Drive device with cooled terminal box

CN115668704BActive Publication Date: 2026-09-04SEW EURODRIVE GMBH & CO KG
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Patent Information

Application Number
CN202180035350.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-05-15
Filing Date
2021-04-28
Publication Date
2026-09-04
Estimated Expiration
2041-04-28

AI Technical Summary

Benefits of technology

[0015] In an advantageous design, the cover has cooling fins/heat sinks and/or cooling fingers on its surface, particularly on its outer surface. The advantage here is that improved heat dissipation can be achieved.

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Abstract

The invention relates to a drive device with a terminal box, wherein the terminal box has a lower part (1) and a cover part (2) connected to the lower part (1). A power module is arranged on a circuit board stack (22) and is connected to a cooling plate (20). Furthermore, the cooling plate (20) is connected to a holding part (21), which is arranged pressed against the cover part (2) by at least one spring part (51) supported on the lower part (1).
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Description

Background Technology

[0001] According to DE 103 28 228 B4, a drive device, particularly a compact drive device, is known as a converter motor with a speed reducer.

[0002] An electronic device with a power module is known from DE 10 2018 000 961 A1.

[0003] An electronic device having a circuit carrier in a plug-in housing is known from DE 10 2011 005 890 A1.

[0004] A semiconductor device is known from DE 10 2012 202 785 A1.

[0005] According to DE 102 39 512 A1, there is a device for housing electrical and control electronics for an electric motor.

[0006] A motor control device is known from DE 11 2007 002 019 T5.

[0007] A heat sink for a PC is known from US 2006 / 0 275 100 A1.

[0008] A power converter is known from US 2015 / 0 123 261 A1.

[0009] A cooling device is known from US 2013 / 0 250 523 A1. Summary of the Invention

[0010] Therefore, the object of the present invention is to provide a simple manufacturing method for the drive device.

[0011] In drive devices with junction boxes, particularly compact drive devices, an important feature of the present invention is that the junction box has a lower part and a cover connected to the lower part, wherein the power module, particularly the heat-generating power module, is connected to a cooling plate, wherein the cooling plate is connected to a retainer, wherein the retainer is arranged to press against the cover, particularly toward the inside of the cover, by at least one spring / elastic member supported on the lower part.

[0012] The advantage here is that the power module, along with the cooling plate, can be configured as a pre-assembled unit. Therefore, the cover is removable, and despite this, the power module is still held by a retainer to which the cooling plate is also connected. In this way—especially after the cover is removed—simple manufacturing can be implemented, particularly for wiring inside the junction box. Through pre-assembly, the power module is also held by a retainer fixed to the lower component. This ensures a robust structure. Furthermore, the retainer form-lockingly surrounds the circuit board stack to which the power module is connected. In this way, the electronic components mounted on the circuit board stack are also arranged protectively.

[0013] In an advantageous design, the power module is mounted on a first circuit board of a circuit board stack, wherein the circuit board stack has at least one second circuit board parallel to the first circuit board. The advantage here is that it enables simple manufacturing.

[0014] In an advantageous design, the first and second circuit boards are connected at least by means of pins that pass through and are soldered to the circuit boards. The advantage here is that simple manufacturing is achievable.

[0015] In an advantageous design, the cover has cooling fins / heat sinks and / or cooling fingers on its surface, particularly on its outer surface. The advantage here is that improved heat dissipation can be achieved.

[0016] In an advantageous design, the retainer has a notch through which the power module passes, particularly toward the cooling plate. The advantage here is improved heat dissipation. Because the cooling plate can be made of a thermally conductive material for the retainer, it is possible to directly transfer heat generated by the power module, i.e., without indirect transfer through the retainer. Therefore, the retainer can then be made of a material with greater load-bearing capacity than the cooling plate.

[0017] In an advantageous design, the first circuit board is positioned on the side of the retainer facing away from the cooling plate. The advantage here is that the retainer is positioned in the middle, and thus the power module is spaced apart from the retainer within the notch. Therefore, it is able to absorb thermal expansion.

[0018] In an advantageous design, the cooling plate covers, shields, and / or seals the notch. The advantage here is that it extends further in the lateral direction to the stacking direction of the circuit board stack than in the direction parallel to the stacking direction.

[0019] In an advantageous design, the spring is positioned between the retainer and the lower component. The advantage here is that the spring can be supported on the lower component, and the retainer can be loaded with the spring force generated by the spring towards the cover, i.e., away from the lower component. That is, the spring is pre-tensioned within the junction box between the retainer and the lower component.

[0020] In a favorable design, the movement of the retaining element is guided by a guide element. The advantage of this is that it enables robust operation.

[0021] In an advantageous design, the movement of the retaining element is limited by a limiting element. The advantage here is that the pre-assembled units can be held together by means of the retaining mechanism, because the retaining mechanism is held on the lower part by the limiting element, meaning it cannot be moved further from the lower part than predetermined by the limiting element.

[0022] In a favorable design, the sleeve is used as a guide. The advantage here is that the spring element can move back and forth along the sleeve.

[0023] In an advantageous design, a screw with a screw head, screwed into a threaded hole in the lower component, or a bolt inserted into or screwed into a hole in the lower component, together with a nut screwed onto the threaded area of ​​the bolt, serves as a limiting element. The advantage here is that simple and cost-effective manufacturing can be achieved. In particular, very inexpensive components can be used.

[0024] In an advantageous design, the spring element, particularly a spring element designed as a ring spring, is fitted onto a sleeve, wherein the sleeve passes through another notch in the retainer, and particularly wherein the sleeve rests against a limiting element, particularly against a washer, nut, or screw head. The advantage here is that the spring element is guided and thus a device that can be easily manufactured, in which reliable operation can be implemented, can be used.

[0025] In an advantageous design, one or more bolts pass through the sleeve, and in particular, and therefore also through the retainer, wherein the bolt is inserted or screwed into the lower component, and the retainer has one or more retaining members on the side opposite to the lower component, or is connected to or connected to the retaining member. The advantage here is that the bolt supports the retaining member, which restricts the degree of freedom of movement of the retainer, particularly the clearance. Therefore, the retaining mechanism can reciprocate along the sleeve, but this movement is limited by the retaining member. Thus, the lower component, which is connected to the circuit board stack, is configured for pre-assembly.

[0026] In an advantageous design, the retainer has a preferably planar base region, wherein the retainer has a notch through which the power module passes, particularly toward the cooling plate, wherein arm regions of the retainer are adjacent to the base region, wherein all arm regions are spaced apart from each other, particularly in a circumferential direction based on the normal direction of the plane receiving the board stack, and wherein each arm region has a notch through which a corresponding sleeve passes. The advantage here is that the arm regions laterally define the board stack and thus the board stack is form-locked and held. Furthermore, the curved implementation of the arm regions allows for a large spacing between the cover and the lower component, particularly a spacing greater than the extension from the contact area between the spring and the lower component to the contact area of ​​the cooling plate on the inside of the cover.

[0027] In an advantageous design, each arm region has at least two curved sections, particularly those facing opposite directions, wherein the bending angle of each curved section is between 70° and 110°, particularly 90°. The advantage here is that it allows for a large gap between the cover and the lower component.

[0028] In an advantageous design, the spacing between the area of ​​the component in contact with the spring and the area of ​​the cover in contact with the cooling plate is: - Larger than the extended dimensions of the circuit board stack including the power module and cooling plate. - Or greater than the sum of the extension dimensions of the spring components and the extension dimensions of the circuit board stack, including the power module and cooling plate. The extension dimension is measured in the normal direction of the plane of one of the board stacks. This has the advantage of providing sufficient free space for wires, cables, etc., and also providing assembly space for screws, etc.

[0029] In an advantageous design, the spacing between the holes for the receiving bolts of the lower component and the contact areas of the cooling plate and cover is greater than the extension dimension of the circuit board stack including the power module and the cooling plate, wherein this extension dimension is measured in the normal direction of the plane of one of the circuit boards receiving the stack. The advantage here is that a larger spacing is provided for establishing electrical connections with wires and thereby simplifies manufacturing.

[0030] In an advantageous design, a plug-in connector is mounted on a third board of the stacked boards. This plug-in connector can be plugged into a mating plug-in connector. The stator winding wires of the drive unit's motor are connected, particularly electrically, to the contacts of the mating plug-in connector, and / or, bus wires and / or power supply wires guided through cable threaded sleeves are connected, particularly electrically, to the contacts of the mating plug-in connector. The advantage here is that simple contact can be achieved by means of the plug-in connection to the mating plug-in connector.

[0031] In an advantageous design, the cooling plate is made of metal, particularly aluminum, while the retainer is made of metal, particularly steel, and the cover is made of metal, particularly aluminum. The advantage here is that the high thermal conductivity allows for efficient heat dissipation from the power module, and the retainer transmits high clamping force. Since the power module passes through a notch in the retainer and connects to the aluminum cooling plate, the power module is spaced apart from the retainer. Therefore, the retainer can be made of another material, allowing for the absorption of varying thermal expansion caused by heat at different intervals.

[0032] This invention is not limited to the claimed combination of features. Other reasonable combinations of the disclosed features are apparent to those skilled in the art, particularly from the purposes stated and / or by comparison with the prior art. Attached Figure Description

[0033] The present invention will now be described in detail with reference to the schematic diagram: exist Figure 1 The image shows a front view of a drive device according to the invention, which has a junction box with a cover.

[0034] exist Figure 2 The image shows a side view of the drive unit with the cover removed.

[0035] exist Figure 3 The image shows a longitudinal section of the junction box area.

[0036] exist Figure 4 The image shows a perspective view of the drive unit with the cover removed.

[0037] exist Figure 5 The image shows a front view of a retainer 21 with a circuit board stack 22.

[0038] exist Figure 6 The image shows a cross-section of the retainer 21 and the circuit board stack 22.

[0039] exist Figure 7 The diagram shows a top view of the junction box with cover 2 removed. Detailed Implementation

[0040] As shown in the accompanying drawings, the drive unit has a motor, in particular, with a reducer, wherein the motor's junction box has a lower part 1 and a cover 2 mounted on the lower part to form the junction box.

[0041] Cover 2 has cooling ribs, especially on its outer side facing away from the motor.

[0042] A stack of circuit boards 22 is arranged in the junction box.

[0043] The first circuit board 61 is equipped with a power module 65, which has controllable semiconductor switches, particularly MOSFETs or IGBTs. Preferably, the semiconductor switches are arranged in three half-bridges connected in parallel, so that these half-bridges form an inverter from which the motor can be fed and thus operated in a speed-regulated manner.

[0044] The second circuit board 62 of the circuit board stack 22 is equipped with signal electronics that generate control signals, particularly pulse width modulation, for the controllable semiconductor switches of the first circuit board 61.

[0045] The third circuit board 63 of the circuit board stack 22 is equipped with a plug-in connector.

[0046] The first circuit board 61, the second circuit board 62, and the third circuit board 63 are connected by pins that pass through these circuit boards 61, 62, and 63, and are in particular soldered to the circuit boards. The circuit board stack 22 thus formed presses its power module 65 against the cooling plate 20.

[0047] The heat generated by the power module 65 is thus diffused in the cooling plate 20 and discharged to the surrounding environment by pressing the cooling plate 20 against the cover 2, particularly against the inside of the cover 2.

[0048] The cover 2 has cooling ribs on its outer side, thereby dissipating heat to the surrounding environment through the thus increased surface area.

[0049] The pressing of the circuit board stack 22 is achieved by a spring 51, which is fitted onto the sleeve 60 and supported on the lower part 1 on one side and on the retainer 21 on the other side. The cooling plate 20 is against the retainer, such that the retainer 21, which is subjected to force by the spring 51, presses the cooling plate 20 against the cover 2, especially against the inside of the cover 2.

[0050] Preferably, thermal paste can also be placed between the cooling plate 20 and the cover 2.

[0051] The retainer 21 is therefore arranged on the side of the cooling plate 20 opposite to the cover 2.

[0052] Bolt 50 extends through corresponding sleeve 60, with its first end region at least partially inserted into a hole in lower component 1, or the first end region of bolt being configured as a threaded region and screwed into a threaded hole in lower component 1. The other end region of bolt 50 has a threaded region on which nut 52 is screwed, and a hole plate 53 abutting against sleeve 60 abuts against the nut. Thus, by screwing nut 52 onto the threaded region of bolt 50, sleeve 60 is secured to lower component 1, and the working area of ​​spring 51 fitted onto sleeve 60 is defined.

[0053] Therefore, the spring 51 presses / clamps the retainer 21 toward the perforated plate 53, particularly the gasket. However, the retainer 21 is thus pressed toward the cover 2 and the cooling plate 20 is thus pressed against the inside of the cover 2.

[0054] like Figure 7 As shown, the cooling plate 20 is connected to the retainer 21 by means of a first screw 71. The cooling plate 20 is connected to the power module 65 of the circuit board stack 22 by means of a second screw 72.

[0055] The retainer 21 is preferably designed as a bent part.

[0056] The retainer 21 has a notch through which the power module 65 passes so that it can be connected, in particular, to the cooling plate 20 placed on the retainer 21.

[0057] The first screw 71 is screwed into the retainer 21 with its threaded area, specifically into the hole machined there. The head of the corresponding screw 71 presses the cooling plate 20 against the retainer 21.

[0058] The second screw 72 is screwed into the power module 65 with its threaded area, specifically into the hole machined there. The head of the corresponding screw 72 presses the cooling plate 20 onto the power module 65.

[0059] The retainer 21 has a preferably flat base region with a notch through which the power module 65 extends toward the cooling plate.

[0060] An arm region is connected to the base region, all of which are spaced apart from each other and each has a notch through which a corresponding sleeve 60 passes, wherein a corresponding bolt 50 passes through the corresponding sleeve 60.

[0061] Therefore, the circuit board stack 22, together with the power module 65, is arranged protectively inside the junction box of the drive unit, such that the cover 2 and the lower component 1 surround the circuit board stack in a manner forming a housing. Mating plug-in connectors can be connected to the plug-in connector 64 mounted on the third circuit board 63, thereby electrically connecting the stator winding wires from the motor of the drive unit and / or the wires from an AC voltage source.

[0062] The circuit board stack 22 preferably functions as a converter, thereby making the motor speed or torque adjustable.

[0063] Each arm region has two curved sections, each with a 90° bend, wherein the first curved section is designed to be opposite to the second curved section. Therefore, a spring 51 that extends smaller than the circuit board stack in the direction of the central axis of the bolt 50 or sleeve 60 can be used.

[0064] Importantly, the spacing between the holes of the receiving bolts 50 in the lower component 1 and the contact areas of the cooling plate 20 and the cover 2 is greater than the extended dimensions of the circuit board stack 22 including the power module 65 and the cooling plate 20.

[0065] Preferably, the central axis is oriented parallel to the normal direction of the plane containing one of the circuit boards 61, 62, 63 that are oriented parallel to each other.

[0066] The data bus wires are guided through the cable guides arranged in the wall of the lower component 1 to the plug connectors 64 of the circuit board stack 22.

[0067] As in Figure 4 As shown, the retainer 21 surrounds the circuit board stack 22 in a spider-like and / or claw-like manner with its arm regions. Therefore, the circuit boards 61, 62, 63 are preferably received in the retainer 21 in a form-locking manner, because at least one arm region is arranged on any of the sides of the circuit board stack 22 that are not facing the lower component 1.

[0068] In other embodiments of the invention, instead of a nut with a washer, restrictions are imposed on the degrees of freedom of movement of the retainer in other ways. For example, the sleeve 60 is omitted and the bolt has a widened portion in place of the screw-on nut 52 and the fitted hole plate 53. Thus, instead of the bolt 50, a screw with a screw head can also be screwed into the threaded hole of the lower part 1.

[0069] Therefore, a sleeve for guiding the spring 51 is not required, since the screw or bolt 50 can be used for guiding. For this purpose, it is preferable to form a smooth surface on the screw or bolt 50.

[0070] List of reference numerals in the attached diagram: 1 Lower component 2. Cover 20 Cooling plate 21 Retaining element 22. Circuit board stacks connected to pins 50 bolts 51 Spring component 52 Nuts 53-hole plates, especially gaskets 60 sleeve The first circuit board of the 61-circuit board stack 22 62 circuit boards stacked 22 second circuit boards The third circuit board in the 63-circuit stack 22 64 Plug-in connectors 65 Power Module 71 First screw for connecting retainer 21 to cooling plate 20 72 Second screw for connecting retainer 21 to power module 65

Claims

1. A drive device with a junction box, The junction box has a lower part and a cover that connects to the lower part. The power module is connected to the cooling plate. The cooling plate is connected to the retaining component. The retainer is arranged pressingly toward the cover by at least one spring member supported on the lower component. The retainer has a flat base area. The retainer has a corresponding notch through which the power module passes. The arm region of the retainer is adjacent to the base region. The arm regions are all spaced apart from each other. Each arm region has at least two bending points, wherein... The power module is mounted on the first circuit board of the circuit board stack. The circuit board stack has at least one second circuit board, which is parallel to the first circuit board.

2. The driving device according to claim 1, Its features are, The first and second circuit boards are connected at least by means of pins passing through circuit boards (61, 62, 63), and the pins are soldered to the circuit boards (61, 62, 63). And / or, The cover has cooling ribs and / or cooling fingers on its surface.

3. The driving device according to claim 1 or 2, Its features are, The power module passes through the notch toward the cooling plate.

4. The driving device according to claim 1 or 2, Its features are, The first circuit board is positioned on the side of the retainer facing away from the cooling plate.

5. The driving device according to claim 1 or 2, Its features are, The cooling plate covers, shields, and / or seals the gap. And / or, The spring is positioned between the retainer and the lower component.

6. The driving device according to claim 1 or 2, Its features are, The movement of the retaining member is guided by a guide component. And / or, The movement of the retaining member is restricted by the use of a limiting member.

7. The driving device according to claim 6, Its features are, The sleeve acts as a guide component. And / or, A screw with a screw head that is screwed into a threaded hole in a lower part, or a bolt that is inserted into or screwed into a hole in a lower part, together with a nut screwed onto the threaded area of ​​the bolt, serves as a limiting element.

8. The driving device according to claim 7, Its features are, A spring element designed as a ring spring is fitted onto the sleeve. The sleeve passes through another notch in the retainer. The sleeve rests against the limiting component.

9. The driving device according to claim 7, Its features are, One or more of the bolts pass through the sleeve, and therefore also through the retainer. The bolt is inserted or screwed into the lower component, and the retainer has one or more limiting members on the side opposite to the lower component, or is connected to the limiting member or a limiting member.

10. The driving device according to claim 1 or 2, Its features are, The arm regions are all spaced apart from each other in a circumferential direction based on the normal direction of the plane that receives the stack of circuit boards. Each arm region has a notch through which the corresponding sleeve passes.

11. The driving device according to claim 1 or 2, Its features are, Each arm region has at least two curved sections that are opposite to each other. The bending angle at each bend ranges from 70° to 110°. And / or, The distance between the area of ​​the component in contact with the spring and the area of ​​the cover in contact with the cooling plate. - Larger than the extended dimensions of the circuit board stack including the power module and cooling plate. - Or greater than the sum of the extension dimensions of the spring components and the total extension dimensions of the circuit board stack, including the power module and cooling plate. The extension dimension is measured in the normal direction of the plane of one of the board circuit boards that is receiving the board stack.

12. The driving device according to claim 1 or 2, Its features are, The spacing between the holes for the receiving bolts of the lower component and the contact area between the cooling plate and the cover is greater than the extended dimensions of the circuit board stack including the power module and the cooling plate. The extension dimension is measured in the normal direction of the plane of one of the board circuit boards that is receiving the board stack.

13. The driving device according to claim 1 or 2, Its features are, A plug-in connector is mounted on the third circuit board of the circuit board stack. The plug-in connector can be plugged into a mating plug-in connector, and the stator winding wires of the motor of the drive unit are electrically connected to the contacts of the mating plug-in connector, and / or, the bus wires and / or power supply wires guided through the cable threaded sleeve connectors are electrically connected to the contacts of the mating plug-in connector. And / or, The cooling plate is made of metal. The retainer is made of metal. The cover is made of metal.

14. The driving device according to claim 2, characterized in that, The cover has cooling ribs and / or cooling fingers on its outer surface.

15. The driving device according to claim 13, characterized in that, The cooling plate is made of aluminum, the retainer is made of steel, and the cover is made of aluminum.

Citation Information

Patent Citations

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