thermoelectric device

Abstract

According to embodiments, a thermoelectric device is disclosed, including: a thermoelectric element including a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; and a heat spreader including a plurality of fins disposed spaced apart on the second substrate, wherein the second substrate includes a first region overlapping the second electrodes in a vertical direction and a second region not overlapping the second electrodes in the vertical direction, and wherein a separation distance between adjacent fins of the plurality of fins is different from each other in the first region and the second region.

Description

Technical Field

[0001] The present invention relates to thermoelectric devices, and more particularly, to thermoelectric elements and structures of heat sinks connected to the thermoelectric elements. Background Technology

[0002] Thermoelectric phenomena are caused by the movement of electrons and holes within a material, and refer to the direct energy conversion between heat and electricity.

[0003] Thermoelectric element is a general term for an element that utilizes the thermoelectric phenomenon and has a structure in which P-type thermoelectric material and N-type thermoelectric material are joined between metal electrodes to form a PN junction pair.

[0004] Thermoelectric elements can be classified into: elements that utilize the temperature change of resistance, elements that utilize the Seebeck effect, and elements that utilize the Peltier effect. The Seebeck effect is the phenomenon of generating electromotive force due to a temperature difference, while the Peltier effect is the phenomenon of absorbing or generating heat due to an electric current.

[0005] Thermoelectric elements are widely used in household appliances, electronic components, and communication devices. For example, they can be used in cooling devices, heating devices, and power generation devices. Therefore, the requirements for the thermoelectric performance of thermoelectric elements are gradually increasing.

[0006] Alternatively, thermoelectric elements can be used by coupling them to a heat exchange component for heat exchange. The problem here is that the coupling between the heat exchange component and the thermoelectric element leads to reduced thermal efficiency and damage due to pressure differential.

[0007] Alternatively, thermoelectric elements can be used by coupling them to a heat exchange component for heat exchange. However, the problem here is that the coupling force between the heat exchange component and the thermoelectric element is reduced by the coupling component, leading to decreased reliability. Summary of the Invention

[0008] Technical issues

[0009] The present invention aims to provide a structure for a heat sink connected to a thermoelectric element.

[0010] Technical solutions

[0011] A thermoelectric device according to one embodiment of the present invention includes: a thermoelectric element comprising a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; and a heat sink comprising a plurality of fins disposed spaced apart from each other on the second substrate, wherein the second substrate includes a first region overlapping the second electrodes in a vertical direction and a second region not overlapping the second electrodes in a vertical direction, and the spacing distance between adjacent fins among the plurality of fins is different in the first region and the second region.

[0012] The separation distance in the second region can be greater than the separation distance in the first region.

[0013] The second substrate may include a lower surface and an upper surface facing the lower surface, and a second electrode may be disposed on the lower surface, and the upper surface may contact a plurality of fins.

[0014] The heat sink may include connecting members configured to connect multiple fins.

[0015] The connecting member may include a first connecting member that contacts the upper surface and a second connecting member that faces the first connecting member.

[0016] Multiple fins may have one end connected to the first connecting member and the other end connected to the second connecting member.

[0017] The length of the second connecting member in the second region can be greater than its length in the first region.

[0018] The second region may overlap with the second connecting member in the vertical direction.

[0019] The first length of the second electrode in the first direction may be less than the second length of the second electrode in the second direction perpendicular to the first direction. The vertical direction may be the direction from the first substrate toward the second substrate, and the first direction and the second direction may be perpendicular to each other and are directions perpendicular to the vertical direction.

[0020] The first and second regions can be alternately set in the first and second directions.

[0021] According to one embodiment of the present invention, a thermoelectric device includes: a thermoelectric element, a heat sink disposed on the thermoelectric element, and a connecting member disposed between the thermoelectric element and the heat sink, wherein the heat sink includes a groove disposed on a surface in contact with the thermoelectric element, and the connecting member is disposed in the groove.

[0022] The thermoelectric device may include: a lower member in contact with a thermoelectric element, an extension member connected to the lower member, and an upper member connected to the extension member and spaced apart from the lower member, wherein a groove may be positioned on the lower member.

[0023] The groove may include a side surface and a bottom surface connected to the side surface and disposed between the lower member and the upper member.

[0024] The side surface may include a stepped portion, and the width of the bottom surface may be less than the maximum width of the side surface.

[0025] The separation distance between extension members and the separation distance between the side surface and the extension members can be from 1:0.05 to 1:0.1.

[0026] The thermoelectric element may include: a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes.

[0027] The groove may overlap at least partially with the second electrode in the vertical direction.

[0028] The lower component may include a first component region that overlaps with the groove in the vertical direction and a second component region disposed outside the groove, and the engaging component may extend between the second component region and the thermoelectric element.

[0029] The lower component can be configured to be spaced apart from the thermoelectric element.

[0030] The groove can protrude from the lower member toward the lower member, and the engaging member can be positioned between adjacent extending members below the lower member.

[0031] Beneficial effects

[0032] According to embodiments of the present invention, a thermoelectric device with excellent thermal efficiency and high reliability can be obtained.

[0033] Specifically, according to an embodiment of the present invention, a thermoelectric device can be provided that improves the thermal efficiency through the heat sink by means of the positional relationship between the heat sink and the thermoelectric element, and prevents pressure difference due to changes in the shape of the heat sink.

[0034] In addition, according to embodiments of the present invention, a thermoelectric device can be provided that improves the reliability of the thermoelectric device by means of a structural form for coupling between the heat sink and the thermoelectric element of the thermoelectric device by means of a coupling member, and prevents the increase of pressure difference due to changes in the shape of the heat sink.

[0035] Furthermore, the thermoelectric element according to embodiments of the present invention can be applied not only to applications implemented in small sizes, but also to applications implemented in large sizes, such as vehicles, ships, steel mills, and incinerators. Attached Figure Description

[0036] Figure 1 This is a perspective view of a power generation module included in a power generation device according to an embodiment of the present invention.

[0037] Figure 2 This is an exploded perspective view of a power generation module according to one embodiment of the present invention.

[0038] Figure 3 and Figure 4 This is a partially enlarged view of a power generation module according to one embodiment of the present invention.

[0039] Figure 5 This is a plan view of a power generation device according to one embodiment of the present invention.

[0040] Figure 6 This is a cross-sectional view of a thermoelectric element included in a power generation module according to an embodiment of the present invention.

[0041] Figure 7 This is a perspective view of a thermoelectric element included in a power generation module according to an embodiment of the present invention.

[0042] Figure 8 This is a perspective view of a thermoelectric device according to an embodiment of the present invention, wherein a heat sink is disposed on a thermoelectric device.

[0043] Figure 9 This is a plan view of an upper substrate and an upper electrode included in a thermoelectric element according to an embodiment of the present invention.

[0044] Figure 10 This is a plan view of a lower substrate and a lower electrode included in a thermoelectric element according to an embodiment of the present invention.

[0045] Figure 11 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a first embodiment of the present invention.

[0046] Figure 12 This is a plan view showing the components of the thermoelectric device according to the first embodiment.

[0047] Figure 13 It is along Figure 12 The cross-sectional view taken by line A-A' in the diagram.

[0048] Figure 14 It is along Figure 12The cross-sectional view taken by line B-B' in the diagram.

[0049] Figure 15 It is along Figure 12 The cross-sectional view taken by line C-C' in the diagram.

[0050] Figure 16 yes Figure 12 Example of modification.

[0051] Figure 17 yes Figure 12 Another example of modification.

[0052] Figure 18 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a second embodiment of the present invention.

[0053] Figure 19 This is a plan view showing the components of the thermoelectric device according to the second embodiment.

[0054] Figure 20 It is along Figure 19 The cross-sectional view taken by line D-D' in the diagram.

[0055] Figure 21 It is along Figure 19 The cross-sectional view taken from line E-E' in the diagram.

[0056] Figure 22 It is along Figure 19 The cross-sectional view taken by line F-F' in the diagram.

[0057] Figure 23 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a third embodiment of the present invention.

[0058] Figure 24 This is a plan view showing the components of the thermoelectric device according to the third embodiment.

[0059] Figure 25 It is along Figure 24 The cross-sectional view taken from line I-I' in the diagram.

[0060] Figure 26 It is along Figure 24 The cross-sectional view taken from line J-J' in the diagram.

[0061] Figure 27 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a fourth embodiment of the present invention.

[0062] Figure 28 This is a perspective view showing the heat sink and connecting member of the thermoelectric device according to the fourth embodiment.

[0063] Figure 29This is a bottom view of the heat sink and connecting member of the thermoelectric device according to the fourth embodiment.

[0064] Figure 30 This is a plan view showing the components of the thermoelectric device according to the fourth embodiment.

[0065] Figure 31 It is along Figure 30 The cross-sectional view taken by line A-A' in the diagram.

[0066] Figure 32 It is along Figure 30 The cross-sectional view taken by line B-B' in the diagram.

[0067] Figure 33 It is along Figure 30 The cross-sectional view taken by line C-C' in the diagram.

[0068] Figure 34 This is a cross-sectional view of the thermoelectric device according to the fifth embodiment.

[0069] Figure 35 yes Figure 34 A magnified view of part K1 in the image.

[0070] Figure 36 This is a cross-sectional view of the thermoelectric device according to the sixth embodiment.

[0071] Figure 37 yes Figure 36 A magnified view of part K2 in the image.

[0072] Figures 38a to 38d This is a flowchart illustrating a method for manufacturing a heat sink for a thermoelectric device according to the fourth embodiment. Detailed Implementation

[0073] In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0074] However, the spirit of the present invention is not limited to the described embodiments, but can be implemented in various different forms, and one or more components can be used by selectively coupling or substituting between embodiments without departing from the spirit of the present invention.

[0075] Furthermore, unless specifically defined and explicitly described, the terms (including technical and scientific terms) used in the embodiments of this invention may be interpreted in the sense that can be generally understood by those skilled in the art to which this invention pertains, and the meaning of commonly used terms such as those defined in dictionaries may be interpreted in consideration of the contextual meaning of related technologies.

[0076] Furthermore, the terminology used in the embodiments of this invention is intended to describe the embodiments and not to limit the invention.

[0077] In this specification, unless otherwise stated in the phrase, the singular form may also include the plural form, and when described as “at least one (or one or more) of A and B, C”, it may include one or more of all possible combinations of A, B and C.

[0078] In addition, when describing the components of embodiments of the present invention, terms such as first, second, A, B, (a) and (b) may be used.

[0079] These terms are intended only to distinguish components from other components, and the nature, order, or sequence of the corresponding components are not limited by these terms.

[0080] In addition, when describing a component as “connected,” “coupled,” or “joined” to another component, this can include not only cases where the component is directly connected, coupled, or joined to another component, but also cases where the component is “connected,” “coupled,” or “joined” to another component through other components inserted therein.

[0081] Furthermore, when a component is described as being formed or disposed at the "top (above) or bottom (below)" of each component, "top (above)" or "bottom (below)" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Additionally, when expressed as "top (above)" or "bottom (below)," this also includes not only the meaning of an upward direction relative to a component, but also the meaning of a downward direction relative to a component.

[0082] Figure 1 This is a perspective view of a power generation module included in a power generation device according to an embodiment of the present invention. Figure 2 This is an exploded perspective view of a power generation module according to one embodiment of the present invention. Figure 3 and Figure 4 This is a partially enlarged view of a power generation module according to one embodiment of the present invention. Figure 5 This is a plan view of a power generation device according to one embodiment of the present invention, and Figure 6 and Figure 7 These are cross-sectional and perspective views of a thermoelectric element included in a power generation module according to an embodiment of the present invention.

[0083] First, the thermoelectric device according to the present invention can be used in power generation devices, power generation systems including power generation devices, etc. For example, the power generation system includes a power generation device and a fluid pipe, and the fluid introduced into the fluid pipe can be a heat source generated in the engine of a vehicle or ship, or in a power plant, steel mill, etc. However, the present invention is not limited thereto. In addition, the temperature of the fluid discharged from the fluid pipe is lower than the temperature of the fluid introduced into the fluid pipe. For example, the temperature of the fluid introduced into the fluid pipe can be 100°C or higher, preferably 200°C or higher, and more preferably 220°C to 250°C, but is not limited thereto, and can be applied differently depending on the temperature difference between the low-temperature part and the high-temperature part of the thermoelectric element.

[0084] Alternatively, the power generation device can be configured adjacent to the fluid pipe to use the energy of the fluid to generate electricity.

[0085] Reference Figures 1 to 4 According to an embodiment of the present invention, the power generation device 1000 includes a pipe 1100, a first thermoelectric device 1200, a second thermoelectric device 1300, a branching unit 1400, a partition member 1500, a shielding member 1600, and a heat insulation member 1700. Additionally, the power generation device 1000 according to an embodiment of the present invention also includes a guide plate 1800 and a support frame 1900.

[0086] Pipeline 1100, first thermoelectric device 1200, second thermoelectric device 1300, branch unit 1400, partition member 1500, shielding member 1600 and insulation member 1700 can be assembled into a module, which may be referred to as a power generation module in this specification.

[0087] According to an embodiment of the present invention, the power generation device 1000 can generate electricity using the temperature difference between a first fluid flowing through the interior of the pipe 1100 and a second fluid passing through the radiators 1220 and 1320 of the first thermoelectric device 1200 and the second thermoelectric device 1300 disposed outside the pipe 1100.

[0088] In this specification, the temperature of the first fluid flowing through the interior of pipe 1100 can be lower than the temperature of the second fluid passing through the radiators 1220 and 1320 of thermoelectric devices 1200 and 1300 disposed outside pipe 1100. In this specification, the first fluid can be a coolant, and the second fluid can be a high-temperature gas. Therefore, the first thermoelectric device 1200 can be disposed on one surface of pipe 1100, and the second thermoelectric device 1300 can be disposed on the other surface of pipe 1100. In this case, the surface of each of the two surfaces of the first thermoelectric device 1200 and the second thermoelectric device 1300 facing pipe 1100 is a low-temperature portion, and the temperature difference between the low-temperature portion and the high-temperature portion can be used to generate electricity. Therefore, in this specification, pipe 1100 can be referred to as a cooling unit.

[0089] The first fluid introduced into pipe 1100 may be water, but is not limited thereto, and may be various types of fluids with cooling properties. The temperature of the first fluid introduced into pipe 1100 may be below 100°C, preferably below 50°C, and more preferably below 40°C, but is not limited thereto. The temperature of the first fluid discharged after passing through pipe 1100 may be higher than the temperature of the first fluid introduced into pipe 1100. Each pipe 1100 includes: a first surface 1110; a second surface 1120 facing the first surface 1110 and disposed parallel to the first surface 1110; a third surface 1130 disposed between the first surface 1110 and the second surface 1120; a fourth surface 1140 disposed perpendicular to the third surface 1130 between the first surface 1110 and the second surface 1120; a fifth surface 1150 disposed facing the third surface 1130; and a sixth surface 1160 disposed facing the fourth surface 1140, and the first fluid passes through the interior of the pipe. When the first thermoelectric device 1200 and the second thermoelectric device 1300 are respectively disposed on the first surface 1110 and the second surface 1120 of the pipe 1100, the third surface 1130 may be disposed on the surface in the direction of introducing the second fluid, and the fourth surface 1140 may be disposed on the surface in the direction of introducing and discharging the first fluid. Therefore, a first fluid inlet 1142 and a first fluid outlet 1144 may be formed on the fourth surface 1140 of the pipe 1100. The first fluid inlet 1142 and the first fluid outlet 1144 may be connected to a fluid passage pipe in the pipe 1100. Therefore, the first fluid introduced from the first fluid inlet 1142 may be discharged from the first fluid outlet 1144 after passing through the fluid passage pipe.

[0090] Although not shown, heat dissipation fins can be disposed on the inner wall of pipe 1100. The shape, number, and area of ​​the heat dissipation fins occupying the inner wall of pipe 1100 can vary depending on the temperature of the first fluid, the temperature of the waste heat, the required power generation capacity, etc. The area of ​​the heat dissipation fins occupying the inner wall of pipe 1100 can be, for example, 1% to 40% of the cross-sectional area of ​​pipe 1100. Therefore, high thermoelectric conversion efficiency can be obtained even without interfering with the flow of the first fluid. In this case, the heat dissipation fins can have a shape that does not interfere with the flow of the first fluid. For example, the heat dissipation fins can be formed in the direction of the flow of the first fluid. In other words, the heat dissipation fins can have a plate shape extending from the inlet of the first fluid toward the outlet of the first fluid, and multiple heat dissipation fins can be arranged to be spaced apart from each other at predetermined intervals. The heat dissipation fins can also be integrally formed with the inner wall of pipe 1100.

[0091] According to an embodiment of the present invention, the direction of the second fluid flowing through the fluid channel unit 2200 and the direction in which the first fluid flowing through the pipe 1100 is introduced and discharged can be different from each other. For example, the direction in which the first fluid is introduced and discharged and the direction through which the second fluid flows can differ from each other by about 90°. Therefore, uniform heat conversion performance can be obtained throughout the entire area. At the same time, the first thermoelectric device 1200 can be disposed on the first surface 1110 of the pipe 1100, and the second thermoelectric device 1300 can be symmetrically disposed on the second surface 1120 of the pipe 1100 with respect to the first thermoelectric device 1200.

[0092] The first thermoelectric device 1200 and the second thermoelectric device 1300 can be fastened to the pipe 1100 using screws or coil springs. Therefore, the first thermoelectric device 1200 and the second thermoelectric device 1300 can be stably coupled to the surface of the pipe 1100. Alternatively, at least one of the first thermoelectric device 1200 and the second thermoelectric device 1300 can also be bonded to the surface of the pipe 1100 using a thermal interface material (TIM). By using coil springs and / or TIM and / or screws, the uniformity of heat applied to the first thermoelectric device 1200 and the second thermoelectric device 1300 can be uniformly controlled even at high temperatures.

[0093] At the same time, such as Figure 3As shown, each of the first thermoelectric device 1200 and the second thermoelectric device 1300 includes: thermoelectric elements 1210 and 1310 respectively disposed on a first surface 1110 and a second surface 1120, and heat sinks 1220 and 1320 respectively disposed on the thermoelectric elements 1210 and 1310. As described above, the pipe 1100 through which the first fluid flows is disposed on one of the two surfaces of each of the thermoelectric elements 1210 and 1310, and the heat sinks 1220 and 1320 are disposed on the other surface. When the second fluid passes through the heat sinks 1220 and 1320, the temperature difference between the heat-absorbing surface and the heat-dissipating surface of the thermoelectric elements 1210 and 1310 can be increased, thereby improving the thermoelectric conversion efficiency. At this time, when the direction from the first surface 1110 toward the thermoelectric element 1210 and the heat sink 1220 is defined as the first direction, the length of the heat sink 1220 in the first direction can be greater than the length of the thermoelectric element 1210 in the first direction. Therefore, due to the increased contact area between the second fluid and the heat sink 1220, the temperature of the heat-absorbing surface of the thermoelectric element 1210 can be increased. The heat sink can perform heat absorption / heat reception.

[0094] Reference Figure 4 The radiators 1220 and 1320, as well as the thermoelectric elements 1210 and 1310, can be fastened by a plurality of fastening members 1230 and 1330. Here, the fastening members 1230 and 1330 can be helical springs or screws. For this purpose, at least some of the radiators 1220 and 1320 and the thermoelectric elements 1210 and 1310 can be formed with through holes S through which the fastening members 1230 and 1330 pass. Here, individual insulators 1240 and 1340 can also be provided between the through holes S and the fastening members 1230 and 1330. The individual insulators 1240 and 1340 can be insulators surrounding the outer circumferential surface of the fastening members 1230 and 1330 or insulators surrounding the wall surface of the through hole S. For example, the insulators 1240 and 1340 can have annular shapes. The inner circumferential surfaces of the annular insulators 1240 and 1340 can be disposed on the outer circumferential surfaces of the fastening members 1230 and 1330, and the outer circumferential surfaces of the insulators 1240 and 1340 can be disposed on the inner circumferential surface of the through hole S. Therefore, the fastening members 1230 and 1330, the heat sinks 1220 and 1320, and the thermoelectric elements 1210 and 1310 can be insulated from each other.

[0095] At this time, the structures of thermoelectric elements 1210 and 1310 can have Figure 6 and Figure 7 The structure of the thermoelectric element 100 shown.

[0096] Reference Figure 6 and Figure 7The thermoelectric element 100 includes: a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0097] A lower electrode 120 is disposed between the lower substrate 110 and the lower bottom surfaces of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140, and an upper electrode 150 is disposed between the upper substrate 160 and the upper bottom surfaces of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140. Therefore, multiple P-type thermoelectric legs 130 and multiple N-type thermoelectric legs 140 are electrically connected through the lower electrode 120 and the upper electrode 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the lower electrode 120 and the upper electrode 150 and electrically connected can form a unit cell.

[0098] For example, when voltage is applied to the lower electrode 120 and the upper electrode 150 via wires 181 and 182, the substrate through which current flows from the P-type thermocouple 130 to the N-type thermocouple 140 can be used as a cooling unit by absorbing heat due to the Peltier effect. And the substrate through which current flows from the N-type thermocouple 140 to the P-type thermocouple 130 can be used as a heating unit by being heated due to the Peltier effect. Alternatively, when a temperature difference is applied between the lower electrode 120 and the upper electrode 150, the charges in the P-type thermocouple 130 and the N-type thermocouple 140 can move due to the Seebeck effect, and electricity can also be generated.

[0099] Here, each of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be a bismuth telluride-based (Bi-Te) thermoelectric leg containing bismuth (Bi) and tellurium (Te) as main raw materials. The P-type thermoelectric leg 130 can be a bismuth telluride-based (Bi-Te) thermoelectric leg containing at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type thermoelectric leg 130 can contain 99 wt% to 99.999 wt% of Bi-Sb-Te as the main raw material based on 100 wt% of the total weight, and can contain 0.001 wt% to 1 wt% of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) based on 100 wt% of the total weight. The N-type thermoelectric leg 140 may be a bismuth telluride (Bi-Te) based thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the N-type thermoelectric leg 140 may contain 99 wt% to 99.999 wt% of Bi-Se-Te as the main raw material based on 100 wt% of the total weight, and may contain 0.001 wt% to 1 wt% of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) based on 100 wt% of the total weight.

[0100] P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can be formed in bulk or stack-type configurations. Typically, bulk P-type thermoelectric legs 130 or bulk N-type thermoelectric legs 140 can be obtained by: heat-treating a thermoelectric material to manufacture an ingot, grinding and sieving the ingot to obtain thermoelectric leg powder, then sintering the thermoelectric leg powder, and cutting the sintered body. In this case, P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can be polycrystalline thermoelectric legs. As mentioned above, when P-type thermoelectric legs 130 and N-type thermoelectric legs 140 are polycrystalline thermoelectric legs, their strength can be increased. Stack-type P-type thermoelectric legs 130 or stack-type N-type thermoelectric legs 140 can be obtained by: applying a paste containing thermoelectric material to a sheet substrate to form a unit component, then stacking and cutting the unit component.

[0101] At this time, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can have the same shape and volume, or they can have different shapes and volumes. For example, since the electrical conductivity characteristics of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140 are different from each other, the height or cross-sectional area of ​​the N-type thermoelectric leg 140 can also be formed to be different from the height or cross-sectional area of ​​the P-type thermoelectric leg 130.

[0102] At this time, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 can have a cylindrical shape, a polygonal cylindrical shape, an elliptical cylindrical shape, etc.

[0103] The performance of a thermoelectric element according to one embodiment of the present invention can be expressed as a quality factor (ZT). The quality factor (ZT) can be expressed as Equation 1:

[0104] [Formula 1]

[0105] ZT=α 2 ·σ·T / k

[0106] Where α refers to the Seebeck coefficient [V / K], σ refers to the conductivity [S / m], and α 2 σ refers to the power factor [W / mK] 2 Additionally, T refers to temperature, and k refers to thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, where a refers to thermal diffusivity [cm]. 2 / S], cp refers to specific heat [J / gK], and ρ refers to density [g / cm³]. 3 ].

[0107] To obtain the quality factor of a thermoelectric element, a Z meter can be used to measure the Z value (V / K), and the measured Z value can be used to calculate the quality factor (ZT).

[0108] Here, the lower electrode 120 disposed between the lower substrate 110, the P-type thermoelectric leg 130, and the N-type thermoelectric leg 140, and the upper electrode 150 disposed between the upper substrate 160, the P-type thermoelectric leg 130, and the N-type thermoelectric leg 140, may include at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and have a thickness of 0.01 mm to 0.3 mm. When the thickness of the lower electrode 120 or the upper electrode 150 is less than 0.01 mm, its function as an electrode may degrade, thereby reducing conductivity. When the thickness of the lower electrode 120 or the upper electrode 150 exceeds 0.3 mm, the conductivity efficiency may decrease due to the increase in resistance.

[0109] Furthermore, the lower substrate 110 and upper substrate 160 facing each other can be metal substrates, and their thickness can be from 0.1 mm to 1.5 mm. When the thickness of the metal substrate is less than 0.1 mm or more than 1.5 mm, the heat dissipation characteristics or thermal conductivity may increase excessively, and thus may reduce the reliability of the thermoelectric element. Additionally, when the lower substrate 110 and upper substrate 160 are metal substrates, an insulating layer 170 can be formed between the lower substrate 110 and the lower electrode 120, and between the upper substrate 160 and the upper electrode 150. The insulating layer 170 can include a material with a thermal conductivity of 1 W / mK to 20 W / mK. In this case, the insulating layer 170 can be a layer made of a resin composition comprising at least one of epoxy resin and silicone resin and an inorganic material, or a layer made of a silicon composite comprising silicon and an inorganic material, or an alumina layer. Here, the inorganic material can be at least one of oxides, nitrides, and carbides of aluminum, boron, silicon, etc.

[0110] At this time, the dimensions of the lower substrate 110 and the upper substrate 160 can also be formed differently from each other. In other words, the volume, thickness, or area of ​​one of the lower substrate 110 and the upper substrate 160 can be formed to be larger than the volume, thickness, or area of ​​the other. Here, the thickness can be the thickness in the direction from the lower substrate 110 to the upper substrate 160, and the area can be the area in the direction perpendicular to the direction from the lower substrate 110 to the upper substrate 160. Therefore, the heat absorption or heat dissipation performance of the thermoelectric element can be improved. Preferably, the volume, thickness, or area of ​​the lower substrate 110 can be formed to be larger than at least one of the volume, thickness, or area of ​​the upper substrate 160. At this time, when the lower substrate 110 is disposed in a high-temperature region for the Seebeck effect, when the lower substrate 110 is used as a heat-generating region for the Peltier effect, or when a sealing member configured to protect the thermoelectric element from the external environment of the thermoelectric element (described below) is disposed on the lower substrate 110, at least one of the volume, thickness, or area of ​​the lower substrate 110 can be formed to be larger than the volume, thickness, or area of ​​the upper substrate 160. At this time, the area of ​​the lower substrate 110 can be formed in the range of 1.2 to 5 times the area of ​​the upper substrate 160. When the area of ​​the lower substrate 110 is less than 1.2 times the area of ​​the upper substrate 160, the effect on improving heat transfer efficiency is not high. When the area of ​​the lower substrate 110 is more than 5 times that of the upper substrate 160, the heat transfer efficiency is significantly reduced, and it may be difficult to maintain the basic shape of the thermoelectric device.

[0111] Additionally, a heat dissipation pattern (e.g., a non-uniform pattern) can be formed on the surface of at least one of the lower substrate 110 and the upper substrate 160. Therefore, the heat dissipation performance of the thermoelectric element can be improved. When a non-uniform pattern is formed on the surface in contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate can also be improved. The thermoelectric element 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0112] Although not shown, a sealing member may be provided between the lower substrate 110 and the upper substrate 160. This sealing member may be provided on the side surfaces of the lower electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the upper electrode 150 between the lower substrate 110 and the upper substrate 160. Therefore, the lower electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the upper electrode 150 can be sealed and protected from external moisture, heat, contaminants, etc.

[0113] At this time, the lower substrate 110 disposed on the pipe 1100 can be an aluminum substrate, and the aluminum substrate can be bonded to each of the first surface 1110 and the second surface 1120 by TIM bonding. Since the aluminum substrate has excellent heat transfer properties, heat transfer between one of the two surfaces of the thermoelectric elements 1210 and 1310 and the pipe 1100 through which the first fluid flows is facilitated. Furthermore, when the aluminum substrate is bonded to the pipe 1100 through which the first fluid flows by TIM bonding, the heat transfer between the aluminum substrate and the pipe 1100 through which the first fluid flows is not interfered with. Here, TIM is a material having both heat transfer and adhesive properties, and can be, for example, a resin composition comprising at least one of epoxy resin and silicone resin, as well as an inorganic material. Here, the inorganic material can be an oxide, carbide, or nitride of aluminum, boron, silicon, etc.

[0114] Reference Figure 5 The separator 1500 can separate the guide plates 1800-1 and 1800-2 from the pipe 1100 by a predetermined distance through contact with the guide plates 1800-1 and 1800-2 and the pipe 1100. Here, contact can refer not only to direct contact, but also to indirect contact through another medium.

[0115] According to an embodiment of the present invention, the partition member 1500 may be disposed between the first surface 1110 and the second surface 1120 of the pipe 1100. When the branch unit 1400 is disposed on the third surface 1130 between the first surface 1110 and the second surface 1120 of the pipe 1100, the partition member 1500 may be disposed on the fourth surface 1140, and the fourth surface 1140 is disposed perpendicularly to the third surface 1130 between the first surface 1110 and the second surface 1120 of the pipe 1100.

[0116] Here, the third surface 1130 on which the branch unit 1400 is disposed may be a surface disposed in the direction of introducing the second fluid, and the fourth surface 1140 on which the dividing member 1500 is disposed may be a surface disposed in the direction of introducing the first fluid.

[0117] According to one embodiment of the present invention, the separating member 1500 separates the horizontal distance between the first surface 1110 of the pipe 1100 and the first guide plate 1800-1, and the horizontal distance between the second surface 1120 of the pipe 1100 and the second guide plate 1800-2, by a predetermined distance. Therefore, the horizontal distance between the first radiator 1220 of the first thermoelectric device 1200 and the first guide plate 1800-1, and the horizontal distance between the second radiator 1320 of the second thermoelectric device 1300 and the guide plate 1800-2, can be separated by a predetermined distance. In this case, the separating member 1500 may include a heat-insulating material. Therefore, thermal insulation can be provided between the second fluid flowing along the guide plates 1800-1 and 1800-2 and the first fluid flowing in the pipe 1100.

[0118] Therefore, the partition member 1500 may include: an inner region 1510 disposed on a fourth surface 1140 perpendicular to a third surface 1130 on which the branch unit 1400 is disposed; a first outer region 1520 extending from the inner region 1510 toward the first surface 1110; and a second outer region 1530 extending from the inner region 1510 toward the second surface 1120. In this case, a first surface 1522 of the first outer region 1520 may be disposed on the first surface 1110, and a second surface 1524 of the first outer region 1520 may be disposed on the first guide plate 1800-1. Similarly, a first surface 1532 of the second outer region 1530 may be disposed on the second surface 1120, and a second surface 1534 of the second outer region 1530 may be disposed on the second guide plate 1800-2. Therefore, since the first surface 1110 of the pipe 1100 and the first guide plate 1800-1 can be spaced apart from each other by a distance T between the first surface 1522 and the second surface 1524 of the first outer region 1520, and the second surface 1120 of the pipe 1100 and the second guide plate 1800-2 can be spaced apart from each other by a distance T between the first surface 1532 and the second surface 1534 of the second outer region 1530, and the radiator and the guide plate can maintain a predetermined distance t, the pressure difference of the second fluid and the flow space of the second fluid can be optimized. In this specification, the pressure difference of the second fluid can refer to the pressure difference between the second fluid before it passes through the radiator of the thermoelectric device and the second fluid after it passes through the radiator of the thermoelectric device. When the length of the radiator is 1, the sum of the length of the radiator l and the distance t between the radiator and the guide plate can be equal to the distance T between the first surface 1522 and the second surface 1524 of the second region of the partition member 1500 or the distance T between the first surface 1532 and the second surface 1534 of the third region of the partition member 1500 (i.e., the distance between the pipe 1100 and the guide plate 1800).

[0119] Return to reference Figures 1 to 4To enhance the sealing and insulation effect between the first thermoelectric device 1200, the pipe 1100, and the second thermoelectric device 1300, an insulation member 1700 according to an embodiment of the present invention can be provided on, for example, the surface of the pipe 1100, excluding the area where the first thermoelectric device 1200 and the second thermoelectric device 1300 are located. Therefore, heat loss between the first and second fluids can be prevented, and power generation performance can be improved by increasing the temperature difference between the low-temperature and high-temperature portions of each of the first thermoelectric device 1200 and the second thermoelectric device 1300. Additionally, a shielding member 1600 can be provided on the surface of the pipe 1100, excluding the area where the first thermoelectric device 1200 and the second thermoelectric device 1300 are located. This protects the wires and connectors connected to the first thermoelectric device 1200 and the second thermoelectric device 1300 from external moisture or contamination.

[0120] Meanwhile, the guide plate 1800 is a plate configured to guide the flow of the second fluid in the fluid channel unit 2200, and the second fluid introduced into the fluid channel unit 2200 can flow along the guide plate 1800 and then be discharged.

[0121] The first guide plate 1800-1 can be configured to face the first thermoelectric device 1200, the second guide plate 1800-2 can be configured to face the second thermoelectric device 1300, and the second fluid can pass between the first thermoelectric device 1200 and the first guide plate 1800-1 and between the second thermoelectric device 1300 and the second guide plate 1800-2.

[0122] At this time, the sides of the guide plates 1800-1 and 1800-2 can extend to the fluid collecting plates 1810-1 and 1810-2 and the fluid diffuser plates 1820-1 and 1820-2. The fluid collecting plates 1810-1 and 1810-2 can refer to plates extending toward the inlet of the fluid channel unit 2200 (i.e., the first connecting unit 2400), and the fluid diffuser plates 1820-1 and 1820-2 can refer to plates extending toward the outlet of the fluid channel unit 2200 (i.e., the second connecting unit 2500). At this time, the fluid collecting plates 1810-1 and 1810-2, the guide plates 1800-1 and 1800-2, and the fluid diffuser plates 1820-1 and 1820-2 can be integrally connected to each other. The first guide plate 1800-1, which faces the first thermoelectric device 1200, and the second guide plate 1800-2, which faces the second thermoelectric device 1300, can be symmetrically arranged while maintaining a constant distance d3. Here, the distance d3 between the first guide plate 1800-1 and the second guide plate 1800-2 can be a horizontal distance from the first guide plate 1800-1 toward the second guide plate 1800-2. Therefore, since the second fluid can pass through the first thermoelectric device 1200 and the first guide plate 1800-1 and the second thermoelectric device 1300 and the second guide plate 1800-2 at a constant flow rate, uniform thermoelectric performance can be obtained. In contrast, the first fluid collecting plate 1810-1 and the second fluid collecting plate 1810-2 can be arranged symmetrically, such that the distances d4 and d4' between the first fluid collecting plate 1810-1 extending from the first guide plate 1800-1 and the second fluid collecting plate 1810-2 extending from the second guide plate 1800-2 increase as the first fluid collecting plate 1810-1 and the second fluid collecting plate 1810-2 approach the inlet of the fluid channel unit 2200. Here, the distance between the first fluid collecting plate 1810-1 and the second fluid collecting plate 1810-2 can be the horizontal distance from the first fluid collecting plate 1810-1 to the second fluid collecting plate 1810-2. Similarly, the first fluid diffuser plate 1820-1 and the second fluid diffuser plate 1820-2 can be arranged symmetrically, such that the distance between the first fluid diffuser plate 1820-1 extending from the first guide plate 1800-1 and the second fluid diffuser plate 1820-2 extending from the second guide plate 1800-2 increases as the first fluid diffuser plate 1820-1 and the second fluid diffuser plate 1820-2 approach the outlet of the fluid channel unit 2200. Therefore, the second fluid introduced through the inlet of the fluid channel unit 2200 can be collected in the fluid collection plates 1810-1 and 1810-2, and can then pass between the thermoelectric devices 1200 and 1300 and the guide plate 1800, diffuse from the fluid diffuser plates 1820-1 and 1820-2, and then be discharged through the outlet of the fluid channel unit 2200.Therefore, the pressure difference of the second fluid before and after passing between the thermoelectric devices 1200 and 1300 and the guide plate 1800 can be minimized, thereby preventing the second fluid from flowing back toward the inlet of the fluid channel unit 2200.

[0123] At this time, the support frame 1900 supports the first guide plate 1800-1 and the second guide plate 1800-2, the first fluid collecting plate 1810-1 and the second fluid collecting plate 1810-2, and the first fluid diffuser plate 1820-1 and the second fluid diffuser plate 1820-2. In other words, the support frame 1900 may include the first support frame 1900-1 and the second support frame 1900-2, and the first guide plate 1800-1 and the second guide plate 1800-2, the first fluid collecting plate 1810-1 and the second fluid collecting plate 1810-2, and the first fluid diffuser plate 1820-1 and the second fluid diffuser plate 1820-2 may be fixed between the first support frame 1900-1 and the second support frame 1900-2.

[0124] Meanwhile, according to an embodiment of the present invention, the branching unit 1400 can branch the second fluid introduced into the fluid channel unit 2200. The second fluid branched by the branching unit 1400 can pass between the first thermoelectric device 1200 and the first guide plate 1800-1 and between the second thermoelectric device 1300 and the second guide plate 1800-2.

[0125] The branching unit 1400 can be disposed between the first surface 1110 and the second surface 1120 of the pipe 1100. For example, when the third surface 1130 of the pipe 1100 is disposed in the direction of introducing the second fluid, the branching unit 1400 can be disposed on one side of the third surface 1130 of the pipe 1100. Alternatively, according to the principles of fluid dynamics, the branching unit 1400 can also be disposed on the side of the fifth surface 1150 of the pipe 1100 facing the third surface 1130.

[0126] The branching unit 1400 on the third surface 1130 of the conduit 1100 can have a shape in which the distance from the third surface 1130 increases from both ends of the third surface 1130 toward the center between the two ends of the third surface 1130. In other words, the third surface 1130 on which the branching unit 1130 is disposed can be substantially perpendicular to the first surface 1110 and the second surface 1120, and the branching unit 1400 can be disposed at an angle relative to the first surface 1110 and the second surface 1120 of the conduit 1100. For example, the branching unit 1400 can be umbrella-shaped or roof-shaped. Thus, the second fluid (e.g., waste heat) can be branched through the branching unit 1400 and guided to contact the first thermoelectric device 1200 and the second thermoelectric device 1300 disposed on the two surfaces of the power generation device. In other words, the second fluid can be branched through the branching unit 1400 and can pass between the first thermoelectric device 1200 and the first guide plate 1800-1 and between the second thermoelectric device 1300 and the second guide plate 1800-2.

[0127] Meanwhile, the width W1 between the outer side of the first radiator 1220 of the first thermoelectric device 1200 and the outer side of the second radiator 1320 of the second thermoelectric device 1300 can be greater than the width W2 of the branch unit 1400. Here, each of the outer sides of the first radiator 1220 and the second radiator 1320 can refer to opposite sides facing the pipe 1100. Each of the first radiator 1220 and the second radiator 1320 can include a plurality of heat dissipation fins, and the plurality of heat dissipation fins can be formed in a direction that does not interfere with the gas flow. For example, the plurality of heat dissipation fins can have a plate shape extending in a second direction of gas flow. Alternatively, the plurality of heat dissipation fins can have a folded shape, such that a flow path is formed in the second direction of gas flow. At this point, the maximum width W1 between the first radiator 1220 of the first thermoelectric device 1200 and the second radiator 1320 of the second thermoelectric device 1300 can refer to the distance from the farthest point of the radiator 1220 to the farthest point of the second radiator 1320 relative to the pipe 1100, and the maximum width W2 of the branching unit 1400 can refer to the width of the branching unit 1400 in the region closest to the third surface 1130 of the pipe 1100. Therefore, the flow of the second fluid can be directly transferred to the first radiator 1220 and the second radiator 1320 without being interfered with by the branching unit 1400. Thus, the contact area between the second fluid and the first radiator 1220 and the second radiator 1320 can be increased, thereby increasing the heat received by the first radiator 1220 and the second radiator 1320 from the second fluid and increasing the power generation efficiency.

[0128] Meanwhile, the first guide plate 1800-1 can be symmetrically arranged to be spaced apart from the first radiator 1220 of the first thermoelectric device 1200 by a predetermined interval, and the second guide plate 1800-2 can be symmetrically arranged to be spaced apart from the second radiator 1320 of the second thermoelectric device 1300 by a predetermined interval. Here, the interval between the guide plates 1800-1 and 1800-2 and the radiator of each thermoelectric device can affect the pressure difference of the second fluid in contact with the radiator of each thermoelectric device before and after passing through the radiator, thereby affecting the power generation performance.

[0129] According to an embodiment of the invention, it is intended to maintain the spacing between the guide plates 1800-1 and 1800-2 and the heat sink of each thermoelectric device as the spacing required to optimize power generation performance.

[0130] Figure 8 This is a perspective view of a thermoelectric device according to an embodiment of the present invention, wherein a heat sink is disposed on the thermoelectric device; Figure 9 This is a plan view of an upper substrate and an upper electrode included in a thermoelectric element according to an embodiment of the present invention; Figure 10 This is a plan view of a lower substrate and a lower electrode in a thermoelectric element according to an embodiment of the present invention; and Figure 11 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a first embodiment of the present invention.

[0131] Reference Figures 8 to 11 According to an embodiment of the present invention, the thermoelectric device TD may include a thermoelectric element 200, a heat sink 300 disposed on the thermoelectric element 200, and an electrode connection unit 400.

[0132] Specifically, the thermoelectric element 200 includes: a first substrate 210, a first insulating layer 220 disposed on the first substrate 210, a plurality of first electrodes disposed on the first insulating layer 220, a plurality of P-type thermoelectric legs 240 and a plurality of N-type thermoelectric legs 250 disposed on the plurality of first electrodes 230, a plurality of second electrodes 260 disposed on the plurality of P-type thermoelectric legs 240 and the plurality of N-type thermoelectric legs 230, a second insulating layer 270 disposed on the plurality of second electrodes 260, and a second substrate 280 disposed on the second insulating layer 270. Additionally, the first insulating layer 220 may be disposed between the first substrate 210 and the second substrate 280. Furthermore, although not shown, a sealing member (not shown) may also be disposed surrounding the plurality of first electrodes 230, the plurality of P-type thermoelectric legs 240, the plurality of N-type thermoelectric legs 250, the plurality of second electrodes 260, and the second insulating layer 270.

[0133] Here, the first electrode 230, the P-type thermoelectric leg 240, the N-type thermoelectric leg 250, and the second electrode 260 can respectively correspond to the reference. Figure 6 and Figure 7 The lower electrode 120, P-type thermoelectric leg 130, N-type thermoelectric leg 140, and upper electrode 150 are described. Furthermore, since the first substrate 210 corresponds to the lower substrate 110, the second substrate 280 corresponds to the upper substrate 160, and the first insulating layer 220 and the second insulating layer 270 correspond to the insulating layer 170, references can be applied in the same or similar manner. Figure 6 and Figure 7 The content described.

[0134] Furthermore, at least one of the first substrate 210 and the second substrate 280 can be a metal substrate. For example, at least one of the first substrate 210 and the second substrate 280 can be made of at least one of aluminum, aluminum alloy, copper, and copper alloy. The first substrate 210 and the second substrate 280 can also be made of different materials. For example, a substrate requiring higher voltage resistance of the first substrate 210 and the second substrate 280 can be configured as an aluminum substrate, and a substrate requiring higher thermal conductivity can be configured as a copper substrate.

[0135] In this specification, withstand voltage performance can refer to the characteristic of maintaining dielectric properties without breakdown for a predetermined time period under a predetermined voltage and current. For example, when maintaining dielectric properties for 10 seconds without breakdown under a voltage of AC 2.5kV and a current of 1mA, the withstand voltage can be 2.5kV.

[0136] Furthermore, since the power supply is connected to electrodes disposed on the low-temperature portion of the thermoelectric element 200, the low-temperature portion may require a higher withstand voltage than the high-temperature portion. In contrast, when the thermoelectric element 200 is driven, the high-temperature portion may be exposed to temperatures such as approximately 180°C or higher, and due to the different coefficients of thermal expansion of the electrodes, insulating layer, and substrate, delamination between the electrodes, insulating layer, and substrate may be problematic. Therefore, the high-temperature portion of the thermoelectric element 200 may require a higher thermal shock mitigation performance than the low-temperature portion. Consequently, the structures of the high-temperature and low-temperature portions may be formed differently from each other.

[0137] The connection between the electrode connection unit 400 disposed on the first substrate 210 and the first electrode 230 will be described below.

[0138] As described above, a first insulating layer 220 is disposed on a first substrate 210, and a plurality of first electrodes 230 are disposed on the first insulating layer 220.

[0139] At this time, multiple first electrodes 230 can be provided to form multiple electrode outer edges, and the first substrate 210 can have multiple substrate outer edges corresponding to the multiple electrode outer edges. Here, the electrode outer edge can refer to the edge of the multiple first electrodes 230, and the substrate outer edge can refer to the edge of the first substrate 210. For example, when the multiple first electrodes 230 are provided in a rectangular shape, the multiple first electrodes 230 can have first electrode outer edges E1 to fourth electrode outer edges E4, and the first substrate 210 can have first substrate outer edges S1 to fourth substrate outer edges S4 respectively corresponding to the first electrode outer edges E1 to fourth electrode outer edges E4.

[0140] According to embodiments of the present invention, the electrode connection unit 400 may include a first connection unit 410 and a second connection unit 420 having different polarities. For example, when the (-) terminal is connected to the first connection unit 410, the (+) terminal may be connected to the second connection unit 420. For example, the first connection unit 410 of the electrode connection unit 400 may connect to one of the plurality of first electrodes 230 and the (-) terminal, and the second connection unit 420 may connect to another of the plurality of first electrodes 230 and the (+) terminal. Therefore, the position of the electrode connection unit 400 may affect the insulation resistance of the thermoelectric element 200. Insulation resistance refers to the resistance exhibited by an insulator when a predetermined voltage is applied, and the thermoelectric element 200 needs to meet a predetermined insulation resistance. For example, when a DC voltage of 500V is applied, the thermoelectric element 200 should meet the requirement of having an insulation resistance of 500MΩ or greater.

[0141] According to an embodiment, when the electrode connection unit 400 is connected to some of the plurality of first electrodes 230 disposed on the outer edge E1 of the first electrode, the distance d1 between the outer edge E1 of the first electrode and the outer edge S1 of the first substrate can be longer than the distance d2 to d4 between the outer edges E2 to the fourth electrode and the outer edges S2 to S4 of the second substrate. In this case, the electrode connection unit 400 can be extended to the outside of a sealing member (not shown), which is configured to surround the first insulating layer 220, the plurality of first electrodes 230, the plurality of P-type thermoelectric legs 240, the plurality of N-type thermoelectric legs 250, the plurality of second electrodes 260, and the second insulating layer 270 between the first substrate 210 and the second substrate 280.

[0142] Here, the shortest distance A1 between the electrode connection unit 400 and the outer edge S1 of the first substrate can be 12 mm or more, preferably 14 mm or more, and more preferably 16 mm or more.

[0143] Furthermore, each of the shortest distance B1 between the second substrate outer edge S2 connected to the outer edge S1 of the first substrate and the first connecting unit 410 and the shortest distance B2 between the third substrate outer edge S3 connected to the outer edge S1 of the first substrate and the second connecting unit 420 can be 12 mm or more, preferably 14 mm or more, and more preferably 16 mm or more.

[0144] Alternatively, the shortest distance F1 from the point where the outer edges S1 and S2 of the first substrate meet (i.e., the vertex between the outer edges S1 and S2 of the first substrate) to the first connecting unit 410 and the shortest distance F2 from the point where the outer edges S1 and S3 of the first substrate meet (i.e., the vertex between the outer edges S1 and S3 of the first substrate) to the second connecting unit 420 can be 16 mm or more, preferably 19 mm or more, and more preferably 21 mm or more.

[0145] As described above, by adjusting the distance between the outer edge of the substrate and the electrode connection unit 400, a thermoelectric element with an insulation resistance of 500MΩ or greater at a DC voltage of 500V can be obtained.

[0146] At this time, each of the first connecting unit 410 and the second connecting unit 420 can be a connector into which a wire can be detachably inserted. As described above, each of the electrode connecting unit 400, the first connecting unit 410, and the second connecting unit 420 can be disposed outside the sealing member. Therefore, the wire connection is simple, and the possibility of disconnection between the electrode and the wire can be minimized.

[0147] Furthermore, each of the first connecting unit 410 and the second connecting unit 420 can be sealed with a silicone-containing resin. Therefore, the insulation resistance and withstand voltage performance of the thermoelectric element can be further improved.

[0148] Furthermore, the first insulating layer 220 may be disposed beneath the plurality of first electrodes 230 and electrode connection units 400 on the first substrate 210, and may have an area larger than that of the first electrodes 230 and electrode connection units 400. Therefore, the first electrodes 230 and electrode connection units 400 may overlap with the first insulating layer 220 in the vertical direction (Z-axis direction).

[0149] The first insulating layer 220 may have a larger area than the second insulating layer 270. Therefore, the first insulating layer 220 may partially overlap with the second insulating layer 270 in the vertical direction (Z-axis direction).

[0150] The second insulating layer 270 can be disposed between the second electrode 260 and the second substrate 280. The area of ​​the second insulating layer 270 can be larger than the total area of ​​the plurality of second electrodes 260. Therefore, the plurality of second electrodes 260 can overlap with the second insulating layer 270 in the vertical direction (Z-axis direction).

[0151] Additionally, multiple second electrodes 260 can be configured to face multiple first electrodes 230, with multiple P-type thermoelectric legs 240 and multiple N-type thermoelectric legs 250 inserted between the multiple second electrodes 260 and the first electrodes 230. The multiple first electrodes 230 and multiple second electrodes 260 can be electrically connected via the multiple P-type thermoelectric legs 240 and the multiple N-type thermoelectric legs 250. For example, the multiple first electrodes 230 and multiple second electrodes 260 can be connected in series.

[0152] Furthermore, each of the plurality of second electrodes 260 can be arranged in the same shape under the second substrate 280 or the second insulating layer 270. For example, the length of the second electrode 260 in the first direction (X-axis direction) can be greater than the length of the second electrode 260 in the second direction (Y-axis direction). In other words, the long sides of the plurality of second electrodes 260 can be symmetrically arranged in the first direction, and the short sides of the plurality of second electrodes 260 can be symmetrically arranged in the second direction. However, this structure can be changed depending on the electrode connection structure, etc. Here, the first direction is a direction perpendicular to the vertical direction and will be described as the X-axis direction, etc. The second direction is a direction perpendicular to the first direction and will be described as the Y-axis direction, etc. The third direction is the aforementioned direction, the same as the direction from the first substrate toward the second substrate, and will be described as the Z-axis direction, etc.

[0153] The heat sink 300 can be positioned on the second substrate 280. The heat sink 300 can overlap with the second substrate 280 in the third direction (Z-axis direction) and correspond to the above reference. Figures 1 to 5 The heat sinks 1220 and 1320 are described. The shape of the heat sink 300 according to this embodiment can be changed to correspond to the position of the second electrode 260. This will be described below.

[0154] Figure 12 This is a plan view showing the components of the thermoelectric device according to the first embodiment. Figure 13 It is along Figure 12 A cross-sectional view taken from line A-A' in the diagram. Figure 14 It is along Figure 12 The cross-sectional view taken by line B-B' in the diagram, and Figure 15 It is along Figure 12 The cross-sectional view taken by line C-C' in the diagram.

[0155] Reference Figures 12 to 15The thermoelectric device according to the first embodiment includes the thermoelectric element 200 and the heat sink 300 as described above. Furthermore, the thermoelectric element 200 may include: a first substrate 210, a first insulating layer 220 disposed on the first substrate 210, a plurality of first electrodes 230 disposed on the first insulating layer 220, a plurality of P-type thermoelectric legs 240 and a plurality of N-type thermoelectric legs 250 disposed on the plurality of first electrodes 230, a plurality of second electrodes 260 disposed on the plurality of P-type thermoelectric legs 240 and the plurality of N-type thermoelectric legs 250, a second insulating layer 270 disposed on the plurality of second electrodes 260, and a second substrate 280 disposed on the second insulating layer 270. The above description can be applied in the same manner for its detailed description.

[0156] In this embodiment, a heat sink 300 may be disposed on a second substrate 280, and the second substrate 280 may be in contact with the heat sink 300. In this case, the second substrate 280 may include an upper surface 280a and a lower surface 280b. Furthermore, the upper surface 280a of the second substrate 280 may be in contact with the heat sink 300. Additionally, a second electrode 260 (or a second insulating layer 270) may be disposed on the lower surface 280b of the second substrate 280, and the second electrode 260 (or the second insulating layer 270) may be in contact with the lower surface 280b of the second substrate 280.

[0157] Additionally, the second substrate 280 may include a first region P1 and a second region P2. The first region P1 is the region that overlaps with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 is the region that does not overlap with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 may correspond to a partition region between adjacent second electrodes 260. The positional relationship of the heat sink 300 on the first region P1 and the second region P2 of the second substrate 280 will be described below.

[0158] Specifically, the radiator 300 may include a plurality of fins 310 and connecting members 320.

[0159] Multiple fins 310 may extend upward (i.e., vertically) from the upper surface 280a of the second substrate 280 in the XZ plane or the YZ plane.

[0160] Furthermore, the plurality of fins 310 can be arranged to be spaced apart from each other in a first direction (X-axis direction) or a second direction (Y-axis direction). In the first embodiment, the plurality of fins 310 can be arranged to be spaced apart from each other in the first direction (X-axis direction).

[0161] In the plurality of fins 310, the separation distance between adjacent fins in the first region P1 may be different from the separation distance between adjacent fins in the second region P2. In an embodiment, in the plurality of fins 310, the separation distance between adjacent fins in the second region P2 may be greater than the separation distance between adjacent fins in the first region P1.

[0162] Specifically, the separation distance between adjacent fins 310 on the first region P1 (hereinafter referred to as "first separation distance SL1") may be different from the separation distance between adjacent fins 310 on the second region P2 (hereinafter referred to as "second separation distance SL2"). Furthermore, the first separation distance SL1 between adjacent fins 310 on the first region P1 may be smaller than the second separation distance SL2 between adjacent fins 310 on the second region P2. In other words, the second separation distance SL2 may be greater than the first separation distance SL1. The separation distance (e.g., the first separation distance and the second separation distance) may be the distance between adjacent fins in the direction in which the first connecting member 321, the fins 310, and the second connecting member 322 are arranged, as will be described below. Therefore, in the first embodiment, the first separation distance SL1 and the second separation distance SL2 refer to lengths in a first direction (X-axis direction).

[0163] With this configuration, heat absorbed by the fluid passing around the heat sink 300 on the first region P1 can be easily transferred through the substrate 280 to the second electrode 260. The path from the contact area between the second substrate 280 and the heat sink 300 (specifically, the connecting member (e.g., the first connecting member) described below) to the second electrode 260 can be reduced, thereby minimizing heat loss. Furthermore, by increasing the spacing between adjacent fins on the second region P2 (e.g., a second spacing distance), an increase in the pressure difference of the fluid caused by the multiple fins 310 can be prevented. Here, pressure difference refers to the pressure difference of the fluid before and after passing through the power generation device. In other words, the thermoelectric device according to the embodiment can minimize the occurrence of mechanical damage due to pressure difference by reducing the pressure difference of the fluid in the power generation device or the power generation system including the power generation device.

[0164] Furthermore, when fins 310 are not present in the second region P2, the separation distance between adjacent fins 310 can correspond to the separation distance in the second region P2. This can also be applied in the same way to other embodiments described below.

[0165] Furthermore, the first region P1 and the second region P2 can be alternately arranged in the first direction (X-axis direction) and the second direction (Y-axis direction). In other words, the second electrode can be arranged in an array along rows and columns to improve the power generation performance or heat exchange performance of the thermoelectric device.

[0166] Furthermore, the first separation distance SL1 between adjacent fins P1 can be the same or different from each other in the first region P1. Multiple first regions P1 can be provided to correspond to multiple second electrodes 260.

[0167] In this embodiment, the first separation distance between adjacent fins P1 on multiple first regions P1 can also vary depending on the corresponding position of the first regions P1. The 1-1 separation distance SL1a and the 1-2 separation distance SL1b can be different from each other. In this case, the 1-1 separation distance SL1a and the 1-2 separation distance SL1b can be positioned on the same second electrode. For example, the 1-1 separation distance SL1a can be greater than the 1-2 separation distance SL1b. In other words, the first separation distance can be adjusted to correspond to the region overlapping with the second electrode 260 in the vertical direction. Therefore, heat exchange efficiency can be improved.

[0168] Furthermore, the 1-1 separation distance SL1a and the 1-3 separation distance SL1c can be different from each other. Alternatively, the 1-2 separation distance SL1b and the 1-4 separation distance SL1d can be different from each other. In this case, the 1-1 separation distance SL1a and the 1-2 separation distance SL1b, as well as the 1-3 separation distance SL1c and the 1-4 separation distance SL1d, can be positioned on different second electrodes 260.

[0169] For example, the 1-1 separation distance SL1a and 1-2 separation distance SL1b can be smaller than the 1-3 separation distance SL1c and 1-4 separation distance SL1d. Furthermore, the 1-1 separation distance SL1a and 1-2 separation distance SL1b can be positioned closer to the fluid inlet than the 1-3 separation distance SL1c and 1-4 separation distance SL1d. In other words, according to the embodiment, by setting the first separation distance to be smaller the closer it is to the fluid inlet, heat exchange between high-temperature components can be improved while maintaining the pressure difference of the radiator 300. In this case, the first separation distances on the same second electrode can be the same or different from each other.

[0170] The connecting member 320 can be disposed between adjacent fins 310 that are spaced apart from each other. In other words, the connecting member 320 can connect adjacent fins 310 that are spaced apart from each other.

[0171] According to an embodiment, the connecting member 320 may include a first connecting member 321 and a second connecting member 322. The first connecting member 321 may contact the upper surface 280a of the second substrate 280. In addition, the second connecting member 322 may be spaced apart from the upper surface 280a of the second substrate 280 and positioned above the upper surface 280a of the second substrate 280.

[0172] The first connecting member 321 may be connected to the fin 310. In an embodiment, at least one end of the first connecting member 321 and the other end may contact the fin 310.

[0173] The second connecting member 322 can be connected to the fin 31. In an embodiment, at least one end of the second connecting member 322 and the other end can contact the fin 310.

[0174] The fin 310 may have one end connected to contact the first connecting member 321 and the other end connected to contact the second connecting member 322.

[0175] The first connecting member 321 and the second connecting member 322 can be arranged to face each other relative to the fin. Alternatively, the first connecting member 321 and the second connecting member 322 can be arranged non-symmetrically relative to the fin 310. In other words, the first connecting member 321 and the second connecting member 322 can not overlap in the vertical direction (Z-axis direction).

[0176] Additionally, multiple second electrodes 260 can be provided. In the accompanying drawings, the multiple second electrodes 260 may include electrode 260-1 (2-1), electrode 260-2 (2-2), electrode 260-3 (2-3), and electrode 260-4 (2-4).

[0177] Electrodes 2-1 (260-1) and 2-2 (260-2) can be arranged side-by-side along a first direction (X-axis direction). Electrodes 2-3 (260-3) and 2-4 (260-4) can also be arranged side-by-side along the first direction (X-axis direction). Electrodes 2-1 (260-1) and 2-3 (260-3) can also be arranged side-by-side along a second direction (Y-axis direction). Electrodes 2-2 (260-2) and 2-4 (260-4) can also be arranged side-by-side along the second direction (Y-axis direction).

[0178] According to the embodiments, multiple fins 310 can be alternately arranged in the first direction (X-axis direction). Additionally, one fin 310 can be arranged on the second electrode 260 in a second direction (Y-axis direction) perpendicular to the first direction, and the fins 310 overlapping with the second electrode 260 in the second direction can be identical. A first connecting member 321 can also be arranged on the second electrode 260 in the second direction (Y-axis direction), and the fins 310 overlapping with the second electrode 260 in the second direction can be identical. Furthermore, a second connecting member 322 can also be arranged on the second electrode 260 in the second direction (Y-axis direction), and the fins 310 overlapping with the second electrode 260 in the second direction can be identical. For example, multiple fins 310 arranged on electrodes 2-1 (2-1) and 2-3 (2-3) can be identical to each other. Similarly, multiple fins 310 arranged on electrodes 2-2 (2-2) and 2-4 (2-4) can be identical to each other.

[0179] In this embodiment, the fins 310, the first connecting member 321, and the second connecting member 322 can be configured to extend in a second direction (Y-axis direction). In other words, a plurality of fins 310 can be configured to extend in a plane XY along the second direction (Y-axis direction). Additionally, the first connecting member 321 and the second connecting member 322 can also be configured to extend in a plane XY along the second direction (Y-axis direction). Therefore, the fins 310, the first connecting member 321, and the second connecting member 322 can be alternately arranged in the first direction (X-axis direction). For example, the first connecting member 321, the fins 310, the second connecting member 322, and the fins 310 can be sequentially and repeatedly arranged in the first direction (X-axis direction).

[0180] In addition, since the second separation distance SL2 between adjacent fins 310 on the second region P2 is different from the first separation distance SL1 between adjacent fins 310 on the first region P1, the length of the second connecting member 322 can also vary depending on the region.

[0181] In this embodiment, since the second separation distance SL2 is greater than the first separation distance SL1, the length of the second connecting member 322 on the second region P2 can be greater than the length of the second connecting member 322 on the first region P1. The length of the second connecting member 322 is the length in the same direction as the direction toward the adjacent first connecting member 321 or the adjacent second connecting member 322 facing each other. Therefore, the thermoelectric device according to this embodiment can improve thermal efficiency while reducing the pressure difference.

[0182] Alternatively, in one embodiment, the second connecting member 322 may be disposed solely within the second region P2. Therefore, the second region P2 may overlap only with the second connecting member 322 in the third direction (Z-axis direction). This structure improves the reduction of pressure differential.

[0183] Furthermore, according to the embodiment, as described above, in the second electrode 260, the first length EL1 in the first direction (X-axis direction) can be smaller than the second length EL2 in the second direction (Y-axis direction). In this case, the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250 connected to contact the second electrode 260 can be arranged side by side along the second direction (Y-axis direction).

[0184] According to the embodiment, the fins 310, the first connecting member 321, and the second connecting member 322 can extend to a direction corresponding to the arrangement of the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250 on a single electrode (e.g., a second electrode). Therefore, since the fins 310, the first connecting member 321, and the second connecting member 322 extend along the long side of the second electrode, the thermoelectric device according to the embodiment can improve thermal efficiency by increasing the heat exchange time between the high-temperature fluid and the radiator.

[0185] However, it should be understood that when the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250 are arranged side by side along the first direction (X-axis direction), the shape of the second electrode 260 can be changed to correspond to the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250.

[0186] Figure 16 yes Figure 12 The modified example, and Figure 17 yes Figure 12 Another example of modification.

[0187] Reference Figure 16 The thermoelectric device according to the modified example includes the thermoelectric element 200 and the heat sink 300 as described above. Additionally, the thermoelectric element 200 may include: a first substrate 210, a first insulating layer 220 disposed on the first substrate 210, a plurality of first electrodes 230 disposed on the first insulating layer 220, a plurality of P-type thermoelectric legs 240 and a plurality of N-type thermoelectric legs 250 disposed on the plurality of first electrodes 230, a plurality of second electrodes 260 disposed on the plurality of P-type thermoelectric legs 240 and the plurality of N-type thermoelectric legs 250, a second insulating layer 270 disposed on the plurality of second electrodes 260, and a second substrate 280 disposed on the second insulating layer 270. The above description can be applied in the same manner for its detailed description.

[0188] Additionally, the second substrate 280 may include an upper surface 280a and a lower surface 280b. The upper surface 280a of the second substrate 280 may contact the heat sink 300. Furthermore, the second electrode 260 (or the second insulating layer 270) may be disposed on the lower surface 280b of the second substrate 280 and may contact the lower surface 280b of the second substrate 280.

[0189] Additionally, the second substrate 280 may include a first region P1 and a second region P2. The first region P1 is the region that overlaps with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 is the region that does not overlap with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 may correspond to the partition region between adjacent second electrodes 260.

[0190] The radiator 300 may include multiple fins 310 and connecting members 320.

[0191] The plurality of fins 310 can be arranged to be spaced apart from each other in a first direction (X-axis direction) or a second direction (Y-axis direction). In the first embodiment, the plurality of fins 310 can be arranged to be spaced apart from each other in the first direction (X-axis direction).

[0192] In the plurality of fins 310, the separation distance between adjacent fins in the second region P2 can be greater than that in the first region P1. Specifically, the first separation distance SL1 between adjacent fins 310 on the first region P1 can be different from the second separation distance SL2 between adjacent fins 310 on the second region P2. Furthermore, the first separation distance SL1 between adjacent fins 310 on the first region P1 can be smaller than the second separation distance SL2 between adjacent fins 310 on the second region P2. In other words, the second separation distance SL2 can be greater than the first separation distance SL1. In this embodiment, the first separation distance SL1 and the second separation distance SL2 refer to the length in the first direction (X-axis direction). With this configuration, heat absorbed by the fluid passing around the heat sink 300 on the first region P1 can be easily transferred through the substrate 280 to the second electrode 260. The path from the contact area between the second substrate 280 and the heat sink 300 (specifically, the connecting member (e.g., the first connecting member) described below) to the second electrode 260 can be reduced, thereby minimizing heat loss. Furthermore, by increasing the separation distance between adjacent fins on the second region P2 (e.g., a second separation distance), the increase in the pressure difference of the fluid caused by the multiple fins 310 can be prevented. Here, pressure difference refers to the pressure difference of the fluid before and after passing through the power generation device. In other words, the thermoelectric device according to the embodiment can minimize the occurrence of mechanical damage due to pressure difference by reducing the pressure difference of the fluid in the power generation device or the power generation system including the power generation device.

[0193] Furthermore, the first region P1 and the second region P2 can be alternately arranged in the first direction (X-axis direction) and the second direction (Y-axis direction). In other words, the second electrode can be arranged in an array along rows and columns to improve the power generation performance or heat exchange performance of the thermoelectric device.

[0194] The connecting member 320 can be disposed between adjacent fins 310 that are spaced apart from each other. In other words, the connecting member 320 can connect adjacent fins 310 that are spaced apart from each other.

[0195] Additionally, as described above, the connecting member 320 may include a first connecting member 321 and a second connecting member 322. The first connecting member 321 may contact the upper surface 280a of the second substrate 280. Furthermore, the second connecting member 322 may be spaced apart from the upper surface 280a of the second substrate 280 and positioned above the upper surface 280a of the second substrate 280.

[0196] Additionally, the first connecting member 321 can be connected to the fin 310. At least one end of the first connecting member 321 and the other end can contact the fin 310. The second connecting member 322 can be connected to the fin 310. In an embodiment, at least one end of the second connecting member 322 and the other end can contact the fin 310. Furthermore, the fin 310 may have one end connected to contact the first connecting member 321 and another end connected to contact the second connecting member 322. Therefore, the first connecting member 321 and the second connecting member 322 can be arranged to face each other relative to the fin. Additionally, the first connecting member 321 and the second connecting member 322 may not be arranged symmetrically relative to the fin 310.

[0197] Furthermore, the fins 310, the first connecting member 321, and the second connecting member 322 can be configured to extend in a second direction (Y-axis direction). In other words, multiple fins 310 can be configured to extend along the second direction (Y-axis direction) in a plane XY. Additionally, the first connecting member 321 and the second connecting member 322 can also be configured to extend along the second direction (Y-axis direction) in a plane XY. Therefore, the fins 310, the first connecting member 321, and the second connecting member 322 can be alternately arranged in the first direction (X-axis direction). For example, the first connecting member 321, the fins 310, the second connecting member 322, and the fins 310 can be sequentially and repeatedly arranged in the first direction (X-axis direction).

[0198] In addition, since the second separation distance SL2 between adjacent fins 310 on the second region P2 is different from the first separation distance SL1 between adjacent fins 310 on the first region P1, the length of the second connecting member 322 can also vary depending on the region.

[0199] Furthermore, since the second separation distance SL2 is greater than the first separation distance SL1, the length of the second connecting member 322 on the second region P2 can be greater than the length of the second connecting member 322 on the first region P1. The length of the second connecting member 322 is the length in the same direction as the direction of the adjacent first connecting member 321 or the adjacent second connecting member 322 facing each other. Therefore, the thermoelectric device according to the embodiment can improve thermal efficiency while reducing the pressure difference.

[0200] In the modified example, a portion of the fin 310 and the second connecting member 322 may be disposed in the second region P2. In other words, at least a portion of the fin 310 may be disposed between adjacent second electrodes and may overlap with the second region P2 in the third direction (Z-axis direction).

[0201] Therefore, the fins 310 can at least partially overlap with the outer surface of the second electrode 260 on the second region P2. With this configuration, the heat transfer efficiency can be improved when the heat sink transfers heat received from the high-temperature fluid to the second electrode 260. This is because when heat is transferred through the fins 310 to the second electrode 260, the heat is transferred to the entire second electrode (i.e., the entire upper surface of the second electrode), thereby increasing the heat transfer rate.

[0202] Reference Figure 17 In addition to what will be described below, a thermoelectric device according to another modified example can be applied in the same manner as the thermoelectric device according to the modified example described above.

[0203] In a thermoelectric device according to another modified example, the first connecting member 321, the second connecting member 322, and the fin 310 may be disposed in the second region P2.

[0204] Specifically, at least one fin 310 may be disposed on the second region P2. Therefore, at least one of the plurality of fins 310 may overlap with the second region P2.

[0205] Additionally, a portion of at least one of the first connecting members 321 may be disposed on the second region P2 to overlap with the second region P2. Therefore, the first connecting member 321 may also be disposed on the first region P1 and the second region P2.

[0206] In addition, at least one second connecting member 322 may be disposed between the outer surfaces 260a of adjacent second electrodes 260.

[0207] In the second region P2, the outer surface 260a of the second electrode 260 may have a separation distance d11 from the adjacent fin 310.

[0208] For example, a fin 310 may be disposed between the outer surfaces 260a of adjacent second electrodes 260, and a fin 310 adjacent to a fin 310 may partially overlap with the second region P2, or may be disposed on the first region P1. Alternatively, two or more fins 310 may also be disposed between the outer surfaces 260a of adjacent second electrodes 260.

[0209] With this configuration, as described above, the heat transfer efficiency can be improved when the heat sink receives heat from the high-temperature fluid to the second electrode 260. Furthermore, when the bonding with the upper surface 280a of the second substrate 280 is performed by reducing the length of the second connecting member in the first direction on the second region P2 and pressurizing the heat sink during manufacturing, the thermoelectric device according to the modified example can prevent the shape of the connecting member from changing due to the force applied to the connecting member.

[0210] Figure 18 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a second embodiment of the present invention. Figure 19 This is a plan view showing the components of the thermoelectric device according to the second embodiment. Figure 20 It is along Figure 19 A cross-sectional view taken from line D-D' in the diagram. Figure 21 It is along Figure 19 The cross-sectional view taken by line E-E' in the diagram, and Figure 22 It is along Figure 19 The cross-sectional view taken by line F-F' in the diagram.

[0211] Reference Figures 18 to 22 The thermoelectric device according to the second embodiment includes the thermoelectric element 200 and the radiator 300 as described above.

[0212] In the second embodiment, the thermoelectric element 200 may include: a first substrate 210, a first insulating layer 220 disposed on the first substrate 210, a plurality of first electrodes 230 disposed on the first insulating layer 220, a plurality of P-type thermoelectric legs 240 and a plurality of N-type thermoelectric legs 250 disposed on the plurality of first electrodes 230, a plurality of second electrodes 260 disposed on the plurality of P-type thermoelectric legs 240 and the plurality of N-type thermoelectric legs 250, a second insulating layer 270 disposed on the plurality of second electrodes 260, and a second substrate 280 disposed on the second insulating layer 270. For a detailed description thereof, references may be applied in the same manner as in the first embodiment. Figures 1 to 10 The content described.

[0213] First, the second substrate 280 may include a first region P1 and a second region P2. The first region P1 is the region that overlaps with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 is the region that does not overlap with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 may correspond to the partition region between adjacent second electrodes 260.

[0214] Additionally, the second substrate 280 may include an upper surface 280a and a lower surface 280b. The upper surface 280a of the second substrate 280 may contact the heat sink 300. Furthermore, the second electrode 260 (or the second insulating layer 270) may be disposed on the lower surface 280b of the second substrate 280 and may contact the lower surface 280b of the second substrate 280.

[0215] Additionally, the radiator 300 may include a plurality of fins 310 and a connecting member 320. The plurality of fins 310 may be arranged to be spaced apart from each other in a first direction (X-axis direction) or a second direction (Y-axis direction). In a second embodiment, the plurality of fins 310 may be arranged to be spaced apart from each other in the second direction (Y-axis direction).

[0216] In the plurality of fins 310, the separation distance between adjacent fins in the second region P2 can be greater than the separation distance between adjacent fins in the first region P1. Specifically, the first separation distance SL1' between adjacent fins 310 in the first region P1 can be different from the second separation distance SL2' between adjacent fins 310 in the second region P2. Furthermore, the first separation distance SL1' between adjacent fins 310 in the first region P1 can be less than the second separation distance SL2' between adjacent fins 310 in the second region P2. In other words, the second separation distance SL2' can be greater than the first separation distance SL1'. The separation distance (e.g., the first separation distance and the second separation distance) can be the distance between adjacent fins in the direction in which the first connecting member 321, the fins 310, and the second connecting member 322 are arranged, as will be described below. Therefore, in the second embodiment, the first separation distance SL1' and the second separation distance SL2' refer to the length in the second direction (Y-axis direction).

[0217] With this configuration, heat absorbed by the fluid passing around the heat sink 300 on the first region P1 can be easily transferred through the substrate 280 to the second electrode 260. The path from the contact area between the second substrate 280 and the heat sink 300 (specifically, the connecting member (e.g., the first connecting member) described below) to the second electrode 260 can be reduced, thereby minimizing heat loss. Furthermore, by increasing the separation distance between adjacent fins on the second region P2 (e.g., a second separation distance), an increase in the pressure difference of the fluid caused by the multiple fins 310 can be prevented. Additionally, the thermoelectric device according to the second embodiment can minimize mechanical damage caused by pressure differential by reducing the pressure difference of the fluid in the power generation device or the power generation system including the power generation device.

[0218] Furthermore, the first region P1 and the second region P2 can be alternately arranged in the first direction (X-axis direction) and the second direction (Y-axis direction). In other words, the second electrode can be arranged in an array along rows and columns to improve the power generation performance or heat exchange performance of the thermoelectric device.

[0219] The connecting member 320 can be disposed between adjacent fins 310 that are spaced apart from each other. In other words, the connecting member 320 can connect adjacent fins 310 that are spaced apart from each other.

[0220] According to an embodiment, the connecting member 320 may include a first connecting member 321 and a second connecting member 322. The first connecting member 321 may contact the upper surface 280a of the second substrate 280. In addition, the second connecting member 322 may be spaced apart from the upper surface 280a of the second substrate 280 and positioned above the upper surface 280a of the second substrate 280.

[0221] As described above, the first connecting member 321, the fin 310, and the second connecting member 322 can contact each other and can be connected to each other. The description thereof can be applied in the same manner as that described in the first embodiment.

[0222] Additionally, multiple second electrodes 260 may be provided. In the accompanying drawings, the multiple second electrodes 260 may include electrode 260-1 (2-1), electrode 260-2 (2-2), electrode 260-3 (2-3), and electrode 260-4 (2-4). The above description may be applied in the same manner, except as described below.

[0223] Multiple fins 310 can be alternately arranged in the second direction (Y-axis direction). Therefore, electrodes arranged in the same row can be arranged under the same fin 310. For example, multiple fins 310 arranged on electrode 2-1 260-1 and electrode 2-2 260-2 can be identical to each other. In addition, multiple fins 310 arranged on electrode 2-3 260-3 and electrode 2-4 260-4 can be identical to each other.

[0224] In the second embodiment, the fins 310, the first connecting member 321, and the second connecting member 322 can be configured to extend in a first direction (X-axis direction). Furthermore, multiple fins 310 can be configured to extend along the first direction (X-axis direction) in a plane XY. Additionally, the first connecting member 321 and the second connecting member 322 can also be configured to extend along the first direction (X-axis direction) in a plane XY. Therefore, the fins 310, the first connecting member 321, and the second connecting member 322 can be alternately arranged in the second direction (Y-axis direction). For example, the first connecting member 321, the fins 310, the second connecting member 322, and the fins 310 can be sequentially and repeatedly arranged in the second direction (Y-axis direction).

[0225] In addition, since the second separation distance SL2' between adjacent fins 310 on the second region P2 is different from the first separation distance SL1' between adjacent fins 310 on the first region P1, the length of the second connecting member 322 can also vary depending on the region.

[0226] In this embodiment, since the second separation distance SL2' is greater than the first separation distance SL1', the length of the second connecting member 322 on the second region P2 can be greater than the length of the second connecting member 322 on the first region P1. Here, the length of the second connecting member 322 is the length in the same direction as the direction of the adjacent first connecting member 321 or the adjacent second connecting member 322 facing each other. Furthermore, since the length of the second connecting member 322 on the second region P2 is greater than the length of the second connecting member 322 on the first region P1, the thermoelectric device can improve thermal efficiency while reducing the pressure difference.

[0227] Alternatively, in one embodiment, the second connecting member 322 may be disposed solely within the second region P2. The second region P2 may overlap only with the second connecting member 322 in the third direction (Z-axis direction). This configuration improves the reduction of pressure differential.

[0228] Alternatively, as described above, a portion of the fin 310 and the second connecting member 322 may be disposed in the second region P2.

[0229] Alternatively, at least a portion of the first connecting member 321, the second connecting member 322, and the fin 310 may be disposed in the second region P2.

[0230] Furthermore, according to the embodiment, as described above, the first length of the second electrode 260 in the first direction (X-axis direction) can be less than the second length of the second electrode 260 in the second direction (Y-axis direction). In this case, the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250 connected to contact the second electrode 260 can be arranged side by side along the second direction (Y-axis direction).

[0231] Figure 23 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a third embodiment of the present invention. Figure 24 This is a plan view showing the components of the thermoelectric device according to the third embodiment. Figure 25 It is along Figure 24 The cross-sectional view taken by line I-I' in the diagram, and Figure 26 It is along Figure 24 The cross-sectional view taken from line J-J' in the diagram.

[0232] Reference Figures 23 to 26 The thermoelectric device according to the third embodiment includes the thermoelectric element 200 and the radiator 300 as described above.

[0233] In a third embodiment, the thermoelectric element 200 may include: a first substrate 210, a first insulating layer 220 disposed on the first substrate 210, a plurality of first electrodes 230 disposed on the first insulating layer 220, a plurality of P-type thermoelectric legs 240 and a plurality of N-type thermoelectric legs 250 disposed on the plurality of first electrodes 230, a plurality of second electrodes 260 disposed on the plurality of P-type thermoelectric legs 240 and the plurality of N-type thermoelectric legs 250, a second insulating layer 270 disposed on the plurality of second electrodes 260, and a second substrate 280 disposed on the second insulating layer 270. For a detailed description thereof, references may be applied in the same manner as in other embodiments. Figures 1 to 10 The content described.

[0234] First, the second substrate 280 may include a first region P1 and a second region P2. The first region P1 is the region that overlaps with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 is the region that does not overlap with the second electrode 260 in the vertical direction (Z-axis direction). The second region P2 may correspond to the partition region between adjacent second electrodes 260.

[0235] Additionally, the second substrate 280 may include an upper surface 280a and a lower surface 280b. The upper surface 280a of the second substrate 280 may contact the heat sink 300. Furthermore, the second electrode 260 (or the second insulating layer 270) may be disposed on the lower surface 280b of the second substrate 280 and may contact the lower surface 280b of the second substrate 280.

[0236] Additionally, the radiator 300 may include a plurality of fins 310 and a connecting member 320. The plurality of fins 310 may be arranged to be spaced apart from each other in a first direction (X-axis direction) or a second direction (Y-axis direction). In a second embodiment, the plurality of fins 310 may be arranged to be spaced apart from each other in the second direction (Y-axis direction).

[0237] In the plurality of fins 310, the separation distance between adjacent fins in the second region P2 can be greater than the separation distance between adjacent fins in the first region P1. In the third embodiment, the separation distance between adjacent fins refers to the length in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0238] Specifically, the first separation distance SL1” between adjacent fins 310 on the first region P1 is different from the second separation distance SL2 between adjacent fins 310 on the second region P2. Furthermore, the first separation distance SL1” between adjacent fins 310 on the first region P1 can be smaller than the second separation distance SL2 between adjacent fins 310 on the second region P2. In other words, the second separation distance SL2” can be greater than the first separation distance SL1.

[0239] At this point, the first separation distance SL1” can refer to the length in the first direction (X-axis direction) or the length in the second direction (Y-axis direction), and they can be the same or different from each other. Similarly, the second separation distance SL2” can also refer to the length in the first direction (X-axis direction) or the length in the second direction (Y-axis direction), and they can be the same or different from each other.

[0240] However, as described above, since the first separation distance SL1” is smaller than the second separation distance SL2”, the heat absorbed by the fluid passing around the heat sink 300 on the first region P1 can be easily transferred to the second electrode 260 through the substrate 280.

[0241] Therefore, the path from the contact area between the second substrate 280 and the heat sink 300 (specifically, the connecting member (e.g., the first connecting member) described below) to the second electrode 260 can be reduced, thereby minimizing heat loss.

[0242] In addition, by increasing the separation distance between adjacent fins on the second region P2 (e.g., the second separation distance), the increase in the pressure difference of the fluid caused by the multiple fins 310 can be prevented.

[0243] Furthermore, the thermoelectric device according to the third embodiment can minimize the occurrence of mechanical damage caused by pressure difference by reducing the pressure difference of the fluid in the power generation device or the power generation system including the power generation device.

[0244] Furthermore, the first region P1 and the second region P2 can be alternately arranged in the first direction (X-axis direction) and the second direction (Y-axis direction). In other words, the second electrode can be arranged in an array along rows and columns to improve the power generation performance or heat exchange performance of the thermoelectric device.

[0245] Additionally, the connecting member 320 can be disposed between adjacent fins 310 that are spaced apart from each other. In other words, the connecting member 320 can connect adjacent fins 310 that are spaced apart from each other.

[0246] According to an embodiment, the connecting member 320 may include a first connecting member 321 and a second connecting member 322. The first connecting member 321 may contact the upper surface 280a of the second substrate 280. In addition, the second connecting member 322 may be spaced apart from the upper surface 280a of the second substrate 280 and positioned above the upper surface 280a of the second substrate 280.

[0247] Furthermore, the first connecting member 321, the fin 310, and the second connecting member 322 can contact each other and can be connected to each other. The description herein can be applied in the same manner to the descriptions in other embodiments.

[0248] Additionally, multiple second electrodes 260 may be provided. In the accompanying drawings, the multiple second electrodes 260 may include electrode 260-1 (2-1), electrode 260-2 (2-2), electrode 260-3 (2-3), and electrode 260-4 (2-4). The above description may be applied in the same manner, except as described below.

[0249] Multiple fins 310 can be alternately arranged in a first direction (X-axis direction) and a second direction (Y-axis direction). Therefore, electrodes arranged in the same row or column can be arranged under different fins 310. For example, different fins 310 (i.e., fins 310 arranged to be spaced apart from each other) can be positioned on electrodes 2-1 to 2-4.

[0250] Furthermore, in the third embodiment, unlike the first or second embodiment, the fins 310, the first connecting member 321, and the second connecting member 322 may not extend between adjacent electrodes in the first direction (X-axis direction) or the second direction (Y-axis direction). In other words, in the third embodiment, in the heat sink 300, the first connecting member 321 and the second connecting member 322 may be alternately arranged in the first direction (X-axis direction) and the second direction (Y-axis direction). For example, the first connecting member 321, the fins 310, the second connecting member 322, and the fins 310 are sequentially and repeatedly arranged in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0251] In addition, as described above, since the second separation distance SL2' between adjacent fins 310 on the second region P2 is different from the first separation distance SL1' between adjacent fins 310 on the first region P1, the length of the second connecting member 322 can also vary depending on the region.

[0252] In the third embodiment, since the second separation distance SL2” is greater than the first separation distance SL1”, the length of the second connecting member 322 on the second region P2 can be greater than the length of the second connecting member 322 on the first region P1. Furthermore, since the length of the second connecting member 322 on the second region P2 is greater than the length of the second connecting member 322 on the first region P1, the thermoelectric device can improve thermal efficiency while reducing the pressure difference.

[0253] Alternatively, the second connecting member 322 can be disposed solely within the second region P2. The second region P2 may overlap only with the second connecting member 322 in the third direction (Z-axis direction). This configuration can improve the reduction of pressure differential.

[0254] Alternatively, the above-described modified example can be applied, and thus a portion of the fin 310 and the second connecting member 322 can be disposed in the second region P2.

[0255] Alternatively, at least a portion of the first connecting member 321, the second connecting member 322, and the fin 310 may be disposed in the second region P2.

[0256] Figure 27 This is a perspective view of a thermoelectric device including a thermoelectric element and a heat sink according to a fourth embodiment of the present invention. Figure 28 This is a perspective view of the heat sink and connecting member of the thermoelectric device according to the fourth embodiment, and Figure 29 This is a bottom view of the heat sink and connecting member of the thermoelectric device according to the fourth embodiment.

[0257] Reference Figures 27 to 29As described above, the thermoelectric device TD according to the fourth embodiment includes: a thermoelectric element 200; a heat sink 3000 disposed on the thermoelectric element 200; and a coupling member CU configured to couple the heat sink 3000 and the thermoelectric element 200 between the heat sink 3000 and the thermoelectric element 200.

[0258] The bonding member CU can be disposed between the thermoelectric element 200 and the heat sink 3000. The bonding member CU can be made of a thermally conductive material. For example, the bonding member CU can be made of a material used for welding, such as silver paste or Sn, such as PbSn or CuAgSn. However, the present invention is not limited to these materials.

[0259] In addition, the connecting member CU can be made of a material that is heat-resistant to the high temperature of the fluid passing through the heat sink 3000.

[0260] In this embodiment, the connecting member CU can be positioned within a recess G in the heat sink 3000. In other words, the connecting member CU can be positioned within a recess G formed on the bottom surface of the lower member 3210. This configuration improves the coupling force between the heat sink 3000 and the thermoelectric element 200. Furthermore, since the connecting member CU is positioned within the recess G and not exposed to the outside (e.g., air), the reliability of the thermoelectric device is improved. Additionally, the heat sink 3000 and the thermoelectric element 200 (particularly the second substrate 280) are in contact with each other, allowing the connecting member CU to reduce the fluid flow area and prevent an increase in pressure differential. The structure of the connecting member CU and the heat sink 3000 will be described below.

[0261] Furthermore, the heat sink 3000 described below corresponds to the heat sink 300 described above, the lower member 3210 corresponds to the first connecting member 321 described above, and the upper member 3220 corresponds to the second connecting member 322 described above. Therefore, the above content can be applied in the same manner, except for the content of each element described below.

[0262] More specifically, in the thermoelectric device TD according to an embodiment, the radiator 3000 may include: a lower member 3210 in contact with the thermoelectric element 200, an extension member 3100 connected to the lower member, and an upper member 3220 in contact with the extension member 3100 and spaced apart from the lower member 3210. This can also be applied in the same manner to the various embodiments described below.

[0263] Additionally, the lower member 3210 may at least partially contact the second substrate 280 of the thermoelectric element 200. Therefore, heat from the fluid can be transferred / absorbed to the thermoelectric element through the heat sink 3000 (particularly the lower member 3210).

[0264] In this embodiment, the lower member 3210 may extend in the second direction (Y-axis direction). In other words, the lower member 3210 may overlap with a plurality of second electrodes 260 arranged in the second direction (Y-axis direction) in the third direction (Z-axis direction).

[0265] In addition, one end of the lower member 3210 and the other end can be connected to contact the extension member 3100.

[0266] Additionally, the lower member 3210 may include the groove G as described above. The groove G may protrude along a third direction (Z-axis direction). Furthermore, the groove G may be positioned on the central portion of the lower member 3210. Therefore, the edge of the lower member 3210 may contact the upper surface 280a of the second substrate 280. Alternatively, the bottom surface of the groove G in the lower member 3210, which will be described below, may be spaced apart from the upper surface 280a of the second substrate 280 in a third direction (Z-axis direction).

[0267] One end of the extension member 3100 can contact and be connected to the lower member 3210. The other end of the extension member 3100 can contact and be connected to the upper member 3220, which will be described below. Additionally, one end of the extension member 3100 can be positioned below its other end. In other words, one end can be positioned closer to the second substrate in the third direction than the other end. Here, "lower" refers to the region on the first substrate side relative to the first and second substrates, and the region in the direction opposite to the third direction, while "upper" refers to the region on the second substrate side and the region in the third direction.

[0268] Additionally, the extension member 3100 can be disposed between the lower member 3210 and the upper member 3220. Therefore, the lower member 3210 and the upper member 3220 can be configured to be spaced apart from each other relative to the extension member 3100.

[0269] However, the lower member 3210 and the upper member 3220 do not need to face each other relative to the extension member 3100. In other words, the lower member 3210 and the upper member 3220 do not need to overlap each other in the third direction (Z-axis direction). Therefore, the heat exchange efficiency can be increased by increasing the surface cross-sectional area of ​​the heat sink 3000.

[0270] In this embodiment, the lower member 3210, the extension member 3100, the upper member 3220, and the extension member 3100 may be arranged sequentially and alternately. In particular, the lower member 3210, the extension member 3100, the upper member 3220, and the extension member 3100 may be arranged sequentially in a first direction (X-axis direction). This will be described below.

[0271] Furthermore, the lower member 3210, the extension member 3100, the upper member 3220, and the extension member 3100 can be configured to extend in the second direction (Y-axis direction). Correspondingly, the engaging member CU disposed in the groove G can also be configured to extend in the second direction (Y-axis direction). Additionally, the engaging members CU can be configured to be spaced apart in the first direction (X-axis direction) to correspond to the lower member 3210.

[0272] Figure 30 This is a plan view showing the components of the thermoelectric device according to the fourth embodiment. Figure 31 It is along Figure 30 A cross-sectional view taken from line A-A' in the diagram. Figure 32 It is along Figure 30 The cross-sectional view taken by line B-B' in the diagram, and Figure 33 It is along Figure 30 The cross-sectional view taken by line C-C' in the diagram.

[0273] Reference Figures 30 to 33 The second electrode 260 can be arranged in an array along rows and columns to improve the power generation performance or heat exchange performance of the thermoelectric device.

[0274] According to the embodiment, the first length EL1 of the second electrode 260 in the first direction (X-axis direction) can be less than the second length EL2 in the second direction (Y-axis direction). In this case, the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250 connected to contact the second electrode 260 can be arranged side by side along the second direction (Y-axis direction).

[0275] According to the embodiment, the extension member 3100, lower member 3210, and upper member 3220 can extend in a direction corresponding to the direction in which the P-type thermoelectric leg 240 and N-type thermoelectric leg 250 are disposed on an electrode (e.g., a second electrode). Therefore, since the extension member 3100, lower member 3210, and upper member 3220 extend along the long side of the second electrode, the thermoelectric device according to the embodiment can improve thermal efficiency by increasing the heat exchange time between the high-temperature fluid and the heat sink.

[0276] However, it should be understood that when the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250 are arranged side by side along the first direction (X-axis direction), the shape of the second electrode 260 can be changed to correspond to the P-type thermoelectric leg 240 and the N-type thermoelectric leg 250.

[0277] In the accompanying drawings, the plurality of second electrodes 260 may include 2-1 electrode 260-1, 2-2 electrode 260-2, 2-3 electrode 260-3 and 2-4 electrode 260-4.

[0278] Electrodes 2-1 (260-1) and 2-2 (260-2) can be arranged side-by-side along a first direction (X-axis direction). Electrodes 2-3 (260-3) and 2-4 (260-4) can also be arranged side-by-side along the first direction (X-axis direction). Electrodes 2-1 (260-1) and 2-3 (260-3) can also be arranged side-by-side along a second direction (Y-axis direction). Electrodes 2-2 (260-2) and 2-4 (260-4) can also be arranged side-by-side along the second direction (Y-axis direction).

[0279] According to the embodiment, multiple extension members 3100 can be alternately disposed in the first direction (X-axis direction). Additionally, one extension member 3100 can be disposed on the second electrode 260 in a second direction (Y-axis direction) perpendicular to the first direction, and the extension members 3100 overlapping with the second electrode 260 in the second direction can be identical. A lower member 3210 can also be disposed on the second electrode 260 in the second direction (Y-axis direction), and the extension members 3100 overlapping with the second electrode 260 in the second direction can be identical. Furthermore, an upper member 3220 can also be disposed on the second electrode 260 in the second direction (Y-axis direction), and the extension members 3100 overlapping with the second electrode 260 in the second direction can be identical. For example, multiple extension members 3100 disposed on electrodes 2-1 (2-1) and 2-3 (2-3) can be identical to each other. Similarly, multiple extension members 3100 disposed on electrodes 2-2 (2-2) and 2-4 (2-4) can be identical to each other.

[0280] In this embodiment, the extension member 3100, the lower member 3210, and the upper member 3220 can be configured to extend in a second direction (Y-axis direction). In other words, the plurality of extension members 3100 can be configured to extend along the second direction (Y-axis direction) in a plane XY. Additionally, the lower member 3210 and the upper member 3220 can also be configured to extend along the second direction (Y-axis direction) in a plane XY. Therefore, the extension member 3100, the lower member 3210, and the upper member 3220 can be alternately configured in the first direction (X-axis direction). For example, the lower member 3210, the extension member 3100, the upper member 3220, and the extension member 3100 can be sequentially and repeatedly configured in the first direction (X-axis direction).

[0281] Additionally, the heat sink 3000 may have a recess formed by the extension member 3100 and the lower member 3210, and a protrusion formed by the extension member 3100 and the upper member 3220. According to an embodiment, in the heat sink 3000, the extension member 3100 and the lower member 3210 may be configured as recesses having an upward (e.g., in the direction from the thermoelectric element toward the heat sink) recessed structure. Furthermore, in the heat sink 3000, the extension member 3100 and the upper member 3220 may be configured as protrusions having an upward (e.g., in the direction from the thermoelectric element toward the heat sink) projecting structure. However, in the lower case, the recess may also be transformed into a protrusion, and vice versa.

[0282] Furthermore, as described above, the recesses and protrusions can be sequentially and repeatedly arranged in the first direction (X-axis direction). Additionally, since the recesses are formed by the lower member 3210, the grooves G provided on the bottom surface of the lower member 3210 can also be sequentially and repeatedly arranged together with the protrusions in the first direction (X-axis direction).

[0283] Alternatively, in the embodiment, the groove G may also extend in the second direction (Y-axis direction) like the lower member 3210 and the upper member 3220.

[0284] First, the groove G can be positioned at the center of the lower member 3210. Therefore, the lower member 3210 may include a first member region PP1 overlapping with the groove G and a second member region PP2 outside the groove G or in contact with the second substrate 280. In other words, in this embodiment, the first member region PP1 may overlap with the engaging member CU in the vertical direction.

[0285] In one embodiment, the lower member 3210 may include a first edge M1 to a fourth edge M4. The first edge M1 and the second edge M2 may be arranged to face each other, and the third edge M3 and the fourth edge M4 may be arranged to face each other.

[0286] Furthermore, the first edge M1 and the second edge M2 can be positioned between the third edge M3 and the fourth edge M4. In this case, the first edge M1 and the second edge M2 can extend in the second direction (Y-axis direction) and can be the long sides of the lower member 3210. Additionally, the third edge M3 and the fourth edge M4 can extend in the first direction (X-axis direction) and can be the short sides of the lower member 3210.

[0287] Furthermore, the groove G can be configured to be spaced apart from the first edge M1 and the second edge M2. In other words, the groove G can have a first separation distance d11 from the first edge M1 or the second edge M2.

[0288] Additionally, the groove G can be configured to be spaced apart from the third edge M3 and the fourth edge M4. In other words, the groove G can have a second separation distance d12 from the third edge M3 or the fourth edge M4.

[0289] In this embodiment, the first separation distance d11 and the second separation distance d12 can be the same. This configuration minimizes the overflow of the joining member CU into areas or to one side outside the groove G. Furthermore, while increasing the bonding force between the lower member 3210 and the second substrate 280, it prevents a decrease in the reliability of the thermoelectric device due to an imbalance in the bonding force.

[0290] The groove G can be positioned on the central portion C11 of the lower member 3210. Here, the central portion C11 can be the intersection of the bisectors of the first edge M1 and the second edge M2 with the bisectors of the third edge M3 and the fourth edge M4. The central portion C11 can also be the center of gravity, which serves as the center of the lower member 3210 or the groove G.

[0291] Furthermore, according to the embodiment, at least a portion of the groove G can overlap with the second electrode 260 in the vertical direction. Specifically, as described above, the groove G can extend in the second direction (Y-axis direction) and overlap with the second electrode 260 arranged in the second direction (Y-axis direction) in the vertical direction. In other words, the lower member 3210 can also overlap with the second electrode 260 in the vertical direction, and the heat transfer path from the lower member 3210 to the second electrode 260 can be minimized. Therefore, the efficiency of heat reception / absorption can be improved.

[0292] Furthermore, as described above, the bonding member CU can be disposed between the heat sink 3000 and the thermoelectric element 200 (particularly the second substrate 280). As described above, the bonding member CU can be made of a material with thermal conductivity and heat resistance. For example, the bonding member CU can be heat-resistant to the high temperature of the fluid passing through the heat sink 3000.

[0293] The engaging member CU can be placed in the groove G. Alternatively, the engaging member CU can be positioned below the lower member 3210.

[0294] In this embodiment, the joining member CU can be positioned solely within the groove G. Therefore, the second member region PP2 of the lower member 3210 can contact the upper surface of the second substrate 280. In other words, the joining member CU can be surrounded by the second member region PP2. This configuration minimizes contact between the joining member CU and external foreign objects or fluids, thereby improving the reliability of the thermoelectric device. More specifically, since the joining member CU is positioned within the groove G of the lower member 3210, the separation distance between the lower member 3210 and the second substrate 280 can be minimized. Therefore, the coupling force between the second substrate 280 and the heat sink 3000 can be improved, thereby improving the reliability as described above. Furthermore, heat exchange between the second substrate 280 and the heat sink 3000 can occur more efficiently. Additionally, when the separation distance between the second substrate 280 and the heat sink 3000 increases, the length of the heat sink is limited to the fluid movement area corresponding to the desired pressure difference. In other words, due to the limitation on the length of the extension member, a problem arises in reducing the heat exchange rate of the heat sink. Furthermore, when the groove G is absent, the increase in pressure difference caused by the connecting member inevitably makes it difficult to achieve the desired heat exchange rate. However, in contrast, the thermoelectric device according to the embodiment can provide an improved heat exchange rate, reliability, and reduced pressure difference.

[0295] Furthermore, the bonding member CU can contact the upper surface of the second substrate 280 and the lower member 3210. Therefore, the coupling force between the heat sink 3000 and the thermoelectric element 200 can be improved.

[0296] Furthermore, the first component region PP1 of the lower component 3210 may at least partially overlap with the second electrode 260. Additionally, the second component region PP2 of the lower component 3210 may at least partially overlap with the second electrode 260. With this configuration, heat reception / absorption of the second electrode 260 can be effectively performed by the lower component 3210.

[0297] In this embodiment, the position of the second component region PP2 of the lower component 3210 can vary depending on the separation distance SSL1 between adjacent extension components 3100. For example, the separation distance SSL1 between adjacent extension components 3100 can be greater than the separation distance SSL6 in the first direction (X-axis direction) of the second electrode 260. In this case, the first component region PP1 and the second component region PP2 can at least partially overlap with the second electrode 260 in the vertical direction (Z-axis direction). Therefore, heat loss can be reduced by decreasing the heat movement path.

[0298] Furthermore, when the separation distance SSL1 between the extension members 3100 is equal to or less than the separation distance SSL6 in the first direction (X-axis direction) of the second electrode 260, the second member region PP2 and the first member region PP1 can be positioned to overlap with the second electrode 260 in the vertical direction (Z-axis direction). Therefore, the power generation performance of the thermoelectric device can be improved by minimizing heat loss due to thermal movement.

[0299] In one embodiment, the groove G and the engaging member CU in the groove G extend in the second direction (Y-axis direction), and thus can be disposed along the second electrode 260 arranged in the second direction (Y-axis direction). In this case, the engaging member CU can also be disposed between adjacent second electrodes 260 arranged in the second direction (Y-axis direction).

[0300] In addition, the upper member 3220 also extends in the second direction (Y-axis direction) and can therefore be disposed along the second electrode 260 arranged in the second direction (Y-axis direction) and is configured to be spaced apart from the upper surface 280a of the second substrate 280 in the vertical direction.

[0301] Furthermore, in this embodiment, the length SSL2 of the groove G in the first direction (X-axis direction) can correspond to the length of the first member region PP1. Additionally, the length SSL2 of the groove G in the first direction (X-axis direction) can be less than the separation distance SSL1 between adjacent extension members 3100. Furthermore, the length SSL3 of the second member region PP2 can correspond to the difference between the separation distance SSL1 between adjacent extension members 3100 and the length SSL2 of the groove G in the first direction (X-axis direction) (excluding the thickness of the lower member, extension members, and upper member).

[0302] In this embodiment, the ratio between the separation distance SSL1 between adjacent extension members 3100 and the length SSL3 of the second member region PP2 can be from 1:0.05 to 1:0.1. When the ratio is less than 1:0.05, the problem is that the joining members overflow and are difficult to manufacture, and when the ratio is greater than 1:0.1, the problem is that the heat exchange performance is reduced. In this case, the length SSL3 of the second member region PP2 corresponds to the separation distance between the side surface SS and the extension member 3100.

[0303] In addition, in the embodiment, the distance SSL4 between the upper member 3220 and the second substrate 280 (or thermoelectric element) can be greater than the height of the groove or the length SSL5 between the bottom surface BS of the groove and the second substrate 280 (or thermoelectric element).

[0304] Furthermore, the ratio between the distance SSL4 between the upper member 3220 and the second substrate 280 (or thermoelectric element) and the height of the groove or the length SSL3 between the bottom surface BS of the groove and the second substrate 280 (or thermoelectric element) can be from 1:0.1 to 1:0.1. When this ratio is less than 1:0.1, the bonding force of the connecting member CU decreases, while when this ratio is greater than 1:0.1, the groove G and the connecting member reduce fluid movement, resulting in increased pressure differential and reduced heat exchange efficiency, thereby reducing power generation.

[0305] Furthermore, the groove G can be formed by a bottom surface BS and a side surface SS. As described above, since the groove G protrudes from the lower member 3210 toward the upper member 3220, the bottom surface BS can be disposed between the lower member 3210 and the upper member 3220. The side surface SS of the groove can be disposed around the bottom surface BS of the groove G. In addition, the bottom surface BS and the side surface SS of the groove G can have curvature. For example, when the side surface SS of the groove G has curvature, the aforementioned length (e.g., SL3) can be applied as an average value.

[0306] In various embodiments, the groove G may have a curvature that protrudes towards the second substrate 280 or towards the upper member 3220. Therefore, when the joining member CU flows back into the groove G, it can expand and contract due to temperature. Since the contact area between the joining member CU and the lower member 3210 increases when the groove G has the aforementioned curvature, it can easily withstand expansion pressure, thereby improving the reliability of the device.

[0307] For example, since the joint area of ​​the joint member CU increases when the side surface SS and bottom surface BS of the groove G have curvature, the joint force between the heat sink and the thermoelectric element can be increased.

[0308] Additionally, as a modification example, the length of the lower member 3210 in the first direction (X-axis direction) can differ from the length of the upper member 3220 in the first direction. Therefore, the coupling force between the heat sink and the thermoelectric element can be improved.

[0309] Furthermore, even when the upper component 3220 blocks the fluid path through the groove G of the lower component 3210, heat exchange can be maintained while reducing the pressure difference by adjusting the length of the upper component 3220.

[0310] Additionally, the lower member 3210 may be additionally disposed at both ends of the second substrate 280 in the first direction (X-axis direction). Furthermore, as described above, the groove G may be disposed on the lower member 3210, and the engaging member CU may be positioned within the groove G.

[0311] Therefore, since the lower member 3210 in the heat sink 3000 is disposed on the outermost side of the second substrate 280 in the first direction (X-axis direction), the coupling force between the edge of the heat sink 3000 and the second substrate 280 can be improved. Therefore, the reliability of the thermoelectric device according to the embodiment can be improved.

[0312] Furthermore, since the upper member 3220 or the extension member 3100 in the heat sink 3000 is not disposed on the outermost side of the second substrate 280 in the first direction (X-axis direction), the support force of the second substrate 280 can also be improved.

[0313] Figure 34 This is a cross-sectional view of the thermoelectric device according to the fifth embodiment, and Figure 35 yes Figure 34 A magnified view of part K1 in the image.

[0314] As described above, the thermoelectric device according to the fifth embodiment may include: a thermoelectric element 200, a heat sink 3000 disposed on the thermoelectric element 200, an electrode connection unit, and a bonding member CU.

[0315] In the fifth embodiment, the above description of the thermoelectric element 200, the heat sink 3000, the electrode connection unit and the bonding member CU can be applied in the same manner, except as described below.

[0316] First, according to the fifth embodiment, the joining member CU disposed in the groove G can extend between the second member region PP2 of the lower member 3210 and the thermoelectric element 200.

[0317] More specifically, the joining member CU may extend between the second member region PP2 of the lower member and the second substrate 280 (or the upper surface 280a of the second substrate).

[0318] At this time, the joining member CU may include: a first joining region CU1 that overlaps with the first member region PP1 (i.e., groove G) in the vertical direction, and a second joining region CU2 that overlaps with the second member region PP2 in the vertical direction.

[0319] The length of the first mating region CU1 in the vertical direction (Z-axis direction) can be greater than the length of the side surface SS of the groove G in the vertical direction (Z-axis direction). In other words, the lower member 3210 of the heat sink can be configured to be spaced apart from the thermoelectric element.

[0320] However, the connecting member CU is mostly positioned within the groove G, and can therefore be configured to overlap with the lower member 3210 in the third direction (Z-axis direction). Alternatively, the connecting member CU may not overlap with the upper member 3220 in the vertical direction. With this configuration, since the connecting member CU is positioned below the lower member 3210, the exposed surface of the connecting member CU can correspond to the gap between the lower member 3210 and the thermoelectric element. Therefore, the contact area between the fluid flowing through the heat sink can be minimized, thereby improving the reliability of the connecting member CU, i.e., the reliability of the thermoelectric device.

[0321] Furthermore, in the joining member CU, the length of the first joining region CU1 in the vertical direction (Z-axis direction) can be less than the length of the second joining region CU2 in the vertical direction (Z-axis direction). Therefore, the joining member CU can be positioned within the second member region PP2.

[0322] Furthermore, the second bonding region CU2 can be positioned within the second component region PP2, thereby creating a separation space between the second component region PP2 and the thermoelectric element. Therefore, due to the reduced spacing between the second component region PP2 and the thermoelectric element, fluid flowing through the heat sink may not easily come into contact with the second bonding region CU2. This improves the reliability of both the bonding component CU and the thermoelectric device.

[0323] Figure 36 This is a cross-sectional view of the thermoelectric device according to the sixth embodiment, and Figure 37 yes Figure 36 A magnified view of part K2 in the image.

[0324] As described above, the thermoelectric device according to the sixth embodiment may include: a thermoelectric element 200, a heat sink 3000 disposed on the thermoelectric element 200, an electrode connection unit, and a bonding member CU.

[0325] In the sixth embodiment, the above description of the thermoelectric element 200, the heat sink 3000, the electrode connection unit and the bonding member CU can be applied in the same manner, except as described below.

[0326] First, according to the sixth embodiment, as described above, the groove G may include a bottom surface BS and a side surface SS. Furthermore, when the side surface SS is configured to surround the bottom surface BS, the side surface SS may be configured to be spaced apart from the edge of the second lower member 3210 by a predetermined distance.

[0327] At this point, the side surface SS may have a stepped portion ST. In an embodiment, multiple stepped portions ST may be provided.

[0328] Referring to the accompanying drawings, the side surface SS of the groove G may have a first side surface SS1, a second side surface SS2, and a third side surface SS3. The first side surface SS1 may contact the bottom surface BS of the groove G. Additionally, the second side surface SS2 may contact both the first side surface SS1 and the third side surface SS3. The second side surface SS2 may be a surface curved at a predetermined angle from the first side surface SS1, which extends in the vertical direction. Furthermore, the third side surface SS3 may be a surface that contacts the second side surface SS2 and is curved at a predetermined angle from the second side surface SS2. The third side surface SS3 may extend in the same direction as the first side surface SS1.

[0329] Furthermore, as described above, the first side surface SS1, the second side surface SS2, and the third side surface SS3 can be positioned outside the bottom surface BS of the groove G and configured to surround the bottom surface BS. Therefore, the width of the area surrounded by the first side surface SS1 can be different from the width of the area surrounded by the third side surface SS3. In the embodiment, the width of the bottom surface BS in the first direction and the maximum width of the side surface SS in the first direction can be different from each other.

[0330] Furthermore, the width of the bottom surface BS in the first direction can be smaller than the maximum width of the side surface SS in the first direction. For example, the width of the area surrounded by the first side surface SS1 can be greater than the width of the area surrounded by the third side surface SS3. In other words, the side surface can become smaller as it gets closer to the lower member.

[0331] Therefore, the joining member CU is positioned in the groove G, and the extension of the joining member CU between the second member region PP2 and the thermoelectric element is prevented to the greatest extent. Thus, since there are surfaces in direct contact between the heat sink and the thermoelectric element (particularly the second substrate), direct heat exchange occurs from the heat sink to the thermoelectric element, thereby improving heat exchange through the joining member. Furthermore, the heat exchange rate is increased by preventing the formation of a separation space between the heat sink 3000 and the thermoelectric element, thus preventing an increase in the area that inhibits fluid flow.

[0332] Furthermore, the extension of the joining member CU described in the fifth embodiment can also be applied to the sixth embodiment as another modification example.

[0333] Figures 38a to 38d This is a flowchart illustrating a method for manufacturing a heat sink for a thermoelectric device according to the fourth embodiment.

[0334] Reference Figure 38aThe radiator 3000A will now be described based on its non-bending structure prior to manufacturing the aforementioned radiator 3000. Furthermore, radiators whose shape changes according to each process will be described as 300A, 300B, 300C, 300D, etc. The radiator 3000A can be positioned on a first mold MD1 having a predetermined recess R1. Additionally, the radiator 3000A can be pressed by a punch J1 corresponding to the recess R1 of the first mold MD1. This process can be performed repeatedly or simultaneously over the entire area of ​​the radiator 3000A.

[0335] Reference Figure 38b The radiator 3000B can be pressed to have a shape corresponding to the shape of the recess R1 of the first mold MD1. In other words, the radiator 3000B can be bent to have a non-flat structure. This can correspond to the lower member, extension member, upper member, and extension member described in various embodiments.

[0336] Reference Figure 38c The second mold MD2 can be inserted into the recess of the heat sink 3000C. The second mold MD2 may have a predetermined recess. The width ML2 of the recess in the second mold MD2 may be smaller than the width ML1 of the first recess R1 in the first mold MD1 described above.

[0337] Additionally, one surface of the recess of the radiator 3000C can be bent into the second mold MD2 by pressing the second punch J2. As described above, this pressing can be performed repeatedly or simultaneously over the entire area of ​​the radiator 3000C. Furthermore, it can be performed in conjunction with a reference... Figure 38a The pressing is performed in the opposite direction to the pressing described. Alternatively, pressing can be performed at the position corresponding to the lower component mentioned above.

[0338] Reference Figure 38d The radiator 3000D may have the same shape as the radiator described in the fourth embodiment. Additionally, in the radiator 3000D, the lower member may have a groove GA protruding from the lower member toward the upper member.

[0339] The thermoelectric element according to embodiments of the present invention can be applied to power generation devices, cooling devices, heating devices, etc.

[0340] In other words, the above-described content can be applied in the same way to power generation devices, cooling devices, and heating devices that include thermoelectric elements according to this embodiment, such as vehicles or various electrical devices. For example, the power generation system can generate electricity from heat sources such as ships, vehicles, power plants, and geothermal energy. Furthermore, in the power generation system, multiple power generation devices can be arranged to efficiently converge the heat source. Therefore, the heat source can be evenly injected into multiple power generation devices through multiple branching units to ensure uniform heat applied to the radiator, thereby preventing radiator bending and improving the reliability of the power generation module (e.g., thermoelectric device). Additionally, power generation efficiency can be improved by controlling the horizontal distance between the branching unit and the guide plate, thereby improving the fuel efficiency of transportation equipment such as ships or vehicles. Therefore, costs such as transportation or maintenance costs can be reduced, creating an environmentally friendly industrial environment in the shipping and transportation industries, and reducing maintenance costs when applied to manufacturing industries such as steel mills.

[0341] Although the above description has been made with reference to exemplary embodiments of the invention, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. A thermoelectric device, comprising: A thermoelectric element includes: a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; A heat sink, comprising a plurality of fins spaced apart from each other on the second substrate; and A connecting member is disposed between the thermoelectric element and the heat sink. The second substrate includes a first region that overlaps with the second electrode in the vertical direction and a second region that does not overlap with the second electrode in the vertical direction. The spacing between adjacent fins in the plurality of fins differs in the first region and the second region. The heat sink includes a groove on the surface that contacts the thermoelectric element, and the connecting member is disposed in the groove. Wherein, the first length of the second electrode in the first direction is less than the second length of the second electrode in the second direction perpendicular to the first direction. The vertical direction is from the first substrate toward the second substrate. The first direction and the second direction are perpendicular to each other, and are directions perpendicular to the vertical direction. The first region and the second region are alternately arranged in the first direction and the second direction.

2. The thermoelectric device according to claim 1, wherein, The separation distance in the second region is greater than the separation distance in the first region.

3. The thermoelectric device according to claim 1, wherein, The second substrate includes a lower surface and an upper surface facing the lower surface, and The second electrode is disposed on the lower surface, and the upper surface is in contact with the plurality of fins.

4. The thermoelectric device according to claim 3, wherein, The radiator includes connecting members configured to connect the plurality of fins.

5. The thermoelectric device according to claim 4, wherein, The connecting component includes: The first connecting member in contact with the upper surface; and A second connecting member facing the first connecting member.

6. The thermoelectric device according to claim 5, wherein, The plurality of fins have one end connected to the first connecting member and the other end connected to the second connecting member.

7. The thermoelectric device according to claim 5, wherein, The length of the second connecting member in the second region is greater than its length in the first region.

8. The thermoelectric device according to claim 5, wherein, The second region overlaps with the second connecting member in the vertical direction.

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