Method, system and apparatus for fine-pitch high-speed connector connection

Abstract

An apparatus, system, and method capable of providing high precision connections between a plurality of pins of a form factor pluggable (CFP) and connection pads of a printed circuit board (PCB). The apparatus, system, and method include a connector mask adapted to receive a body of the CFP therein, a scale adapted to receive the connector mask therein and sized and shaped for direct physical association with the PCB around the connection pads, and an adjustment mechanism at least partially through the scale to contact at least the connector mask and capable of adjusting a position of the pins relative to the connection pads.

Description

[0001] Cross-reference to related applications

[0002] This international application claims priority to U.S. Application No. 16 / 867,236, filed May 5, 2020, entitled "Methods, Systems and Apparatus for Fine-Pitch High-Speed ​​Connector Connections," the entire contents of which are incorporated herein by reference as if their entire contents were set forth. Background Technology Technical Field

[0004] This disclosure relates to high-speed connectivity, and more specifically to apparatus, systems, and methods for finely pitched high-speed connector attachments.

[0005] Background Information

[0006] Form-factor pluggable (CFP) packages are a common type of connection used for high-speed digital signal transmission. As examples, CFP, CFP2, CFP4, or CFP8 (typically, "CFPx" connectors) are widely used in high-speed optical pluggable modules to connect to the motherboard in high-speed (i.e., 100Gbps, 200Gbps, 400Gbps, 600Gbps and higher) optical communications.

[0007] Therefore, some pins of the CFPx connector typically provide high-speed RF signal connections between the CFPx module and the motherboard. Consequently, misalignment between the fine-pitch connector pins and the pads on the module PCB can lead to signal integrity issues and / or module failure due to back reflection and signal loss.

[0008] Therefore, precise interconnects are critical for the mass production of 100Gbps, 200Gbps, 400Gbps, and higher-speed optical transceivers. Without the necessary precision, achieving 10×10G, 4×25G, 8×25G, or 8×50G channel rates between the optical transceiver module and the main PCB is virtually impossible. As mentioned above, this is because any misalignment between the connector pins and the pads on the module PCB leads to RF insertion loss, back reflection, crosstalk, and consequently, module failure.

[0009] Therefore, there is a need for an improved device, system, and method for providing high-precision connections. Summary of the Invention

[0010] This disclosure includes, and comprises, an apparatus, system, and method capable of providing high-precision connections between multiple pins of a form factor package (CFP) and connection pads of a printed circuit board (PCB). The apparatus, system, and method include: a connector mask adapted to receive a body of the CFP therein; a scale adapted to receive the connector mask therein, the scale being sized and shaped for direct physical association with the PCB around the connection pads; and an adjustment mechanism at least partially passing through the scale to contact at least the connector mask and capable of adjusting the position of the pins relative to the connection pads.

[0011] Therefore, the disclosed embodiments provide an improved apparatus, system, and method for providing high-precision connections. Attached Figure Description

[0012] The disclosed non-limiting embodiments are discussed in conjunction with the accompanying drawings, which form part of the invention, wherein like reference numerals denote like elements, and wherein:

[0013] Figure 1 The CFPx connector and its retainer are shown;

[0014] Figure 2 This illustrates the association between the CFPx connector and the printed circuit board (PCB) on the PCB panel;

[0015] Figure 3A The pinout of a CFPx connector is shown, along with a type of PCB pin receiver;

[0016] Figure 3B The pinout of a CFPx connector is shown, along with a type of PCB pin receiver;

[0017] Figure 4 The PCB pin receiver pads are shown;

[0018] Figure 5 The misaligned CFPx pins and PCB receiver pads are shown.

[0019] Figure 6 The intended alignment of the CFPx pins and PCB receiver pads is shown;

[0020] Figure 7 The intended alignment of the CFPx pins and PCB receiver pads is shown;

[0021] Figure 8 The intended alignment of the CFPx pins and PCB receiver pads is shown;

[0022] Figure 9This demonstrates various aspects of the high-precision connection and fixing device;

[0023] Figure 10 This demonstrates various aspects of the high-precision connection and fixing device;

[0024] Figure 11 This demonstrates various aspects of the high-precision connection and fixing device;

[0025] Figure 12 This demonstrates various aspects of the high-precision connection and fixing device;

[0026] Figure 13 This demonstrates various aspects of the high-precision connection and fixing device; and

[0027] Figure 14 The various aspects of the high-precision connection and fixing device are shown. Detailed Implementation

[0028] The accompanying drawings and descriptions provided herein may have been simplified to illustrate aspects relevant to a clear understanding of the apparatuses, systems, and methods described herein, while other aspects that may be found in typical similar apparatuses, systems, and methods have been omitted for clarity. Those skilled in the art will recognize that other elements and / or operations may be desired and / or necessary for implementing the apparatuses, systems, and methods described herein. However, because such elements and operations are well known in the art and do not contribute to a better understanding of this disclosure, a discussion of such elements and operations may not be provided herein. Nevertheless, this disclosure is intended to inherently include all such elements, variations, and modifications to the described aspects that will be known to those skilled in the art.

[0029] Implementations are provided throughout this disclosure to make it thorough and fully convey the scope of the disclosed embodiments to those skilled in the art. Numerous specific details, such as examples of specific components, apparatuses, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. However, it will be apparent to those skilled in the art that certain specific details of the disclosure are not required and that these embodiments may be implemented in different forms. Therefore, these embodiments should not be construed as limiting the scope of this disclosure.

[0030] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. For example, as used herein, the singular form may also be intended to include the plural form unless the context clearly indicates otherwise. The terms “comprising,” “including,” “containing,” and “having” are inclusive and thus specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless expressly determined as a sequence of execution, the method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown. It should also be understood that additional or alternative steps may be employed.

[0031] When an element or layer is referred to as being “on,” “joined to,” “connected to,” or “linked to” another element or layer, it may be directly on, directly joined to, directly connected to, or directly linked to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as being “directly on,” “directly joined to,” “directly connected to,” or “directly linked to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0032] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another. That is, unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms do not imply order or sequence when used herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0033] There are various methods to produce the precise connections described above for CFPx connectors. One method is to have, for example... Figure 1 The CFPx connector retainer 10 shown partially forms a CFPx connector retainer 14 to hold the CFPx connector 12. The retainer can then be attached to a PCB board, for example, for reflow.

[0034] Figure 2A fixing device is shown with a CFPx connector 12 connected to a PCB panel 20 using a retainer 10. Clearly, in a typical process, the connector 10 cannot be adjusted relative to the PCB board 20a to which it is connected; in other words, the CFPx connector pins 12a cannot be adjusted to properly align with the PCB pad connectors 26. However, in a typical connection process, without such adjustment, the dimensional tolerance control of the PCB by the PCB supplier and the tolerances of the CFPx connector cannot ensure proper pin alignment relative to the pads.

[0035] Figure 3 illustrates a CFPx connector 12 and a PCB connector 26. The CFPx connector 12 shown has a male connector 12a, whose female mating side 26a connects to the module PCB. The connector 12 is typically a molded polymer structure with plated metal contact inserts 12a. In this embodiment, the contact pitch is 0.6 mm, and there are 104 contacts, with 52 pins on the top side of the connector 12 and 52 pins on the bottom side, for connection to the top and bottom pads 26a of the module PCB (also as shown). Figure 2 (As shown).

[0036] Figure 4 Module board 20a is shown. As an example, module PCB 20a can have a width of 32.25mm with a tolerance of + / -0.10mm, and the edge pads can have a positional tolerance of 0.075mm from the edge. However, leading PCB suppliers typically only meet a tolerance of 0.10mm, and some are only able to meet 0.15mm. However, the positional tolerance of pad 26 and the dimensional tolerance of the PCB size affect the connector pins (…). Figure 4 (Not shown in the diagram) Alignment with the pads has a significant impact. Table 1 summarizes exemplary tolerance analyses for CFP MSA recommendations based on specific connector size specifications and CFP MSA recommendations based on module PCB specifications.

[0037] Furthermore, Table 1 summarizes the alignment tolerances between the exemplary CFP2 connector and the exemplary CFP2 PCB pads, with specifications recommended by the MSA and CFP2 connector suppliers. As shown in the figure, passively placing the CFP2 connector onto the CFPPCB results in a 100% overhang of the connector pins relative to the pads on the PCB. Needless to say, this result is highly undesirable for CFP2 assembly.

[0038]

[0039]

[0040] Table 1

[0041] In the worst-case scenario described above, CFP2 connector pin 12a is 100% dangling over PCB pad 26a, which... Figure 5 This is illustrated schematically. Such overhang will cause poor connectivity for most pins 12a, and may therefore lead to module failure. Assuming that the PCB manufacturer's manufacturing tolerances typically do not meet MSA recommendations, this could result in even worse alignment. Figure 6 As shown, CFP2 connector pin 12a may be completely misaligned with PCB pad 26a, resulting in an open circuit between CFP2 connector pin 12a and CFP2 module pad 26a. After soldering, this will cause a short circuit between the pins.

[0042] Furthermore, CFP2 PCB suppliers typically cannot guarantee that the positional error of the pads relative to the PCB edge is within + / - 0.05 mm. This can result in alignment errors of up to 0.375 mm under passive placement, or separation of the CFP2 connector pins from the CFP2 PCB pads, i.e., an open circuit. Figure 7 The CFP2 connector pin 12a is shown well aligned with the PCB pad 26a. Conversely, Figure 8 The photograph shows that the CFP2 connector was not aligned with the PCB pads after reflow attachment, with a droop of up to 90%.

[0043] Under a microscope, a slight improvement in connector-PCB alignment can be achieved; however, when the aligned component is returned to the SMT reflow, connector pins may still slip or detach from the solder pads due to the lack of any mechanism to hold the connector in place after alignment. Furthermore, alignment is so sensitive that it is extremely time-consuming, making it undesirable for any mass production, especially on an SMT reflow line where each step occurs in seconds or less.

[0044] Another anticipated solution is to tighten the specifications for CFP2 connectors and PCB dimensions. In this case, building tightly defined PCB dimensions is very expensive, as is building CFP2 connectors. This increased cost not only raises module costs but also significantly reduces the number of alternative suppliers, creating significant problems in the supply chain.

[0045] Therefore, in summary: CFPx connectors and CFPx module PCBs cannot be passively placed due to their typical specifications; misalignment between fine-pitch pin CFPx connectors and the PCB leads to high costs and timing inefficiencies; increasing tolerances is too inefficient to achieve optimal alignment of connector pins with PCB pads; passive alignment fixation results in low throughput; micro-alignment is very time-consuming and can slip after alignment; and any materials used for alignment fixation devices for CFPx connectors must withstand reflow temperatures. Therefore, a tool, method, mechanism, and system are needed to align fine-pitch pin connectors with CFPx module PCBs and hold the connectors in place during SMT reflow.

[0046] The implementation provides a fixing device, namely a connector mask (retainer) 900, to hold the CFPx connector 12 in place; a second fixing device, also referred to herein as a scale 902, for connection to the PCB 20a; and a mechanism 904 for adjusting the connector mask 900 to hold the CFPx connector 12 relative to the PCB 20a during connection. More specifically, Figure 9 A connector mask holder 900 is shown that holds the CFPx connector 12 near the PCB 20a for connection, and a scale 902 with an adjustment mechanism 904 including an adjustment screw 904a abutting a plate 904b and a spring 904b to hold the connector mask 900 in which the CFPx connector 12 is located in place and to allow the position of the CFPx connector 12 relative to the PCB 20a to be adjusted.

[0047] The scale 902 can be positioned on the PCB panel to ultimately receive the CFPx connector to the PCB panel at the desired connection location. The scale 902 can be held in place at least partially by various connectors, such as retaining screws, springs, etc., which hold the scale in place and / or may additionally allow actuation of the scale's position relative to the PCB.

[0048] although Figure 9 The illustrations include an adjustable mechanism in the form of a plate / spring and a dial to maintain alignment during processing; however, those skilled in the art will understand that other forms of adjustable mechanisms, such as cams, flexible clamps, etc., can be used. Furthermore, the connector mask and scale can be any suitable structure to impart any necessary rigidity or flexibility, although lightweight nonconductors are preferred, such as rubber, plastics, etc.

[0049] Figure 10This is an exploded view of the CFPx connector fixing device 1000, including alignment and connection. The CFPx connector 12, the connector mask 900 inserted into the scale 902, the position holder 1002 for holding the scale 902 in place, and at least one adjustment mechanism 904 are also shown.

[0050] Figure 11 This is a front perspective view of the fixing device design 1000. It shows the mask 900 held in place by at least a spring-loaded pusher 904. Notably, by adjusting the adjustable portion of the adjustment mechanism 904 associated with the scale 902—specifically, the screw 904 on the side of the scale 902 in the illustrated embodiment and the associated spring 904b—the CFPx connector pins of the connector 12 within the mask 900 are... Figure 11 (Not shown in the image) can be aligned with the CFPx pads on PCB 20a.

[0051] Figure 12 This is a photographic illustration of the scale on the PCB at the location of the connecting pads. The image also clearly shows the two scale support screws and the wing screw friction-engaged mask.

[0052] Figure 13 Another embodiment of the CFPx alignment fixture 1300 is shown. The illustration includes a scale 1302, a mask 1304, multiple spacers, retaining pins and screws, an adjusting spring 1306 adjusted by screw 1308, a support screw 1310 clamping the mask 1304 within the scale 1302, and two spring-loaded balls 1312 that hold the fixture to the PCB panel, instead of the two screws described above holding the scale to the PCB. Furthermore, replacing the two screws detailed above with spring-loaded balls 1312 improves ease of operation and saves assembly time in the SMT process flow.

[0053] In an exemplary process for attaching a mounting device to a substrate, a CFPx connector may first be placed within a CFPx connector alignment mounting device. The mounting device, in which the CFPx connector is located, is then placed on a PCB panel. By adjusting the side screws on the alignment mounting device, the CFPx connector pins are aligned with the connection pads on the PCB.

[0054] The PCB is then reflowed, while the alignment retainer holds the CFPx connector in place for precise alignment with the PCB pads. Afterward, the alignment retainer can be removed from the reflowed PCBA by loosening the screws.

[0055] Alternatively, each panel 20 may include multiple CFPx PCBs 20a. Therefore, as... Figure 14As shown, a plurality of alignment and fixing devices consisting of a mask 900 and a ruler 902 can be used to hold and align each CFPx connector 12 to its corresponding PCB 20a.

[0056] In the above detailed description, for the sake of brevity, various features may be combined in various embodiments. This approach to disclosure should not be construed as reflecting an intention that any subsequently claimed embodiment requires more features than those explicitly stated.

[0057] Furthermore, this disclosure is provided to enable any person skilled in the art to make or use the disclosed embodiments. Various modifications to this disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to limit itself to the embodiments and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0058] As can be seen from the above detailed description, various features have been grouped together in a single embodiment for the sake of clarity and brevity. This approach of the present disclosure should not be construed as reflecting an intention that an embodiment requires more features than explicitly described herein. Rather, this disclosure will cover all variations and modifications to the disclosed embodiments that will be understood by those skilled in the art based on this disclosure.

Claims

1. A fixing device that provides high-precision connections between multiple pins of a CFP (Category Package Pluggable) and connection pads of a printed circuit board (PCB), the fixing device comprising: A connector mask adapted to receive therein the form-factor packaged pluggable body; A ruler adapted to receive the connector mask therein, and the size and shape of the ruler are configured for direct physical association with the printed circuit board around the connection pads; as well as An adjustment mechanism, which at least partially extends through the scale, is used to contact at least the connector mask and is capable of adjusting the position of the pins relative to the connection pads.

2. The fixture of claim 1, wherein, The pluggable form factor is CFP2.

3. The fixture of claim 1, wherein, The printed circuit board is connected to the PCB panel.

4. The fixing device according to claim 3, wherein, The PCB panel includes multiple printed circuit boards.

5. The fixing device according to claim 1, wherein, The ruler is attached to the printed circuit board via multiple fixing screws.

6. The fixing device according to claim 1, wherein, The external package is pluggable and held within the connector mask by fixing screws.

7. The fixing device according to claim 1, wherein, The adjustment mechanism includes a rotating dial.

8. The fixing device according to claim 7, wherein, The rotating dial is associated with a spring surrounding it.

9. The fixing device according to claim 7, wherein, The rotating dial presses against the plate that is in contact with the connector mask.

10. The fixing device according to claim 1, wherein, The adjustment mechanism includes at least one of a cam and a flexible clamp.

11. The fixing device according to claim 1, wherein, The adjustment mechanism is provided at least in part by the components of the scale.

12. The fixing device according to claim 11, wherein, The scale is made of rubber.

13. The fixing device according to claim 1, wherein, The ruler is made of plastic.

14. The fixing device according to claim 1, wherein, The scale is made of non-conductive material.

15. The fixing device according to claim 1, wherein, The scale is made of lightweight materials.

16. The fixing device according to claim 1, wherein, The scale is made of rigid material.

17. The fixing device according to claim 1, wherein, The connector mask is made of either rubber or plastic.

18. The fixing device according to claim 1, wherein, The connector mask is made of non-conductive material.

19. The fixing device according to claim 1, wherein, The connector mask is made of flexible material.

20. The fixing device according to claim 1, wherein, The scale is connected to the printed circuit board via multiple spring-loaded balls.

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