Electroplating fixture and electroplating apparatus

Abstract

The application relates to the technical field of electroplating equipment, in particular to an electroplating clamp and electroplating equipment. The electroplating clamp comprises a conductive contact mechanism, a bearing mechanism, a lifting clamping mechanism, a supporting mechanism and a rotary driving mechanism; the conductive contact mechanism is connected to the top of the bearing mechanism; the lifting clamping mechanism comprises a lifting driving member, a first fixed connecting seat, a first movable connecting seat, a synchronous transmission rod and a clamping disc; the lifting driving member is arranged on the supporting mechanism, and the lifting driving member can drive the first fixed connecting seat to drive the clamping disc to approach or move away from the conductive contact mechanism; the rotary driving mechanism is arranged on the supporting mechanism, and the rotary driving mechanism is connected with the bearing mechanism and can drive the bearing mechanism to drive the synchronous transmission rod, the clamping disc, the conductive contact mechanism and the first movable connecting seat to rotate synchronously. The electroplating clamp realizes breakthroughs of integrating rotation, clamping and uniform conduction, and effectively improves the uniformity of plating layer thickness and product yield of wafer electroplating.

Description

Technical Field

[0001] This application relates to the field of electroplating equipment technology, and in particular to an electroplating fixture and electroplating equipment. Background Technology

[0002] Wafer electroplating is one of the key steps in the semiconductor chip manufacturing process. The process involves placing the wafer in an electroplating solution, connecting a negative voltage to the wafer as a cathode, and connecting a positive voltage to a soluble or insoluble anode. The metal ions in the electroplating solution are deposited onto the wafer surface through the action of an electric field.

[0003] With the continuous improvement of automation in semiconductor wafer manufacturing equipment, the automation level of wafer electroplating equipment has become an important indicator of whether it meets production needs. Currently, most wafer electroplating equipment on the market uses manually clamped conductive fixtures, which suffer from low automation, low production efficiency, and poor stability, failing to meet the equipment's requirements. Summary of the Invention

[0004] The purpose of this application is to provide an electroplating fixture and electroplating equipment, so as to solve to some extent the technical problems of low automation, low production efficiency and poor stability of the existing manual clamping conductive electroplating fixtures.

[0005] This application provides an electroplating fixture, including a conductive contact mechanism, a load-bearing mechanism, a lifting clamping mechanism, a support mechanism, and a rotation drive mechanism;

[0006] The supporting mechanism is used to support and position the workpiece to be electroplated, and the conductive contact mechanism is connected to the top of the supporting mechanism;

[0007] The lifting and clamping mechanism includes a lifting drive component, a first fixed connecting seat, a first movable connecting seat, a synchronous transmission rod, and a clamping plate;

[0008] The lifting drive component is disposed on the support mechanism. The first fixed connecting seat is connected to the lifting drive component. The first movable connecting seat is rotatably connected to the first fixed connecting seat. One end of the synchronous transmission rod is connected to the first movable connecting seat. The other end of the synchronous transmission rod passes through the bearing mechanism and is connected to the clamping plate. The lifting drive component can drive the first fixed connecting seat to move the clamping plate closer to or away from the conductive contact mechanism.

[0009] The rotation drive mechanism is disposed on the support mechanism, and the rotation drive mechanism is connected to the bearing mechanism and can drive the bearing mechanism to drive the synchronous transmission rod, the clamping plate, the conductive contact mechanism and the first movable connecting seat to rotate synchronously.

[0010] In the above technical solution, the electroplating fixture further includes a conductive slip ring mechanism, which includes a slip ring stator disposed on the support mechanism and a slip ring rotor rotatably sleeved with the slip ring stator.

[0011] The slip ring rotor is connected to the rotation drive mechanism, which can drive the slip ring rotor to rotate synchronously with the bearing mechanism.

[0012] The slip ring rotor is electrically connected to the conductive contact mechanism, and the slip ring stator is electrically connected to an external power source.

[0013] In any of the above technical solutions, the support mechanism further includes a mounting base and a connecting arm, one end of the connecting arm is connected to the mounting base, and the other end of the connecting arm is used to connect to the machine base;

[0014] The rotation drive mechanism includes a rotating shaft and a drive assembly. The mounting base has a shaft hole, and the rotating shaft is rotatably inserted into the shaft hole. The drive assembly is located at the bottom of the mounting base and can drive the bottom end of the rotating shaft to rotate.

[0015] In any of the above technical solutions, the slip ring stator is further disposed on the top of the mounting base, the slip ring rotor is rotatably disposed inside the slip ring stator, the slip ring rotor is provided with a second shaft hole, and the rotating shaft is disposed in the second shaft hole and connected to the slip ring rotor;

[0016] Both the first fixed connecting seat and the first movable connecting seat are provided with clearance through holes, and the clearance through holes contain the conductive slip ring mechanism.

[0017] In any of the above technical solutions, the supporting mechanism further includes a supporting disk;

[0018] The bearing plate is spaced apart on the top of the first movable connecting seat, and the top end of the rotating shaft is connected to the bottom end of the bearing plate;

[0019] The top of the bearing plate has a positioning groove on its inner peripheral sidewall, which is adapted to the outer peripheral sidewall of the workpiece to be electroplated.

[0020] The bearing plate has a guide cavity inside, and the clamping plate is movably disposed in the guide cavity. The bottom end of the synchronous transmission rod is connected to the first movable connecting seat, and the top end of the synchronous transmission rod passes through the bearing plate and is connected to the clamping plate.

[0021] In any of the above technical solutions, the supporting mechanism further includes multiple positioning blocks;

[0022] Multiple positioning blocks are disposed at the top of the bearing disk and arranged at intervals along the circumference of the bearing disk;

[0023] The positioning block protrudes from the outer peripheral sidewall of the bearing disk, and a positioning hole is provided on the positioning block;

[0024] The conductive contact mechanism includes a conductive disk and multiple connecting posts, with each of the multiple connecting posts being inserted into a corresponding positioning hole in one of the multiple positioning blocks. The conductive disk is located on the top side of the carrier disk.

[0025] In any of the above technical solutions, the conductive disk further includes an annular conductive substrate and a plurality of conductive spring pins, wherein the plurality of conductive spring pins are connected to the annular conductive substrate and are arranged sequentially at intervals along the circumference of the annular conductive substrate.

[0026] The conductive slip ring mechanism further includes a first connecting line and a second connecting line;

[0027] The first connecting line is electrically connected to the slip ring stator and is used to connect to the cathode of an external power supply;

[0028] One end of the second connecting line is electrically connected to the slip ring rotor, and the other end of the second connecting line is electrically connected to the connecting post.

[0029] In any of the above technical solutions, the supporting mechanism further includes a plurality of limiting parts disposed at the top of the supporting plate, and the plurality of limiting parts are arranged sequentially at intervals along the circumference of the supporting plate;

[0030] The inner peripheral sidewall of the limiting part is formed with an arc-shaped recess, which is adapted to a portion of the outer peripheral sidewall of the workpiece to be electroplated, so that multiple arc-shaped recesses form the positioning groove.

[0031] In any of the above technical solutions, a boss is further provided on the circumferential edge of the top of the clamping disc, and the boss extends circumferentially around the clamping disc.

[0032] This application also provides an electroplating apparatus, including the electroplating fixture described in any of the above technical solutions.

[0033] Compared with the prior art, the beneficial effects of this application are as follows:

[0034] The electroplating fixture provided in this application includes a conductive contact mechanism, a bearing mechanism, a lifting and clamping mechanism, a support mechanism, and a rotation drive mechanism. The bearing mechanism carries the workpiece to be electroplated. The lifting and clamping mechanism's lifting drive component drives the clamping disc via its synchronous transmission rod to lift the workpiece and press it against the conductive contact mechanism, thus forming a conductive contact between the workpiece and the conductive contact mechanism. The conductive contact mechanism is used to connect to an external power source, thereby establishing an electrical connection between the workpiece and the external power source.

[0035] The rotation drive mechanism drives the carrier mechanism to rotate, thereby enabling the carrier mechanism to drive the clamping plate, the workpiece to be electroplated, and the conductive contact mechanism to rotate synchronously. When the workpiece to be electroplated is put into the electroplating solution, rotating the workpiece can improve the uniformity of its coating and the product yield.

[0036] In addition, the first fixed connecting seat and the first movable connecting seat are connected between the synchronous transmission rod and the lifting drive component, so that the rotation drive of the rotation drive mechanism and the lifting drive of the lifting drive component are decoupled, ensuring that the two do not affect each other.

[0037] In summary, this electroplating fixture achieves a breakthrough by integrating rotation, clamping, and uniform conductivity. Specifically, it ensures reliable clamping of the workpiece to be electroplated while maintaining good conductive contact during the rotation of the workpiece, thus guaranteeing production efficiency and stability and effectively improving the uniformity of coating thickness and product yield in wafer electroplating.

[0038] The electroplating equipment provided in this application includes the electroplating fixture described above, and thus can achieve all the beneficial effects of the electroplating fixture. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the electroplating fixture provided in Embodiment 1 of this application;

[0041] Figure 2 An exploded view of the electroplating fixture provided in Embodiment 1 of this application;

[0042] Figure 3 This is a schematic diagram of the first state of the electroplating fixture provided in Embodiment 1 of this application;

[0043] Figure 4 for Figure 3Sectional view at section AA;

[0044] Figure 5 for Figure 4 A magnified view of the area at point B;

[0045] Figure 6 This is a schematic diagram of the second state of the electroplating fixture provided in Embodiment 1 of this application;

[0046] Figure 7 for Figure 6 Sectional view at section CC;

[0047] Figure 8 This is a schematic diagram of the lifting and clamping mechanism of the electroplating fixture provided in Embodiment 1 of this application;

[0048] Figure 9 This is a schematic diagram of the clamping disc of the lifting and clamping mechanism of the electroplating fixture provided in Embodiment 1 of this application;

[0049] Figure 10 for Figure 9 Sectional view at section DD;

[0050] Figure 11 exist Figure 10 A magnified view of the area at point E;

[0051] Figure 12 This is a schematic diagram of the supporting mechanism of the electroplating fixture provided in Embodiment 1 of this application;

[0052] Figure 13 This is a schematic diagram of the conductive disk of the conductive contact mechanism of the electroplating fixture provided in Embodiment 1 of this application.

[0053] Figure label:

[0054] 1-Electroplating fixture; 10-Support mechanism; 100-Connecting arm; 101-Mounting base; 11-Rotation drive mechanism; 110-Drive assembly; 111-Rotating shaft; 12-Lifting clamping mechanism; 120-Lifting drive component; 121-First fixed connecting seat; 122-Second fixed connecting seat; 123-Cross ball bearing; 124-First movable connecting seat; 125-Synchronous transmission rod; 126-Clamping plate; 1260-Boss; 13-Bearing mechanism; 130 - Carrying plate; 131- Positioning block; 1310- Positioning socket; 132- Limiting part; 1320- Arc-shaped recess; 133- Connecting flange; 14- Conductive contact mechanism; 140- Placement plate; 141- Annular conductive substrate; 142- Conductive spring pin; 143- Sealing component; 144- Connecting column; 15- Conductive slip ring mechanism; 150- Slip ring rotor; 151- Slip ring stator; 152- First connecting line; 153- Second connecting line; 2- Workpiece to be electroplated. Detailed Implementation

[0055] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0057] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0058] Example 1

[0059] See Figures 1 to 13 As shown, an embodiment of this application provides an electroplating fixture 1 for an electroplating equipment, which can clamp, position, and conduct electricity to a workpiece 2 to be electroplated, such as a wafer.

[0060] like Figure 1 and Figure 2 As shown, the electroplating fixture 1 provided in this embodiment includes a conductive contact mechanism 14, a bearing mechanism 13, a lifting clamping mechanism 12, a support mechanism 10, a rotation drive mechanism 11, and a conductive slip ring mechanism 15.

[0061] The above-mentioned components of the electroplating fixture 1 will be described in detail below.

[0062] In an optional embodiment, the support mechanism 13 is used to support and position the workpiece 2 to be electroplated. The support mechanism 13 includes a support plate 130, which supports and positions the workpiece 2 to be electroplated.

[0063] Specifically, a positioning groove is provided on the inner peripheral sidewall of the top of the bearing plate 130. The positioning groove is adapted to the outer peripheral sidewall of the workpiece 2 to be electroplated, so as to support and position the workpiece 2 to be electroplated.

[0064] In this embodiment, in order to reduce the possibility of spatial interference between the carrier plate 130 and the outer peripheral sidewall of the workpiece 2 to be electroplated, the carrier mechanism 13 also includes a plurality of limiting parts 132 disposed at the top of the carrier plate 130. For example, the number of limiting parts 132 is two, three, four or more, and the plurality of limiting parts 132 are evenly spaced along the circumference of the carrier plate 130.

[0065] The inner peripheral sidewall of the limiting part 132 is provided with an arc-shaped recess 1320. The arc-shaped recess 1320 is adapted to the partial outer peripheral sidewall of the workpiece 2 to be electroplated, so that the multiple arc-shaped recesses 1320 form a positioning groove. That is, the part of the workpiece 2 to be electroplated is limited inside the arc-shaped recess 1320, thereby forming a multi-point bearing positioning of the workpiece 2 to be electroplated through the arc-shaped recesses 1320 of the multiple limiting parts 132.

[0066] In the optional solutions of this embodiment, such as Figure 8 As shown, the lifting and clamping mechanism 12 includes a lifting drive component 120, a first fixed connecting seat 121, a first movable connecting seat 124, a synchronous transmission rod 125, and a clamping plate 126.

[0067] The lifting drive component 120 is disposed on the support mechanism 10. The first fixed connecting seat 121 is connected to the lifting drive component 120. The first fixed connecting seat 121 is, for example, a first fixed flange. The lifting drive component 120 is, for example, a cylinder or a linear drive module. There can be multiple lifting drive components 120. Multiple lifting drive components 120 are arranged at intervals along the circumference of the first fixed connecting seat 121 and are all disposed on the support mechanism 10.

[0068] The first movable connecting seat 124 is rotatably connected to the first fixed connecting seat 121. Specifically, the first movable connecting seat 124 and the first fixed connecting seat 121 are connected by a rotating structure. Optionally, the lifting clamping mechanism 12 also includes a second fixed connecting seat 122 and a cross ball bearing 123. The second fixed connecting seat 122 is disposed on the top of the first fixed connecting seat 121. The inner ring of the cross ball bearing 123 is connected to the outer peripheral side wall of the second fixed connecting seat 122, and the outer ring of the cross ball bearing 123 is connected to the inner peripheral side wall of the first movable connecting seat 124. This allows the first movable connecting seat 124 and the outer ring of the cross ball bearing 123 to rotate relative to the inner ring of the cross ball bearing 123 and the second fixed connecting seat 122, thereby enabling the first movable connecting seat 124 to rotate relative to the first fixed connecting seat 121.

[0069] One end of the synchronous transmission rod 125 is connected to the first movable connecting seat 124, and the other end of the synchronous transmission rod 125 passes through the bearing mechanism 13 and the clamping plate 126 in sequence. The lifting drive component 120 can drive the first fixed connecting seat 121 to move the synchronous transmission rod 125 and the clamping plate 126 closer to or away from the conductive contact mechanism 14. In other words, the lifting drive component 120 can drive the first fixed connecting seat 121, the first movable connecting seat 124, the synchronous transmission rod 125 and the clamping plate 126 to move up and down synchronously, so that the clamping plate 126 can press the workpiece 2 to be electroplated in the bearing plate 130 toward the conductive contact mechanism 14 during the upward process, that is, during the process of approaching the conductive contact mechanism 14, thereby clamping the workpiece 2 to be electroplated between the clamping plate 126 and the conductive contact mechanism 14, so as to realize the current conduction between the workpiece 2 to be electroplated and the conductive contact mechanism 14, so that the two form an electrical connection.

[0070] The rotation drive mechanism 11 is disposed on the support mechanism 10, and the rotation drive mechanism 11 is connected to the bearing mechanism 13 and can drive the bearing mechanism 13 to drive the synchronous transmission rod 125, clamping plate 126, first movable connecting seat 124 and conductive contact mechanism 14 to rotate synchronously.

[0071] Specifically, since the synchronous transmission rod 125 connects the bearing mechanism 13 to the first movable connecting seat 124, the bearing mechanism 13 can rotate synchronously with the first movable connecting seat 124. Furthermore, when the conductive contact mechanism 14 is connected to the bearing mechanism 13, the conductive contact mechanism 14 and the workpiece 2 to be electroplated, clamped between the conductive contact mechanism 14 and the clamping plate 126, will also rotate synchronously with the bearing mechanism 13. Thus, during the electroplating process, the workpiece 2 to be electroplated can be driven to rotate in the electroplating solution by the rotation drive mechanism 11, improving the electroplating uniformity of the workpiece 2.

[0072] In this embodiment, the support mechanism 10 is used to support and fix other components of the electroplating fixture 1. The support mechanism 10 includes a mounting base 101 and a connecting arm 100. One end of the connecting arm 100 is connected to the mounting base 101, and the other end of the connecting arm 100 is used to connect to the machine tool. The structure of the machine tool and the connection method between the machine tool and the connecting arm 100 can be adjusted according to the actual use scenario and are not limited. For example, the machine tool can be an external drive device.

[0073] Optionally, the mounting base 101 is disc-shaped, and both the top and the top edge of the mounting base 101 can be used to mount other components.

[0074] In this embodiment, the rotation drive mechanism 11 includes a rotating shaft 111 and a drive assembly 110. The mounting base 101 has a shaft hole, and the rotating shaft 111 is rotatably inserted into the shaft hole. The drive assembly 110 is disposed at the bottom of the mounting base 101 and can drive the bottom end of the rotating shaft 111 to rotate. The top end of the rotating shaft 111 is connected to the bearing mechanism 13, so that when the drive assembly 110 drives the rotating shaft 111 to rotate, the rotating shaft 111 can drive the bearing mechanism 13 to rotate.

[0075] Optionally, the drive assembly 110 includes a motor, a drive gear, and a driven gear. The drive gear is connected to the output shaft of the motor, and the driven gear is connected to the rotating shaft 111. The drive gear and the driven gear mesh, so that the power output from the output shaft of the motor can be transmitted to the rotating shaft 111 through the drive gear and the driven gear, causing the rotating shaft 111 to rotate.

[0076] In an optional embodiment, the conductive slip ring mechanism 15 is used to electrically connect the conductive contact mechanism 14 to an external power source. The conductive slip ring mechanism 15 includes a slip ring stator 151 disposed on the support mechanism 10 and a slip ring rotor 150 rotatably sleeved with the slip ring stator 151. In other words, the slip ring stator 151 is rotatably sleeved outside the slip ring rotor 150, or the slip ring rotor 150 is rotatably sleeved outside the slip ring stator 151.

[0077] The slip ring rotor 150 is connected to the rotation drive mechanism 11, which can drive the slip ring rotor 150 to rotate synchronously with the bearing mechanism 13. The slip ring rotor 150 is electrically connected to the conductive contact mechanism 14, and the slip ring stator 151 is electrically connected to the external power supply. Both the slip ring rotor 150 and the slip ring stator 151 are made of conductive material, and they always form full contact along the circumference during relative rotation. Therefore, they are in a contact and conductive state, so the current from the external power supply is sequentially conducted to the conductive contact mechanism 14 through the slip ring stator 151 and the slip ring rotor 150.

[0078] When the conductive contact mechanism 14 rotates with the bearing mechanism 13, since the slip ring rotor 150 rotates synchronously with the bearing mechanism 13, it can ensure that the conductive contact mechanism 14 and the workpiece 2 to be electroplated can still establish a reliable electrical connection with the external power source even during rotation.

[0079] In this embodiment, the slip ring stator 151 is disposed on the top of the mounting base 101, and the slip ring rotor 150 is rotatably inserted inside the slip ring stator 151 so that the slip ring rotor 150 and the slip ring stator 151 are rotatably sleeved.

[0080] The slip ring rotor 150 has a second shaft hole, and the rotating shaft 111 passes through the second shaft hole and is connected to the slip ring rotor 150. Thus, the slip ring rotor 150 can rotate synchronously with the rotating shaft 111, and the slip ring rotor 150 can rotate synchronously with the bearing mechanism 13, the conductive contact mechanism 14 and the workpiece 2 to be electroplated, without affecting the fixed connection of the slip ring stator 151 relative to the mounting base 101.

[0081] In order to reduce the overall height of the electroplating fixture 1 and improve the space utilization of the electroplating fixture 1 along the height direction, both the first fixed connecting seat 121 and the first movable connecting seat 124 are provided with clearance through holes. The clearance through holes accommodate the conductive slip ring mechanism 15, so that the conductive slip ring mechanism 15, the first fixed connecting seat 121 and the first movable connecting seat 124 share the height space.

[0082] In this embodiment, in order to facilitate the electrical connection of the conductive slip ring mechanism 15 to the external power supply and the conductive contact mechanism 14 respectively, the conductive slip ring mechanism 15 further includes a first connecting line 152 and a second connecting line 153.

[0083] The first connecting wire 152 is electrically connected to the slip ring stator 151 and is used to connect to the external power supply cathode. One end of the second connecting wire 153 is electrically connected to the slip ring rotor 150, and the other end of the second connecting wire 153 is electrically connected to the conductive contact mechanism 14. Since the conductive contact component, the second connecting wire 153 and the slip ring rotor 150 can rotate synchronously, the second connecting wire 153 will not become entangled. Furthermore, since the mounting base 101, the first connecting wire 152 and the slip ring stator 151 are all fixedly installed, the first connecting wire 152 will not be affected by the rotation of the slip ring rotor 150, and thus will not become entangled.

[0084] In an optional embodiment, the carrier disk 130 is spaced apart on the top of the first movable connecting seat 124, and the top of the rotating shaft 111 is connected to the bottom of the carrier disk 130. Specifically, the bottom of the carrier disk 130 is provided with a connecting flange 133, and the top of the rotating shaft 111 is connected to the connecting flange 133, so that when the driving assembly 110 drives the rotating shaft 111 to rotate, the carrier disk 130 can rotate synchronously.

[0085] In this embodiment, a guide cavity is formed inside the bearing plate 130, and the clamping plate 126 is vertically and vertically disposed in the guide cavity. Specifically, the guide cavity can be cylindrical, and the outer peripheral sidewall of the clamping plate 126 contacts the inner peripheral sidewall of the guide cavity. Thus, when the clamping plate 126 is driven by the lifting drive member 120, it can move along the height direction of the guide cavity, which plays a guiding and positioning role for the lifting of the clamping plate 126, avoids the clamping plate 126 from tilting, and improves the clamping reliability of the clamping plate 126 for the workpiece 2 to be electroplated.

[0086] The bottom end of the synchronous transmission rod 125 is connected to the first movable connecting seat 124, and the top end of the synchronous transmission rod 125 passes through the bearing plate 130 and is connected to the clamping plate 126. Thus, on the one hand, the lifting drive component 120 can drive the clamping plate 126 to move back and forth along the height direction of the bearing plate 130 through the synchronous transmission rod 125. On the other hand, since the synchronous transmission rod 125 passes through the bearing plate 130, the bearing plate 130 can drive the synchronous rotating rod to rotate synchronously. Thus, the synchronous transmission rod 125 sequentially drives the first movable connecting seat 124 to rotate synchronously. At the same time, the rotating shaft 111 drives the slip ring rotor 150 to rotate synchronously.

[0087] In this embodiment, as Figures 9 to 11 As shown, a boss 1260 is provided on the circumferential edge of the top of the clamping plate 126. The boss 1260 extends circumferentially around the clamping plate 126, so that when the clamping plate 126 presses against the workpiece 2 to be electroplated, the clamping plate 126 can contact the workpiece 2 to be electroplated through the boss 1260, forming only annular line contact, thereby reducing the area occupied by the clamping plate 126 on the workpiece 2 to be electroplated and improving the effective utilization rate of the workpiece 2 to be electroplated.

[0088] In this embodiment, as Figure 12 and Figure 13 As shown, in order to achieve the positioning connection between the conductive contact mechanism 14 and the support mechanism 13, the support mechanism 13 also includes a plurality of positioning blocks 131.

[0089] Multiple positioning blocks 131 are disposed on the top of the carrier disk 130 and arranged at intervals along the circumference of the carrier disk 130. For example, the number of positioning blocks 131 is two, three, four or more.

[0090] The positioning block 131 protrudes from the outer peripheral sidewall of the carrier plate 130, and the positioning block 131 is provided with a positioning insertion hole 1310. The conductive contact mechanism 14 includes a conductive plate and a plurality of connecting posts 144. The plurality of connecting posts 144 are inserted into the positioning insertion holes 1310 of the plurality of positioning blocks 131 in a corresponding manner. The conductive plate is located on the top side of the carrier plate 130, so that the conductive plate is fixed by the positioning insertion holes 1310 of the positioning block 131 and the connecting posts 144, so that the conductive plate can rotate synchronously with the carrier plate 130. In addition, the clamping plate 126 can press the workpiece 2 to be electroplated, which is positioned and carried in the carrier plate 130, onto the conductive plate, so that the conductive plate can conduct current to the surface of the workpiece 2 to be electroplated.

[0091] In this embodiment, the conductive disk includes an annular conductive substrate 141 and a plurality of conductive spring pins 142. The plurality of conductive spring pins 142 are connected to the annular conductive substrate 141 and are arranged sequentially at intervals along the circumference of the annular conductive substrate 141. The conductive spring pins 142 are made of a conductor with a certain elasticity, which ensures reliable conductive contact between the conductive spring pins 142 and the surface of the workpiece 2 to be electroplated, and avoids scratching the surface of the workpiece 2 due to excessive rigidity of the conductive spring pins 142.

[0092] Optionally, the number of conductive spring pins 142 can be several, dozens, hundreds or even hundreds. All conductive spring pins 142 can be evenly spaced along the circumference of the annular conductive substrate 141. Multiple conductive spring pins 142 form multiple conductive contacts with the workpiece 2 to be electroplated, which effectively improves the uniformity of conductivity and is beneficial to improving the uniformity of the plating thickness and the product yield.

[0093] Optionally, such as Figure 5 As shown, the conductive contact mechanism 14 also includes an insulating placement tray 140 and a sealing member 143. The sealing member 143 is annular, and the conductive tray is disposed on the placement tray 140, which supports, fixes, and protects the conductive tray. The sealing member 143 is connected to the conductive tray or the placement tray 140 and is located inside the conductive spring pin 142, thereby isolating the conductive tray from the electroplating solution through the annular sealing member 143.

[0094] Specifically, the second connecting line 153 is electrically connected between the connecting post 144 and the slip ring rotor 150, so that the current of the slip ring rotor 150 is sequentially conducted to the surface of the workpiece 2 to be electroplated through the second connecting line 153, the connecting post 144, the conductive substrate, and the conductive spring pin 142.

[0095] Optionally, the mounting base 101, the bearing plate 130 of the bearing mechanism 13, the positioning block 131, the limiting part 132, the clamping plate 126, and the rotating shaft 111 are all made of insulating material, thereby ensuring that the current conduction path is sequentially the slip ring stator 151, the sliding rotor, the connecting column 144, the annular conductive substrate 141, the conductive needle, and the workpiece 2 to be electroplated.

[0096] In summary, during actual operation, the electroplating fixture 1 clamps the workpiece 2 to be electroplated according to the following steps:

[0097] The lifting drive component 120 is, for example, a cylinder. Figure 3 and Figure 4 As shown, the cylinder rod retracts to the lowest position, thereby driving the clamping plate 126 to descend to the lowest position, avoiding the positioning groove formed by the arc-shaped recess 1320 of the bearing plate 130. The robot arm clamps the workpiece 2 to be electroplated and places it in the positioning groove formed by the arc-shaped recess 1320 of the bearing plate 130.

[0098] like Figure 6 and Figure 7 As shown, the cylinder rod then extends, thereby driving the clamping plate 126 to rise until the boss 1260 of the clamping plate 126 contacts the workpiece 2 to be electroplated and lifts the workpiece 2, so that the workpiece 2 to be electroplated contacts the conductive spring pin 142 of the conductive contact mechanism 14 and contacts the sealing member 143 of the conductive contact mechanism 14, realizing the electrical connection between the workpiece 2 to be electroplated and the power cathode, and achieving conductive sealing through the sealing member 143, preventing the electroplating solution from directly contacting the conductive spring pin 142.

[0099] The drive assembly 110 is activated to drive the rotating shaft 111 to rotate. The rotating shaft 111 drives the bearing plate 130, clamping plate 126, conductive contact mechanism 14 and workpiece 2 to be electroplated to rotate. Then, the electroplating fixture 1 is rotated as a whole through an external device connected to the connecting arm 100 until the workpiece 2 to be electroplated enters the electroplating solution. Then, the electroplating power supply can be started to begin the electroplating operation on the workpiece 2.

[0100] After the electroplating process is completed, the electroplating power supply is disconnected, and the electroplating fixture 1 is driven to flip again by an external device until the workpiece 2 to be electroplated is removed from the electroplating solution. The cylinder rod of the control cylinder is retracted to the lowest position, and the clamping plate 126 is driven to place the workpiece 2 to be electroplated on it back into the positioning groove formed by the arc-shaped recess 1320 of the bearing plate 130, thus obtaining the electroplated workpiece.

[0101] Finally, the electroplated workpiece is removed from the carrier plate 130 by a robotic arm, and the workpiece can then be processed for the next step.

[0102] Example 2

[0103] Example 2 provides an electroplating device, which includes the electroplating fixture in Example 1. The technical features of the electroplating fixture disclosed in Example 1 are also applicable to this example. The technical features of the electroplating fixture disclosed in Example 1 will not be described again.

[0104] The electroplating equipment in this embodiment has the advantages of the electroplating fixture in Embodiment 1, and the advantages of the electroplating fixture disclosed in Embodiment 1 will not be repeated here.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention. In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features of different embodiments are meant to be within the scope of the present invention and form different embodiments. For example, any one of the claimed embodiments can be used in any combination. The information disclosed in this background section is only intended to enhance the understanding of the overall background technology of the present invention, and should not be regarded as an admission or in any form implying that such information constitutes prior art known to those skilled in the art.

Claims

1. An electroplating fixture, characterized in that, It includes a conductive contact mechanism, a load-bearing mechanism, a lifting and clamping mechanism, a support mechanism, and a rotation drive mechanism; The supporting mechanism is used to support and position the workpiece to be electroplated, and the conductive contact mechanism is connected to the top of the supporting mechanism; The lifting and clamping mechanism includes a lifting drive component, a first fixed connecting seat, a first movable connecting seat, a synchronous transmission rod, and a clamping plate; The lifting drive component is disposed on the support mechanism. The first fixed connecting seat is connected to the lifting drive component. The first movable connecting seat is rotatably connected to the first fixed connecting seat. One end of the synchronous transmission rod is connected to the first movable connecting seat. The other end of the synchronous transmission rod passes through the bearing mechanism and is connected to the clamping plate. The lifting drive component can drive the first fixed connecting seat to move the clamping plate closer to or away from the conductive contact mechanism. The rotation drive mechanism is disposed on the support mechanism, and the rotation drive mechanism is connected to the bearing mechanism and can drive the bearing mechanism to drive the synchronous transmission rod, the clamping plate, the conductive contact mechanism and the first movable connecting seat to rotate synchronously; It also includes a conductive slip ring mechanism, which includes a slip ring stator disposed on the support mechanism and a slip ring rotor rotatably sleeved with the slip ring stator; The slip ring rotor is connected to the rotation drive mechanism, and the rotation drive mechanism can drive the slip ring rotor to rotate synchronously with the bearing mechanism; The slip ring rotor is electrically connected to the conductive contact mechanism, and the slip ring stator is electrically connected to an external power source. The support mechanism includes a mounting base and a connecting arm. One end of the connecting arm is connected to the mounting base, and the other end of the connecting arm is used to connect to the machine base. The rotation drive mechanism includes a rotating shaft and a drive assembly. The mounting base has a shaft hole, and the rotating shaft is rotatably inserted into the shaft hole. The drive assembly is located at the bottom of the mounting base and can drive the bottom end of the rotating shaft to rotate. The slip ring stator is disposed on the top of the mounting base, and the slip ring rotor is rotatably inserted inside the slip ring stator. The slip ring rotor has a second shaft hole, and the rotating shaft passes through the second shaft hole and is connected to the slip ring rotor. Both the first fixed connecting seat and the first movable connecting seat are provided with clearance through holes, and the clearance through holes accommodate the conductive slip ring mechanism.

2. The electroplating fixture according to claim 1, characterized in that, The supporting mechanism includes a supporting disk; The bearing plate is spaced apart on the top of the first movable connecting seat, and the top of the rotating shaft is connected to the bottom of the bearing plate; The top of the bearing plate has a positioning groove on its inner peripheral sidewall, which is adapted to the outer peripheral sidewall of the workpiece to be electroplated. The bearing plate has a guide cavity inside, and the clamping plate is movably disposed in the guide cavity. The bottom end of the synchronous transmission rod is connected to the first movable connecting seat, and the top end of the synchronous transmission rod passes through the bearing plate and is connected to the clamping plate.

3. The electroplating fixture according to claim 2, characterized in that, The supporting mechanism also includes multiple positioning blocks; Multiple positioning blocks are disposed at the top of the bearing disk and arranged at intervals along the circumference of the bearing disk; The positioning block protrudes from the outer peripheral sidewall of the bearing plate, and a positioning hole is provided on the positioning block; The conductive contact mechanism includes a conductive disk and multiple connecting posts, with each of the multiple connecting posts being inserted into a corresponding positioning hole in one of the multiple positioning blocks. The conductive disk is located on the top side of the carrier disk.

4. The electroplating fixture according to claim 3, characterized in that, The conductive disk includes an annular conductive substrate and multiple conductive springs, the multiple conductive springs being connected to the annular conductive substrate and arranged sequentially at intervals along the circumference of the annular conductive substrate. The conductive slip ring mechanism further includes a first connecting line and a second connecting line; The first connecting line is electrically connected to the slip ring stator and is used to connect to the cathode of an external power supply; One end of the second connecting line is electrically connected to the slip ring rotor, and the other end of the second connecting line is electrically connected to the connecting post.

5. The electroplating fixture according to claim 2, characterized in that, The bearing mechanism also includes a plurality of limiting parts disposed at the top of the bearing plate, and the plurality of limiting parts are arranged sequentially at intervals along the circumference of the bearing plate; The inner peripheral sidewall of the limiting part is formed with an arc-shaped recess, which is adapted to a local outer peripheral sidewall of the workpiece to be electroplated, so that multiple arc-shaped recesses form the positioning groove.

6. The electroplating fixture according to claim 2, characterized in that, The clamping disc has a boss on its top circumferential edge, which extends circumferentially around the clamping disc.

7. An electroplating device, characterized in that, The electroplating fixture includes any one of claims 1 to 6.

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