal 816 of the airbag assembly 800 in an example embodiment. In such an example, each of the first sheet 900 and the second sheet 902 of the airbag substrate 812 includes folded portions 904, 906, respectively, to expose the external portion 806 of the electronic component 802 and the conductive element 810 contained thereon. The TPU seal 816 then extends over the folded portions 904, 906 to seal the first and second sheets 900, 902 around the electronic component 802.
[0056] Figure 10This is an exploded view or pre-assembly view of the airbag assembly 800 in an example embodiment. A first sheet 900 includes a capacitor electrode 100 and a conductive element 810 disposed on the inner surface of the first sheet 900. A second sheet 902 includes the capacitor electrode 100 and the conductive element 810, which are exposed on the inner surface of the second sheet 902 facing the inner surface of the first sheet 900. The electronic assembly 802 includes active electronic devices 1000, such as an MCU 214, a memory 216, and a power supply 234, as well as other components disclosed herein, and a conductive element 808 configured to be electrically coupled to the conductive element 810 disposed on the first and second sheets 900, 902.
[0057] Figure 11 This is a side view detail of the first sheet 900 in the example embodiment. Although Figure 11 This description is for the first sheet 900, but these principles also apply to the second sheet 902.
[0058] The first sheet 900 comprises at least one TPU layer 1100 or includes TPU and other suitable materials. Conductive elements 810, such as silver traces, are disposed on the inner surface 1102 of the first sheet 900. Conductive elements 810 are not disposed on the outer surface 1104 of the layer 1100. The layer 1100 is not laminated at its edges 1106, 1108 to facilitate the fabrication of the TPU seal 816 and the folded portions 904, 906. Figure 9 Although the conductive element 810 is shown as being disposed on layer 1100, it should be noted that the conductive element may be on a separate layer (not shown) laminated onto layer 1100. However, the separate layer may not be laminated at edges 1106, 1108.
[0059] Figure 12A and 12B These are side and perspective views of the airbag assembly 1200 in the example embodiment, respectively. The airbag assembly 1200 may be functionally the same as or similar to the airbag assemblies disclosed herein, such as airbag assembly 21 and airbag assembly 800, since the airbag assembly 1200, including the flexible electronics component 12, can be used as a pressure sensor. Alternatively, the airbag assembly 1200 may incorporate the flexible electronics component 802 in place of the flexible electronics component 12, or incorporate the flexible electronics component 802 in addition to the flexible electronics component 12. Furthermore, the airbag assembly 1200 may include the same components and layout as airbag assembly 21 and / or airbag assembly 800, such as the formation of the airbag substrate 1202 based on the first and second sheets, which may be respectively connected to… Figure 9 The first sheet 900 and the second sheet 902 are the same or similar, and the first sheet and the second sheet 900, 902 are made of TPU.
[0060] However, airbag assembly 1200 incorporates certain features and assembly methods that differ from airbag assembly 21 and / or airbag assembly 800. In the illustrated example, airbag assembly 1200 includes fibers 1204 extending between the inner surfaces 1206 of airbag assembly 1200. Fibers 1204 can improve the structural resilience of airbag assembly 1200 relative to airbag assemblies 21, 800, and provide performance differences in various applications. Fibers 1204 can be implemented as disclosed in U.S. Patent No. 8,479,412, filed December 3, 2009, “TETHERED FLUID-FILLED CHAMBERS”, filed December 3, 2009, and U.S. Patent Publication No. 2019 / 0365043, filed August 19, 2019, “SPACER TEXTILE MATHERIALS AND METHODS FOR MANUFACTURING THE SPACER TEXTILE MATERIAL”, the entire contents of which are incorporated herein by reference.
[0061] Furthermore, the airbag assembly 1200 can be formed according to an alternative process different from that described for airbag assemblies 21, 800. Specifically, the airbag assembly 1200 can be formed according to the principles and processes described in U.S. Patent Application Publication No. 2020 / 0260819, filed May 5, 2020, "MIDSOLE SYSTEM WITH GRADED RESPONSE," filed May 5, 2020, by Case et al., and U.S. Patent Application Publication No. 17 / 207322, filed March 19, 2021, "FOOTWEAR WITH FLUID-FILLED BLADDER," filed March 19, 2021, by Elder et al., the entire contents of which are incorporated herein by reference. In general, the above-described process provides for the formation of a pouch 1208 between a first sheet 1210 of the first portion 1212 and a second sheet 1214 of the second portion 1216 of the airbag assembly 1200. The flexible electronic component 12 is positioned or placed in the bag 1208, and the airbag substrate 1202 of the first sheet 1210 and the second sheet 1214 melts in the melting region 1218 to seal the airbag substrate 1202 around the bag and provide environmental isolation for the flexible electronic component 12. As a result, the forces applied to the airbag component 1200 are generally applied to and sensed by the flexible electronic component 12.
[0062] Although the airbag assembly 1200 is described according to the above process, it should be noted and emphasized that the airbag assembly 1200 can be formed according to the process described for airbag assemblies 21 and 800. Furthermore, conversely, the airbag assemblies 21 and 800 can be formed according to the process described for airbag assembly 1200. Moreover, the airbag assembly 1200 and the flexible electronic assembly 12 can perform any of the functions described for airbag assemblies 21 and 800.
[0063] Figure 13 This is a flowchart of the manufacturing of footwear articles in an example embodiment. It should be recognized and understood that portions of the flowchart can be performed to manufacture airbag components, such as airbag components 21, 800, and 1200 disclosed herein, without considering the integration of the airbag components into the footwear articles.
[0064] At 1300, an electrical conductor is disposed on at least one of the first sheet or the second sheet. In one example, disposing of the electrical conductor includes disposing the electrical conductor on the inner surface of the respective first or second sheet.
[0065] At 1302, capacitor electrodes are disposed on the outer surfaces of the first and second sheets or on the inner surfaces of the first and second sheets. In one example, disposing of capacitor electrodes includes disposing capacitor electrodes to form capacitor electrode pairs, one capacitor electrode in each pair being on the first sheet and the other capacitor electrode in each pair being on the second sheet, opposite to the other electrode in the pair, wherein a change in the electrical characteristics of a pair of capacitor electrodes indicates a change in the compression of the airbag assembly.
[0066] In step 1304, a seal is formed around the periphery of the first sheet, the second sheet, and the electronic component to form an airbag assembly. The electronic component includes a circuit board and electrical conductors disposed on the circuit board. An inner portion of the electronic component is disposed within the seal formed between and therebetween the first and second sheets, while an outer portion of the electronic component is disposed outside the seal. In one example, the circuit board is a flexible circuit board that forms through-holes, and forming the seal includes bonding the first and second sheets together through the through-holes. In one example, forming the seal includes forming folds in each of the first and second sheets near the through-holes at the edges of the first and second sheets, and electrical conductors disposed on the first and second sheets surround the folds to make electrical contact with electrical conductors on the electronic component. In one example, the electronic component extends between the first and second sheets, and forming the seal extends across the electronic component between the first and second sheets. In one example, forming the seal includes forming a solder joint. In one example, forming the seal includes placing electrical conductors of the electronic component on the outer portion.
[0067] In one example, forming a seal includes placing active electronics configured to receive signals from capacitive electrodes within an internal portion. In one example, the active electronics are configured to process the signals received from the capacitive electrodes and identify the condition of the airbag based on those signals. In one example, the active electronics are configured to transmit signals to a remote device.
[0068] In one example, forming a seal includes completely housing the electronic components within the airbag assembly. In one example, the electronic components include active electronics configured to receive signals from capacitive electrodes. In one example, the electronic components include active electronics configured to receive signals from capacitive electrodes. In one example, the active electronics are configured to wirelessly transmit data indicating a signal to a remote device.
[0069] In 1306, an electrical conductor disposed on a circuit board is electrically coupled to a corresponding one of an electrical conductor disposed on a first or second sheet. In one example, disposing of the electrical conductor includes disposing the electrical conductor on the outer surface of the corresponding one of the first or second sheets.
[0070] At 1308, the capacitor electrode is electrically coupled to an electrical conductor disposed on the first and second sheets and an electrical conductor on the circuit board.
[0071] In 1310, the airbag assembly is positioned in the outsole at the bottom of the footwear.
[0072] In 1312, the lower part is fixed to the upper part of the footwear.
[0073] Example
[0074] Example 1 is a footwear article comprising: an upper part; a lower part attached to the upper part, including an outsole and an air bladder assembly, wherein the air bladder assembly includes: a first sheet and a second sheet, forming a seal therebetween around the periphery of the first and second sheets; and an electronic component including a circuit board and an electrical conductor disposed on the circuit board, wherein an internal portion of the electronic component is disposed within the seal formed therebetween between the first and second sheets, and an external portion of the electronic component is disposed outside the seal.
[0075] In Example 2, the subject matter of Example 1 includes an airbag assembly further comprising an electrical conductor disposed on at least one of the first sheet or the second sheet, wherein an electrical conductor disposed on a circuit board is electrically coupled to a corresponding one of the electrical conductors disposed on the first or the second sheet.
[0076] In Example 3, the subject of Examples 1-2 includes an electrical conductor disposed on the outer surface of one of the first and second sheets.
[0077] In Example 4, the subject matter of Examples 2-3 includes an airbag assembly further comprising a capacitor electrode disposed on the outer surfaces of the first and second sheets and electrically coupled to an electrical conductor disposed on the first and second sheets and an electrical conductor on a circuit board.
[0078] In Example 5, the subject matter of Examples 3-4 includes a pair of capacitor electrodes, one capacitor electrode in each pair being on a first sheet and the other capacitor electrode in each pair being on a second sheet, opposite to the other electrode in the pair, wherein a change in the electrical properties of a pair of capacitor electrodes indicates a change in the compression of the airbag assembly.
[0079] In Example 6, the subject matter of Examples 2-5 includes a circuit board that is a flexible circuit board, wherein the flexible circuit board forms through-holes, and wherein the first and second sheets are bonded to each other through the through-holes.
[0080] In Example 7, the subject matter of Examples 5-6 includes a fold formed at a through-hole near the edge of both the first and second sheets, and wherein an electrical conductor disposed on the first and second sheets is wound around the fold to make electrical contact with an electrical conductor on an electronic component.
[0081] In Example 8, the subject matter of Examples 6-7 includes an electronic component extending between first and second sheets, and wherein a seal is formed between the first and second sheets, extending across the extent of the electronic component.
[0082] In Example 9, the subject of Examples 7-8 includes the sealing method of welding.
[0083] In Example 10, the subject matter of Examples 1-9 includes an electrical conductor disposed on the inner surface of one of the first and second sheets, and further includes a capacitor electrode disposed on the inner surface of the first and second sheets, the capacitor electrode being electrically coupled to the associated electrical conductor disposed on the first and second sheets.
[0084] In Example 11, the subject of Example 10 includes an external portion comprising an electrical conductor of an electronic component.
[0085] In Example 12, the subject of Examples 10-11 includes an internal portion comprising an active electronic device configured to receive a signal from a capacitor electrode.
[0086] In Example 13, the subject of Example 12 includes an active electronic device configured to process signals received from capacitive electrodes and identify the condition of the airbag based on the signals.
[0087] In Example 14, the subject of Examples 12-13 includes active electronic devices configured to transmit signals to a remote device.
[0088] In Example 15, the subject of Examples 9-14 includes an electronic component that is fully housed within the airbag assembly.
[0089] In Example 16, the subject of Example 15 includes an electronic component comprising an active electronic device configured to receive a signal from a capacitor electrode.
[0090] In Example 17, the subject of Example 16 includes an electronic component comprising an active electronic device configured to receive signals from a capacitor electrode.
[0091] In Example 18, the subject of Example 17 includes an active electronic device configured to wirelessly transmit data of an indication signal to a remote device.
[0092] Example 19 is a method of manufacturing a footwear article, comprising: forming a seal around the periphery of a first sheet, a second sheet, and an electronic component to form an airbag assembly, the electronic component including a circuit board and an electrical conductor disposed on the circuit board, wherein an inner portion of the electronic component is disposed within the seal formed between and between the first and second sheets, and an outer portion of the electronic component is disposed outside the seal; positioning the airbag assembly in the outsole of a lower portion of the footwear article; and securing the lower portion to an upper portion of the footwear article.
[0093] In Example 20, the subject matter of Example 19 includes: placing an electrical conductor on at least one of a first sheet or a second sheet; and electrically coupling an electrical conductor disposed on a circuit board to a related one of the electrical conductors disposed on the first or second sheet.
[0094] In Example 21, the subject of Example 20 includes, wherein setting an electrical conductor includes setting the electrical conductor on the outer surface of one of the first and second sheets.
[0095] In Example 22, the subject matter of Example 21 includes disposing capacitor electrodes on the outer surfaces of first and second sheets; and electrically coupling the capacitor electrodes to electrical conductors disposed on the first and second sheets and electrical conductors on a circuit board.
[0096] In Example 23, the subject matter of Example 22 includes, wherein setting the capacitor electrodes includes setting the capacitor electrodes to form a pair of capacitor electrodes, one capacitor electrode in each pair is on a first sheet, and the other capacitor electrode in each pair is on a second sheet, opposite to the other electrode in the pair, wherein a change in the electrical characteristics of a pair of capacitor electrodes indicates a change in the compression of the airbag assembly.
[0097] In Example 24, the subject matter of Examples 12-23 includes a circuit board that is a flexible circuit board, wherein the flexible circuit board forms through-holes, and wherein forming a seal includes bonding first and second sheets together through the through-holes.
[0098] In Example 25, the subject of Example 24 includes forming a fold at a through-hole in each of the first and second sheets near the edge of the first and second sheets, and wherein an electrical conductor disposed on the first and second sheets is wound around the fold to make electrical contact with an electrical conductor on an electronic component.
[0099] In Example 26, the subject matter of Example 25 includes an electronic component extending between the first and second sheets, and wherein a seal is formed between the first and second sheets, extending across the extent of the electronic component.
[0100] In Example 27, the subject of Example 26 includes forming a seal, wherein forming a seal includes forming a weld.
[0101] In Example 28, the subject matter of Examples 19-27 includes, wherein setting an electrical conductor includes setting the electrical conductor on the inner surface of an associated one of the first and second sheets, and further includes: setting a capacitor electrode on the inner surface of the first and second sheets, the capacitor electrode being electrically coupled to the associated electrical conductor set on the first and second sheets.
[0102] In Example 29, the subject of Example 28 includes forming a seal by placing an electrical conductor of an electronic component on an external portion.
[0103] In Example 30, the subject of Examples 28-29 includes, wherein forming a seal includes placing an active electronic device configured to receive a signal from a capacitor electrode in an inner portion.
[0104] In Example 31, the subject of Example 30 includes an active electronic device configured to process signals received from capacitive electrodes and identify the condition of the airbag based on the signals.
[0105] In Example 32, the subject of Examples 30-31 includes active electronic devices configured to transmit signals to a remote device.
[0106] In Example 33, the subject of Example 32 includes forming a seal by completely housing the electronic components within the airbag assembly.
[0107] In Example 34, the subject of Example 33 includes an electronic component comprising an active electronic device configured to receive a signal from a capacitor electrode.
[0108] In Example 35, the subject of Example 34 includes an electronic component comprising an active electronic device configured to receive a signal from a capacitor electrode.
[0109] In Example 36, the subject of Example 35 includes an active electronic device configured to wirelessly transmit data of an indication signal to a remote device.
[0110] Example 37 is a system that includes any one or more of the footwear items and remote devices from Examples 1-18.
[0111] Example 38 is any one or more airbag components from Examples 1-18.
[0112] Example 39 is a method of manufacturing an airbag assembly as described in any one or more of Examples 19-36.
[0113] Example 40 is a method for using any one or more footwear items from Examples 1-18 or the system from Example 37.
[0114] Throughout this specification, multiple examples can implement components, operations, or structures described as a single example. Although the individual operations of one or more methods are shown and described as separate operations, one or more separate operations may be performed concurrently, and the operations are not required to be performed in the order shown. Structures and functions presented as separate components in the example configurations can be implemented as combined structures or components. Similarly, structures and functions presented as single components can be implemented as separate components. These and other variations, modifications, additions, and improvements fall within the scope of this document's subject matter.
[0115] Some embodiments are described herein as including logic or multiple components, modules, or mechanisms. A module can constitute a software module (e.g., code contained on a machine-readable medium or in transmitted signals) or a hardware module. A “hardware module” is a tangible unit capable of performing a particular operation and can be configured or arranged in a particular physical manner. In various example embodiments, one or more computer systems (e.g., standalone computer systems, client computer systems, or server computer systems) or one or more hardware modules (e.g., processors or a group of processors) of a computer system can be configured as hardware modules by software (e.g., an application or application portion) that operates to perform certain operations described herein.
[0116] In some embodiments, the hardware module may be implemented mechanically, electronically, or any suitable combination thereof. For example, the hardware module may include dedicated circuitry or logic permanently configured to perform certain operations. For example, the hardware module may be a dedicated processor, such as a field-programmable gate array (FPGA) or an ASIC. The hardware module may also include programmable logic or circuitry temporarily configured by software to perform certain operations. For example, the hardware module may include software contained in a general-purpose processor or other programmable processor. It should be understood that the decision to implement the hardware module mechanically, in dedicated and permanently configured circuitry, or in temporarily configured circuitry (e.g., configured by software) may be driven by cost and time considerations.
[0117] Therefore, the phrase "hardware module" should be understood to include tangible entities, i.e., physically constructed, permanently configured (e.g., hardwired) or temporarily configured (e.g., programmed) entities that operate or perform certain operations described herein in a certain way. As used herein, "hardware-implemented module" refers to a hardware module. Consider embodiments in which hardware modules are temporarily configured (e.g., programmed), and each hardware module does not need to be configured or instantiated at any given time. For example, in cases where the hardware modules include a general-purpose processor configured by software as a dedicated processor, the general-purpose processor can be configured at different times as distinct dedicated processors (e.g., including different hardware modules). The software can configure the processor accordingly, for example, constituting a specific hardware module at one time and different hardware modules at different times.
[0118] Hardware modules can provide information to and receive information from other hardware modules. Therefore, the described hardware modules can be considered communication-coupled. In the presence of multiple hardware modules simultaneously, communication can be achieved through signal transmission between two or more hardware modules (e.g., via appropriate circuitry and buses). In embodiments where multiple hardware modules are configured or exemplified at different times, such communication between hardware modules can be achieved, for example, by storing and retrieving information in a memory structure accessible to the multiple hardware modules. For example, one hardware module can perform an operation and store the output of that operation in its communication-coupled memory device. Another hardware module can then access the storage device at a later time to retrieve and process the stored output. Hardware modules can also initiate communication with input or output devices and can operate on resources (e.g., sets of information).
[0119] The various operations of the example methods described herein can be performed, at least in part, by one or more processors, which may be temporarily configured (e.g., by software) or permanently configured to perform the relevant operations. Whether temporarily or permanently configured, such processors can constitute processor-implemented modules for performing one or more of the operations or functions described herein. As used herein, "processor-implemented module" refers to a hardware module implemented using one or more processors.
[0120] Similarly, the methods described herein can be implemented at least in part by a processor, which is an example of hardware. For example, at least some operations of the methods can be performed by one or more processors or modules implemented by processors. Furthermore, one or more processors can operate to support the performance of related operations in a “cloud computing” environment or as “Software as a Service” (SaaS). For example, at least some operations can be performed by a set of computers (as an example of a machine including processors), which can be accessed via a network (e.g., the Internet) and via one or more appropriate interfaces (e.g., application programming interfaces (APIs)).
[0121] The performance of certain operations can be distributed across one or more processors, residing not only on a single machine but also deployed across multiple machines. In some example embodiments, one or more processors or processor-implemented modules may reside in a single geographic location (e.g., within a home environment, office environment, or server cluster). In other example embodiments, one or more processors or processor-implemented modules may be distributed across multiple geographic locations.
[0122] Some portions of this specification are presented based on algorithms or symbolic representations of operations on data stored as bits or binary digital signals in machine memory (e.g., computer memory). These algorithms or symbolic representations are examples of techniques used by those skilled in the art of data processing to communicate the substance of their work to others skilled in the art. As used herein, an "algorithm" is a self-consistent sequence of operations or similar processing that leads to a desired result. In this context, algorithms and operations involve the physical manipulation of physical quantities. Typically, but not necessarily, these quantities may take the form of electrical, magnetic, or optical signals that can be stored, accessed, transmitted, combined, compared, or otherwise manipulated by a machine. Primarily for general reasons, it is sometimes convenient to use terms such as "data," "content," "bit," "value," "element," "symbol," "character," "term," "quantity," and "number" to refer to such signals. However, these terms are merely convenient labels and will be associated with appropriate physical quantities.
[0123] Unless otherwise stated, discussions herein using terms such as “processing,” “computing,” “determining,” “presenting,” and “displaying” can refer to the actions or processes of a machine (e.g., a computer) that manipulates or transforms data represented as physical (e.g., electronic, magnetic, or optical) quantities within one or more memories (e.g., volatile memory, non-volatile memory, or any suitable combination thereof), registers, or other machine components that receive, store, transmit, or display information. Furthermore, unless otherwise stated, the terms “a” or “an” are used herein to include one or more examples, as is common in patent literature. Finally, as used herein, the conjunction “or” means a non-exclusive “or” unless otherwise expressly stated.
Claims
1. A type of footwear, comprising: upper part; The lower part, fixed to the upper part, includes the outsole and the airbag assembly, wherein the airbag assembly includes: A first sheet and a second sheet, forming a seal between them around the periphery of the first and second sheets; An electronic component includes a circuit board and electrical conductors disposed on the circuit board, wherein an internal portion of the electronic component is disposed within a seal formed between and between first and second sheets, and an external portion of the electronic component is disposed outside the seal. The airbag assembly further includes an electrical conductor disposed on at least one of the first sheet or the second sheet, wherein the electrical conductor disposed on the circuit board is electrically coupled to a corresponding one of the electrical conductors disposed on the first or second sheet. The electrical conductor is disposed on the outer surface of one of the first and second sheets. The circuit board is a flexible circuit board, wherein the flexible circuit board forms through holes, and wherein the first and second sheets are joined together through the through holes. The first and second sheets each have folds formed at through-holes near their edges, and electrical conductors disposed on the first and second sheets are wound around the folds to make electrical contact with electrical conductors on the electronic component.
2. The footwear article as described in claim 1, wherein, The airbag assembly also includes capacitor electrodes disposed on the outer surfaces of the first and second sheets and electrically coupled to electrical conductors disposed on the first and second sheets and electrical conductors on the circuit board.
3. The footwear article as described in claim 1, wherein, The capacitor electrodes form capacitor electrode pairs, with one capacitor electrode in each pair on the first sheet and the other capacitor electrode in each pair on the second sheet, opposite to the other electrode in the pair, wherein a change in the electrical characteristics of a pair of capacitor electrodes indicates a change in the compression of the airbag assembly.
4. The footwear article as described in claim 1, wherein, The electronic component extends between the first and second sheets, and the seal is formed between the first and second sheets, extending beyond the extent of the electronic component.
5. The footwear article as described in claim 1, wherein, The seal is welded.
6. The footwear article as described in claim 1, wherein, The external portion includes the electrical conductors of the electronic components.
7. The footwear article as described in claim 1, wherein, The internal portion includes active electronic devices configured to receive signals from the capacitor electrodes.
8. The footwear article as described in claim 7, wherein, The active electronic device is configured to process signals received from the capacitor electrodes and identify the condition of the airbag based on the signals.
9. The footwear article as described in claim 7, wherein, The active electronic device is configured to transmit the signal to a remote device.
10. The footwear article as claimed in claim 9, wherein, The active electronic device is configured to wirelessly transmit data indicating the signal to a remote device.
11. A method for manufacturing footwear, comprising: A seal is formed around the first sheet, the second sheet, and the periphery of the electronic component to form an airbag assembly. The electronic component includes a circuit board and an electrical conductor disposed on the circuit board. An internal portion of the electronic component is disposed within the seal formed between and between the first and second sheets, and an external portion of the electronic component is disposed outside the seal. Position the airbag assembly in the lower part of the outsole of the footwear; Secure the lower part to the upper part of the footwear; An electrical conductor is disposed on at least one of the first sheet or the second sheet; as well as An electrical conductor disposed on the circuit board is electrically coupled to a relevant one of the electrical conductors disposed on the first or second sheet. The provision of the electrical conductor includes placing the electrical conductor on the outer surface of one of the first and second sheets. Wherein, the circuit board is a flexible circuit board, wherein the flexible circuit board forms through holes, and wherein forming the seal includes bonding the first and second sheets together through the through holes, and The method of manufacturing footwear further includes forming a fold at a through-hole near the edge of each of the first and second sheets, wherein an electrical conductor disposed on the first and second sheets is wound around the fold to make electrical contact with an electrical conductor on the electronic component.
12. The method of claim 11, further comprising: Capacitor electrodes are disposed on the outer surfaces of the first and second sheets; as well as The capacitor electrodes are electrically coupled to electrical conductors disposed on the first and second sheets and electrical conductors on the circuit board.
13. The method of claim 12, wherein, Setting the capacitor electrodes includes setting capacitor electrodes to form capacitor electrode pairs, one capacitor electrode in each pair being on the first sheet and the other capacitor electrode in each pair being on the second sheet, opposite to the other electrode in the pair, wherein a change in the electrical characteristics of a pair of capacitor electrodes indicates a change in the compression of the airbag assembly.
14. The method of claim 11, wherein, The electronic component extends between the first and second sheets, and the seal is formed between the first and second sheets, extending beyond the range of the electronic component.
15. The method of claim 14, wherein, Forming the seal includes forming a weld.
16. The method of claim 11, wherein, Forming the seal involves placing the electrical conductors of the electronic component on the outer portion.
17. The method of claim 11, wherein, Forming the seal involves placing an active electronic device configured to receive signals from the capacitor electrodes within the internal portion.
18. The method of claim 17, wherein, The active electronic device is configured to process signals received from the capacitor electrodes and identify the condition of the airbag based on the signals.
19. The method of claim 17, wherein, The active electronic device is configured to transmit the signal to a remote device.
20. The method of claim 19, wherein, The active electronic device is configured to wirelessly transmit data indicating the signal to a remote device.
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