High temperature heating device

Abstract

This invention provides a high-temperature heating device comprising: a first heating component, a second heating component, a sealing component, and a first driving mechanism. The first heating component and the second heating component are disposed opposite to each other, and a hollow region is formed between them. At least one of the first heating component and the second heating component is used to hold the target object. The sealing component is disposed on the first driving mechanism and is located around the hollow region, serving to seal the hollow region. The first driving mechanism is used to drive the sealing component to move. This high-temperature heating device heats the target object's sides near or away from the first heating component using the first and second heating components, and heats the target object's sides using the sealing component, thereby improving the heating uniformity of the target object. It is also simple to operate and convenient to use.

Description

Technical Field

[0001] This invention relates to the field of target object processing technology, and in particular to a high-temperature heating device. Background Technology

[0002] In integrated circuit manufacturing, the target wafer is used as a carrier for intensive and complex processing steps, particularly involving photoresist coating, development, baking, and exposure processes, to transfer the designed path to the wafer. In this process, wafer exposure can be considered a critical step in chip formation. However, after undergoing complex processing, the wafer is prone to warping or micro-deformation, making it difficult to focus during exposure and thus affecting the wafer yield.

[0003] Chinese patent application CN111110220703B discloses a high-temperature vacuum furnace and a target material processing device. This high-temperature vacuum furnace heats a process tube capable of holding a wafer by incorporating an electric heating element and an electrode assembly within the furnace body, thereby achieving high-temperature heating at varying distances. However, this heating method results in the center of the wafer receiving less heat than the edges, leading to uneven heating and potentially increasing warping during processing.

[0004] Chinese patent application CN103325714B discloses a heating device comprising a disc-shaped ceramic substrate with a wafer placement surface, a resistive heating element disposed inside or on the surface of the ceramic substrate, and a hollow shaft mounted on the surface opposite to the wafer placement surface within the ceramic substrate. The ceramic substrate has a central portion and an outer peripheral portion. By adjusting the length ratio and thickness ratio of the two sections on the hollow shaft, a cooling temperature distribution and improved temperature control can be achieved simultaneously during the wafer heating process, while also preventing the lower end of the hollow shaft from overheating. However, this heating method does not take into account the degree of heating on the sides of the wafer, and uneven heating still occurs to varying degrees. In particular, as the wafer thickness changes, this uneven heating becomes more pronounced, affecting the wafer yield.

[0005] Therefore, it is necessary to design a high-temperature heating device that has a smaller impact on wafer thermal processing, thereby reducing the warping of wafers caused by uneven heating during thermal processing and improving the yield of wafer processing. Summary of the Invention

[0006] The purpose of this invention is to provide a high-temperature heating device to improve the uneven heating of wafers during the high-temperature heating process and improve surface flatness.

[0007] To achieve the above objectives, the present invention provides a high-temperature heating device, comprising: a first heating component, a second heating component, a sealing component, and a first driving mechanism. The first heating component and the second heating component are disposed opposite to each other, and a hollow region is formed between the first heating component and the second heating component. Either the first heating component or the second heating component is used to support the target object, and the first heating component is used to heat the surface of the target object near the first heating component. The second heating component is used to heat the surface of the target object near the second heating component. The sealing component is disposed on the first driving mechanism and is disposed around the hollow region. The sealing component is used to close the hollow region and is used to heat the surface of the target object near the sealing component. The first driving mechanism is used to drive the sealing component to move. The beneficial effects of the high-temperature heating device of the present invention are as follows: the first heating component and the second heating component are arranged opposite to each other, and a hollow area exists between the first heating component and the second heating component. The target object to be heated is placed on the first heating component or the second heating component. The first heating component and the second heating component can heat the surface of the target object near or away from the first heating component. The sealing component is disposed on the first driving mechanism and is disposed around the hollow area. The sealing component can be closed by the first driving mechanism, which forms a closed heating cavity in the hollow area, reducing heat loss during heating. On the other hand, the sealing component heats the surface of the target object, improving the heating uniformity of the target object. After heating is completed, the sealing component can be removed by the first driving mechanism, and the heated target object can be removed. The operation is simple and convenient, and the heated target object can be quickly replaced, which facilitates the improvement of heating efficiency.

[0008] In one feasible solution, the first heating component or the second heating component is provided with a return air channel, one end of which is connected to the hollow region, and the other end of which is connected to the outside. The advantages are: firstly, the return air channel promotes gas flow within the enclosed hollow region, resulting in a more uniform temperature distribution; secondly, it allows waste gas or volatiles generated during the heating process to be discharged, preventing deposition and ensuring a cleaner heated object.

[0009] In one feasible solution, the first heating component or the second heating component is provided with a gas replenishment channel, and the gas replenishment channel is located on one side of the heating part of the first heating component or the heating part of the second heating component. The sealing component is provided with an air inlet channel communicating with the gas replenishment channel, and the air inlet channel is communicating with the hollow region. Its advantages are: the gas replenishment channel can replenish the gas in the hollow region, and the airflow flows through the route of the gas replenishment channel-the hollow region-the return channel, so that the gas in the gas replenishment channel and the return channel do not affect each other. Furthermore, by placing the gas replenishment channel on one side of the heating part of the first heating component or the second heating component, the gas entering the hollow region through the gas replenishment channel can be preheated.

[0010] In one feasible solution, the first heating component or the second heating component is provided with a gas replenishment chamber, which communicates with the gas replenishment channel and is located on one side of the heating part of the first heating component or the second heating component. Its advantages are: by providing the gas replenishment chamber to replenish the gas in the gas replenishment channel, and by positioning the gas replenishment chamber on one side of the heating part of the first heating component or the second heating component, the replenished gas can be fully preheated, improving heat utilization efficiency.

[0011] In one feasible solution, the return air channel includes: a first return air channel and a second return air channel. One end of the first and second return air channels communicates with the hollow region, and the other end communicates with the outside. The connection point between the first and second return air channels and the hollow region is located at the center of the hollow region, and the connection point between the second and second return air channels and the hollow region is located at the edge of the hollow region. The advantages are: by setting up two channels for return air, with the first and second return air channels located at the center of the hollow region and the second return air channel at the edge, this arrangement avoids heat accumulation, temperature rise, and pressure increase in the middle of the hollow region. It also balances the negative pressure generated by the first and second return air channels, reducing the impact on the air pressure in the hollow region.

[0012] In one feasible solution, the connection point between the air intake channel and the hollow region is located near the connection point between the second return air channel and the hollow region. The advantage of this arrangement is that it can guide the gas entering the hollow region through the air intake channel, reducing the impact of the airflow entering the hollow region through the air intake channel on the target object during the heating process.

[0013] In one feasible solution, a second moving mechanism, a third moving mechanism, and a carrying plate are further included. The carrying plate is disposed on the third moving mechanism and is used to place the target object. The third moving mechanism is used to transfer the target object to the hollow area. The second moving mechanism is used to move the target object to the carrying plate, the first heating component, or the second heating component. Its advantages are that this arrangement allows the target object to be transported via the second and third moving mechanisms, improving work efficiency and preventing burns to workers from high temperatures, thus enhancing safety.

[0014] In one feasible solution, a cooling component is also included, which is disposed on the carrier plate and used to cool the target object. The advantage of this arrangement is that it enables rapid cooling and shaping of the target object, reducing the impact of decreased rigidity caused by the target object's high temperature during movement.

[0015] In one feasible solution, a heat insulation component is further included, located between at least one of the first heating component or the second heating component and the second moving mechanism. The advantage of this is that the heat insulation component reduces the impact of heat generated by the first and second heating components on other structures, ensuring the normal operation of the device.

[0016] In one feasible solution, the carrying plate is provided with several anti-slip protrusions. The advantage of this design is that it improves the stability of the target object during transport.

[0017] In one feasible solution, the anti-slip protrusion is composed of rubber and polymer materials. Its advantage lies in that this design increases the coefficient of friction between the target object and the anti-slip protrusion, thereby improving the stability of the target object during transport.

[0018] In one feasible solution, a negative pressure mechanism is also included, which is connected to the return gas channel and is used to drive gas flow in the hollow region. The beneficial effect is that the negative pressure mechanism promotes gas flow. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the high-temperature heating device in the first embodiment of the present invention;

[0020] Figure 2 for Figure 1 A partial structural diagram of a medium- and high-temperature heating device;

[0021] Figure 3 for Figure 2Schematic diagram of the cross-sectional structure of a medium- and high-temperature heating device;

[0022] Figure 4 for Figure 3 Enlarged structural diagram at point A;

[0023] Figure 5 for Figure 3 Enlarged structural diagram at point B;

[0024] Figure 6 for Figure 2 A schematic diagram of the structure of the first heating component and the negative pressure mechanism;

[0025] Figure 7 for Figure 6 A schematic diagram of the exploded structure of the first heating component;

[0026] Figure 8 for Figure 2 Schematic diagram of the cooling component;

[0027] Figure 9 for Figure 2 A schematic diagram of the structure of the first driving mechanism and the second moving mechanism;

[0028] Figure 10 for Figure 2 Schematic diagram of the middle sealing assembly;

[0029] Figure 11 for Figure 2 Schematic diagram of the structure of the second heating component and the sealing component;

[0030] Figure 12 This is a schematic diagram of the structure of the second heating component and the sealing component in the second embodiment of the present invention;

[0031] Figure 13 This is a schematic diagram of the sealing assembly in the third embodiment of the present invention.

[0032] Numbering on the map:

[0033] 1. First heating component; 101. Gas return channel; 102. Gas replenishment channel; 103. Gas replenishment chamber; 104. First gas return channel; 105. Second gas return channel; 106. First lower fixing plate; 107. First upper fixing plate; 108. First heating wire; 109. Cover plate;

[0034] 2. Second heating component; 201. Second lower fixing plate; 202. Second upper fixing plate; 203. Second heating wire;

[0035] 3. Sealing assembly; 301. Air intake passage; 302. Side sealing plate;

[0036] 4. First drive mechanism; 401. Cylinder; 402. Connecting plate;

[0037] 5. Hollow area;

[0038] 6. Second moving mechanism; 601. Screw-slider mechanism; 602. Push rod; 603. Mounting plate;

[0039] 7. Third moving mechanism;

[0040] 8. Cargo tray; 801. Anti-slip protrusions;

[0041] 9. Cooling components; 902. Cooling pipes; 903. Interfaces;

[0042] 10. Thermal insulation components; 1001. First thermal insulation panel; 1002. Second thermal insulation panel; 1003. Third thermal insulation panel; 1004. Top panel;

[0043] 11. Negative pressure mechanism; 1101. Vacuum generator; 1102. Third pipeline; 1103. Fourth pipeline;

[0044] 12. Rack;

[0045] 13. Ventilation block; 1301. First pipeline; 1302. Second pipeline; 1303. Inner cavity; 1304. Outer cavity;

[0046] 14. Support plate; 1401. Fixing column;

[0047] 15. Third heating wire;

[0048] 16. Target object. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0050] To address the problems existing in the prior art, embodiments of the present invention provide a high-temperature heating device.

[0051] Figure 1This is a schematic diagram of the high-temperature heating device in the first embodiment of the present invention. Figure 2 for Figure 1 A partial structural diagram of a medium- and high-temperature heating device. Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of the medium- and high-temperature heating device. Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle. Figure 5 for Figure 3 Enlarged structural diagram at point B. Figure 7 for Figure 6 Exploded structural diagram of the first heating component. Figure 9 for Figure 2 Schematic diagram of the structure of the first driving mechanism and the second moving mechanism. Figure 10 for Figure 2 Schematic diagram of the middle sealing assembly. Figure 11 for Figure 2 A schematic diagram of the structure of the second heating component and the sealing component.

[0052] In some embodiments of the present invention, reference is made to Figure 1 and Figure 2 The high-temperature heating device includes: a first heating component 1, a second heating component 2, a sealing component 3, and a first driving mechanism 4. The first heating component 1 and the second heating component 2 are arranged opposite to each other, and a hollow region 5 is formed between the first heating component 1 and the second heating component 2. Either the first heating component 1 or the second heating component 2 is used to support the target object 16. The first heating component 1 is used to heat the surface of the target object 16 near the first heating component 1, and the second heating component 2 is used to heat the surface of the target object 16 near the second heating component 2. The sealing component 3 is disposed on the first driving mechanism 4 and is disposed around the hollow region 5. The sealing component 3 is used to seal the hollow region 5 and is used to heat the surface of the target object 16 near the sealing component 3. The first driving mechanism 4 is used to drive the sealing component 3 to move.

[0053] In some specific embodiments of the present invention, reference is made to Figures 2 to 5 , Figure 7 and Figures 9 to 11The high-temperature heating device also includes a frame 12. The first heating component 1 and the second heating component 2 are horizontally arranged on the frame 12, one above the other. The area between the first heating component 1 and the second heating component 2 is the hollow area 5. The first heating component 1 and the second heating component 2 are horizontally arranged. The first heating component 1 includes a first lower fixing plate 106, a first upper fixing plate 107, and a first heating wire 108. The first lower fixing plate 106 is provided with uniform and layered spiral grooves. The first heating wire 108 is disposed in the spiral grooves. The two ends of the first heating wire 108 are electrically connected to a power source. The first upper fixing plate 107 is disposed on the first lower fixing plate 106. The second heating component 2 includes a second lower fixing plate 201, a second... The upper fixing plate 202 and the second heating wire 203 are provided. The second heating component 2 is configured in the same way as the first heating component 1, and the second heating component 2 can support the target object 16. The sealing component 3 includes a side sealing plate 302. The first driving mechanism 4 includes two cylinders 401 arranged symmetrically front and rear and two connecting plates 402 respectively arranged on the two cylinders 401. The front and rear sides of the side sealing plate 302 are fixedly arranged on the two connecting plates 402, and the side sealing plate 302 is arranged around the periphery of the second heating component 2. The bottom inner side of the side sealing plate 302 is provided with an inner protruding ring, and the top outer side of the second lower fixing plate 201 is provided with an outer protruding ring. The outer protruding ring and the inner protruding ring are arranged vertically and vertically. The two cylinders 401 are connected to the air pump. Initially, the side sealing plate 302 is located around the second heating component 2. At this time, the target object 16 to be heated is placed on the second heating component 2. Then, the cylinder 401 is controlled to move the side sealing plate 302 upward until the inner convex ring abuts against the outer convex ring. At this time, the top surface of the side sealing plate 302 abuts against the first lower fixing plate 106, thereby sealing the hollow area 5. The target object 16 is then heated. The top and bottom surfaces of the target object 16 are heated by the first heating component 1 and the second heating component 2, respectively. The sides of the target object 16 are heated by the heat from the first heating component 1 and the second heating component 2 conducted by the side sealing plate 302. After heating is completed, the side sealing plate 302 is moved downward by the cylinder 401, and then the target object 16 can be removed. More specifically, since the target object 16 is placed directly on the second heating component 2 during use, and there are gaps between the first heating component 1 and the side sealing plate 302 and the target object 16, the second heating component 2 directly heats the bottom surface of the target object 16, the first heating component 1 indirectly heats the target object 16 by heating the space above the target object 16, and the side sealing plate 302 indirectly heats the target object 16 by heating the space on the side of the target object 16.This ensures that the top, bottom, and sides of the target object 16 are all heated by the heat source, making the target object 16 heated more evenly and reducing the warping that occurs during the heating process.

[0054] It is worth noting that the first heating component 1 and the second heating component 2 are not limited to heating wires; they can also use heating plates, heating films, or multi-zone heat sources. A multi-zone heat source means that multiple heat sources are set within the heating component to heat different areas separately, and each area can be individually controlled. Furthermore, the first drive mechanism 4 is not limited to being powered by a cylinder 401; it can be powered by a motor and lead screw, a linkage mechanism, or a motor belt, etc.

[0055] In some other embodiments of the present invention, reference is made to Figure 2 and Figure 4 The first heating component 1 or the second heating component 2 is provided with a return air channel 101. One end of the return air channel 101 is connected to the hollow region 5, and the other end of the return air channel 101 is connected to the outside.

[0056] In some other specific embodiments of the present invention, reference is made to Figures 2 to 5 Based on the principle that gas rises when heated, the return gas channel 101 is set on the first heating component 1. One end of the return gas channel 101 is connected to the hollow region 5, and the other end of the return gas channel 101 is connected to the outside. When in use, as the hollow region 5 is heated, the gas moves to the outside through the return gas channel 101, which can promote the gas flow in the hollow region 5 and reduce the impact of air pressure on the target object 16. At the same time, when the target object 16 is heated at high temperature, it will generate waste gas or fine particles. The return gas channel 101 can make the waste gas, volatiles or fine particles move to the outside together, which can prevent the above-mentioned waste from being deposited on the target object 16.

[0057] In some other embodiments of the present invention, reference is made to Figures 2 to 5 The first heating component 1 or the second heating component 2 is provided with a gas replenishment channel 102, and the gas replenishment channel 102 is located on one side of the heating part of the first heating component 1 or the heating part of the second heating component 2. The sealing component 3 is provided with an air inlet channel 301 that communicates with the gas replenishment channel 102, and the air inlet channel 301 communicates with the hollow region 5.

[0058] In some further embodiments of the present invention, reference is made to Figure 4 , Figure 5 and Figure 7The air supply channel 102 is disposed on the first heating component 1 and on the outer periphery of the first heating wire 108. The air supply channel is disposed between the first lower fixing plate 106 and the first upper fixing plate 107. The air inlet of the air supply channel 102 is disposed on the first upper fixing plate 107, and the air outlet of the air supply channel 102 is disposed on the first lower fixing plate 106. Both the air inlet and the air outlet of the air supply channel 102 are configured as a plurality of evenly arranged small holes. The side sealing plate 302 is provided with an annular groove. The bottom surface of the annular groove is provided with a plurality of air inlets of the air supply channel 301. The inner side surface of the side sealing plate 302 is provided with a plurality of evenly arranged air outlets communicating with the air inlets of the air supply channel 301. The air outlets are connected to the hollow region 5 when the side sealing plate 302 is closed. This configuration allows the gas on the upper side of the first heating component 1 to enter through the air inlet of the gas replenishment channel 102, and then move to the hollow region 5 through the air inlet channel 301, which can replenish the gas in the hollow region 5 and promote the outflow of gas in the hollow region 5.

[0059] In some other embodiments of the present invention, reference is made to Figures 2 to 4 The first heating component 1 or the second heating component 2 is provided with a gas replenishment chamber 103, which is connected to the gas replenishment channel 102, and the gas replenishment chamber 103 is located on one side of the heating part of the first heating component 1 or the second heating component 2.

[0060] In some other specific embodiments of the present invention, reference is made to Figures 2 to 5 The first heating component 1 also includes a cover plate 109, which forms a cavity with the first upper fixing plate 107, namely the gas replenishment cavity 103. The gas replenishment cavity 103 has a through hole for the return gas channel 101 on its left side. The air inlet of the gas replenishment channel 102 is connected to the gas replenishment cavity 103, and the gas replenishment cavity 103 is located above the first heating wire 108. This allows the gas entering the gas replenishment channel 102 to be fully preheated, preventing overcooled gas from directly entering the hollow area 5 and affecting the target object 16.

[0061] Figure 6 for Figure 2 A schematic diagram of the structure of the first heating component and the negative pressure mechanism;

[0062] In some embodiments of the present invention, reference is made to Figure 2 and Figure 4The return air channel 101 includes a first return air channel 104 and a second return air channel 105. One end of the first return air channel 104 and the second return air channel 105 is connected to the hollow region 5, and the other end of the first return air channel 104 and the second return air channel 105 is connected to the outside. The connection between the first return air channel 104 and the hollow region 5 is located at the center of the hollow region 5, and the connection between the second return air channel 105 and the hollow region 5 is located at the edge of the hollow region 5.

[0063] In some specific embodiments of the present invention, reference is made to Figures 4 to 6 It also includes an air exchange block 13, a first pipeline 1301, and a second pipeline 1302. The air exchange block 13 has two non-communicating hollow cavities, namely the inner cavity 1303 and the outer cavity 1304. The connection between the first return air channel 104 and the hollow region 5 is the air inlet of the first return air channel 104, and the connection between the second return air channel 105 and the hollow region 5 is the air inlet of the second return air channel 105. The air inlet of the first return air channel 104 is located at the center of the first lower fixed plate 106, and the air inlet of the second return air channel 105 is configured as multiple small holes, which are evenly distributed on the first upper fixed plate. On the fixed plate 107, the first lower fixed plate 106 is hollow. The air inlet of the second return air channel 105 connects the hollow part of the first lower fixed plate 106 with the hollow area 5. The top surface of the first lower fixed plate 106 is provided with a first through hole, which connects the hollow part of the first lower fixed plate 106 with the outer cavity 1304 of the air exchange block 13. The middle of the first lower fixed plate 106 is provided with a second through hole, which connects the hollow area 5 with the inner cavity 1303 of the air exchange block 13. The first pipe 1301 and the second pipe 1302 respectively connect the inner cavity 1303 and the outer cavity 1304 to the outside. In use, the gas near the outer side of the hollow region 5 moves to the outside through the second return air channel 105, and the gas near the middle of the hollow region 5 moves to the outside through the first return air channel 104. The second return air channel 105 has multiple evenly spaced air inlets, which can promote a more stable airflow. The area of ​​the second through hole is larger than the total area of ​​the air inlets of the second return air channel 105. The first pipe 1301 is a straight pipe, which can quickly transport the gas in the middle of the hollow region 5 to the outside through the first return air channel 104, thus avoiding the problems of heat accumulation and pressure increase in the middle of the hollow region 5.

[0064] In addition, in order to promote the outward movement of gas within the hollow region 5, an air extraction device (not shown in the figure) can be connected to the end of the first pipe 1301 or the second pipe 1302 that is connected to the outside. The air extraction device (not shown in the figure) can assist the gas in moving to the outside. The air extraction device can be purchased commercially.

[0065] In other embodiments of the present invention, reference is made to Figures 3 to 5 The connection between the air intake channel 301 and the hollow region 5 is located near the connection between the second return air channel 105 and the hollow region 5.

[0066] In some other specific embodiments of the present invention, the air outlet of the air inlet channel 301 is the connection point between the air inlet channel 301 and the hollow region 5, and the air inlet of the second return air channel 105 is the connection point between the second return air channel 105 and the hollow region 5. The air outlets of the air inlet channel 301 are uniformly arranged in a plurality of positions, and the air inlets of the second return air channel 105 are also uniformly arranged in a plurality of positions. When the hollow region 5 is closed, the height of the air outlet of the air inlet channel 301 is lower than that of the air inlet of the second return air channel 105. This arrangement can guide the airflow entering the hollow region 5 through the air outlet of the air inlet channel 301 upward, and prevent the airflow entering the hollow region 5 through the air outlet of the air inlet channel 301 from impacting the target object 16 downward.

[0067] In some other embodiments of the present invention, reference is made to Figures 1 to 5 and Figure 9 The high-temperature heating device further includes a second moving mechanism 6, a third moving mechanism 7, and a carrying plate 8. The carrying plate 8 is disposed on the third moving mechanism 7 and is used to place the target object 16. The third moving mechanism 7 is used to move the target object 16 to the hollow area 5. The second moving mechanism 6 is used to move the target object 16 to the carrying plate 8, the first heating component 1, or the second heating component 2.

[0068] In some further embodiments of the present invention, the second moving mechanism 6 includes a lead screw and slider mechanism 601, a mounting plate 603, and three push rods 602. Since at least three points can form a stable structure on the target object 16, the push rods 602 are set to three, but not limited to three. The second heating assembly 2 and the carrying plate 8 are both provided with through holes or openings to avoid the push rods 602. The lead screw and slider mechanism 601 includes a motor, a lead screw, and a lead screw nut. The lead screw is rotatably mounted on the frame 12, and the lead screw nut is slidably mounted on the frame 12. On the lead screw, driven by the motor, the lead screw nut reciprocates on the lead screw. A mounting plate 603 is mounted on the lead screw nut, and three push rods 602 are vertically fixed on the mounting plate 603. The third moving mechanism 7 includes a motor, a driving wheel, a driven wheel, a belt, a slider, and a slide rail. The driving wheel is mounted on the rotating shaft of the motor, the driven wheel is rotatably mounted on the frame 12, the belt is wound around the driving wheel and the driven wheel, the slide rail is mounted on the frame 12 in a left-right direction, and the slider is slidably mounted... The slide rail is placed on the slide block, and the slider is mounted on the belt. As the motor rotates, the slider can reciprocate. The third moving mechanism 7 is a well-known technology in the art and will not be described in detail here. The carrying plate 8 is mounted on the slider. In use, the target object 16 is placed on the carrying plate 8, and then the motor is turned on. As the motor rotates, the carrying plate 8 can be moved into the hollow area 5. Then, the screw-slider mechanism 601 of the second moving mechanism 6 is turned on, which drives the fixed rod to lift the target object 16 on the carrying plate 8. At this time, the carrying plate 8 is moved out of the hollow area 5 by the motor. Then, the cylinder 401 of the first moving mechanism is turned on, which drives the side sealing plate 302 to move upward to close the hollow area 5. At the same time, the screw-slider mechanism 601 of the second moving mechanism 6 drives the fixed rod to move downward to place the target object 16 on the second heating component 2 to heat the target object 16. After heating is completed, the target object 16 can be removed by following the above steps.

[0069] Figure 8 for Figure 2 A schematic diagram of the cooling component.

[0070] In other embodiments of the present invention, reference is made to Figure 2 and Figure 8 The high-temperature heating device also includes a cooling component 9, which is disposed on the carrier plate 8 and is used to cool the target object 16.

[0071] In some other specific embodiments of the present invention, the lower side of the carrier plate 8 is provided with the arc-shaped groove, and the cooling component 9 includes a cooling pipe 902, two interfaces 903 and a water pump (not shown in the figure). The cooling pipe 902 is disposed in the arc-shaped groove, and the two interfaces 903 are respectively disposed at both ends of the cooling pipe 902. One interface 903 is connected to the water pump, and the water pump (not shown in the figure) is connected to a water source. The other interface 903 is directly connected to the water source. When in use, the water pump delivers water to the cooling pipe 902. The water moves through the loop of the cooling pipe 902 and returns to the water source. In the process, it can remove the heat from the target object 16 after it has been heated at a high temperature, thus accelerating the cooling of the target object 16.

[0072] It is worth noting that in actual use, the above methods are not the only way to cool down; other cooling mechanisms or refrigeration mechanisms can also be used.

[0073] In addition, water is used as the cooling material in this embodiment. Other coolants can be used in actual use, and other cooling mechanisms can also be set on the cooling component 9 to cool the water source.

[0074] In other embodiments of the present invention, reference is made to Figures 1 to 3 The high-temperature heating device further includes a heat insulation component 10, which is located between at least one of the first heating component 1 or the second heating component 2 and the second moving mechanism 6.

[0075] In some other specific embodiments of the present invention, the heat insulation component 10 includes a first heat insulation plate 1001, which is disposed on the lower side of the second heating component 2 and on the upper side of the cylinder 401 of the first moving mechanism and the lead screw slider mechanism 601 of the second moving mechanism 6. The first heat insulation plate 1001 can reduce the impact of the heat generated by the first heating component and the second heating component 2 on other structures on the frame 12.

[0076] In addition, the heat insulation assembly 10 also includes a second heat insulation plate 1002, two third heat insulation plates 1003, and a top plate 1004. The second heat insulation plate 1002 is disposed on the right side of the first heating assembly 1 and the second heating assembly 2, and the second heat insulation plate 1002 is provided with an opening for the carrying plate 8 to pass through. The two third heat insulation plates 1003 are disposed on the front and rear sides of the first heating assembly 1 and the second heating assembly 2. The top plate 1004 is disposed on the upper side of the second heat insulation plate 1002 and the two third heat insulation plates 1003. In this way, the first heating assembly 1 and the second heating assembly 2 are placed in the space surrounded by the heat insulation plates and the top plate 1004, reducing heat loss and the impact of heat on the structure of the frame 12.

[0077] It is worth mentioning that, in actual use, a blower mechanism can be installed on the first heat insulation plate 1001 and the frame 12 to drive airflow, accelerate the air circulation rate between the heating component and the frame 12, and reduce the temperature impact of the heating component on other components.

[0078] In some further embodiments of the present invention, reference is made to Figure 3 The carrying plate 8 is provided with a plurality of anti-slip protrusions 801. In some further specific embodiments of the present invention, the carrying plate 8 is provided with a plurality of grooves, and the plurality of anti-slip protrusions 801 are disposed in each of the grooves of the carrying plate 8.

[0079] In some other embodiments of the present invention, reference is made to Figure 3 The anti-slip protrusion 801 is composed of rubber material and polymer material.

[0080] In some specific embodiments of the present invention, a portion of the anti-slip protrusions 801 are made of rubber, while another portion of the anti-slip protrusions 801 are made of polymer materials.

[0081] In some other embodiments of the present invention, reference is made to Figures 4 to 6 The high-temperature heating device also includes a negative pressure mechanism 11, which is connected to the return gas channel 101. The negative pressure mechanism 11 is used to drive the gas flow in the hollow region 5.

[0082] In some further specific embodiments of the present invention, reference is made to Figures 2 to 5The negative pressure mechanism 11 includes a vacuum generator 1101 and a third pipeline 1102. The vacuum generator 1101 is a vacuum component that uses a positive pressure gas source to generate negative pressure and is commercially available. The vacuum generator 1101 is installed on the second pipeline 1302. One end of the third pipeline 1102 is connected to the vacuum generator 1101, and the other end is connected to the outside. In one state, the vacuum generator 1101 is closed, and the gas in the second return gas channel 105 flows through the vacuum generator 1101 and the second pipeline 1302 to the outside. At this time, the vacuum generator 1101 does not function. In another state, the vacuum generator 1101 is open, and part of the gas in the second return gas channel 105 flows through the vacuum generator 1101 and the second pipeline 1302 to the outside, while the other part flows through the vacuum generator 1101 and the third pipeline 1102 to the outside. At this time, the vacuum generator 1101 can accelerate the airflow.

[0083] In addition, the negative pressure mechanism 11 also includes a fourth pipeline 1103 and a wind pressure monitoring mechanism (not shown in the figure). The wind pressure monitoring mechanism is connected to the outer cavity 1304 of the ventilation block 13. The wind pressure monitoring mechanism can detect the pressure of the outer cavity 1304. The wind pressure monitoring mechanism can be purchased on the market. This setting can provide the vacuum generator 1101 with the wind pressure value for opening or closing for reference. For example, when the pressure of the outer cavity 1304 is lower than a certain value, the vacuum generator 1101 is closed, and when the pressure of the outer cavity 1304 is higher than a certain value, the vacuum generator 1101 is opened, which facilitates the control of the pressure in the hollow area 5.

[0084] Figure 12 This is a schematic diagram of the structure of the second heating component and the sealing component in the second embodiment of the present invention;

[0085] In some embodiments of the present invention, reference is made to Figure 2 , Figure 3 , Figure 12 , Figure 12 and Figure 11 The difference is that the high-temperature heating device further includes a support plate 14, which is disposed on the first heating component 1 or the second heating component 2, and the support plate 14 is located in the hollow region 5. The support plate 14 is spaced apart from both the first heating component 1 and the second heating component 2. The support plate 14 is used to set the target object 16.

[0086] In some specific embodiments of the present invention, reference is made to Figure 2 and Figure 12The support plate 14 is mounted on the second heating component 2 via a fixing post 1401. The target object 16 is placed on the support plate 14. This arrangement ensures that the area heated by the first heating component 1 is the area between the first heating component 1 and the target object 16, the area heated by the second heating component 2 is the area between the second heating component 2 and the target object 16, and the area heated by the side sealing plate 302 is the area between the side sealing plate 302 and the target object 16. This arrangement ensures that the first heating component 1, the second heating component 2, and the side sealing plate 302 are not in direct contact with each other, further improving the uniformity of heating and enhancing air circulation between the second heating component 2 and the target object 16.

[0087] Figure 13 This is a schematic diagram of the sealing assembly in the third embodiment of the present invention.

[0088] In some embodiments of the present invention, reference is made to Figure 2 , Figure 10 and Figure 13 , Figure 13 and Figure 10 The difference is that the sealing assembly 3 further includes a third heating wire 15, the side sealing plate 302 is provided with a mounting groove, and the third heating wire 15 is disposed in the mounting groove.

[0089] In some specific embodiments of the present invention, reference is made to Figures 2 to 4 and Figure 13 The mounting groove is annularly arranged within the side sealing plate 302, and the third heating wire 15 is disposed within the mounting groove and electrically connected to a power source. The third heating wire 15 is configured to heat the area of ​​the side sealing plate 302, and the temperature that the side sealing plate 302 can be heated can be adjusted by changing the power of the third heating wire 15. This facilitates temperature control and balances the temperatures that the first heating component 1, the second heating component 2, and the side sealing plate 302 can heat, thereby improving the heating uniformity of the target object 16 within the hollow region 5.

[0090] It is worth noting that, in actual design, the gas replenishment chamber 103 and the gas replenishment channel 102 can also be located on the second heating component 2, with the second heating component 2 preheating the replenished gas. Alternatively, the gas replenishment channel 102 can be located on the sealing component 3, with the third heating wire 15 directly preheating the replenished gas.

[0091] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A high-temperature heating device, applied to a target object, characterized in that, include: A first heating component, a second heating component, a sealing component, and a first driving mechanism; The first heating component and the second heating component are disposed opposite to each other, and there is a hollow area between the first heating component and the second heating component. Either the first heating component or the second heating component is used to support the target object, and the first heating component is used to heat the surface of the target object close to the first heating component, and the second heating component is used to heat the surface of the target object close to the second heating component. The sealing component is disposed on the first driving mechanism and on the periphery of the hollow region. The sealing component is used to close the hollow region and to heat the surface of the target object near the sealing component. The first driving mechanism is used to drive the sealing component to move.

2. The high-temperature heating device according to claim 1, characterized in that, The first heating component or the second heating component is provided with a return air channel, one end of which is connected to the hollow area and the other end of which is connected to the outside.

3. The high-temperature heating device according to claim 2, characterized in that, The first heating component or the second heating component is provided with a gas replenishment channel, and the gas replenishment channel is located on one side of the heating part of the first heating component or the heating part of the second heating component. The sealing component is provided with an air intake channel communicating with the gas replenishment channel, and the air intake channel is communicating with the hollow area.

4. The high-temperature heating device according to claim 3, characterized in that, The first heating component or the second heating component is provided with an air replenishment chamber, which is connected to the air replenishment channel, and the air replenishment chamber is located on one side of the heating part of the first heating component or the second heating component.

5. The high-temperature heating device according to claim 3, characterized in that, The return gas passage includes: a first return gas passage and a second return gas passage; One end of the first return air channel and the second return air channel are connected to the hollow region, and the other end of the first return air channel and the second return air channel are connected to the outside. The connection between the first return air channel and the hollow region is located at the center of the hollow region, and the connection between the second return air channel and the hollow region is located at the edge of the hollow region.

6. The high-temperature heating device according to claim 5, characterized in that, The connection between the air intake channel and the hollow region is located near the connection between the second return air channel and the hollow region.

7. The high-temperature heating device according to any one of claims 1 to 6, characterized in that, It also includes a second moving mechanism, a third moving mechanism, and a cargo platform; The carrying plate is disposed on the third moving mechanism, the carrying plate is used to place the target object, and the third moving mechanism is used to move the target object to the hollow area; The second moving mechanism is used to move the target object to the carrier plate, the first heating component, or the second heating component.

8. The high-temperature heating device according to claim 7, characterized in that, It also includes cooling components; The cooling component is disposed on the carrier plate and is used to cool the target object.

9. The high-temperature heating device according to claim 7, characterized in that, It also includes thermal insulation components; The heat insulation component is located between at least one of the first heating component or the second heating component and the second moving mechanism.

10. The high-temperature heating device according to claim 7, characterized in that, The loading plate is provided with several anti-slip protrusions.

11. The high-temperature heating device according to claim 10, characterized in that, The anti-slip protrusions are composed of rubber and polymer materials.

12. The high-temperature heating device according to claim 3, characterized in that, It also includes a negative pressure mechanism; The negative pressure mechanism is connected to the return gas channel, and the negative pressure mechanism is used to drive the gas flow in the hollow area.

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