Substrate height measuring apparatus and substrate height measuring method

Abstract

A substrate height measuring apparatus includes a photographing section, a setting section, and a measuring section. The photographing section causes a photographing device to photograph at least a part of an area of a substrate including a measurement predetermined position at which a height of the substrate to be clamped is to be measured. The setting section causes a substrate image photographed by the photographing section to be displayed on a display device, and is capable of adjusting a measurement position at which the height of the substrate is actually measured, based on the measurement predetermined position of the substrate image displayed on the display device, thereby setting the measurement position. The measuring section causes a measuring device to measure the height of the substrate at the measurement position set by the setting section.

Description

Technical Field

[0001] This specification discloses technologies related to substrate height measuring apparatus and substrate height measuring method. Background Technology

[0002] Patent Document 1 describes a method for obtaining substrate height data by eliminating abnormal data from measurement data during substrate height measurement, such as in driving instruction. Specifically, the substrate, formed of epoxy resin or the like, is a rigid body, and therefore, from a local perspective, its surface is planar. Thus, the measured value of the substrate height, obtained by scanning slightly, will change slightly, but not drastically. Therefore, in the method described in Patent Document 1, while moving the substrate height measuring sensor at a fixed speed, measurement data is acquired at predetermined intervals within a predetermined area. When the measurement data is not included in a predetermined range representing normal data, that measurement data is excluded as an abnormal value.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-27015 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] For example, wiring patterns, vias, components, and other circuit-forming elements are set on the substrate. Additionally, identification codes for the substrate product are affixed to the substrate. These components affect the measurement of the substrate's height by the measuring device, potentially becoming a major cause of decreased measurement accuracy.

[0008] For this reason, this specification discloses a measuring position that can be adjusted to actually measure the height of the substrate, a substrate height measuring device that can adjust the height of the substrate, and a substrate height measuring method.

[0009] Technical solutions for solving the problem

[0010] This specification discloses a substrate height measuring apparatus comprising an imaging unit, a setting unit, and a measuring unit. The imaging unit captures an image of at least a portion of the substrate, including a predetermined measurement position for determining the height of a clamped substrate. The setting unit displays the substrate image captured by the imaging unit on a display device, and can adjust the actual measurement position for measuring the substrate height based on the predetermined measurement position of the substrate image displayed on the display device, thereby setting the measurement position. The measuring unit measures the height of the substrate at the measurement position set by the setting unit.

[0011] Furthermore, this specification discloses a method for measuring substrate height comprising an imaging step, a setting step, and a measurement step. In the imaging step, an imaging device images a region of at least a portion of the substrate, including a predetermined measurement position for determining the height of the clamped substrate. In the setting step, the substrate image captured by the imaging step is displayed on a display device, and the actual measurement position for measuring the substrate height is adjusted based on the predetermined measurement position of the substrate image displayed on the display device, thereby setting the measurement position. In the measurement step, the measurement device measures the height of the substrate at the measurement position set by the setting step.

[0012] Invention Effects

[0013] The substrate height measuring apparatus described above includes an imaging unit, a setting unit, and a measuring unit. Therefore, the substrate height measuring apparatus can adjust the measuring position for actually measuring the substrate height based on a predetermined measuring position of the substrate image displayed on the display device, enabling the measuring apparatus to measure the substrate height. The substrate height measuring apparatus described above can also be used in the substrate height measuring method. Attached Figure Description

[0014] Figure 1 This is a top view showing an example of the structure of a component mounting machine.

[0015] Figure 2 This is a block diagram illustrating an example of a control block for a substrate height measuring device.

[0016] Figure 3 This is a flowchart illustrating an example of the control sequence based on a substrate height measuring device.

[0017] Figure 4 This is a schematic diagram showing an example of a component disposed on a substrate.

[0018] Figure 5 This is a top view of a substrate showing a setting example for determining a predetermined position.

[0019] Figure 6 This is a schematic diagram illustrating an example of an image displayed on a substrate of a display device.

[0020] Figure 7 This is a schematic diagram showing another example of an image displayed on a substrate of a display device.

[0021] Figure 8 This is a schematic diagram showing an example of setting the reference measurement position and the associated measurement position.

[0022] Figure 9 It is shown in Figure 8A schematic diagram showing the measurement results of the substrate height measured at the measurement location. Detailed Implementation

[0023] 1. Implementation Method

[0024] 1-1. Structural Example of Component Mounting Machine 10

[0025] The substrate height measuring device 70 can be installed in a substrate mounting machine that needs to measure the height of a clamped substrate 90. For example, a printing press, a printing inspection machine, a component mounting machine 10, and a visual inspection machine are included in the substrate mounting machine. In this embodiment, the substrate height measuring device 70 is installed in the component mounting machine 10. The component mounting machine 10 mounts multiple components P0 onto the substrate 90. For example... Figure 1 As shown, the component mounting machine 10 includes a substrate conveying device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16.

[0026] The substrate transport device 11, for example, is a belt conveyor, which transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board, forming circuits, electrical circuits, magnetic circuits, etc. The substrate transport device 11 moves the substrate 90 into the component mounting machine 10, positions the substrate 90 at a predetermined position inside the machine, and clamps it. After the component mounting machine 10 has completed the mounting process of multiple components P0, the substrate transport device 11 releases the substrate 90 and removes the substrate 90 from the equipment of the component mounting machine 10.

[0027] The component supply device 12 supplies a plurality of components P0 mounted on the substrate 90. The component supply device 12 includes a plurality of feeders 121 arranged along the transport direction (X-axis direction) of the substrate 90. Each feeder 121 transports a carrier tape containing the plurality of components P0 at intervals, and supplies the components P0 at a supply position located at the front end of the feeder 121. Furthermore, the component supply device 12 can also supply electronic components (e.g., lead components, etc.) that are relatively large compared to chip components, etc., placed on a tray.

[0028] The component transfer device 13 includes a head drive device 131 and a moving stage 132. The head drive device 131 is configured to move the moving stage 132 in the X-axis and Y-axis directions using a linear motion mechanism. A mounting head 20 is detachably (replaceable) mounted on the moving stage 132 using a clamping member. The mounting head 20 uses at least one holding member 30 to pick up and hold the component P0 supplied by the component supply device 12, and mount the component P0 onto the substrate 90 positioned by the substrate transport device 11. The holding member 30 can be, for example, a nozzle, a chuck, or the like.

[0029] The component camera 14 and the substrate camera 15 can use known imaging devices. The component camera 14 is fixed to the base of the component mounting machine 10 with its optical axis facing upward in the vertical direction (Z-axis direction). The component camera 14 can capture images of the component P0 held in the holding member 30 from below. The substrate camera 15 is disposed on the moving stage 132 of the component transfer device 13 with its optical axis facing downward in the vertical direction (Z-axis direction). The substrate camera 15 can capture images of the substrate 90 from above. The component camera 14 and the substrate camera 15 capture images based on control signals sent from the control device 16. The image data of the captured images by the component camera 14 and the substrate camera 15 are sent to the control device 16.

[0030] The control device 16 includes a known arithmetic and storage device, forming a control circuit. Information and image data output from various sensors installed on the component mounting machine 10 are input to the control device 16. The control device 16 sends control signals to each device based on the control program and pre-set predetermined installation conditions.

[0031] For example, the control device 16 causes the substrate camera 15 to capture an image of the substrate 90 positioned by the substrate transport device 11. The control device 16 performs image processing on the image captured by the substrate camera 15 to identify the positioning state of the substrate 90. Additionally, the control device 16 causes the holding member 30 to pick up and hold the component P0 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component P0 held on the holding member 30. The control device 16 performs image processing on the image captured by the component camera 14 to identify the holding posture of the component P0.

[0032] The control device 16 moves the holding member 30 upwards toward a predetermined mounting position set by a control program or the like. Furthermore, the control device 16 corrects the predetermined mounting position based on the positioning state of the substrate 90 and the holding posture of the component P0, and sets the actual mounting position of the component P0. The predetermined mounting position and the actual mounting position include not only position (X-axis and Y-axis coordinates) but also rotation angle.

[0033] The control device 16, in accordance with the mounting position, corrects the target position (X-axis and Y-axis coordinates) and rotation angle of the holding member 30. The control device 16 lowers the holding member 30 according to the corrected rotation angle at the target position, mounting the component P0 onto the substrate 90. The control device 16 performs the mounting process of mounting multiple components P0 onto the substrate 90 by repeating the above pick-and-place cycle.

[0034] 1-2. Structural Example of Substrate Height Measuring Device 70

[0035] 1-2-1. Overview of the substrate height measuring device 70

[0036] The substrate height measuring device 70 of this embodiment is provided in the control device 16 of the component mounting machine 10. When understood as a control block, the substrate height measuring device 70 includes an imaging unit 71, a setting unit 72, and a measuring unit 73. The substrate height measuring device 70 may also include a display unit 74. Figure 2 As shown, the substrate height measuring device 70 of this embodiment includes an imaging unit 71, a setting unit 72, a measuring unit 73, and a display unit 74.

[0037] Furthermore, the substrate height measuring device 70 of this embodiment is in accordance with Figure 3 The control is executed according to the flowchart shown. The imaging unit 71 performs the process shown in step S11. The setting unit 72 performs the process shown in step S12. The measuring unit 73 performs the process shown in step S13. The display unit 74 performs the process shown in step S14.

[0038] Figure 4 An example of a component disposed on a substrate is shown. Figure 4 This is an enlarged top view of a portion of the substrate 90 clamped by the substrate transport device 11. As shown in the figure, circuit forming components such as wiring patterns WP0, vias SH0, and components P0 are provided on the substrate 90. Additionally, an identification code for the substrate product 900 is attached to the substrate 90. These components affect the measurement of the height of the substrate 90 by the measuring device 60 and may be a major cause of decreased measurement accuracy.

[0039] For example, consider a case where the measuring device 60 for measuring the height of substrate 90 is an optical measuring device. In this case, the measuring device 60 projects a laser onto substrate 90, receives the laser reflected from substrate 90, and measures the height of substrate 90 based on the principle of triangulation. Therefore, when the aforementioned component is provided near the predetermined measurement position 91 for determining the height of substrate 90, laser scattering may occur due to the component, leading to a decrease in measurement accuracy. Figure 4 In the figure, areas that may affect measurement accuracy are represented by dashed circles. In this figure, a portion of component P0 and wiring pattern WP0 is included within the circle, illustrating that the measurement accuracy of the measuring device 60 may decrease.

[0040] The substrate height measuring device 70 displays the substrate image 90M captured by the imaging unit 71 on the display device 50. Then, based on the predetermined measurement position 91 of the substrate image 90M displayed on the display device 50, the substrate height measuring device 70 adjusts the measurement position 93 of the measuring device 60 to actually measure the height of the substrate 90, thereby enabling the measuring device 60 to measure the height of the substrate 90. Therefore, when a component that reduces measurement accuracy is provided near the predetermined measurement position 91, the measurement position 93 can be set at a location avoiding that component.

[0041] 1-2-2. Filming Department 71

[0042] The imaging unit 71 causes the imaging device 40 to capture images of at least a portion of a region 92 of the substrate 90, including a predetermined measurement position 91 for determining the height of the clamped substrate 90. Figure 3 Step S11 is shown.

[0043] The component mounting machine 10 confirms the warping state of the substrate 90 based on the measurement results of the substrate height measuring device 70. Furthermore, the component mounting machine 10 can also adjust the height of the holding member 30 when mounting component P0 onto the substrate 90 based on the aforementioned measurement results. Therefore, the predetermined measurement position 91 is set in a manner that allows for the confirmation of the warping state of the substrate 90 and the adjustment of the height of the holding member 30. In addition, the predetermined measurement position 91 is preset by a control program or the like, matching the substrate type. For example, the larger the size of the substrate 90, the more predetermined measurement positions 91 are set. Furthermore, the lower the rigidity of the substrate 90, the more predetermined measurement positions 91 are set. Moreover, identification information capable of identifying the predetermined measurement position 91 is assigned to multiple predetermined measurement positions 91.

[0044] Figure 5 An example of setting the predetermined position 91 for measurement is shown. In this figure, one predetermined position 91 for measurement is provided at the center of the substrate 90. In addition, in this figure, eight predetermined positions 91 for measurement are provided along the outer edge of the substrate 90. By providing at least one predetermined position 91 at the center of the substrate 90 and multiple predetermined positions 91 for measurement are provided at the outer edge of the substrate 90, the component mounting machine 10 can easily grasp the warping state (concave or convex) of the substrate 90.

[0045] Furthermore, at least three predetermined measurement positions 91 are provided on one side of the substrate 90 (X-axis direction), thereby making it easy for the component mounting machine 10 to grasp the warping state (concave or convex) of the substrate 90 on one side of the substrate 90 (X-axis direction). At least three predetermined measurement positions 91 are provided on the other side of the substrate 90 (Y-axis direction), thereby making it easy for the component mounting machine 10 to grasp the warping state (concave or convex) of the substrate 90 on the other side of the substrate 90 (Y-axis direction). By grasping the warping state (concave or convex) of the substrate 90 in this way, the component mounting machine 10 can easily adjust the height of the holding member 30.

[0046] The imaging device 40 only needs to be able to capture images of at least a portion of region 92 of the substrate 90, including the region where the predetermined position 91 is determined; any known imaging device can be used. For example... Figure 1 As shown, the imaging device 40 in this embodiment uses a substrate camera 15. (As indicated...) Figure 5 As shown, the substrate camera 15 is capable of capturing images of a portion 92 of the substrate 90 including the portion where the predetermined position 91 is determined. Furthermore, the component mounting machine 10 may also include an imaging device capable of capturing images of the entire area 92 of the substrate 90. In this case, the imaging device 40 is also capable of capturing images of the entire area 92 of the substrate 90 including the portion where the predetermined position 91 is determined.

[0047] 1-2-3. Setting Section 72

[0048] The setting unit 72 displays the substrate image 90M captured by the imaging unit 71 on the display device 50, and can adjust the measurement position 93 for actually measuring the height of the substrate 90 based on the predetermined measurement position 91 of the substrate image 90M displayed on the display device 50, and set the measurement position 93. Figure 3 Step S12 (as shown).

[0049] The display device 50 only needs to be able to display the substrate image 90M captured by the imaging unit 71, and a known display device can be used. For example... Figure 1 As shown, the display device 50 in this embodiment uses the display device provided on the component mounting machine 10. The display device 50 can also be provided separately.

[0050] Figure 6 An example of a substrate image 90M displayed on a display device 50 is shown. In the substrate image 90M of this figure, an image is captured... Figure 4The area 92 of the substrate 90 shown. In the substrate image 90M, the image features such as brightness and luminance of the areas where circuit forming components such as wiring patterns WP0, vias SH0, and components P0 are captured are different from those of the areas where circuit forming components are not captured. Therefore, the setting unit 72 can perform image processing on the substrate image 90M and adjust the measurement position 93 based on the image features of the substrate image 90M.

[0051] Specifically, Figure 6 The image feature value of a portion of the circle shown by the dashed line differs from the image feature value of the area where the circuit forming component is not photographed, so the setting unit 72 determines that the measurement position 93 needs to be adjusted. The setting unit 72 moves the measurement position 93 in such a way that the image feature value of the entire circle is equal to the image feature value of the area where the circuit forming component is not photographed. The same applies to the identification code of the circuit forming component related to the identification substrate product 900.

[0052] However, in the above method, image feature values ​​may change due to factors such as the shooting conditions of the imaging device 40 or disturbances during shooting, making it sometimes difficult to adjust the measurement position 93. Therefore, the setting unit 72 can set a specific position FP0 of the substrate image 90M indicated by the operator as the measurement position 93. In this mode, the operator can confirm the substrate image 90M displayed on the display device 50 and adjust the measurement position 93.

[0053] The method by which the operator instructs a specific position FP0 is not limited, and various methods can be used. For example, the setting unit 72 can display coordinate axes (X-axis and Y-axis) on the substrate image 90M displayed on the display device 50, allowing the operator to input the coordinates (X-axis and Y-axis coordinates) of a specific position FP0. In this case, the setting unit 72 can display grid-like auxiliary lines, etc., on the substrate image 90M displayed on the display device 50. This makes it easy for the operator to know the coordinates of the specific position FP0.

[0054] The setting unit 72 can also display the indicator 94 in a predetermined area including the measurement predetermined position 91 of the substrate image 90M displayed on the display device 50. The operator can use the input device to move the indicator 94 so that the operator can indicate a specific position FP0. Thus, the operator can easily indicate a specific position FP0.

[0055] The indicator component 94 is an auxiliary unit for the operator to indicate a specific position FP0, and can be used in various ways. Figure 6The indicated component 94 shown is a circular icon, with the center of the circle corresponding to a specific position FP0. The display device 50 of this embodiment is composed of a touch panel and also functions as an input device for various operations performed by the operator. The operator can touch the indicated component 94 displayed on the display device 50 to move the indicated component 94 and indicate the specific position FP0. Alternatively, the operator can use various input devices provided on the component mounting machine 10 (e.g., mouse, keyboard, etc.) to move the indicated component 94 displayed on the display device 50 and indicate the specific position FP0.

[0056] The shape of the indicator 94 can be set in a manner consistent with the range that may affect the measurement accuracy of the measuring device 60. Thus, the operator can indicate a specific position FP0 in a way that excludes circuit-forming components and the like from the range that may affect the measurement accuracy of the measuring device 60.

[0057] Furthermore, for example, when the area that might affect the measurement accuracy of the measuring device 60 does not include circuit forming components, it is not necessary to move the measuring position 93. In this case, the measuring position 93 is not adjusted from the predetermined measuring position 91, but is set to the same position as the predetermined measuring position 91. Thus, in order to be able to adjust the measuring position 93, there are two cases: one where the predetermined measuring position 91 is adjusted and the measuring position 93 is set at the same position as the predetermined measuring position 91 without adjusting the predetermined measuring position 91.

[0058] 1-2-4. Measurement Section 73

[0059] The measuring unit 73, at the measuring position 93 set by the setting unit 72, causes the measuring device 60 to measure the height of the substrate 90. Figure 3 Step S13 (as shown).

[0060] The measuring device 60 only needs to be able to measure the height of the substrate 90, and any known measuring device can be used. For example, the measuring device 60 can use various measuring devices such as the optical measuring device and the electrostatic capacitance measuring device described above. The measuring device 60 in this embodiment is an optical measuring device. Furthermore, as... Figure 1 As shown, the measuring device 60 of this embodiment is provided on the moving stage 132 of the component transfer device 13 on which the substrate camera 15 is provided.

[0061] The measuring unit 73 can measure the height of the substrate 90 during trial production of the substrate product 900 before the production of the substrate product 900 on which the component P0 is mounted, or during initial workpiece verification when the type of substrate product 900 to be produced is changed. Thus, the operator or equipment (e.g., the component mounting machine 10) can confirm the warping state of the substrate 90 before the production of the substrate product 900, and can also adjust the height of the holding member 30 when mounting the component P0 onto the substrate 90.

[0062] Furthermore, the measuring unit 73 can also use the measuring device 60 to measure the height of the substrate 90 during the production of the substrate product 900. Therefore, the operator or equipment (e.g., component mounting machine 10) can confirm the warping state of the substrate 90 during the production of the substrate product 900, and can also adjust the height of the holding member 30. Moreover, as described later, the number of height measurements of the substrate 90 can be changed for the same type of substrate 90 during trial production or initial workpiece verification and during the production of the substrate product 900.

[0063] 1-2-5. Display Unit 74

[0064] The display unit 74 displays the coordinates of the measurement position 93 in the substrate 90 and the measurement result measured by the measurement unit 73 on the display device 50. Figure 3 Step S14 is shown.

[0065] The display unit 74 only needs to be able to display the above content on the display device 50, and the display method can be various. For example, after the height of the substrate 90 is measured by the measuring device 60, the operator operates... Figure 6 The operation unit BP11 is shown. Therefore, the display unit 74 displays the coordinates (X-axis and Y-axis coordinates) of the measurement position 93 in the substrate 90, along with the measurement result measured by the measurement unit 73, on the display device 50 together with the substrate image 90M. This figure shows that the measurement result of the height of the substrate 90 at the measurement position 93 (X-axis coordinate X10 and Y-axis coordinate Y10) is height H10.

[0066] Furthermore, the display unit 74 is not limited to text display; it can also display substrate images or other information indicating the warping state of the substrate 90 on the display device 50. Moreover, the display unit 74 can also display the coordinates (X-axis and Y-axis coordinates) of the measurement position 93 within the substrate 90 when the measurement position 93 is adjusted. In this case, the display unit 74 can display the coordinates (X-axis and Y-axis coordinates) of the measurement position 93 within the substrate 90 in accordance with the movement of the measurement position 93.

[0067] 1-2-6. Deformation Methods

[0068] Sometimes it is difficult to determine the condition of the periphery of the measurement location 93 based on the substrate image 90M. For example, unevenness or other defects of the substrate 90 that are difficult to detect based on the substrate image 90M may exist around the measurement location 93. When the measurement device 60 measures the height of the substrate 90 in such an area, the measurement accuracy may decrease.

[0069] Therefore, the setting unit 72 can set at least one associated measurement position 93b around the reference measurement position 93a, which is a measurement position 93 set for adjusting the measurement predetermined position 91 or a measurement position 93 set without adjusting the measurement predetermined position 91. As a result, the operator or device (e.g., component mounting machine 10) can grasp the situation around the reference measurement position 93a and can move the measurement position 93 as needed.

[0070] Figure 7 Another example of a substrate image 90M displayed on the display device 50 is shown. This figure shows eight associated measurement positions 93b set around a reference measurement position 93a at X-axis coordinate X10 and Y-axis coordinate Y10. The predetermined measurement position 91 and the reference measurement position 93a are indicated by black circles, and the eight associated measurement positions 93b are indicated by white circles. As shown in this figure, the reference measurement position 93a at X-axis coordinate X10 and Y-axis coordinate Y10 is a measurement position 93 set by adjusting the predetermined measurement position 91.

[0071] Furthermore, as mentioned above, there is also a case where the measurement position 93 is set to the same position as the predetermined measurement position 91 without adjustment. In this case, the setting unit 72 can also set at least one associated measurement position 93b around the reference measurement position 93a.

[0072] Furthermore, the configuration of the reference measurement position 93a and the associated measurement position 93b is limited, but the reference measurement position 93a and the associated measurement position 93b can be configured on grid points. Therefore, it is easy to uniformly configure the associated measurement position 93b. Figure 7 In the example shown, the baseline measurement location 93a and eight associated measurement locations 93b are arranged on the grid points.

[0073] In this configuration, the display unit 74 can also display the coordinates of the measurement position 93 within the substrate 90 and the measurement results measured by the measurement unit 73 on the display device 50. For example, after the height of the substrate 90 is measured by the measurement device 60, the operator operates... Figure 7The operation unit BP11 is shown. As a result, the display unit 74 displays the coordinates (X-axis coordinates and Y-axis coordinates) of the reference measurement position 93a and the eight associated measurement positions 93b in the substrate 90, as well as the measurement results measured by the measurement unit 73, together with the substrate image 90M on the display device 50.

[0074] The figure shows that the height of the substrate 90 at the reference measurement position 93a, with X-axis coordinate X10 and Y-axis coordinate Y10, is measured to be height H10. Similarly, the figure shows that the height of the substrate 90 at the associated measurement position 93b, with X-axis coordinate X1 and Y-axis coordinate Y1, is measured to be height H11. The same applies to the remaining seven associated measurement positions 93b.

[0075] The display unit 74 can also display the elevation difference obtained by subtracting the lowest value from the highest value of the measurement results of the reference measurement position 93a and the associated measurement position 93b measured by the measurement unit 73. Therefore, the operator can easily identify the elevation difference and, based on the elevation difference, understand the surrounding conditions of the reference measurement position 93a. Figure 7 The elevation difference shown is DF10, which represents the elevation difference between the measurement results at the reference measurement location 93a and the eight associated measurement locations 93b.

[0076] Furthermore, during the production of substrate product 900, when the measuring device 60 measures the height of substrate 90 at both reference measuring position 93a and associated measuring position 93b, the measurement time increases, and the measurement operation may become more complicated. Therefore, the measuring unit 73 can measure the height of substrate 90 at both reference measuring position 93a and associated measuring position 93b during the trial production or initial workpiece confirmation of substrate product 900.

[0077] Furthermore, the measurement unit 73 can allow the measurement of the height of the substrate 90 at the reference measurement position 93a during the production of the substrate product 900, while restricting the measurement of the height of the substrate 90 at the associated measurement position 93b. In this way, during the trial production or initial workpiece confirmation and production of the substrate product 900, the number of measurements of the height of the substrate 90 can be changed for the same type of substrate 90.

[0078] As described above, a plurality of measurement predetermined positions 91 can be provided on the substrate 90. The setting unit 72 can set at least one associated measurement position 93b around each of the plurality of measurement predetermined positions 91, which is either a measurement position 93 set for adjusting the measurement predetermined position 91 or a reference measurement position 93a set for not adjusting the measurement predetermined position 91.

[0079] Figure 8 The diagram shows an example of setting the reference measurement position 93a and the associated measurement position 93b. This figure illustrates the relevant... Figure 5 This is an example of a state where each of the nine predetermined measurement positions 91 is set with a reference measurement position 93a and eight associated measurement positions 93b. Six of the nine reference measurement positions 93a are set to adjust the predetermined measurement position 91. Three of the nine reference measurement positions 93a are set without adjusting the predetermined measurement position 91.

[0080] The display unit 74 can display the identification information of the corresponding predetermined measurement position 91, the coordinates of the reference measurement position 93a in the substrate 90, and the measurement results measured by the measurement unit 73 at a glance, based on multiple reference measurement positions 93a. For example, after the height of the substrate 90 is measured by the measurement device 60, the operator operates... Figure 7 The operation unit BP12 is shown. Therefore, the display unit 74 is... Figure 9 The information shown is displayed on the display device 50. Figure 9 It shows in Figure 8 An example of displaying the measurement results of the height of the substrate 90 measured at measurement position 93.

[0081] exist Figure 9 In the example shown, checkboxes, board number, identification information of the predetermined measurement position 91, coordinates (X-axis and Y-axis coordinates) of the reference measurement position 93a, measurement results measured by the measurement unit 73, and elevation difference are displayed. Regarding the checkboxes, the operator can use the input device to select whether to check them, and the measurement results are displayed for the selected reference measurement position 93a.

[0082] The board number is identification information that identifies a multi-beveled substrate formed by separating multiple substrates 90 smaller than the substrate 90 within a single substrate 90. This identification information is assigned to both the multi-beveled substrate as a whole and to each individual substrate 90 included in the multi-beveled substrate. The substrate height measuring device 70 allows the measuring device 60 to measure the height of the substrate 90 with respect to the entire multi-beveled substrate. Furthermore, the substrate height measuring device 70 also allows the measuring device 60 to measure the height of each individual substrate 90 included in the multi-beveled substrate.

[0083] The figure shows a reference measurement position 93a with X-axis coordinate X31 and Y-axis coordinate Y31, where the operator has made a checkmark. The board number is zero, and the identification information for the corresponding predetermined measurement position 91 is identification information CH1. Additionally, the figure shows that the measured height of the substrate 90 at this reference measurement position 93a is height H31. The height difference between this reference measurement position 93a and the eight associated measurement positions 93b surrounding it is height difference DF31. The same applies to the remaining eight reference measurement positions 93a.

[0084] The display unit 74 can also change the display method to distinguish between a reference measurement position 93a where the elevation difference exceeds a predetermined value and a reference measurement position 93a where the elevation difference is below the predetermined value. Therefore, the operator can easily determine the reference measurement position 93a where the elevation difference exceeds the predetermined value. For example, the operator can... Figure 9 The predetermined value of the height difference is input into the input unit BP21 shown. In this figure, the information is shown enclosed by four sides at the reference measurement position 93a of the X-axis coordinate X32 and the Y-axis coordinate Y32, indicating that the height difference DF32 exceeds the predetermined value.

[0085] The display unit 74 is only required to display information in a manner that can distinguish between a reference measurement position 93a with an elevation difference exceeding a predetermined value and a reference measurement position 93a with an elevation difference below the predetermined value; the display method is not limited. For example, the display unit 74 can change the display method of the display device 50 by using at least one of different display colors, the presence or absence of markings, or different icons.

[0086] The display unit 74 can, for example, use a color that is easier for the operator to see (e.g., yellow, red, etc.) compared to the display color of the reference measurement position 93a where the elevation difference is below a predetermined value, to display the reference measurement position 93a where the elevation difference exceeds a predetermined value. Similarly, for markings and icons, various methods such as display colors and patterns that are easy for the operator to see, movement within the display screen, and flashing display can be used.

[0087] The display unit 74 can also guide adjustments to the predetermined measurement position 91 regarding the reference measurement position 93a where the height difference exceeds a predetermined value. Figure 9 In the identification information CH2, it indicates that the measurement position 93 needs adjustment. Therefore, the operator can easily determine the reference measurement position 93a where the elevation difference exceeds a predetermined value (in this case, the reference measurement position 93a of X-axis coordinate X32 and Y-axis coordinate Y32), and can perform adjustments to the predetermined measurement position 91.

[0088] Furthermore, in the aforementioned method, the reference measurement position 93a is adjusted to the predetermined measurement position 91 as needed, and the reference measurement position 93a and the associated measurement position 93b are set. Then, the height of the substrate 90 is measured at the set reference measurement position 93a and the associated measurement position 93b. For the reference measurement position 93a where the height difference exceeds a predetermined value, the reference measurement position 93a is readjusted as needed.

[0089] However, the substrate height measuring device 70 can also set a reference measuring position 93a at the same position as the predetermined measuring position 91, and set a related measuring position 93b based on this reference measuring position 93a. In this case, the substrate height measuring device 70 measures the height of the substrate 90 at the reference measuring position 93a and the related measuring position 93b, which are set at the same position as the predetermined measuring position 91. Then, the substrate height measuring device 70 can also take a picture of the substrate 90, reset the reference measuring position 93a and the related measuring position 93b, and remeasure the height of the substrate 90 at the reference measuring position 93a where the height difference exceeds a predetermined value.

[0090] 2. Method for measuring substrate height

[0091] The substrate height measuring apparatus 70 described above can also be used in the substrate height measuring method. Specifically, the substrate height measuring method includes an imaging step, a setting step, and a measuring step. The imaging step corresponds to the control performed by the imaging unit 71. The setting step corresponds to the control performed by the setting unit 72. The measuring step corresponds to the control performed by the measuring unit 73. In addition, the substrate height measuring method can include a display step. The display step corresponds to the control performed by the display unit 74.

[0092] 3. An example of the effect of the implementation method

[0093] The substrate height measuring device 70 includes an imaging unit 71, a setting unit 72, and a measuring unit 73. Therefore, the substrate height measuring device 70 can adjust the measuring position 93 for actually measuring the height of the substrate 90 based on the predetermined measuring position 91 of the substrate image 90M displayed on the display device 50, enabling the measuring device 60 to measure the height of the substrate 90. The substrate height measuring device 70 described above can also be used in the same way for substrate height measurement methods.

[0094] Explanation of reference numerals in the attached figures

[0095] 40: Imaging device; 50: Display device; 60: Measuring device

[0096] 70: Substrate height measuring device; 71: Imaging unit; 72: Setting unit; 73: Measuring unit

[0097] 74: Display unit; 90: Substrate; 91: Measurement of predetermined position; 92: Area

[0098] 93: Measurement location; 93a: Reference measurement location; 93b: Associated measurement location

[0099] 94: Indicator component; 90M: Substrate image; FP0: Specific location.

[0100] P0: Component 900: Substrate Product

Claims

1. A substrate height measuring device, comprising: The imaging unit enables the imaging device to capture images of at least a portion of the substrate, including a predetermined position for determining the height of the clamped substrate. The setting unit displays a substrate image captured by the imaging unit on a display device, and can adjust the actual measurement position for measuring the height of the substrate based on the predetermined measurement position of the substrate image displayed on the display device, thereby setting the measurement position. and The measuring unit measures the height of the substrate at the measuring position set by the setting unit. The setting unit sets at least one associated measurement position around the measurement position, which is either a reference measurement position set for adjusting the predetermined measurement position or a measurement position set without adjusting the predetermined measurement position, and displays the coordinates of the reference measurement position and the associated measurement position in the substrate, as well as the measurement result measured by the measurement unit, on the display device.

2. The substrate height measuring device according to claim 1, wherein, The setting unit sets a specific location of the substrate image indicated by the operator as the measurement location.

3. The substrate height measuring device according to claim 2, wherein, The setting unit causes the indicator component to be displayed in a predetermined area including the measured predetermined position of the substrate image displayed on the display device, and the operator can use the input device to move the indicator component so that the operator can indicate the specific position.

4. The substrate height measuring device according to any one of claims 1 to 3, wherein, The reference measurement location and the associated measurement location are configured on the grid points.

5. The substrate height measuring device according to any one of claims 1 to 3, wherein, The measuring unit measures the height of the substrate during trial production of the substrate product before production of the substrate product on which components are mounted, or during initial workpiece verification when the type of substrate product to be produced is changed.

6. The substrate height measuring device according to any one of claims 1 to 3, wherein, The substrate height measuring device includes a display unit that displays the coordinates of the measuring position in the substrate and the measurement result measured by the measuring unit.

7. A substrate height measuring device, comprising: The imaging unit enables the imaging device to capture images of at least a portion of the substrate, including a predetermined position for determining the height of the clamped substrate. The setting unit displays a substrate image captured by the imaging unit on a display device, and can adjust the actual measurement position for measuring the height of the substrate based on the predetermined measurement position of the substrate image displayed on the display device, thereby setting the measurement position. and The measuring unit measures the height of the substrate at the measuring position set by the setting unit. The substrate height measuring device includes a display unit that displays the coordinates of the measuring position in the substrate and the measurement result measured by the measuring unit. On the substrate, a plurality of the predetermined measurement positions are provided. Regarding each of the plurality of predetermined measurement positions, the setting unit sets at least one associated measurement position around the measurement position, which is either a reference measurement position set for adjusting the predetermined measurement position or a measurement position set without adjusting the predetermined measurement position. Regarding the multiple reference measurement positions, the display unit provides a summary display of identification information for the corresponding predetermined measurement position, the coordinates of the reference measurement position on the substrate, and the measurement results measured by the measurement unit. The setting unit sets at least one associated measurement position around the measurement position, which is either a reference measurement position set for adjusting the predetermined measurement position or a measurement position set without adjusting the predetermined measurement position. The display unit also displays the elevation difference obtained by subtracting the lowest value from the highest value of the measurement results of the reference measurement position and the associated measurement position measured by the measurement unit. The display unit changes its display method in a manner that enables it to recognize the display of a reference measurement position where the elevation difference exceeds a predetermined value and the display of a reference measurement position where the elevation difference is below a predetermined value.

8. The substrate height measuring device according to claim 6, wherein, The setting unit sets at least one associated measurement position around the measurement position, which is either a reference measurement position set for adjusting the predetermined measurement position or a measurement position set without adjusting the predetermined measurement position. The display unit also displays the height difference obtained by subtracting the lowest value from the highest value of the measurement results of the reference measurement position and the associated measurement position measured by the measurement unit.

9. The substrate height measuring device according to claim 7, wherein, The display unit changes its display method in a manner that enables it to recognize the display of a reference measurement position where the elevation difference exceeds a predetermined value and the display of a reference measurement position where the elevation difference is below a predetermined value.

10. The substrate height measuring device according to any one of claims 7 to 9, wherein, Regarding the reference measurement position where the elevation difference exceeds a predetermined value, the display unit guides the adjustment for the predetermined measurement position.

11. A method for measuring the height of a substrate, comprising: The imaging process involves the imaging device capturing an area of ​​at least a portion of the substrate, including a predetermined position for determining the height of the clamped substrate. A setting process is adopted to display a substrate image captured by the imaging process on a display device. Based on the predetermined measurement position of the substrate image displayed on the display device, the measurement position for actually measuring the height of the substrate is adjusted, thereby setting the measurement position. In the measurement process, the measuring device measures the height of the substrate at the measurement position set by the setting process. In the setting process, at least one associated measurement position is set around the measurement position which is set as a reference measurement position for adjusting the predetermined measurement position or for setting the measurement position without adjusting the predetermined measurement position, and the coordinates of the reference measurement position and the associated measurement position in the substrate and the measurement result measured by the measurement process are displayed on the display device.

Images