A line fault location simulation device

Abstract

The application discloses a line fault distance measurement simulation device, which comprises simulation modules for simulating A, B and C phases respectively, a time service module, a single-chip microcomputer, a wireless transmission module and a workstation PC, wherein each simulation module comprises a load, a power supply, a current sampling resistor, a current sampling resistor, a plurality of line units, a fault impedance and an ADC module; wherein the line unit comprises glass fiber hollow conductors and a supporting ring; each line unit is composed of a plurality of glass fiber hollow conductors, the glass fiber hollow conductors are connected at the head and tail and are wound in a zigzag mode, are arranged in two layers, are uniformly arranged along the circumference and are connected with other units through lead-out wires. By closing different fault impedances, single-phase short-circuit faults at different positions can be simulated, the difference between an actual fault simulation position and a calculation result is compared, and thus the effectiveness of a traveling wave distance measurement algorithm is verified, so that the technical problem that the prior art cannot accurately simulate power transmission line fault distance measurement is solved.

Description

Technical Field

[0001] This application relates to the field of power technology, and in particular to a line fault location simulation device. Background Technology

[0002] Line fault location devices are a common monitoring equipment in power systems. Their working principle involves installing current acquisition devices on both sides of the transmission line. When a fault occurs on the transmission line, a high-frequency current signal is generated at the fault point. By measuring the time it takes for this high-frequency current signal to reach both sides of the line, the specific fault point can be calculated. This method is called traveling wave ranging. However, because the transmission speed of traveling waves in transmission lines is close to the speed of light, a long conductor is needed to simulate the traveling wave ranging process. Using ordinary coils to manufacture simulation devices results in inductance, resistance, and capacitance parameters that differ significantly from actual equipment, making it difficult to generate an effective traveling wave. Summary of the Invention

[0003] The purpose of this application is to provide a line fault location simulation device to solve the technical problem that the existing technology cannot accurately simulate the fault location of transmission lines.

[0004] In view of this, this application provides a line fault location simulation device, comprising: a simulation module for simulating phases A, B and C respectively, a timing module, a microcontroller, a wireless transmission module and a workstation PC, wherein each of the simulation modules includes: a load, a power supply, a first current sampling resistor, a second current sampling resistor, several line units, a fault impedance and an ADC module.

[0005] The circuit unit includes: hollow fiberglass conductors and a support ring; each circuit unit is composed of several hollow fiberglass conductors, which are connected end to end and wound in a Z-shape, arranged in two layers, evenly distributed along the circumference, and connected to other units through lead wires; the support ring is supported by a fiberglass board to maintain the shape of the circuit unit; the circuit unit is cylindrical in shape to facilitate ventilation and heat dissipation;

[0006] The load and the power supply are connected in sequence by: a first current sampling resistor, a plurality of line units, and a second current sampling resistor; wherein, an ADC module is connected between the first current sampling resistor and the connected line unit, and an ADC module is connected between the second current sampling resistor and the connected line unit; a fault impedance is connected between two line units.

[0007] The microcontroller obtains a pulse with a precision of 1ns through the timing module, which is used to compress the waveform signal collected by the ADC module into a data packet and send it to the workstation PC through the wireless transparent transmission module.

[0008] The workstation PC is used to receive the waveform signal from the microcontroller and calculate the phase difference of the waveform signal, thereby completing the simulation of line fault location.

[0009] Optionally, the hollow glass fiber conductor specifically includes: a glass fiber tube, a copper foil layer, and a polyimide film;

[0010] The glass fiber tube serves as a support to maintain the shape of the glass fiber hollow conductor; the copper foil layer is used to carry the test current; and the polyimide film is used for insulation between the conductors to prevent short circuits between the glass fiber hollow conductors caused by foreign objects.

[0011] Optionally, the hollow glass fiber conductors are connected end-to-end and wound in a zigzag pattern, specifically including:

[0012] Each of the glass fiber hollow conductors is connected by soldering with soft copper wire and wound in a Z-shape to form a complete circuit.

[0013] Optionally, each of the simulation modules contains 6 circuit units, each circuit unit consisting of 180 glass fiber hollow conductors with a length of 1960mm.

[0014] Optionally, the load is a 50kVA 10kV three-phase distribution transformer used to simulate the user load in a real system.

[0015] Optionally, the power supply capacity is 30kVA and it is a 10kV three-phase test transformer.

[0016] Optionally, the fault impedance is a 1Ω 10kW stainless steel resistor, and the fault impedance is connected in series with a 10kV 630A vacuum circuit breaker to simulate a line fault.

[0017] Optionally, both the first current sampling resistor and the second current sampling resistor are 1mΩ cement resistors.

[0018] Optionally, the ADC module is an AD9220 with a sampling rate of 10MHz and a sampling accuracy of 12bi.

[0019] Optionally, the microcontroller is an STM32H750.

[0020] Compared with the prior art, the advantages of the embodiments of this application are as follows:

[0021] This application provides a line fault location simulation device, comprising: a simulation module simulating phases A, B, and C respectively; a timing module; a microcontroller; a wireless transmission module; and a workstation PC. Each simulation module includes: a load, a power supply, a first current sampling resistor, a second current sampling resistor, several line units, a fault impedance, and an ADC module. Each line unit includes: hollow fiberglass conductors and a support ring. Each line unit is composed of several hollow fiberglass conductors, which are connected end-to-end and wound in a Z-shape, arranged in two layers, uniformly distributed along the circumference, and connected to other units via lead wires. The support ring is supported by a fiberglass board and is used to maintain the line unit. Appearance: The circuit unit is cylindrical for easy ventilation and heat dissipation. The load and power supply are connected sequentially to: a first current sampling resistor, several circuit units, and a second current sampling resistor. An ADC module is connected between the first current sampling resistor and the connected circuit unit, and the same ADC module is connected between the second current sampling resistor and the connected circuit unit. A fault impedance is connected between two circuit units. The microcontroller acquires pulses with 1ns precision via a timing module, which are used to compress the waveform signals acquired by the ADC module into data packets and transmit them to the workstation PC via a wireless pass-through module. The workstation PC receives the waveform signals from the microcontroller and calculates the phase difference of the waveform signals, thereby simulating line fault location.

[0022] Compared with existing technologies, the line fault location simulation device of this application can simulate single-phase short-circuit faults at different locations by closing different fault impedances. By comparing the differences between the actual simulated fault location and the calculated results, the effectiveness of the traveling wave location algorithm is verified. This solves the technical problem that existing technologies cannot accurately simulate transmission line fault location. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a line fault location simulation device provided in an embodiment of this application;

[0025] Figure 2 A front view of a circuit unit provided in an embodiment of this application;

[0026] Figure 3 A partial enlarged view of a circuit unit provided in an embodiment of this application;

[0027] Figure 4 A cross-sectional view of a glass fiber hollow conductor for a circuit unit provided in this application embodiment;

[0028] Figure 5 This is a schematic diagram of the circuit unit of an analog module provided in an embodiment of this application.

[0029] Labels: 1. Device bracket; 2. Phase A circuit unit; 3. Phase B circuit unit; 4. Phase C circuit unit; 5. Support ring; 6. Glass fiber hollow conductor; 8. Load capacitor; 9. 4.5mm glass fiber tube; 10. 0.1mm copper foil layer; 11. 0.1mm polyimide film. Detailed Implementation

[0030] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] Please see Figure 1 This application provides a line fault location simulation device, including: a simulation module for simulating phases A, B and C respectively, a timing module, a microcontroller, a wireless transmission module and a workstation PC, wherein each simulation module includes: a load, a power supply, a first current sampling resistor, a second current sampling resistor, several line units, a fault impedance and an ADC module.

[0034] The circuit unit includes: glass fiber hollow conductors and support rings; each circuit unit is composed of several glass fiber hollow conductors, which are connected end to end and wound in a Z-shape, arranged in two layers, evenly distributed along the circumference, and connected to other units through lead wires; the support ring is supported by a glass fiber board to maintain the shape of the circuit unit; the circuit unit is cylindrical in shape to facilitate ventilation and heat dissipation.

[0035] like Figure 2 As shown, 5 is the support ring, and 6 is the glass fiber hollow conductor. Each circuit unit consists of 180 glass fiber hollow conductors, each 1960mm long, wound in a Z-shape and arranged in two layers, with 90 conductors in each layer, evenly distributed along the circumference. This winding method eliminates mutual inductance between conductors, retaining only the self-inductance, thus ensuring that the impedance characteristics of the circuit unit remain consistent with the actual circuit. The support ring is supported by a glass fiber board to maintain the shape of the circuit unit. The circuit unit is cylindrical in shape for easy ventilation and heat dissipation.

[0036] like Figure 3 As shown, Figure 3 This is a magnified view of a partial circuit unit. 6 is a glass fiber hollow conductor, 7 is a support ring, and 8 is a lead wire. It can be seen that the hollow conductors are connected end-to-end to form a complete loop, which is connected to other circuit units and fault impedances via the lead wire. The ends of the hollow conductors are soldered with soft copper wire.

[0037] The load and the power supply are connected in sequence as follows: a first current sampling resistor, several line units, and a second current sampling resistor; wherein, an ADC module is connected between the first current sampling resistor and the connected line unit, and an ADC module is connected between the second current sampling resistor and the connected line unit; a fault impedance is connected between the two line units.

[0038] The microcontroller obtains pulses with a precision of 1ns through the timing module, which are used to compress the waveform signals acquired by the ADC module into data packets and send them to the workstation PC through the wireless transparent transmission module.

[0039] The workstation PC is used to receive waveform signals from the microcontroller and calculate the phase difference of the waveform signals, thereby completing the simulation of line fault location.

[0040] It should be noted that the power supply in this embodiment is a 10kV three-phase test transformer with a capacity of 30kVA; the current sampling resistor is a 1mΩ cement resistor; the ADC module is an AD9220 with a sampling rate of 10MHz and a sampling accuracy of 12bi; the fault impedance is a 1Ω 10kW stainless steel resistor, and a 10kV 630A vacuum circuit breaker is connected in series with the fault impedance to simulate a line fault; the load is a 50kVA 10kV three-phase distribution transformer to simulate the user load in the real system; the microcontroller is an STM32H750, which is used to compress the waveform signal acquired by the ADC into a data packet and send it to the workstation PC through the 485 wireless pass-through module; the 485 wireless pass-through module is a 24L01 module, which converts the 485 signal into a wireless signal for transmission to simulate the wireless communication link in the actual system; the timing module is an RDN003 Beidou satellite timing module, which can provide pulses with an accuracy of 1ns; the workstation is a regular PC, which receives the current pulse waveform signals acquired by the microcontrollers on both sides through the 485 wireless pass-through module and calculates the phase difference of the signal.

[0041] Based on this topology, a complete line fault location simulation device can be constructed. By switching different fault impedances, single-phase short-circuit faults at different locations can be simulated. By comparing the differences between the actual simulated fault locations and the calculated results, the effectiveness of the traveling wave fault location algorithm can be verified. For example, as... Figure 1 As shown, closing fault impedance 1 simulates a short-circuit fault at 360 meters on phase A line, and closing fault impedance 3 simulates a short-circuit fault at 1080 meters on the line.

[0042] In one embodiment, the glass fiber hollow conductor specifically includes: a glass fiber tube, a copper foil layer, and a polyimide film;

[0043] The glass fiber tube provides support to maintain the shape of the glass fiber hollow conductor; the copper foil layer is used to carry the test current; and the polyimide film is used for insulation between the conductors to prevent short circuits between the glass fiber hollow conductors caused by foreign objects.

[0044] It should be noted that, as Figure 4 As shown, Figure 4This is a cross-sectional diagram of the glass fiber hollow conductor used in the circuit unit. 9 is a 4.5mm glass fiber tube, 10 is a 0.1mm copper foil layer, and 11 is a 0.1mm polyimide film. The glass fiber tube provides support to maintain the shape of the hollow conductor, ensuring that the individual hollow conductors in the circuit unit do not deform severely due to gravity, thus affecting the overall electrical parameters. The copper foil layer is used to carry the test current. When a fault current passes through, because the fault current is high-frequency, the current will concentrate on the outer layer of the conductor due to the skin effect. Therefore, using thin copper foil as the conductor can meet the fault current carrying capacity while reducing the consumption of metal materials and lowering the cost of the device. The polyimide film is used for insulation between conductors to prevent short circuits between the hollow conductors caused by foreign objects, which would affect the electrical parameters. The hollow conductor is manufactured by using a winding machine to wind the copper foil and polyimide film onto the glass fiber tube in two stages.

[0045] In one implementation, such as Figure 5 As shown, Figure 5 This is a structural diagram of the circuit unit of the simulation module. 1 is the device support, 2 is the A-phase circuit unit (numbers 1-6), 3 is the B-phase circuit unit (numbers 7-12), and 4 is the C-phase circuit unit (numbers 13-18). The device support is made of fiberglass board. The entire simulation circuit has 18 circuit units. The length, width, and height of the simulation circuit device are 2000mm, 760mm, and 2160mm, respectively, which is convenient for laboratory placement and use. All circuit units adopt a hollow structure to facilitate heat dissipation.

[0046] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A line fault location simulation device, characterized in that, include: The system includes a simulation module, a timing module, a microcontroller, a wireless transmission module, and a workstation PC that respectively simulate phases A, B, and C. Each of the simulation modules includes: a load, a power supply, a first current sampling resistor, a second current sampling resistor, several line units, a fault impedance, and an ADC module. The circuit unit includes: hollow fiberglass conductors and a support ring; each circuit unit is composed of several hollow fiberglass conductors, which are connected end to end and wound in a Z-shape, arranged in two layers, evenly distributed along the circumference, and connected to other units through lead wires; the support ring is supported by a fiberglass board to maintain the shape of the circuit unit; the circuit unit is cylindrical in shape to facilitate ventilation and heat dissipation; The load and the power supply are connected in sequence by: a first current sampling resistor, a plurality of line units, and a second current sampling resistor; wherein, an ADC module is connected between the first current sampling resistor and the connected line unit, and an ADC module is connected between the second current sampling resistor and the connected line unit; a fault impedance is connected between two line units. The microcontroller obtains pulses with a precision of 1ns through the timing module, which are used to compress the waveform signals collected by the ADC module into data packets and send them to the workstation PC through the wireless transmission module. The workstation PC is used to receive the waveform signal from the microcontroller and calculate the phase difference of the waveform signal, thereby completing the simulation of line fault location.

2. The line fault location simulation device according to claim 1, characterized in that, The glass fiber hollow conductor specifically includes: a glass fiber tube, a copper foil layer, and a polyimide film; The glass fiber tube serves as a support to maintain the shape of the glass fiber hollow conductor; the copper foil layer is used to carry the test current; and the polyimide film is used for insulation between the conductors to prevent short circuits between the glass fiber hollow conductors caused by foreign objects.

3. The line fault location simulation device according to claim 1, characterized in that, The glass fiber hollow conductors are connected end to end and wound in a Z-shape, specifically including: Each of the glass fiber hollow conductors is connected by soldering with soft copper wire and wound in a Z-shape to form a complete circuit.

4. The line fault location simulation device according to claim 1, characterized in that, Each of the aforementioned simulation modules contains 6 circuit units, and each circuit unit is composed of 180 glass fiber hollow conductors with a length of 1960mm.

5. The line fault location simulation device according to claim 1, characterized in that, The load is a 50kVA 10kV three-phase distribution transformer, used to simulate the user load in a real system.

6. The line fault location simulation device according to claim 1, characterized in that, The power source is a 10kV three-phase test transformer with a capacity of 30kVA.

7. The line fault location simulation device according to claim 1, characterized in that, The fault impedance is a 1Ω 10kW stainless steel resistor, and a 10kV 630A vacuum circuit breaker is connected in series with the fault impedance to simulate a line fault.

8. The line fault location simulation device according to claim 1, characterized in that, Both the first current sampling resistor and the second current sampling resistor are 1mΩ cement resistors.

9. The line fault location simulation device according to claim 1, characterized in that, The ADC module is an AD9220 with a sampling rate of 10MHz and a sampling accuracy of 12bi.

10. The line fault location simulation device according to claim 1, characterized in that, The microcontroller used is STM32H750.

Images