Wafer-to-wafer bond displacement detection structure and method
By designing bonding structures and electrical detection mechanisms on the wafer, and using resistance changes to determine displacement and alignment, the problem of weld layer alignment during wafer bonding is solved, achieving automated alignment detection and improving the reliability of electrical connections.
CN115692380BActive Publication Date: 2026-05-26THING ELEMENT SEMICON TECH (QINGDAO) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- THING ELEMENT SEMICON TECH (QINGDAO) CO LTD
- Filing Date
- 2022-12-06
- Publication Date
- 2026-05-26
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Figure CN115692380B_ABST
Abstract
This invention provides a wafer-to-wafer bond displacement detection structure and method. At least one set of check bonding structures are fabricated on a first wafer and a second wafer. Each set of bonding structures includes a first bonding block and a second bonding block spaced apart along the same dimension of the wafer. The position of the first bonding block on the first wafer corresponds to the position of the first bonding block on the second wafer, and the first bonding block on the first wafer can cover the first bonding block on the second wafer; the position of the second bonding block on the first wafer corresponds to the position of the second bonding block on the second wafer, and the second bonding block on the first wafer can cover the first bonding block on the second wafer. By detecting a first resistance between the first bonding blocks on the first wafer and the second wafer, and a second resistance between the second bonding blocks, the existence and direction of displacement between the first wafer and the second wafer are determined based on the resistance values of the first and second resistances.
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