An assembly device for adhesive members

Abstract

The application relates to the technical field of part assembly, in particular to an assembly device for viscous parts, which is applied to the assembly of viscous parts and parts to be adhered and comprises a part-to-be-adhered fixing assembly, a viscous part fixing assembly, a guide part and a cooling adjusting device; the part-to-be-adhered fixing assembly is provided with a part-to-be-adhered station, and the viscous part fixing assembly is provided with a viscous part station; the cooling end of the cooling adjusting device is arranged towards the viscous part station, the cooling adjusting device is used for cooling treatment of the viscous part, so that the viscous part reaches a first preset temperature; the viscous part fixing assembly can drive the viscous part to move towards the part-to-be-adhered fixing assembly, thereby making the part-to-be-adhered station and the viscous part station butt joint; the guide part is arranged adjacent to the butt joint channels of the part-to-be-adhered station and the viscous part station, and the movement track of the guide part partially coincides with that of the viscous part. The application can prevent the colloid of the viscous part from being damaged and improve the bonding and assembly effect.

Description

Technical Field

[0001] This application relates to the field of parts assembly technology, and more specifically to an assembly apparatus for adhesive parts. Background Technology

[0002] An interference fit relies on the interference amount between the mating parts after assembly to achieve a tight connection. After assembly, the elastic deformation of the materials creates pressure between the mating surfaces. This connection structure is simple and can withstand torque, axial force, or a combination of both, resulting in high reliability.

[0003] In existing technologies, interference-fit parts are typically assembled using hammering or press-fitting methods, which can easily damage the parts and are only suitable for assembling metal parts. For example, the assembly of an earphone head and stem usually involves one-piece injection molding, splicing two halves, or threaded connection. One-piece injection molding requires high standards for material uniformity and mold design. Threaded connections generally use clearance fits followed by sealing with sealant, or use sealing rings. However, the sealant and sealing ring connection methods are prone to damage during the transition process. Therefore, there is a need for a novel assembly device for adhesive parts to address the aforementioned problems in existing technologies. Summary of the Invention:

[0004] In view of the above-mentioned problems in the prior art, this application discloses an assembly device for adhesive parts, which can prevent damage to the adhesive of the adhesive parts and improve the bonding and assembly effect.

[0005] This application is achieved through the following technical solution:

[0006] This application provides an assembly apparatus for adhesive parts, applied to the assembly of adhesive parts and parts to be bonded, including: a part to be bonded fixing assembly, an adhesive part fixing assembly, a guide, and a cooling and regulating device;

[0007] The component to be bonded fixing assembly is provided with a component to be bonded station, and the adhesive component fixing assembly is provided with an adhesive component station;

[0008] The cooling end of the cooling regulating device is positioned toward the adhesive part station, and the cooling regulating device is used to cool the adhesive part so that the adhesive part reaches a first preset temperature.

[0009] The adhesive component fixing assembly can drive the adhesive component to move toward the component fixing assembly to be glued, thereby enabling the component to be glued station and the adhesive component station to dock.

[0010] The guide is arranged adjacent to the docking channel of the work station to be bonded and the work station to be bonded, and the movement trajectory of the guide and the work station to be bonded partially overlap.

[0011] Furthermore, the guide includes an extrusion surface;

[0012] The extrusion surface is disposed within the docking channel and is positioned within the movement trajectory of the adhesive component.

[0013] Furthermore, the extrusion surface includes a guide ramp, which is disposed on the side of the extrusion surface near the adhesive fixing assembly.

[0014] Furthermore, the adhesive component station includes a drive mechanism;

[0015] The driving mechanism is connected to the adhesive fixing assembly, and the driving mechanism can drive the adhesive fixing assembly to move toward the component fixing assembly to be glued.

[0016] Furthermore, the cooling regulating device includes a first air outlet duct and a first vortex tube;

[0017] The first air outlet duct includes a first air outlet end and a first connection end;

[0018] The first air outlet is positioned toward the adhesive component station, and the first connecting end is connected to the first vortex tube.

[0019] Furthermore, the cooling and regulating device includes a second air outlet duct and a second vortex tube;

[0020] The second air outlet duct includes a second air outlet end and a second connection end;

[0021] The second air outlet is positioned toward the work station to be bonded, and the second connecting end is connected to the second vortex tube.

[0022] Furthermore, it also includes a first temperature sensor and a first controller;

[0023] The adhesive part station has a first target temperature zone, which is set within the temperature sensing area of ​​the first temperature sensor. The first temperature sensor is used to collect the first temperature data of the target temperature zone.

[0024] The first controller is used to control the air intake flow rate of the first vortex tube based on the first temperature data.

[0025] Furthermore, it also includes a second temperature sensor;

[0026] The first air outlet has a second target temperature zone, which is located within the temperature sensing area of ​​the second temperature sensor. The second temperature sensor is used to collect the second temperature data of the second target temperature zone.

[0027] The first controller is also configured to control the orientation of the first air outlet based on the first temperature data and the second temperature data.

[0028] Furthermore, it also includes a third temperature sensor and a second controller;

[0029] The second air outlet has a third target temperature zone, which is located within the temperature sensing area of ​​the third temperature sensor. The third temperature sensor is used to collect the third temperature data of the second air outlet.

[0030] The second controller is used to control the air intake flow of the second vortex tube according to the third temperature data, so that the temperature of the workpiece to be bonded is different from the first preset temperature by a preset temperature threshold.

[0031] Furthermore, the first preset temperature is -30 to -20°C.

[0032] By adopting the above technical solution, the assembly apparatus for adhesive parts disclosed in this application has the following beneficial effects:

[0033] This application utilizes a guide component and a cooling adjustment device in conjunction. During the process where the adhesive component fixing assembly moves the adhesive component toward the component to be bonded fixing assembly, thereby aligning the component to be bonded station and the adhesive component station, the cooling adjustment device first cools the adhesive on the adhesive component to bring it to a first preset temperature. Then, the guide component compresses the adhesive on the adhesive component to ensure an interference fit between the adhesive component and the component to be bonded. The cooling process prevents damage to the adhesive during the interference fit process, thereby improving the bonding and assembly effect. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of an assembly apparatus for adhesive parts according to an embodiment of this application;

[0036] Figure 2 This is a side view of an assembly apparatus for adhesive parts according to an embodiment of this application;

[0037] Figure 3 This is a schematic diagram of the structure of an assembly apparatus for adhesive parts according to an embodiment of this application;

[0038] Figure 4This is a schematic diagram of the structure of an assembly apparatus for adhesive parts according to an embodiment of this application;

[0039] Figure 5 This is a schematic diagram of the structure of an assembly apparatus for adhesive parts according to an embodiment of this application;

[0040] Figure 6 This is a schematic diagram of the structure of an assembly apparatus for adhesive parts according to an embodiment of this application.

[0041] In the figure, the corresponding reference numerals are: 1-guide component; 2-cooling adjustment device; 3-fixing assembly for the part to be bonded; 4-fixing assembly for the adhesive part; 5-first temperature sensor; 6-second temperature sensor; 7-third temperature sensor; 11-extrusion surface; 12-guide slope; 21-first air outlet duct; 22-first vortex tube; 23-second air outlet duct; 24-second vortex tube; 31-supporting platform; 32-positioning component. Detailed Implementation

[0042] This application discloses an assembly apparatus for adhesive parts, which improves the stability of magnetic force testing and the installation stability of the parts to be tested, and is simple to operate.

[0043] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] It should be noted that in the description of this application, the terms "side," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the components referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. Furthermore, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data used can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0045] This application provides an assembly apparatus for adhesive parts; please refer to [reference needed]. Figure 1-6This device is used for assembling adhesive parts and parts to be bonded, and includes: a guide 1, a cooling adjustment device 2, a part to be bonded fixing assembly 3, and an adhesive part fixing assembly 4; the part to be bonded fixing assembly 3 has a part to be bonded station, and the adhesive part fixing assembly 4 has an adhesive part station; the cooling end of the cooling adjustment device 2 is set towards the adhesive part station, and the cooling adjustment device 2 is used to cool the adhesive part so that the adhesive part reaches a first preset temperature; the adhesive part fixing assembly 4 can drive the adhesive part to move towards the part to be bonded fixing assembly 3, thereby connecting the part to be bonded station and the adhesive part station; the guide 1 is adjacent to the docking channel of the part to be bonded station and the adhesive part station, and the movement trajectory of the guide 1 and the adhesive part partially overlaps.

[0046] This application utilizes a guide component and a cooling adjustment device in conjunction. During the process where the adhesive component fixing assembly moves the adhesive component toward the component to be bonded fixing assembly, thereby aligning the component to be bonded station and the adhesive component station, the cooling adjustment device first cools the adhesive on the adhesive component to bring it to a first preset temperature, temporarily causing it to lose its adhesiveness. Then, the guide component compresses the adhesive on the adhesive component to ensure an interference fit between the adhesive component and the component to be bonded. The cooling treatment prevents damage to the adhesive during the interference fit process, improving the bonding and assembly effect.

[0047] It should be noted that the adhesive component and the part to be bonded are in an interference fit. Specifically, the major diameter of the adhesive component is 0.28 mm larger than the inner diameter of the assembly of the part to be bonded. The adhesive component includes the adhesive material and the assembly that matches the part to be bonded. The adhesive material is used to bond the part to be bonded to the assembly. Specifically, the adhesive material can be a double-sided foam adhesive. In the prior art, double-sided foam adhesive tends to stick to the surface of the object during interference fit, causing damage to the double-sided foam adhesive.

[0048] In some embodiments, the first preset temperature indicates the temperature at which the viscous colloid in the adhesive component loses its viscousness; specifically, the first preset temperature is -30 to -20°C. It should be noted that the first preset temperature is set to match the adhesive component, and different adhesive components can be set with different first preset temperatures.

[0049] This application sets the temperature of the adhesive component to -30 to -20°C, causing it to temporarily lose its adhesiveness, thereby preventing damage to the adhesive during interference fit installation and improving the bonding and assembly effect.

[0050] In some embodiments, the adhesive part station includes a drive mechanism; the drive mechanism is connected to the adhesive part fixing assembly 4 in a transmission manner, and the drive mechanism is capable of driving the adhesive part fixing assembly 4 to move toward the part fixing assembly 3 to be bonded.

[0051] This application, by setting a driving mechanism, can automatically drive the adhesive part fixing component 4 toward the part to be glued fixing component 3, making the assembly more automated and saving manpower.

[0052] In some embodiments, the bonding station includes a support platform 31 and a positioning member 32; the support platform 31 is provided with a bonding receiving groove; the positioning member 32 is provided with a positioning groove, which matches the bonding receiving groove, so that the positioning member and the support platform are matched and connected to form a target bonding fixing structure, which is used to fix the position of the bonding member.

[0053] This application improves the installation stability of the parts to be glued during the assembly process by setting up the support platform 31 and the positioning element 32, thus ensuring the installation effect.

[0054] In some embodiments, the guide 1 is fixedly connected to the work station to be bonded, and a guide receiving groove is provided on the side of the work station to be bonded near the adhesive work station. The guide receiving groove is close to the work station to be bonded and is used to match the guide 1.

[0055] In some embodiments, the guide member 1 is bonded to the guide member receiving groove.

[0056] In other embodiments, the guide member 1 is engaged with the guide member receiving groove.

[0057] This application saves assembly space and manufacturing costs by integrating the guide component 1 with the workstation for the part to be bonded.

[0058] In other embodiments, the guide 1 is independently disposed between the workstation for the part to be bonded and the workstation for the adhesive part. The guide 1 is equipped with a moving mechanism that can drive the guide 1 to perform linear or curved motion, so that the movement trajectory of the guide 1 partially overlaps with that of the adhesive part. This causes motion interference with the adhesive material of the adhesive part, resulting in compression and deformation of the adhesive material, allowing it to reach a preset installation shape, thereby achieving the assembly of the adhesive part and the part to be bonded. It should be noted that when the part to be bonded is an enclosing component and the adhesive part is a accommodating component, the preset installation shape indicates that the size of the structure to be assembled from the adhesive part is less than or equal to the accommodating space formed by the enclosing component.

[0059] In some embodiments, the guide 1 may be a guide block.

[0060] In some embodiments, the guide 1 includes an extrusion surface 11; the extrusion surface 11 is disposed within the docking channel and is positioned within the movement trajectory of the adhesive.

[0061] This application uses an extrusion surface 11 to extrude the adhesive of the adhesive component, so that the adhesive of the adhesive component reaches the preset installation shape before interference bonding, thereby preventing damage to the adhesive and improving the assembly and installation effect.

[0062] In some embodiments, the size of the extrusion surface 11 can be matched to the area and position of the adhesive colloid that needs to be extruded.

[0063] In one specific embodiment, the adhesive of the adhesive component is annular, and the adhesive needs to be extruded on the annular adhesive surface. The extrusion surface 11 can be a cylindrical annular surface, and the extrusion surface 11 can form a hollow cylindrical channel through which the adhesive component can pass. When passing through the cylindrical channel, the adhesive is extruded by the extrusion surface 11 to achieve a preset installation shape.

[0064] In some embodiments, the extrusion surface 11 includes a guide ramp 12 disposed on the side of the extrusion surface 11 near the adhesive member fixing assembly 4.

[0065] This application uses a guide slope 12 to gradually contact and compress the adhesive in the adhesive part, preventing the adhesive from being squeezed and stuck by the extrusion surface 11, thus preventing damage to the adhesive and improving the assembly and installation effect.

[0066] In some embodiments, the guide ramp 12 extends from one end near the adhesive fixing component 4 to one end of the component to be bonded fixing component 3, and the distance between the guide ramp 12 and the docking channel between the component to be bonded station and the adhesive station becomes smaller and smaller.

[0067] In some embodiments, the inclination angle of the guide slope 12 is not limited, but can be matched according to the size of the adhesive to be compressed and the size of the space for accommodating the adhesive.

[0068] In some embodiments, the cooling regulating device 2 includes a first air outlet duct 21 and a first vortex tube 22; the first air outlet duct 21 includes a first air outlet end and a first connecting end; the first air outlet end is disposed toward the adhesive part station, and the first connecting end is connected to the first vortex tube 22.

[0069] This application sets up a first air outlet duct 21 and a first vortex tube 22. The first vortex tube 22 generates cold air, and the cold air is delivered to the area that needs to be cooled through the first air outlet duct 21. The air intake of the first vortex tube 22 is controlled to achieve temperature control and cooling treatment of the adhesive part station, so that the adhesive part reaches a first preset temperature, causing the adhesive part to temporarily lose its adhesiveness, preventing the adhesive from being damaged during the interference fit process, and improving the bonding and assembly effect.

[0070] In some embodiments, the first air outlet duct 21 has an insulation layer to keep the gas inside the first air outlet duct 21 warm.

[0071] In some embodiments, the first air outlet is directed toward the viscous colloid of the adhesive component, directly cooling the viscous colloid, accelerating the cooling effect, and improving assembly efficiency.

[0072] In some embodiments, the cooling regulating device 2 includes a second air outlet duct 23 and a second vortex tube 24; the second air outlet duct 23 includes a second air outlet end and a second connecting end; the second air outlet end is disposed toward the work station to be bonded, and the second connecting end is connected to the second vortex tube 24.

[0073] This application uses a second air outlet duct 23 and a second vortex tube 24 to cool down the workstation of the parts to be bonded, so that the parts to be bonded reach the target temperature. The target temperature matches the first preset temperature. The target temperature can be the same as the first preset temperature, or it can differ from the first preset temperature by a preset temperature threshold. The target temperature indicates the temperature at which the adhesive temporarily loses its adhesiveness, preventing the adhesive from contacting the parts to be bonded before they reach the target installation position during the interference fit process, thus preventing damage to the adhesive and improving the bonding and assembly effect.

[0074] In some embodiments, the second air outlet is in contact with the workpiece to be bonded. Through this contact, the temperature of the second air outlet is equivalent to that of the workpiece to be bonded. The temperature difference between the air outlet temperature and the temperature of the workpiece to be bonded is negligible. Only the air outlet temperature of the second air outlet is needed to determine the temperature of the workpiece to be bonded.

[0075] In some embodiments, the first air outlet duct 21 and the second air outlet duct 23 are connected. Only one vortex tube is needed to achieve cooling treatment for the unbonded part station and the adhesive part station. Through integrated design, space and cost are saved.

[0076] In some embodiments, the device further includes a third air outlet duct and a heating device. The third air outlet duct includes a third air outlet end and a third connecting end. The third air outlet end is disposed toward the workstation to be bonded, and the third connecting end is connected to the heating device.

[0077] This application, by setting up a third air outlet duct and a heating device, heats the adhesive material of the adhesive material after the parts to be bonded and the adhesive parts reach the target bonding position, thereby accelerating the recovery of the adhesive material's tackiness and improving assembly efficiency.

[0078] In some embodiments, the device further includes a first temperature sensor 5 and a first controller; the adhesive part station has a first target temperature zone, which is located within the temperature sensing area of ​​the first temperature sensor 5; the first temperature sensor 5 is used to collect first temperature data of the target temperature zone; and the first controller is used to control the air intake flow rate of the first vortex tube 22 according to the first temperature data.

[0079] This application enables the real-time observation of temperature changes at the viscous part station by setting a first temperature sensor 5. The first temperature sensor 5, the first vortex tube 22, and the first controller are linked and coordinated. The air intake flow of the first vortex tube 22 is controlled by the first temperature data from the first temperature sensor 5 to achieve the purpose of temperature control and improve the automation effect.

[0080] In some embodiments, the first temperature sensor 5 is disposed within the first target temperature zone and is used to collect first temperature data of the target temperature zone.

[0081] In some other embodiments, the first temperature sensor 5 can be an infrared temperature sensor.

[0082] In some embodiments, the first target temperature zone indicates a region within a preset range of the adhesive.

[0083] In some embodiments, a second temperature sensor 6 is also included; a second target temperature zone is provided at the first air outlet, the second target temperature zone is disposed within the temperature sensing area of ​​the second temperature sensor 6, and the second temperature sensor 6 is used to collect second temperature data of the second target temperature zone; the first controller is also used to control the orientation of the first air outlet according to the first temperature data and the second temperature data.

[0084] This application, by setting a second temperature sensor 6, can observe the temperature change at the first air outlet in real time, thereby determining whether there is a problem in the entire assembly process. By monitoring the temperature at the air outlet, it can be observed that during the cooling process of the adhesive component, if the flow velocity of the vortex tube has reached a level that can make the adhesive component reach the first preset temperature, but the adhesive component has not yet reached the first preset temperature, it may be that there is a problem with the orientation of the air outlet at the first air outlet, thus preventing the adhesive component from being ineffectively cooled due to a problem with the orientation of the first air outlet.

[0085] In some embodiments, the second temperature sensor 6 is disposed within the second target temperature zone and is used to collect second temperature data of the target temperature zone.

[0086] In other embodiments, the second temperature sensor 6 can be an infrared temperature sensor.

[0087] In some embodiments, the second target temperature zone indicates an area within a preset range at the first air outlet.

[0088] In some embodiments, the device further includes a third temperature sensor 7 and a second controller; a third target temperature zone is provided at the second air outlet, the third target temperature zone is disposed within the temperature sensing zone of the third temperature sensor 7, the third temperature sensor 7 is used to collect third temperature data at the second air outlet; the second controller is used to control the air intake flow rate of the second vortex tube 24 according to the third temperature data, so that the temperature of the workpiece to be bonded differs from the first preset temperature by a preset temperature threshold.

[0089] This application, by setting a third temperature sensor 7, can observe the temperature change at the second air outlet in real time, thereby determining the temperature of the workpiece to be bonded. Furthermore, the third temperature sensor 7, the second vortex tube 24, and the second controller are linked and coordinated. By using the second temperature data from the third temperature sensor 7, the air intake flow of the second vortex tube 24 is controlled to achieve the purpose of temperature control and improve the automation effect.

[0090] In some embodiments, the third temperature sensor 7 is disposed within the third target temperature zone and is used to collect the third temperature data of the target temperature zone.

[0091] In other embodiments, the third temperature sensor 7 can be an infrared temperature sensor.

[0092] In some embodiments, the third target temperature zone indicates an area within a preset range at the second air outlet.

[0093] In some embodiments, the assembly apparatus for adhesive parts provided in this application assembles the adhesive part and the part to be bonded by the following steps:

[0094] S1: Provide adhesive parts and parts to be glued.

[0095] S2: Place the adhesive part on the adhesive part station and fix it.

[0096] S3: Place the part to be bonded on the bonding station and fix it in place.

[0097] S4: Control the movement of the adhesive part station toward the part to be bonded station to complete the assembly between the adhesive part and the part to be bonded, and then stop the movement. It should be noted that during the movement of the adhesive part station toward the part to be bonded station, the adhesive of the adhesive part is first cooled by the cooling and regulating device, and then squeezed by the guide component before the adhesive part and the part to be bonded come into contact and are assembled.

[0098] The temperature regulation method for the cooling and regulating device includes the following steps:

[0099] S101: Collect the first temperature data of the target temperature zone.

[0100] S102: Feed back the first temperature data to the first controller.

[0101] S103: The first controller controls the intake flow of the first vortex tube based on the first temperature data.

[0102] S104: Collect the second temperature data of the second target temperature zone.

[0103] S105: Feed back the first temperature data and the second temperature data to the first controller.

[0104] S106: The first controller controls the orientation of the first air outlet based on the first temperature data and the second temperature data.

[0105] S107: Collect the third temperature data at the second air outlet.

[0106] S108: Feed back the third temperature data to the second controller.

[0107] S109: The second controller controls the air intake flow of the second vortex tube based on the third temperature data, so that the temperature of the workpiece to be bonded differs from the first preset temperature by a preset temperature threshold.

[0108] It should be noted that the first temperature data, the second temperature data, and the third temperature data in steps S101, S104, and S107 can be collected simultaneously.

[0109] The following are some specific embodiments of the above technical solutions listed in this specification.

[0110] Example 1

[0111] This embodiment 1 discloses an assembly apparatus for adhesive components, applied in the field of electronic device assembly technology, specifically for the assembly of earphone stems and earphone shells. In existing technologies, earphone stems and shells are typically assembled using adhesive dispensing. This dispensing method can lead to problems such as adhesive overflow, easily causing contamination of the electronic components. This application proposes a novel assembly method using adhesive components for interference fit assembly of the electronic components. Please refer to [reference needed for details]. Figure 1-6 This device is used for assembling adhesive parts and parts to be bonded, and includes: a guide 1, a cooling adjustment device 2, a part to be bonded fixing assembly 3, and an adhesive part fixing assembly 4; the part to be bonded fixing assembly 3 has a part to be bonded station, and the adhesive part fixing assembly 4 has an adhesive part station; the cooling end of the cooling adjustment device 2 is set towards the adhesive part station, and the cooling adjustment device 2 is used to cool the adhesive part so that the adhesive part reaches a first preset temperature; the adhesive part fixing assembly 4 can drive the adhesive part to move towards the part to be bonded fixing assembly 3, thereby connecting the part to be bonded station and the adhesive part station; the guide 1 is adjacent to the docking channel of the part to be bonded station and the adhesive part station, and the movement trajectory of the guide 1 and the adhesive part partially overlaps.

[0112] It should be noted that the adhesive component and the part to be bonded are in an interference fit. Specifically, the major diameter of the adhesive component is 0.28 mm larger than the inner diameter of the assembly of the part to be bonded. The adhesive component includes the adhesive material and the assembly that matches the part to be bonded. The adhesive material is used to bond the part to be bonded to the assembly. Specifically, the adhesive material can be a double-sided foam adhesive. In the prior art, double-sided foam adhesive tends to stick to the surface of the object during interference fit, causing damage to the double-sided foam adhesive.

[0113] Specifically, the guide 1 is fixedly connected to the work station of the part to be bonded. A guide receiving groove is provided on the side of the work station of the part to be bonded that is close to the work station of the adhesive part. The guide receiving groove is close to the receiving groove of the part to be bonded and is used to match the guide 1.

[0114] Specifically, the guide component 1 is snapped into the guide component receiving slot. This application saves assembly space and manufacturing costs by integrating the guide component 1 with the workstation for the part to be bonded.

[0115] Specifically, guide component 1 can be a guide block.

[0116] Specifically, the guide member 1 includes an extrusion surface 11; the extrusion surface 11 is disposed in the docking channel and is placed within the movement trajectory of the adhesive member.

[0117] This application uses an extrusion surface 11 to extrude the adhesive of the adhesive component, so that the adhesive of the adhesive component reaches the preset installation shape before interference bonding, thereby preventing damage to the adhesive and improving the assembly and installation effect.

[0118] Specifically, the size of the extrusion surface 11 can be matched and set according to the area and position of the adhesive colloid in the adhesive part that needs to be extruded.

[0119] Specifically, the extrusion surface 11 includes a guide slope 12, which is disposed on the side of the extrusion surface 11 near the adhesive fixing assembly 4.

[0120] This application uses a guide slope 12 to gradually contact and compress the adhesive in the adhesive part, preventing the adhesive from being squeezed and stuck by the extrusion surface 11, thus preventing damage to the adhesive and improving the assembly and installation effect.

[0121] Specifically, the guide ramp 12 extends from one end near the adhesive part fixing assembly 4 to one end of the part to be bonded fixing assembly 3, and the distance between the guide ramp 12 and the docking channel between the part to be bonded station and the adhesive part station becomes smaller and smaller.

[0122] Specifically, the tilt angle of the guide slope 12 is not limited here, but can be matched and set according to the size of the adhesive to be compressed and the size of the space for accommodating the adhesive.

[0123] Specifically, the first preset temperature indicates the temperature at which the viscous colloid in the adhesive component loses its stickiness; the first preset temperature is -25°C. It should be noted that the first preset temperature is set to match the adhesive component, and different adhesive components can be set with different first preset temperatures.

[0124] This application sets the temperature of the adhesive component to -25℃, causing it to temporarily lose its adhesiveness, thereby preventing damage to the adhesive during interference fit installation and improving the bonding and assembly effect.

[0125] Specifically, the adhesive part station includes a drive mechanism; the drive mechanism is connected to the adhesive part fixing assembly 4 in a transmission manner, and the drive mechanism can drive the adhesive part fixing assembly 4 to move toward the part fixing assembly 3 to be bonded.

[0126] This application, by setting a driving mechanism, can automatically drive the adhesive part fixing component 4 toward the part to be glued fixing component 3, making the assembly more automated and saving manpower.

[0127] Specifically, the bonding station includes a support platform 31 and a positioning member 32; the support platform 31 is provided with a bonding receiving groove; the positioning member 32 is provided with a positioning groove, which matches the bonding receiving groove so that the positioning member and the support platform are matched and connected to form a target bonding fixing structure, which is used to fix the position of the bonding member.

[0128] This application improves the installation stability of the parts to be glued during the assembly process by setting up the support platform 31 and the positioning element 32, thus ensuring the installation effect.

[0129] Specifically, the cooling regulating device 2 includes a first air outlet duct 21 and a first vortex tube 22; the first air outlet duct 21 includes a first air outlet end and a first connecting end; the first air outlet end is arranged toward the adhesive part station, and the first connecting end is connected to the first vortex tube 22.

[0130] This application sets up a first air outlet duct 21 and a first vortex tube 22. The first vortex tube 22 generates cold air, and the cold air is delivered to the area that needs to be cooled through the first air outlet duct 21. The air intake of the first vortex tube 22 is controlled to achieve temperature control and cooling treatment of the adhesive part station, so that the adhesive part reaches a first preset temperature, causing the adhesive part to temporarily lose its adhesiveness, preventing the adhesive from being damaged during the interference fit process, and improving the bonding and assembly effect.

[0131] Specifically, the first air outlet duct 21 has an insulation layer to keep the gas inside the first air outlet duct 21 warm.

[0132] Specifically, the first air outlet is positioned towards the viscous colloid of the adhesive component, directly cooling the viscous colloid, accelerating the cooling effect, and improving assembly efficiency.

[0133] Specifically, the cooling and regulating device 2 includes a second air outlet duct 23 and a second vortex tube 24; the second air outlet duct 23 includes a second air outlet end and a second connecting end; the second air outlet end is set towards the work station to be bonded, and the second connecting end is connected to the second vortex tube 24.

[0134] This application uses a second air outlet duct 23 and a second vortex tube 24 to cool down the workstation of the parts to be bonded, so that the parts to be bonded reach the target temperature. The target temperature matches the first preset temperature. The target temperature can be the same as the first preset temperature, or it can differ from the first preset temperature by a preset temperature threshold. The target temperature indicates the temperature at which the adhesive temporarily loses its adhesiveness, preventing the adhesive from contacting the parts to be bonded before they reach the target installation position during the interference fit process, thus preventing damage to the adhesive and improving the bonding and assembly effect.

[0135] Specifically, the second air outlet is set to contact the part to be bonded. Through this contact setting, the temperature of the second air outlet is equivalent to that of the part to be bonded. The temperature difference between the air outlet temperature and the temperature of the part to be bonded is negligible. Only the air outlet temperature of the second air outlet is needed to know the temperature of the part to be bonded.

[0136] Specifically, the first air outlet duct 21 and the second air outlet duct 23 are connected. Only one vortex tube is needed to achieve cooling treatment for the unbonded part station and the bonded part station. Through integrated design, space and cost are saved.

[0137] Specifically, it also includes a third air outlet duct and a heating device. The third air outlet duct includes a third air outlet end and a third connecting end. The third air outlet end is set towards the workstation to be bonded, and the third connecting end is connected to the heating device.

[0138] This application, by setting up a third air outlet duct and a heating device, heats the adhesive material of the adhesive material after the parts to be bonded and the adhesive parts reach the target bonding position, thereby accelerating the recovery of the adhesive material's tackiness and improving assembly efficiency.

[0139] Specifically, it also includes a first temperature sensor 5 and a first controller; the viscous part station has a first target temperature zone, which is set within the temperature sensing area of ​​the first temperature sensor 5, and the first temperature sensor 5 is used to collect the first temperature data of the target temperature zone; the first controller is used to control the air intake flow of the first vortex tube 22 according to the first temperature data.

[0140] This application enables the real-time observation of temperature changes at the viscous part station by setting a first temperature sensor 5. The first temperature sensor 5, the first vortex tube 22, and the first controller are linked and coordinated. The air intake flow of the first vortex tube 22 is controlled by the first temperature data from the first temperature sensor 5 to achieve the purpose of temperature control and improve the automation effect.

[0141] Specifically, the first temperature sensor 5 is located within the first target temperature zone and is used to collect the first temperature data of the target temperature zone.

[0142] Specifically, the first target temperature zone indicates the area within a preset range of the viscous material.

[0143] Specifically, it also includes a second temperature sensor 6; the first air outlet has a second target temperature zone, which is located within the temperature sensing area of ​​the second temperature sensor 6, and the second temperature sensor 6 is used to collect second temperature data of the second target temperature zone; the first controller is also used to control the orientation of the first air outlet based on the first temperature data and the second temperature data.

[0144] This application, by setting a second temperature sensor 6, can observe the temperature change at the first air outlet in real time, thereby determining whether there is a problem in the entire assembly process. By monitoring the temperature at the air outlet, it can be observed that during the cooling process of the adhesive component, if the flow velocity of the vortex tube has reached a level that can make the adhesive component reach the first preset temperature, but the adhesive component has not yet reached the first preset temperature, it may be that there is a problem with the orientation of the air outlet at the first air outlet, thus preventing the adhesive component from being ineffectively cooled due to a problem with the orientation of the first air outlet.

[0145] Specifically, the second temperature sensor 6 is located within the second target temperature zone and is used to collect the second temperature data of the target temperature zone.

[0146] Specifically, the second target temperature zone indicates the area within a preset range at the first air outlet.

[0147] Specifically, it also includes a third temperature sensor 7 and a second controller; the second air outlet has a third target temperature zone, which is set within the temperature sensing area of ​​the third temperature sensor 7, and the third temperature sensor 7 is used to collect the third temperature data of the second air outlet; the second controller is used to control the air intake flow of the second vortex tube 24 according to the third temperature data, so that the temperature of the workpiece to be bonded differs from the first preset temperature by a preset temperature threshold.

[0148] This application, by setting a third temperature sensor 7, can observe the temperature change at the second air outlet in real time, thereby determining the temperature of the workpiece to be bonded. Furthermore, the third temperature sensor 7, the second vortex tube 24, and the second controller are linked and coordinated. By using the second temperature data from the third temperature sensor 7, the air intake flow of the second vortex tube 24 is controlled to achieve the purpose of temperature control and improve the automation effect.

[0149] Specifically, the third temperature sensor 7 is located within the third target temperature zone and is used to collect the third temperature data of the target temperature zone.

[0150] Specifically, the third target temperature zone indicates the area within a preset range at the second air outlet.

[0151] By adopting the above technical solution, the assembly apparatus for adhesive parts disclosed in this application has the following beneficial effects:

[0152] This application utilizes a guide component and a cooling adjustment device in conjunction. During the process where the adhesive component fixing assembly moves the adhesive component toward the component to be bonded fixing assembly, thereby aligning the component to be bonded station and the adhesive component station, the cooling adjustment device first cools the adhesive on the adhesive component to bring it to a first preset temperature, temporarily causing it to lose its adhesiveness. Then, the guide component compresses the adhesive on the adhesive component to ensure an interference fit between the adhesive component and the component to be bonded. The cooling treatment prevents damage to the adhesive during the interference fit process, improving the bonding and assembly effect.

[0153] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An assembly apparatus for adhesive parts, applied to the assembly of adhesive parts and parts to be bonded, characterized in that, include: Guide component (1), cooling adjustment device (2), component fixing assembly (3), and adhesive component fixing assembly (4); The component fixing assembly (3) is provided with a component fixing station, and the adhesive component fixing assembly (4) is provided with an adhesive component fixing station; The cooling end of the cooling regulating device (2) is set toward the adhesive part station. The cooling regulating device (2) is used to cool the adhesive part so that the adhesive part reaches the first preset temperature. The adhesive fixing assembly (4) can drive the adhesive to move toward the adhesive fixing assembly (3), thereby connecting the adhesive station and the adhesive station. The guide (1) is arranged adjacent to the docking channel of the work station to be bonded and the work station of the adhesive, and the movement trajectory of the guide (1) and the adhesive part partially overlap.

2. The assembly apparatus for adhesive parts according to claim 1, characterized in that, The guide (1) includes an extrusion surface (11); The extrusion surface (11) is disposed within the docking channel, and the extrusion surface (11) is placed within the movement trajectory of the adhesive component.

3. The assembly apparatus for adhesive parts according to claim 2, characterized in that, The extrusion surface (11) includes a guide slope (12) disposed on the side of the extrusion surface (11) near the adhesive fixing assembly (4).

4. The assembly apparatus for adhesive parts according to claim 1, characterized in that, It also includes a drive mechanism, which is connected to the adhesive fixing assembly (4) and is capable of driving the adhesive fixing assembly (4) toward the adhesive fixing assembly (3).

5. The assembly apparatus for adhesive parts according to claim 1, characterized in that, The cooling regulating device (2) includes a first air outlet duct (21) and a first vortex tube (22); The first air outlet duct (21) includes a first air outlet end and a first connection end; The first air outlet is positioned toward the adhesive component station, and the first connecting end is connected to the first vortex tube (22).

6. The assembly apparatus for adhesive parts according to claim 5, characterized in that, The cooling regulating device (2) includes a second air outlet duct (23) and a second vortex tube (24); The second air outlet duct (23) includes a second air outlet end and a second connection end; The second air outlet is positioned toward the work station of the part to be bonded, and the second connecting end is connected to the second vortex tube (24).

7. The assembly apparatus for adhesive parts according to claim 5, characterized in that, It also includes a first temperature sensor (5) and a first controller; The adhesive part station has a first target temperature zone, which is located within the temperature sensing area of ​​the first temperature sensor (5). The first temperature sensor (5) is used to collect the first temperature data of the target temperature zone. The first controller is used to control the air intake flow of the first vortex tube (22) according to the first temperature data.

8. The assembly apparatus for adhesive parts according to claim 7, characterized in that, It also includes a second temperature sensor (6); The first air outlet has a second target temperature zone, which is located within the temperature sensing area of ​​the second temperature sensor (6). The second temperature sensor (6) is used to collect the second temperature data of the second target temperature zone. The first controller is also configured to control the orientation of the first air outlet based on the first temperature data and the second temperature data.

9. The assembly apparatus for adhesive parts according to claim 6, characterized in that, It also includes a third temperature sensor (7) and a second controller; The second air outlet has a third target temperature zone, which is located within the temperature sensing area of ​​the third temperature sensor (7). The third temperature sensor (7) is used to collect the third temperature data of the second air outlet. The second controller is used to control the air intake flow of the second vortex tube (24) according to the third temperature data, so that the temperature of the workpiece to be bonded is different from the first preset temperature by a preset temperature threshold.

10. The assembly apparatus for adhesive parts according to claim 1, characterized in that, The first preset temperature is -30 to -20℃.

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