Polarizing sheet, display panel, and display device

Abstract

The embodiment of the present application discloses a polarizer, a display panel and a display device, the polarizer comprises a first surface, a second surface and a first side surface connected with the first surface and the second surface, the first side surface comprises an inclined surface close to the first surface and a parallel surface away from the first surface, the inclined surface is continuous with the parallel surface, the polarizer further comprises a first adhesive layer, the inclined surface comprises a first inclined sub-surface, the first inclined sub-surface is located on the side of the first adhesive layer close to the first surface, the first inclined sub-surface forms a first acute angle with the plane where the first surface is located, and the first acute angle is an acute angle, through the arrangement of the first inclined sub-surface and the first acute angle formed between the first inclined sub-surface and the plane where the first substrate is located, the contact between the chip on film and the first adhesive layer in the manufacturing process of the display device is reduced, the damage and pollution of the chip on film are improved, and the product yield of the display device is improved.

Description

Technical Field

[0001] This invention relates to the field of displays, and more specifically to a polarizer, a display panel, and a display device. Background Technology

[0002] Currently, narrow bezels or even borderless designs are a major development trend in display devices, such as televisions. (See also...) Figure 1 To achieve a borderless display, existing display devices typically place the array substrate 21 of the display panel 20 on the side of the color filter substrate away from the backlight module. The edge of the polarizer 30, which is adhered to the side of the array substrate 21 away from the color filter substrate, extends beyond the edge of the array substrate 21, exposing the adhesive layer that bonds the polarizer 30 to the array substrate 21. During the manufacturing process of the display device, the flip-chip film 40, which is fixed to one end of the array substrate 21, may come into contact with the adhesive layer due to movement, packaging, or assembly, causing the flip-chip film 40 to stick to the adhesive layer. This results in the flip-chip film 40 being contaminated or damaged, affecting the product yield of the display device.

[0003] Therefore, there is an urgent need for a polarizer, display panel, and display device to solve the above-mentioned technical problems. Summary of the Invention

[0004] This invention provides a polarizer, a display panel, and a display device, which can alleviate the technical problem of contamination or damage caused by the contact between the flip-chip film and the adhesive layer of the polarizer adhered to the side of the array substrate away from the color filter substrate during the manufacturing process of the display device, thus affecting the product yield of the display device.

[0005] This invention provides a polarizer, comprising:

[0006] A first surface, a second surface, and a first side surface, wherein the first surface and the second surface are disposed opposite to each other, and the first side surface is connected to the first surface and the second surface;

[0007] The first side surface includes an inclined surface close to the first surface and a parallel surface away from the first surface, wherein the inclined surface and the parallel surface are continuous.

[0008] The polarizer further includes a first adhesive layer, and the inclined surface includes a first inclined sub-surface. The first inclined sub-surface is located on the side of the first adhesive layer close to the first surface. The first inclined sub-surface forms a first chamfer with the plane where the first surface is located. The first chamfer is an acute angle.

[0009] Preferably, the polarizer further includes a first optical layer located on the side of the first adhesive layer away from the first surface;

[0010] The first optical layer includes a first sub-part closer to the first adhesive layer and a second sub-part farther from the first adhesive layer.

[0011] The inclined surface further includes a second inclined sub-surface, which is located on the side of the first sub-part closer to the first surface. The second inclined sub-surface forms a second chamfer with the plane containing the first surface, and the second chamfer is an acute angle.

[0012] Preferably, the angle of the first chamfer is greater than or equal to 8°, and the angle of the first chamfer is less than or equal to 61°.

[0013] Preferably, the first inclined sub-surface and the second inclined sub-surface are coplanar.

[0014] Preferably, the thickness of the first adhesive layer is greater than or equal to 5 micrometers, or less than or equal to 25 micrometers.

[0015] The thickness of the first sub-part is greater than or equal to 10 micrometers, and the thickness of the first sub-part is less than or equal to 50 micrometers.

[0016] Preferably, the storage elastic modulus of the first adhesive layer is greater than or equal to 100 kPa, and the first adhesive layer does not contain an antistatic agent.

[0017] This application also provides a display panel, including:

[0018] The first polarizer is any of the aforementioned polarizers;

[0019] A first substrate is located on the side of the first surface of the first polarizer that is away from the second surface of the first polarizer; and,

[0020] A flip-chip film, wherein the flip-chip film is bonded to one side of the first substrate near the first side of the first polarizer.

[0021] Preferably, the angle range of the first chamfer angle of the first polarizer is:

[0022]

[0023] Wherein, α1 is the first chamfer, D1 is the length of the orthographic projection of the inclined surface onto the plane where the parallel surface is located, D1 is greater than or equal to the thickness of the first adhesive layer, the first substrate includes a second side surface near the first side surface, and the plane where the parallel surface is located is parallel to the plane where the second side surface is located.

[0024] D2 is the thickness of the first substrate;

[0025] W1 is the distance between the plane containing the second side and the plane containing the parallel plane. The distance between the plane containing the second side and the plane containing the parallel plane is greater than or equal to 0.1 mm, and the distance between the plane containing the second side and the plane containing the parallel plane is less than or equal to 0.4 mm.

[0026] Preferably, the angle range of the first chamfer angle of the first polarizer is:

[0027]

[0028] Wherein, D3 is the thickness of the first adhesive layer, D4 is the thickness of the first optical layer of the first polarizer, and P1 is the ratio of the thickness of the first sub-part of the first optical layer to the thickness of the first optical layer.

[0029] The present invention also provides a display device, comprising:

[0030] Any of the aforementioned display panels; and,

[0031] The backlight module is located on the side of the first substrate of the display panel away from the first polarizer of the display panel.

[0032] The present invention reduces the contact between the flip-chip film and the first adhesive layer during the manufacturing process of the display device by setting a first inclined sub-surface, and the first chamfer formed by the first inclined sub-surface and the plane where the first substrate is located is an acute angle, thereby improving the damage and contamination of the flip-chip film and increasing the product yield of the display device. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of an existing display device.

[0035] Figure 2 This is a schematic diagram of a polarizer provided in an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the first structure of the display device provided in the embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of a second structure of the display device provided in an embodiment of the present invention;

[0038] Figure 5This is a schematic diagram of a third structure of the display device provided in an embodiment of the present invention;

[0039] Figure 6 This is a flowchart of the steps in the method for manufacturing a polarizer provided in an embodiment of the present invention;

[0040] Figures 7A to 7E This is a schematic flowchart of the method for manufacturing a polarizer provided in an embodiment of the present invention. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. In the present invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0042] Currently, because the edge of the polarizer adhered to the side of the array substrate away from the color filter substrate extends beyond the edge of the array substrate, there is a problem in the manufacturing process of the display device where the adhesive layer between the flip-chip film and the polarizer adheres, causing damage or contamination to the flip-chip film and affecting the product yield.

[0043] Please see Figures 2 to 5 This invention provides a polarizer 300, comprising:

[0044] A first surface, a second surface, and a first side surface, wherein the first surface and the second surface are disposed opposite to each other, and the first side surface is connected to the first surface and the second surface;

[0045] The first side surface includes an inclined surface 301 close to the first surface and a parallel surface 302 away from the first surface, wherein the inclined surface 301 and the parallel surface 302 are continuous.

[0046] The polarizer 300 further includes a first adhesive layer 310, and the inclined surface 301 includes a first inclined sub-surface 301a. The first inclined sub-surface 301a is located on the side of the first adhesive layer 310 close to the first surface. The first inclined sub-surface 301a forms a first chamfer with the plane where the first surface is located. The first chamfer is an acute angle.

[0047] The present invention reduces the contact between the flip-chip film and the first adhesive layer during the manufacturing process of the display device by setting a first inclined sub-surface, and the first chamfer formed by the first inclined sub-surface and the plane where the first substrate is located is an acute angle, thereby reducing the damage and contamination of the flip-chip film and improving the product yield of the display device.

[0048] In some embodiments, the polarizer 300 further includes a first optical layer 320 located on the side of the first adhesive layer 310 away from the first surface.

[0049] The first optical layer 320 includes a first sub-part 320a on the side close to the first adhesive layer 310 and a second sub-part 320b on the side away from the first adhesive layer 310.

[0050] The inclined surface 301 further includes a second inclined sub-surface 301b, which is located on the side of the first sub-part 320a close to the first surface. The second inclined sub-surface 301b forms a second chamfer with the plane containing the first surface, and the second chamfer is an acute angle.

[0051] In some embodiments, the thickness of the first optical layer 320 is greater than or equal to 20 micrometers, and the thickness of the first optical layer 320 is less than or equal to 100 micrometers, for example: 30 micrometers, 38 micrometers, 48 ​​micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, etc.; preferably, the thickness of the first optical layer 320 is greater than or equal to 38 micrometers to 48 micrometers, for example: the thickness of the first optical layer 320 is 40 micrometers, 42 micrometers, 44 micrometers, 45 micrometers, 46 micrometers, etc.

[0052] In some embodiments, the first optical layer 320 is a wide-viewing-angle layer, and the material of the wide-viewing-angle layer can be a resin-based optical thin film material, such as COP (Cycloolefin copolymer), TAC (Triacetate Cellulose), PMMA (Polymethyl Methacrylate), etc. The wide-viewing-angle layer is used to adjust the phase difference of light from the display panel in the plane where the display panel is located and to adjust the phase difference of light from the display panel in a plane perpendicular to the plane where the display panel is located, thereby increasing the viewing angle range of the display device.

[0053] By setting the second inclined sub-surface 301b, the contact point between the flip-chip film and the polarizer 300 is further moved away from the first adhesive layer 310, which helps to further reduce damage and contamination of the flip-chip film and improve the product yield of the display device.

[0054] In some embodiments, the angle of the first chamfer is greater than or equal to 8°, and the angle of the first chamfer is less than or equal to 61°. For example, the angle of the first chamfer can be 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, or 60°. This helps to avoid contact between the flip-chip film 400 and the first adhesive layer 310, reduce contamination and damage caused by the first adhesive layer 310, and improve the product quality and yield of the display device.

[0055] In some embodiments, the angle range of the second chamfer is greater than 0° and less than 90°. For example, the angle of the second chamfer can be 5°, 8°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 75°, 80°, 85°, etc. Preferably, the angle range of the second chamfer is the same as the angle range of the first chamfer.

[0056] Please see Figure 4 In some embodiments, the first inclined sub-surface 301a and the second inclined sub-surface 301b are coplanar. This coplanarity of the first inclined sub-surface 301a and the second inclined sub-surface 301b is beneficial to reduce the contamination or damage to the flip-chip film caused by the first adhesive layer 310 while the inclined surface 301 is cut and formed in one go, simplifying the processing technology of the polarizer 300.

[0057] In some embodiments, the thickness of the first adhesive layer 310 is greater than or equal to 5 micrometers, or less than or equal to 25 micrometers. For example, the thickness of the first adhesive layer 310 is 10 micrometers, 15 micrometers, 20 micrometers, etc.

[0058] The thickness of the first sub-part 320a is greater than or equal to 10 micrometers, and the thickness of the first sub-part 320a is less than or equal to 50 micrometers. For example, the thickness of the first sub-part 320a is 15 micrometers, 20 micrometers, 22 micrometers, 23 micrometers, 30 micrometers, 35 micrometers, 40 micrometers, 45 micrometers, etc.; preferably, the thickness of the first sub-part 320a is 19 micrometers to 24 micrometers, for example, the thickness of the first sub-part 320a is 20 micrometers, 22 micrometers, 23 micrometers, etc.

[0059] In some embodiments, the storage elastic modulus of the first adhesive layer 310 is greater than or equal to 100 kPa, for example, the storage elastic modulus of the first adhesive layer 310 can be 150 kPa, 300 kPa, 400 kPa, 500 kPa, etc. When the storage elastic modulus of the first adhesive layer 310 is less than 100 kPa, the hardness of the first adhesive layer 310 is low, and it is more likely to deform and break when the first adhesive layer 310 is subjected to external force, which can easily cause some of the material of the first adhesive layer 310 to transfer to the structure in contact with the first adhesive layer 310 (such as the flip-chip film 400), causing contamination and damage to other structures. When the storage elastic modulus of the first adhesive layer 310 is greater than or equal to 100 kPa, the hardness of the first adhesive layer 310 is sufficient, which helps to reduce the risk of the first adhesive layer 310 causing contamination and damage to other structures, and improves the product yield of the display device 10.

[0060] In some embodiments, the material of the first adhesive layer 310 includes resin materials, such as polyurethane resin, rubber resin, polyvinyl ether resin, polyester resin, and polymethacrylic resin, preferably polyester resin or polymethacrylic resin.

[0061] In some embodiments, the first adhesive layer 310 does not contain an antistatic agent, and the surface resistance of the first adhesive layer 310 is greater than or equal to 1×10⁻⁶. 14 Ω / S, where S represents the surface resistance per unit area. For example, the surface resistance of the first adhesive layer 310 is 1.2 × 10⁻⁶ Ω / S. 14 Ω / S, 1.5×10 14 Ω / S, 1.8×10 14 Ω / S, 1×10 15 Ω / S, etc. Since the first adhesive layer 310 does not contain antistatic agent, it is beneficial to avoid the transfer of antistatic agent to other structures (such as: flip-chip film 400) when the first adhesive layer 310 comes into contact with other structures, causing corrosion and damage to other structures, thereby improving the product quality and yield of the display device.

[0062] In some embodiments, the polarizer 300 further includes a second adhesive layer 330 located on the side of the first optical layer 320 away from the first adhesive layer 310.

[0063] In some embodiments, the second adhesive layer 330 contains an antistatic agent, which helps to prevent static electricity generated in the polarizer 300 during processing and avoids product quality problems of the polarizer 300 caused by film adsorption, foreign matter adsorption, etc. due to static electricity. At the same time, the antistatic agent in the second adhesive layer 330 increases the antistatic properties of the display device 10 and prevents the surface of the display device, especially the display panel, from generating an interfering electric field due to static electricity accumulation, which would affect the normal display of the display panel.

[0064] The antistatic agent can be an ionic compound, conductive microparticles, conductive polymers, etc., preferably an ionic compound. The cation constituting the ionic compound can be an organic cation or an inorganic cation. Organic cations can be pyridinium cations, imidazolium cations, ammonium cations, sulfonium cations, phosphonium cations, piperidinium cations, pyrrolidineium cations, etc.; inorganic cations can be potassium ions, lithium ions, etc.; the anion constituting the ionic compound can be an organic anion or an inorganic anion, preferably a fluorine-containing anion with excellent antistatic properties, such as hexafluorophosphate anion [(PF6]]. 6－ )], Bis(trifluoromethanesulfonyl)imide anion [(CF3SO2)2N － [Anion, bis(fluorosulfonyl)imide anion [(FSO2)2N] － Anions, etc.

[0065] The surface resistivity of the second adhesive layer 330 is greater than or equal to 9 × 10⁻⁶. 8 Ω / S, the surface resistivity of the second adhesive layer 330 is less than or equal to 1×10 Ω / S. 10 Ω / S, for example: the surface resistivity of the second adhesive layer 330 can be 9.5 × 10 Ω / S. 8 Ω / S, 1×10 9 Ω / S, 1.5×10 9 The polarizer is designed to reduce the polarizer's resistance to static electricity, such as Ω / S, to avoid product quality issues caused by electrostatic adsorption of thin films or foreign matter during the first polarization process. It also improves the electrical resistance of the display device to prevent the accumulation of static electricity from generating an interfering electric field that could affect the normal display of the device.

[0066] In some embodiments, the thickness of the second adhesive layer 330 is greater than or equal to 5 micrometers, and the thickness of the second adhesive layer 330 is less than or equal to 30 micrometers. For example, the thickness of the second adhesive layer 330 can be 8 micrometers, 15 micrometers, 22 micrometers, 27 micrometers, etc.

[0067] In some embodiments, the storage elastic modulus of the second adhesive layer 330 is less than or equal to 70 kPa; preferably, the storage elastic modulus of the second adhesive layer 330 is less than or equal to 50 kPa, for example, the storage elastic modulus of the second adhesive layer 330 can be 10 kPa, 15 kPa, 20 kPa, 25 kPa, 30 kPa, 35 kPa, 40 kPa, 45 kPa, etc.

[0068] In some embodiments, the polarizer 300 further includes a first polarizing layer 340 located on the side of the second adhesive layer 330 away from the first adhesive layer 310, and the material of the first polarizing layer 340 may be PVA (Polyvinyl Alcohol).

[0069] In some embodiments, the polarizer 300 further includes a first protective layer 350 located on the side of the first polarizing layer 340 away from the first adhesive layer 310. The material of the first protective layer 350 may be selected from PMMA, PET (Polyethylene Terephthalate), TAC, COP, etc.

[0070] In some embodiments, the polarizer 300 further includes a surface treatment layer 370 located on the side of the first protective layer 350 away from the first adhesive layer 310. The surface treatment layer 370 can be used for functions such as anti-reflection and anti-glare. The surface treatment layer 370 can also be a hardened coating or the like.

[0071] The polarizer 300 provided in this embodiment of the invention, by setting a first inclined sub-surface 301a, and the first chamfer formed by the first inclined sub-surface 301a and the plane where the first surface is located is an acute angle, reduces the contact between the flip-chip film and the first adhesive layer during the manufacturing process of the display device, improves the damage and contamination of the flip-chip film, and improves the product yield of the display device.

[0072] Please see Figures 3 to 5 This invention also provides a display panel 200, comprising:

[0073] The first polarizer is the polarizer 300 as described above;

[0074] The first substrate 210 is located on the side of the first surface of the first polarizer that is away from the second surface of the first polarizer; and,

[0075] A flip-chip film 400 is bonded to one side of the first substrate near the first side of the first polarizer.

[0076] In some embodiments, the display panel 200 may be a liquid crystal display panel, an OLED (Oragnic Light Emitting Diode) display panel, an LED (Light Emitting Diode) display panel, a Micro LED (Micro Light Emitting Diode) display panel, a Mini LED (Mini Light Emitting Diode) display panel, or other types of display panels.

[0077] When the display panel is a liquid crystal display panel, the display panel 200 further includes a second substrate 220 located on the side of the first substrate 210 away from the first polarizer, and a liquid crystal layer 230 located between the first substrate 210 and the second substrate 220.

[0078] By setting a first inclined sub-surface 301a, and the first chamfer formed by the first inclined sub-surface 301a and the plane where the first substrate 210 is located is an acute angle within a certain angle range, the present invention reduces the contact between the flip-chip film 400 and the first adhesive layer 310 during the manufacturing process of the display device 10, reduces the damage and contamination of the flip-chip film 400, and improves the product yield of the display device 10.

[0079] The technical solution of the present invention will now be described in conjunction with specific embodiments.

[0080] Please see Figure 4 as well as Figure 5 In some embodiments, the angle range of the first chamfer is:

[0081]

[0082] Wherein, α1 is the first chamfer, D1 is the length of the orthographic projection of the inclined surface onto the plane where the parallel surface is located, D1 is greater than or equal to the thickness of the first adhesive layer, the first substrate includes a second side surface near the first side surface, and the plane where the parallel surface is located is parallel to the plane where the second side surface is located.

[0083] D2 is the thickness of the first substrate;

[0084] W1 is the distance between the plane containing the second side and the plane containing the parallel plane.

[0085] In some embodiments, the first substrate 210 may be an array substrate, and the second substrate 220 may be a color filter substrate.

[0086] The display panel 200 includes a display area and a non-display area surrounding the display area. The first end of the flip-chip film 400 is bonded to the non-display area. The first end of the flip-chip film 400 is located on the side of the first substrate 210 away from the first polarizer. The flip-chip film 400 is bent toward the backlight module 100. The second end of the flip-chip film 400 is bonded to the side of the display panel 200 away from the first polarizer.

[0087] The display device 10 also includes a printed circuit board bonded to the flip-chip film 400, the printed circuit board being disposed near the second end of the flip-chip film 400.

[0088] Please see Figure 4 In the first plane, the second side includes a first end near the first adhesive layer 310 and a second end away from the first adhesive layer 310. The inclined surface 301 includes a third end shared with the parallel surface 302. The line connecting the first end and the third end forms a first angle with the extension line of the side of the first substrate 210 near the first adhesive layer 310. The first plane is perpendicular to the plane where the first substrate 210 is located.

[0089] The size of the first included angle is When the first chamfer is smaller than the first included angle, the orthographic projection of the side of the first adhesive layer 310 closest to the first substrate 210 on the first substrate 210 cannot cover the first substrate 210, affecting the product quality of the display device 10.

[0090] The line connecting the second end and the third end forms a second angle with the extension line of the side of the first substrate 210 near the first adhesive layer 310.

[0091] The size of the second included angle is When the first chamfer is greater than the second included angle, during the manufacturing process of the display device 10, the flip-chip film 400 will come into contact with the first adhesive layer 310 when it bends toward the first polarizer, causing contamination or damage to the flip-chip film 400.

[0092] Therefore, the angle range of the first chamfer is selected as follows: This helps to avoid contact between the flip-chip film 400 and the first adhesive layer 310 during the manufacturing process of the display device 10, reducing damage and contamination of the flip-chip film 400 and improving the product yield of the display device 10.

[0093] In some embodiments, the angle range of the first chamfer is:

[0094]

[0095] Wherein, D3 is the thickness of the first adhesive layer 310.

[0096] That is, the length of the orthographic projection of the inclined surface 301 onto the plane containing the parallel surface 302 is equal to the thickness of the first adhesive layer 310.

[0097] Please see Figure 5 In some embodiments, the parallel surface 302 includes a first parallel sub-surface, which is located on the side of the second sub-part 320b of the first optical layer near the flip-chip film. Specifically, the first parallel sub-surface of the second sub-part 320b is located on the side of the first side away from the array substrate. That is, the orthographic projection of the second sub-part 320b on the plane where the first substrate 210 is located covers the orthographic projection of the first adhesive layer 310 on the plane where the first substrate 210 is located. This helps to prevent the first adhesive layer 310 from being exposed, reduce the pollution and damage caused by the first adhesive layer 310, and improve the product quality and yield of the display device 10.

[0098] Please see Figure 5 In some embodiments, when the inclined surface 301 includes the first inclined sub-surface 301a and the second inclined sub-surface, the length of the orthographic projection of the inclined surface 301 onto the plane containing the parallel surface 302 is equal to the sum of the thickness of the first adhesive layer 310 and the thickness of the first sub-part 320a, and the angle range of the first chamfer is:

[0099]

[0100] Wherein, D3 is the thickness of the first adhesive layer 310, D4 is the thickness of the first optical layer 320, and P1 is the ratio of the thickness of the first sub-part 320a to the thickness of the first optical layer 320. That is, when the thickness of the first sub-part 320a is D5, P1 = D5 / D4.

[0101] In some embodiments, the distance between the plane containing the second side and the plane containing the parallel surface 302 is greater than or equal to 0.1 mm, and the distance between the plane containing the second side and the plane containing the parallel surface 302 is less than or equal to 0.4 mm. For example, the distance between the plane containing the second side and the plane containing the parallel surface 302 can be 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.4 mm, etc. When the distance between the plane containing the second side and the plane containing the parallel surface 302 is less than 0.1 mm, the adhesion accuracy between the first polarizer and the first substrate 210 is difficult to guarantee, affecting the product yield of the display device 10. When the distance between the plane containing the second side and the plane containing the parallel surface 302 is greater than 0.4 mm, the edge of the first polarizer extends too far beyond the edge of the first substrate 210, which easily leads to material waste and increased manufacturing costs.

[0102] Preferably, the distance between the plane containing the second side and the plane containing the parallel surface 302 is greater than or equal to 0.2 mm, and the distance between the plane containing the second side and the plane containing the parallel surface 302 is less than or equal to 0.3 mm. For example, the distance between the plane containing the second side and the plane containing the parallel surface 302 is 0.22 mm, 0.25 mm, 0.28 mm, etc. This ensures the attachment accuracy of the first polarizer to the first substrate 210 while avoiding excessive material waste in the manufacturing process. This is beneficial to improving the product yield of the display device 10 and saving the manufacturing cost of the display device 10.

[0103] The thickness of the first adhesive layer 310 is greater than or equal to 5 micrometers, and less than or equal to 25 micrometers. For example, the thickness of the first adhesive layer 310 is 10 micrometers, 15 micrometers, 20 micrometers, etc. This is beneficial for providing sufficient adhesion within a suitable thickness range so that the first polarizer adheres to the side of the first substrate 210 away from the second substrate 220. The thickness of the first adhesive layer 310 is preferably 25 micrometers.

[0104] The thickness of the first sub-part 320a is greater than or equal to 10 micrometers, and the thickness of the first sub-part 320a is less than or equal to 50 micrometers. This facilitates keeping the contact point between the flip-chip film 400 and the first polarizer at a sufficient distance from the first adhesive layer 310, thereby further reducing damage and contamination of the flip-chip film 400 and improving the product yield of the display device 10. Preferably, the thickness of the first sub-part 320a is 19 micrometers to 24 micrometers.

[0105] In some embodiments, the thickness ratio of the first sub-part 320a to the thickness of the first optical layer 320 is 0.5, which is beneficial for the processing of the first polarizer and ensures that the second sub-part 320b has sufficient thickness to prevent the first adhesive layer 310 from being exposed, thereby reducing the pollution and damage caused by the first adhesive layer 310 and improving the product quality and yield of the display device 10.

[0106] Preferably, the angle range of the second chamfer is the same as the angle range of the first chamfer, that is:

[0107]

[0108] Wherein, α2 is the second chamfer. When the angle range of the second chamfer is the same as that of the first chamfer, during the manufacturing process of the display device 10, when the flip-chip film 400 is bent toward the direction of the first polarizer, the contact point between the flip-chip film 400 and the first polarizer is located on the side of the second inclined sub-surface away from the first adhesive layer 310. This helps to reduce contamination or damage to the flip-chip film 400 caused by the first adhesive layer 310, and improves the product quality and yield of the display device 10.

[0109] In some embodiments, the display panel further includes a second polarizer 500 located on the side of the second substrate 220 away from the first substrate 210, wherein the plane of the side of the second polarizer 500 near the flip-chip film 400 is parallel to the plane of the side of the second substrate 220 near the flip-chip film 400. In a top view of the display panel 200, the side of the second polarizer 500 near the flip-chip film 400 does not extend beyond the side of the second substrate 220 near the flip-chip film 400.

[0110] The second polarizer 500 includes a third adhesive layer near the second substrate 220. The composition of the third adhesive layer may be the same as or similar to that of the first adhesive layer 310. The thickness, surface resistivity and storage elastic modulus range of the third adhesive layer are the same as the corresponding range of the first adhesive layer 310, and will not be described again here.

[0111] The second polarizer 500 also includes a second optical layer located on the side of the third adhesive layer away from the second substrate 220. The purpose and composition of the second optical layer are the same as or similar to those of the first optical layer 320. The thickness range of the second optical layer is the same as that of the corresponding range of the first optical layer 320, and will not be described again here.

[0112] The second polarizer 500 also includes a fourth adhesive layer located on the side of the second optical layer away from the second substrate 220. The composition of the fourth adhesive layer may be the same as or similar to that of the second adhesive layer 330. The thickness, surface resistivity and storage elastic modulus range of the fourth adhesive layer are the same as the corresponding range of the second adhesive layer 330, and will not be described again here.

[0113] The second polarizer 500 further includes a second polarizing layer located on the side of the fourth adhesive layer away from the second substrate 220. The first polarizing layer 340 has a first light transmission axis, and the second polarizing layer has a second light transmission axis. The extension direction of the first light transmission axis is perpendicular to the extension direction of the second light transmission axis.

[0114] The second polarizer 500 also includes a second protective layer located on the side of the second polarizer layer away from the second substrate 220. The material selection range of the second protective layer is the same as that of the first protective layer 350, and will not be described in detail here.

[0115] The present invention, through the provision of a first inclined sub-surface 301a, and the first chamfer formed by the first inclined sub-surface 301a and the plane containing the first substrate 210 being an acute angle, reduces the contact between the flip-chip film 400 and the first adhesive layer 310 during the manufacturing process of the display device 10, improves the damage and contamination of the flip-chip film 400, and increases the product yield of the display device 10.

[0116] The display panel provided in this embodiment of the invention has a first inclined sub-surface 301a, and the first chamfer formed by the first inclined sub-surface 301a and the plane where the first substrate 210 is located is an acute angle within a certain angle range. This reduces the contact between the flip-chip film 400 and the first adhesive layer 310 during the manufacturing process of the display device 10, reduces damage and contamination of the flip-chip film 400, and improves the product yield of the display device.

[0117] Please see Figures 3 to 5 The present invention also provides a display device 10, comprising:

[0118] The display panel 200 as described above; and,

[0119] The backlight module 100 is located on the side of the first substrate 210 of the display panel 200 away from the first polarizer of the display panel 200.

[0120] Specifically, the display panel 200 is a liquid crystal display panel, and the backlight module 100 is located on the side of the second substrate 220 of the display panel 200 away from the first substrate 210 of the display panel 200.

[0121] The second polarizer 500 of the display panel is located between the backlight module 100 and the second substrate 220 of the display panel 200.

[0122] The display device 10 provided by the present invention, by setting a first inclined sub-surface 301a, and the first chamfer formed by the first inclined sub-surface 301a and the plane where the first substrate 210 is located is an acute angle, reduces the contact between the flip-chip film 400 and the first adhesive layer 310 during the manufacturing process of the display device 10, improves the damage and contamination of the flip-chip film 400, and improves the product yield of the display device 10.

[0123] Please see Figure 6 as well as Figures 7A to 7E This invention also provides a method for manufacturing a polarizer, comprising:

[0124] S100, the release layer 360, the first adhesive layer 310, and the first optical layer 320 of the polarizer to be processed are cut along the first direction to form a pre-tilted surface.

[0125] In some embodiments, please refer to Figure 7A The first direction is indicated by the label "X".

[0126] S200, a second adhesive layer 330, a first polarizing layer 340, a first protective layer 350 and a surface treatment layer 370 are sequentially formed on the first optical layer 320.

[0127] S300, the release layer 360, the first adhesive layer 310, the first optical layer 320, the second adhesive layer 330, the first polarizing layer 340, the first protective layer 350, and the surface treatment layer 370 of the polarizer to be processed are cut along the second direction to form an inclined surface 301 and a parallel surface 302.

[0128] In some embodiments, please refer to Figure 7C The second direction is indicated by the label "Y".

[0129] In this embodiment, step S300 further includes grinding the edges of the parallel surface 302 after cutting.

[0130] S400, Remove the release layer 360.

[0131] S500, the first adhesive layer 310 is attached to the side of the first substrate 210 of the display panel 200 away from the second substrate 220.

[0132] The first optical layer 320 is cut to include a first sub-part 320a on the side close to the first adhesive layer 310 and a second sub-part 320b on the side away from the first adhesive layer 310.

[0133] The inclined surface 301 includes a first inclined sub-surface 301a and a second inclined sub-surface 301b. The first inclined sub-surface 301a is located on the side of the first adhesive layer 310 near the flip-chip film 400, and the second inclined sub-surface 301b is located on the side of the first sub-part 320a near the flip-chip film 400.

[0134] The first inclined sub-surface 301a and the second inclined sub-surface 301b are coplanar, and the inclined surface 301a and the parallel surface 302 form a first cutting angle, the angle range of which is:

[0135]

[0136] β1 is the first cutting angle, D3 is the thickness of the first adhesive layer 310, D4 is the thickness of the first optical layer 320, and P1 is the ratio of the thickness of the first sub-part 320a to the thickness of the first optical layer 320.

[0137] The present invention provides a method for manufacturing a polarizer. By setting a first inclined sub-surface 301a, and the first chamfer formed by the first inclined sub-surface 301a and the plane where the first substrate 210 is located is an acute angle, the contact between the flip-chip film 400 and the first adhesive layer 310 during the manufacturing process of the display device 10 is reduced, the damage and contamination of the flip-chip film 400 are improved, and the product yield of the display device 10 is increased.

[0138] This invention discloses a polarizer, a display panel, and a display device. The polarizer includes a first surface, a second surface, and a first side surface connecting the first surface and the second surface. The first side surface includes an inclined surface near the first surface and a parallel surface away from the first surface. The inclined surface and the parallel surface are continuous. The polarizer also includes a first adhesive layer. The inclined surface includes a first inclined sub-surface located on the side of the first adhesive layer near the first surface. The first inclined sub-surface forms a first chamfer with the plane containing the first surface. The first chamfer is an acute angle. By setting the first inclined sub-surface and ensuring that the first chamfer formed by the first inclined surface and the plane containing the first substrate is an acute angle, this invention reduces the contact between the flip-chip film and the first adhesive layer during the manufacturing process of the display device, improves the damage and contamination of the flip-chip film, and increases the product yield of the display device.

[0139] The polarizer, display panel, and display device provided by the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A display panel, characterized in that, include: First polarizer; The first substrate is located on the side of the first surface of the first polarizer that is away from the second surface of the first polarizer; as well as, A flip-chip film, wherein the flip-chip film is bonded to one side of the first substrate near the first side of the first polarizer; The first polarizer includes a first surface, a second surface, and a first side surface. The first surface and the second surface are disposed opposite to each other, and the first side surface connects the first surface and the second surface. The first side surface includes an inclined surface close to the first surface and a parallel surface away from the first surface. The inclined surface and the parallel surface are continuous. The first polarizer also includes a first adhesive layer. The inclined surface includes a first inclined sub-surface. The first inclined sub-surface is located on the side of the first adhesive layer close to the first surface. The first inclined sub-surface forms a first chamfer with the plane containing the first surface. The first chamfer is an acute angle.

2. The display panel according to claim 1, characterized in that, The first polarizer also includes a first optical layer located on the side of the first adhesive layer away from the first surface; The first optical layer includes a first sub-part close to the first adhesive layer and a second sub-part away from the first adhesive layer. The inclined surface further includes a second inclined sub-surface, which is located on the side of the first sub-part closer to the first surface. The second inclined sub-surface forms a second chamfer with the plane containing the first surface, and the second chamfer is an acute angle.

3. The display panel according to claim 2, characterized in that, The first inclined sub-plane and the second inclined sub-plane are coplanar.

4. The display panel according to claim 2, characterized in that, The thickness of the first adhesive layer is greater than or equal to 5 micrometers, and the thickness of the first adhesive layer is less than or equal to 25 micrometers; The thickness of the first sub-part is greater than or equal to 10 micrometers, and the thickness of the first sub-part is less than or equal to 50 micrometers.

5. The display panel according to claim 2, characterized in that, The storage elastic modulus of the first adhesive layer is greater than or equal to 100 kPa, and the first adhesive layer does not contain an antistatic agent.

6. The display panel according to claim 1, characterized in that, The angle of the first chamfer is greater than or equal to 8°, and the angle of the first chamfer is less than or equal to 61°.

7. The display panel according to claim 1, characterized in that, The angle range of the first chamfer of the first polarizer is: ； Wherein, α1 is the first chamfer, D1 is the length of the orthographic projection of the inclined surface onto the plane where the parallel surface is located, D1 is greater than or equal to the thickness of the first adhesive layer, the first substrate includes a second side surface near the first side surface, and the plane where the parallel surface is located is parallel to the plane where the second side surface is located. D2 is the thickness of the first substrate; W1 is the distance between the plane containing the second side and the plane containing the parallel plane. The distance between the plane containing the second side and the plane containing the parallel plane is greater than or equal to 0.1 mm, and the distance between the plane containing the second side and the plane containing the parallel plane is less than or equal to 0.4 mm.

8. The display panel according to claim 7, characterized in that, The angle range of the first chamfer of the first polarizer is: ； Wherein, D3 is the thickness of the first adhesive layer, D4 is the thickness of the first optical layer of the first polarizer, and P1 is the ratio of the thickness of the first sub-part of the first optical layer to the thickness of the first optical layer.

9. A display device, characterized in that, include: The display panel as described in any one of claims 1 to 8; as well as, The backlight module is located on the side of the first substrate of the display panel away from the first polarizer of the display panel.

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