Electronic package and method of making the same

Abstract

The present invention relates to an electronic package and a method for manufacturing the same, comprising the steps of placing a carrier structure provided with electronic components on an antenna structure, wherein a step is formed at the edge of the antenna structure, so that a shielding body is arranged along the surface of the step, so that the shielding body only covers a part of the surface of the antenna structure, avoiding interference of the shielding body with the operation of the antenna structure.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging process, and more particularly to an electronic package with a shielding mechanism and its manufacturing method. Background Technology

[0002] With the evolution of semiconductor technology, semiconductor products have been developed in different packaging forms. In order to improve electrical quality, many semiconductor products (such as radio frequency modules) have shielding functions to prevent electromagnetic interference (EMI).

[0003] like Figure 1A and Figure 1B As shown, the existing radio frequency module 1 includes electrically connecting multiple radio frequency chips 11 to a packaging substrate 10 having an antenna layer 12, and then covering each radio frequency chip 11 with an encapsulating colloid 13. A metal shielding layer 14 is formed on the top surface 13a and side surface 13c of the encapsulating colloid 13 and the side surface 10c of the packaging substrate 10, so as to protect the radio frequency chips 11 from external EMI through the metal shielding layer 14.

[0004] However, in the existing RF module 1, since the metal shielding layer 14 covers the side 10c of the package substrate 10, the metal shielding layer 14 shields the antenna layer 12, causing the antenna function of the antenna layer 12 to fail to operate effectively.

[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Summary of the Invention

[0006] In view of the various defects of the prior art, the present invention provides an electronic package and its manufacturing method, which can avoid the interference of the shielding body with the operation of the antenna structure.

[0007] The electronic package of the present invention includes: a carrier structure; an electronic component disposed on the carrier structure; an antenna structure attached to the carrier structure, wherein a stepped portion is formed at the edge of the antenna structure; and a shielding body disposed along the surface of the stepped portion.

[0008] The present invention also provides a method for manufacturing an electronic package, comprising: providing at least one package module, which includes a carrier structure and electronic components disposed on the carrier structure; and attaching an antenna structure to the carrier structure, wherein a stepped portion is formed at the edge of the antenna structure, wherein a shielding body is disposed on the surface of the stepped portion.

[0009] In the aforementioned electronic package and its manufacturing method, the carrier structure is connected to the antenna structure via multiple conductive elements.

[0010] In the aforementioned electronic package and its manufacturing method, the antenna structure has opposing first and second surfaces and a side surface adjacent to the first and second surfaces, and the antenna structure is attached to the carrier structure with its first surface. For example, the stepped portion is formed at the junction of the first surface and the side surface. Alternatively, the stepped portion is formed at the junction of the second surface and the side surface.

[0011] The aforementioned electronic package and its manufacturing method further include covering the electronic component with a packaging layer. Furthermore, a shielding layer is formed on the packaging layer.

[0012] In the aforementioned electronic packaging components and their manufacturing methods, the shielding body is a metal layer.

[0013] As can be seen from the above, in the electronic package and manufacturing method of the present invention, a stepped portion is mainly formed at the edge of the antenna structure, so that the shielding body only covers a local surface of the antenna structure to avoid the shielding body interfering with the operation of the antenna structure. Therefore, compared with the prior art, the electronic package of the present invention can effectively operate the antenna function of the antenna structure. Attached Figure Description

[0014] Figure 1A This is a cross-sectional schematic diagram of an existing radio frequency module.

[0015] Figure 1B This is a 3D schematic diagram of an existing radio frequency module.

[0016] Figures 2A to 2F This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package of the present invention.

[0017] Figure 2F-1 and Figure 2F-2 for Figure 2F Cross-sectional schematic diagram of other embodiments.

[0018] Figures 3A to 3C for Figures 2D to 2F A cross-sectional schematic diagram of another manufacturing method.

[0019] Figures 4A to 4D for Figure 2D The diagram shows a cross-sectional view illustrating the fabrication process of the antenna module.

[0020] Figure 5A , Figure 5B and Figure 5C This is a cross-sectional schematic diagram of another embodiment of the electronic package of the present invention.

[0021] Explanation of reference numerals in the attached figures

[0022] 1: Radio Frequency Module

[0023] 10: Packaging substrate

[0024] 10c, 13c, 20c, 25c: Side view

[0025] 11: Radio Frequency Chip

[0026] 12: Antenna layer

[0027] 13: Encapsulating colloid

[0028] 13a: Top surface

[0029] 14: Metal shielding layer

[0030] 2,3: Electronic packages

[0031] 2a, 5a, 5b: Encapsulation modules

[0032] 2b: Antenna Module

[0033] 20, 50: Load-bearing structure

[0034] 20a: First side

[0035] 20b: Second side

[0036] 200: Line Layer

[0037] 201: Insulating materials

[0038] 21: Electronic Components

[0039] 21a, 22a: Surface

[0040] 22, 29, 52: Encapsulation layer

[0041] 23: Conductive elements

[0042] 24: Shielding layer

[0043] 25: Antenna Structure

[0044] 25a: First surface

[0045] 25b: Second surface

[0046] 250,350,450: concave part

[0047] 251, 351: Stepped section

[0048] 252: Antenna Main Layer

[0049] 253:Contact

[0050] 26: Shielding

[0051] 27: Connector

[0052] 28: Base rubber

[0053] 40: Circuit Structure

[0054] 41: Barrier layer

[0055] 53: Conductive column

[0056] 8: Full-page encapsulation

[0057] D,H1,H2: Length

[0058] g: signal

[0059] L,S: Cutting path. Detailed Implementation

[0060] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0061] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0062] Figures 2A to 2F The figure is a cross-sectional schematic diagram of the manufacturing method of the electronic package 2 of the present invention.

[0063] like Figure 2A As shown, a full-page package 8 is provided, which includes multiple package modules 2a. Each package module 2a includes a carrier structure 20, multiple electronic components 21 disposed on the carrier structure 20, and a package layer 22 disposed on the carrier structure 20 to cover the electronic components 21.

[0064] The carrier structure 20 is, for example, a packaging substrate with a core layer and a circuit structure or a coreless circuit structure, which forms multiple circuit layers 200 on the insulating material 201, such as a fan-out type redistribution layer (RDL).

[0065] In this embodiment, the bearing structure 20 has a first side 20a and a second side 20b, and the material forming the circuit layer 200 is copper, while the insulating material 201 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder resist such as green paint or ink.

[0066] The electronic component 21 is disposed on the first side 20a of the support structure 20, and the electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0067] In this embodiment, the electronic component 21 can be electrically connected to the circuit layer 200 of the carrier structure 20 via flip-chip bonding, wire bonding, direct contact with the circuit layer 200, or other suitable methods, without any particular limitation.

[0068] The encapsulation layer 22 is disposed on the first side 20a of the support structure 20 to cover the electronic component 21.

[0069] In this embodiment, the encapsulation layer 22 is an insulating material, such as polyimide (PI), dry film, encapsulation colloid or molding compound such as epoxy resin, but is not limited to the above.

[0070] Furthermore, a leveling process can be used to expose the surface 21a of at least one electronic component 21 to the surface 22a of the encapsulation layer 22, so that the surface 22a of the encapsulation layer 22 is flush with the surface 21a of the electronic component 21. For example, the leveling process can be performed by grinding to remove part of the material of the electronic component 21 and part of the material of the encapsulation layer 22.

[0071] like Figure 2B As shown, a plurality of conductive elements 23 are formed on the second side 20b of the supporting structure 20, and then along the... Figure 2A The cutting path L shown is used to cut the entire package 8 into individual packages to obtain multiple separate package modules 2a.

[0072] In this embodiment, the conductive element 23 is a spherical shape such as a solder ball, or a columnar shape such as a copper pillar, solder bump, or a stud conductor made by a wire bonding machine, but is not limited to these.

[0073] like Figure 2C As shown, a shielding layer 24 is formed on the outer surface of each of the encapsulation modules 2a, and the shielding layer 24 does not contact the conductive element 23.

[0074] In this embodiment, the shielding layer 24 is formed on the encapsulation layer 22 and extends to the side 20c of the support structure 20, but the shielding layer 24 is not formed on the second side 20b of the support structure 20.

[0075] Furthermore, a shielding layer 24, similar to a metal layer, can be made by sputtering, vapor deposition, electroplating, chemical plating, or film lamination, but is not limited to the above methods.

[0076] like Figure 2D As shown, a full-area antenna module 2b is provided, which includes a plurality of antenna structures 25, and at least one recess 250 is formed at the junction between two antenna structures 25, and a shielding body 26, like a metal layer, is formed along the surface of the recess 250.

[0077] In this embodiment, the antenna structure 25 is, for example, a substrate with a core layer and a circuit structure or a coreless circuit structure, having opposing first surfaces 25a and second surfaces 25b. For example, the antenna structure 25 is an antenna substrate, on which at least one antenna main layer 252 is formed on the internal dielectric material, and a plurality of contacts 253 are formed on the first surface 25a of the antenna structure 25, and the second surface 25b serves as the transmitting / receiving surface of the antenna main layer 252.

[0078] Furthermore, the recess 250 may be formed at the junction between the first surfaces 25a of the two antenna structures 25; or, as... Figure 3A As shown, the recess 350 can be formed at the junction between the second surfaces 25b of the two antenna structures 25.

[0079] In addition, the manufacturing process of the antenna module 2b is as follows: Figures 4A to 4D As shown. Figure 4A As shown, a full-page circuit structure 40 including multiple antenna structures 25 is provided. Next, as... Figure 4B As shown, a resistive layer 41 is formed on the circuit structure 40, and a recess 450 extending into the circuit structure 40 is formed on the resistive layer 41. Then, as... Figure 4C As shown, a shielding body 26, similar to a metal layer, is formed on the resist layer 41 and extends along the surface of the recess 450 by methods such as sputtering, evaporation, electroplating, chemical plating, or film lamination. Finally, as Figure 4D As shown, the blocking layer 41 and the shielding body 26 thereon are removed to retain the shielding body 26 on the recesses 250, 350 of the antenna structure 25.

[0080] In addition, the antenna module 2b may be configured with relevant components, such as connector 27, on the first surface 25a of the antenna structure 25 as required. Therefore, it should be understood that there are many types of antenna modules 2b, and they are not limited to those described above.

[0081] like Figure 2E As shown, the continuation is as follows Figure 2D The process shown involves attaching multiple packaging modules 2a to the contacts 253 on the first surface 25a of the antenna structure 25 of the antenna module 2b via the conductive elements 23, so that the carrier structure 20 is electrically connected to the antenna structure 25 via the conductive elements 23.

[0082] like Figure 2F As shown, along the upper edge of the antenna module 2b... Figure 2E The cutting path S shown (i.e., the location corresponding to the recess 250) is used for a single-piece cutting process to obtain multiple electronic packages 2, and the antenna structure 25 defines a side 25c adjacent to the first surface 25a and the second surface 25b.

[0083] In this embodiment, a stepped portion 251 is formed at the junction of the first surface 25a and the side surface 25c of the antenna structure 25, and the shielding body 26 is arranged along the surface of the stepped portion 251 so that the edge of the antenna structure 25 has a notch-like appearance, such as an L-shape when viewed from the side. This results in the side surface 25c corresponding to the transmitting end (the second surface 25b) of the antenna structure 25 having no shielding mechanism, while the side surface corresponding to the signal transmission line (the contact 253 on the first surface 25a) is equipped with a shielding mechanism. For example, the length H1 of the stepped portion 251 on the side surface 25c is 1 / 3 to 2 / 3 of the length D of the side surface 25c.

[0084] Furthermore, there are many types of this encapsulation module 2a, and there are no particular restrictions. For example... Figure 2F-1 As shown, the encapsulation module 2a may include a base adhesive 28, so that after the encapsulation module 2a is attached to the antenna structure 25 via the conductive elements 23, the base adhesive 28 can be filled into the space between the carrier structure 20 and the antenna structure 25, so that the base adhesive 28 covers the conductive elements 23. The second surface 25b of the antenna structure 25 is the transmitting end, transmitting signal g. Alternatively, as... Figure 2F-2 As shown, after the encapsulation module 2a is attached to the antenna structure 25, the encapsulation layer 29 and the shielding layer 24 are formed, so that the encapsulation layer 22 fills the space between the carrier structure 20 and the antenna structure 25 to cover the conductive elements 23. The second surface 25b of the antenna structure 25 is the transmitting end to transmit signal g.

[0085] Furthermore, if it continues as follows Figure 3A The process shown (i.e., the recess 350 is provided on the second surface 25b of the antenna structure 25) will be along the antenna module 2b as shown in the figure. Figure 3B The cutting path S shown (i.e., the location corresponding to the recess 350) is used for a single-piece cutting process to obtain multiple such... Figure 3CThe electronic package 3 shown has a stepped portion 351 formed at the junction of the second surface 25b and the side surface 25c of its antenna structure 25. The shielding body 26 is arranged along the surface of the stepped portion 351, giving the edge of the second surface 25b of the antenna structure 25 a notch-like appearance. This ensures that the side surface 25c corresponding to the transmitting end (the second surface 25b) of the antenna structure 25 has a shielding mechanism, while the side surface corresponding to the signal transmission line (the contact 253 on the first surface 25a) has no shielding mechanism. For example, the length H2 of the stepped portion 351 on the side surface 25c is 1 / 3 to 2 / 3 of the length D of the side surface 25c. Therefore, the antenna structure 25 can transmit signals from its second surface 25b and a portion of its side surface 25c without being affected by the interference of the shielding body 26 on the transmission direction.

[0086] Therefore, the manufacturing method of the present invention mainly involves forming stepped portions 251, 351 at the edge of the antenna structure 25, so that the shielding body 26 only covers a partial side 25c of the antenna structure 25, so as to avoid the shielding body 26 interfering with the reception and transmission of the antenna main layer 252 of the antenna structure 25. Therefore, compared with the prior art, the electronic package 2, 3 of the present invention can effectively operate the antenna function of the antenna structure 25.

[0087] Furthermore, the antenna structure 25 with this shielding body 26 can be applied in various semiconductor packaging processes. For example, such as Figure 5A As shown, multiple antenna structures 25 with the shield 26 are attached to a support structure 50, such as a circuit board or substrate, via multiple conductive elements 23 through their first surfaces 25a; and at least one electronic component (not shown) may be selectively disposed on the support structure 50. Figure 5B As shown, multiple antenna structures 25 with the shielding body 26 are connected to a carrier structure 50 of a package module 5a having multiple electronic components 21 via multiple conductive elements 23 through their first surfaces 25a; and the electronic components 21 and the antenna structures 25 are respectively located on opposite sides of the carrier structure 50; or, as Figure 5C As shown, multiple antenna structures 25 with the shield 26 are disposed on the first surface 25a of an encapsulation layer 52 of an encapsulation module 5b having multiple electronic components 21. Multiple conductive pillars 53 electrically connected to the carrier structure 50 are embedded in the encapsulation layer 52, so that the conductive pillars 53 are exposed in the encapsulation layer 52, and the antenna structure 25 is electrically coupled to the conductive pillars 53 through multiple conductive components 23, thereby electrically connecting to the carrier structure 50.

[0088] The present invention also provides an electronic package 2,3, which includes: a carrier structure 20,50, at least one electronic component 21, an antenna structure 25, and at least one shield 26.

[0089] The electronic component 21 is disposed on the support structure 20, 50 and electrically connected to the support structure 20, 50.

[0090] The antenna structure 25 is connected to the supporting structure 20, 50, and a stepped portion 251, 351 is formed at the edge of the antenna structure 25.

[0091] The shielding body 26 is only arranged along the surface of the stepped portion 251, 351 and does not cover the entire side 25c of the antenna structure 25.

[0092] In one embodiment, the carrier structure 20, 50 is connected to the antenna structure 25 via a plurality of conductive elements 23.

[0093] In one embodiment, the antenna structure 25 has opposing first surfaces 25a and second surfaces 25b, and a side surface 25c adjacent to the first and second surfaces 25a and 25b, and the antenna structure 25 is connected to the support structure 20, 50 via its first surface 25a. For example, the stepped portion 251 is formed at the junction of the first surface 25a and the side surface 25c. Alternatively, the stepped portion 351 is formed at the junction of the second surface 25b and the side surface 25c.

[0094] In one embodiment, the electronic package 2, 3 further includes a packaging layer 22, 29, 52 covering the electronic component 21. For example, a shielding layer 24 is formed on the packaging layer 22, 29.

[0095] In one embodiment, the shielding body 26 is a metal layer.

[0096] In summary, the electronic package and its manufacturing method of the present invention, through the design of the stepped portion, ensure that the shielding body only covers a partial side of the antenna structure, so as to avoid the shielding body from blocking the antenna structure. Therefore, the electronic package of the present invention can effectively operate the antenna function of the antenna structure.

[0097] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: Load-bearing structure; Electronic components are mounted on the supporting structure; An encapsulation layer that covers the electronic component; An antenna structure is attached to the supporting structure, and a stepped portion is formed at the edge of the antenna structure; as well as The shielding body is only laid out on the surface of the stepped portion at the edge of the antenna structure and is not formed on the encapsulation layer. The carrier structure is connected to the antenna structure on the stepped portion with the shielding body laid out by a plurality of conductive elements. The carrier structure and the plurality of conductive elements are located between the encapsulation layer and the antenna structure. The carrier structure, the electronic components and the encapsulation layer are all located on one side of the plurality of conductive elements, and the antenna structure, the stepped portion and the shielding body are all located on the other side of the plurality of conductive elements.

2. The electronic package as described in claim 1, characterized in that, The antenna structure has a notch-like appearance at its edges.

3. The electronic package as described in claim 1, characterized in that, The antenna structure has opposing first and second surfaces and side surfaces adjacent to the first and second surfaces, and the antenna structure is attached to the carrier structure with its first surface.

4. The electronic package as described in claim 3, characterized in that, The stepped portion is formed at the junction of the first surface and the side surface.

5. The electronic package as described in claim 3, characterized in that, The stepped portion is formed at the junction of the second surface and the side surface.

6. The electronic package as claimed in claim 1, characterized in that, Connectors are disposed on the surface of the antenna structure.

7. The electronic package as claimed in claim 1, characterized in that, A shielding layer is formed on this encapsulation layer.

8. A method for manufacturing an electronic package, characterized in that, include: At least one package module is provided, which includes a carrier structure and electronic components disposed on the carrier structure, and the electronic components are covered by a package layer; as well as An antenna structure is attached to the carrier structure, and a stepped portion is formed at the edge of the antenna structure. A shield is provided on the surface of the stepped portion. The shield is provided only along the surface of the stepped portion at the edge of the antenna structure and is not formed on the encapsulation layer. The carrier structure is connected to the antenna structure with the shield provided on the stepped portion via multiple conductive elements. The carrier structure and the multiple conductive elements are located between the encapsulation layer and the antenna structure. The carrier structure, the electronic components and the encapsulation layer are all located on one side of the multiple conductive elements, and the antenna structure, the stepped portion and the shield are all located on the other side of the multiple conductive elements.

9. The method for manufacturing an electronic package as described in claim 8, characterized in that, The antenna structure has a notch-like appearance at its edges.

10. The method for manufacturing an electronic package as described in claim 8, characterized in that, The antenna structure has opposing first and second surfaces and side surfaces adjacent to the first and second surfaces, and the antenna structure is attached to the carrier structure with its first surface.

11. The method for manufacturing an electronic package as described in claim 10, characterized in that, The stepped portion is formed at the junction of the first surface and the side surface.

12. The method for manufacturing an electronic package as described in claim 10, characterized in that, The stepped portion is formed at the junction of the second surface and the side surface.

13. The method for manufacturing an electronic package as described in claim 8, characterized in that, Connectors are disposed on the surface of the antenna structure.

14. The method for manufacturing an electronic package as described in claim 8, characterized in that, A shielding layer is formed on this encapsulation layer.

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