Substrate processing machine

Abstract

A substrate processing machine has a pair of conveyance tracks that convey a substrate, and a bending device that bends a lead of a lead component, the bending device being disposed between the pair of conveyance tracks to bend the lead of the lead component mounted on the substrate conveyed by the pair of conveyance tracks, the pair of conveyance tracks each having a clamping device that clamps the substrate.

Description

Technical Field

[0001] This invention relates to a substrate handling machine that uses a pair of transport tracks to transport substrates. Background Technology

[0002] As described in the following patent document, there exists a substrate working machine that performs operations on substrates transported by a pair of transport tracks.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-267036 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In substrate handling machines that operate on substrates transported by a pair of transport tracks, there are cases where a bending device for bending the leads is provided between the pair of transport tracks. In such cases, properly clamping the substrate becomes a challenge.

[0008] Technical solutions for solving the problem

[0009] To address the aforementioned issues, this specification discloses a substrate processing machine comprising: a pair of transport tracks for transporting substrates; and a bending device for bending the leads of lead elements, the bending device being disposed between the pair of transport tracks for bending the leads of lead elements mounted on the substrate transported by the pair of transport tracks, each of the pair of transport tracks having a clamping device for clamping the substrate.

[0010] Invention Effects

[0011] According to this disclosure, each of the pair of transport tracks is provided with a clamping device for clamping the substrate. Therefore, in a substrate handling machine that operates on a substrate transported by the pair of transport tracks, the substrate can be properly clamped even when a bending device is provided between the pair of transport tracks. Attached Figure Description

[0012] Figure 1 It is a three-dimensional diagram showing a component mounting machine.

[0013] Figure 2 It is a three-dimensional diagram showing the component assembly.

[0014] Figure 3 This is a perspective view of a substrate handling and holding device.

[0015] Figure 4 It means Figure 3 An enlarged perspective view of the substrate handling and holding device.

[0016] Figure 5 yes Figure 4 A cross-sectional view at line AA.

[0017] Figure 6 This is a three-dimensional diagram representing the cutting and bending unit.

[0018] Figure 7 This is a schematic diagram of a cutting and bending unit used to cut or bend the pins of a pinned element.

[0019] Figure 8 It is a perspective view showing the cutting and bending unit and the unit moving device.

[0020] Figure 9 It means and Figure 3 A perspective view of different substrate handling and holding devices.

[0021] Figure 10 It means Figure 9 An enlarged perspective view of the substrate handling and holding device.

[0022] Figure 11 yes Figure 10 A cross-sectional view at line BB. Detailed Implementation

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as a means of carrying out the present invention.

[0024] exist Figure 1 The image shows a component mounting machine 10. The component mounting machine 10 is a device for performing component mounting operations relative to a circuit substrate 12. The component mounting machine 10 includes a device body 20, a component assembly device 22, a marking camera 24, a component camera 26, a component supply device 28, a bulk component supply device 30, a substrate handling and holding device 32, and a cutting and bending unit (see reference). Figure 3 34. Unit moving device (refer to) Figure 3 36. In addition, as a circuit substrate 12, examples include circuit boards, three-dimensional substrates, etc., and as a circuit board, examples include printed wiring boards, printed circuit boards, etc.

[0025] The main body 20 of the device consists of a frame 40 and beams 42 mounted on the frame 40. Furthermore, in the following description, the width direction of the main body 20 is referred to as the X direction, the front-to-back direction of the main body 20 is referred to as the Y direction, and the vertical direction is referred to as the Z direction.

[0026] The component assembly device 22 is mounted on beam 42 and has two working heads 60 and 62 and a working head moving device 64. For example... Figure 2As shown, each working head 60, 62 has a suction nozzle 66 on its lower end face, which is used to adsorb and hold the element. Furthermore, the working head moving device 64 includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two working heads 60, 62 can move integrally to any position on the frame 40 via the X-direction moving device 68 and the Y-direction moving device 70. Additionally, each working head 60, 62 is detachably mounted to sliding members 74, 76, and the Z-direction moving device 72 allows the sliding members 74, 76 to move independently in the vertical direction. That is, the working heads 60, 62 can move independently in the vertical direction via the Z-direction moving device 72.

[0027] In addition, such as Figure 2 As shown, the marking camera 24 is mounted on the slider 74 with its orientation downwards. Therefore, the marking camera 24, together with the working head 60, moves along the X, Y, and Z directions to capture images at any position on the frame 40. Figure 1 As shown, the part camera 26 is disposed on the frame 40 between the component supply device 28 and the substrate handling and holding device 32, facing upwards. Thus, the part camera 26 captures images of the components held by the suction nozzles 66 of the working heads 60 and 62.

[0028] The component supply device 28 is positioned and disposed at one end of the frame 40 in a detachable manner in the front-rear direction. The component supply device 28 includes a tray-type component supply device 86 and a feeder-type component supply device 88. The tray-type component supply device 86 is a device for supplying components placed on a tray. The feeder-type component supply device 88 is a device for supplying components to the component assembly device 22 via a belt feeder or a rod feeder (not shown).

[0029] The bulk component supply device 30 is positioned and disposed at the other end of the frame 40 in a detachable manner in the front-rear direction. The bulk component supply device 30 is a device that arranges multiple components in a dispersed state neatly and supplies components in a neatly arranged state. That is, it is a device that arranges multiple components in arbitrary positions neatly into a predetermined position and supplies the components in the predetermined position to the component assembly device 22.

[0030] Furthermore, the components supplied by the component supply device 28 and the bulk component supply device 30 include electronic circuit components, components of solar cells, components of power modules, etc. Additionally, electronic circuit components may include components with leads or components without leads.

[0031] The substrate handling and holding device 32 is disposed at the center of the frame 40 in the front-rear direction, such as Figure 3As shown, the device includes a pair of transport tracks 100 and 102, a reciprocating device 104, and a pair of clamping devices 106 and 108. The pair of transport tracks 100 and 102 are arranged opposite each other in the Y direction, extending in the X direction. Since the pair of transport tracks 100 and 102 have substantially the same structure, the description will focus on transport track 100.

[0032] The transport track 100 consists of a pair of support legs 112 and 114 and a bridging member 116. The pair of support legs 112 and 114 are erected on the upper surface of the base 118 of the substrate transport and holding device 32, separated in the X direction. The bridging member 116 is mounted on the pair of support legs 112 and 114, extending in the X direction. A first conveyor belt 120 is wound around one end of the bridging member 116 in the X direction, and a second conveyor belt 122 is wound around the other end in the X direction. The first conveyor belt 120 is driven by an electromagnetic motor 124 to... Figure 3 The first conveyor belt rotates clockwise, while the second conveyor belt 122 rotates in the same direction as the first conveyor belt 122, driven by the electromagnetic motor 126.

[0033] Thus, the circuit substrate 12 supported on the first conveyor belt 120 of the pair of transport tracks 100, 102 is transported into the component mounting machine 10, and the circuit substrate 12 supported on the second conveyor belt 122 of the pair of transport tracks 100, 102 is transported out of the component mounting machine 10. Therefore, the side with the first conveyor belt 120 is described as the upstream side, and the side with the second conveyor belt 122 is described as the downstream side. Furthermore, the pair of transport tracks 100, 102, the first conveyor belt 120, and the second conveyor belt 122 are the structures constituting the component mounting machine 10. That is, the component mounting machine 10 includes the pair of transport tracks 100, 102, the first conveyor belt 120, and the second conveyor belt 122.

[0034] Furthermore, the distance between the first conveyor belt 120 and the second conveyor belt 122 in the X direction is longer than the length of the circuit substrate 12, and a guide rail 130 is provided between the first conveyor belt 120 and the second conveyor belt 122 in an X-direction extending manner. Therefore, the circuit substrate 12, which is carried into the component mounting machine 10 by the first conveyor belt 120, is transported onto the guide rail 130. However, since the distance between the first conveyor belt 120 and the second conveyor belt 122 in the X direction is longer than the length of the circuit substrate 12, it is impossible to transport the circuit substrate 12 transported onto the guide rail 130 using either the first conveyor belt 120 or the second conveyor belt 122. Therefore, a reciprocating device 104 is provided on the transport track 100.

[0035] like Figure 4As shown, the reciprocating device 104 includes a slide rail 132, a slider 134, a sliding arm 136, and a sliding pin 138. The slide rail 132 is disposed on the upper surface of the bridging member 116 in an X-direction extending position. The slider 134 is supported by the slide rail 132 and is able to slide in the X-direction. The slider 134 can slide controllably by being driven by an electromagnetic motor (not shown).

[0036] Furthermore, a sliding arm 136 is provided on the upper surface of the slider 134 in a manner that allows it to swing vertically, and its swing can be controlled by a cylinder (not shown). When the sliding arm 136 swings downwards, it swings to a position that presses and transports the circuit substrate 12; when it swings upwards, it swings to a retracted position so that the circuit substrate 12 can be transported in the transport tracks 100 and 102. Specifically, the sliding arm 136 is approximately horizontal when swinging downwards, and its front end extends upwards when swinging upwards. Furthermore, when the sliding arm 136 swings downwards, its front end extends towards the circuit substrate 12 supported by the guide rail 130, as seen from above. Furthermore, the sliding pin 138 is fixed to the front end of the sliding arm 136 in a downward extending state. When the sliding arm 136 swings downward, the lower end of the sliding pin 138 extends downward beyond the circuit substrate 12 supported by the guide rail 130.

[0037] Therefore, the circuit substrate 12, transported from the first conveyor belt 120 to the guide rail 130, is transported to the second conveyor belt 122 by the sliding pin 138 of the reciprocating device 104. That is, when the circuit substrate 12 is transported to the guide rail 130 using the first conveyor belt 120, the slider 134 is positioned upstream of the guide rail 130, and the sliding arm 136 swings upward. Furthermore, when the circuit substrate 12 is transported to the guide rail 130 via the first conveyor belt 120, the sliding arm 136 swings downward. Next, the slider 134 slides downstream, causing the sliding pin 138 to abut against the circuit substrate 12 supported by the guide rail 130. The slider 134 then slides further downstream, i.e., to the second conveyor belt 122, thereby transporting the circuit substrate 12 to the second conveyor belt 122. Finally, the circuit substrate 12 transported to the second conveyor belt 122 is removed from the component mounting machine 10 via the second conveyor belt 122. That is, in the substrate handling and holding device 32, the circuit substrate 12 is transported into the component mounting machine 10 by the first conveyor belt 120 and then transported onto the guide rail 130. On the guide rail 130, the circuit substrate 12 is transported toward the second conveyor belt 122 by the sliding pin 138 of the reciprocating device 104, and the circuit substrate 12 transported to the second conveyor belt 122 is removed from the component mounting machine 10.

[0038] In addition, a pair of clamping devices 106 and 108 are provided on a pair of transport tracks 100 and 102. That is, clamping device 106 is provided on transport track 100, and clamping device 108 is provided on transport track 102. Since the pair of clamping devices 106 and 108 have approximately the same structure, clamping device 106 will be used as an example for explanation.

[0039] like Figure 4 as well as Figure 4 The sectional view of line AA is Figure 5 As shown, the clamping device 106 includes a clamping plate 150 and a cylinder 152. The clamping plate 150 is elongated and its length is slightly shorter than that of the guide rail 130. The clamping plate 150 is positioned above the guide rail 130, opposite to it, and is capable of sliding vertically. The cylinder 152 is positioned on the outside of the guide rail 130, opposite to the circuit substrate 12 supported by the guide rail 130, and extends vertically, with its rod 154 extending upwards. The clamping plate 150 is connected to the rod 154 of the cylinder 152 on the outside of the guide rail 130.

[0040] With this configuration, the cylinder 152 retracts, causing the clamping plate 150 to slide downwards. At this time, as... Figure 5As shown, the clamping plate 150 abuts against the upper surface of the circuit substrate 12 supported by the guide rail 130. Thus, the circuit substrate 12 supported by the guide rail 130 is clamped and held in place by the guide rail 130 and the clamping plate 150. Furthermore, as the cylinder 152 extends, the clamping plate 150 slides upwards, thereby separating from the circuit substrate 12 supported by the guide rail 130, and the clamping between the guide rail 130 and the clamping plate 150 is released.

[0041] That is, in the substrate handling and holding device 32, when the circuit substrate 12, which is carried into the component mounting machine 10 by the first conveyor belt 120, is transported to the guide rail 130, the cylinder 152 retracts and is clamped by the clamping plate 150 and the guide rail 130. Then, operations based on the working heads 60, 62, etc., are performed on the circuit substrate 12 clamped by the clamping plate 150 and the guide rail 130. That is, the position where the circuit substrate 12 is clamped on the upper surface of the guide rail 130 by the guide rail 130 and the clamping plate 150 becomes the working position relative to the circuit substrate 12. Next, when the operation on the circuit substrate 12 is completed, the cylinder 152 extends, and the clamping based on the guide rail 130 and the clamping plate 150 is released. Then, through the operation of the reciprocating device 104, the circuit substrate 12 is transported from the guide rail 130 to the second conveyor belt 122, and then transported downstream by the second conveyor belt 122, thereby being removed from the component mounting machine 10. Thus, in the substrate handling and holding device 32, the following are performed: the circuit substrate 12 is loaded onto the first conveyor belt 120; the circuit substrate 12 is clamped at the working position based on the clamping devices 106 and 108; the circuit substrate 12 is transported from the working position toward the second conveyor belt 122 based on the reciprocating device 104; and the circuit substrate 12 is unloaded based on the second conveyor belt 122.

[0042] In addition, such as Figure 3 As shown, below the pair of transport tracks 100, 102 of the substrate transport and holding device 32, and between the pair of transport tracks 100, 102, at a position where support pins and support plates for mounting electronic circuit components on the circuit substrate 12 are provided, a cutting and bending unit 34 and a unit moving device 36 are provided. That is, when viewed from above, the cutting and bending unit 34 and the unit moving device 36 are provided between the pair of transport tracks 100, 102. The unit moving device 36 is fixed to the upper surface of the base plate 160 of the base 118 constituting the substrate transport and holding device 32, and the cutting and bending unit 34 moves to any position by the action of the unit moving device 36. Furthermore, the cutting and bending unit 34 moves below the circuit substrate 12 transported by the substrate transport and holding device 32.

[0043] In detail, such as Figure 6As shown, the cutting and bending unit 34 has a pair of sliders 170. The pair of sliders 170 are supported by a slide rail 172 arranged in a straight line so that they can slide in a close-up and separate manner. Furthermore, the sliders 170 slide by being driven by an electromagnetic motor (not shown), so that the distance between the pair of sliders 170 can be controlled to change.

[0044] Furthermore, each of the pair of sliders 170 includes a fixed portion 176 and a movable portion 178. The fixed portion 176 is slidably held on the slide rail 172. The movable portion 178 is held by the fixed portion 176 to allow it to slide in the X direction. The movable portion 178 is connected by a cylinder (see reference...). Figure 6 Driven by the air inlet, it can slide in a controlled manner by moving linearly relative to the fixed part 176 to approach and separate.

[0045] In addition, such as Figure 7 As shown, the upper end of the fixing part 176 is tapered, and a first insertion hole 180 is formed therethrough in the vertical direction. Furthermore, the opening edge of the first insertion hole 180 facing the upper end face is a fixing blade 182. On the other hand, the upper end of the movable part 178 is also tapered, and an L-shaped curved part 184 is formed thereon at its upper end. The curved part 184 extends upward toward the upper end face of the fixing part 176. The first insertion hole 180, which opens at the upper end face of the fixing part 176, is covered by the curved part 184, but a second insertion hole 186 is formed in the curved part 184 opposite to the first insertion hole 180. Moreover, the opening edge of the second insertion hole 186 facing the lower end face of the curved part 184 is a movable blade 188.

[0046] In addition, such as Figure 8 As shown, the unit moving device 36 includes an X-direction moving device 190, a Y-direction moving device 192, a Z-direction moving device 194, and a rotation device 196. The X-direction moving device 190 includes a slide rail 200 and an X-slider 202. The slide rail 200 is arranged to extend along the X-direction, and the X-slider 202 is slidably held on the slide rail 200. Furthermore, the X-slider 202 moves along the X-direction by being driven by an electromagnetic motor (not shown).

[0047] The Y-direction moving device 192 includes a slide rail 206 and a Y-slider 208. The slide rail 206 is disposed on the X-slider 202 extending in the Y direction, and the Y-slider 208 is slidably held on the slide rail 206. The Y-slider 208 moves in the Y direction driven by an electromagnetic motor (not shown). The Z-direction moving device 194 includes a slide rail 210 and a Z-slider 212. The slide rail 210 is disposed on the Y-slider 208 extending in the Z direction, and the Z-slider 212 is slidably held on the slide rail 210. The Z-slider 212 moves in the Z direction driven by an electromagnetic motor (not shown).

[0048] Furthermore, the rotation device 196 has a generally disc-shaped rotary table 216. The rotary table 216 is supported on the Z-slider 212 so as to be able to rotate around its axis, and is driven by an electromagnetic motor (not shown). Moreover, the cutting and bending unit 34 is detachably mounted on the rotary table 216 for easy replacement. With this configuration, the cutting and bending unit 34 can move to any position between the pair of transport tracks 100, 102 via the X-direction moving device 190, the Y-direction moving device 192, and the Z-direction moving device 194, and rotate at any angle via the rotation device 196. That is, the cutting and bending unit 34 can be positioned at any position between the pair of transport tracks 100, 102 below the circuit substrate 12 held by the clamping devices 106, 108.

[0049] In the component mounting machine 10, the above-described structure is used to assemble components onto the circuit substrate 12, which is clamped by the substrate transport and holding device 32. The component mounting machine 10 can assemble various components onto the circuit substrate 12. The following describes the assembly of leaded components (refer to...) Figure 7 The case where 220 is assembled on the circuit substrate 12 will be explained.

[0050] Specifically, the circuit substrate 12 is transported to the working position, i.e., the upper surface of the guide rail 130, by the first conveyor belt 120 of the substrate transport and holding device 32, where it is fixedly held by the guide rail 130 and clamping plate 150 of the clamping devices 106 and 108. Next, the marking camera 24 moves upwards towards the circuit substrate 12 to photograph it. This obtains information related to the holding position of the circuit substrate 12. Additionally, the component supply device 28 or the bulk component supply device 30 supplies the lead element 220 at a predetermined supply position. Furthermore, one of the working heads 60 and 62 moves upwards towards the component supply position and, through the suction nozzle 66, applies pressure to the component body portion (see reference 60) of the lead element 220. Figure 7 )222 is adsorbed and retained.

[0051] Next, the working heads 60 and 62, holding the lead element 220, move upwards towards the part camera 26, and the part camera 26 captures an image of the lead element 220 held by the nozzle 66. This obtains information related to the holding position of the element. Then, the working heads 60 and 62, holding the lead element 220, move upwards towards the circuit substrate 12, correcting errors in the holding position of the circuit substrate 12 and the holding position of the element. Furthermore, the leads of the lead element 220 held by the nozzle 66 (see reference) are... Figure 7 )224 is inserted into a through hole formed in the circuit substrate 12 (refer to) Figure 7 )226. At this time, the cutting and bending unit 34 moves downwards from the through hole 226.

[0052] Specifically, in the cutting and bending unit 34, the distance between the pair of sliders 170 is changed so that the distance or spacing between the second insertion holes 186 of the movable portions 178 of the pair of sliders 170 is the same as the distance or spacing between the two through holes 226 formed in the circuit substrate 12. Furthermore, through the operation of the X-direction moving device 190 and the Y-direction moving device 192, the cutting and bending unit 34 moves in such a way that the coordinates of the second insertion holes 186 of the sliders 170 in the XY direction are aligned with the coordinates of the through holes 226 of the circuit substrate 12 in the XY direction. Thus, the cutting and bending unit 34 moves along the XY direction, causing the second insertion holes 186 of the sliders 170 to overlap with the through holes 226 of the circuit substrate 12 in the vertical direction.

[0053] Next, the cutting and bending unit 34 rises by moving the Z-direction moving device 194 so that the upper surface of the movable part 178 contacts the lower surface of the circuit substrate 12 or is positioned slightly below the lower surface of the circuit substrate 12. Thus, by controlling the movement of the X-direction moving device 190, the Y-direction moving device 192, and the Z-direction moving device 194, the cutting and bending unit 34 is positioned below the through hole 226 of the circuit substrate 12 with the second insertion hole 186 of the slider 170 overlapping with the through hole 226 of the circuit substrate 12.

[0054] Furthermore, the working heads 60 and 62 descend due to the action of the Z-direction moving device 72, thereby inserting the pins 224 of the lead element 220 held by the suction nozzle 66 into the through hole 226 of the circuit substrate 12. At this time, as... Figure 7 As shown, the tip of the pin 224, which is inserted into the through hole 226, is inserted into the first insertion hole 180 of the fixed part 176 via the second insertion hole 186 of the movable part 178 of the cutting and bending unit 34. Then, when the tip of the pin 224 is inserted into the first insertion hole 180 of the fixed part 176, the movable part 178 slides by the action of the electromagnetic motor.

[0055] Thus, the pin 224 is cut to the same length by the fixing blade 182 of the first insertion hole 180 and the movable blade 188 of the second insertion hole 186. Furthermore, the new leading edge of the pin 224 formed by the cutting bends as the movable part 178 slides. Thus, the pin element 220 is assembled onto the circuit substrate 12 while preventing the pin 224 from falling out of the through hole 226.

[0056] Thus, in the component mounting machine 10, since the cutting and bending unit 34 moves to any position in the downward direction of the clamped circuit substrate 12, the leads of the leaded components assembled on the circuit substrate 12 are bent by the cutting and bending unit 34. On the other hand, in conventional mounting machines, a clamping device for clamping the substrate is provided between a pair of transport rails 100, 102, but in the component mounting machine 10, the cutting and bending unit 34 is provided between a pair of transport rails 100, 102. Therefore, in the component mounting machine 10, the clamping devices 106, 108 for clamping the circuit substrate 12 are provided between a pair of transport rails 100, 102. As a result, in the component mounting machine 10, where the cutting and bending unit 34 is provided between a pair of transport rails 100, 102, assembly operations can also be performed on the clamped circuit substrate 12.

[0057] Furthermore, in the substrate handling and holding device 32, a conveyor belt is not provided at the working position where the circuit substrate 12 is clamped; instead, a guide rail 130 is provided to support the circuit substrate 12 from below. Therefore, as Figure 5 As shown, a space free of any fixtures is ensured below the guide rail 130, allowing the cutting and bending unit 34 to move to this space, i.e., below the guide rail 130. This allows the lead element 220 to be fitted onto the edge of the circuit substrate 12 clamped in the work position. To bend the leads 224 of the lead element 220, the cutting and bending unit 34 can move downwards from the lead element 220. In other words, the lead element 220 can be fitted onto the edge of the circuit substrate 12 clamped in the work position. On the other hand, the conveyor belt occupies a relatively large space due to the mechanism for winding the conveyor belt and the space for winding the conveyor belt. Therefore, when the conveyor belt is provided in the work position, it occupies the space below the edge of the circuit substrate 12 clamped in the work position, making it impossible for the cutting and bending unit 34 to move to the edge of the circuit substrate 12. That is, when the conveyor belt is provided in the work position, the lead element 220 cannot be fitted onto the edge of the circuit substrate 12 clamped in the work position. Thus, in the substrate handling and holding device 32, instead of a conveyor belt, a guide rail 130 is provided at the working position where the circuit substrate 12 is clamped, thereby ensuring that the lead element 220 is assembled toward the edge of the circuit substrate 12 clamped at the working position.

[0058] However, if a guide rail 130 is provided instead of a conveyor belt at the working position where the circuit substrate 12 is clamped, a reciprocating device 104 is required to move the circuit substrate 12 at that working position, i.e., on the guide rail 130. For example... Figure 3 As shown, the reciprocating device 104 is disposed on the upper surface of the transport track 100. However, in order to ensure that the clamping device 106 slides upward toward the clamping plate 150, it is configured to avoid the upper surface of the clamping plate and extend outward toward the outside of the clamping plate, that is, to the opposite side of the circuit substrate clamped by the clamping plate. In other words, the reciprocating device 104 is disposed on the side of the transport track 100 opposite to the transport track 102, that is, on the outside of the transport track 102. Therefore, even if it is desired to separate the distance between the transport track 100 and the transport track 102, the reciprocating device 104 will become an obstacle, and there is a situation where it is impossible to increase the distance between the transport track 100 and the transport track 102, and it is impossible to transport large-sized circuit substrates 12.

[0059] In this situation, it is possible to use Figure 9 The substrate handling and holding device 230 shown replaces the substrate handling and holding device 32. The substrate handling and holding device 230 has a pair of handling tracks 240, 242 and a pair of clamping devices 246, 248. Similar to the pair of handling tracks 100, 102 of the substrate handling and holding device 32, the pair of handling tracks 240, 242 are arranged opposite each other in the Y direction, extending along the X direction. Since the pair of handling tracks 240, 242 have substantially the same construction, the description will focus on handling track 240.

[0060] The transport track 240, like the transport track 100 of the substrate transport and holding device 32, is composed of a pair of support legs 252, 254 and a bridging member 256. The pair of support legs 252, 254 are erected separately in the X direction, and the bridging member 256 is mounted on these support legs 252, 254, extending in the X direction. A conveyor belt 260 is wound around the bridging member 256, extending in the X direction from one end to the other. That is, the conveyor belt 260 is wound around the bridging member 256, extending in the X direction over the entire area from the upstream end to the downstream end. Furthermore, the conveyor belt 260 is driven by an electromagnetic motor 262. Figure 9 Rotate clockwise within.

[0061] Thus, the circuit substrate 12, supported by the conveyor belt 260 of a pair of transport tracks 240, 242, is transported into the component mounting machine 10, moved from the upstream side to the downstream side of the substrate transport holding device 230, and removed from the component mounting machine 10. That is, in the substrate transport holding device 230, the transport of the circuit substrate 12 toward the component mounting machine 10, the transport of the circuit substrate 12 inside the substrate transport holding device 230, and the removal of the circuit substrate 12 from the component mounting machine 10 are performed solely by the conveyor belt 260 provided by the pair of transport tracks 240, 242, without using the reciprocating device 104.

[0062] In addition, a pair of clamping devices 246 and 248 are provided on a pair of transport tracks 240 and 242. That is, clamping device 246 is provided on transport track 240, and clamping device 248 is provided on transport track 242. Since the pair of clamping devices 246 and 248 have approximately the same structure, clamping device 246 will be used as an example for explanation.

[0063] like Figure 10 as well as Figure 10 The sectional view of the BB line is Figure 11 As shown, the clamping device 106 includes a clamping rod 270, a lifting member 272, and a cylinder 274. The clamping rod 270 is rod-shaped, and its length is the same as that of the bridging member 256. Furthermore, the clamping rod 270 is positioned above the conveyor belt 260 wound around the bridging member 256, opposite to the conveyor belt 260.

[0064] Furthermore, the lifting member 272 is generally elongated and plate-shaped, with its edge bent into an L-shape along its length. The length of the lifting member 272 is approximately half the length of the bridging member 256. The lifting member 272 is positioned below the center of the conveyor belt 260 in the X direction and is held by the bridging member 256 to allow it to slide vertically. In the lifting member 272 positioned below the conveyor belt 260, the curved edge of the lifting member 272 extends upwards on the inner side of the conveyor belt 260, i.e., the same side as the circuit substrate 12 supported by the conveyor belt 260. The cylinder 274 is positioned on the outer side of the conveyor belt 260, i.e., opposite to the circuit substrate 12 supported by the conveyor belt 260, with its rod 276 extending downwards. The lifting member 272 is connected to the rod 276 of the cylinder 274 on the outer side of the conveyor belt 260.

[0065] Therefore, by extending the cylinder 274, the lifting member 272 slides downwards; by retracting the cylinder 274, the lifting member 272 slides upwards. Furthermore, in the state where the lifting member 272 slides downwards, the curved edge of the lifting member 272 extending towards the inside of the conveyor belt 260 descends downwards compared to the upper surface of the conveyor belt 260. On the other hand, in the state where the lifting member 272 slides upwards, the curved edge of the lifting member 272 extending towards the inside of the conveyor belt 260 rises upwards compared to the upper surface of the conveyor belt 260.

[0066] With this configuration, as the cylinder 274 extends, the lifting member 272 slides downward, causing the curved edge of the lifting member 272 to descend to a position lower than the upper surface of the conveyor belt 260, thus enabling the conveyor belt 260 to transport the circuit substrate 12. Conversely, as the cylinder 274 retracts, the lifting member 272 slides upward, causing the curved edge of the lifting member 272 to rise to a position higher than the upper surface of the conveyor belt 260. Therefore, when the circuit substrate 12 is located above the lifting member 272, the circuit substrate 12 is lifted by the lifting member 272. At this time, as... Figure 11 As shown, the clamping rod 270 abuts against the upper surface of the circuit substrate 12 lifted by the lifting member 272. Thus, the circuit substrate 12, lifted from the conveyor belt 260, is clamped and held by the lifting member 272 and the clamping rod 270. Furthermore, as the cylinder 274 extends, the lifting member 272 slides downwards, thereby releasing the clamping action between the lifting member 272 and the clamping rod 270, and the circuit substrate 12 is once again placed on the conveyor belt 260.

[0067] That is, in the substrate handling and holding device 230, the circuit substrate 12 is transported into the component mounting machine 10 by the conveyor belt 260. At this time, with the cylinder 274 extended and the lifting member 272 lowered, when the circuit substrate 12 is transported by the conveyor belt 260 above the lifting member 272, the conveyor belt 260 stops. Then, the cylinder 274 retracts, the lifting member 272 rises, and the circuit substrate 12 is clamped by the lifting member 272 and the clamping rod 270. Thus, operations based on the working heads 60, 62, etc., are performed on the circuit substrate 12 clamped by the lifting member 272 and the clamping rod 270. That is, the position above the lifting member 272 where the circuit substrate 12 is clamped by the lifting member 272 and the clamping rod 270 becomes the working position relative to the circuit substrate 12. Next, when the work on the circuit substrate 12 is completed, the cylinder 274 extends and the lifting member 272 descends, thereby releasing the clamping of the lifting member 272 and the clamping rod 270, and the circuit substrate 12 is placed on the conveyor belt 260. Then, the circuit substrate 12 is transported from the working position to the downstream side by the conveyor belt 260 and removed from the component mounting machine 10.

[0068] Thus, in the substrate handling and holding device 230, a reciprocating device is not used; the conveyor belt 260 alone performs the following operations: the transport of the circuit substrate 12 toward the component mounting machine 10, the transport of the circuit substrate 12 within the substrate handling and holding device 230, and the transport of the circuit substrate 12 from the component mounting machine 10. Therefore, in the substrate handling and holding device 230, the transport rails 240 and 242 can be arranged separately with a distance comparable to that of the reciprocating device, enabling the transport of large-sized circuit substrates. That is, by arranging the transport rails 240 at the location where the reciprocating device 104 is located, the distance between the transport rails 240 and 242 can be extended. This allows for the transport of large-sized circuit substrates. Furthermore, in the substrate handling and holding device 230, a cutting and bending unit 34 is also arranged between the pair of transport rails 240 and 242, but a pair of clamping devices 246 and 248 for clamping the circuit substrate 12 are arranged on the pair of transport rails 240 and 242. Therefore, in the component mounting machine 10, which is equipped with a cutting and bending unit 34 between a pair of transport tracks 240 and 242, it is also possible to assemble electronic circuit components on the clamped circuit substrate 12.

[0069] Incidentally, component mounting machine 10 is an example of a substrate mounting machine. Circuit substrate 12 is an example of a substrate. Cutting and bending unit 34 is an example of a bending device. Transport tracks 100 and 102 are examples of transport tracks. Clamping devices 106 and 108 are examples of clamping devices. First conveyor belt 120 and second conveyor belt 122 are examples of conveyor belts. Clamping plate 150 is an example of a clamping component. Lead element 220 is an example of a lead element. Lead 224 is an example of a lead. Transport tracks 240 and 242 are examples of transport tracks. Clamping devices 246 and 248 are examples of clamping devices. Conveyor belt 260 is an example of a conveyor belt. Clamping bar 270 is an example of a clamping component. Lifting component 272 is an example of a lifting component.

[0070] Furthermore, the present invention is not limited to the above embodiments and can be implemented in various ways with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, a first conveyor belt 120 and a second conveyor belt 122 are arranged on the upstream and downstream sides of transport tracks 100 and 102, respectively, with a guide rail 130 arranged between them. Alternatively, a conveyor belt may be arranged only on one of the upstream and downstream sides of transport tracks 100 and 102, while the other transport tracks 100 and 102 may have a guide rail 130. Additionally, while transport tracks 100 and 102 may have both a conveyor belt and a guide rail 130, transport tracks 240 and 242 may only have a conveyor belt 260, or only a guide rail 130 may be provided on the transport tracks. In this case, the circuit substrate 12 is transported along the guide rail 130 using only a reciprocating device.

[0071] In addition, in the above embodiments, the circuit substrate 12 is clamped by clamping the upper and lower surfaces from the top and bottom, but it can also be clamped by clamping the two edges transported by the transport track of the circuit substrate 12 from the left and right.

[0072] Furthermore, in the above embodiment, a lifting member 272 is used in the substrate handling and holding device 230 to lift the circuit substrate 12 placed on the conveyor belt 260. However, a lifting member 272 can also be used in the substrate handling and holding device 32 to lift the circuit substrate 12 placed on the guide rail 130. Additionally, the circuit substrate 12 can also be clamped using the lifting member 272 and the clamping plate 150.

[0073] Furthermore, in the above embodiment, a cutting and bending unit 34 is used to cut and bend the pins 224 of the pin element 220. However, a device that bends the pins 224 without cutting them can also be used. Even if such a device is used, it is disposed between a pair of transport rails, and thus can achieve the same effect as in the above embodiment.

[0074] Explanation of reference numerals in the attached figures

[0075] 10: Component mounting machine (substrate handling machine) 12: Circuit substrate (substrate) 34: Cutting and bending unit (bending device) 100: Transport track 102: Transport track 106: Clamping device 108: Clamping device 120: First conveyor belt 122: Second conveyor belt 150: Clamping plate (clamping component) 220: Lead component 224: Lead 240: Transport track 242: Transport track 246: Clamping device 248: Clamping device 260: Conveyor belt 270: Clamping rod 272: Lifting component.

Claims

1. A substrate processing machine, comprising: A pair of transport tracks for transporting substrates; and A bending device that bends the leads of a pinned component. The bending device is disposed between the pair of transport tracks and bends the leads of the lead elements assembled on the substrate transported by the pair of transport tracks. Each of the pair of transport tracks includes a pair of support legs and a bridging component mounted on the pair of support legs. Each of the pair of transport tracks is equipped with a clamping device for clamping the base plate. Each of the pair of transport tracks has a conveyor belt for transporting the substrate. As the conveyor belts, a first conveyor belt and a second conveyor belt are respectively provided at the upstream and downstream ends of the bridging component. The substrate supported on the first conveyor belt of the pair of transport tracks is fed into the substrate pairing machine, and the substrate supported on the second conveyor belt of the pair of transport tracks is removed from the substrate pairing machine. In the work position where the substrate is clamped between the first conveyor belt and the second conveyor belt, neither the first nor the second conveyor belt is provided; instead, a guide rail is provided to support the substrate from below. The clamping device includes a clamping plate and a cylinder. The clamping plate is configured above the guide rail and opposite to the guide rail, and is capable of sliding in the vertical direction. The cylinder is positioned on the outside of the guide rail. The substrate, transported to the working position by the first conveyor belt, is fixedly held on the upper surface of the guide rail by the clamping device and the guide rail. The reciprocating device is arranged on the upper surface side of the pair of transport tracks and on the outer side in a manner that avoids the clamping device. The reciprocating device has a slide rail, and the substrate, which is transported to the guide rail by the first conveyor belt, is transported to the second conveyor belt by the reciprocating device.

2. The substrate processing machine according to claim 1, wherein, The clamping device has the clamping plate as a clamping component that abuts against and clamps the upper surface of the substrate.

3. The substrate processing machine according to claim 1 or 2, wherein, The clamping device has the cylinder as a lifting component to lift and clamp the substrate.

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