coil components

Abstract

This invention provides a coil component that improves heat dissipation around the periphery of a through conductor. In the coil component, the cross-sectional area of ​​the inner end of the planar coil is designed to be relatively large, so that heat generated in the through conductor is easily transferred to the inner end. Thus, in the coil component, heat is efficiently transferred from the through conductor to the inner end, thereby achieving high heat dissipation around the periphery of the through conductor.

Description

Technical Field

[0001] This invention relates to coil components. Background Technology

[0002] A coil component with multiple coils disposed within a substrate is currently known. Patent Document 1 disclosed below discloses a coil component with four terminals and two coils disposed within a substrate, wherein planar coils disposed on both sides of an insulating substrate are connected to each other via a through conductor.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-130472 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In the aforementioned coil components, the temperature around the conductor sometimes becomes excessively high during operation, which can compromise the stability of the component's characteristics. The inventors have conducted repeated research on heat dissipation around the conductor and have recently discovered a technique to improve heat dissipation.

[0008] The purpose of this invention is to provide a coil component that improves heat dissipation around the conductor.

[0009] Methods for solving problems

[0010] In one aspect of the present invention, a coil component includes: a body; an insulating substrate disposed within the body; and a pair of coil portions having a pair of planar coils wound in parallel on the insulating substrate and a pair of through conductors having inner ends of adjacent planar coils overlapping each other and penetrating the insulating substrate, wherein in a cross section orthogonal to the insulating substrate, the cross-sectional area of ​​the inner end of the planar coil is greater than the cross-sectional area of ​​the planar coil portion further outward than the inner end, and is also greater than the cross-sectional area of ​​the through conductors.

[0011] In the aforementioned coil component, the cross-sectional area of ​​the through conductor is relatively small. During operation, the current density flowing through the planar coil in the through conductor is high, making it prone to heat generation. However, the cross-sectional area of ​​the inner end of the planar coil overlapping the through conductor is larger than that of its outer portion. Therefore, the heat generated in the through conductor is easily transferred to the inner end. Thus, efficient heat transfer from the through conductor to the inner end is achieved in the coil component, resulting in high heat dissipation around the through conductor.

[0012] In another aspect of the coil component of the present invention, the height of the inner end of the planar coil is lower than the height of the planar coil portion that is further outward than the inner end.

[0013] In another aspect of the coil component of the present invention, the width of the inner end of the planar coil is greater than the width of the planar coil portion that is further outward than the inner end.

[0014] In another aspect of the coil component of the present invention, the planar coil is covered by an insulating material, and the thickness of the insulating material covering the inner end of the planar coil is greater than the thickness of the insulating material covering the portion of the planar coil that is further outward than the inner end.

[0015] In another aspect of the coil component of the present invention, the thickness of the insulating substrate is less than the thickness of the inner end of the planar coil.

[0016] In another aspect of the coil component of the present invention, the thicknesses of the inner ends of a pair of planar coils are different.

[0017] In another aspect of the coil component of the present invention, the thickness of the insulating substrate is smaller than the size of the through conductor in the extending direction of the insulating substrate.

[0018] In another aspect of the coil component of the present invention, the cross-sectional shape of the through conductor on a cross section orthogonal to the insulating substrate is formed into a narrow waist shape.

[0019] In another aspect of the coil component of the present invention, the through conductor is offset to the outside relative to the inner end of the planar coil.

[0020] Invention Effects

[0021] According to the present invention, a coil component is provided that improves heat dissipation around the conductor. Attached Figure Description

[0022] Figure 1 This is a schematic perspective view of the coil component in the embodiment.

[0023] Figure 2 It means Figure 1 A diagram of the interior of the coil component.

[0024] Figure 3 yes Figure 2 An exploded view of the coil shown.

[0025] Figure 4 yes Figure 2 The diagram shows a cross-sectional view of the coil component along line IV-IV.

[0026] Figure 5 yes Figure 2 The diagram shows a VV-line cross-section of the coil component.

[0027] Figure 6 yes Figure 2 The top view of the coil shown.

[0028] Figure 7 It's enlarged. Figure 4 The diagram shows the main part of the cross-sectional view. Detailed Implementation

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and repeated descriptions are omitted.

[0030] As an example, the coil component 1 in this embodiment is a balun. The balun is used when, for example, a near-field communication (NFC) circuit is incorporated into a cellular terminal. The balun converts the unbalanced signal from the antenna to the balanced signal from the NFC circuit, thus connecting the unbalanced and balanced circuits. The coil component 1 can also be used as a common-mode filter or a transformer.

[0031] like Figure 1 As shown, the coil component 1 comprises a body 10, a coil structure 20 embedded in the body 10, and two pairs of external terminal electrodes 60A, 60B, 60C, and 60D disposed on the surface of the body 10.

[0032] The body 10 has a rectangular parallelepiped shape and six faces 10a to 10f. For example, the body 10 is designed with a length of 2.0 mm, a short side of 1.25 mm, and a height of 0.65 mm. Among the faces 10a to 10f of the body 10, end face 10a (first end face) and end face 10b (second end face) are parallel to each other, upper surface 10c and lower surface 10d are parallel to each other, and side surface 10e and side surface 10f are parallel to each other. The upper surface 10c of the body 10 is parallel to the mounting surface of the mounting substrate of the coil component 1.

[0033] The base material 10 is composed of a metal-containing magnetic powder resin 12, which is a type of magnetic material. The metal-containing magnetic powder resin 12 is an adhesive powder in which metal magnetic powder is bonded together by an adhesive resin. The metal magnetic powder in the metal-containing magnetic powder resin 12 is composed of, for example, iron-nickel alloys (permalloy), carbonyl iron, amorphous, amorphous or crystalline FeSiCr alloys, iron-silicon-aluminum magnetic alloys, etc. The adhesive resin is, for example, a thermosetting epoxy resin. In this embodiment, the content of metal magnetic powder in the adhesive powder is 80-92 vol% by volume and 95-99 wt% by mass. From the viewpoint of magnetic properties, the content of metal magnetic powder in the adhesive powder may also be 85-92 vol% by volume and 97-99 wt% by mass. The magnetic powder in the metal-containing magnetic powder resin 12 may be a powder having a single average particle size or a mixture of powders having multiple average particle sizes.

[0034] The metal-containing magnetic powder resin 12 of the base body 10 integrally covers the coil structure 20 described later. Specifically, the metal-containing magnetic powder resin 12 covers the coil structure 20 from top to bottom and covers the outer periphery of the coil structure 20. In addition, the metal-containing magnetic powder resin 12 fills the inner periphery region of the coil structure 20.

[0035] The coil structure 20 is composed of an insulating substrate 30, an upper coil structure 40A disposed on the upper side of the insulating substrate 30, and a lower coil structure 40B disposed on the lower side of the insulating substrate 30.

[0036] The insulating substrate 30 is designed to have a flat plate shape, extending between the end faces 10a and 10b of the substrate 10, and orthogonal to the end faces 10a and 10b. Furthermore, the insulating substrate 30 extends parallel to the upper surface 10c and lower surface 10d of the substrate 10. Figure 3 As shown, the insulating substrate 30 has an elliptical coil forming portion 31 extending along the long side of the substrate 10, and a pair of frame portions 34A and 34B extending along the short side of the substrate 10 and sandwiching the coil forming portion 31 from both sides. An elliptical opening 32 extending along the long side of the substrate 10 is provided in the central portion of the coil forming portion 31.

[0037] The insulating substrate 30 is made of a non-magnetic insulating material. The thickness of the insulating substrate 30 can be designed to be, for example, in the range of 10 to 60 μm. In this embodiment, the insulating substrate 30 has a structure in which an epoxy resin is impregnated in glass cloth. The resin constituting the insulating substrate 30 is not limited to epoxy resin, but can also be BT resin, polyimide, aramid, etc. The constitutive material of the insulating substrate 30 can also be ceramic or glass. The constitutive material of the insulating substrate 30 can also be a mass-produced printed circuit board material. The constitutive material of the insulating substrate 30 can also be a resin material used for BT printed circuit boards, FR4 printed circuit boards, or FR5 printed circuit boards.

[0038] The upper coil structure 40A is disposed on the upper surface 30a of the coil forming portion 31 of the insulating substrate 30. For example... Figure 2 , 3 As shown, the upper coil structure 40A is composed of a first planar coil 41, a second planar coil 42, and an upper insulator 50A. The first planar coil 41 and the second planar coil 42 are wound adjacent to each other in a parallel manner on the upper surface 30a of the insulating substrate 30.

[0039] The first planar coil 41 is a generally oblong spiral hollow coil wound on the upper surface 30a of the insulating substrate 30 and within the same layer around the opening 32 of the coil forming portion 31. The first planar coil 41 can have one or more turns. In this embodiment, the first planar coil 41 has 3 to 4 turns. The first planar coil 41 has an outer end portion 41a and an inner end portion 41b. The outer end portion 41a is provided on the frame portion 34A and protrudes from the end face 10a of the body 10. The inner end portion 41b is provided at the edge of the opening 32. On the insulating substrate 30, a first through conductor 41c extending in the thickness direction of the insulating substrate 30 is provided at a position overlapping with the inner end portion 41b of the first planar coil 41, penetrating the insulating substrate 30. The first planar coil 41 is made of, for example, Cu and can be formed by electroplating.

[0040] Similar to the first planar coil 41, the second planar coil 42 is a generally oblong spiral hollow coil wound on the upper surface 30a of the insulating substrate 30 and within the same layer around the opening 32 of the coil forming portion 31. The second planar coil 42 is wound adjacent to the first planar coil 41 on the inner circumferential side of the first planar coil 41. The second planar coil 42 may have one turn or multiple turns. In this embodiment, the number of turns of the second planar coil 42 is the same as that of the first planar coil 41. The second planar coil 42 has an outer end portion 42a and an inner end portion 42b. Similar to the outer end portion 41a of the first planar coil 41, the outer end portion 42a of the second planar coil 42 is provided in the frame portion 34A and protrudes from the end face 10a of the body 10. The inner end portion 42b of the second planar coil 42 is provided at the edge of the opening 32 and is adjacent to the inner end portion 41b of the first planar coil 41. On the insulating substrate 30, a second through conductor 42c extending in the thickness direction of the insulating substrate 30 is provided at a position overlapping with the inner end 42b of the second planar coil 42, penetrating the insulating substrate 30. The second through conductor 42c is adjacent to the first through conductor 41c. Similar to the first planar coil 41, the second planar coil 42 is made of, for example, Cu and can be formed by electroplating.

[0041] An upper insulator 50A is disposed on the upper surface 30a of the insulating substrate 30. The upper insulator 50A contains a thick-film resist patterned using a known photolithography technique. The thick-film resist of the upper insulator 50A delineates the plating growth areas of the first planar coil 41 and the second planar coil 42. In this embodiment, as... Figure 4 As shown, the upper insulator 50A integrally covers the first planar coil 41 and the second planar coil 42, more specifically, it covers the side and upper surfaces of the first planar coil 41 and the second planar coil 42. In this embodiment, the upper insulator 50A comprises an insulating resin film covering the upper surfaces of the first planar coil 41 and the second planar coil 42. Figure 5 , 6 As shown, a portion of the upper insulator 50A extends from the interior of the body 10 through the space between the outer end 41a and the outer end 42a to the end face 10a of the body 10, where it is exposed. Additionally, as... Figure 5 , 6 As shown, a portion of the upper insulator 50A extends along the upper surface 30a of the substrate from the interior of the body 10 to the end face 10b, where it is exposed. The thickness of the upper insulator 50A is greater than the thickness of the first planar coil 41 and the second planar coil 42. The upper insulator 50A is made of, for example, epoxy resin.

[0042] The lower coil structure 40B is disposed on the lower surface 30b of the coil forming portion 31 of the insulating substrate 30. For example... Figure 2 , 3 As shown, the lower coil structure 40B comprises a first planar coil 41, a second planar coil 42, and a lower insulator 50B. The first planar coil 41 and the second planar coil 42 are wound adjacent to each other in a parallel manner on the lower surface 30b of the insulating substrate 30.

[0043] The first planar coil 41 and the second planar coil 42 of the lower coil structure 40B are symmetrical to the first planar coil 41 and the second planar coil 42 of the upper coil structure 40A. More specifically, the first planar coil 41 and the second planar coil 42 of the lower coil structure 40B have a shape that reverses the shape of the first planar coil 41 and the second planar coil 42 of the upper coil structure 40A about an axis parallel to the short side of the body 10.

[0044] The outer end 41a of the first planar coil 41 of the lower coil structure 40B is disposed on the frame portion 34B and protrudes from the end face 10b of the body 10. The inner end 41b of the first planar coil 41 of the lower coil structure 40B overlaps with the first through conductor 41c disposed on the insulating substrate 30. Therefore, the inner end 41b of the first planar coil 41 of the lower coil structure 40B is electrically connected to the inner end 41b of the first planar coil 41 of the upper coil structure 40A via the first through conductor 41c. The first planar coil 41 of the lower coil structure 40B is made of, for example, Cu and can be formed by electroplating.

[0045] The outer end 42a of the second planar coil 42 of the lower coil structure 40B is disposed on the frame portion 34B and protrudes from the end face 10b of the body 10. The inner end 42b of the second planar coil 42 of the lower coil structure 40B overlaps with the second through conductor 42c disposed on the insulating substrate 30. Therefore, the inner end 42b of the second planar coil 42 of the lower coil structure 40B is electrically connected to the inner end 42b of the second planar coil 42 of the upper coil structure 40A via the second through conductor 42c. The second planar coil 42 of the lower coil structure 40B is made of, for example, Cu and can be formed by electroplating.

[0046] A lower insulator 50B is disposed on the lower surface 30b of the insulating substrate 30. The lower insulator 50B contains a thick-film resist patterned using known photolithography. Similar to the thick-film resist of the upper insulator 50A, the thick-film resist of the lower insulator 50B delineates the plating growth areas of the first planar coil 41 and the second planar coil 42. In this embodiment, as... Figure 4 As shown, the lower insulator 50B integrally covers the first planar coil 41 and the second planar coil 42, and more specifically, covers the side and upper surfaces of the first planar coil 41 and the second planar coil 42. In this embodiment, the lower insulator 50B comprises an insulating resin film covering the upper surfaces of the first planar coil 41 and the second planar coil 42. Similar to the upper insulator 50A, a portion of the lower insulator 50B extends from the interior of the substrate 10 through the space between the outer end 41a and the outer end 42a to the end face 10b of the substrate 10, where it is exposed. Additionally, a portion of the lower insulator 50B extends along the lower surface 30b of the substrate from the interior of the substrate 10 to the end face 10a, where it is exposed. The thickness of the lower insulator 50B is greater than the thickness of the first planar coil 41 and the second planar coil 42. The thickness of the lower insulator 50B may also be the same as the thickness of the upper insulator 50A. The lower insulator 50B is made of, for example, epoxy resin.

[0047] The base body 10 includes a pair of coil portions C1 and C2 constituting a dual-coil structure. The first coil portion C1 is composed of a first planar coil 41 of an upper coil structure 40A disposed on the upper surface 30a of the insulating substrate 30, a first planar coil 41 of a lower coil structure 40B disposed on the lower surface 30b of the insulating substrate 30, and a first through conductor 41c connecting the two first planar coils 41 to each other. In the first coil portion C1, the outer end 41a of the first planar coil 41 of the upper coil structure 40A constitutes a first end, and the outer end 41a of the first planar coil 41 of the lower coil structure 40B constitutes a second end. The second coil section C2 is composed of a second planar coil 42 of an upper coil structure 40A disposed on the upper surface 30a of the insulating substrate 30, a second planar coil 42 of a lower coil structure 40B disposed on the lower surface 30b of the insulating substrate 30, and a second through conductor 42c connecting the two second planar coils 42 to each other. In the second coil section C2, the outer end 42a of the second planar coil 42 of the upper coil structure 40A constitutes a first end, and the outer end 42a of the second planar coil 42 of the lower coil structure 40B constitutes a second end.

[0048] Two pairs of external terminal electrodes 60A, 60B, 60C, and 60D are each provided on the parallel end faces 10a and 10b of the body 10.

[0049] In a pair of external terminal electrodes 60A and 60B disposed on end face 10a, external terminal electrode 60A is connected to the outer end 41a of the first planar coil 41 of the upper coil structure 40A, and external terminal electrode 60B is connected to the outer end 42a of the second planar coil 42 of the upper coil structure 40A. Figure 6 As shown, viewed from the end face 10a side, the external terminal electrode 60A is offset from the side face 10f side, covering the vicinity of the side face 10f on the end face 10a. Additionally, the external terminal electrode 60B is offset from the side face 10e side, covering the vicinity of the side face 10e on the end face 10a. Viewed from the end face 10a side, the external terminal electrode 60A and the external terminal electrode 60B are separated by a predetermined uniform width.

[0050] Of the pair of external terminal electrodes 60C and 60D disposed on end face 10b, external terminal electrode 60C is connected to the outer end 41a of the first planar coil 41 of the lower coil structure 40B, and external terminal electrode 60D is connected to the outer end 42a of the second planar coil 42 of the lower coil structure 40B. External terminal electrode 60C is biased against the side 10f side, covering the vicinity of side 10f on end face 10b. External terminal electrode 60D is biased against the side 10e side, covering the vicinity of side 10e on end face 10b. Viewed from end face 10b, external terminal electrode 60C and external terminal electrode 60D are separated by a predetermined uniform width.

[0051] External terminal electrodes 60A on end face 10a and 60C on end face 10b are positioned at corresponding locations along the long side of the body 10. Similarly, external terminal electrodes 60B on end face 10a and 60D on end face 10b are positioned at corresponding locations along the long side of the body 10.

[0052] External terminal electrodes 60A, 60B, 60C, and 60D are all bent into an L-shape, continuously covering end faces 10a and 10b and the upper surface 10c. In this embodiment, external terminal electrodes 60A, 60B, 60C, and 60D are made of resin electrodes, for example, of resin containing Ag powder.

[0053] Next, refer to Figure 7 The structure of the inner ends 41b and 42b of the planar coils 41 and 42 and the through conductors 41c and 42c is described. Figure 7 The section orthogonal to the insulating substrate 30, i.e., the section passing through the conductors 41c and 42c, is magnified. Figure 4 The diagram shows the main part of the cross-sectional view. In the following description, the structure of the planar coils 41 and 42 in the upper coil structure 40A will be described, but the structure of the planar coils 41 and 42 in the lower coil structure 40B is the same or identical.

[0054] like Figure 7 As shown, the cross-sectional area S1 of the inner end 41b of the first planar coil 41 and the cross-sectional area S2 of the inner end 42b of the second planar coil 42 are both designed to be larger than the cross-sectional area s of the planar coils 41 and 42 that are outside their inner ends 41b and 42b. Figure 7 In the illustrated configuration, the width W1 of the inner end 41b of the first planar coil 41 and the width W2 of the inner end 42b of the second planar coil 42 are both greater than the width w of the planar coils 41 and 42 whose turns are located outside their inner ends 41b and 42b. Furthermore, in Figure 7In the manner shown, the thickness D1 of the insulating material covering the portion of the inner end 41b of the first planar coil 41 and the thickness D2 of the insulating material covering the portion of the inner end 42b of the second planar coil 42 are both thicker than the thickness d of the insulating material covering the portions of the planar coils 41 and 42 that are outside their inner ends 41b and 42b.

[0055] Furthermore, the cross-sectional areas S1 of the inner end 41b of the first planar coil 41 and S2 of the inner end 42b of the second planar coil 42 are designed to be different. Alternatively, the cross-sectional areas S1 and S2 can also be designed to be the same. Figure 7 In the illustrated configuration, the cross-sectional area S1 of the inner end 41b of the first planar coil 41 is larger than the cross-sectional area S2 of the inner end 42b of the second planar coil 42. Furthermore, the thickness H1 of the inner end 41b of the first planar coil 41 and the thickness H2 of the inner end 42b of the second planar coil 42 are designed to be different. Figure 7 In the illustrated configuration, the thickness H1 of the inner end 41b of the first planar coil 41 is thicker than the thickness H2 of the inner end 42b of the second planar coil 42. Regarding the thickness of the upper insulator 50A, the thickness D1 of the insulating material covering the portion of the inner end 41b of the first planar coil 41 is thinner than the thickness D2 of the insulating material covering the portion of the inner end 42b of the second planar coil 42. Alternatively, thicknesses D1 and D2 can be the same. The width W1 of the inner end 41b of the first planar coil 41 can be different from or the same as the width W2 of the inner end 42b of the second planar coil 42.

[0056] The first through conductor 41c, which overlaps with the inner end 41b of the first planar coil 41, and the second through conductor 42c, which overlaps with the inner end 42b of the second planar coil 42, have the same thickness as the insulating substrate 30. The first through conductor 41c and the second through conductor 42c have circular cross-sections in the thickness direction of the insulating substrate 30. The thickness of the insulating substrate 30 is designed to be thinner than the diameters (i.e., the dimensions in the extending direction of the insulating substrate 30) of the first through conductor 41c and the second through conductor 42c. The cross-sectional area s1 of the first through conductor 41c is smaller than the cross-sectional area S1 of the inner end 41b of the first planar coil 41. Furthermore, the cross-sectional area s2 of the second through conductor 42c is smaller than the cross-sectional area S2 of the inner end 42b of the second planar coil 42. Both the first through conductor 41c and the second through conductor 42c have a narrow cross-sectional shape, with their width decreasing as they move inward from the upper and lower surfaces 30a and 30b of the insulating substrate 30. Furthermore, both the first through conductor 41c and the second through conductor 42c are offset from the outer periphery of the planar coils 41 and 42 relative to their inner ends 41b and 42b. Figure 7(Right side of the coil). In addition, the first through conductor 41c and the second through conductor 42c can also be positioned without bias on the outer periphery of the coil (e.g., aligned with the center position of the inner ends 41b, 42b).

[0057] As explained above, the cross-sectional areas s1 and s2 of the through conductors 41c and 42c are relatively smaller (for example, smaller than the cross-sectional areas S1 and S2 of the inner ends 41b and 42b of the planar coils 41 and 42). Therefore, the current density of the current flowing in the planar coils 41 and 42 when driving coil component 1 is higher in the through conductors 41c and 42c, making it easier for heat to be generated in the through conductors 41c and 42c. In particular, when the through conductors 41c and 42c are adjacent, as in coil component 1, excessive heat is easily generated. Furthermore, when the cross-sectional shape of the through conductors 41c and 42c forms a narrow waist shape, the current density becomes higher, making it easier for heat to be generated.

[0058] In coil component 1, the cross-sectional areas S1 and S2 of the inner ends 41b and 42b of the planar coils 41 and 42 are designed to be relatively large (e.g., larger than the cross-sectional area s of the outer portions of the planar coils 41 and 42), so the heat generated in the conductors 41c and 42c is easily transferred to the inner ends 41b and 42b. Thus, in coil component 1, heat is efficiently transferred from the conductors 41c and 42c to the inner ends 41b and 42b, thereby achieving high heat dissipation around the conductors 41c and 42c.

[0059] Furthermore, the present invention is not limited to the embodiments described above, and can be implemented in various ways.

[0060] For example, the number of turns in the first coil section and the number of turns in the second coil section can be appropriately increased or decreased. Alternatively, the coil section body can contain more than three coil sections.

Claims

1. A coil component, characterized in that, include: body; An insulating substrate disposed within the body; and A pair of coil portions, having a pair of planar coils wound in parallel on the insulating substrate and a pair of through conductors that overlap with the inner ends of adjacent planar coils and penetrate the insulating substrate. In a cross-section orthogonal to the insulating substrate, the cross-sectional area of ​​the inner end of the planar coil is larger than the cross-sectional area of ​​the portion of the planar coil further out than the inner end, and is also larger than the cross-sectional area of ​​the through conductor. The thicknesses of the inner ends of the pair of planar coils are different.

2. The coil component as described in claim 1, characterized in that: The height of the inner end of the planar coil is lower than the height of the portion of the planar coil that is further outward from the inner end.

3. The coil component as described in claim 1, characterized in that: The width of the inner end of the planar coil is greater than the width of the portion of the planar coil that is further outward from the inner end.

4. The coil component as described in claim 2, characterized in that: The width of the inner end of the planar coil is greater than the width of the portion of the planar coil that is further outward from the inner end.

5. The coil component as described in any one of claims 1 to 4, characterized in that: The planar coil is covered with an insulating material, and the thickness of the insulating material covering the inner end of the planar coil is greater than the thickness of the insulating material covering the portion of the planar coil that is further outward than the inner end.

6. The coil component as described in any one of claims 1 to 4, characterized in that: The thickness of the insulating substrate is less than the thickness of the inner end of the planar coil.

7. The coil component as described in claim 5, characterized in that: The thickness of the insulating substrate is less than the thickness of the inner end of the planar coil.

8. The coil component as described in any one of claims 1 to 4 and 7, characterized in that: The thickness of the insulating substrate is less than the size of the through conductor in the extending direction of the insulating substrate.

9. The coil component as described in claim 5, characterized in that: The thickness of the insulating substrate is less than the size of the through conductor in the extending direction of the insulating substrate.

10. The coil component as claimed in claim 6, characterized in that: The thickness of the insulating substrate is less than the size of the through conductor in the extending direction of the insulating substrate.

11. The coil component as described in any one of claims 1 to 4, 7, 9, and 10, characterized in that: The cross-sectional shape of the through conductor on a section orthogonal to the insulating substrate forms a narrow waist shape.

12. The coil component as claimed in claim 5, characterized in that: The cross-sectional shape of the through conductor on a section orthogonal to the insulating substrate forms a narrow waist shape.

13. The coil component as claimed in claim 6, characterized in that: The cross-sectional shape of the through conductor on a section orthogonal to the insulating substrate forms a narrow waist shape.

14. The coil component as claimed in claim 8, characterized in that: The cross-sectional shape of the through conductor on a section orthogonal to the insulating substrate forms a narrow waist shape.

15. The coil component as described in any one of claims 1 to 4, 7, 9, 10, and 12 to 14, characterized in that: The through conductor is offset to the outside relative to the inner end of the planar coil.

16. The coil component as claimed in claim 5, characterized in that: The through conductor is offset to the outside relative to the inner end of the planar coil.

17. The coil component as claimed in claim 6, characterized in that: The through conductor is offset to the outside relative to the inner end of the planar coil.

18. The coil component as claimed in claim 8, characterized in that: The through conductor is offset to the outside relative to the inner end of the planar coil.

19. The coil component as claimed in claim 11, characterized in that: The through conductor is offset to the outside relative to the inner end of the planar coil.

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