Transmissive LCD panel

Abstract

This invention provides a transmissive liquid crystal panel that simplifies replacement and assembly processes and miniaturizes the mounting device. The transmissive liquid crystal panel includes: a pixel region having a plurality of pixels arranged therein; a liquid crystal layer that modulates light according to each of the plurality of pixels; an incident portion that allows light to enter the liquid crystal layer; an emitting portion that emits the light modulated by the liquid crystal layer as image light; and a vapor chamber having an opening corresponding to the pixel region, a heating portion disposed around the opening, and a heat dissipation portion for dissipating heat received by the heating portion. The vapor chamber utilizes the heat received by the heating portion to vaporize a liquid refrigerant sealed inside, and utilizes the heat dissipation portion to dissipate heat from the gaseous refrigerant, thereby condensing the gaseous refrigerant into a liquid refrigerant.

Description

Technical Field

[0001] This invention relates to transmissive liquid crystal panels. Background Technology

[0002] Previously, projectors with a cooling device for cooling the liquid crystal panel were known (see, for example, Patent Document 1).

[0003] In the projector described in Patent Document 1, a liquid crystal panel is housed within a frame, and a flow path for a liquid refrigerant circulating within the frame via a cooling device is provided. The frame cools the liquid crystal panel by transferring heat from the liquid crystal panel to the liquid refrigerant. Furthermore, the liquid crystal panel and frame are housed within a first sealed housing, which contains a heat exchanger and a fan. The liquid refrigerant, circulated by the cooling device, flows through the heat exchanger, transferring heat from the gas within the first sealed housing to the liquid refrigerant, thereby cooling the gas within the first sealed housing. The gas within the first sealed housing circulates within the first sealed housing via the fan, further cooling the liquid crystal panel.

[0004] The cooling unit includes a pump for pressurizing and delivering liquid refrigerant, a radiator for cooling the liquid refrigerant, and multiple piping lines for circulating the liquid refrigerant. A portion of these piping lines is equipped with connectors to allow for the replacement of components through which the liquid refrigerant flows.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-74695

[0006] However, in the projector described in Patent Document 1, the liquid refrigerant flows within the frame housing the LCD panel, and therefore the frame is equipped with piping. With such piping, if the LCD panel needs to be replaced, it must be removed while preventing leakage of the liquid refrigerant, making the replacement process cumbersome. This also occurs when assembling the LCD panel into the projector.

[0007] In addition, a pump and a housing are required to circulate the liquid refrigerant flowing in the housing, which leads to the problem of cooling devices and, consequently, larger projectors.

[0008] Therefore, it is desirable to achieve a structure that simplifies the replacement and assembly processes of the LCD panel and miniaturizes the device equipped with the LCD panel. Summary of the Invention

[0009] The first aspect of the present invention provides a transmissive liquid crystal panel comprising: a pixel region having a plurality of pixels arranged therein; a liquid crystal layer having light modulated according to each of the plurality of pixels; an incident portion having light incident onto the liquid crystal layer; an ejection portion having light modulated by the liquid crystal layer emitted as image light; and a vapor chamber having an opening corresponding to the pixel region, a heating portion disposed around the opening, and a heat dissipation portion for dissipating heat received by the heating portion. The vapor chamber uses the heat received by the heating portion to vaporize a liquid refrigerant sealed inside, and uses the heat dissipation portion to dissipate heat from the gaseous refrigerant, thereby condensing the gaseous refrigerant into a liquid refrigerant.

[0010] A transmissive liquid crystal panel according to a second aspect of the present invention comprises: a pixel region having a plurality of pixels arranged therein; a liquid crystal layer having light modulated according to each of the plurality of pixels; a counter substrate having a common electrode disposed corresponding to the pixel region; a pixel substrate having a plurality of pixel electrodes disposed corresponding to the plurality of pixels and carrying the liquid crystal layer between the pixel substrate and the counter substrate; a first dustproof substrate disposed on the counter substrate on a surface opposite to the pixel substrate; a second dustproof substrate disposed on the pixel substrate on a surface opposite to the counter substrate; and a first vapor chamber having: a first opening corresponding to the pixel region; and a first heating portion disposed around the first opening and connected to at least one of the counter substrate and the first dustproof substrate in a manner capable of heat transfer. The system comprises: a first heat dissipation section that dissipates heat received by the first heat-receiving section; a first vapor chamber that vaporizes a first refrigerant sealed inside by the heat received by the first heat-receiving section; and a second vapor chamber having: a second opening corresponding to the pixel region; a second heat-receiving section disposed around the second opening and connected to at least one of the pixel substrate and the second dustproof substrate in a manner capable of heat transfer; and a second heat dissipation section that dissipates heat received by the second heat-receiving section; the second vapor chamber that vaporizes a second refrigerant sealed inside by the heat received by the second heat-receiving section; and a second heat dissipation section that dissipates heat received by the second heat-receiving section; the second vapor chamber that vaporizes a second refrigerant sealed inside by the heat received by the second heat-receiving section; and a second heat dissipation section that dissipates heat received by the second refrigerant, thereby condensing the second refrigerant in gaseous phase into liquid phase. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the structure of the projector according to the first embodiment.

[0012] Figure 2 This is a perspective view showing the image forming unit of the first embodiment.

[0013] Figure 3 This is an exploded perspective view showing the liquid crystal panel and holding member according to the first embodiment.

[0014] Figure 4 This is an exploded perspective view showing the liquid crystal panel and holding member according to the first embodiment.

[0015] Figure 5 This is a cross-sectional view showing the liquid crystal panel according to the first embodiment.

[0016] Figure 6 This is a perspective view showing the main body of the injection-side cooling component according to the first embodiment.

[0017] Figure 7 This is a perspective view showing the first heat dissipation component installed on the main body of the first embodiment.

[0018] Figure 8 This is a schematic diagram showing a cross-section of the liquid crystal panel according to the first embodiment.

[0019] Figure 9 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the first embodiment.

[0020] Figure 10 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the first embodiment.

[0021] Figure 11 This is a schematic diagram showing a cross-section of the liquid crystal panel of the projector according to the second embodiment.

[0022] Figure 12 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the second embodiment.

[0023] Figure 13 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the second embodiment.

[0024] Figure 14 This is a schematic diagram showing a cross-sectional view of the liquid crystal panel of the projector according to the third embodiment.

[0025] Figure 15 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the third embodiment.

[0026] Figure 16This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the third embodiment.

[0027] Figure 17 This is a schematic diagram showing a cross-sectional view of the liquid crystal panel of the projector according to the fourth embodiment.

[0028] Figure 18 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the fourth embodiment.

[0029] Figure 19 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the fourth embodiment.

[0030] Figure 20 This is a schematic diagram showing a cross-sectional view of the liquid crystal panel of the projector according to the fifth embodiment.

[0031] Figure 21 This is a schematic cross-sectional view showing a modified liquid crystal panel according to the fifth embodiment.

[0032] Figure 22 This is a schematic cross-sectional view showing a modified liquid crystal panel according to the fifth embodiment.

[0033] Figure 23 This is a schematic diagram showing a cross-sectional view of the liquid crystal panel of the projector according to the sixth embodiment.

[0034] Figure 24 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the sixth embodiment.

[0035] Figure 25 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the sixth embodiment.

[0036] Figure 26 This is a schematic diagram showing a cross-sectional view of the liquid crystal panel of the projector according to the seventh embodiment.

[0037] Figure 27 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0038] Figure 28 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0039] Figure 29 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0040] Figure 30 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0041] Figure 31 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0042] Figure 32 This is a schematic diagram showing a cross-section of the liquid crystal panel of the projector according to the seventh embodiment.

[0043] Figure 33 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0044] Figure 34 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0045] Figure 35 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to the seventh embodiment.

[0046] Figure 36 This is a schematic diagram showing a cross-sectional view of a modified liquid crystal panel according to various embodiments.

[0047] Label Explanation

[0048] 4A, 4B, 4C, 4D, 4E, 4F, 4G, 4H, 4I: Liquid crystal panel (transmissive liquid crystal panel); 41: Panel body; 41A: Pixel area; 42: Liquid crystal layer; 43: Incident part; 44: Opposing substrate (incident side electrode substrate); 441: Light incident surface; 442: Light emitting surface; 45: Incident side dustproof substrate (first dustproof substrate); 451: Light incident surface (surface on the light incident side); 452: Light emitting surface (surface on the light emitting side); 453: Side surface; 46: Emission part; 47: Pixel substrate (emission side electrode substrate); 471: Light incident surface; 472: Light emitting surface; 48: Emission-side dustproof substrate (second dustproof substrate); 481: Light incident surface (surface on the light incident side); 482: Light emitting surface (surface on the light emitting side); 483: Side surface; 49: Wiring; 50: Holding housing; 51: Clamping component; 6A, 6B, 6C, 6D, 6E, 6F, 6G, 6H, 6I: Emission-side cooling component; 61A, 61B, 61C, 61D, 61E, 61F, 61G, 61H, 61I: Main body (vapor chamber; second vapor chamber); 62: First component; 621: Heated part; 62A: First surface; 63: Second component; 631: First heat dissipation part (heat dissipation part); 632: Second heat dissipation part (heat dissipation part); 63A: Second surface; 64, 64C: Opening; 67: Heat transfer component; 68: First heat dissipation component; 69: Second heat dissipation component; 7A, 7B, 7C, 7D, 7E, 7F, 7G, 7H, 7I: Liquid crystal panel; 8A, 8B, 8C, 8D, 8E, 8F, 8G, 8H, 8I: Incident side cooling component; 81A, 81B, 81C, 81D, 8 1E, 81F, 81G, 81H, 81I: Main body (steam chamber; first steam chamber); 82: First component; 821: Heated part; 82A: First surface; 83: Second component; 831: First heat dissipation part (heat dissipation part); 832: Second heat dissipation part (heat dissipation part); 83A: Second surface; 84, 84C: Opening; 87: Heat transfer component; 88: First heat dissipation component; 89: Second heat dissipation component; 9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H, 9I, 9J, 9K: LCD panel; SP: Sealing space. Detailed Implementation

[0049] Hereinafter, the first embodiment of the present invention will be described with reference to the accompanying drawings.

[0050] [General Structure of a Projector]

[0051] Figure 1 This is a schematic diagram showing the structure of the projector 1 in this embodiment.

[0052] In this embodiment, the projector 1 modulates light emitted from a light source to form an image corresponding to image information, and then magnifies and projects the formed image onto a projection surface such as a screen. Figure 1 As shown, the projector 1 has an outer casing 2 and an image projection device 3. Furthermore, although not shown in the figure, the projector 1 includes: a cooling device for cooling the objects constituting the projector 1; a power supply device for supplying power to the electronic components constituting the projector 1; and a control device for controlling the operation of the projector 1.

[0053] [Structure of the outer casing]

[0054] The outer casing 2 constitutes the outer casing of the projector 1, and internally houses the image projection device 3, cooling device, power supply device, and control device.

[0055] The outer casing 2 has a front portion 21, a back portion 22, a left face portion 23 located on the left side of the front portion 21, and a right face portion 24 located on the right side of the front portion 21. Although not shown in the figure, the outer casing 2 has a top face portion connecting one end of each face portion 21 to 24 and a bottom face portion connecting the other end of each face portion 21 to 24. The outer casing 2 is formed, for example, in a generally cuboid shape.

[0056] The right side panel 24 has an air inlet 241. The air inlet 241 introduces air from outside the outer housing 2 as cooling gas into the interior of the outer housing 2. A filter may also be provided at the air inlet 241 to capture dust contained in the air passing through the air inlet 241.

[0057] The front portion 21 has a passage 211 located approximately in the center of the front portion 21. Light projected from the projection optical device 37, described later, passes through the passage 211.

[0058] The front part 21 has an exhaust port 212 located on the left side 23 of the front part 21. The exhaust port 212 discharges the cooling gas that has cooled the object disposed inside the outer housing 2 to the outside of the outer housing 2.

[0059] [Structure of the image projection device]

[0060] The image projection device 3 forms an image corresponding to the image information input from the control device and projects the formed image. The image projection device 3 includes a light source 31, a light homogenization unit 32, a color separation unit 33, a relay unit 34, an image forming unit 35, an optical component housing 36, and a projection optical device 37.

[0061] The light source 31 emits illumination light into the light homogenization section 32. For example, the structure of the light source 31 can include a solid-state light source that emits blue light as excitation light, and a wavelength conversion element that converts a portion of the wavelength of the blue light emitted from the solid-state light source into fluorescence containing green and red light. Furthermore, other structures of the light source 31 include those using a light source lamp such as an ultra-high pressure mercury lamp, and those employing a solid-state light source with semiconductor lasers or light-emitting elements that respectively emit blue, green, and red light.

[0062] The light homogenization unit 32 homogenizes the light emitted from the light source 31. The homogenized light passes through the color separation unit 33 and the relay unit 34 to illuminate the modulation area of ​​the liquid crystal panel 4A, which will be described later. The light homogenization unit 32 includes two lens arrays 321 and 322, a polarization conversion element 323, and an overlapping lens 324.

[0063] The color separation unit 33 separates the light incident from the light homogenization unit 32 into red, green, and blue light. The color separation unit 33 has two dichroic mirrors 331 and 332 and a reflector 333 that reflects the blue light separated by the dichroic mirror 331.

[0064] The relay unit 34 is positioned in the optical path of red light, which has a longer optical path than other colors of light, to suppress the loss of red light. The relay unit 34 includes an incident-side lens 341, a relay lens 343, and reflectors 342 and 344. In this embodiment, it is assumed that the relay unit 34 is positioned in the optical path of red light. However, it is not limited to this; for example, it could be configured such that the color with a longer optical path than other colors of light is blue light, and the relay unit 34 is positioned in the optical path of blue light.

[0065] The image forming unit 35 modulates incident red, green, and blue light, and combines the modulated light to form an image. The image forming unit 35 includes three field lenses 351, three incident-side polarizers 352, and an image forming unit 353A, all configured according to the incident light colors.

[0066] The image forming unit 353A has three liquid crystal panels 4A, three field-angle compensation plates 354, three emission-side polarizers 355 and one color synthesis unit 356, which are integrated into one unit.

[0067] The liquid crystal panel 4A modulates the light emitted from the light source 31 based on an image signal input from the control device. Specifically, the liquid crystal panel 4A modulates the light emitted from the incident-side polarizer 352 based on the input image signal, and emits the modulated light as image light. The liquid crystal panel 4A includes a liquid crystal panel 4AR that modulates red light, a liquid crystal panel 4AG that modulates green light, and a liquid crystal panel 4AB that modulates blue light. The liquid crystal panel 4A is a transmissive liquid crystal panel that emits the modulated light along the incident direction of the light relative to the liquid crystal panel 4A, and the incident-side polarizer 352, the liquid crystal panel 4A, and the emission-side polarizer 355 constitute a liquid crystal light valve.

[0068] The detailed structure of LCD panel 4A will be described in detail later.

[0069] The color synthesis unit 356 synthesizes the three colors of light modulated by the liquid crystal panel 4AB, 4AG, and 4AR. The image light synthesized by the color synthesis unit 356 is incident on the projection optical device 37. In this embodiment, the color synthesis unit 356 is composed of a cross-shaped dichroic prism that is approximately rectangular. The cross-shaped dichroic prism is, for example, a prism that has a generally rectangular shape formed by bonding four right-angled triangular prisms together, and two intersecting dielectric multilayer films are provided at the interfaces of the four prisms.

[0070] Figure 2 This is a stereoscopic view representing the image forming unit 353A.

[0071] like Figure 2 As shown, the color combining unit 356 has three incident surfaces 356R, 356G, and 356B, which are opposite to the liquid crystal panels 4AR, 4AG, and 4AB and allow light of various colors passing through the liquid crystal panels 4AR, 4AG, and 4AB to be incident upon, and one emission surface 356S. Blue and red light from the three colors incident on the incident surfaces 356R, 356G, and 356B are reflected towards the projection optical device 37 by two dielectric multilayer films, while green light passes through the two dielectric multilayer films towards the projection optical device 37. Thus, the three colors are combined. The combined image light is emitted from the emission surface 356S towards the projection optical device 37.

[0072] In addition to the above-described structure, the image forming unit 353A, such as Figure 2 As shown, it also has 3 retaining components 357.

[0073] Three holding components 357 respectively hold the liquid crystal panel 4A and the emission-side polarizer 355 described later, and are fixed to the corresponding incident surfaces 356R, 356G, and 356B.

[0074] Figure 3 This is an exploded perspective view of the liquid crystal panel 4A and the holding member 357, viewed from the light incident side. Figure 4 This is an exploded perspective view of the liquid crystal panel 4A and the holding member 357, viewed from the light-emitting side of the liquid crystal panel 4A.

[0075] like Figure 3 and Figure 4 As shown, the retaining member 357 has a mounting portion 358 and four protruding insertion portions 359.

[0076] The mounting portion 358 is formed in the shape of a rectangular frame and is mounted to the corresponding incident surface by means of adhesive bonding or the like. The mounting portion 358 has an opening portion 3581 and a retaining portion 3582.

[0077] The opening 3581 is rectangular in shape and is located approximately in the center of the mounting portion 358. The opening 3581 allows light passing through the emission-side polarizer 355 to pass toward the color combining portion 356.

[0078] The holding part 3582 holds the emission-side polarizer 355.

[0079] Four insertion portions 359 protrude from the four corner portions of the mounting portion 358 toward the liquid crystal panel 4A. After the four insertion portions 359 are inserted into the position adjustment portions 503 of the liquid crystal panel 4A, they are bonded and fixed to the liquid crystal panel 4A by an adhesive such as an ultraviolet-cured adhesive.

[0080] The liquid crystal panel 4A and the color combining unit 356 are integrated through the retaining component 357. However, the color combining unit 356 is not limited to a cross-shaped dichroic prism, and may also be composed of multiple dichroic mirrors.

[0081] like Figure 1 As shown, the optical component housing 36 internally houses the aforementioned parts 32-34 and the field lens 351. Furthermore, the image projection device 3 is provided with an illumination optical axis Ax, which serves as the designed optical axis, and the optical component housing 36 holds the parts 32-34 and the field lens 351 at predetermined positions on the illumination optical axis Ax. The light source 31, the image forming unit 353A, and the projection optics 37 are positioned at predetermined positions on the illumination optical axis Ax.

[0082] The projection optical device 37 is a projection lens that magnifies and projects an image incident from the image forming unit 35 onto the projection surface. That is, the projection optical device 37 projects image light modulated by the liquid crystal panel 4A. As the projection optical device 37, a group lens having multiple lenses and a cylindrical lens barrel that houses multiple lenses can be exemplified.

[0083] [Structure of LCD Panel]

[0084] As described above, the liquid crystal panel 4A is a transmissive liquid crystal panel that modulates light incident from the incident polarizer 352, and the holding member 357 is positioned corresponding to each incident surface of the color combining unit 356. Figure 3 and Figure 4 As shown, the liquid crystal panel 4A has a panel body 41, wiring 49 consisting of flat cables, a retaining housing 50, and an injection-side cooling component 6A.

[0085] In the following description, the three mutually perpendicular directions are designated as the +X direction, +Y direction, and +Z direction. In this embodiment, the +Z direction is designated as the direction of light propagation incident on the liquid crystal panel 4A. The right side when viewing the liquid crystal panel 4A along the +Z direction with the +Y direction aligned with the top is designated as the +X direction. Although the illustration is omitted, the opposite direction of the +X direction is designated as the -X direction, the opposite direction of the +Y direction is designated as the -Y direction, and the opposite direction of the +Z direction is designated as the -Z direction. That is, the +Z direction relative to the liquid crystal panel 4A is the light emitting side relative to the liquid crystal panel 4A, and the -Z direction relative to the liquid crystal panel 4A is the light incident side relative to the liquid crystal panel 4A.

[0086] [Structure of the panel body]

[0087] Figure 5 This is a cross-sectional view of LCD panel 4A.

[0088] The panel body 41 modulates the incident light. The panel body 41 has a pixel region 41A in which multiple pixels are arranged. The pixel region 41A is a region in the liquid crystal panel 4A in which multiple pixels are arranged and modulate the incident light based on the input image signal, and each of the multiple pixels can modulate the light individually.

[0089] like Figure 5 As shown, the panel body 41 has a liquid crystal layer 42, an incident portion 43, and an emitted portion 46. That is, the liquid crystal panel 4A is a transmissive liquid crystal panel having pixel regions 41A.

[0090] [Structure of the liquid crystal layer]

[0091] The liquid crystal layer 42 is formed by liquid crystal sealed between the incident portion 43 and the ejection portion 46. More specifically, the liquid crystal layer 42 is formed by liquid crystal sealed between the opposing substrate 44 constituting the incident portion 43 and the pixel substrate 47 constituting the ejection portion 46.

[0092] The liquid crystal layer 42 modulates the light incident through the incident section 43 according to the input image signal. That is, the liquid crystal layer 42 is a modulation section that modulates the incident light in the pixel region 41A, and constitutes the main part of the pixel region 41A.

[0093] Heat is generated when light is incident on the liquid crystal layer 42. The heat generated by the liquid crystal layer 42 is transferred to the incident portion 43 and the ejection portion 46 that sandwich the liquid crystal layer 42.

[0094] [Structure of the incident section]

[0095] The incident portion 43 is provided on the light incident side relative to the liquid crystal layer 42, allowing light incident on the liquid crystal layer 42 to pass through, thereby causing light to be incident on the liquid crystal layer 42. The incident portion 43 includes: a counter substrate 44, which sandwiches the liquid crystal layer 42 together with the pixel substrate 47; and an incident-side dustproof substrate 45, which is provided on the counter substrate 44.

[0096] [Structure of the opposing substrate]

[0097] The opposing substrate 44 is disposed on the light-incident side relative to the liquid crystal layer 42, and is a light-transmitting incident-side electrode substrate connected to the liquid crystal layer 42 in a manner capable of heat transfer. Although not shown in the figure, the opposing substrate 44 has an opposing electrode that serves as a common electrode and is electrically connected to the liquid crystal layer 42, and a support substrate that supports the opposing electrode. The opposing electrode corresponds to the incident-side electrode and constitutes the pixel region 41A. When viewed along the direction of light propagation incident on the pixel region 41A, the area of ​​the opposing substrate 44 is larger than the area of ​​the pixel region 41A. That is, when viewed from the -Z direction, the area of ​​the opposing substrate 44 is larger than the area of ​​the pixel region 41A.

[0098] The opposing substrate 44 has: a light incident surface 441, which is a light incident side surface for light to be incident on; and a light emitting surface 442, which is a light emitting side surface for light to be emitted after passing through the opposing substrate 44.

[0099] The heat generated by the liquid crystal layer 42 is transferred to the opposing substrate 44.

[0100] [Structure of the incident-side dustproof substrate]

[0101] The incident-side dustproof substrate 45 is a light-transmitting substrate disposed on the light-incident surface 441 of the opposing substrate 44 at a portion corresponding to the pixel region 41A. That is, when the liquid crystal panel 4A is viewed from the -Z direction, the incident-side dustproof substrate 45 is disposed on the light-incident surface 441 in such a way that it covers the pixel region 41A and allows for heat transfer.

[0102] The incident-side dustproof substrate 45 suppresses dust and other particles from adhering to the area corresponding to the pixel region 41A in the light incident surface 441, preventing the shadows of these particles from entering the image light. Viewed along the direction of light propagation towards the pixel region 41A, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the pixel region 41A. Specifically, viewed from the -Z direction, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the pixel region 41A but smaller than the area of ​​the opposing substrate 44.

[0103] The incident-side dustproof substrate 45 has a light incident surface 451, a light emitting surface 452, and a side surface 453, and is formed into a generally rectangular parallelepiped shape.

[0104] The light incident surface 451 is the surface of the incident-side dustproof substrate 45 that is near the light incident side, and is the surface on which light emitted from the incident-side polarizer 352 is incident.

[0105] The light emitting surface 452 is the light emitting side surface of the incident-side dustproof substrate 45, and is the surface through which light is emitted from the incident-side dustproof substrate 45. The light emitting surface 452 is connected to the light incident surface 441 of the opposing substrate 44.

[0106] Side surface 453 is the surface that connects the light incident surface 451 and the light exit surface 452.

[0107] Heat from the liquid crystal layer 42 is transferred to the incident-side dustproof substrate 45 via the opposing substrate 44. That is, the incident-side dustproof substrate 45 is connected to the liquid crystal layer 42 via the opposing substrate 44 in a manner that enables heat transfer.

[0108] [Structure of the injection section]

[0109] The emission section 46 is disposed on the light emission side relative to the liquid crystal layer 42, and emits light modulated by the liquid crystal layer 42 as image light. The emission section 46 includes: a pixel substrate 47, which sandwiches the liquid crystal layer 42 together with the opposing substrate 44; and an emission-side dustproof substrate 48 disposed on the pixel substrate 47.

[0110] [Structure of pixel substrate]

[0111] Pixel substrate 47 is disposed on the light-emitting side relative to liquid crystal layer 42, and is a light-transmitting emission-side electrode substrate connected to liquid crystal layer 42 in a manner capable of heat transfer. Although not shown in the figure, pixel substrate 47 has multiple switching elements such as TFT (Thin Film Transistor), multiple pixel electrodes electrically connected to liquid crystal layer 42, and a support substrate supporting the multiple switching elements and the multiple pixel electrodes. The multiple pixel electrodes are equivalent to emission-side electrodes, constituting pixel region 41A. In detail, the multiple pixel electrodes are respectively disposed corresponding to the multiple pixels arranged in pixel region 41A, and are electrically connected to the multiple switching elements and the portions of liquid crystal layer 42 corresponding to the multiple pixels. In other words, the multiple pixel electrodes define the multiple pixels arranged in pixel region 41A. Viewed from the emission direction of image light emitted from pixel substrate 47, the area of ​​pixel substrate 47 is larger than the area of ​​pixel region 41A.

[0112] The pixel substrate 47 is a light incident side surface, having: a light incident surface 471, which is for light modulated by the liquid crystal layer 42 to be incident; and a light emitting surface 472, which is disposed on the light emitting side, for light passing through the pixel substrate 47 to be emitted.

[0113] The heat generated by the liquid crystal layer 42 is transferred to the pixel substrate 47.

[0114] [Structure of the dustproof substrate on the injection side]

[0115] The emission-side dustproof substrate 48 is a light-transmitting substrate disposed on the light-emitting surface 472 of the pixel substrate 47 at a portion corresponding to the pixel region 41A. That is, when the liquid crystal panel 4A is viewed from the light-emitting side, the emission-side dustproof substrate 48 is disposed on the light-emitting surface 472 in such a way that it covers the pixel region 41A and allows for heat transfer.

[0116] The emission-side dustproof substrate 48 prevents dust and other particles from directly adhering to the pixel substrate 47 and allowing their shadows to enter the image light. Viewed from the emission direction of the image light emitted from the liquid crystal layer 42, the area of ​​the emission-side dustproof substrate 48 is larger than the area of ​​the pixel region 41A. Specifically, viewed from the +Z direction, the area of ​​the emission-side dustproof substrate 48 is larger than the area of ​​the pixel region 41A but smaller than the area of ​​the pixel substrate 47.

[0117] The dustproof substrate 48 on the injection side has a light incident surface 481, a light emission surface 482 and a side surface 483, and is formed into a generally rectangular parallelepiped shape.

[0118] The light incident surface 481 is the light incident side of the dustproof substrate 48 on the emission side. It is connected to the light emission surface 472 of the pixel substrate 47 and is the surface through which light emitted from the light emission surface 472 is incident.

[0119] The light emission surface 482 is the light emission side surface of the emission-side dustproof substrate 48, and is the light emission surface that passes through the emission-side dustproof substrate 48.

[0120] Side surface 483 is the surface that connects the light incident surface 481 and the light exit surface 482.

[0121] Heat from the liquid crystal layer 42 is transferred to the emission-side dustproof substrate 48 via the pixel substrate 47. That is, the emission-side dustproof substrate 48 is connected to the liquid crystal layer 42 via the pixel substrate 47 in a manner that enables heat transfer.

[0122] [Wiring Structure]

[0123] In the region of the liquid crystal layer 42 corresponding to the plurality of pixels, the wiring 49 applies an applied voltage corresponding to the image signal between the plurality of pixel electrodes disposed on the pixel substrate 47 and the counter electrode of the counter substrate 44. That is, the wiring 49 supplies the image signal driving the liquid crystal layer 42.

[0124] Wiring 49 is electrically connected to pixel substrate 47. Specifically, wiring 49 extends from opposing substrate 44 and pixel substrate 47 in the +Y direction and is connected to a control device (not shown). In this embodiment, wiring 49 is constructed of FPC (Flexible Printed Circuits).

[0125] On the surface of wiring 49 in the +Z direction, a drive circuit 491 is provided to control the movement of the panel body 41 according to the image signal input from the control device. The drive circuit 491 is thermally connected to the first component 62 of the injection-side cooling component 6A.

[0126] [Maintain the structure of the casing]

[0127] The retaining housing 50 covers a portion of the panel body 41, the opposing substrate 44, and the wiring 49 in the -Z direction. The retaining housing 50 holds the panel body 41 internally by combining with the injection-side cooling component 6A. That is, the retaining housing 50 and the injection-side cooling component 6A (described later) are separate components. The retaining housing 50, in addition to... Figure 3 In addition to the opening 501 and the heat dissipation fins 502 shown, as Figure 3 as well as Figure 4 As shown, it also has four position adjustment parts 503.

[0128] like Figure 3 As shown, viewed from the -Z direction, the opening 501 is configured to be approximately rectangular, corresponding to the pixel region 41A. The opening 501 allows light emitted from the incident-side polarizer 352 to pass through and be incident on the incident-side dustproof substrate 45.

[0129] Multiple heat dissipation fins 502 are provided such that they protrude from the +Y direction relative to the opening 501 in the -Z direction. The heat dissipation fins 502 dissipate heat transferred from the incident portion 43 to the retaining housing 50.

[0130] like Figure 3 and Figure 4 As shown, viewed from the -Z direction, four position adjustment portions 503 are provided at the four corners of the holding housing 50. Each position adjustment portion 503 is a hole through which a corresponding insertion portion 359 is inserted from the +Z direction. Based on the insertion amount of the insertion portion 359 relative to each position adjustment portion 503, the position of the holding housing 50 relative to the incident surface of the color combining portion 356 on which the holding member 357 is mounted is adjusted, thereby adjusting the position of the liquid crystal panel 4A. After the position of the liquid crystal panel 4A is adjusted, as described above, the insertion portion 359 and the position adjustment portion 503 are fixed with adhesive.

[0131] [Structure of the injection-side cooling component]

[0132] The ejection-side cooling component 6A is disposed on the side opposite to the opposing substrate 44 relative to the pixel substrate 47, and is thermally connected to the pixel substrate 47. For example... Figure 5 As shown, the injection-side cooling component 6A has a hollow enclosed space SP containing refrigerant. By utilizing the heat transferred from the heating element, the liquid refrigerant is vaporized, thereby consuming the heat transferred from the heating element and cooling the heating element.

[0133] In this embodiment, the ejection-side cooling member 6A utilizes the heat transferred from the pixel substrate 47 and the ejection-side dustproof substrate 48 to vaporize the liquid refrigerant into a gaseous refrigerant, thereby cooling the liquid crystal layer 42. That is, the ejection-side cooling member 6A cools the liquid crystal layer 42 by vaporizing the liquid refrigerant.

[0134] The injection-side cooling component 6A has a main body 61A and a first heat dissipation component 68.

[0135] [Structure of the main body]

[0136] Figure 6 This is a perspective view showing the main body 61A. In detail, Figure 6 This is a perspective view of the main body 61A as seen from the side of the second component 63.

[0137] like Figure 6 As shown, the main body 61A has a first component 62 and a second component 63, and is constructed by combining the first component 62 and the second component 63. In this embodiment, the main body 61A is a steam chamber, and an enclosed space SP (see reference) is formed inside the main body 61A by combining the first component 62 and the second component 63. Figure 5 A refrigerant is sealed in the encapsulation space SP. In addition, when viewed from the emission side (+Z direction) of the light emitted from the liquid crystal layer 42, the main body 61A extends further outward than the pixel substrate 47 and the emission-side dustproof substrate 48.

[0138] The first component 62 is a flat substrate, also referred to as the first substrate. The first component 62 is the connecting portion of the main body 61A that connects to the heating element, and is configured to contact the liquid refrigerant sealed within the sealing space SP. In the first component 62, the portion that transfers heat from the outside causes the liquid refrigerant within the sealing space SP to transform into a gaseous refrigerant. That is, the first component 62 utilizes the transferred heat to vaporize the liquid refrigerant. The first surface 62A of the first component 62, opposite to the second component 63, is the surface that contacts the heating element. In this embodiment, the first surface 62A is a flat surface.

[0139] The first component 62 has a heat-receiving portion 621 that receives heat from the heating element. That is, the main body 61A of the steam chamber in this embodiment has a heat-receiving portion 621. The heat-receiving portion 621 will be described in detail later.

[0140] The second component 63 is a substrate formed in the shape of a flat plate, and may also be referred to as a second substrate. The second component 63 is joined to the first component 62, and together with the first component 62, forms the enclosed space SP. The second component 63 is configured to be in contact with the refrigerant gas inside the enclosed space SP.

[0141] The second component 63 has a second surface 63A and a first heat dissipation part 631.

[0142] The second surface 63A is the surface of the second component 63 opposite to the first component 62.

[0143] The first heat dissipation section 631 receives heat from the gaseous refrigerant within the sealed space SP, condenses the gaseous refrigerant into liquid refrigerant, and dissipates the received heat to the outside. That is, the first heat dissipation section 631 can also be called the first condensation section. The location of the first heat dissipation section 631 will be described in detail later.

[0144] Such a second component 63 is disposed on the opposite side of the liquid crystal layer 42 in the liquid crystal panel 4A relative to the first component 62.

[0145] The main body 61A has an opening 64.

[0146] The opening 64 is a generally rectangular opening provided in the main body 61A corresponding to the pixel region 41A. The opening 64 penetrates the main body 61A along the direction (+Z direction) where the first component 62 and the second component 63 are facing each other, and light passing through the liquid crystal panel 4A passes through the opening 64. That is, the opening 64 is a through hole with an inner peripheral surface.

[0147] The inner peripheral surface of the opening 64 is formed by the joint portion of the first component 62 and the second component 63. Therefore, the heat transferred to the inner edge of the opening 64 is transferred to the first component 62.

[0148] Furthermore, the main body 61A extends from the opening 64 in the +Y direction. More specifically, the main body 61A extends from the opening 64 in the extending direction (+Y direction) of the wiring 49 extending from the pixel substrate 47 connected to the liquid crystal layer 42. In other words, the main body 61A extends from the opening 64 in the extending direction (+Y direction) of the wiring 49 extending from the liquid crystal layer 42.

[0149] [Structure of the heated section]

[0150] The heat-receiving portion 621 is the part of the main body 61A that receives heat from the heating element. Therefore, in this embodiment, a portion of the heat-receiving portion 621 is provided in the first component 62 around the opening 64. In this embodiment, the main body 61A is configured such that the first component 62 contacts the pixel substrate 47 and the emission-side dustproof substrate 48, so the heat-receiving portion 621 is the portion around the opening 64, which is the portion of the first component 62 that contacts the pixel substrate 47 and the emission-side dustproof substrate 48. In other words, the main body 61A has a heat-receiving portion 621 such that it is provided in the first component 62 around the opening 64 and receives heat from the light-emitting surface 472 of the pixel substrate 47, which serves as the heating element, and the side surface 483 of the emission-side dustproof substrate 48, which serves as the heating element.

[0151] Although the illustration is omitted, the portion of the inner surface of the sealed space SP corresponding to the heated portion 621 can be called the vaporization portion, which uses the heat received by the heated portion 621 to vaporize the liquid refrigerant.

[0152] In detail, the part of the inner surface of the sealed space SP that comes into contact with the liquid refrigerant is the vaporization part, which is vaporized by the heat transferred from the heated part 621.

[0153] [Structure of the first heat dissipation section]

[0154] The first heat dissipation section 631 is a section in the main body 61A that dissipates heat from the refrigerant of the gas flowing in the sealed space SP.

[0155] Although not illustrated, the portion of the inner surface of the sealed space SP corresponding to the first heat dissipation section 631 can be referred to as the first condensation section, which condenses the gaseous refrigerant into a liquid refrigerant by being heated. More specifically, the portion of the inner surface of the sealed space SP that is in contact with the gaseous refrigerant, and which receives heat from the gaseous refrigerant and condenses it into a liquid refrigerant, is the first condensation section. The heat received from the gaseous refrigerant through this first condensation section is dissipated through the first heat dissipation section 631.

[0156] The first heat dissipation portion 631 is positioned relative to the opening 64 in the extending direction of the wiring 49 from the liquid crystal layer 42. A first heat dissipation component 68 (see reference) is provided on the second surface 63A at a position corresponding to the first heat dissipation portion 631. Figure 5 By providing a first heat dissipation member 68 to the first heat dissipation section 631, the first heat dissipation section 631 becomes a part of the second component 63 that easily dissipates heat received from the gaseous refrigerant to the outside of the main body section 61A. Therefore, in the ejection-side cooling component 6A, the portion where the first heat dissipation member 68 is provided is configured as the first heat dissipation section 631.

[0157] [Structure of the first heat dissipation component]

[0158] Figure 7 This is a perspective view showing the first heat dissipation component 68 installed on the main body 61A.

[0159] The first heat dissipation component 68 dissipates heat transferred from the first heat dissipation part 631. For example... Figure 7 As shown, the first heat dissipation component 68 has multiple fins 681.

[0160] Multiple fins 681 are each formed into a square cylindrical shape and arranged in the +X direction. Each fin 681 has an internal flow path for cooling gas to flow along the +Y direction. A portion of the cooling gas flowing in the liquid crystal panel 4A flows along the second surface 63A in the +Y direction and along the flow path provided inside each fin 681. Heat is transferred from each fin 681 to the cooling gas flowing within the flow path.

[0161] Alternatively, the fin 681 can also be other shapes. For example, the fin 681 can also be a pin protruding to the side opposite to the first component 62. In this case, the pin can also be one of the following shapes: cylindrical, prismatic, frustum conical, and frustum pyramidal.

[0162] [Configuration of the injection-side cooling components relative to the panel body]

[0163] Figure 8 This is a schematic diagram showing a cross-section of the liquid crystal panel 4A along the YZ plane.

[0164] like Figure 8 As shown, the emission-side cooling member 6A is disposed on the light emission side relative to the liquid crystal layer 42. Specifically, the emission-side cooling member 6A is disposed on the light emission surface 472 of the pixel substrate 47. That is, the first surface 62A of the first member 62 is connected to the light emission surface 472 of the pixel substrate 47 in a manner that enables heat transfer. In this embodiment, the pixel substrate 47 corresponds to the emission-side substrate.

[0165] Additionally, an injection-side dustproof substrate 48 is disposed within the opening 64. The side surface 483 of the injection-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64 via a thermally conductive adhesive in a manner that enables heat transfer.

[0166] That is, the inner circumferential surface of the opening 64 is part of the heated part 621.

[0167] [Heat transfer path generated in the liquid crystal layer]

[0168] Of the heat generated in the liquid crystal layer 42, a portion is transferred to the opposing substrate 44, and the rest is transferred to the pixel substrate 47. The heat transferred to the opposing substrate 44 is transferred to the incident-side dustproof substrate 45 and the retaining housing 50 for heat dissipation.

[0169] A portion of the heat transferred to the pixel substrate 47 is transferred to the heated portion 621, and another portion is transferred to the heated portion 621 via the injection-side dustproof substrate 48. More specifically, in... Figure 8 In the emission-side cooling component 6A shown, heat transferred from the liquid crystal layer 42 to the pixel substrate 47 is transferred to the heated portion 621 that is in contact with the light emitting surface 472 of the pixel substrate 47. On the other hand, heat transferred to the emission-side dustproof substrate 48 is transferred to the inner peripheral surface of the opening 64 that is connected to the side surface 483 of the emission-side dustproof substrate 48 in a manner that enables heat transfer.

[0170] The first component 62, which has a heat-receiving portion 621, uses the heat transferred from the liquid crystal layer 42 to vaporize the refrigerant in the liquid sealed in the space SP, thereby consuming the heat transferred from the liquid crystal layer 42 to the first component 62. As a result, the pixel substrate 47, the ejection-side dustproof substrate 48, and the liquid crystal layer 42 are cooled.

[0171] The gaseous refrigerant flowing within the sealed space SP and reaching the first condenser is condensed into liquid refrigerant at the first condenser. The heat received by the gaseous refrigerant from the first condenser is transferred from the first heat dissipation section 631 to the first heat dissipation component 68, and is dissipated by the first heat dissipation component 68.

[0172] [The flow of cooling gas circulating in the LCD panel]

[0173] Cooling gas, circulated by a fan in a cooling device mounted on the outer casing 2, flows in the +Y direction relative to the liquid crystal panel 4A. Specifically, the cooling gas flowing in the liquid crystal panel 4A is split at the -Y direction end of the liquid crystal panel 4A into cooling gas flowing in the space on the light incident side relative to the liquid crystal panel 4A and cooling gas flowing in the space on the light emitting side relative to the liquid crystal panel 4A.

[0174] Cooling gas flowing in the space relative to the light-incident side of the liquid crystal panel 4A flows in the +Y direction, sequentially cooling the incident-side dustproof substrate 45 and the holding housing 50. That is, heat transferred from the liquid crystal layer 42 to the incident-side dustproof substrate 45 and the holding housing 50 is transferred to the cooling gas. Furthermore, a portion of the heat from electronic components such as the drive circuit 491 provided on the wiring 49 is transferred to the holding housing 50. The cooling gas flowing in the space relative to the light-incident side of the liquid crystal panel 4A flows through the heat dissipation fins 502 of the holding housing 50, thus a portion of the heat from the electronic components is transferred to the cooling gas via the heat dissipation fins 502. Therefore, the electronic components are also cooled.

[0175] Cooling gas flowing in the space relative to the light-emitting side of the liquid crystal panel 4A flows in the +Y direction and sequentially cools the emission-side dustproof substrate 48 and the first heat dissipation component 68. That is, the heat transferred from the liquid crystal layer 42 to the emission-side dustproof substrate 48 and the first heat dissipation component 68 is transferred to the cooling gas.

[0176] In this way, by circulating cooling gas through the incident-side dustproof substrate 45, the holding housing 50, the ejection-side dustproof substrate 48, and the first heat dissipation member 68, the heat of the liquid crystal layer 42 is transferred to the cooling gas, thereby cooling the liquid crystal layer 42. Furthermore, in this embodiment, the driving circuit 491 is thermally connected to the first component 62 of the ejection-side cooling member 6A. Therefore, a portion of the heat from the driving circuit 491, after being transferred to the first component 62, is transferred to the first heat dissipation member 68 via the first heat dissipation portion 631 of the second component 63, and then to the cooling gas circulating in the first heat dissipation member 68. Thus, the driving circuit 491 is cooled.

[0177] Here, in the liquid crystal panel 4A, the first heat dissipation part 631 is provided at a position in the +Y direction closer to the connection portion of the first component 62 with the pixel substrate 47 and the connection portion with the ejection-side dustproof substrate 48. In other words, the first heat dissipation part 631 is provided in the +Y direction of the opening 64.

[0178] Therefore, a first condensation section for condensing gaseous refrigerant into liquid refrigerant is provided in the +Y direction of the opening 64.

[0179] Therefore, when the liquid crystal panel 4A is arranged with the +Y direction as the vertical direction and facing upwards, the liquid refrigerant condensed in the first condensation section can be transported to the vaporization section not only by capillary force but also by gravity. The vaporization section transfers heat from the heated section 621, causing the liquid refrigerant to vaporize. Thus, the heat transferred from the liquid crystal layer 42 via the pixel substrate 47 and the ejection-side dustproof substrate 48 promotes the change of the refrigerant from liquid to gas at the vaporization section. In other words, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0180] [Effects of the First Embodiment]

[0181] The projector 1 described above in this embodiment achieves the following effects.

[0182] The projector 1 has a liquid crystal panel 4A, which serves as a light modulation device for modulating light emitted from a light source. The liquid crystal panel 4A is a transmissive liquid crystal panel that emits modulated light along the direction of travel of the light incident on the liquid crystal panel.

[0183] The liquid crystal panel 4A has a pixel region 41A, a liquid crystal layer 42, an incident portion 43, an emitted portion 46, and a main body portion 61A. Multiple pixels are arranged in the pixel region 41A. The liquid crystal layer 42 modulates light for each of the multiple pixels. The incident portion 43 allows light to enter the liquid crystal layer 42. The emitted portion 46 emits the light modulated by the liquid crystal layer 42 as image light. The main body portion 61A is a vapor chamber constituting the emitted-side cooling component 6A. The main body portion 61A has an opening 64, a heat receiving portion 621, and a first heat dissipation portion 631. The opening 64 is disposed on the main body portion 61A corresponding to the pixel region 41A. The heat receiving portion 621 is disposed around the opening 64. The first heat dissipation portion 631 acts as a heat dissipation portion, dissipating heat received by the heat receiving portion 621. The main body 61A uses the heat received by the heated part 621 to vaporize the liquid refrigerant sealed inside the sealed space SP, and uses the first heat dissipation part 631 to dissipate the heat of the gaseous refrigerant, thereby condensing the gaseous refrigerant into liquid refrigerant. The sealed space SP is located inside the main body 61A.

[0184] Here, the vapor chamber does not require piping for refrigerant flow or wiring for supplying drive power. Based on this structure, compared to the case where a cooling device for refrigerant flow is provided or thermoelectric conversion elements such as Peltier elements that use electricity to move heat, the structure of the liquid crystal panel 4A can be simplified. Therefore, the projector 1, as the device mounting the liquid crystal panel 4A, can be miniaturized. Furthermore, since the liquid crystal panel 4A can be mounted and detached from the projector 1 without installing and disconnecting piping and wiring, the replacement of the liquid crystal panel 4A can be easily performed. Moreover, the heating portion 621 located around the opening 64 corresponding to the pixel region 41A is heated, thus improving the temperature uniformity within the pixel region 41A.

[0185] In the liquid crystal panel 4A, the emission section 46 has a pixel substrate 47, which is connected to the liquid crystal layer 42 in a manner that allows for heat transfer and allows image light to pass through. The pixel substrate 47 is a light-transmitting emission-side substrate, and when viewed from the emission direction of the image light emitted from the liquid crystal layer 42, the area of ​​the pixel substrate 47 is larger than the area of ​​the pixel region 41A. The main body 61A, which serves as the vapor chamber, is disposed on the pixel substrate 47 in a manner that allows for heat transfer.

[0186] With this structure, the main body 61A is disposed on the pixel substrate 47 in a manner that enables heat transfer. The pixel substrate 47 is connected to the liquid crystal layer 42 in a manner that enables heat transfer, thereby allowing the heated portion 821 to easily receive heat from the liquid crystal layer 42 via the pixel substrate 47. Therefore, the liquid crystal layer 42 can be easily cooled.

[0187] In the liquid crystal panel 4A, the emission section 46 includes a pixel substrate 47. The pixel substrate 47 has an emission-side electrode electrically connected to the liquid crystal layer 42. The pixel substrate 47 is a light-transmitting emission-side electrode substrate disposed on the light emission side relative to the liquid crystal layer 42. The emission-side substrate of the main body 61A, where the emission-side cooling member 6A is provided, is the pixel substrate 47.

[0188] With this structure, the pixel substrate 47 is a light-transmitting substrate directly connected to the heat-sensitive liquid crystal layer 42. Therefore, by connecting the pixel substrate 47 to the heat-receiving part 621, the heat generated by the liquid crystal layer 42 can be efficiently transferred to the heat-receiving part 621. Thus, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0189] In the liquid crystal panel 4A, the emission section 46 has an emission-side dustproof substrate 48 disposed on the light emission surface 472 of the pixel substrate 47. The light emission surface 472 corresponds to the light emission side surface of the pixel substrate 47. The emission-side dustproof substrate 48 has a light incident surface 481, a light emission surface 482, and a side surface 483. The side surface 483 connects the light incident surface 481 and the light emission surface 482. The light incident surface 481 corresponds to the light incident side surface of the emission-side dustproof substrate 48, and the light emission surface 482 corresponds to the light emission side surface of the emission-side dustproof substrate 48. The heat-receiving section 621 receives heat from the light emission surface 472 of the pixel substrate 47 and the side surface 483 of the emission-side dustproof substrate 48.

[0190] With this structure, the heat-receiving part 621 is connected to both the pixel substrate 47 and the emission-side dustproof substrate 48, thus allowing heat from the liquid crystal layer 42 to be transferred to the heat-receiving part 621 via both the pixel substrate 47 and the emission-side dustproof substrate 48. Therefore, heat from the liquid crystal layer 42 can be efficiently transferred to the heat-receiving part 621, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0191] In the liquid crystal panel 4A, the pixel substrate 47 has a plurality of pixel electrodes disposed corresponding to a plurality of pixels as emission-side electrodes. The pixel substrate 47 is an emission-side electrode substrate disposed on the light emission side relative to the liquid crystal layer 42.

[0192] In a typical transmissive liquid crystal panel, a counter substrate is disposed on the light incident side relative to the liquid crystal layer, and a pixel substrate is disposed on the light emitting side relative to the liquid crystal layer.

[0193] Therefore, by making the emission-side electrode substrate a pixel substrate 47 and by providing a main body portion 61A with the above structure on a general transmissive liquid crystal panel, a liquid crystal panel 4A that can achieve the above-mentioned effects can be constructed. Therefore, the liquid crystal panel 4A can be constructed simply.

[0194] The liquid crystal panel 4A has a wiring 49 that supplies image signals to the driving liquid crystal layer 42. The main body 61A, which serves as the vapor chamber, extends from the opening 64 in the extending direction in which the wiring 49 extends from the liquid crystal layer 42.

[0195] With such a structure, for example, compared to the case where the main body 61A extends from the opening 64 in the direction opposite to the extension direction of the wiring 49, i.e., the -Y direction, it is possible to suppress the enlargement of the liquid crystal panel 4A.

[0196] In the liquid crystal panel 4A, the ejection-side cooling component 6A has a first heat dissipation component 68, which is disposed in the main body 61A, which serves as a vapor chamber, and releases the heat transferred from the first heat dissipation component 631.

[0197] The first heat dissipation component 68 is equivalent to a heat dissipation component. The first heat dissipation component 68 is disposed in the +Y direction, which extends from the opening 64 of the main body 61A relative to the opening 6.

[0198] With this structure, the pixel substrate 47 and the ejection-side dustproof substrate 48, which are connected to the heat-receiving part 621 and serve as heat-generating elements, can be separated from the first heat dissipation member 68. This suppresses the heat transferred to the first heat dissipation member 68 from affecting the pixel substrate 47 and the ejection-side dustproof substrate 48.

[0199] [First Variation of the First Embodiment]

[0200] In the liquid crystal panel 4A, the side surface 483 of the ejection-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64, which is part of the heated portion 621, via a thermally conductive adhesive in a manner that allows for heat transfer. However, this is not a limitation; the side surface 483 and the inner peripheral surface of the opening 64 may not be connected in a manner that allows for heat transfer. Alternatively, the side surface 483 and the inner peripheral surface of the opening 64 may be connected in a manner that allows for heat transfer via a heat transfer component such as a leaf spring. Furthermore, it is not limited to the side surface 483 being completely connected to the inner peripheral surface of the opening 64 in a manner that allows for heat transfer; a portion of the side surface 483 may also be connected to the inner peripheral surface of the opening 64 in a manner that allows for heat transfer.

[0201] [Second variation of the first embodiment]

[0202] In the liquid crystal panel 4A, the heat-receiving part 621 of the emission-side cooling member 6A is directly connected to the light-emitting surface 472 of the pixel substrate 47, and is connected to the side surface 483 of the emission-side dustproof substrate 48 in a manner that allows heat transfer via a thermally conductive adhesive or the like. However, it is not limited to this; the heat-receiving part 621 may also be directly connected to the emission-side dustproof substrate 48 without being directly connected to the pixel substrate 47. For example, a heat transfer member capable of transferring heat from the pixel substrate 47 to the heat-receiving part 621 may be provided between the pixel substrate 47 and the heat-receiving part 621.

[0203] Figure 9 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 4B, which is a variant of the liquid crystal panel 4A.

[0204] For example, it can also be used Figure 9 The LCD panel 4B shown is used to replace the LCD panel 4A.

[0205] The liquid crystal panel 4B has the same structure and function as the liquid crystal panel 4A, except that it has an ejection-side cooling component 6B and a clamping component 51, which replace the ejection-side cooling component 6A. That is, the liquid crystal panel 4B has a panel body 41, wiring 49, a holding housing 50, a clamping component 51, and an ejection-side cooling component 6B.

[0206] The clamping member 51 is combined with the retaining housing 50 to clamp the panel body 41 in the +Z direction together with the retaining housing 50. That is, the clamping member 51 is disposed on the light emitting side relative to the liquid crystal layer 42. Specifically, a portion of the clamping member 51 is disposed between the pixel substrate 47 and the heat-receiving portion 621. The clamping member 51 is formed, for example, of a metal with good thermal conductivity.

[0207] The injection-side cooling component 6B has the same structure and function as the injection-side cooling component 6A, except that it has a main body 61B instead of the main body 61A. That is, the injection-side cooling component 6B has a main body 61B and a first heat dissipation component 68.

[0208] The main body 61B has a first component 62, a second component 63, and an opening 64. The first component 62 has a first surface 62A and a heat-receiving part 621, and the second component 63 has a second surface 63A and a first heat-dissipating part 631.

[0209] In the emission-side cooling component 6B, the first surface 62A of the first component 62 is not directly connected to the pixel substrate 47, but is connected to the pixel substrate 47 via the clamping component 51 in a manner that allows for heat transfer. Furthermore, the first surface 62A is connected to the light-emitting surface 482 of the emission-side dustproof substrate 48. That is, in the liquid crystal panel 4B, when viewed from the direction of light propagation (+Z direction) incident on the liquid crystal layer 42, the area of ​​the emission-side dustproof substrate 48 is larger than the area of ​​the opening 64 of the emission-side cooling component 6B. Therefore, the emission-side dustproof substrate 48 is not disposed inside the opening 64, and the main body 61B is disposed on the emission-side dustproof substrate 48.

[0210] The heat transferred to the injection-side dustproof substrate 48 is transferred to the first component 62 through the first surface 62A.

[0211] That is, the heat-receiving part 621 of the main body 61B is not only the part of the first component 62 that is connected to the light emitting surface 482 of the emission-side dustproof substrate 48, but also the part that is connected to the pixel substrate 47 via the clamping member 51 in a way that allows heat transfer.

[0212] In addition, of the heat generated in the liquid crystal layer 42, the heat transferred to the emission-side dustproof substrate 48 via the pixel substrate 47 is greater than the heat transferred to the clamping member 51 via the pixel substrate 47. Therefore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer.

[0213] [Effects of the second variation of the first embodiment]

[0214] In addition to having the same effect as the aforementioned LCD panel 4A, this LCD panel 4B also has the following effects.

[0215] In the liquid crystal panel 4B, the emission section 46 includes: a pixel substrate 47 having a plurality of pixel electrodes electrically connected to the liquid crystal layer 42, disposed on the light emission side relative to the liquid crystal layer 42; and an emission-side dustproof substrate 48 disposed on the light emission surface 472 of the pixel substrate 47. The emission-side substrate of the main body 61B, on which the emission-side cooling member 6B is disposed, is the emission-side dustproof substrate 48. Furthermore, the pixel substrate 47 corresponds to a light-transmitting emission-side electrode substrate, and the plurality of pixel electrodes correspond to emission-side electrodes.

[0216] With this structure, the main body 61B, which serves as the vapor chamber, is disposed on the emission-side dustproof substrate 48 in a manner that enables heat transfer. The emission-side dustproof substrate 48 is disposed on the light emission side closer to the pixel substrate 47. Therefore, compared to the case where the main body 61B is disposed on the pixel substrate 47 in a manner that avoids the emission-side dustproof substrate 48, the main body 61B can be easily connected to the emission part 46.

[0217] Here, the heat generated in the liquid crystal layer 42 is transferred to the emission-side dustproof substrate 48 via the pixel substrate 47, thus causing heat diffusion in the liquid crystal layer 42. In contrast, the first component 62 of the main body 61B is connected to the light emitting surface 482 of the emission-side dustproof substrate 48, so the heat of the liquid crystal layer 42 can be easily transferred to the heated portion 621 of the first component 62.

[0218] In the liquid crystal panel 4B, the main body 61B, which serves as the vapor chamber, is provided on the light emitting surface 482 of the emission-side dustproof substrate 48. The light emitting surface 482 corresponds to the light emitting side surface of the emission-side dustproof substrate 48.

[0219] With this structure, for example, compared to the case where the ejection-side dustproof substrate 48 is disposed in the opening 64 corresponding to the pixel region 41A, even if the main body 61B, which serves as the vapor chamber, has tolerances, the main body 61B can be easily mounted on the ejection section 46.

[0220] [Third variation of the first embodiment]

[0221] In liquid crystal panel 4A, the heat-receiving portion 621 of the emission-side cooling member 6A is connected to the light-emitting surface 472 of the pixel substrate 47 and the side surface 483 of the emission-side dustproof substrate 48 in a manner that allows for heat transfer. Furthermore, in liquid crystal panel 4B, the heat-receiving portion 621 is connected to the light-emitting surface 482 of the emission-side dustproof substrate 48. However, the connection portion of the heat-receiving portion 621 that connects to the pixel substrate 47 and the emission-side dustproof substrate 48 is not limited to the structure described above.

[0222] Figure 10 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 4C, which is a variant of the liquid crystal panel 4A.

[0223] For example, it can also be used Figure 10 The LCD panel 4C shown is used to replace the LCD panel 4A.

[0224] The liquid crystal panel 4C has the same structure and function as the liquid crystal panel 4A, except that it has a clamping member 51 and an ejection-side cooling member 6C instead of the ejection-side cooling member 6A. That is, the liquid crystal panel 4C has a panel body 41, wiring 49, holding housing 50, clamping member 51 and ejection-side cooling member 6C.

[0225] Like the injection-side cooling component 6A, the injection-side cooling component 6C dissipates heat to the outside by vaporizing the liquid refrigerant into a gaseous refrigerant through heat transferred from the pixel substrate 47 and the injection-side dustproof substrate 48. The injection-side cooling component 6C has the same structure and function as the injection-side cooling component 6A, except that it has a main body 61C instead of the main body 61A. That is, the injection-side cooling component 6C has a main body 61C and a first heat dissipation component 68.

[0226] The main body 61C, like the main body 61A, has a first component 62 and a second component 63, and is constructed by combining the first component 62 and the second component 63. The main body 61C is disposed on the pixel substrate 47 such that the first surface 62A of the first component 62 contacts the light emitting surface 472 of the pixel substrate 47. That is, a portion of the heat-receiving portion 621 of the main body 61C is connected to the pixel substrate 47 in a manner that allows for heat transfer.

[0227] The main body 61C has an opening 64C.

[0228] The opening 64C is a secondary hole having a first opening 64C1 provided on the light incident side (-Z direction) and a second opening 64C2 provided on the light emitting side (+Z direction).

[0229] The inner diameter of the first opening 64C1 is larger than the inner diameter of the second opening 64C2. An injection-side dustproof substrate 48 is disposed inside the first opening 64C1, and the side surface 483 of the injection-side dustproof substrate 48 is connected to the inner peripheral surface of the first opening 64C1 in a manner that enables heat transfer via a thermally conductive adhesive or the like.

[0230] The connecting portion 64C3, which connects the inner peripheral surfaces of the first opening 64C1 and the second opening 64C2, is substantially parallel to a plane perpendicular to the direction of light travel (+Z direction) through the emission-side dustproof substrate 48. A portion of the light emitting surface 482 of the emission-side dustproof substrate 48 is connected to the connecting portion 64C3 in a manner that allows for heat transfer. In other words, the main body 61C has a stepped portion formed by the first opening 64C1, the connecting portion 64C3, and the second opening 64C2. Furthermore, the inner peripheral surface of the first opening 64C1 corresponds to the inner peripheral surface of the stepped portion, and the connecting portion 64C3 corresponds to the bottom surface of the stepped portion.

[0231] Furthermore, in the main body 61C, the connection portion that connects to the pixel substrate 47 and the ejection-side dustproof substrate 48 is the heat-receiving portion 621. Therefore, the inner peripheral surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621.

[0232] [Effects of the third variation of the first embodiment]

[0233] In addition to having the same effect as the aforementioned LCD panels 4A and 4B, this LCD panel 4C also has the following effects.

[0234] In the liquid crystal panel 4C, the emission-side dustproof substrate 48 has a side surface 483 that connects the light incident surface 481 and the light emitting surface 482. The light incident surface 481 corresponds to the light incident side of the emission-side dustproof substrate 48, and the light emitting surface 482 corresponds to the light emitting side of the emission-side dustproof substrate 48.

[0235] The inner peripheral surface of the first opening 64C1 of the main body 61C is connected to at least a portion of the side surface 483 of the injection-side dustproof substrate 48 in a manner that allows for heat transfer. Furthermore, the connecting portion 64C3 of the main body 61C is connected to the light-emitting surface 482 of the injection-side dustproof substrate 48 in a manner that allows for heat transfer. That is, the inner peripheral surface of the first opening 64C1 and the connecting portion 64C3 are part of the heated portion 621.

[0236] With this structure, heat transferred to the liquid crystal layer 42 of the emission-side dustproof substrate 48 can be received through the inner peripheral surface of the first opening 64C1 and the connecting portion 64C3. As a result, compared to the case where a main body serving as a vapor chamber is provided on the light emitting surface 482 of the emission-side dustproof substrate 48, the increase in size of the liquid crystal panel 4C in the light transmission direction (+Z direction) can be suppressed.

[0237] In the liquid crystal panel 4C, the heat-receiving part 621 is connected to the pixel substrate 47 in a manner that enables heat transfer.

[0238] With this structure, heat is transferred not only from the side surface 483 of the ejection-side dustproof substrate 48 to the heat-receiving part 621, but also from the pixel substrate 47 to the heat-receiving part 621. Therefore, heat from the liquid crystal layer 42 can be easily transferred to the heat-receiving part 621, thus improving the cooling efficiency of the liquid crystal layer 42.

[0239] Furthermore, in the liquid crystal panel 4C, the first component 62 with the heat-receiving part 621 and the pixel substrate 47 may not be connected in a manner that enables heat transfer. In this case, the main body 61C may be fixed to the ejection-side dustproof substrate 48.

[0240] [Second Implementation]

[0241] Next, the second embodiment of the present invention will be described.

[0242] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but the position of the first heat dissipation member in the emission-side cooling component constituting the liquid crystal panel is different. Furthermore, in the following description, the same reference numerals are used for parts that are the same as or substantially the same as those already described, and the descriptions are omitted.

[0243] Figure 11 This is a schematic diagram showing a cross-section along the YZ plane of the liquid crystal panel 4D of the projector of this embodiment.

[0244] The projector in this embodiment, in addition to replacing the liquid crystal panel 4A of the first embodiment, has the following features: Figure 11 Except for the liquid crystal panel 4D shown, it has the same structure and function as the projector 1 of the first embodiment. The liquid crystal panel 4D has the same structure and function as the liquid crystal panel 4A, except that it has an ejection-side cooling member 6D instead of an ejection-side cooling member 6A.

[0245] The injection-side cooling component 6D has the same structure and function as the injection-side cooling component 6A of the first embodiment, except that it has a main body portion 61D instead of the main body portion 61A of the first embodiment. That is, the injection-side cooling component 6D has a main body portion 61D and a first heat dissipation component 68.

[0246] The main body 61D has a first component 62 and a second component 63, which are assembled by combining the first component 62 and the second component 63 in the +Z direction.

[0247] The main body 61D has an opening 64, and extends from the opening 64 in the -Y direction, which is opposite to the extending direction of the wiring 49 from the liquid crystal layer 42. Therefore, in the second component 63 of the main body 61D, the first heat dissipation component 631 is disposed in the -Y direction relative to the opening 64. The first heat dissipation component 68 is provided on the second surface 63A of the second component 63 at a position corresponding to the first heat dissipation component 631.

[0248] Furthermore, an ejection-side dustproof substrate 48 is disposed inside the opening 64, and the inner peripheral surface of the opening 64 is connected to the side surface 483 of the ejection-side dustproof substrate 48 in a manner that allows for heat transfer via a thermally conductive adhesive or the like. That is, in the main body 61D, the heated portion 621 is connected not only to the light-emitting surface 472 of the pixel substrate 47, but also to the side surface 483 of the ejection-side dustproof substrate 48 in a manner that allows for heat transfer.

[0249] [The flow of cooling gas circulating in the LCD panel]

[0250] Cooling gas, circulated by a fan in a cooling device mounted on the outer casing 2, flows relative to the liquid crystal panel 4D in the +Y direction. Although not shown in the figure, the cooling gas flowing in the liquid crystal panel 4D, like the cooling gas flowing in the liquid crystal panel 4A, is split at the -Y direction end of the liquid crystal panel 4D into cooling gas flowing in the space on the light incident side relative to the liquid crystal panel 4D and cooling gas flowing in the space on the light emitting side relative to the liquid crystal panel 4D.

[0251] Cooling gas flows in the +Y direction in the space relative to the light incident side of the liquid crystal panel 4D, and after cooling the incident side dustproof substrate 45, it cools the retaining housing 50.

[0252] Cooling gas flowing in the space relative to the light emitting side of the liquid crystal panel 4D flows in the +Y direction, and after cooling the first heat dissipation component 68, it cools the dustproof substrate 48 on the emission side.

[0253] In this way, in the liquid crystal panel 4D, cooling gas flows to the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, the holding housing 50, and the ejection-side cooling component 6D, thereby transferring the heat of the liquid crystal layer 42 to the cooling gas. In addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0254] Furthermore, in the liquid crystal panel 4D, the first heat dissipation section 631 and the first heat dissipation component 68 are disposed in the -Y direction relative to the opening 64. Therefore, when the liquid crystal panel 4D is arranged with the -Y direction as the vertical direction upward, the refrigerant condensed by the first condensation section corresponding to the first heat dissipation section 631 can be transported to the vaporization section in the heated section 621 corresponding to the connection portion connected to the pixel substrate 47 and the connection portion connected to the ejection-side dustproof substrate 48 by means of both capillary force and gravity.

[0255] Therefore, the heat transferred from the liquid crystal layer 42 through the pixel substrate 47 and the emission-side dustproof substrate 48 can promote the change of the refrigerant from liquid to gas at the vaporization section. That is, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0256] [Effects of the Second Embodiment]

[0257] In addition to having the same effects as the projector 1 of the first embodiment, the projector described above also has the following effects. That is, in addition to having the same effects as the liquid crystal panel 4A of the first embodiment, the liquid crystal panel 4D of this embodiment also has the following effects.

[0258] The liquid crystal panel 4D has wiring 49 that supplies image signals to the liquid crystal layer 42. The main body 61D, which serves as the vapor chamber, extends from the opening 64 in the -Y direction, which is opposite to the direction in which the wiring 49 extends from the liquid crystal layer 42.

[0259] With this structure, interference between the wiring 49 and the main body 61D can be suppressed, thus preventing the heat dissipation of the main body 61D from being hindered by the wiring 49.

[0260] [First variation of the second embodiment]

[0261] In the 4D liquid crystal panel, the side surface 483 of the ejection-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64, which is part of the heated portion 621, via a thermally conductive adhesive in a manner that allows for heat transfer. However, this is not a limitation; the side surface 483 and the inner peripheral surface of the opening 64 may not be connected in a manner that allows for heat transfer. Alternatively, the side surface 483 and the inner peripheral surface of the opening 64 may be connected in a manner that allows for heat transfer via a heat transfer component such as a leaf spring. Furthermore, it is not limited to the side surface 483 being completely connected to the inner peripheral surface of the opening 64 in a manner that allows for heat transfer; a portion of the side surface 483 may also be connected to the inner peripheral surface of the opening 64 in a manner that allows for heat transfer.

[0262] [Second variation of the second embodiment]

[0263] In the 4D liquid crystal panel, the heat-receiving part 621 is directly connected to the light-emitting surface 472 of the pixel substrate 47, and is connected to the side surface 483 of the emission-side dustproof substrate 48 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. However, it is not limited to this; the heat-receiving part 621 may also be directly connected to the emission-side dustproof substrate 48 without being directly connected to the pixel substrate 47. For example, a heat transfer member capable of transferring heat from the pixel substrate 47 to the heat-receiving part 621 may be provided between the pixel substrate 47 and the heat-receiving part 621.

[0264] Figure 12 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 4E, which is a variant of the liquid crystal panel 4D.

[0265] For example, it can also be used Figure 12 The LCD panel 4E shown is used instead of LCD panel 4D.

[0266] The liquid crystal panel 4E has the same structure and function as the liquid crystal panel 4D, except that it has an ejection-side cooling component 6E and a clamping component 51 instead of an ejection-side cooling component 6D. That is, the liquid crystal panel 4E has a panel body 41, wiring 49, a holding housing 50, a clamping component 51, and an ejection-side cooling component 6E.

[0267] The injection-side cooling component 6E has the same structure and function as the injection-side cooling component 6D, except that it has a main body 61E instead of the main body 61D. That is, the injection-side cooling component 6E has a main body 61E and a first heat dissipation component 68.

[0268] The main body 61E has a first component 62 and a second component 63, and is constructed by combining the first component 62 and the second component 63. The main body 61E has an opening 64, the first component 62 has a first surface 62A and a heat-receiving portion 621, and the second component 63 has a second surface 63A and a first heat-dissipating portion 631. Like the main body 61D, the main body 61E extends from the opening 64 in a direction opposite to the extension direction of the wiring 49, i.e., the -Y direction.

[0269] In the ejection-side cooling component 6E, the first surface 62A of the first component 62 is not directly connected to the pixel substrate 47, but is connected to the pixel substrate 47 via the clamping component 51 in a manner that allows for heat transfer. Furthermore, the main body 61E is disposed on the ejection-side dustproof substrate 48, and the first surface 62A is connected to the light-emitting surface 482 of the ejection-side dustproof substrate 48. That is, the ejection-side cooling component 6E is disposed on the ejection-side dustproof substrate 48 such that the portion surrounding the opening 64 on the first surface 62A is connected to the light-emitting surface 482. In other words, a portion of the heated portion 621 disposed around the opening 64 is connected to the light-emitting surface 482 of the ejection-side dustproof substrate 48 in a manner that allows for heat transfer, and another portion of the heated portion 621 is connected to the pixel substrate 47 via the clamping component 51 in a manner that allows for heat transfer.

[0270] Furthermore, of the heat generated in the liquid crystal layer 42, the heat transferred to the emission-side dustproof substrate 48 via the pixel substrate 47 is greater than the heat transferred to the clamping member 51 via the pixel substrate 47. Therefore, the heated part 621 and the clamping member 51 may not be connected in a manner that enables heat transfer.

[0271] Such a liquid crystal panel 4E achieves the same effect as the liquid crystal panels 4B and 4D mentioned above.

[0272] [Third variation of the second embodiment]

[0273] In the liquid crystal panel 4D, the heat-receiving portion 621 of the emission-side cooling member 6D is connected to the light-emitting surface 472 of the pixel substrate 47 and the side surface 483 of the emission-side dustproof substrate 48 in a manner that allows for heat transfer. In the liquid crystal panel 4E, the heat-receiving portion 621 is directly connected to the light-emitting surface 482 of the emission-side dustproof substrate 48. However, the connection portion of the heat-receiving portion 621 that connects to the pixel substrate 47 and the emission-side dustproof substrate 48 is not limited to the above structure.

[0274] Figure 13 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 4F, which is a variant of the liquid crystal panel 4D.

[0275] For example, it can also replace 4D LCD panels. Figure 13 The LCD panel shown is 4F.

[0276] The liquid crystal panel 4F has the same structure and function as the liquid crystal panel 4D, except that it has an ejection-side cooling component 6F instead of the ejection-side cooling component 6D. That is, the liquid crystal panel 4F has a panel body 41, wiring 49, holding housing 50, clamping component 51, and ejection-side cooling component 6F.

[0277] Like the injection-side cooling component 6D, the injection-side cooling component 6F dissipates heat to the outside by vaporizing the liquid refrigerant into a gaseous refrigerant through heat transferred from the pixel substrate 47 and the injection-side dustproof substrate 48. The injection-side cooling component 6F has the same structure and function as the injection-side cooling component 6D, except that it has a main body 61F instead of the main body 61D. That is, the injection-side cooling component 6F has a main body 61F and a first heat dissipation component 68.

[0278] The main body portion 61F, like the main body portion 61D, has a first component 62 and a second component 63, and is constructed by combining the first component 62 and the second component 63. The main body portion 61F is disposed on the pixel substrate 47 such that the first surface 62A of the first component 62 contacts the light emitting surface 472 of the pixel substrate 47. That is, a portion of the heat-receiving portion 621 of the main body portion 61F is connected to the pixel substrate 47 in a manner that allows for heat transfer.

[0279] The main body 61F has an opening 64C.

[0280] As described above, the opening 64C is a secondary hole having a first opening 64C1 on the light incident side and a second opening 64C2 on the light emitting side. An emitting-side dustproof substrate 48 is disposed inside the first opening 64C1, and the side surface 483 of the emitting-side dustproof substrate 48 is connected to the inner peripheral surface of the first opening 64C1 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. Furthermore, a portion of the light emitting surface 482 of the emitting-side dustproof substrate 48 is connected to a connecting portion 64C3 in a manner that allows for heat transfer, and this connecting portion 64C3 connects the inner peripheral surfaces of the first opening 64C1 and the second opening 64C2.

[0281] In other words, the main body 61F has a stepped portion formed by a first opening 64C1, a connecting portion 64C3, and a second opening 64C2. The inner circumferential surface of the first opening 64C1 corresponds to the inner circumferential surface of the stepped portion, and the connecting portion 64C3 corresponds to the bottom surface of the stepped portion.

[0282] Furthermore, in the main body 61F, the connection portion that connects to the pixel substrate 47 and the ejection-side dustproof substrate 48 is part of the heat-receiving portion 621. Therefore, the inner peripheral surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621.

[0283] Such a liquid crystal panel 4F can achieve the same effect as the liquid crystal panels 4C and 4D mentioned above.

[0284] Furthermore, in the liquid crystal panel 4F, similarly to the liquid crystal panel 4C, the first component 62 with the heat-receiving portion 621 and the pixel substrate 47 may not be connected in a manner capable of heat transfer. In this case, the main body 61F may also be fixed to the ejection-side dustproof substrate 48.

[0285] [Third Implementation Method]

[0286] Next, the third embodiment of the present invention will be described.

[0287] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but differs in that the main body of the emission-side cooling component of the liquid crystal panel extends not only from the opening in the direction of the extension of the wiring 49, but also from the opening in the direction opposite to the direction of the extension of the wiring 49. Furthermore, in the following description, the same reference numerals are used for parts that are the same as or substantially the same as those already described, and descriptions are omitted.

[0288] Figure 14 This is a schematic diagram showing a cross-section along the YZ plane of the liquid crystal panel 4G of the projector of this embodiment.

[0289] The projector in this embodiment, in addition to replacing the liquid crystal panel 4A of the first embodiment, has the following features: Figure 14 Apart from the liquid crystal panel 4G shown, it has the same structure and function as the projector 1 of the first embodiment.

[0290] The liquid crystal panel 4G has the same structure and function as the liquid crystal panel 4A, except that it has an ejection-side cooling component 6G instead of the ejection-side cooling component 6A. Specifically, the liquid crystal panel 4G has a panel body 41, wiring 49, a holding housing 50, and an ejection-side cooling component 6G. The panel body 41 has a liquid crystal layer 42, an incident portion 43, and an ejection portion 46. The incident portion 43 has an opposing substrate 44 and an incident-side dustproof substrate 45, and the ejection portion 46 has a pixel substrate 47 and an ejection-side dustproof substrate 48. Furthermore, the panel body 41 has a pixel region 41A composed of the liquid crystal layer 42, the opposing substrate 44, and the pixel substrate 47, and multiple pixels are arranged in the pixel region 41A.

[0291] The injection-side cooling component 6G also has a second heat dissipation component 69, which is larger than the injection-side cooling component 6A in the +Y direction, but otherwise has the same structure as the injection-side cooling component 6A. That is, the injection-side cooling component 6G has a main body 61G, a first heat dissipation component 68, and a second heat dissipation component 69.

[0292] The main body 61G has a first component 62, a second component 63, and an opening 64. The first component 62 has a first surface 62A and a heat-receiving portion 621. The second component 63 has a second surface 63A, a first heat-dissipating portion 631, and a second heat-dissipating portion 632.

[0293] The main body 61G is constructed by combining the first component 62 and the second component 63. In addition to extending from the opening 64 in the extension direction (+Y direction) of the wiring 49 extending from the liquid crystal layer 42, the main body 61G also extends from the opening 64 in the opposite direction (-Y direction) of the extension direction of the wiring 49 extending from the liquid crystal layer 42.

[0294] As described above, the first heat dissipation portion 631 is disposed in the second component 63 in the +Y direction relative to the opening 64. A first heat dissipation component 68 is provided on the second surface 63A of the second component 63 at a position corresponding to the first heat dissipation portion 631.

[0295] The second heat dissipation part 632 is disposed in the second component 63 in the -Y direction relative to the opening 64. A second heat dissipation component 69 is provided on the second surface 63A of the second component 63 at a position corresponding to the second heat dissipation part 632.

[0296] The second heat dissipation component 69 dissipates heat transferred from the second heat dissipation section 632 to the cooling gas flowing in the second heat dissipation component 69. The second heat dissipation component 69 may be a structure having multiple fins identical to the multiple fins 681, or it may be a structure having multiple fins formed in other shapes.

[0297] [The flow of cooling gas circulating in the LCD panel]

[0298] Cooling gas, circulated by a fan in a cooling device mounted on the outer casing 2, flows in the +Y direction relative to the liquid crystal panel 4G. Although not shown in the figure, the cooling gas circulating in the liquid crystal panel 4G is split at the -Y direction end of the liquid crystal panel 4G into cooling gas flowing in the space on the light incident side relative to the liquid crystal panel 4G and cooling gas flowing in the space on the light emitting side relative to the liquid crystal panel 4G.

[0299] Cooling gas flowing in the space relative to the light incident side of the LCD panel 4G flows in the +Y direction to cool the incident side dustproof substrate 45, and then cools the retaining housing 50.

[0300] Cooling gas flowing in the space relative to the light emitting side of the LCD panel 4G flows in the +Y direction to sequentially cool the second heat dissipation component 69, the dustproof substrate 48 on the emission side, and the first heat dissipation component 68.

[0301] In this way, by circulating cooling gas to the incident-side dustproof substrate 45, the holding housing 50, the ejection-side dustproof substrate 48, the first heat dissipation component 68, and the second heat dissipation component 69, the heat of the liquid crystal layer 42 is transferred to the cooling gas, and thus, in addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0302] In addition, in the 4G LCD panel, the first heat dissipation part 631 and the first heat dissipation component 68 are disposed in the +Y direction relative to the opening 64, and the second heat dissipation part 632 and the second heat dissipation component 69 are disposed in the -Y direction relative to the opening 64.

[0303] Therefore, when the liquid crystal panel 4G is arranged with the +Y direction as the upper vertical direction, the refrigerant condensed by the first condensation section corresponding to the first heat dissipation section 631 can be transported to the vaporization section of the heating section 621 corresponding to the connection section connected to the pixel substrate 47 and the connection section connected to the ejection side dustproof substrate 48 by means of capillary force and gravity.

[0304] Furthermore, when the LCD panel 4G is arranged with the -Y direction as the vertical direction and the upper side, the refrigerant condensed by the second condensation section corresponding to the second heat dissipation section 632 can be transported to the vaporization section of the heating section 621 corresponding to the connection section connected to the pixel substrate 47 and the connection section connected to the ejection side dustproof substrate 48 by means of capillary force and gravity.

[0305] Therefore, the heat transferred from the liquid crystal layer 42 via the pixel substrate 47 and the emission-side dustproof substrate 48 can promote the change of the refrigerant from liquid to gas at each vaporization section. That is, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0306] [Effects of the Third Implementation]

[0307] In addition to having the same effects as the projector in the first embodiment and the projector in the second embodiment, the projector described above also has the following effects.

[0308] That is, in addition to having the same effect as the liquid crystal panel 4A in the first embodiment and the liquid crystal panel 4D in the second embodiment, the liquid crystal panel 4G in this embodiment also has the following effect.

[0309] The liquid crystal panel 4G has a wiring 49 that supplies image signals to the liquid crystal layer 42. The main body 61G, which serves as the vapor chamber, extends from the opening 64 in both the +Y and -Y directions. The +Y direction corresponds to the extension direction of the wiring 49 extending from the liquid crystal layer 42, and the -Y direction corresponds to the direction opposite to the extension direction of the wiring 49 extending from the liquid crystal layer 42.

[0310] With this structure, the heat dissipation area of ​​the main body 61G from the gaseous refrigerant can be increased, thus making it easier to condense the gaseous refrigerant into a liquid refrigerant. Therefore, the liquid refrigerant can flow to the vaporization section without delay, promoting the vaporization of the liquid refrigerant by the heat of the liquid crystal layer 42.

[0311] Furthermore, by arranging the LCD panel 4G with one of the +Y and -Y directions as the vertical direction on the upper side, it is possible to transport the condensed liquid refrigerant to the vaporization section where the liquid refrigerant vaporizes, not only by using capillary force but also by using gravity.

[0312] This facilitates the change of the refrigerant from liquid to gas by utilizing the heat received by the heated portion 621. Consequently, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby enhancing the cooling efficiency of the liquid crystal layer 42.

[0313] [First variation of the third embodiment]

[0314] In the LCD panel 4G, the side surface 483 of the ejection-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64, which is part of the heated portion 621, via a thermally conductive adhesive in a manner that enables heat transfer.

[0315] However, this is not a limitation; the inner circumferential surfaces of the side surface 483 and the opening 64 may not be connected in a manner that allows for heat transfer. Alternatively, the side surface 483 and the inner circumferential surfaces of the opening 64 may be connected in a manner that allows for heat transfer via a heat transfer component such as a leaf spring. Furthermore, it is not limited to the side surface 483 being entirely connected to the inner circumferential surface of the opening 64 in a manner that allows for heat transfer; a portion of the side surface 483 may also be connected to the inner circumferential surface of the opening 64 in a manner that allows for heat transfer.

[0316] [Second variation of the third embodiment]

[0317] In the LCD panel 4G, the heat-receiving part 621 of the ejection-side cooling component 6G is directly connected to the light-emitting surface 472 of the pixel substrate 47, and is connected to the side surface 483 of the ejection-side dustproof substrate 48 in a way that allows heat transfer via a thermally conductive adhesive or the like.

[0318] However, this is not the only option; the heated portion 621 may also be directly connected to the injection-side dustproof substrate 48 instead of the pixel substrate 47. For example, a heat transfer component capable of transferring heat from the pixel substrate 47 to the heated portion 621 may be provided between the pixel substrate 47 and the heated portion 621.

[0319] Figure 15This is a schematic diagram showing a cross-section along the YZ plane of a modified liquid crystal panel 4H, which is a liquid crystal panel 4G.

[0320] For example, it can also replace 4G LCD panels. Figure 15 The LCD panel shown is 4H.

[0321] The LCD panel 4H has the same structure and function as the LCD panel 4G, except that it has the injection-side cooling component 6H and the clamping component 51 instead of the injection-side cooling component 6G.

[0322] That is, the liquid crystal panel 4H has a panel body 41, wiring 49, holding housing 50, clamping member 51 and injection side cooling member 6H.

[0323] The injection-side cooling component 6H has the same structure and function as the injection-side cooling component 6G, except that it has a main body 61H instead of the main body 61G. That is, the injection-side cooling component 6H has a main body 61H, a first heat dissipation component 68, and a second heat dissipation component 69.

[0324] The main body 61H has a first component 62, a second component 63, and an opening 64. The first component 62 has a first surface 62A and a heat-receiving portion 621. The second component 63 has a second surface 63A, a first heat-dissipating portion 631, and a second heat-dissipating portion 632. Similar to the main body 61A, the main body 61H extends from the opening 64 in the +Y direction, which is the extension direction of the wiring 49 extending from the liquid crystal layer 42. In addition, similar to the main body 61D, it extends from the opening 64 in the -Y direction, which is the opposite direction to the extension direction of the wiring 49 extending from the liquid crystal layer 42.

[0325] In the injection-side cooling component 6H, the first surface 62A of the first component 62 is not directly connected to the pixel substrate 47, but is connected to the pixel substrate 47 via the clamping component 51 in a manner that enables heat transfer. In addition, it is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer.

[0326] Furthermore, the first surface 62A is connected to the light emitting surface 482 of the emission-side dustproof substrate 48. Viewed from the emission direction of the image light formed using the liquid crystal panel 4H, the area of ​​the emission-side dustproof substrate 48 is larger than the area of ​​the opening 64 of the emission-side cooling member 6H. Moreover, the emission-side dustproof substrate 48 is not disposed inside the opening 64, and the first surface 62A is connected to the light emitting surface 482 of the emission-side dustproof substrate 48 at a portion surrounding the opening 64.

[0327] That is, the injection-side cooling component 6H is provided on the injection-side dustproof substrate 48 in such a way that the area around the opening 64 on the first surface 62A is connected to the light emission surface 482.

[0328] In other words, a portion of the heat-receiving portion 621 disposed around the opening 64 is connected to the light-emitting surface 482 of the emission-side dustproof substrate 48 in a manner that enables heat transfer; another portion of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping member 51 in a manner that enables heat transfer; and yet another portion of the heat-receiving portion 621 is connected to the opposing substrate 44 via the holding housing 50 in a manner that enables heat transfer. Furthermore, the heat transferred from the liquid crystal layer 42 to the emission-side dustproof substrate 48 via the pixel substrate 47 is transferred to the heat-receiving portion 621.

[0329] Furthermore, as described above, of the heat generated in the liquid crystal layer 42, the heat transferred to the emission-side dustproof substrate 48 via the pixel substrate 47 is greater than the heat transferred to the clamping member 51 via the pixel substrate 47. Therefore, the heated portion 621 and the clamping member 51 may not be connected in a manner that enables heat transfer.

[0330] This type of LCD panel 4H achieves the same effect as the aforementioned LCD panels 4B, 4E, and 4G.

[0331] [Third variation of the third embodiment]

[0332] In the liquid crystal panel 4G, the heat-receiving part 621 of the emission-side cooling component 6G is directly connected to the light-emitting surface 472 of the pixel substrate 47 and the side surface 483 of the emission-side dustproof substrate 48. Furthermore, in the liquid crystal panel 4H, the heat-receiving part 621 is directly connected to the light-emitting surface 482 of the emission-side dustproof substrate 48.

[0333] However, the connection portion in the heated portion 621 that is connected to the pixel substrate 47 and the ejection-side dustproof substrate 48 is not limited to the structure described above.

[0334] Figure 16 This is a schematic diagram showing a cross-section along the YZ plane of a modified liquid crystal panel 4I, which is a liquid crystal panel 4G.

[0335] For example, it can also replace 4G LCD panels. Figure 16 The LCD panel 4I shown is shown.

[0336] The liquid crystal panel 4I has the same structure and function as the liquid crystal panel 4G, except that it has an ejection-side cooling component 6I instead of the ejection-side cooling component 6G. That is, the liquid crystal panel 4I has a panel body 41, wiring 49, a holding housing 50, and an ejection-side cooling component 6I.

[0337] Like the injection-side cooling component 6G, the injection-side cooling component 6I dissipates heat to the outside by vaporizing the liquid refrigerant into a gaseous refrigerant through heat transferred from the pixel substrate 47 and the injection-side dustproof substrate 48. The injection-side cooling component 6I has the same structure and function as the injection-side cooling component 6G, except that it has a main body 61I instead of the main body 61G. That is, the injection-side cooling component 6I has a main body 61I, a first heat dissipation component 68, and a second heat dissipation component 69.

[0338] The main body 61I, like the main body 61G, has a first component 62 and a second component 63, and is constructed by combining the first component 62 and the second component 63. The main body 61I is disposed on the pixel substrate 47 such that the first surface 62A of the first component 62 contacts the light emitting surface 472 of the pixel substrate 47. That is, a portion of the heat-receiving portion 621 of the main body 61I is connected to the pixel substrate 47 in a manner that allows for heat transfer.

[0339] The main body 61I has an opening 64C.

[0340] As described above, the opening 64C is a secondary hole having a first opening 64C1 on the light incident side and a second opening 64C2 on the light emitting side. An emitting-side dustproof substrate 48 is disposed inside the first opening 64C1, and the side surface 483 of the emitting-side dustproof substrate 48 is connected to the inner peripheral surface of the first opening 64C1 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. A portion of the light emitting surface 482 of the emitting-side dustproof substrate 48 is connected to the connecting portion 64C3 in a manner that allows for heat transfer. This connecting portion 64C3 connects the inner peripheral surfaces of the first opening 64C1 and the second opening 64C2.

[0341] In other words, the main body 61I has a stepped portion formed by a first opening 64C1, a connecting portion 64C3, and a second opening 64C2. The inner circumferential surface of the first opening 64C1 corresponds to the inner circumferential surface of the stepped portion, and the connecting portion 64C3 corresponds to the bottom surface of the stepped portion.

[0342] In the main body 61I, the connection portion that connects to the pixel substrate 47 and the ejection-side dustproof substrate 48 is part of the heat-receiving portion 621. Therefore, the inner peripheral surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621.

[0343] Furthermore, similar to the main body 61G, the main body 61I extends not only from the opening 64C in the +Y direction (the direction in which the wiring 49 extends from the liquid crystal layer 42), but also in the -Y direction (the direction opposite to the direction in which the wiring 49 extends from the liquid crystal layer 42). The first heat dissipation part 631 and the first heat dissipation component 68 are disposed on the second surface 63A in the +Y direction relative to the opening 64C, and the second heat dissipation part 632 and the second heat dissipation component 69 are disposed on the second surface 63A in the -Y direction relative to the opening 64C.

[0344] Such a liquid crystal panel 4I can achieve the same effect as the liquid crystal panels 4C, 4F and 4G mentioned above.

[0345] Furthermore, in the liquid crystal panel 4I, similarly to the liquid crystal panels 4C and 4F, the first component 62 with the heat-receiving portion 621 and the pixel substrate 47 may not be connected in a manner capable of heat transfer. In this case, the main body 61I may also be fixed to the ejection-side dustproof substrate 48.

[0346] [Fourth Implementation Method]

[0347] Next, the fourth embodiment of the present invention will be described.

[0348] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but the arrangement of the cooling components in the liquid crystal panel is different. Furthermore, in the following description, the same reference numerals are used for parts that are the same as or substantially the same as those already described, and the descriptions are omitted.

[0349] Figure 17 This is a schematic diagram showing a cross-section along the YZ plane of the liquid crystal panel 7A of the projector of this embodiment.

[0350] The projector in this embodiment, in addition to replacing the liquid crystal panel 4A of the first embodiment, has the following features: Figure 17 Apart from the liquid crystal panel 7A shown, it has the same structure and function as the projector 1 of the first embodiment.

[0351] The liquid crystal panel 7A has the same structure as the liquid crystal panel 4A, except that it has a clamping member 51 and an incident-side cooling member 8A instead of an ejection-side cooling member 6A. That is, the liquid crystal panel 7A has a panel body 41, wiring 49, a holding housing 50, a clamping member 51, and an incident-side cooling member 8A. The panel body 41 has a liquid crystal layer 42, an incident portion 43, and an ejection portion 46. The incident portion 43 has an opposing substrate 44 and an incident-side dustproof substrate 45, and the ejection portion 46 has a pixel substrate 47 and an ejection-side dustproof substrate 48. Moreover, the panel body 41 has a pixel region 41A composed of the liquid crystal layer 42, the opposing substrate 44, and the pixel substrate 47, and a plurality of pixels are arranged in the pixel region 41A.

[0352] Furthermore, as shown in the second variation of the first embodiment, the clamping member 51 clamps the panel body 41 together with the retaining housing 50. In this embodiment, the retaining housing 50 does not have heat dissipation fins 502, and an incident-side cooling member 8A is provided on the light-incident side surface 50A of the retaining housing 50.

[0353] [Structure of the incident-side cooling component]

[0354] Similar to the ejection-side cooling component 6A, the incident-side cooling component 8A uses the heat transferred from the liquid crystal layer 42 to vaporize the liquid refrigerant sealed inside into a gaseous refrigerant, thereby consuming the heat transferred from the liquid crystal layer 42 and cooling the liquid crystal layer 42. It also receives the heat from the gaseous refrigerant and condenses the gaseous refrigerant into a liquid refrigerant, dissipating the heat received to the outside.

[0355] The incident-side cooling component 8A has a main body 81A and a first heat dissipation component 88. In addition to having a first component 82 and a second component 83 that are combined with each other, the main body 81A also has an opening 84.

[0356] Viewed from the incident side (-Z direction) of the light incident on the liquid crystal layer 42, the main body 81A extends outward compared to the opposing substrate 44 and the incident-side dustproof substrate 45.

[0357] The first component 82 is a substrate formed in the shape of a flat plate, and may also be referred to as a first substrate. The first component 82 has the same structure as the first component 62. The first component 82 has a first surface 82A, which is the side opposite to the second component 83. The first surface 82A is the surface that contacts the heating element. In this embodiment, the first surface 82A is a flat surface.

[0358] The first component 82 has a heat-receiving portion 821 that receives heat from the heating element. That is, the main body 81A of the steam chamber in this embodiment has a heat-receiving portion 821. The heat-receiving portion 821 will be described in detail later.

[0359] The second component 83 is a substrate formed in the shape of a flat plate, and may also be referred to as a second substrate. The second component 83 has the same structure as the second component 63. The second component 83 is joined to the first component 82, and together with the first component 82, they form an encapsulation space SP. In addition to having a second surface 83A, which is the side opposite to the first component 82, the second component 83 also has a first heat dissipation portion 831 disposed on the second surface 83A.

[0360] Furthermore, the second component 83 is heated by the refrigerant of the gas inside the sealed space SP in the first heat dissipation part 831, and dissipates the heat of the gas refrigerant to the outside.

[0361] In addition, although the illustration is omitted, the portion of the inner surface of the sealed space SP corresponding to the first heat dissipation portion 831, namely the first condensation portion, condenses the heated gaseous refrigerant into liquid refrigerant.

[0362] The opening 84 is a through hole that penetrates the main body 81A along the direction (+Z direction) where the first component 82 and the second component 83 are facing each other. The opening 84 is a generally rectangular opening when viewed from the +Z direction. The inner peripheral surface of the opening 84 is formed by the joint portion of the first component 82 and the second component 83.

[0363] Furthermore, the main body 81A extends from the opening 84 along the +Y direction, which is the extension direction of the wiring 49 extending from the liquid crystal layer 42. That is, the first component 82 and the second component 83 extend from the opening 84 toward the extension direction (+Y direction) of the wiring 49.

[0364] [Structure of the heated section]

[0365] The heated portion 821 is the part of the first component 82 that is connected to the heating element and receives heat from the heating element. That is, the heated portion 821 can be defined as the connection portion in the first component 82 that is connected to the heating element. The heated portion 821 is provided in the first component 82 around the opening 84.

[0366] In this embodiment, the heated portion 821 is connected to the light incident surface 441 of the opposing substrate 44 and the side surface 453 of the incident-side dustproof substrate 45, and receives the heat from the opposing substrate 44 and the incident-side dustproof substrate 45.

[0367] Although the illustration is omitted, the portion of the inner surface of the sealed space SP corresponding to the heated portion 821 can be called the vaporization portion, which uses the heat from the heated portion 821 to vaporize the liquid refrigerant.

[0368] In detail, the part of the inner surface of the sealed space SP that comes into contact with the liquid refrigerant is the vaporization part, which is vaporized by the heat transferred from the heated part 821.

[0369] [Structure of the first heat dissipation section]

[0370] The first heat dissipation unit 831 is provided in the second component 83 on the second surface 83A opposite to the first component 82. The first heat dissipation unit 831 dissipates heat from the refrigerant of the gas flowing in the sealed space SP.

[0371] Although the illustration is omitted, the portion on the inner surface of the sealed space SP corresponding to the first heat dissipation portion 831 can be referred to as the first condensation portion of the refrigerant that condenses the gaseous refrigerant into a liquid by being heated from the gaseous refrigerant.

[0372] Specifically, in the portion of the inner surface of the sealed space SP that comes into contact with the gaseous refrigerant, the portion that receives heat from the gaseous refrigerant and condenses the gaseous refrigerant into liquid refrigerant is the first condensation section. The heat received from the gaseous refrigerant through this first condensation section is dissipated through the first heat dissipation section 831.

[0373] The first heat dissipation portion 831 is disposed relative to the opening 64 in the extending direction of the wiring 49 extending from the liquid crystal layer 42. A first heat dissipation component 88 is disposed on the second surface 83A at a position corresponding to the first heat dissipation portion 831. By providing the first heat dissipation component 88 to the first heat dissipation portion 831, the first heat dissipation portion 831 becomes a portion of the second component 83 that easily dissipates heat received from the gaseous refrigerant to the outside of the main body portion 81A.

[0374] Therefore, in the incident-side cooling component 8A, the portion in which the first heat dissipation component 88 is provided is configured as the first heat dissipation section 831.

[0375] [Configuration of the incident-side cooling components relative to the panel body]

[0376] The incident-side cooling component 8A is disposed on the light-incident side relative to the liquid crystal layer 42. Specifically, the incident-side cooling component 8A is disposed on the light-incident surface 441 of the opposing substrate 44, which serves as the incident-side substrate, and the first surface 82A of the first component 82 is connected to the light-incident surface 441 of the opposing substrate 44 in a manner that enables heat transfer.

[0377] Additionally, an incident-side dustproof substrate 45 is disposed within the opening 84. The side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84 via a thermally conductive adhesive in a manner that enables heat transfer.

[0378] That is, the inner circumferential surface of the opening 84 is part of the heated part 821.

[0379] [Heat transfer path generated in the liquid crystal layer]

[0380] Of the heat transferred from the liquid crystal layer 42 to the opposing substrate 44, a portion of the heat is transferred to the heated portion 821 via the opposing substrate 44, and another portion of the heat is transferred from the opposing substrate 44 to the heated portion 821 via the incident-side dustproof substrate 45.

[0381] More specifically, in Figure 17 In the incident-side cooling component 8A shown, heat transferred from the liquid crystal layer 42 to the opposing substrate 44 is transferred to the heated portion 821 that is in contact with the light incident surface 441 of the opposing substrate 44. On the other hand, heat transferred to the incident-side dustproof substrate 45 is transferred to the inner peripheral surface of the opening 84 that is connected to the side surface 453 of the incident-side dustproof substrate 45 in a manner that enables heat transfer.

[0382] The first component 82, which has a heat-receiving portion 821, uses the heat transferred from the liquid crystal layer 42 to vaporize the refrigerant of the liquid encapsulated in the space SP, thereby consuming the heat transferred to the first component 82. As a result, the opposing substrate 44, the incident-side dustproof substrate 45, and consequently the liquid crystal layer 42 are cooled.

[0383] The gaseous refrigerant flowing within the sealed space SP and reaching the first condenser is condensed into liquid refrigerant at the first condenser. The heat received by the gaseous refrigerant from the first condenser is transferred from the first heat dissipation section 831 to the first heat dissipation component 88, and is dissipated by the first heat dissipation component 88.

[0384] [The flow of cooling gas circulating in the LCD panel]

[0385] Cooling gas, circulated by a fan in a cooling device mounted on the outer casing 2, flows in the +Y direction relative to the liquid crystal panel 7A. Although not shown in the figure, the cooling gas flowing in the liquid crystal panel 7A, like the cooling gas flowing in the liquid crystal panel 4A, is split at the -Y direction end of the liquid crystal panel 7A into cooling gas flowing in the space on the light incident side relative to the liquid crystal panel 7A and cooling gas flowing in the space on the light emitting side relative to the liquid crystal panel 7A.

[0386] Cooling gas flowing in the space relative to the light incident side of the liquid crystal panel 7A flows in the +Y direction to cool the incident-side dustproof substrate 45, and then flows along the second surface 83A in the +Y direction, thereby flowing in the first heat dissipation member 88. The first heat dissipation member 88 transfers the heat transferred from the first heat dissipation section 831 to the cooling gas.

[0387] Cooling gas flowing in the space relative to the light emission side of the liquid crystal panel 7A flows in the +Y direction to cool the dustproof substrate 48 on the emission side, then cools the clamping member 51, and then cools circuit components such as the drive circuit 491.

[0388] In this way, by circulating cooling gas to the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, the clamping member 51, and the first heat dissipation member 88 where the heat of the liquid crystal layer 42 is transferred, the heat of the liquid crystal layer 42 is transferred to the cooling gas, and the liquid crystal layer 42 is cooled.

[0389] Furthermore, in the liquid crystal panel 7A, the first heat dissipation section 831 is also positioned in the +Y direction relative to the opening 84. Therefore, when the liquid crystal panel 7A is arranged with the +Y direction as the upper vertical direction, the refrigerant condensed in the liquid after the first condensation section can be transported to the vaporization section not only by capillary force but also by gravity. The vaporization section transfers heat received by the heating section 821 to vaporize the liquid refrigerant.

[0390] Therefore, the heat transferred from the liquid crystal layer 42 through the opposing substrate 44 and the incident-side dustproof substrate 45 can promote the change of the refrigerant from liquid to gas at the vaporization section.

[0391] That is, it can improve the heat dissipation efficiency of the liquid crystal layer 42, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0392] [Effects of the Fourth Implementation]

[0393] In addition to achieving the same effect as the projector 1 of the first embodiment, the projector described above also achieves the following effects. That is, in addition to achieving the same effect as the liquid crystal panel 4A of the first embodiment, the liquid crystal panel 7A of this embodiment also achieves the following effects.

[0394] The projector of this embodiment has a liquid crystal panel 7A, which serves as a light modulation device for modulating light emitted from a light source. The liquid crystal panel 7A is a transmissive liquid crystal panel that emits modulated light along the travel direction of the light incident on the liquid crystal panel.

[0395] The liquid crystal panel 7A has a pixel region 41A, a liquid crystal layer 42, an incident portion 43, an emitted portion 46, and a main body portion 81A. Multiple pixels are arranged in the pixel region 41A. The liquid crystal layer 42 modulates light according to each of the multiple pixels. The incident portion 43 allows light to enter the liquid crystal layer 42. The emitted portion 46 emits the light modulated by the liquid crystal layer 42 as image light. The main body portion 81A is a vapor chamber constituting the incident-side cooling component 8A. The main body portion 81A has an opening 84, a heat receiving portion 821, and a first heat dissipation portion 831. The opening 84 is disposed on the main body portion 81A corresponding to the pixel region 41A. The heat receiving portion 821 is disposed around the opening 84. The first heat dissipation portion 831 dissipates heat received by the heat receiving portion 821.

[0396] The main body 81A uses the heat received by the heated part 821 to vaporize the liquid refrigerant sealed inside the sealed space SP, and uses the first heat dissipation part 831 to dissipate the heat of the gaseous refrigerant, thereby condensing the gaseous refrigerant into liquid refrigerant. The sealed space SP is located inside the main body 81A.

[0397] Here, the vapor chamber does not require piping for refrigerant flow or wiring for supplying drive power.

[0398] Based on the above structure, compared with the case of setting a cooling device for refrigerant flow and the case of setting a thermoelectric conversion element such as a Peltier element that uses electricity to move heat, the structure of the liquid crystal panel 7A can be simplified.

[0399] Therefore, it is possible to miniaturize the projector that houses the LCD panel 7A. Furthermore, since the LCD panel 7A can be installed and removed from the projector without installing and disconnecting piping and wiring, the LCD panel 7A can be easily replaced.

[0400] Furthermore, since the heated portion 821 located around the opening 84 corresponding to the pixel region 41A is heated, the temperature uniformity in the pixel region 41A can be improved.

[0401] In the liquid crystal panel 7A, the incident portion 43 has a counter substrate 44, which is connected to the liquid crystal layer 42 in a manner that allows for heat transfer and allows light incident on the liquid crystal layer 42 to pass through. In this embodiment, the counter substrate 44 is equivalent to a light-transmitting incident-side substrate. Viewed from the -Z direction, the area of ​​the counter substrate 44 is larger than the area of ​​the pixel region 41A. The -Z direction corresponds to the direction opposite to the direction of light travel to the liquid crystal layer 42. The main body 81A, which serves as the vapor chamber, is disposed on the counter substrate 44 in a manner that allows for heat transfer.

[0402] According to this structure, the main body 81A is disposed on the opposing substrate 44 in a manner that enables heat transfer. The opposing substrate 44 is connected to the liquid crystal layer 42 in a manner that enables heat transfer, thereby allowing the heated part 821 to easily receive heat from the liquid crystal layer 42 via the opposing substrate 44.

[0403] Therefore, the liquid crystal layer 42 can be easily cooled.

[0404] In the liquid crystal panel 7A, the incident portion 43 has a counter substrate 44 that has a common electrode electrically connected to the liquid crystal layer 42 and is disposed on the light incident side relative to the liquid crystal layer 42. The common electrode is equivalent to the incident side electrode, and the counter substrate 44 is equivalent to a light-transmitting incident side electrode substrate. The counter substrate 44 is an incident side substrate on which the main body portion 81A, which serves as a vapor chamber, is provided.

[0405] With this structure, the opposing substrate 44 is a light-transmitting substrate directly connected to the heat-sensitive liquid crystal layer 42. Since the main body portion 81A is provided on this opposing substrate 44, the heat generated by the liquid crystal layer 42 can be efficiently transferred to the main body portion 81A. Therefore, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0406] In the liquid crystal panel 7A, the incident portion 43 has an incident-side dustproof substrate 45 disposed on the light incident surface 441 of the opposing substrate 44. The light incident surface 441 corresponds to the light incident side surface of the opposing substrate 44. The incident-side dustproof substrate 45 has a light incident surface 451, a light emission surface 452, and a side surface 453. The light incident surface 451 corresponds to the light incident side surface of the incident-side dustproof substrate 45, and the light emission surface 452 corresponds to the light emission side surface of the incident-side dustproof substrate 45. The side surface 453 connects the light incident surface 451 and the light emission surface 452.

[0407] The heated portion 821 is heated from the light incident surface 441 of the opposing substrate 44 and the side surface 453 of the incident-side dustproof substrate 45.

[0408] According to this structure, the heat-receiving part 821 is heated from the opposing substrate 44 and the incident-side dustproof substrate 45, so the heat of the liquid crystal layer 42 can be transferred to the heat-receiving part 821 via the opposing substrate 44 and the incident-side dustproof substrate 45 respectively.

[0409] Therefore, the heat of the liquid crystal layer 42 can be efficiently transferred to the heated part 821, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0410] In the liquid crystal panel 7A, the opposing substrate 44 has a common electrode disposed corresponding to the pixel area 41A as an incident side electrode.

[0411] As described above, in a typical transmissive liquid crystal panel, an opposing substrate is disposed on the light incident side relative to the liquid crystal layer, and a pixel substrate is disposed on the light emitting side relative to the liquid crystal layer.

[0412] Therefore, by providing a main body portion 81A with the above structure, that is, a main body portion 81A serving as a vapor chamber, on a general transmissive liquid crystal panel, a liquid crystal panel 7A that achieves the above-mentioned effect can be constructed.

[0413] The liquid crystal panel 7A has a wiring 49 that supplies image signals to the driving liquid crystal layer 42. The main body 81A, which serves as the vapor chamber, extends from the opening 84 in the extending direction in which the wiring 49 extends from the liquid crystal layer 42.

[0414] With such a structure, for example, compared to the case where the main body extends from the opening 84 in the opposite direction to the extension direction of the wiring 49, it is possible to suppress the enlargement of the liquid crystal panel 7A in the extension direction of the wiring 49.

[0415] [First variation of the fourth embodiment]

[0416] In the liquid crystal panel 7A, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84, which is part of the heated portion 821, via a thermally conductive adhesive in a manner that enables heat transfer.

[0417] However, this is not a limitation; the inner circumferential surfaces of side 453 and opening 84 may not be connected in a manner that enables heat transfer. Alternatively, similarly, the inner circumferential surfaces of side 453 and opening 84 may be connected in a manner that enables heat transfer via a structure other than a thermally conductive adhesive, such as a heat transfer component like a leaf spring.

[0418] Furthermore, it is not limited to the fact that the entire side surface 453 is connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer; it is also possible that a portion of the side surface 453 is connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer.

[0419] [Second variation of the fourth embodiment]

[0420] In the liquid crystal panel 7A, the heated part 821 of the incident side cooling member 8A is directly connected to the light incident surface 441 of the opposing substrate 44, and is connected to the side surface 453 of the incident side dustproof substrate 45 in a way that allows heat transfer via a thermally conductive adhesive or the like.

[0421] However, this is not the only option; the heated portion 821 may also be directly connected to the incident-side dustproof substrate 45 instead of the opposing substrate 44. For example, a heat transfer member capable of transferring heat from the opposing substrate 44 to the heated portion 821 may be provided between the opposing substrate 44 and the heated portion 821.

[0422] Figure 18 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 7B, which is a variant of the liquid crystal panel 7A.

[0423] For example, it can also be used Figure 18 The LCD panel 7B shown is used instead of the LCD panel 7A.

[0424] The LCD panel 7B has the same structure and function as the LCD panel 7A, except that it has an incident-side cooling component 8B instead of the incident-side cooling component 8A.

[0425] That is, the liquid crystal panel 7B has a panel body 41, wiring 49, holding housing 50, clamping member 51, and incident side cooling member 8B.

[0426] The incident-side cooling component 8B has a main body 81B and a first heat dissipation component 88. The main body 81B has a first component 82, a second component 83, and an opening 84. The first component 82 has a first surface 82A and a heat-receiving portion 821, and the second component 83 has a second surface 83A and a first heat dissipation portion 831.

[0427] In the incident-side cooling component 8B, the first surface 82A of the first component 82 is not directly connected to the opposing substrate 44, but is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer. In addition, the first surface 82A is connected to the light incident surface 451 of the incident-side dustproof substrate 45.

[0428] That is, in the liquid crystal panel 7B, when viewed from the opposite direction (-Z direction) of the direction of light propagation to the liquid crystal layer 42, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the opening 84 of the incident-side cooling member 8B.

[0429] Therefore, the incident-side dustproof substrate 45 is not disposed inside the opening 84, and the main body 81B is disposed on the incident-side dustproof substrate 45.

[0430] The heat transferred to the incident-side dustproof substrate 45 is transferred to the first component 82 through the first surface 82A.

[0431] That is, a portion of the heat-receiving portion 821 of the main body 81B is the portion of the first component 82 that is connected to the light incident surface 451 of the incident-side dustproof substrate 45. In addition, heat transfer from the liquid crystal layer 42 to the holding housing 50 is also transferred via the opposing substrate 44, so another portion of the heat-receiving portion 821 is the portion that is connected to the opposing substrate 44 via the holding housing 50 in a manner that allows heat transfer.

[0432] In addition, of the heat generated in the liquid crystal layer 42, the heat transferred to the incident-side dustproof substrate 45 via the opposing substrate 44 is greater than the heat transferred to the holding housing 50 via the opposing substrate 44. Therefore, the heated part 821 and the holding housing 50 may not be connected in a way that allows for heat transfer.

[0433] [Effects of the second variation of the fourth embodiment]

[0434] In addition to having the same effect as the aforementioned LCD panel 7A, this LCD panel 7B also has the following effects.

[0435] In the liquid crystal panel 7B, the incident portion 43 has an opposing substrate 44 and an incident-side dustproof substrate 45.

[0436] The opposing substrate 44 is a light-transmitting incident-side electrode substrate that has a common electrode electrically connected to the liquid crystal layer 42 and is disposed on the light-incident side relative to the liquid crystal layer 42. The common electrode corresponds to the incident-side electrode. An incident-side dustproof substrate 45 is disposed on the light-incident surface 441 of the opposing substrate 44. The light-incident surface 441 corresponds to the light-incident side surface of the opposing substrate 44. The incident-side dustproof substrate 45 is an incident-side substrate provided with a main body portion 81B serving as a vapor chamber.

[0437] With this structure, the main body 81B is disposed on the incident-side dustproof substrate 45 in a manner that allows for heat transfer. The incident-side dustproof substrate 45 is positioned closer to the light incident side than the opposing substrate 44. Therefore, compared to the case where the main body 81B is disposed on the opposing substrate 44 to avoid the incident-side dustproof substrate 45, the main body 81B can be easily connected to the incident portion 43.

[0438] Here, the heat generated in the liquid crystal layer 42 is transferred to the incident-side dustproof substrate 45 via the opposing substrate 44, thus causing heat diffusion in the liquid crystal layer 42.

[0439] In contrast, the first component 82 of the main body 81B is connected to the light incident surface 451 of the incident-side dustproof substrate 45, so that the heat of the liquid crystal layer 42 can be easily transferred to the heat-receiving part 821 in the first component 82.

[0440] In the liquid crystal panel 7B, the main body 81B, which serves as the vapor chamber, is provided on the light incident surface 451 of the incident-side dustproof substrate 45. The light incident surface 451 corresponds to the light incident side surface of the incident-side dustproof substrate 45.

[0441] With this structure, for example, compared to the case where the incident-side dustproof substrate 45 is disposed in the opening 84 corresponding to the pixel area, even if the main body 81B, which serves as the vapor chamber, has tolerances, the main body 81B can be easily mounted on the incident part 43.

[0442] [Third variation of the fourth embodiment]

[0443] In the liquid crystal panel 7A, the heat-receiving portion 821 of the incident-side cooling member 8A is connected to the light-incident surface 441 of the opposing substrate 44 and the side surface 453 of the incident-side dustproof substrate 45 in a manner capable of heat transfer. In the liquid crystal panel 7B, the heat-receiving portion 821 is directly connected to the light-incident surface 451 of the incident-side dustproof substrate 45. However, the connection portion of the heat-receiving portion 821 that connects to the opposing substrate 44 and the incident-side dustproof substrate 45 is not limited to the above structure.

[0444] Figure 19 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 7C, which is a variant of the liquid crystal panel 7A.

[0445] For example, it can also be used Figure 19 The LCD panel 7C shown is used instead of LCD panel 7A.

[0446] The liquid crystal panel 7C has the same structure and function as the liquid crystal panel 7A, except that it has an incident-side cooling component 8C instead of the incident-side cooling component 8A. That is, the liquid crystal panel 7C has a panel body 41, wiring 49, holding housing 50, clamping component 51, and incident-side cooling component 8C.

[0447] Similar to the incident-side cooling component 8A, the incident-side cooling component 8C vaporizes the liquid refrigerant into a gaseous refrigerant by heat transferred from the opposing substrate 44 and the incident-side dustproof substrate 45, and dissipates the heat received by the gaseous refrigerant to the outside. The incident-side cooling component 8C has the same structure and function as the incident-side cooling component 8A, except that it has a main body 81C instead of the main body 81A. That is, the incident-side cooling component 8C has a main body 81C and a first heat dissipation component 88.

[0448] The main body 81C, like the main body 81A, has a first component 82 and a second component 83, and is constructed by combining the first component 82 and the second component 83. In addition, the first component 82 has a first surface 82A and a heat-receiving portion 821, and the second component 83 has a second surface 83A and a first heat-dissipating portion 831.

[0449] The main body 81C has an opening 84C.

[0450] The opening 84C is a secondary hole similar to the opening 64C, having a first opening 84C1 provided on the light emission side (+Z direction) and a second opening 84C2 provided on the light incident side (-Z direction).

[0451] The inner diameter of the first opening 84C1 is larger than the inner diameter of the second opening 84C2. An incident-side dustproof substrate 45 is disposed inside the first opening 84C1, and the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the first opening 84C1 in a manner that enables heat transfer via a thermally conductive adhesive or the like.

[0452] The connecting portion 84C3, which connects the inner peripheral surfaces of the first opening 84C1 and the second opening 84C2, is substantially parallel to a plane perpendicular to the direction of light travel (+Z direction) through the incident-side dustproof substrate 45. A portion of the light incident surface 451 of the incident-side dustproof substrate 45 is connected to the connecting portion 84C3 in a manner that allows for heat transfer. In other words, the main body 81C has a stepped portion formed by the first opening 84C1, the connecting portion 84C3, and the second opening 84C2. Furthermore, the inner peripheral surface of the first opening 84C1 corresponds to the inner peripheral surface of the stepped portion, and the connecting portion 84C3 corresponds to the bottom surface of the stepped portion.

[0453] Furthermore, in the main body 81C, the connection portion that connects to the opposing substrate 44 and the incident-side dustproof substrate 45 is part of the heat-receiving portion 821. Therefore, the inner peripheral surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821.

[0454] [Effects of the third variation of the fourth embodiment]

[0455] In addition to having the same effect as the aforementioned LCD panels 7A and 7B, this LCD panel 7C also has the following effects.

[0456] In the liquid crystal panel 7C, the incident-side dustproof substrate 45 has a side surface 453 that connects the light incident surface 451 and the light emitting surface 452. The light incident surface 451 corresponds to the light incident side of the incident-side dustproof substrate 45, and the light emitting surface 452 corresponds to the light emitting side of the incident-side dustproof substrate 45.

[0457] The inner peripheral surface of the first opening 84C1 of the main body 81C is connected to at least a portion of the side surface 453 of the incident-side dustproof substrate 45 in a manner that allows for heat transfer. Furthermore, the connecting portion 84C3 of the main body 81C is connected to the light incident surface 451 of the incident-side dustproof substrate 45 in a manner that allows for heat transfer. That is, the inner peripheral surface of the first opening 84C1 and the connecting portion 84C3 are part of the heated portion 821.

[0458] According to this structure, the heat transferred to the liquid crystal layer 42 of the incident-side dustproof substrate 45 can be received through the inner peripheral surface of the first opening 84C1 and the connecting portion 84C3.

[0459] Therefore, compared to the case where a main body serving as a vapor chamber is provided on the light incident surface 451 of the incident-side dustproof substrate 45, it is possible to suppress the increase in size of the liquid crystal panel 7C in the direction of light transmission (+Z direction).

[0460] In the LCD panel 7C, the heated part 821 is connected to the opposing substrate 44 in a manner that enables heat transfer.

[0461] With this structure, heat is transferred not only from the side surface 453 of the incident-side dustproof substrate 45 to the heated portion 821, but also from the opposing substrate 44 to the heated portion 821. Therefore, heat from the liquid crystal layer 42 can be easily transferred to the heated portion 821, thus improving the cooling efficiency of the liquid crystal layer 42.

[0462] Alternatively, in the liquid crystal panel 7C, the first component 82 with the heat-receiving portion 821 and the opposing substrate 44 may not be connected in a manner that enables heat transfer. In this case, the main body 81C may be fixed to the incident-side dustproof substrate 45.

[0463] [Fifth Implementation Method]

[0464] Next, the fifth embodiment of the present invention will be described.

[0465] The projector of this embodiment has the same configuration as the projector of the fourth embodiment, but the position of the first heat dissipation member in the incident-side cooling component of the liquid crystal panel is different. Furthermore, in the following description, the same reference numerals are used for parts that are the same as or substantially the same as those already described, and the descriptions are omitted.

[0466] Figure 20 This is a schematic diagram showing a cross-section along the YZ plane of the liquid crystal panel 7D of the projector of this embodiment.

[0467] The projector in this embodiment, in addition to replacing the liquid crystal panel 7A of the fourth embodiment, has Figure 20 Apart from the liquid crystal panel 7D shown, it has the same structure and function as the projector 1 of the fourth embodiment.

[0468] The liquid crystal panel 7D has the same structure as the liquid crystal panel 7A in the fourth embodiment, except that it has an incident-side cooling member 8D instead of an incident-side cooling member 8A. That is, the liquid crystal panel 7D has a panel body 41, wiring 49, holding housing 50, clamping member 51, and incident-side cooling member 8D.

[0469] Similar to the incident-side cooling component 8A, the incident-side cooling component 8D uses the heat transferred from the opposing substrate 44 and the incident-side dustproof substrate 45 to vaporize the liquid refrigerant sealed inside, thereby cooling the liquid crystal layer 42 and dissipating the heat received from the gaseous refrigerant. The incident-side cooling component 8D has a main body 81D and a first heat dissipation component 88.

[0470] The main body 81D has a first component 82 and a second component 83, which are assembled together. The main body 81D has an opening 84.

[0471] The main body 81D extends from the opening 84 in the -Y direction, which is opposite to the direction in which the wiring 49 extends from the liquid crystal layer 42. Therefore, on the second surface 83A of the second component 83, the first heat dissipation portion 831 is disposed in the -Y direction relative to the opening 84. The first heat dissipation component 88 is disposed on the second surface 83A at a position corresponding to the first heat dissipation portion 831.

[0472] In addition, an incident-side dustproof substrate 45 is disposed inside the opening 84, and the inner peripheral surface of the opening 84 and the side surface 453 of the incident-side dustproof substrate 45 are connected in a way that allows heat transfer by means of a thermally conductive adhesive or the like.

[0473] That is, in the main body 81D, the heat-receiving part 821 is connected to the light incident surface 451 of the opposing substrate 44, and is also connected to the side surface 453 of the incident-side dustproof substrate 45 in a way that allows heat transfer.

[0474] [The flow of cooling gas circulating in the LCD panel]

[0475] Cooling gas, circulated by a fan in the cooling device configured in the outer casing 2, flows relative to the LCD panel 7D in the +Y direction.

[0476] Cooling gas, which flows in the space relative to the light incident side of the liquid crystal panel 7D, flows in the +Y direction to cool the first heat dissipation component 88 and the incident side dustproof substrate 45, and then cools the holding housing 50.

[0477] Cooling gas flowing in the space relative to the light-emitting side of the LCD panel 7D flows in the +Y direction to cool the dustproof substrate 48 on the emission side, and then cools the clamping member 51.

[0478] In this way, in the liquid crystal panel 7D, cooling gas flows to the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, the holding housing 50, the clamping member 51, and the first heat dissipation member 88, thereby transferring the heat of the liquid crystal layer 42 to the cooling gas. In addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0479] Furthermore, in the liquid crystal panel 7D, the first heat dissipation section 831 and the first heat dissipation component 88 are disposed in the -Y direction relative to the opening 84. Therefore, when the liquid crystal panel 7D is arranged with the -Y direction as the upper vertical direction, the refrigerant condensed by the first condensation section corresponding to the first heat dissipation section 831 can be transported to the vaporization section in the heated section 821 corresponding to the connection portion connected to the opposing substrate 44 and the connection portion connected to the incident-side dustproof substrate 45, not only by capillary force but also by gravity.

[0480] Therefore, the heat transferred from the liquid crystal layer 42 via the opposing substrate 44 and the incident-side dustproof substrate 45 can promote the change of the refrigerant from liquid to gas at the vaporization section. That is, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0481] [Effects of the Fifth Implementation]

[0482] In addition to achieving the same effect as the projector in the fourth embodiment, the projector described above also achieves the following effects. Specifically, the liquid crystal panel 7D of this embodiment, in addition to achieving the same effect as the liquid crystal panel 7A of the fourth embodiment, also achieves the following effects.

[0483] The liquid crystal panel 7D has wiring 49 that supplies image signals to the liquid crystal layer 42. The main body 81D, which serves as the vapor chamber, extends from the opening 84 in the -Y direction. The -Y direction is the direction opposite to the direction in which the wiring 49 extends from the liquid crystal layer 42.

[0484] With this structure, interference between the wiring 49 and the main body 81D can be suppressed, thus preventing the heat dissipation of the main body 81D from being hindered by the wiring 49.

[0485] [First variation of the fifth embodiment]

[0486] In the LCD panel 7D, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84, which is part of the heated portion 821, via a thermally conductive adhesive in a manner that enables heat transfer.

[0487] However, this is not a limitation; the inner circumferential surfaces of the side surface 453 and the opening 84 may not be connected in a manner that enables heat transfer. Furthermore, the inner circumferential surfaces of the side surface 453 and the opening 84 may be connected in a manner that enables heat transfer via a heat transfer component such as a leaf spring.

[0488] Furthermore, it is not limited to the fact that the entire side surface 453 is connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer; it is also possible that a portion of the side surface 453 is connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer.

[0489] [Second variation of the fifth embodiment]

[0490] In the LCD panel 7D, the heated part 821 is directly connected to the light incident surface 441 of the opposing substrate 44, and is connected to the side surface 453 of the incident-side dustproof substrate 45 in a way that allows heat transfer via a thermally conductive adhesive or the like.

[0491] However, this is not the only option; the heated portion 821 may also be directly connected to the incident-side dustproof substrate 45 instead of the opposing substrate 44. For example, a heat transfer member capable of transferring heat from the opposing substrate 44 to the heated portion 821 may be provided between the opposing substrate 44 and the heated portion 821.

[0492] Figure 21 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 7E, which is a variant of the liquid crystal panel 7D.

[0493] For example, it can also replace the 7D LCD panel. Figure 21 The LCD panel shown is 7E.

[0494] The liquid crystal panel 7E has the same structure and function as the liquid crystal panel 7D, except that it has an incident-side cooling component 8E instead of the incident-side cooling component 8D. That is, the liquid crystal panel 7E has a panel body 41, wiring 49, holding housing 50, clamping component 51, and incident-side cooling component 8E.

[0495] The incident-side cooling component 8E has a main body 81E and a first heat dissipation component 88. Like the main body 81D, the main body 81E has a first component 82, a second component 83, and an opening 84. The first component 82 has a first surface 82A and a heat-receiving portion 821, and the second component 83 has a second surface 83A and a first heat dissipation portion 831. Like the main body 81D, the main body 81E extends from the opening 84 in the opposite direction to the extension direction of the wiring 49 extending from the liquid crystal layer 42, i.e., the -Y direction.

[0496] In the incident-side cooling component 8E, the first surface 82A of the first component 82 is not directly connected to the opposing substrate 44, but is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer. Furthermore, the main body 81E is disposed on the incident-side dustproof substrate 45, and the first surface 82A is directly connected to the light incident surface 451 of the incident-side dustproof substrate 45.

[0497] That is, the incident-side cooling component 8E is provided on the incident-side dustproof substrate 45 in such a way that the area around the opening 84 on the first surface 82A is connected to the light incident surface 451.

[0498] In other words, a portion of the heat-receiving portion 821 disposed around the opening 84 is connected to the light incident surface 451 of the incident-side dustproof substrate 45 in a manner that enables heat transfer, and another portion of the heat-receiving portion 821 is connected to the opposing substrate 44 via the holding housing 50 in a manner that enables heat transfer. Heat transfer from the liquid crystal layer 42 to the holding housing 50 is also transferred via the pixel substrate 47.

[0499] Furthermore, of the heat generated in the liquid crystal layer 42, the heat transferred to the incident-side dustproof substrate 45 via the opposing substrate 44 is greater than the heat transferred to the holding housing 50 via the opposing substrate 44 and the pixel substrate 47.

[0500] Therefore, the heated part 821 and the retaining shell 50 may not be connected in a way that allows for heat transfer.

[0501] Such an LCD panel 7E achieves the same effect as the aforementioned LCD panels 7B and 7D.

[0502] [Third variation of the fifth embodiment]

[0503] In the liquid crystal panel 7D, the heat-receiving part 821 of the incident-side cooling member 8D is connected to the light-incident surface 441 of the opposing substrate 44 and the side surface 453 of the incident-side dustproof substrate 45 in a manner that enables heat transfer. In the liquid crystal panel 7E, the heat-receiving part 821 is directly connected to the light-incident surface 451 of the incident-side dustproof substrate 45.

[0504] However, the connection portion in the heated portion 821 that is connected to the opposing substrate 44 and the incident-side dustproof substrate 45 is not limited to the structure described above.

[0505] Figure 22 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 7F, which is a variant of the liquid crystal panel 7D.

[0506] For example, it can also replace the 7D LCD panel. Figure 22 The LCD panel shown is 7F.

[0507] The liquid crystal panel 7F has the same structure and function as the liquid crystal panel 7D, except that it has an incident-side cooling component 8F instead of the incident-side cooling component 8D. That is, the liquid crystal panel 7F has a panel body 41, wiring 49, holding housing 50, clamping component 51, and incident-side cooling component 8F.

[0508] Similar to the incident-side cooling component 8D, the incident-side cooling component 8F dissipates heat to the outside by vaporizing the liquid refrigerant into a gaseous refrigerant through heat transferred from the opposing substrate 44 and the incident-side dustproof substrate 45. The incident-side cooling component 8F has the same structure and function as the incident-side cooling component 8D, except that it has a main body 81F instead of the main body 81D. That is, the incident-side cooling component 8F has a main body 81F and a first heat dissipation component 88.

[0509] The main body 81F has a first component 82, a second component 83, and an opening 84C. In addition, like the main body 81D, the main body 81F extends from the opening 84C in the opposite direction to the extension direction of the wiring 49 extending from the liquid crystal layer 42, i.e., the -Y direction.

[0510] As shown in the third variation of the fourth embodiment, the opening 84C is a secondary hole having a first opening 84C1 on the light emission side and a second opening 84C2 on the light incident side. The inner diameter of the first opening 84C1 is larger than the inner diameter of the second opening 84C2, and an incident-side dustproof substrate 45 is disposed inside the first opening 84C1. The side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the first opening 84C1 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. A portion of the light incident surface 451 of the incident-side dustproof substrate 45 is connected to the connecting portion 84C3 in a manner that allows for heat transfer.

[0511] In other words, the main body 81F has a stepped portion formed by a first opening 84C1, a connecting portion 84C3, and a second opening 84C2. The inner circumferential surface of the first opening 84C1 corresponds to the inner circumferential surface of the stepped portion, and the connecting portion 84C3 corresponds to the bottom surface of the stepped portion.

[0512] Furthermore, in the main body 81F, the connection portion that connects to the opposing substrate 44 and the incident-side dustproof substrate 45 is part of the heat-receiving portion 821. Therefore, the inner peripheral surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821.

[0513] The 7F LCD panel achieves the same effect as the aforementioned 7C and 7D LCD panels.

[0514] Furthermore, in the liquid crystal panel 7F, similarly to the liquid crystal panel 7C, the first component 82 having the heat-receiving portion 821 and the opposing substrate 44 may not be connected in a manner capable of heat transfer. In this case, the main body 81F may also be fixed to the incident-side dustproof substrate 45.

[0515] [Sixth Implementation Method]

[0516] Next, the sixth embodiment of the present invention will be described.

[0517] The projector of this embodiment has the same structure as the projector of the fourth embodiment, but it differs in that the main body of the incident-side cooling component of the liquid crystal panel extends from the opening in the direction of extending the wiring 49, and also extends in the opposite direction to the direction of extending the wiring 49.

[0518] Furthermore, in the following description, the same reference numerals are used for parts that are the same as or substantially the same as those already described, and the descriptions are omitted.

[0519] Figure 23 This is a schematic diagram showing a cross-section along the YZ plane of the liquid crystal panel 7G of the projector of this embodiment.

[0520] The projector in this embodiment, in addition to having Figure 23 The liquid crystal panel 7G shown here replaces the liquid crystal panel 7A of the fourth embodiment, and has the same structure and function as the projector of the fourth embodiment.

[0521] The liquid crystal panel 7G has the same structure as the liquid crystal panel 7A of the fourth embodiment, except that it has an incident-side cooling component 8G instead of an incident-side cooling component 8A. That is, the liquid crystal panel 7G has a panel body 41, wiring 49, holding housing 50, clamping member 51, and incident-side cooling component 8G. The panel body 41 has a liquid crystal layer 42, an incident portion 43, and an emission portion 46. The incident portion 43 has an opposing substrate 44 and an incident-side dustproof substrate 45, and the emission portion 46 has a pixel substrate 47 and an emission-side dustproof substrate 48.

[0522] Furthermore, the panel body 41 has a pixel region 41A composed of a liquid crystal layer 42, an opposing substrate 44 and a pixel substrate 47, and a plurality of pixels are arranged in the pixel region 41A.

[0523] The incident-side cooling component 8G also has a second heat dissipation component 89, which is larger than the incident-side cooling component 8A in the +Y direction, but otherwise has the same structure as the incident-side cooling component 8A. That is, the incident-side cooling component 8G has a main body 81G, a first heat dissipation component 88, and a second heat dissipation component 89.

[0524] The main body 81G has a first component 82, a second component 83, and an opening 84. The first component 82 has a first surface 82A and a heat-receiving portion 821. The second component 83 has a second surface 83A, a first heat-dissipating portion 831, and a second heat-dissipating portion 832.

[0525] The main body 81G is constructed by combining the first component 82 and the second component 83. In addition to extending from the opening 84 in the extension direction (+Y direction) of the wiring 49 extending from the liquid crystal layer 42, the main body 81G also extends from the opening 84 in the opposite direction (-Y direction) of the extension direction of the wiring 49 extending from the liquid crystal layer 42.

[0526] As described above, the first heat dissipation portion 831 is disposed in the second component 83 in the +Y direction relative to the opening 84. A first heat dissipation component 88 is provided on the second surface 83A of the second component 83 at a position corresponding to the first heat dissipation portion 831.

[0527] The second heat dissipation part 832 is disposed in the second component in the -Y direction relative to the opening 84. A second heat dissipation component 89 is provided on the second surface 83A of the second component 83 at a position corresponding to the second heat dissipation part 832.

[0528] The second heat dissipation component 89 dissipates heat transferred from the second heat dissipation section 832 to the cooling gas flowing in the second heat dissipation component 89. The second heat dissipation component 89 may be a structure having multiple fins identical to the multiple fins 681, or it may be a structure having multiple fins formed in other shapes.

[0529] [The flow of cooling gas circulating in the LCD panel]

[0530] Cooling gas, circulated by a fan in the cooling device configured in the outer casing 2, flows in the +Y direction relative to the LCD panel 7G.

[0531] Cooling gas flowing in the space relative to the light incident side of the LCD panel 7G flows in the +Y direction to sequentially cool the second heat dissipation component 89, the incident side dustproof substrate 45, and the first heat dissipation component 88.

[0532] Cooling gas flowing in the space relative to the light emission side of the LCD panel 7G flows in the +Y direction to cool the dustproof substrate 48 on the emission side, and then cools the clamping member 51.

[0533] In this way, by circulating cooling gas to the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, the clamping member 51, the first heat dissipation member 88, and the second heat dissipation member 89, the heat of the liquid crystal layer 42 is transferred to the cooling gas, and thus, in addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0534] In addition, in the LCD panel 7G, the first heat dissipation part 831 and the first heat dissipation component 88 are disposed in the +Y direction relative to the opening 84, and the second heat dissipation part 832 and the second heat dissipation component 89 are disposed in the -Y direction relative to the opening 84.

[0535] Therefore, when the liquid crystal panel 7G is arranged with the +Y direction as the upper vertical direction, the refrigerant condensed by the first condensation section corresponding to the first heat dissipation section 831 can be transported to the vaporization section of the heating section 821 corresponding to the connection section connected to the opposing substrate 44 and the connection section connected to the incident side dustproof substrate 45 by means of capillary force and gravity.

[0536] Furthermore, when the liquid crystal panel 7G is arranged with the -Y direction as the vertical direction and the upper side, the refrigerant condensed by the second condensation section corresponding to the second heat dissipation section 832 can be transported to the vaporization section of the heating section 821 corresponding to the connection section connected to the opposing substrate 44 and the connection section connected to the incident side dustproof substrate 45 by means of capillary force and gravity.

[0537] Therefore, the heat transferred from the liquid crystal layer 42 through the opposing substrate 44 and the incident-side dustproof substrate 45 can promote the change of the refrigerant from liquid to gas at each vaporization section.

[0538] That is, it can improve the heat dissipation efficiency of the liquid crystal layer 42, thereby improving the cooling efficiency of the liquid crystal layer 42.

[0539] [Effects of the Sixth Implementation Method]

[0540] In addition to having the same effects as the projectors in the fourth and fifth embodiments, the projector described above also has the following effects.

[0541] That is, in addition to having the same effect as the liquid crystal panel 7A of the fourth embodiment and the liquid crystal panel 7D of the fifth embodiment, the liquid crystal panel 7G of this embodiment also has the following effect.

[0542] The liquid crystal panel 7G has a wiring 49 that supplies image signals to the liquid crystal layer 42. The main body 81G, which serves as the vapor chamber, extends from the opening 84 in both the +Y and -Y directions. The +Y direction corresponds to the extension direction of the wiring 49 extending from the liquid crystal layer 42, and the -Y direction corresponds to the direction opposite to the extension direction of the wiring 49 extending from the liquid crystal layer 42.

[0543] With this structure, the heat dissipation area of ​​the main body 81G from the gaseous refrigerant can be increased, thus making it easier to condense the gaseous refrigerant into a liquid refrigerant. Therefore, the liquid refrigerant can flow to the vaporization section without delay, promoting the vaporization of the liquid refrigerant by the heat of the liquid crystal layer 42.

[0544] Furthermore, by arranging the LCD panel 7G with one of the +Y and -Y directions as the vertical direction and facing upwards, the condensed liquid refrigerant can be transported to the vaporization section where the liquid refrigerant vaporizes, not only by capillary force but also by gravity.

[0545] This facilitates the change of the refrigerant from liquid to gas by utilizing the heat received by the heated portion 821. Consequently, the heat dissipation efficiency of the liquid crystal layer 42 can be improved, thereby enhancing the cooling efficiency of the liquid crystal layer 42.

[0546] [First variation of the sixth embodiment]

[0547] In the LCD panel 7G, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84, which is part of the heated portion 821, via a thermally conductive adhesive in a manner that enables heat transfer.

[0548] However, this is not a limitation; the inner circumferential surfaces of the side surface 453 and the opening 84 may not be connected in a manner that enables heat transfer. Alternatively, the inner circumferential surfaces of the side surface 453 and the opening 84 may be connected in a manner that enables heat transfer via a heat transfer component such as a leaf spring.

[0549] Furthermore, it is not limited to the fact that the entire side surface 453 is connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer; it is also possible that a portion of the side surface 453 is connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer.

[0550] [Second variation of the sixth embodiment]

[0551] In the LCD panel 7G, the heated part 821 of the incident side cooling component 8G is directly connected to the light incident surface 441 of the opposing substrate 44, and is connected to the side surface 453 of the incident side dustproof substrate 45 in a way that allows heat transfer via a thermally conductive adhesive or the like.

[0552] However, it is not limited to this. The heated part 821 may also be directly connected to the incident side dustproof substrate 45, instead of being directly connected to the opposing substrate 44.

[0553] For example, a heat transfer member capable of transferring heat from the opposing substrate 44 to the heated portion 821 may be provided between the opposing substrate 44 and the heated portion 821.

[0554] Figure 24 This is a schematic diagram showing a cross-section along the YZ plane of a modified liquid crystal panel 7H, which is a liquid crystal panel 7G.

[0555] For example, it can also be used Figure 24 The LCD panel 7H shown is used instead of LCD panel 7G.

[0556] The liquid crystal panel 7H has the same structure and function as the liquid crystal panel 7G, except that it has an incident-side cooling component 8H instead of the incident-side cooling component 8G. That is, the liquid crystal panel 7H has a panel body 41, wiring 49, holding housing 50, clamping component 51, and incident-side cooling component 8H.

[0557] The incident-side cooling component 8H has a main body 81H, a first heat dissipation component 88, and a second heat dissipation component 89. The main body 81H has a first component 82, a second component 83, and an opening 84. The first component 82 has a first surface 82A and a heat-receiving portion 821. The second component 83 has a second surface 83A, a first heat dissipation portion 831, and a second heat dissipation portion 832. Similar to the main body 81A, the main body 81H extends from the opening 84 in the +Y direction, which is the extension direction of the wiring 49 extending from the liquid crystal layer 42. In addition, similar to the main body 81D, it extends from the opening 84 in the -Y direction, which is the direction opposite to the extension direction of the wiring 49.

[0558] In the incident-side cooling component 8H, the first surface 82A of the first component 82 is not directly connected to the opposing substrate 44, but is connected to the opposing substrate 44 via the retaining housing 50 in a manner that allows for heat transfer. In addition, the first surface 82A is connected to the light incident surface 451 of the incident-side dustproof substrate 45.

[0559] That is, when viewed from the opposite direction (-Z direction) of the direction of light propagation incident on the liquid crystal layer 42, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the opening 84 of the incident-side cooling member 8H. Therefore, the incident-side dustproof substrate 45 is not disposed inside the opening 84, and the first surface 82A is connected to the light incident surface 451 of the incident-side dustproof substrate 45 at the portion around the opening 84.

[0560] That is, the incident-side cooling component 8H is provided on the incident-side dustproof substrate 45 in such a way that the area around the opening 84 on the first surface 82A is connected to the light incident surface 451.

[0561] In other words, a portion of the heated portion 821 disposed around the opening 84 is connected to the light incident surface 451 of the incident-side dustproof substrate 45 in a manner that enables heat transfer, another portion of the heated portion 821 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer, and yet another portion of the heated portion 821 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer.

[0562] Furthermore, the heat transferred from the liquid crystal layer 42 to the incident-side dustproof substrate 45 via the opposing substrate 44 is transferred to the heated portion 821.

[0563] Furthermore, as described above, of the heat generated in the liquid crystal layer 42, the heat transferred to the incident-side dustproof substrate 45 via the opposing substrate 44 is greater than the heat transferred to the holding housing 50 via the opposing substrate 44. Therefore, the heated portion 821 and the holding housing 50 may not be connected in a manner that enables heat transfer.

[0564] Such a liquid crystal panel 7H achieves the same effect as the liquid crystal panels 7B, 7E, and 7G mentioned above.

[0565] [Third variation of the sixth embodiment]

[0566] In the liquid crystal panel 7G, the heat-receiving part 821 of the incident-side cooling member 8G is connected to the light-incident surface 441 of the opposing substrate 44 and the side surface 453 of the incident-side dustproof substrate 45 in a manner that enables heat transfer. Furthermore, in the liquid crystal panel 7H, the heat-receiving part 821 is connected to the light-incident surface 451 of the incident-side dustproof substrate 45 in a manner that enables heat transfer.

[0567] However, the connection portion in the heated portion 821 that is connected to the opposing substrate 44 and the incident-side dustproof substrate 45 is not limited to the structure described above.

[0568] Figure 25 This is a schematic diagram showing a cross-section along the YZ plane of a modified liquid crystal panel 7I, which is a liquid crystal panel 7G.

[0569] For example, it can also replace the 7G LCD panel. Figure 25 The LCD panel 7I shown is shown.

[0570] The liquid crystal panel 7I has the same structure and function as the liquid crystal panel 7G, except that it has an incident-side cooling component 8I instead of the incident-side cooling component 8G. That is, the liquid crystal panel 7I has a panel body 41, wiring 49, holding housing 50, clamping component 51, and incident-side cooling component 8I.

[0571] Like the incident-side cooling component 8G, the incident-side cooling component 8I dissipates heat to the outside by vaporizing the liquid refrigerant into a gaseous refrigerant through heat transferred from the opposing substrate 44 and the incident-side dustproof substrate 45. The incident-side cooling component 8I has the same structure and function as the incident-side cooling component 8G, except that it has a main body 81I instead of the main body 81G.

[0572] That is, the incident-side cooling component 8I has a main body 81I, a first heat dissipation component 88, and a second heat dissipation component 89.

[0573] The main body 81I, like the main body 81G, has a first component 82 and a second component 83, and is constructed by combining the first component 82 and the second component 83. The main body 81I is disposed on the opposing substrate 44 such that the first surface 82A of the first component 82 contacts the light incident surface 441 of the opposing substrate 44.

[0574] That is, a portion of the heat-receiving portion 821 of the main body 81I is connected to the opposing substrate 44 in a manner that enables heat transfer.

[0575] The main body 81I has an opening 84C.

[0576] As shown in the third variation of the fourth embodiment, the opening 84C is a secondary hole having a first opening 84C1 on the light emission side and a second opening 84C2 on the light incident side. An incident-side dustproof substrate 45 is disposed inside the first opening 84C1, and the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the first opening 84C1 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. A portion of the light incident surface 451 of the incident-side dustproof substrate 45 is connected to the connecting portion 84C3 in a manner that allows for heat transfer.

[0577] In other words, the main body 81I has a stepped portion formed by a first opening 84C1, a connecting portion 84C3, and a second opening 84C2. The inner circumferential surface of the first opening 84C1 corresponds to the inner circumferential surface of the stepped portion, and the connecting portion 84C3 corresponds to the bottom surface of the stepped portion.

[0578] In the main body 81I, the connection portion that connects to the opposing substrate 44 and the incident-side dustproof substrate 45 is part of the heat-receiving portion 821. Therefore, the inner peripheral surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821.

[0579] Furthermore, similar to the main body 81G, the main body 81I extends not only from the opening 84C in the +Y direction (the direction in which the wiring 49 extends from the liquid crystal layer 42), but also in the -Y direction (the direction opposite to the direction in which the wiring 49 extends from the liquid crystal layer 42). The first heat dissipation part 831 and the first heat dissipation component 88 are disposed on the second surface 83A in the +Y direction relative to the opening 84C, and the second heat dissipation part 832 and the second heat dissipation component 89 are disposed on the second surface 83A in the -Y direction relative to the opening 84C.

[0580] This LCD panel 7I achieves the same effect as the aforementioned LCD panels 7C, 7F, and 7G.

[0581] Furthermore, in the liquid crystal panel 7I, similarly to the liquid crystal panels 7C and 7F, the first component 82 having the heat-receiving portion 821 and the opposing substrate 44 may not be connected in a manner capable of heat transfer. In this case, the main body 81C may be fixed to the incident-side dustproof substrate 45.

[0582] [Seventh Implementation Method]

[0583] Next, the seventh embodiment of the present invention will be described.

[0584] The projector of this embodiment has the same structure as the projector of the first embodiment, but differs in that the liquid crystal panel has an incident-side cooling component and an emission-side cooling component. Furthermore, in the following description, the same reference numerals are used for parts that are the same as or substantially the same as those already described, and the descriptions are omitted.

[0585] Figure 26 This is a schematic diagram showing a cross-section along the YZ plane of the liquid crystal panel 9A of the projector of this embodiment.

[0586] The projector in this embodiment, in addition to replacing the liquid crystal panel 4A of the first embodiment, has the following features: Figure 26 Except for the liquid crystal panel 9A shown, it has the same structure as the projector 1 of the first embodiment.

[0587] In addition to the structure of the liquid crystal panel 4A in the first embodiment, the liquid crystal panel 9A also has an incident-side cooling member 8A. In other words, in addition to the structure of the liquid crystal panel 7A in the fourth embodiment, the liquid crystal panel 9A also has an ejection-side cooling member 6A.

[0588] That is, the liquid crystal panel 9A has a panel body 41, wiring 49, a holding housing 50, an emission-side cooling component 6A, and an incident-side cooling component 8A. As described in the first embodiment, the panel body 41 has a liquid crystal layer 42, an incident portion 43, and an emission portion 46. The incident portion 43 has an opposing substrate 44 and an incident-side dustproof substrate 45, and the emission portion 46 has a pixel substrate 47 and an emission-side dustproof substrate 48.

[0589] In this embodiment, the incident-side dustproof substrate 45 is equivalent to the first dustproof substrate, and the ejection-side dustproof substrate 48 is equivalent to the second dustproof substrate.

[0590] The main body 81A constituting the incident-side cooling component 8A corresponds to the first vapor chamber, and the first component 82, the second component 83, and the opening 84 constituting the main body 81A correspond to the first heat-receiving part, the first heat-dissipating part, and the first opening, respectively. When viewed from the incident side (-Z direction) of the light incident on the liquid crystal layer 42, the main body 81A extends further outward than the opposing substrate 44 and the incident-side dustproof substrate 45.

[0591] The main body 61A constituting the emission-side cooling component 6A corresponds to the second vapor chamber, and the first component 62, the second component 63, and the opening 64 constituting the main body 61A correspond to the second heat-receiving part, the second heat-dissipating part, and the second opening, respectively. Viewed from the emission side (+Z direction) of the light emitted from the liquid crystal layer 42, the main body 61A extends further outward than the pixel substrate 47 and the emission-side dustproof substrate 48.

[0592] Furthermore, the main body 81A and the main body 61A are positioned opposite each other in the incident direction (+Z direction) of light relative to the liquid crystal layer 42.

[0593] In the liquid crystal panel 9A, a portion of the heat-receiving part 621 of the emission-side cooling member 6A is connected to the light-emitting surface 472 of the pixel substrate 47 constituting the panel body 41 in a manner that allows for heat transfer. The inner peripheral surface of the opening 64 of the emission-side cooling member 6A is connected to the side surface 483 of the emission-side dustproof substrate 48 in a manner that allows for heat transfer via a thermally conductive adhesive or the like. The inner peripheral surface of the opening 64 is a part of the heat-receiving part 621.

[0594] In addition, the injection-side cooling component 6A can be disposed on the pixel substrate 47 or on the injection-side dustproof substrate 48.

[0595] In the liquid crystal panel 9A, a portion of the heat-receiving part 821 of the incident-side cooling member 8A is connected to the light-incident surface 441 of the opposing substrate 44 constituting the panel body 41 in a manner that allows heat transfer. The inner peripheral surface of the opening 84 of the incident-side cooling member 8A is connected to the side surface 453 of the incident-side dustproof substrate 45 in a manner that allows heat transfer via a thermally conductive adhesive or the like. The inner peripheral surface of the opening 84 is a part of the heat-receiving part 821.

[0596] In addition, the incident-side cooling component 8A can be disposed on the opposing substrate 44 or on the incident-side dustproof substrate 45.

[0597] In such a liquid crystal panel 9A, similar to the liquid crystal panels 4A-4I and 7A-7I described above, cooling gas flows from the cooling device along the +Y direction.

[0598] The cooling gas flowing in the space on the light incident side relative to the liquid crystal panel 9A flows in the +Y direction to cool the dustproof substrate 45 on the incident side and the first heat dissipation component 88.

[0599] The cooling gas flowing in the space on the light emission side relative to the liquid crystal panel 9A flows in the +Y direction to cool the dustproof substrate 48 on the emission side and the first heat dissipation component 68.

[0600] In this way, in the liquid crystal panel 9A, the heat of the liquid crystal layer 42 is dissipated to the outside of the liquid crystal panel 9A through the incident-side dustproof substrate 45, the emission-side dustproof substrate 48, the emission-side cooling component 6A, and the incident-side cooling component 8A. In addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0601] [Effects of the Seventh Implementation]

[0602] The projector described above in this embodiment achieves the same effect as the projector 1 in the first embodiment and the projector in the fourth embodiment. That is, the liquid crystal panel 9A in this embodiment can achieve the same effect as the liquid crystal panel 4A in the first embodiment and the liquid crystal panel 7A in the fourth embodiment.

[0603] Specifically, the liquid crystal panel 9A is a transmissive liquid crystal panel that emits modulated light along the direction of light travel incident on the liquid crystal panel. The liquid crystal panel 9A includes a pixel region 41A, a liquid crystal layer 42, an opposing substrate 44, an incident-side dustproof substrate 45, a pixel substrate 47, an emission-side dustproof substrate 48, and main body portions 61A and 81A. Multiple pixels are arranged in the pixel region 41A.

[0604] The liquid crystal layer 42 modulates light according to each of the plurality of pixels. The opposing substrate 44 has a common electrode disposed corresponding to the pixel area. The pixel substrate 47 has a plurality of pixel electrodes disposed corresponding to the plurality of pixels respectively, and the liquid crystal layer 42 is carried between the pixel substrate 47 and the opposing substrate 44.

[0605] The incident-side dustproof substrate 45 is equivalent to the first dustproof substrate and is disposed on the opposite side of the opposing substrate 44. The ejection-side dustproof substrate 48 is equivalent to the second dustproof substrate and is disposed on the opposite side of the opposing substrate 44 on the pixel substrate 47.

[0606] The main body 81A corresponds to the first vapor chamber and has an opening 84 as a first opening, a heating portion 821 as a first heating portion, and a first heat dissipation portion 831 as a first heat dissipation portion. The opening 84 is the opening corresponding to the pixel region 41A. The heating portion 821 is disposed around the opening 84 and is connected to at least one of the opposing substrate 44 and the incident-side dustproof substrate 45 in a manner that allows heat transfer. The first heat dissipation portion 831 dissipates the heat received by the heating portion 821. The main body 81A uses the heat received by the heating portion 821 to vaporize the liquid refrigerant sealed inside, and uses the first heat dissipation portion 831 to dissipate the heat of the gaseous refrigerant, thereby condensing the gaseous refrigerant into liquid refrigerant. The refrigerant sealed in the sealing space SP of the main body 81A corresponds to the first refrigerant.

[0607] The main body 61A corresponds to the second vapor chamber and has an opening 64 as a second opening, a heated portion 621 as a second heated portion, and a first heat dissipation portion 631 as a second heat dissipation portion. The opening 64 corresponds to the pixel region 41A. The heated portion 621 is disposed around the opening 64 and is connected to at least one of the pixel substrate 47 and the ejection-side dustproof substrate 48 in a manner that allows heat transfer. The first heat dissipation portion 631 dissipates heat received by the heated portion 621. The main body 61A utilizes the heat received by the heated portion 621 to vaporize the liquid refrigerant sealed inside, and utilizes the first heat dissipation portion 631 to dissipate heat from the gaseous refrigerant, thereby condensing the gaseous refrigerant into a liquid refrigerant. The refrigerant sealed within the sealing space SP of the main body 61A corresponds to the second refrigerant.

[0608] Based on this structure, it can achieve the same effect as LCD panels 4A and 7A.

[0609] Furthermore, the liquid crystal panel 9A has: a main body portion 81A, which is connected to at least one of the opposing substrate 44 and the incident-side dustproof substrate 45 in a manner that enables heat transfer; and a main body portion 61A, which is connected to at least one of the pixel substrate 47 and the emission-side dustproof substrate 48 in a manner that enables heat transfer, thereby further improving the cooling efficiency of the liquid crystal layer 42.

[0610] In the liquid crystal panel 9A, viewed from the incident side of light incident on the liquid crystal layer 42, the main body 81A, which serves as the first vapor chamber, extends outward from the opposing substrate 44 and the incident-side dustproof substrate 45. Viewed from the emission side of light emitted from the liquid crystal layer 42, the main body 61A, which serves as the second vapor chamber, extends outward from the pixel substrate 47 and the emission-side dustproof substrate 48. The main body 81A and the main body 61A are opposite to each other in the direction of light incident on the liquid crystal layer 42.

[0611] With this structure, compared to the case where the main body 81A and the main body 61A are not opposite each other, it is possible to suppress the enlargement of the liquid crystal panel 9A.

[0612] [First variation of the seventh embodiment]

[0613] In the liquid crystal panel 9A, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84, which is part of the heated portion 821 in the main body 81A of the incident-side cooling component 8A, via a thermally conductive adhesive in a manner that enables heat transfer. Similarly, the side surface 483 of the ejection-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64, which is part of the heated portion 621 in the main body 61A of the ejection-side cooling component 6A, via a thermally conductive adhesive in a manner that enables heat transfer.

[0614] However, not limited to this, at least one of the side surfaces 453 of the incident-side dustproof substrate 45 and the side surface 483 of the ejection-side dustproof substrate 48 may not be connected to the inner peripheral surfaces of the corresponding openings in the openings 84 of the incident-side cooling component 8A and the openings 64 of the ejection-side cooling component 6A in a manner that enables heat transfer.

[0615] In addition, at least one of the side surface 453 of the incident-side dustproof substrate 45 and the side surface 483 of the ejection-side dustproof substrate 48 can be connected to the inner peripheral surface of the corresponding opening in the opening 84 of the incident-side cooling component 8A and the opening 64 of the ejection-side cooling component 6A in a manner that enables heat transfer via a heat transfer member such as a leaf spring.

[0616] In addition, as described above, a portion of the side surface 453 may be connected to the inner peripheral surface of the opening 84 in a manner that enables heat transfer, or a portion of the side surface 483 may be connected to the inner peripheral surface of the opening 64 in a manner that enables heat transfer.

[0617] [Second variation of the seventh embodiment]

[0618] In the LCD panel 9A, an ejection-side cooling component 6A is used as the ejection-side cooling component, and an incident-side cooling component 8A is used as the incident-side cooling component.

[0619] However, the structure of the incident-side cooling component and the emission-side cooling component are not limited to the structures described above. For example, the liquid crystal panel may also be configured to have one of the emission-side cooling components 6A to 6I as an emission-side cooling component and one of the incident-side cooling components 8A to 8I as an incident-side cooling component.

[0620] In this case, when viewed from the emission side (+Z direction) of the light emitted from the liquid crystal layer 42, the emission-side cooling component can also be configured such that the main body extends further outward than the pixel substrate 47 and the emission-side dustproof substrate 48.

[0621] In addition, when viewed from the incident side (-Z direction) of the light incident on the liquid crystal layer 42, the incident side cooling component can also be configured such that the main body extends further outward than the opposing substrate 44 and the incident side dustproof substrate 45.

[0622] Furthermore, the ejection-side cooling component and the incident-side cooling component can be arranged such that the main body of the ejection-side cooling component and the main body of the incident-side cooling component are opposite to each other in the incident direction (+Z direction) of the light relative to the liquid crystal layer 42.

[0623] Figure 27 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9B, which is a variant of the liquid crystal panel 9A.

[0624] For example, it can also be used Figure 27 The liquid crystal panel 9B shown is used to replace the liquid crystal panel 9A.

[0625] The liquid crystal panel 9B has a structure that combines the liquid crystal panel 4B shown in the second variation of the first embodiment and the liquid crystal panel 7B shown in the second variation of the fourth embodiment. That is, the liquid crystal panel 9B has a panel body 41, wiring 49, a holding housing 50, a clamping member 51, an ejection-side cooling member 6B, and an incident-side cooling member 8B.

[0626] In the liquid crystal panel 9B, the emission-side cooling component 6B is disposed on the emission-side dustproof substrate 48 in such a way that a heat-receiving portion 621 disposed around the opening 64 is connected to the light-emitting surface 482. Another part of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping component 51 in a manner that enables heat transfer.

[0627] In the liquid crystal panel 9B, the incident-side cooling component 8B is disposed on the incident-side dustproof substrate 45 in such a way that a heated portion 821 disposed around the opening 84 is connected to the light incident surface 451. Another part of the heated portion 821 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer.

[0628] Furthermore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer, and the heated part 821 and the retaining housing 50 may not be connected in a way that enables heat transfer.

[0629] This 9B LCD panel achieves the same effect as LCD panels 4B, 7B, and 9A.

[0630] [Third variation of the seventh embodiment]

[0631] Figure 28 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9C, which is a variant of the liquid crystal panel 9A.

[0632] For example, it can also be used Figure 28 The LCD panel 9C shown is used instead of LCD panel 9A.

[0633] The liquid crystal panel 9C has a structure that combines the liquid crystal panel 4C shown in the third variation of the first embodiment and the liquid crystal panel 7C shown in the third variation of the fourth embodiment.

[0634] That is, the liquid crystal panel 9C has a panel body 41, wiring 49, holding housing 50, clamping member 51, ejection side cooling member 6C and incident side cooling member 8C.

[0635] In the liquid crystal panel 9C, the ejection-side dustproof substrate 48 is disposed within the first opening 64C1 of the ejection-side cooling component 6C. The inner edge of the first opening 64C1 is connected to the side surface 483 of the ejection-side dustproof substrate 48, and the connecting portion 64C3 is connected to a portion of the light emitting surface 482 of the ejection-side dustproof substrate 48.

[0636] Furthermore, the heated portion 621 of the first component 62 is connected to the pixel substrate 47.

[0637] In the liquid crystal panel 9C, the incident-side dustproof substrate 45 is disposed within the first opening 84C1 of the incident-side cooling component 8C. The inner edge of the first opening 84C1 is connected to the side surface 453 of the incident-side dustproof substrate 45, and the connecting portion 84C3 is connected to a portion of the light incident surface 451 of the incident-side dustproof substrate 45.

[0638] In addition, the heated portion 821 of the first component 82 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer.

[0639] Furthermore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer, and the heated part 821 and the retaining housing 50 may not be connected in a way that enables heat transfer.

[0640] Such a 9C LCD panel achieves the same effect as LCD panels 4C, 7C, and 9A.

[0641] [Fourth variation of the seventh embodiment]

[0642] Figure 29 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9D, which is a variant of the liquid crystal panel 9A.

[0643] For example, it can also be used Figure 29 The LCD panel 9D shown is used to replace the LCD panel 9A.

[0644] The liquid crystal panel 9D has a structure that combines the liquid crystal panel 4D shown in the second embodiment and the liquid crystal panel 7D shown in the fifth embodiment.

[0645] That is, the liquid crystal panel 9D has a panel body 41, wiring 49, holding housing 50, ejection-side cooling component 6D and incident-side cooling component 8D.

[0646] Furthermore, the main body 61D of the ejection-side cooling component 6D extends from the opening 64 in the -Y direction, which is opposite to the extension direction of the wiring 49 extending from the liquid crystal layer 42, and the main body 81D of the incident-side cooling component 8D extends from the opening 84 in the -Y direction, which is opposite to the extension direction of the wiring 49 extending from the liquid crystal layer 42.

[0647] In the liquid crystal panel 9D, the heat-receiving portion 621 of the ejection-side cooling member 6D is connected to the light-emitting surface 472 of the pixel substrate 47. An ejection-side dustproof substrate 48 is disposed inside the opening 64, and its side surface 483 is connected to the inner peripheral surface of the opening 64 of the ejection-side cooling member 6D via a thermally conductive adhesive or the like in a manner that allows for heat transfer. The inner peripheral surface of the opening 64 is part of the heat-receiving portion 621.

[0648] The main body 61D of the injection-side cooling component 6D can be disposed on the pixel substrate 47 or on the injection-side dustproof substrate 48.

[0649] In the liquid crystal panel 9D, the heated portion 821 of the incident-side cooling member 8D is connected to the light-incident surface 441 of the opposing substrate 44. An incident-side dustproof substrate 45 is disposed inside the opening 84, and its side surface 453 is connected to the inner peripheral surface of the opening 84 of the incident-side cooling member 8D via a thermally conductive adhesive or the like in a manner that allows for heat transfer. The inner peripheral surface of the opening 84 is part of the heated portion 821.

[0650] The main body 81D of the incident-side cooling component 8D can be disposed on the opposing substrate 44 or on the incident-side dustproof substrate 45.

[0651] In such a liquid crystal panel 9D, similar to the liquid crystal panels 4A-4I and 7A-7I described above, cooling gas flows from the cooling device along the +Y direction.

[0652] The cooling gas flowing in the space on the light incident side relative to the LCD panel 9D flows in the +Y direction to cool the first heat dissipation component 88 and the incident side dustproof substrate 45 in sequence, and then cools the retaining housing 50.

[0653] The cooling gas flowing in the space on the light emission side relative to the LCD panel 9D flows in the +Y direction to cool the first heat dissipation component 68 and the dustproof substrate 48 on the emission side in sequence, and then cools the clamping component 51.

[0654] In this way, in the liquid crystal panel 9D, the heat of the liquid crystal layer 42 is dissipated to the outside of the liquid crystal panel 9D through the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, the ejection-side cooling component 6D and the incident-side cooling component 8D. In addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0655] Such a 9D LCD panel achieves the same effect as 4D, 7D, and 9A LCD panels.

[0656] [Fifth variation of the seventh embodiment]

[0657] Figure 30This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9E, which is a variant of the liquid crystal panel 9A.

[0658] For example, it can also be used Figure 30 The LCD panel 9E shown is used to replace the LCD panel 9A.

[0659] The liquid crystal panel 9E has a structure that combines the liquid crystal panel 4E shown in the second variation of the second embodiment and the liquid crystal panel 7E shown in the second variation of the fifth embodiment.

[0660] That is, the liquid crystal panel 9E has a panel body 41, wiring 49, holding housing 50, clamping member 51, ejection side cooling member 6E and incident side cooling member 8E.

[0661] In the liquid crystal panel 9E, the main body 61E of the emission-side cooling component 6E is provided on the emission-side dustproof substrate 48 such that a portion of the heat-receiving portion 621 provided around the opening 64 in the first surface 62A is connected to the light-emitting surface 482. The other portion of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping member 51 in a manner that enables heat transfer.

[0662] In the liquid crystal panel 9E, the main body 81E of the incident-side cooling component 8E is provided on the incident-side dustproof substrate 45 such that a portion of the heat-receiving portion 821 provided around the opening 84 in the first surface 82A is connected to the light incident surface 451. Another portion of the heat-receiving portion 821 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer.

[0663] Furthermore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer, and the heated part 821 and the retaining housing 50 may not be connected in a way that enables heat transfer.

[0664] Such a 9E LCD panel achieves the same effect as the 4E, 7E, and 9D LCD panels.

[0665] [Sixth variation of the seventh embodiment]

[0666] Figure 31 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9F, which is a variant of the liquid crystal panel 9A.

[0667] For example, it can also be used Figure 31 The LCD panel 9F shown is used to replace the LCD panel 9A.

[0668] The liquid crystal panel 9F has a structure that combines the liquid crystal panel 4F shown in the third variation of the second embodiment and the liquid crystal panel 7F shown in the third variation of the fifth embodiment.

[0669] That is, the liquid crystal panel 9F has a panel body 41, wiring 49, holding housing 50, clamping member 51, ejection side cooling member 6F and incident side cooling member 8F.

[0670] In the liquid crystal panel 9F, the ejection-side dustproof substrate 48 is disposed within the first opening 64C1 of the ejection-side cooling member 6F. The inner peripheral surface of the first opening 64C1 is connected to the side surface 483 of the ejection-side dustproof substrate 48 in a manner that allows for heat transfer, and the connecting portion 64C3 is connected to a portion of the light emitting surface 482 of the ejection-side dustproof substrate 48. Additionally, the heated portion 621 is connected to the pixel substrate 47.

[0671] In addition, the heated part 621 does not necessarily need to be connected to the pixel substrate 47.

[0672] In the liquid crystal panel 9F, the incident-side dustproof substrate 45 is disposed within the first opening 84C1 of the incident-side cooling member 8F. The inner peripheral surface of the first opening 84C1 is connected to the side surface 453 of the incident-side dustproof substrate 45 in a manner that allows for heat transfer, and the connecting portion 84C3 is connected to a portion of the light incident surface 451 of the incident-side dustproof substrate 45. In addition, the heated portion 821 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that allows for heat transfer.

[0673] Furthermore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer, and the heated part 821 and the retaining housing 50 may not be connected in a way that enables heat transfer.

[0674] Such a 9F LCD panel achieves the same effect as the 4F, 7F, and 9D LCD panels.

[0675] [Seventh variation of the seventh embodiment]

[0676] Figure 32 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9G, which is a variant of the liquid crystal panel 9A.

[0677] For example, it can also be used Figure 32 The LCD panel 9G shown is used to replace the LCD panel 9A.

[0678] The liquid crystal panel 9G has a structure that combines the liquid crystal panel 4G shown in the third embodiment and the liquid crystal panel 7G shown in the sixth embodiment.

[0679] That is, the LCD panel 9G has a panel body 41, wiring 49, holding housing 50, clamping member 51, injection side cooling member 6G and incident side cooling member 8G.

[0680] In the liquid crystal panel 9G, the heat-receiving portion 621 of the ejection-side cooling component 6G is connected to the light-emitting surface 472 of the pixel substrate 47 in a manner that allows for heat transfer. An ejection-side dustproof substrate 48 is disposed inside the opening 64 of the ejection-side cooling component 6G, and the side surface 483 of the ejection-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. The main body 61G of the ejection-side cooling component 6G can be disposed on the pixel substrate 47 or on the ejection-side dustproof substrate 48.

[0681] In the liquid crystal panel 9G, the heated portion 821 of the incident-side cooling component 8G is connected to the light-incident surface 441 of the opposing substrate 44 in a manner that allows for heat transfer. An incident-side dustproof substrate 45 is disposed inside the opening 84 of the incident-side cooling component 8G, and the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84 via a thermally conductive adhesive or the like in a manner that allows for heat transfer. The main body 81G of the incident-side cooling component 8G can be disposed on the opposing substrate 44 or on the incident-side dustproof substrate 45.

[0682] In such a liquid crystal panel 9G, similar to the liquid crystal panels 4A-4I and 7A-7I described above, cooling gas flows from the fan of the cooling device along the +Y direction.

[0683] The cooling gas flowing in the space on the light incident side relative to the LCD panel 9G flows in the +Y direction to cool the second heat dissipation component 89, the incident side dustproof substrate 45, and the first heat dissipation component 88 in sequence.

[0684] The cooling gas flowing in the space on the light emission side relative to the LCD panel 9G flows in the +Y direction to cool the second heat dissipation component 69, the dustproof substrate 48 on the emission side, and the first heat dissipation component 68 in sequence.

[0685] In this way, in the liquid crystal panel 9G, the heat of the liquid crystal layer 42 is dissipated to the outside of the liquid crystal panel 9G through the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, the ejection-side cooling component 6G and the incident-side cooling component 8G. In addition to the liquid crystal layer 42 being cooled, the driving circuit 491 is also cooled.

[0686] Such a 9G LCD panel achieves the same effect as the 4G, 7G, and 9A LCD panels.

[0687] [Eighth variation of the seventh embodiment]

[0688] Figure 33 This is a schematic diagram showing a cross-section along the YZ plane of a modified liquid crystal panel 9H, which is a liquid crystal panel 9A.

[0689] For example, it can also be used Figure 33The LCD panel 9H shown is used instead of LCD panel 9A.

[0690] The liquid crystal panel 9H has a structure that combines the liquid crystal panel 4H shown in the second variation of the third embodiment and the liquid crystal panel 7H shown in the second variation of the sixth embodiment.

[0691] That is, the liquid crystal panel 9H has a panel body 41, wiring 49, holding housing 50, clamping member 51, injection side cooling member 6H and incident side cooling member 8H.

[0692] In the liquid crystal panel 9H, the main body 61H of the emission-side cooling component 6H is disposed on the emission-side dustproof substrate 48, and the heat-receiving part 621 disposed around the opening 64 in the first surface 62A is connected to the light-emitting surface 482 of the emission-side dustproof substrate 48. Another part of the heat-receiving part 621 is connected to the pixel substrate 47 via the clamping member 51 in a manner that enables heat transfer.

[0693] In the liquid crystal panel 9H, the main body 81H of the incident-side cooling component 8E is disposed on the incident-side dustproof substrate 45, and the heat-receiving part 821 disposed around the opening 84 in the first surface 82A is connected to the light-incident surface 451 of the incident-side dustproof substrate 45. Another part of the heat-receiving part 821 is connected to the opposing substrate 44 via the retaining housing 50 in a manner that enables heat transfer.

[0694] Furthermore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer, and the heated part 821 and the retaining housing 50 may not be connected in a way that enables heat transfer.

[0695] Such a 9H LCD panel achieves the same effect as the 4H, 7H, and 9G LCD panels.

[0696] [Ninth variation of the seventh embodiment]

[0697] Figure 34 This is a schematic diagram showing a cross-section along the YZ plane of a modified liquid crystal panel 9I, which is a liquid crystal panel 9A.

[0698] For example, it can also be used Figure 34 The LCD panel 9I shown is used instead of LCD panel 9A.

[0699] The liquid crystal panel 9I has a structure that combines the liquid crystal panel 4I shown in the third variation of the third embodiment and the liquid crystal panel 7I shown in the third variation of the sixth embodiment.

[0700] That is, the liquid crystal panel 9I has a panel body 41, wiring 49, holding housing 50, clamping member 51, ejection side cooling member 6I and incident side cooling member 8I.

[0701] In the liquid crystal panel 9I, an emission-side dustproof substrate 48 is disposed within a first opening 64C1 of the emission-side cooling member 6I. The inner peripheral surface of the first opening 64C1 is connected to the side surface 483 of the emission-side dustproof substrate 48, and a connecting portion 64C3 is connected to a portion of the light-emitting surface 482 of the emission-side dustproof substrate 48. The inner peripheral surface of the first opening 64C1 and the connecting portion 64C3 are part of a heat-receiving portion 621. Furthermore, the heat-receiving portion 621 is connected to the pixel substrate 47.

[0702] In the liquid crystal panel 9I, an incident-side dustproof substrate 45 is disposed within a first opening 84C1 of an incident-side cooling member 8I. The inner peripheral surface of the first opening 84C1 is connected to the side surface 453 of the incident-side dustproof substrate 45, and the connecting portion 84C3 is connected to a portion of the light incident surface 451 of the incident-side dustproof substrate 45. The inner peripheral surface of the first opening 84C1 and the connecting portion 84C3 are part of a heat-receiving portion 821. Furthermore, the heat-receiving portion 821 is connected to the opposing substrate 44 and the pixel substrate 47 via a holding housing 50 in a manner that enables heat transfer.

[0703] Furthermore, the heated part 621 and the clamping member 51 may not be connected in a way that enables heat transfer, and the heated part 821 and the retaining housing 50 may not be connected in a way that enables heat transfer.

[0704] Such a 9I LCD panel achieves the same effect as the 4I, 7I, and 9G LCD panels.

[0705] [Tenth Variation of the Seventh Embodiment]

[0706] In the liquid crystal panel 9A, the main body 81A of the incident-side cooling member 8A, which serves as the first vapor chamber, and the main body 61A of the ejection-side cooling member 6A, which serves as the second vapor chamber, are positioned opposite each other in the direction of light propagation incident on the liquid crystal layer 42.

[0707] However, this is not a limitation; the main body 81A and the main body 61A may not be opposite each other in the direction of light propagation incident on the liquid crystal layer 42. The same applies to liquid crystal panels having one of the emission-side cooling members 6A to 6I and one of the incident-side cooling members 8A to 8I.

[0708] Figure 35 This is a schematic diagram of a modified liquid crystal panel 9J, viewed from the light-incident side relative to the liquid crystal layer 42. In other words, Figure 35 This diagram shows the arrangement of the main body 61G of the ejection-side cooling component 6G and the main body 81G of the incident-side cooling component 8G in the liquid crystal panel 9J.

[0709] For example, it can also replace LCD panel 9A and adopt Figure 35 The LCD panel shown is 9J.

[0710] The LCD panel 9J, like the LCD panel 9G, has a panel body 41, wiring 49, a retaining housing 50 (not shown), an injection-side cooling component 6G, and an incident-side cooling component 8G.

[0711] In the liquid crystal panel 9J, the main body 61G constituting the ejection-side cooling member 6G is inclined relative to both the +Y and +X directions, moving towards the +Y direction and closer to the +X direction from its -Y direction end. Therefore, in Figure 35 In the example, the first heat dissipation component 68 of the ejection-side cooling component 6G is positioned relative to the pixel region 41A in the +X and +Y directions, and the second heat dissipation component 69 is positioned relative to the pixel region 41A in the -X and -Y directions.

[0712] Furthermore, the first heat dissipation component 68 and the second heat dissipation component 69 are respectively provided in a manner where the flow paths of the first heat dissipation component 68 and the second heat dissipation component 69 are along the +Y direction, corresponding to the first heat dissipation part 631 and the second heat dissipation part 632.

[0713] In the liquid crystal panel 9J, the main body 81G constituting the incident-side cooling member 8G is inclined relative to both the +Y and +X directions, starting from its end in the -Y direction and moving towards the -X direction as it moves towards the +Y direction. Therefore, in Figure 35 In the example, the first heat dissipation component 88 of the incident-side cooling component 8G is positioned relative to the pixel region 41A in the -X direction and the +Y direction, and the second heat dissipation component 89 is positioned relative to the pixel region 41A in the +X direction and the -Y direction.

[0714] Furthermore, the first heat dissipation component 88 and the second heat dissipation component 89 are respectively disposed in a manner that the flow paths of the first heat dissipation component 88 and the second heat dissipation component 89 are along the +Y direction, corresponding to the first heat dissipation part 831 and the second heat dissipation part 832.

[0715] Thus, in the liquid crystal panel 9J, the emission-side cooling component 6G and the incident-side cooling component 8G are configured to intersect in the pixel region 41A when viewed from the light incident side relative to the liquid crystal panel 9J.

[0716] Therefore, the cooling gas flowing along the +Y direction can be easily directed to each heat dissipation component 68, 69, 88, 89, the incident-side dustproof substrate 45, and the ejection-side dustproof substrate 48. As a result, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0717] Furthermore, the main body 61G may also be tilted from the end in the -Y direction toward the -X direction as it moves toward the +Y direction, and the main body 81G may also be tilted from the end in the -Y direction toward the +X direction as it moves toward the +Y direction.

[0718] Furthermore, the cooling component configured as described above is not limited to the ejection-side cooling component 6G and the incident-side cooling component 8G; it may be one of the ejection-side cooling components 6A to 6I or one of the incident-side cooling components 8A to 8I. For example, even if the liquid crystal panel has only one cooling component, either the ejection-side cooling component or the incident-side cooling component, that single cooling component may be tilted relative to the +X and +Y directions.

[0719] [Variations on the implementation method]

[0720] This invention is not limited to the embodiments described above, which include the various modifications described above. Modifications and improvements within the scope of achieving the purpose of this invention are included in this invention.

[0721] In the emission-side cooling components of the second and seventh embodiments described above, the first heat dissipation component 68, which is provided on the second surface 63A of the second component 63 corresponding to the first heat dissipation portion 631, is disposed on the light emission side relative to the first component 62.

[0722] However, it is not limited to this, the first heat dissipation component 68 may also be disposed on the light incident side relative to the first component 62.

[0723] In the emission-side cooling components of the third and seventh embodiments described above, the second heat dissipation component 69, which is provided on the second surface 63A of the second component 63 corresponding to the second heat dissipation portion 632, is disposed on the light emission side relative to the first component 62.

[0724] However, it is not limited to this; the second heat dissipation component 69 may also be disposed on the light incident side relative to the first component 62.

[0725] In these cases, for example, the first heat dissipation part 631 and the first heat dissipation component 68 can be connected in a way that allows heat transfer through a heat transfer component, and the second heat dissipation part 632 and the second heat dissipation component 69 can be connected in a way that allows heat transfer through a heat transfer component.

[0726] In addition, the heat transfer component may also have the function of supporting the first heat dissipation component 68 or the second heat dissipation component 69.

[0727] In the incident-side cooling components of the fourth and seventh embodiments described above, the first heat dissipation component 88, which is provided on the second surface 83A of the second component 83 corresponding to the first heat dissipation portion 831, is disposed on the light incident side relative to the first component 82.

[0728] However, it is not limited to this, the first heat dissipation component 88 may also be disposed on the light emitting side relative to the first component 82.

[0729] In the incident-side cooling components of the fifth and seventh embodiments described above, the second heat dissipation component 89, which is provided on the second surface 83A of the second component 83 corresponding to the second heat dissipation portion 832, is disposed on the light incident side relative to the first component 82.

[0730] However, it is not limited to this, the second heat dissipation component 89 may also be disposed on the light emitting side relative to the first component 82.

[0731] In these cases, for example, the first heat dissipation part 831 and the first heat dissipation component 88 can be connected in a way that allows heat transfer through a heat transfer component, and the second heat dissipation part 832 and the second heat dissipation component 89 can be connected in a way that allows heat transfer through a heat transfer component.

[0732] In addition, the heat transfer component may also have the function of supporting the first heat dissipation component 88 or the second heat dissipation component 89.

[0733] Figure 36 This is a schematic diagram showing a cross-section along the YZ plane of a liquid crystal panel 9K, which is a variant of the liquid crystal panel 9D.

[0734] For example, it can also be used Figure 36 The LCD panel shown is 9K, which replaces the LCD panel 9D.

[0735] The LCD panel 9K has the same structure and function as the LCD panel 9D, except that it has the same ejection-side cooling component 6K and incident-side cooling component 8K as the ejection-side cooling component 6D and incident-side cooling component 8D.

[0736] That is, the LCD panel 9K has a panel body 41, wiring 49, holding housing 50, clamping member 51, ejection side cooling member 6K and incident side cooling member 8K.

[0737] Like the injection-side cooling component 6D, the injection-side cooling component 6K dissipates heat to the outside by vaporizing the liquid refrigerant into a gaseous refrigerant through heat transferred from the pixel substrate 47 and the injection-side dustproof substrate 48. The injection-side cooling component 6K has the same structure and function as the injection-side cooling component 6D, except that it has a heat transfer component 67 and a different configuration of the first heat dissipation component 68.

[0738] That is, the injection-side cooling component 6K has a main body 61D, a heat transfer component 67, and a first heat dissipation component 68.

[0739] In the ejection-side cooling component 6K, the first heat dissipation component 68 is disposed on the light incident side relative to the first component 62. That is, the first heat dissipation component 68 is disposed on the side opposite to the second component 63 relative to the first component 62.

[0740] Furthermore, when multiple fins 681 are provided as multiple fins of the first heat dissipation component 68, the flow path provided in the fins 681 can also be tilted relative to the +Y direction in such a way that it moves closer to the +X direction or the -X direction as it moves toward the +Y direction.

[0741] The heat transfer component 67 connects the first heat dissipation part 631 in the second surface 63A to the first heat dissipation component 68 in a manner that enables heat transfer, and transfers the heat of the refrigerant gas transferred from the first condensation part to the first heat dissipation part 631 to the first heat dissipation component 68. The heat transfer component 67 may be formed, for example, by a metal sheet, or by a metal component capable of supporting the first heat dissipation component 68.

[0742] Similar to the incident-side cooling component 8D, the incident-side cooling component 8K vaporizes the liquid refrigerant into a gaseous refrigerant by transferring heat from the opposing substrate 44 and the incident-side dustproof substrate 45, and then dissipates the heat received by the gaseous refrigerant to the outside. The incident-side cooling component 8K has the same structure and function as the incident-side cooling component 8D, except that it has a heat transfer component 87 and a different configuration of the first heat dissipation component 88.

[0743] That is, the incident-side cooling component 8K has a main body 81D, a heat transfer component 87, and a first heat dissipation component 88.

[0744] In the incident-side cooling component 8K, the first heat dissipation component 88 is disposed on the light-emitting side relative to the first component 82. That is, the first heat dissipation component 88 is disposed on the side opposite to the second component 83 relative to the first component 82.

[0745] Furthermore, when multiple fins 681 are provided as multiple fins of the first heat dissipation component 88, the flow path provided in the fins 681 can also be inclined relative to the +Y direction in such a way that it moves closer to the +X direction or the -X direction as it moves toward the +Y direction.

[0746] The heat transfer component 87 connects the first heat dissipation part 831 and the first heat dissipation component 88 in a manner that enables heat transfer, transferring the heat of the refrigerant gas that has been transferred from the first condensation part to the first heat dissipation part 831 to the first heat dissipation component 88. The heat transfer component 87 may be formed, for example, by a metal sheet, or by a metal component capable of supporting the first heat dissipation component 88.

[0747] Cooling gas, circulated by a fan of a cooling device configured within the outer casing 2, flows relative to the LCD panel 9K in the +Y direction.

[0748] Cooling gas flows in the +Y direction in the space relative to the light incident side of the LCD panel 9K, and after cooling the incident side dustproof substrate 45, it cools the retaining housing 50.

[0749] Cooling gas flowing in the space relative to the light emission side of the LCD panel 9K flows in the +Y direction, and after cooling the dustproof substrate 48 on the emission side, it cools the clamping member 51.

[0750] The cooling gas flowing between the main body 61D of the ejection-side cooling component 6K and the main body 81D of the incident-side cooling component 8K flows in the +Y direction, cools the first heat dissipation components 68 and 88, and then flows in the +X or -X direction, thereby flowing away from the liquid crystal panel 9K.

[0751] In addition to achieving the same effect as the 9D LCD panel, the 9K LCD panel also achieves the following effects.

[0752] It can suppress the flow of cooling gas flowing in the first heat dissipation component 68 to the ejection-side dustproof substrate 48, and can suppress the flow of cooling gas flowing in the first heat dissipation component 88 to the incident-side dustproof substrate 45.

[0753] Therefore, it is possible to allow cooling gas with a relatively low temperature to flow separately in the injection-side dustproof substrate 48 and the first heat dissipation member 68 disposed in the -Y direction relative to the injection-side dustproof substrate 48.

[0754] Similarly, it is possible to allow cooling gases with relatively low temperatures to flow separately in the incident-side dustproof substrate 45 and the first heat dissipation member 88 disposed in the -Y direction relative to the incident-side dustproof substrate 45.

[0755] Therefore, the incident-side dustproof substrate 45, the ejection-side dustproof substrate 48, and the first heat dissipation components 68 and 88 can be cooled efficiently, thereby enabling efficient cooling of the liquid crystal layer 42.

[0756] Furthermore, if the liquid crystal panel has one of the ejection-side cooling components 6D to 6I, the first heat dissipation component 68 or the second heat dissipation component 69, which is arranged in the -Y direction relative to the openings 64 and 64C, can be arranged on the side opposite to the second component 63 relative to the first component 62, and the second surface 63A can be connected to the first heat dissipation component 68 or the second heat dissipation component 69 in a way that allows heat transfer, through the heat transfer component 67.

[0757] Similarly, if it is a liquid crystal panel having one of the incident-side cooling components 8D to 8I, the first heat dissipation component 88 or the second heat dissipation component 89, which is arranged in the -Y direction relative to the openings 84 and 84C, can be arranged on the side opposite to the second component 83 relative to the first component 82, and the second surface 63A can be connected to the first heat dissipation component 88 or the second heat dissipation component 89 in a way that allows heat transfer, using the heat transfer component 87.

[0758] In addition, when the cooling gas flowing from the fan of the cooling device flows in the -Y direction relative to the liquid crystal panel, the first heat dissipation component 68, which is arranged in the +Y direction relative to the openings 64 and 64C in the ejection side cooling components 6A to 6C and 6G to 6I, can be arranged in the opposite direction to the second component 63 relative to the first component 62, and the second surface 63A and the first heat dissipation component 68 can be connected in a way that allows heat transfer through the heat transfer component 67.

[0759] Similarly, when the cooling gas flowing from the cooling device flows in the -Y direction relative to the liquid crystal panel, the first heat dissipation component 88, which is arranged in the +Y direction relative to the openings 84 and 84C in the incident-side cooling components 8A to 8C and 8G to 8I, can be arranged in the opposite direction to the second component 83 relative to the first component 82, and the second surface 83A and the first heat dissipation component 88 can be connected in a way that allows heat transfer through the heat transfer component 87.

[0760] Alternatively, one of the heat dissipation components of the incident-side cooling component and the ejection-side cooling component can be disposed on the side of the second component 83 relative to the first component 82, and the other heat dissipation component can be disposed on the side opposite to the second component 83 relative to the first component 82.

[0761] In the above embodiments, the incident portion 43 has an incident-side dustproof substrate 45, and the ejection portion 46 has an ejection-side dustproof substrate 48.

[0762] However, it is not limited thereto, and the liquid crystal panel of the present invention may also not have at least one of the dustproof substrates, namely the incident-side dustproof substrate 45 and the emission-side dustproof substrate 48.

[0763] In the above embodiments, the ejection-side cooling components 6A to 6I have at least one heat dissipation component among the first heat dissipation component 68 and the second heat dissipation component 69, and the incident-side cooling components 8A to 8I have at least one heat dissipation component among the first heat dissipation component 88 and the second heat dissipation component 89.

[0764] However, this is not the only possibility; at least one of the incident-side cooling component and the ejection-side cooling component may also be without a heat dissipation component.

[0765] That is, in this invention, heat dissipation components may not be required in the steam chamber.

[0766] In the above embodiments, the incident-side electrode substrate disposed on the light-incident side relative to the liquid crystal layer 42 is designated as the opposing substrate 44, and the emission-side electrode substrate disposed on the light-emission side relative to the liquid crystal layer 42 is designated as the pixel substrate 47. However, it is not limited to this, and the incident-side electrode substrate may also be designated as the pixel substrate 47, and the emission-side electrode substrate may be designated as the opposing substrate 44.

[0767] In the above embodiments, a projector is listed as an apparatus equipped with liquid crystal panels 4A-4I, 7A-7I, and 9A-9K. However, it is not limited to this; for example, the liquid crystal panel of the present invention can also be applied to a setting-type liquid crystal display device, or to a portable liquid crystal display device.

[0768] [Summary of this invention]

[0769] The following is a summary of the invention.

[0770] The first aspect of the present invention provides a transmissive liquid crystal panel comprising: a pixel region having a plurality of pixels arranged therein; a liquid crystal layer having light modulated according to each of the plurality of pixels; an incident portion having light incident onto the liquid crystal layer; and an emitting portion having light modulated by the liquid crystal layer emitted as image light.

[0771] The transmissive liquid crystal panel also has a vapor chamber, which has an opening corresponding to the pixel area, a heat-receiving part disposed around the opening, and a heat dissipation part for dissipating heat received by the heat-receiving part. The vapor chamber uses the heat received by the heat-receiving part to vaporize the liquid refrigerant sealed inside, and uses the heat dissipation part to dissipate heat from the gaseous refrigerant, thereby condensing the gaseous refrigerant into liquid refrigerant.

[0772] Here, the vapor chamber does not require piping for refrigerant flow or wiring for supplying drive power. Based on this structure, compared to the case where a cooling device for refrigerant flow is provided, or the case where thermoelectric conversion elements such as Peltier elements that use electricity to move heat are provided, the structure of the transmissive liquid crystal panel can be simplified.

[0773] Therefore, it is possible to miniaturize devices equipped with transmissive liquid crystal panels.

[0774] Furthermore, the transmissive LCD panel can be installed and disconnected from the device without installing and disconnecting piping and wiring, thus making it easy to replace the transmissive LCD panel.

[0775] Furthermore, the heating element located around the opening corresponding to the pixel area is heated, thus improving the temperature uniformity in the pixel area.

[0776] In the first embodiment described above, the emission portion has a light-transmitting emission-side substrate, which is connected to the liquid crystal layer in a manner that allows for heat transfer and allows the image light to pass through. Viewed from the emission direction of the image light, the area of ​​the emission-side substrate is larger than the area of ​​the pixel region. Alternatively, the vapor chamber may be disposed on the emission-side substrate in a manner that allows for heat transfer.

[0777] With this structure, the ejection side substrate and the liquid crystal layer are connected in a way that allows for heat transfer, thus the heat of the liquid crystal layer is transferred.

[0778] By providing a vapor chamber on such an injection-side substrate in a manner that enables heat transfer, the heated portion can easily receive heat from the liquid crystal layer.

[0779] Therefore, the liquid crystal layer can be cooled easily.

[0780] In the first embodiment described above, the emission portion has a light-transmitting emission-side electrode substrate, which has an emission-side electrode electrically connected to the liquid crystal layer and is disposed on the light emission side relative to the liquid crystal layer. The emission-side substrate may also be the emission-side electrode substrate.

[0781] With this structure, the emission-side electrode substrate is a light-transmitting substrate directly connected to the heat-sensitive liquid crystal layer. Because a vapor chamber is provided on this emission-side electrode substrate, heat generated in the liquid crystal layer can be efficiently transferred to the heated portion.

[0782] Therefore, it can improve the cooling efficiency of the liquid crystal layer.

[0783] In the first embodiment described above, the ejection portion has an ejection-side dustproof substrate disposed on the light-emitting side surface of the ejection-side electrode substrate. The ejection-side dustproof substrate has a side surface connecting the light-incident side surface of the ejection-side dustproof substrate and the light-emitting side surface of the ejection-side dustproof substrate. Alternatively, the heating portion may be heated from both the light-emitting side surface of the ejection-side electrode substrate and the side surface of the ejection-side dustproof substrate.

[0784] With this structure, the heated portion is heated from the emission-side electrode substrate and the emission-side dustproof substrate respectively, so the heat of the liquid crystal layer can be transferred to the heated portion via the emission-side electrode substrate and the emission-side dustproof substrate respectively.

[0785] Therefore, the heat of the liquid crystal layer can be efficiently transferred to the heated part, thus improving the cooling efficiency of the liquid crystal layer.

[0786] In the first embodiment described above, the emission portion includes: a light-transmitting emission-side electrode substrate having an emission-side electrode electrically connected to the liquid crystal layer and disposed on the light emission side relative to the liquid crystal layer; and an emission-side dustproof substrate disposed on the light emission side surface of the emission-side electrode substrate. The emission-side substrate may also be the emission-side dustproof substrate.

[0787] According to this structure, the vapor chamber is disposed on the emission-side dustproof substrate, which is located closer to the light emission side than the emission-side electrode substrate, in a manner that enables heat transfer.

[0788] Therefore, compared to the case where the vapor chamber is provided on the injection-side electrode substrate in a way that avoids the injection-side dustproof substrate, the vapor chamber can be easily connected to the injection section.

[0789] Here, the heat generated in the liquid crystal layer is transferred to the emission-side dustproof substrate via the emission-side electrode substrate, thus causing heat diffusion in the liquid crystal layer.

[0790] In contrast, since the vapor chamber is located on the light-emitting side of the dustproof substrate on the emission side, the heat of the liquid crystal layer can be easily transferred to the heated part.

[0791] In the first embodiment described above, the vapor chamber may also be disposed on the light-emitting side of the dustproof substrate on the emission side.

[0792] With this structure, for example, compared to the case where the ejection-side dustproof substrate is arranged in the opening corresponding to the pixel area, the vapor chamber can be easily installed in the ejection section even if there are tolerances in the vapor chamber.

[0793] In the first embodiment described above, the injection-side dustproof substrate has a side surface that connects the light-incident side surface of the injection-side dustproof substrate and the light-emission side surface of the injection-side dustproof substrate. Alternatively, the inner peripheral surface of the opening may be connected to at least a portion of the side surface of the injection-side dustproof substrate in a manner that allows for heat transfer.

[0794] With this structure, the heat transferred from the liquid crystal layer to the dustproof substrate on the emission side can be received by the inner peripheral surface of the opening.

[0795] Therefore, compared with the case where the vapor chamber is set up by connecting the heated part to the light-emitting side of the dustproof substrate on the emission side, it is possible to suppress the increase in size of the transmissive liquid crystal panel in the direction of light transmission.

[0796] In the first approach described above, the heated portion may also be connected to the ejection-side electrode substrate in a manner that enables heat transfer.

[0797] With this structure, heat is transferred not only from the side of the injection-side dustproof substrate to the heated part, but also from the injection-side electrode substrate to the heated part.

[0798] Therefore, the heat of the liquid crystal layer can be easily transferred to the heated part, thus improving the cooling efficiency of the liquid crystal layer.

[0799] In the first embodiment described above, the emission-side electrode substrate may also be a pixel substrate having a plurality of pixel electrodes disposed corresponding to the plurality of pixels as emission-side electrodes, and disposed on the light emission side relative to the liquid crystal layer.

[0800] In a typical transmissive liquid crystal panel, a counter substrate is disposed on the light incident side relative to the liquid crystal layer, and a pixel substrate is disposed on the light emitting side relative to the liquid crystal layer.

[0801] Therefore, by making the emission-side electrode substrate a pixel substrate and by providing a vapor chamber with the above structure on a general transmissive liquid crystal panel, the transmissive liquid crystal panel of the present invention can be constructed.

[0802] Therefore, the transmissive liquid crystal panel of the present invention can be easily constructed.

[0803] In the first embodiment described above, the incident portion has a light-transmitting incident-side substrate, which is connected to the liquid crystal layer in a manner that allows for heat transfer, and allows light incident on the liquid crystal layer to pass through. Viewed from the opposite direction of the light's propagation direction onto the liquid crystal layer, the area of ​​the incident-side substrate is larger than the area of ​​the pixel region. Alternatively, the vapor chamber may be disposed on the incident-side substrate in a manner that allows for heat transfer.

[0804] With this structure, since the incident-side substrate and the liquid crystal layer are connected in a manner that allows for heat transfer, the incident-side substrate transfers heat from the liquid crystal layer. By providing a vapor chamber on such an incident-side substrate in a manner that allows for heat transfer, the heated portion can easily receive heat from the liquid crystal layer.

[0805] Therefore, the liquid crystal layer can be cooled easily.

[0806] In the first embodiment described above, the incident portion has an incident-side electrode substrate with the following light transmittance: the incident-side electrode substrate has an incident-side electrode electrically connected to the liquid crystal layer, and is disposed on the light incident side relative to the liquid crystal layer. The incident-side substrate may also be the incident-side electrode substrate.

[0807] With this structure, the incident-side electrode substrate is a light-transmitting substrate directly connected to the heat-sensitive liquid crystal layer. Because a vapor chamber is provided on this emission-side electrode substrate, heat generated in the liquid crystal layer can be efficiently transferred to the heated portion.

[0808] Therefore, it can improve the cooling efficiency of the liquid crystal layer.

[0809] In the first embodiment described above, the incident portion has an incident-side dustproof substrate disposed on the light-incident side surface of the incident-side electrode substrate. The incident-side dustproof substrate has a side surface connecting the light-incident side surface of the incident-side dustproof substrate with the light-emission side surface of the incident-side dustproof substrate. The heated portion can be heated from both the light-incident side surface of the incident-side electrode substrate and the side surface of the incident-side dustproof substrate.

[0810] With this structure, the heated portion is heated from the incident-side electrode substrate and the incident-side dustproof substrate respectively, so the heat of the liquid crystal layer can be transferred to the heated portion via the incident-side electrode substrate and the incident-side dustproof substrate respectively.

[0811] Therefore, the heat of the liquid crystal layer can be efficiently transferred to the heated part, thus improving the cooling efficiency of the liquid crystal layer.

[0812] In the first embodiment described above, the incident portion includes: a light-transmitting incident-side electrode substrate having an incident-side electrode electrically connected to the liquid crystal layer and disposed on the light-incident side relative to the liquid crystal layer; and an incident-side dustproof substrate disposed on the light-incident side surface of the incident-side electrode substrate. The incident-side substrate may also be the incident-side dustproof substrate.

[0813] According to this structure, the vapor chamber is disposed on the incident-side dustproof substrate, which is located closer to the light incident side than the incident-side electrode substrate, in a manner that enables heat transfer.

[0814] Therefore, compared to the case where the vapor chamber is provided on the incident side electrode substrate in a way that avoids the incident side dustproof substrate, the vapor chamber can be easily connected to the incident part.

[0815] Here, the heat generated in the liquid crystal layer is transferred to the emission-side dustproof substrate via the incident-side electrode substrate, thus causing heat diffusion in the liquid crystal layer.

[0816] In contrast, since the vapor chamber is located on the light-incident side of the incident dustproof substrate, the heat of the liquid crystal layer can be easily transferred to the heated part.

[0817] In the first embodiment described above, the steam chamber may also be disposed on the light-incident side of the incident dustproof substrate.

[0818] With this structure, for example, compared to the case where the incident-side dustproof substrate is arranged in the opening corresponding to the pixel area, the vapor chamber can be easily installed in the incident section even if there are tolerances in the vapor chamber.

[0819] In the first embodiment described above, the incident-side dustproof substrate has a side surface that connects the light-incident side surface of the incident-side dustproof substrate and the light-emission side surface of the incident-side dustproof substrate. Alternatively, the inner peripheral surface of the opening may be in contact with at least a portion of the side surface of the incident-side dustproof substrate in a manner that allows for heat transfer.

[0820] With this structure, the heat transferred from the liquid crystal layer to the incident-side dustproof substrate can be received from the inner edge of the opening.

[0821] Therefore, compared with the case where the vapor chamber is set up by connecting the heated part to the light-incident side of the incident dustproof substrate, it is possible to suppress the increase in size of the transmissive liquid crystal panel in the direction of light transmission.

[0822] In the first approach described above, the heated portion may also be connected to the incident electrode substrate in a manner that enables heat transfer.

[0823] With this structure, heat is transferred not only from the side of the incident-side dustproof substrate to the heated part, but also from the incident-side electrode substrate to the heated part.

[0824] Therefore, the heat of the liquid crystal layer can be easily transferred to the heated part, thus improving the cooling efficiency of the liquid crystal layer.

[0825] In the first embodiment described above, the incident electrode substrate may also be a counter substrate having a common electrode disposed corresponding to the pixel region as the incident electrode.

[0826] As described above, in a typical transmissive liquid crystal panel, an opposing substrate is disposed on the light incident side relative to the liquid crystal layer, and a pixel substrate is disposed on the light emitting side relative to the liquid crystal layer.

[0827] Therefore, by making the incident side electrode substrate an opposing substrate and by providing a vapor chamber with the above structure on a general transmissive liquid crystal panel, the transmissive liquid crystal panel of the present invention can be constructed.

[0828] Therefore, the transmissive liquid crystal panel of the present invention can be easily constructed.

[0829] In the first embodiment described above, the transmissive liquid crystal panel may also have wiring that supplies image signals to drive the liquid crystal layer, and the vapor chamber may extend from the opening in the direction in which the wiring extends from the liquid crystal layer.

[0830] With such a structure, for example, compared to the case where the vapor chamber extends from the opening in the opposite direction to the extension direction of the wiring, it is possible to suppress the enlargement of the transmissive liquid crystal panel.

[0831] In the first embodiment described above, the device may also have wiring for supplying image signals to drive the liquid crystal layer, and the vapor chamber extends from the opening in a direction opposite to the direction in which the wiring extends from the liquid crystal layer.

[0832] With this structure, interference between the wiring and the steam chamber can be suppressed, thus preventing the heat dissipation of the steam chamber from being hindered by the wiring.

[0833] In the first embodiment described above, wiring is provided to supply image signals that drive the liquid crystal layer. Alternatively, the vapor chamber may extend from the opening in both the direction in which the wiring extends from the liquid crystal layer and in the opposite direction.

[0834] This structure allows for an increased heat dissipation area in the vapor chamber from the gaseous refrigerant, thus enabling the gaseous refrigerant to be easily condensed into a liquid refrigerant.

[0835] Therefore, the liquid refrigerant can flow to the heated part without delay, and the heat of the liquid crystal layer can promote the vaporization of the liquid refrigerant.

[0836] Furthermore, by arranging the transmissive liquid crystal panel with one of the extension direction of the wiring and the opposite direction of the extension direction of the wiring as the upper vertical direction, it is possible to transport the condensed liquid refrigerant to the part where the liquid refrigerant is vaporized, not only by capillary force but also by gravity.

[0837] This enables the refrigerant to change from liquid to gas by utilizing the heat received by the heated part.

[0838] Therefore, it is possible to improve the heat dissipation efficiency of the liquid crystal layer, thereby improving the cooling efficiency of the liquid crystal layer.

[0839] In the first embodiment described above, the transmissive liquid crystal panel has a heat dissipation component disposed in the vapor chamber to release heat transferred from the heat dissipation section. Alternatively, the heat dissipation component may be disposed relative to the opening in the direction in which the vapor chamber extends from the opening.

[0840] With this structure, the heating element connected to the heated part can be moved away from the heat dissipation component.

[0841] Therefore, it is possible to suppress the impact of heat transferred to the heat dissipation components on the heat-generating element.

[0842] A transmissive liquid crystal panel according to a second aspect of the present invention comprises: a pixel region having a plurality of pixels arranged therein; a liquid crystal layer having light modulated according to each of the plurality of pixels; a counter substrate having a common electrode disposed corresponding to the pixel region; a pixel substrate having a plurality of pixel electrodes disposed corresponding to the plurality of pixels, and carrying the liquid crystal layer between the pixel substrate and the counter substrate; a first dustproof substrate disposed on the counter substrate on a surface opposite to the pixel substrate; and a second dustproof substrate disposed on the pixel substrate on a surface opposite to the counter substrate.

[0843] The transmissive liquid crystal panel further includes a first vapor chamber, which has: a first opening corresponding to the pixel area; a first heating portion disposed around the first opening and connected to at least one of the opposing substrate and the first dustproof substrate in a heat-transfer manner; and a first heat dissipation portion for dissipating heat received by the first heating portion. The first vapor chamber utilizes the heat received by the first heating portion to vaporize a first refrigerant sealed inside, and utilizes the first heat dissipation portion to dissipate heat from the gaseous first refrigerant, thereby condensing the gaseous first refrigerant into a liquid first refrigerant.

[0844] It also has a second vapor chamber, which has: a second opening corresponding to the pixel area; a second heating portion disposed around the second opening and connected to at least one of the pixel substrate and the second dustproof substrate in a manner capable of heat transfer; and a second heat dissipation portion for dissipating heat received by the second heating portion. The second vapor chamber uses the heat received by the second heating portion to vaporize the liquid second refrigerant sealed inside, and uses the second heat dissipation portion to dissipate heat from the gaseous second refrigerant, thereby condensing the gaseous second refrigerant into liquid second refrigerant.

[0845] Based on this structure, it can achieve the same effect as the transmissive liquid crystal panel of the first type mentioned above.

[0846] Furthermore, the transmissive liquid crystal panel has: a first vapor chamber connected to at least one of the opposing substrate and the first dustproof substrate in a manner that enables heat transfer; and a second vapor chamber connected to at least one of the pixel substrate and the second dustproof substrate in a manner that enables heat transfer, thereby further improving the cooling efficiency of the liquid crystal layer.

[0847] In the second embodiment described above, viewed from the incident side of light incident on the liquid crystal layer, the first vapor chamber extends outward compared to the opposing substrate and the first dustproof substrate. Viewed from the emitting side of light emitted from the liquid crystal layer, the second vapor chamber extends outward compared to the pixel substrate and the second dustproof substrate. Alternatively, the first vapor chamber and the second vapor chamber may be opposite each other in the direction of light incident relative to the liquid crystal layer.

[0848] With this structure, compared to the case where the first vapor chamber and the second vapor chamber are not opposite each other, it is possible to suppress the enlargement of the transmissive liquid crystal panel.

Claims

1. A transmissive liquid crystal panel, characterized in that, The transmissive liquid crystal panel has: A pixel region, wherein multiple pixels are arranged in the pixel region; A liquid crystal layer that modulates light according to each of the plurality of pixels; An incident portion, wherein light is incident onto the liquid crystal layer; The emission section emits light modulated by the liquid crystal layer as image light. A flat vapor chamber, formed by combining a flat first part and a flat second part, is filled with refrigerant. The portion of the vapor chamber relative to one of the injection portion and the ejection portion is disposed on the opposite side to the other portion and is connected to the other portion in a manner that enables heat transfer. as well as A heat dissipation component is connected to the steam chamber in a manner that enables heat transfer. The vapor chamber has an opening corresponding to the pixel area, a heating section disposed around the opening, and a heat dissipation section for dissipating heat received by the heating section. The vapor chamber uses the heat received by the heating section to vaporize the liquid refrigerant sealed inside, and uses the heat dissipation section to dissipate heat from the gaseous refrigerant, thereby condensing the gaseous refrigerant into a liquid refrigerant. The heat dissipation component is connected to the side of the steam chamber opposite to the portion of the steam chamber in a manner that enables heat transfer.

2. The transmissive liquid crystal panel according to claim 1, characterized in that, The emission portion has a light-transmitting emission-side substrate, which is connected to the liquid crystal layer in a manner that allows for heat transfer, and also allows the image light to pass through. Viewed from the direction of light emission from the image, the area of ​​the emission-side substrate is larger than the area of ​​the pixel region. The steam chamber is disposed on the injection-side substrate in a manner that enables heat transfer.

3. The transmissive liquid crystal panel according to claim 2, characterized in that, The emission portion has a light-transmitting emission-side electrode substrate, which has an emission-side electrode electrically connected to the liquid crystal layer and is disposed on the light emission side relative to the liquid crystal layer. The ejection-side substrate is the ejection-side electrode substrate.

4. The transmissive liquid crystal panel according to claim 2, characterized in that, The ejection section has: A light-transmitting emission-side electrode substrate having an emission-side electrode electrically connected to the liquid crystal layer and disposed on the light-emitting side relative to the liquid crystal layer; and An injection-side dustproof substrate is disposed on the light-emitting side surface of the injection-side electrode substrate. The injection-side substrate is the injection-side dustproof substrate.

5. The transmissive liquid crystal panel according to claim 4, characterized in that, The steam chamber is disposed on the light-emitting side of the dustproof substrate on the emission side.

6. The transmissive liquid crystal panel according to claim 4, characterized in that, The injection-side dustproof substrate has a side surface that connects the light-incident side surface of the injection-side dustproof substrate with the light-ejection side surface of the injection-side dustproof substrate. The inner peripheral surface of the opening is connected to at least a portion of the side surface of the injection-side dustproof substrate in a manner that enables heat transfer.

7. The transmissive liquid crystal panel according to claim 6, characterized in that, The heated portion is connected to the ejection-side electrode substrate in a manner that enables heat transfer.

8. The transmissive liquid crystal panel according to any one of claims 3 to 7, characterized in that, The emission-side electrode substrate is a pixel substrate having a plurality of pixel electrodes disposed corresponding to the plurality of pixels as emission-side electrodes, and disposed on the light emission side relative to the liquid crystal layer.

9. The transmissive liquid crystal panel according to claim 1, characterized in that, The incident portion has a light-transmitting incident-side substrate, which is connected to the liquid crystal layer in a manner that allows for heat transfer, and allows light incident on the liquid crystal layer to pass through. Viewed from the opposite direction of the light's propagation towards the liquid crystal layer, the area of ​​the incident-side substrate is larger than the area of ​​the pixel region. The steam chamber is disposed on the incident side substrate in a manner that enables heat transfer.

10. The transmissive liquid crystal panel according to claim 9, characterized in that, The incident portion has an incident-side electrode substrate with the following light transmittance: the incident-side electrode substrate has an incident-side electrode electrically connected to the liquid crystal layer, and is disposed on the light incident side relative to the liquid crystal layer. The incident-side substrate is the incident-side electrode substrate.

11. The transmissive liquid crystal panel according to claim 10, characterized in that, The incident portion has an incident-side dustproof substrate, which is disposed on the light-incident side surface of the incident-side electrode substrate. The incident-side dustproof substrate has a side surface that connects the light-incident side surface of the incident-side dustproof substrate with the light-emission side surface of the incident-side dustproof substrate. The heated portion is heated from the light-incident side of the incident electrode substrate and the side surface of the incident dustproof substrate.

12. The transmissive liquid crystal panel according to claim 9, characterized in that, The incident portion has: A light-transmitting incident-side electrode substrate having an incident-side electrode electrically connected to the liquid crystal layer and disposed on the light-incident side relative to the liquid crystal layer; and An incident-side dustproof substrate is disposed on the light-incident side surface of the incident-side electrode substrate. The incident-side substrate is the incident-side dustproof substrate.

13. The transmissive liquid crystal panel according to claim 12, characterized in that, The steam chamber is disposed on the light-incident side of the incident dustproof substrate.

14. The transmissive liquid crystal panel according to claim 12, characterized in that, The incident-side dustproof substrate has a side surface that connects the light-incident side surface of the incident-side dustproof substrate with the light-emission side surface of the incident-side dustproof substrate. The inner peripheral surface of the opening is connected to at least a portion of the side surface of the incident-side dustproof substrate in a manner that enables heat transfer.

15. The transmissive liquid crystal panel according to claim 14, characterized in that, The heated portion is connected to the incident side electrode substrate in a manner that enables heat transfer.

16. The transmissive liquid crystal panel according to any one of claims 10 to 15, characterized in that, The incident-side electrode substrate is an opposing substrate having a common electrode disposed corresponding to the pixel region as the incident-side electrode.

17. A transmissive liquid crystal panel, characterized in that, This transmissive liquid crystal panel has the following features: A pixel region, wherein multiple pixels are arranged in the pixel region; A liquid crystal layer that modulates light according to each of the plurality of pixels; A counter substrate, the counter substrate having a common electrode disposed corresponding to the pixel region; A pixel substrate having a plurality of pixel electrodes disposed corresponding to the plurality of pixels respectively, and the liquid crystal layer being carried between the pixel substrate and the opposing substrate; A first dustproof substrate is disposed on the surface of the opposing substrate opposite to the pixel substrate; The second dustproof substrate is disposed on the pixel substrate on the surface opposite to the opposing substrate; A flat first vapor chamber, formed by combining a flat first component and a flat second component, is filled with a first refrigerant. The first vapor chamber is disposed on a side opposite to the pixel substrate and the second dustproof substrate, with respect to at least one of the opposing substrate and the first dustproof substrate. A first heat dissipation component is connected to the first steam chamber in a manner that enables heat transfer; A flat second vapor chamber, which is formed by combining a flat third component and a flat fourth component, is filled with a second refrigerant. The second vapor chamber is disposed on the side opposite to the opposing substrate and the first dustproof substrate, relative to at least one of the pixel substrate and the second dustproof substrate. as well as The second heat dissipation component is connected to the second steam chamber in a manner that enables heat transfer. The first steam chamber has: a first opening corresponding to the pixel area; and a first heating portion disposed around the first opening and connected to at least one of the opposing substrate and the first dustproof substrate in a manner capable of heat transfer. The first heat dissipation section dissipates the heat received by the first heat receiving section. The first vapor chamber uses the heat received by the first heat receiving section to vaporize the liquid phase of the first refrigerant sealed inside. The first heat dissipation section dissipates the heat of the gaseous first refrigerant, thereby condensing the gaseous first refrigerant into a liquid phase. as well as The second vapor chamber has: a second opening corresponding to the pixel area; a second heating portion disposed around the second opening and connected to at least one of the pixel substrate and the second dustproof substrate in a manner capable of heat transfer; and a second heat dissipation portion for dissipating heat received by the second heating portion. The second vapor chamber uses the heat received by the second heating portion to vaporize the liquid phase of the second refrigerant sealed inside, and uses the second heat dissipation portion to dissipate heat from the gaseous phase of the second refrigerant, thereby condensing the gaseous phase of the second refrigerant into a liquid phase.

18. The transmissive liquid crystal panel according to claim 17, characterized in that, Viewed from the incident side of light incident on the liquid crystal layer, the first vapor chamber extends outward compared to the opposing substrate and the first dustproof substrate. Viewed from the light emission side of the liquid crystal layer, the second vapor chamber extends outwards compared to the pixel substrate and the second dustproof substrate. The first vapor chamber and the second vapor chamber are opposite each other in the direction of light incident on the liquid crystal layer.

Images