Substrate processing apparatus

Abstract

The inventive concept provides a substrate processing apparatus. The substrate processing apparatus comprises a main body; a fluid supply unit for supplying a processing fluid to a processing space within the main body; and a fluid drain line for draining the processing fluid from the processing space, and wherein the main body comprises: a first main body; a second main body which is relatively movable with respect to the first main body; and an anti-friction member for preventing friction between the first main body and the second main body, and wherein the anti-friction member is configured to continuously cover at least two of the surfaces of the first main body and the second main body.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0099854, filed with the Korean Intellectual Property Office on July 29, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a substrate processing apparatus. Background Technology

[0004] To manufacture semiconductor devices, various substrate-based processes, such as photolithography, etching, ashing, ion implantation, and thin-film deposition, are used to form desired patterns on a substrate, such as a wafer. Each process uses different processing fluids and gases, and generates particles and process byproducts during the process. Cleaning processes are performed before and after each process to remove these particles and process byproducts from the substrate.

[0005] A known cleaning process uses chemicals and rinsing solutions to treat a substrate. This is followed by a drying process. One embodiment of the drying process includes a spin-drying process, in which the substrate is rotated at high speed to remove any rinsing solution remaining on the substrate. However, a problem is that this spin-drying method may damage the patterns formed on the substrate.

[0006] Therefore, a recent supercritical drying process is used to supply an organic solvent, such as isopropanol (IPA), onto a substrate to replace the rinsing solution remaining on the substrate with an organic solvent having low surface tension. Then, a supercritical processing fluid (e.g., carbon dioxide) is supplied to the substrate to remove the remaining organic solvent. In the supercritical drying process, a drying gas is supplied to an internally sealed process chamber and is heated and pressurized. The temperature and pressure of the drying gas rise above the critical point, and the drying gas phase changes to a supercritical state.

[0007] In substrate processing equipment used to perform supercritical drying processes, such as Figure 1 As shown, the top body 1 and the bottom body 2 are combined to form an internal space. A substrate W, such as a wafer, is supported by a support member 4, and drying gas is supplied to the internal space. Maintaining the pressure in the internal space at a high pressure is crucial to keeping the drying gas in a supercritical state. The internal space is sealed by a sealing member 3, such as an O-ring. Furthermore, to minimize the generation of particulate impurities in areas where the top body 1 and the bottom body 2 contact each other, a contact film 5 is mounted on the mating surface of the bottom body 2.

[0008] Simultaneously, when the substrate W is dried by the drying gas, vibrations occur in various directions at the top body 1 and bottom body 2 due to the pressure of the internal space. These vibrations occur irregularly in various directions, such as the XYZ directions, the direction of rotation in the X direction, the direction of rotation in the Y direction, the direction of rotation in the Z direction, and so on. In this case, as... Figure 2 As shown, deformation and pushing phenomena may occur in the contact membrane 5. Summary of the Invention

[0009] An embodiment of the present invention provides a substrate processing apparatus for effectively processing substrates.

[0010] An embodiment of the present invention provides a substrate processing apparatus for minimizing the occurrence of pushing or deformation phenomena in anti-friction members provided between the main bodies.

[0011] An embodiment of the present invention provides a substrate processing apparatus for minimizing fine vibrations of the substrate during high-voltage processes.

[0012] An embodiment of the present invention provides a substrate processing apparatus for increasing the replacement cycle of anti-friction components.

[0013] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will be apparent to those skilled in the art from the following description.

[0014] This invention provides a substrate processing apparatus. The substrate processing apparatus includes a main body; a fluid supply unit for supplying processing fluid to a processing space within the main body; and a fluid discharge line for discharging processing fluid from the processing space. The main body includes: a first main body; a second main body that is movable relative to the first main body; and an anti-friction member for preventing friction between the first main body and the second main body, wherein the anti-friction member is configured to continuously cover at least two surfaces of the first main body and the second main body.

[0015] In the implementation, the surfaces of the first body and the second body include: a first surface; and a second surface extending from the first surface, wherein the anti-friction member includes: a first portion configured to cover the first surface; and a second portion extending in a direction intersecting the direction extending from the first portion and configured to cover the second surface.

[0016] In the implementation plan, the second part is provided in multiple ways.

[0017] In the implementation scheme, some of the second parts extend upward from the first part, while the other second parts extend downward.

[0018] In the implementation scheme, some of the second portions extend from the first portion in an upward and inclined direction, while the other second portions extend in a downward and inclined direction.

[0019] In the implementation scheme, the anti-friction member has an integral form in which the first part and the second part are formed as a whole.

[0020] In the implementation scheme, the second parts are spaced apart from each other, with a spacing of 15mm to 20mm.

[0021] In the implementation scheme, the surfaces of the first body and the second body include a third surface extending from the first surface and the second surface, and the anti-friction member further includes a third portion extending from the first portion.

[0022] In the implementation plan, the first main body is a chamber body that defines the processing space, and the second main body is a clamping body for clamping the chamber body.

[0023] In the implementation scheme, each of the first body and the second body is combined with each other to define the first chamber body and the second chamber body of the processing space.

[0024] In the implementation scheme, either the first body or the second body may be movable in the lateral direction.

[0025] In the implementation scheme, either the first body or the second body may move in the up / down direction.

[0026] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes a chamber body defining a processing space for processing a substrate, the chamber body including a first chamber body and a second chamber body movable relative to the first chamber body; a clamping body for clamping the first chamber body and the second chamber body, provided that the first chamber body and the second chamber body are in close contact in a closed position; and an anti-friction member for preventing friction between the clamping body and the chamber body.

[0027] In the implementation, the anti-friction member is configured to continuously cover at least two surfaces of either the clamping body or the chamber body.

[0028] In the implementation, the anti-friction components are provided in multiple portions and spaced apart from each other.

[0029] In the implementation scheme, when viewed from above, some anti-friction components are arranged in a circumferential direction and spaced apart from each other.

[0030] In an embodiment, the surface of either the clamping body or the chamber body includes: a first surface; a second surface extending from the first surface; and a third surface extending from the first and second surfaces, wherein the anti-friction member includes: a first portion configured to cover the first surface; a second portion extending in a direction intersecting the direction extending from the first portion and configured to cover the second surface; and a third portion extending from the first portion.

[0031] In the implementation scheme, the anti-friction component is a polyimide film.

[0032] This invention provides a substrate processing apparatus for processing a substrate using a processing fluid in a supercritical state. The substrate processing apparatus includes a main body; a fluid supply unit for supplying processing fluid to a processing space within the main body; and a fluid discharge line for discharging processing fluid from the processing space. The main body includes: a chamber body defining a processing space for processing the substrate, the chamber body including a first chamber body and a second chamber body movable relative to the first chamber body; a clamping body for clamping the first chamber body and the second chamber body, provided that the first chamber body and the second chamber body are in close contact in a closed position; and an anti-friction member for preventing friction between the clamping body and the chamber body, wherein the anti-friction member is mounted on the clamping body and configured to continuously cover at least two surfaces of the clamping body.

[0033] In one embodiment, the surface of the clamping body includes: a first surface parallel to the ground; a second surface extending intersecting with the first surface; and a third surface extending intersecting with both the first and second surfaces, the third surface being a single surface, wherein the first clamping body and the second clamping body face each other, and wherein the anti-friction member includes: a first portion configured to cover the first surface; a second portion extending from the first portion and configured to cover the second surface; and a third portion extending from the first portion and configured to cover the third surface.

[0034] The present invention provides a substrate processing apparatus for processing a substrate using a processing fluid in a supercritical state. The substrate processing apparatus includes a first body; a second body combined with the first body to define a processing space for processing the substrate; and anti-friction members mounted on a mating surface, the mating surface being a surface of either the first or second body, the first and second bodies being mated at that surface, and wherein multiple anti-friction members are provided.

[0035] In the implementation scheme, the anti-friction components are spaced apart from each other and mounted on the mating surfaces.

[0036] In an embodiment, the substrate processing apparatus further includes a moving unit for moving either the first body or the second body relative to the other of the first body and the second body, and if either the first body or the second body moves and is in a closed position to define a processing space, the space between the anti-friction members is a space that allows either of the anti-friction members to be spaced apart from another adjacent anti-friction member.

[0037] According to the embodiments of the present invention, the substrate can be processed effectively.

[0038] According to embodiments of the present invention, the occurrence of pushing or deformation phenomena in the anti-friction components provided between the main bodies can be minimized.

[0039] According to embodiments of the present invention, the occurrence of fine vibrations in the body during high-pressure processes can be minimized.

[0040] According to embodiments of the present invention, the replacement cycle of anti-friction components can be increased.

[0041] The effects of the present invention are not limited to those described above, and other effects not mentioned will be apparent to those skilled in the art from the following description. Attached Figure Description

[0042] The foregoing and other purposes and features will become apparent from the following description of the figures with reference, wherein, unless otherwise specified, similar reference numerals refer to similar parts in the figures.

[0043] Figure 1 The diagram shows a known substrate processing apparatus.

[0044] Figure 2 The illustration is in Figure 1 The state in which deformation or pushing occurs on the contact film.

[0045] Figure 3 The illustration shows a substrate processing apparatus according to an embodiment of the concept of the present invention.

[0046] Figure 4 schematic diagram Figure 3 Implementation scheme for the liquid handling chamber.

[0047] Figure 5 schematic diagram Figure 3 Implementation plan for the drying chamber.

[0048] Figure 6 Illustration Figure 5 The top and bottom main bodies are positioned in a closed state.

[0049] Figure 7 Illustration Figure 5The first clamping body and the second clamping body are positioned in the clamping position.

[0050] Figure 8A For illustration Figure 5 A three-dimensional view of any one of the clamping bodies.

[0051] Figure 8B For illustration Figure 5 A three-dimensional view of the other of the clamping bodies.

[0052] Figure 9 For illustration Figure 5 An enlarged view of the main chamber body and a portion of the clamping body.

[0053] Figure 10 , Figure 11 ,and Figure 12 The diagram illustrates the vibration of the main chamber, which can be transmitted to the clamping body.

[0054] Figure 13 The figure illustrates an anti-friction member according to another embodiment of the concept of the present invention.

[0055] Figure 14 and Figure 15 The figure illustrates an anti-friction member according to another embodiment of the concept of the present invention.

[0056] Figure 16 Another embodiment of the anti-friction member of the present invention is illustrated schematically.

[0057] Figures 17 to 22 The illustration shows a drying chamber and anti-friction components according to another embodiment of the concept of the present invention.

[0058] [Symbol Explanation]

[0059] 1: Top main body; 2: Bottom main body; 3: Sealing component; 4: Support component; 5: Contact membrane;

[0060] 10: Index module; 12: Load port; 14: Index box; 20: Processing module;

[0061] 30: Controller; 120: Indexing robot; 122: Hand; 124: Guide rail; 200: Buffer unit;

[0062] 220: Buffer; 300: Transfer chamber; 320: Transfer manipulator; 322: Hand;

[0063] 324: Guide rail; 400: Liquid handling chamber; 410: Housing; 420: Cup;

[0064] 422: (First) Recollect container; 422a: First entry point;

[0065] 424: (Second) Re-collection container; 424a: Second inlet;

[0066] 426: Third recollection container; 426a: Third inlet; 440: Support unit;

[0067] 442: Support plate; 442a: Support pin; 442b: Chuck pin; 444: Drive shaft;

[0068] 446: Actuator; 460: Liquid supply unit; 462: Nozzle; 480: Lifting / lowering unit;

[0069] 500: Drying chamber; 510: Chamber body; 510a: First surface; 510b: Second surface;

[0070] 511: Processing space; 512: Top main body; 512a: First supply channel;

[0071] 514: Bottom body; 514a: Second supply channel; 514b: Discharge channel;

[0072] 516: Sealing component; 520: Clamping body; 520a: First surface;

[0073] 520b, 520c: Second surface; 520d: Third surface; 522: First clamping body;

[0074] 524: Second clamping body; 530: Fluid supply unit; 531: Fluid supply source;

[0075] 533: First supply line; 535: First supply valve; 537: Second supply line;

[0076] 539: Second supply valve; 540: Fluid discharge line; 550: Support component;

[0077] 560: First moving unit; 562: Lift / lower driver; 564: Lift / lower plate;

[0078] 570: Second moving unit; 572: First main body; 574: Second main body; 576: Third main body;

[0079] 578: Moving track; 580: Anti-friction component; 580a~580g: Anti-friction component;

[0080] 581: Part 1; 581a: Part 1 of 580a; 581b: Part 1 of 580b;

[0081] 582: Part Two; 582b: Part Two; 583: Part Two; 584: Part Three;

[0082] 600: Drying chamber; 611: Processing space; 612: Base body; 614: Door body;

[0083] 616: Support frame; 633: First supply line; 637: Second supply line;

[0084] 651: Discharge pipeline; 700: Drying chamber; 712: Base body; 714: Door body;

[0085] 716: Support frame; 733: Supply line; 761: Discharge line; 800: Drying chamber;

[0086] 810: Main body; 812: Top main body; 812a: Top channel; 814: Bottom main body;

[0087] 814a: Supply channel; 814b: Bottom channel; 814c: Discharge channel; 816: Sealing component;

[0088] 820: Lifting / lowering component; 830: Support component; 900: Drying chamber;

[0089] 910: Main body of the chamber; 912: Main body of the first chamber; 914: Main body of the second chamber;

[0090] 920: Clamping body; 922: First clamping body; 922a~922b: Protrusions;

[0091] 924: Second clamping body; 924a~924b: Protrusions; 9122: Groove; 9124: Groove;

[0092] 9142: Groove; 9144: Groove; B: Fixed outer wall; C: Container; G: Drying fluid;

[0093] V1~V3: Vibration; W: Substrate; X: First direction; Y: Second direction; Z: Third direction. Detailed Implementation

[0094] The present invention concept can be modified and taken in various forms, and specific embodiments thereof will be illustrated and described in detail in the drawings. However, embodiments of the present invention concept are not intended to limit the specific forms of disclosure, and it should be understood that the present invention concept includes all variations, equivalents, and substitutions included within the spirit and technical scope of the present invention concept. In the description of the present invention concept, detailed descriptions of related known technologies may be omitted where such descriptions may obscure the essence of the present invention concept.

[0095] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the concept of the invention. As used herein, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are also intended to include multiple forms. It should be further understood that when the terms "comprises," "comprising," "includes," and / or "includes" are used in this specification, they specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Furthermore, the term "example" means instance or illustration.

[0096] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another region, layer, or portion. Therefore, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion without departing from the teachings of the present invention.

[0097] It should be understood that when a component or layer is referred to as being "on," "connected to," "coupled to," or "covering" another component or layer, it may be directly on, connected to, coupled to, or cover the other component or layer, or there may be an intermediary component or layer. Conversely, when a component is referred to as being "directly on," "directly connected to," or "directly coupled to" another component or layer, there is no intermediary component or layer. Other terms, such as "between," "adjacent," "near," or similar, should also be interpreted in the same manner.

[0098] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the concepts of this invention pertain. Unless expressly defined in this application, terms as defined in common dictionaries should be interpreted in a manner consistent with the context of the relevant art, without being idealized or overly formal.

[0099] The following text will refer to Figures 3 to 22 Schemes describing the concept of the present invention.

[0100] Figure 3 This is a plan view illustrating a substrate processing apparatus according to an embodiment of the concept of the present invention.

[0101] refer to Figure 3 The substrate processing apparatus includes an indexing module 10, a processing module 20, and a controller 30. The indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged will be referred to as the first direction X, the direction perpendicular to the first direction X will be referred to as the second direction Y, and the direction perpendicular to both the first direction X and the second direction Y will be referred to as the third direction Z.

[0102] The indexing module 10 transfers the substrate W from the container C in which the substrate W is stored to the processing module 20, and stores the substrate W that has been processed at the processing module 20 in the container C. The longitudinal direction of the indexing module 10 is provided in the second direction Y. The indexing module 10 has a loading port 12 and an index frame 14. The index frame 14 is located between the loading port 12 and the processing module 20. The container C for storing the substrate W is placed on the loading port 12. Multiple loading ports 12 can be provided, and the multiple loading ports 12 can be arranged along the second direction Y.

[0103] For container C, a sealed container, such as a front-open unified pod (FOUP), can be used. Container C can be placed on loading port 12 by means of a transfer mechanism (not shown) such as an overhead conveyor, overhead transfer machine, or automated guided vehicle, or by an operator.

[0104] Index frame 14 is provided with an indexing robot 120. Within index frame 14, a guide rail 124 is provided, its longitudinal direction in a second direction Y, and the indexing robot 120 is provided so that it can move along the guide rail 124. The indexing robot 120 may include a hand 122 on which a substrate W is placed, and the hand 122 is movable forward and backward, rotatable about a third direction Z, and movable along the third direction Z. A plurality of hands 122 are provided, spaced apart in the up / down direction, and the hands 122 are movable forward and backward independently of each other.

[0105] Controller 30 controls the substrate processing equipment. The controller may include a process controller, such as a microprocessor (computer) that controls the substrate processing equipment; a user interface, such as a keyboard and similar for operator input to manage the substrate processing equipment, a display for visualizing and showing the operation of the substrate processing equipment, and similar; and a storage unit storing process control programs for executing processes performed in the substrate processing equipment under the control of the process controller, and various data and programs (i.e., processing recipes) for executing various processes in various components according to processing conditions. Furthermore, the user interface and storage unit may be connected to the process controller. The processing recipes may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or DVD, or semiconductor memory such as flash memory.

[0106] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which a substrate W is carried into the processing module 20 and temporarily resides when carried out from the processing module 20. The liquid processing chamber 400 supplies liquid to the substrate W to perform a liquid processing process on the substrate W. The drying chamber 500 performs a drying process to remove residual liquid from the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0107] The longitudinal direction of the transfer chamber 300 can be provided in a first direction X. A buffer unit 200 can be disposed between the index module 10 and the transfer chamber 300. A liquid processing chamber 400 and a drying chamber 500 can be disposed on one side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 can be disposed along a second direction Y. The drying chamber 500 and the transfer chamber 300 can be disposed along a second direction Y. The buffer unit 200 can be located at one end of the transfer chamber 300.

[0108] According to the embodiments, liquid processing chambers 400 may be disposed on both sides of transfer chamber 300, and drying chambers 500 may be disposed on both sides of transfer chamber 300, with liquid processing chambers 400 disposed closer to buffer unit 200 than drying chambers 500. In some embodiments, liquid processing chambers 400 may be provided on one and / or both sides of transfer chamber 300 in an array of AXB (where A and B are natural numbers greater than 1 or 1) along a first direction X and a third direction Z. In some embodiments, drying chambers 500 may be provided on one and / or both sides of transfer chamber 300 in an array of CXD (where C and D are natural numbers greater than 1 or 1) along a first direction X and a third direction Z. In some embodiments, only liquid processing chamber 400 may be provided on one side of transfer chamber 300, and only drying chamber 500 may be provided on the other side of transfer chamber 300.

[0109] The transfer chamber 300 includes a transfer manipulator 320. Within the transfer chamber 300, a guide rail 324 with a longitudinal direction disposed in a first direction X is provided, and a transfer manipulator 320 movable on the guide rail 324 is provided. The transfer manipulator 320 may include a hand 322 on which a substrate W is placed, and the hand 322 is movable forward and backward, rotatable about a third direction Z as an axis, and movable along the third direction Z. Multiple hands 322 are spaced apart in the up / down direction, and the hands 322 can move forward and backward independently of each other.

[0110] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be configured to be spaced apart from each other in the third direction Z. The front and back sides of the buffer unit 200 are open. The front side is the surface facing the index module 10, and the back side is the surface facing the transfer chamber 300. The indexing robot 120 can access the buffer unit 200 via the front side, and the transfer robot 320 can access the buffer unit 200 via the back side.

[0111] Figure 4 schematic diagram Figure 3 An implementation scheme for a liquid handling chamber. (Reference) Figure 4 The liquid handling chamber 400 includes a housing 410, a cup 420, a support unit 440, a liquid supply unit 460, and a lifting / lowering unit 480.

[0112] The housing 410 may have an internal space in which the substrate W is processed. The housing 410 may have a generally hexahedral shape. For example, the housing 410 may have a rectangular parallelepiped shape. In addition, an opening (not shown) may be formed in the housing 410 for bringing in or taking out the substrate W. Furthermore, a door (not shown) for selectively opening and closing the opening may be installed at the housing 410.

[0113] The cup 420 may have a container shape with an open top. The cup 420 may have a processing space, and the substrate W may be processed with liquid within the processing space. A support unit 440 supports the substrate W within the processing space. A liquid supply unit 460 supplies processing fluid to the substrate W supported by the support unit 440. Multiple types of processing fluid may be provided and may be supplied sequentially to the substrate W. A lifting / lowering unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0114] In one embodiment, the cup 420 has a plurality of recollection containers 422, 424, and 426. Each of the recollection containers 422, 424, and 426 has a recollection space for recollecting liquid used for substrate processing. Each of the recollection containers 422, 424, and 426 is arranged in an annular shape around the support unit 440. During the liquid processing process, the processing fluid dispersed by the rotation of the substrate W is introduced into the recollection space via the inlets (422a, 424a, and 426a) of the respective recollection containers 422, 424, and 426. According to one embodiment, the cup 420 has a (first) recollection container 422, a (second) recollection container 424, and a (third) recollection container 426. The (first) recollection container 422 is arranged around the support unit 440, the (second) recollection container 424 is arranged around the (first) recollection container 422, and the (third) recollection container 426 is arranged around the (second) recollection container 424. The second inlet 424a for introducing liquid into the (second) recollection container 424 may be located above the first inlet 422a for introducing liquid into the (first) recollection container 422, and the third inlet 426a for introducing liquid into the (third) recollection container 426 may be located above the second inlet 424a.

[0115] The support unit 440 includes a support plate 442 and a drive shaft 444. The top surface of the support plate 442 is provided in a generally circular shape and may have a diameter larger than that of the substrate W. A support pin 442a is provided at the center of the support plate 442 to support the bottom surface of the substrate W, and the support pin 442a extends from the support plate 442 such that the substrate W is spaced apart from the support plate 442 by a predetermined distance. A chuck pin 442b is provided at the edge of the support plate 442. The chuck pin 442b protrudes upward from the support plate 442 and supports one side of the substrate W such that the substrate W is stably held by the support unit 440 when the substrate W rotates. The drive shaft 444 is driven by a driver 446, connected to the center of the bottom surface of the substrate W, and rotates the support plate 442 based on its central axis.

[0116] According to the embodiment, the liquid supply unit 460 may include nozzles 462. Nozzles 462 supply a processing fluid to the substrate W. The processing fluid may be a chemical, a rinsing solution, or an organic solvent. The chemical may be a chemical with strong acid or strong base properties. Furthermore, the rinsing solution may be deionized water. Furthermore, the organic solvent may be isopropanol (IPA). In addition, the liquid supply unit 460 may include multiple nozzles 462, and each nozzle 462 may supply a different type of processing fluid. For example, one nozzle 462 may supply a chemical, another nozzle 462 may supply a rinsing solution, and yet another nozzle 462 may supply an organic solvent. Furthermore, the controller 30 may control the liquid supply unit 460 to supply an organic solvent to the substrate W from yet another nozzle 462 after supplying a rinsing solution from another nozzle 462. Therefore, the rinsing solution supplied to the substrate W can be replaced with an organic solvent with low surface tension.

[0117] The lifting / lowering unit 480 moves the cup 420 in the up / down direction. The relative height between the cup 420 and the substrate W changes by the up / down movement of the cup 420. As a result, the recollection containers 422, 424, 426 for recollecting the processed fluid change according to the type of liquid supplied to the substrate W, so that the liquid can be recollected separately. Unlike the above description, the cup 420 is fixedly mounted, and the lifting / lowering unit 480 can move the support unit 440 in the up / down direction.

[0118] Figure 5 schematic diagram Figure 3 Implementation plan for the drying chamber.

[0119] refer to Figure 5 According to an embodiment of the present invention, the drying chamber 500 can remove processing fluid remaining on the substrate W by using a drying fluid in a supercritical state. For example, the drying chamber 500 can perform a drying process using supercritical carbon dioxide (CO2) to remove organic solvents remaining on the substrate W.

[0120] The drying chamber 500 may include a chamber body 510 (exemplarily a first body), a clamping body 520 (exemplarily a second body), a fluid supply unit 530, a fluid discharge line 540, a support member 550, a first moving unit 560, a second moving unit 570, and an anti-friction member 580. The chamber body 510 and the clamping body 520 may be collectively referred to as the body.

[0121] The chamber body 510 may include a top body 512 (another example of a first body) and a bottom body 514 (another example of a second body). The top body 512 and the bottom body 514 may be combined with each other to form a processing space 511. Either the top body 512 or the bottom body 514 may be configured to be movable relative to the other. For example, either the top body 512 or the bottom body 514 may be movable by a first moving unit 560. The first moving unit 560 may include a lift / lower actuator 562 and a lift / lower plate 564. A plurality of lift / lower actuators 562 may be provided and connected to the lift / lower plate 564. The lift / lower plate 564 may be coupled to the bottom body 514. When the lift / lower actuators 562 lift and lower the lift / lower plate 564, the bottom body 514 may also be lifted and lowered together with the lift / lower plate 564. A heater for heating the dry fluid supplied to the processing space 511 may be embedded in the chamber body 510. Furthermore, when the top body 512 and the bottom body 514 are in the closed position, a groove can be formed at the bottom body 514 to increase the airtightness of the processing space 511, and an O-ring 516, which serves as a sealing member, can be inserted into the groove.

[0122] The position of the top body 512 can be fixed, and the bottom body 514 can be raised and lowered in the third direction Z by the first moving unit 560. In the following text, the position where the bottom body 514 rises and contacts the top body 512 to form a processing space 511 is called the closed position, and the position where the bottom body 514 falls and is spaced apart from the top body 512 is called the open position.

[0123] The clamping body 520 may include a first clamping body 522 and a second clamping body 524. The first clamping body 522 and the second clamping body 524 can clamp the chamber body 510 in a relative position. The inner surfaces of the first clamping body 522 and the second clamping body 524 may have a shape substantially corresponding to the outer surface of the chamber body 510 in the closed position. The first clamping body 522 and the second clamping body 524 can be moved by a second moving unit 570. A plurality of second moving units 570 may be provided. Any one of the second moving units 570 may be connected to the top body 512 and the first clamping body 522, while another of the second moving units 570 may be connected to the top body 512 and the second clamping body 524.

[0124] The second moving unit 570 may include a first body 572 coupled to the top body 512, a second body 574 coupled to the clamping body 520 and moving along the moving track 578, and a third body 576 coupled to the fixed outer wall B. The second body 574 can move in the first direction X while moving the clamping body 520 in the direction toward the chamber body 510.

[0125] The fluid supply unit 530 can supply dry fluid to the processing space 511. The dry fluid supplied by the fluid supply unit 530 may include carbon dioxide (CO2). The fluid supply unit 530 may include a fluid supply source 531, a first supply line 533, a first supply valve 535, a second supply line 537, and a second supply valve 539.

[0126] Fluid supply source 531 can store and / or supply the dry fluid supplied to processing space 511. Fluid supply source 531 can supply the dry fluid to first supply line 533 and / or second supply line 537. For example, a first supply valve 535 can be installed at the first supply line 533. In addition, the first supply line 533 can be connected to a first supply channel 512a formed in the top body 512. In addition, a second supply valve 539 can be installed at the second supply line 537. In addition, the second supply line 537 can be connected to a second supply channel 514a formed in the bottom body 514. The first supply valve 535 and the second supply valve 539 can be on / off valves. Depending on the opening / closing of the first supply valve 535 and the second supply valve 539, the dry fluid can selectively flow in the first supply line 533 or the second supply line 537.

[0127] In the above example, the first supply line 533 and the second supply line 537 are connected to a fluid supply source 531, but are not limited thereto. For example, multiple fluid supply sources 531 may be provided, the first supply line 533 may be connected to any one of the multiple fluid supply sources 531, and the second supply line 537 may be connected to another fluid supply source 531.

[0128] Furthermore, the first supply line 533 may be a top supply line supplying dry gas above the processing space 511. For example, the first supply line 533 may supply dry gas to the processing space 511 in a downward direction. Furthermore, the second supply line 537 may be a bottom supply line supplying dry gas below the processing space 511. For example, the second supply line 537 may supply dry gas to the processing space 511 in a downward direction.

[0129] The fluid discharge line 540 can discharge dried fluid from the processing space 511. The fluid discharge line 540 can be connected to a pressure-reducing member (not shown) that provides pressure reduction for the processing space. Furthermore, the fluid discharge line 540 can be connected to a discharge channel 514b formed in the bottom body 514. The pressure-reducing member can be a pump. However, the invention concept is not limited thereto, and the pressure-reducing member can be modified in various ways to utilize known devices capable of providing pressure reduction for the processing space.

[0130] The support member 550 can support the substrate W in the processing space 511. The support member 550 can support the edge region of the substrate W in the processing space 511. The support member 550 can support the bottom surface of the edge region of the substrate W. The support member 550 can be installed at the top body 512.

[0131] An anti-friction member 580 may be mounted on the clamping body 520. The anti-friction member 580 may be mounted on the inner surface of the clamping body 520. The anti-friction member 580 may be mounted in a region where the clamping body 520 and the chamber body 510 can contact each other, i.e., as mating surfaces. The anti-friction member 580 may be referred to as an anti-friction film. Multiple anti-friction members 580 may be provided. Some of the anti-friction members 580 may be mounted on the bottom portion of the inner surface of the clamping body 520, while others may be mounted on the top portion of the inner surface of the clamping body 520.

[0132] Anti-friction members 580 can be installed at each of the first clamping body 522 and the second clamping body 524. Two anti-friction members 580 can be installed at the bottom portion of the inner surface of the first clamping body 522, and two anti-friction members 580 can be installed at the top portion of the inner surface of the first clamping body 522. Similarly, two anti-friction members 580 can be installed at the bottom portion of the inner surface of the second clamping body 524, and two anti-friction members 580 can be installed at the top portion of the inner surface of the second clamping body 524. That is, the anti-friction members 580 can be installed at eight points. The installation positions and specific shapes of the anti-friction members 580 will be described later.

[0133] Figure 6 Illustration Figure 5 The top and bottom main bodies are positioned in a closed position, while Figure 7 Illustration Figure 5 The first clamping body and the second clamping body are positioned according to the clamping position.

[0134] refer to Figure 6 and Figure 7 When the drying process of substrate W begins, for example, a high-pressure drying process using supercritical drying fluid to dry substrate W, the first moving unit 560 can move either the top body 512 or the bottom body 514 from an open position spaced apart from each other to a closed position (see...). Figure 6 Subsequently, in order to limit the movement of the top body 512 and the bottom body 514 during the high-pressure drying process, the first clamping body 522 and the second clamping body 524 can be released from the release position that releases the movement restriction of the top body 512 and the bottom body 514 (see...). Figure 7 Move to a clamping position that restricts the movement of the top body 512 and the bottom body 514.

[0135] Figure 8A For illustration Figure 5 A three-dimensional diagram of any one of the clamping entities. Figure 8B For illustration Figure 5 The three-dimensional view of the other clamping bodies, and Figure 9 for Figure 5 An enlarged view of the main chamber body and a portion of the clamping body.

[0136] refer to Figure 8A , Figure 8B ,and Figure 9 When the top body 512 and the bottom body 514 are in a closed position with close contact with each other, the outer surface of the chamber body 510 may have a shape corresponding to the inner surface of the clamping body 520. For example, when the top body 512 and the bottom body 514 are in the closed position, a portion of the outer surface of the chamber body 510 may be clamped by the inner surface of the first clamping body 522, while another portion of the outer surface of the chamber body 520 may be clamped by the inner surface of the second clamping body 524.

[0137] The anti-friction member 580 can be mounted on the inner surface of the first clamping body 522. The anti-friction member 580 can be mounted on the inner surface of the second clamping body 524. The anti-friction member 580 can be attached to the inner surfaces of the first clamping body 522 and the second clamping body 524 by an adhesive or similar means. However, the invention is not limited thereto, and the anti-friction member 580 can also be coupled and mounted on the inner surface of the clamping body 520 by a coupling device such as bolts / screws.

[0138] Multiple anti-friction members 580 may be mounted on the inner surface of the first clamping body 522. The anti-friction members 580 mounted on the inner surface of the first clamping body 522 may be spaced apart from each other. When the first clamping body 522 is in the clamping position, pressure may be applied to the anti-friction members 580, and even when pressure is applied to the anti-friction members 580, the spaces between the anti-friction members 580 may be spaced apart without overlapping. Furthermore, multiple anti-friction members 580 (e.g., two anti-friction members 580) may be mounted on the bottom portion of the inner surface of the first clamping body 522, spaced apart from each other. Additionally, multiple anti-friction members 580 (e.g., two anti-friction members 850) may be mounted on the top portion of the inner surface of the first clamping body 522, spaced apart from each other. When viewed from above, the anti-friction members 580 may be mounted to be spaced apart from each other in the circumferential direction. For example, when viewed from above, two anti-friction members 580 located at the top portion of the inner surface of the first clamping body 522 can be installed spaced apart from each other in a circumferential direction. Furthermore, when viewed from above, two anti-friction members 580 located at the bottom portion of the inner surface of the first clamping body 522 can be spaced apart from each other in a circumferential direction. The arrangement of the anti-friction members 580 installed on the second clamping body 524 is symmetrical to the arrangement of the anti-friction members 580 installed on the first clamping body 522, therefore, a repeated description thereof will be omitted.

[0139] Furthermore, the inner surfaces of the first clamping body 522 and the second clamping body 524 may each include a first surface 520a, second surfaces 520b and 520c, and a third surface 520d. The first surface 520a may be a surface parallel to the ground. The second surfaces 520b and 520c may be surfaces extending from the first surface 520a. The second surfaces 520b and 520c may extend in a direction intersecting the extending direction of the first surface 520a. For example, the second surfaces 520b and 520c may extend in a direction perpendicular to the extending direction of the first surface 520a. The third surface 520d may be a surface extending from the first surface 520a and the second surface 520c. The third surface 520d may extend in a direction perpendicular to the extending direction of the first surface 520a and in a direction perpendicular to the extending direction of the second surface 520c.

[0140] The anti-friction member 580 may be configured to continuously cover at least two surfaces of the inner surface of the clamping body 520. For example, the anti-friction member 580 may include a first portion 581, second portions 582 and 583, and a third portion 584. The first portion 581 may be configured to cover a first surface 520a of the clamping body 520. When viewed from above, the first portion 581 may have an arcuate shape.

[0141] Second portions 582 and 583 may extend from the first portion 581. Second portions 582 and 583 may extend in a direction intersecting the extending direction of the first portion 581. For example, second portions 582 and 583 may extend in a direction perpendicular to the extending direction of the first portion 581. Second portions 582 and 583 may be configured to cover the second surfaces 520b and 520c. A portion of the second portions 582 and 583 may extend upwards, while another portion of the second portions 582 and 583 may extend downwards. Furthermore, a plurality of second portions 582 and 583 may be provided, and the second portions 582 and 583 may be spaced apart from each other. The spacing between the second portions 582 and 583 may be from about 15 mm to about 20 mm. Furthermore, the anti-friction member 580 may further include a third portion 584 configured to cover the third surface 520d. The third portion 584 may extend from the first portion 581.

[0142] Furthermore, the first portion 581, the second portions 582 and 583, and the third portion 584 of the anti-friction member 580 can be provided as a single unit. That is, the anti-friction member 580 can have a monolithic shape, wherein the several films are integrally processed so that the first portion 581, the second portion 582, and the third portion 584 have a single body, rather than being individually attached to the inner surface of the clamping body 520. This is because when several films are overlapped to form the anti-friction member 580 having the first portion 581, the second portion 582 and 583, and the third portion 584, the anti-friction member 580 is highly susceptible to damage from vibrations caused by the pressure of the processing space 511.

[0143] The anti-friction member 580 of this application is provided as a three-dimensional thin-film structure, rather than simply attached to a plane. Furthermore, the anti-friction member 580 is installed to withstand vertical, horizontal, and forward / backward forces transmitted by the chamber body 510.

[0144] Specifically, such as Figure 10 As shown, the chamber body 510 can transmit vibrations V1 that jitter in the vertical direction (e.g., the third direction Z) to the clamping body 520. In this case, even if the vibrations V1 that jitter in the third direction Z are transmitted to the clamping body 520, the force received by the first portion 581 of the anti-friction member 580 is transmitted in the direction toward the first surface 520a of the clamping body 520, and therefore almost no deformation or pushing occurs at the anti-friction member 580.

[0145] In addition, such as Figure 11 As shown, the chamber body 510 can transmit vibration V2 in the front-to-back direction (e.g., the first direction X) to the clamping body 520. In this case, even if the vibration V2 in the first direction X is transmitted to the anti-friction member 580, it is possible to limit the occurrence of the pushing phenomenon by the third part 584 and the second part 583.

[0146] In addition, such as Figure 12 As shown, the chamber body 510 can transmit rotational vibration V3, which recurs in the third direction Z, to the clamping body 520. In this case, even if the rotational vibration V3, which recurs in the third direction Z, is transmitted to the anti-friction member 580, the occurrence of the pushing phenomenon can be limited by the third part 584 of the anti-friction member 580.

[0147] The vibrations described above are merely examples, and various other types of vibrations can be transmitted to the anti-friction member 580. Because the anti-friction member 580 has a point of inflection where it bends, the anti-friction member 580 according to the embodiment of the present invention has supporting forces in all directions and is therefore less prone to deformation or displacement. That is, while the anti-friction member 580, having a planar structure, was previously prone to deformation or displacement due to vibration, the anti-friction member 580 according to the embodiment of the present invention has a three-dimensional structure, thereby minimizing these problems.

[0148] In the above example, the anti-friction member 580 has a first portion 581, second portions 582 and 583, and a third portion 584, but is not limited thereto. For example, such as Figure 13 As shown, the anti-friction member 580 can be configured to cover only the first surface 520a.

[0149] In the above example, the second parts 582 and 583 extend from the first part 581 in the upper / lower direction, but are not limited thereto. For example, such as Figure 14 and Figure 15 As shown, the second portions 582 and 583 may extend from the first portion 581 in the upward and downward directions, and may extend in the inclined direction.

[0150] In the above example, as an example, the anti-friction member 580 is mounted on the inner surface of the clamping body 520, but it is not limited to this. For example, such as Figure 16 As shown, the anti-friction member 580a can be mounted on the mating surface of the top body 512 or the bottom body 514. For example, the anti-friction member 580a can be mounted on the mating surface of the bottom body 514 and can be configured to continuously cover the first surface 510a and the second surface 510b of the bottom body 514. For example, the anti-friction member 580a may include a first portion 581a covering the first surface 510a and a second portion 582b covering the second surface 510b. Furthermore, the anti-friction member 580a can be mounted on the outside of the sealing member 516. This is to minimize the inflow of particles generated by friction from the anti-friction member 580a into the processing space 511.

[0151] Figure 17 The diagram schematically illustrates a drying chamber according to another embodiment of the concept of the present invention. A drying chamber 600 for drying a substrate W using supercritical fluid may include a base body 612 and a door body 614. The base body 612 and the door body 614 may be combined with each other to form a processing space 611. The base body 612 may have a cylindrical shape with an open side, and the door body 614 may be movable in the lateral direction to selectively open and close the processing space 611. A support frame 616 supporting the substrate W may be coupled to the door body 614.

[0152] A first supply line 633 for supplying drying fluid G can supply drying fluid G to one side of the substrate W supported by the support frame 616. A second supply line 637 for supplying drying fluid can supply drying fluid downward from the support frame 616.

[0153] The discharge line 651 for discharging the dried fluid G can discharge the processing space 611 in a downward direction.

[0154] The anti-friction member 580b may be attached to the door body 614. The anti-friction member 580b may include a first portion 581b covering a first surface of the door body 614 facing the base body 612, and a second portion 582b covering a second surface of the door body 614 that is not parallel to the first surface. When viewed in cross-section, the anti-friction member 580b may typically have an "L" shape or an inverted "L" shape. In some cases, such as... Figure 18 As shown, the anti-friction member 580c may have a rotating "U" shape.

[0155] Figure 19 A drying chamber according to another embodiment of the concept of the present invention is schematically illustrated. A drying chamber 700 for drying a supercritical fluid drying substrate W may include a base body 712 and a door body 714. The base body 712 and the door body 714 may be combined with each other to form a processing space. The base body 712 may have a cylindrical shape with an open side, and the door body 714 may be movable in the lateral direction to selectively open and close the processing space. A support frame 716 supporting the substrate W may be coupled to the door body 714.

[0156] The drying fluid G supplied by the supply line 733 can flow along the fluid channel of the drying fluid G formed by the support frame 716 and the base body 712. The fluid channel of the drying fluid G can be formed to flow along the top surface of the substrate W.

[0157] The discharge line 761 that discharges the dry fluid G can discharge the processing space 611 in an upward direction.

[0158] The anti-friction member 580d may be attached to the door body 714. The anti-friction member 580d may include a first portion covering a first surface of the door body 714 facing the base body 712; and a second portion covering a second surface of the door body 714 that is not parallel to the first surface. When viewed in cross-section, the anti-friction member 580d may typically have an "L" shape and an inverted "L" shape.

[0159] Figure 20 A drying chamber according to another embodiment of the present invention is schematically illustrated. A drying chamber 800 for drying a substrate W using supercritical fluid may include a body 810 and a lifting / lowering member 820. The body 810 may include a top body 812 and a bottom body 814. The top body 812 and the bottom body 814 may be combined with each other to form a processing space for processing the substrate W. Furthermore, the drying chamber 800 may include a support member 830 for supporting the substrate W in the processing space. Additionally, the drying chamber 800 may further include a sealing member 816 capable of maintaining the airtightness of the processing space formed by the top body 812 and the bottom body 814.

[0160] Furthermore, a top channel 812a for supplying the drying fluid G can be formed at the top body 812. Additionally, a bottom channel 814b capable of supplying and discharging the drying fluid G can be formed at the bottom body 814. The bottom channel 814b can be in fluid communication with the supply channel 814a for supplying the drying fluid G and the discharge channel 814c for discharging the drying fluid G.

[0161] An anti-friction member 580e may be provided at the mating surfaces where the top body 812 and the bottom body 814 contact. The anti-friction member 580e may be mounted on the bottom body 814. The anti-friction member 580e may include a first portion covering the surfaces of the top body 812 and the bottom body 814 facing each other; and a second portion covering a second surface perpendicular to the first surface. When viewed in cross-section, the anti-friction member 580e may generally have an inverted "L" shape.

[0162] Figure 21 A drying chamber according to another embodiment of the concept of the present invention is schematically illustrated. A drying chamber 900 for drying a substrate W using a supercritical fluid may include a chamber body 910 and a clamping body 920. The chamber body 910 may include a first chamber body 912 and a second chamber body 914. The second chamber body 914 may be provided to be movable relative to the first chamber body 912. The two bodies may be combined with each other to form a processing space in which the substrate is processed by the drying fluid. Furthermore, when the substrate is processed by the drying fluid in a supercritical state, the closed position of the first chamber body 912 and the second chamber body 914 may be released by pressure.

[0163] Therefore, when the substrate is processed in the drying chamber 900, the clamping body 920 can clamp the chamber body 910.

[0164] The clamping body 920 may include a first clamping body 922 and a second clamping body 924. Protrusions 922a and 922b of the first clamping body 922 can be inserted into grooves 9122 formed in the first chamber body 912 and grooves 9142 formed in the second chamber body 914, respectively. Similarly, protrusions 924a and 924b of the second clamping body 924 can be inserted into grooves 9124 and 9144 formed in the second chamber body 914, respectively.

[0165] Furthermore, the anti-friction member 580f can be mounted on the mating surface where the clamping body 920 and the chamber body 910 engage. For example, the anti-friction member 580f can be configured to cover the protrusions 922a, 922b, 924a, and 924b of the clamping body 920. Additionally, the anti-friction member 580f can be configured to cover at least two surfaces of each of the protrusions 922a, 922b, 924a, and 924b.

[0166] Figure 22 The diagram shows the installation location. Figure 17 Another embodiment of the anti-friction member 580g in the drying chamber 600 shown. Multiple anti-friction members 580g may be provided. The anti-friction members 580g may be mounted on the mating surfaces where the base body 612 and the door body 614 engage with each other. Specifically, multiple anti-friction members 580g may be mounted on the mating surface of the door body 614, spaced apart from each other. Furthermore, as described above, the door body 614 is designed to be movable relative to the base body 612 via a moving unit. When the door body 614 is in a closed position defining the processing space, the space between the anti-friction members 580g may also be a space that allows an anti-friction member 580g to be spaced apart from another adjacent anti-friction member 580g.

[0167] The effects of the present invention are not limited to those described above. Those skilled in the art will clearly understand any effects not mentioned from this specification and the accompanying drawings.

[0168] Although preferred embodiments of the present invention have been described and illustrated to date, the present invention is not limited to the specific embodiments described above. It should be noted that those skilled in the art can implement the present invention in various ways without departing from the essence of the inventive concept claimed in the claims, and these modifications should not be interpreted separately from the technical spirit or prospects of the present invention.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: main body; A fluid supply unit, wherein the fluid supply unit is used to supply processing fluid to the processing space within the main body; and A fluid discharge line for discharging the processed fluid from the processed space. The main body comprises: The first main body is a chamber body that defines the processing space; A second body, which is movable relative to the first body and serves as a clamping body for clamping the chamber body; and An anti-friction member is provided to prevent friction between the first body and the second body. The anti-friction member is configured to continuously cover at least two surfaces of the first body and the second body. The surfaces of the first body and the second body include: First surface; and The second surface extends from the first surface, and The anti-friction component includes: The first part is configured to cover the first surface; and The second part is configured to extend in a direction intersecting the direction extending from the first part and is configured to cover the second surface.

2. The substrate processing apparatus of claim 1, wherein the second portion is provided in multiple portions.

3. The substrate processing apparatus of claim 2, wherein some of the second portions extend upward from the first portion, while the other second portions extend downward.

4. The substrate processing apparatus of claim 3, wherein some of the second portions extend from the first portion in an upward and inclined direction, while the other second portions extend in a downward and inclined direction.

5. The substrate processing apparatus according to claim 1, wherein the anti-friction member has an integral form in which the first portion and the second portion are integrally formed.

6. The substrate processing apparatus according to claim 2, wherein the second portions are spaced apart from each other and the space is 15 mm to 20 mm.

7. The substrate processing apparatus of claim 1, wherein the surfaces of the first body and the second body include a third surface extending from the first surface and the second surface, and the anti-friction member further includes a third portion extending from the first portion.

8. The substrate processing apparatus according to any one of claims 1 to 7, wherein either the first body or the second body is movable in the lateral direction.

9. A substrate processing apparatus, the substrate processing apparatus comprising: A chamber body defining a processing space for processing a substrate, the chamber body including a first chamber body and a second chamber body that is movable relative to the first chamber body; The clamping body is used to clamp the first chamber body and the second chamber body when they are in close contact in the closed position. An anti-friction component is provided to prevent friction between the clamping body and the chamber body. The surface of either the clamping body or the chamber body includes: First surface; A second surface, the second surface extending from the first surface; and A third surface, extending from the first surface and the second surface, and The anti-friction component includes: The first part is configured to cover the first surface; The second part extends in a direction intersecting the direction extending from the first part and is configured to cover the second surface; and The third part extends from the first part.

10. The substrate processing apparatus of claim 9, wherein the anti-friction members are provided in a plurality and spaced apart from each other.

11. The substrate processing apparatus of claim 10, wherein, when viewed from above, some of the anti-friction members are arranged in a circumferential direction and spaced apart from each other.

12. The substrate processing apparatus according to any one of claims 9 to 11, wherein the anti-friction member is a polyimide film.

13. A substrate processing apparatus for processing a substrate using a processing fluid in a supercritical state, the substrate processing apparatus comprising: main body; A fluid supply unit, wherein the fluid supply unit is used to supply the processing fluid to the processing space within the main body; and A fluid discharge line for discharging the processed fluid from the processed space. The main body comprises: A chamber body defining a processing space for processing the substrate, the chamber body including a first chamber body and a second chamber body that is movable relative to the first chamber body; A clamping body, wherein if the first chamber body and the second chamber body are in close contact in the closed position, the clamping body is used to clamp the first chamber body and the second chamber body; and An anti-friction member is provided to prevent friction between the clamping body and the chamber body. The anti-friction member is mounted on the clamping body and configured to continuously cover at least two surfaces of the clamping body. The surface of the clamping body comprises: A first surface, which is parallel to the ground; A second surface, which extends intersectingly with respect to the first surface; and A third surface, extending intersecting with the first and second surfaces, wherein the first clamping body and the second clamping body face each other. The anti-friction member comprises: The first part is configured to cover the first surface; The second portion extends from the first portion and is configured to cover the second surface; and The third part extends from the first part and is configured to cover the third surface.

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