Automated external defibrillator

Abstract

An automatic external defibrillator (1) includes a high-voltage generator (3) configured to charge and discharge energy to perform a shock defibrillation on a subject, a housing (100) configured to house the high-voltage generator and define an exterior of the automatic external defibrillator, and a potting material (40) including an insulating material. The high-voltage generator includes a high-voltage circuit board (20) and high-voltage electronic components arranged on the high-voltage circuit board. The potting material covers the high-voltage circuit board and terminals of the high-voltage electronic components, and is in contact with the high-voltage circuit board and the housing to secure the high-voltage circuit board to the housing.

Description

Technical Field

[0001] This disclosure relates to an automated external defibrillator. Background Technology

[0002] Recently, automated external defibrillators (AEDs) have been rapidly gaining popularity. These AEDs deliver a powerful electric shock to the heart of a patient experiencing sudden cardiac arrest due to ventricular fibrillation to defibrillate and restore cardiac function. AEDs have a high-voltage circuit capable of controlling the charging and discharging of electrical energy to deliver an electric shock to the patient for defibrillation (see, for example, JP-A-2008-514329). The high-voltage circuit disclosed in JP-A-2008-514329 is housed within a housing for a high-voltage module. To ensure electrical insulation between the terminals of the electronic components disposed on the high-voltage circuit, the housing containing the high-voltage circuit is filled with a dielectric material such as epoxy resin (potting material). In this way, a high-voltage module with a high-voltage circuit embedded in the dielectric material is manufactured. Summary of the Invention

[0003] The high-voltage module disclosed in JP-A-2008-514329 is housed within the AED's outer casing and secured to the casing by mechanical fastening (such as bolts). Therefore, when a strong impact is applied to the AED from the outside, a large force can be applied to the connection between the high-voltage module and the casing. Furthermore, because a certain gap needs to be maintained between the outer wall of the casing and the high-voltage module, the external dimensions of the AED increase. Therefore, from the perspective of durability and the external dimensions of the AED, there is room for improvement.

[0004] This disclosure aims to improve the durability of AEDs and to miniaturize AEDs.

[0005] According to one or more aspects of this disclosure, an automated external defibrillator (AED) is provided. The AED includes: a high-voltage generator configured to charge and discharge energy to deliver an electric shock to a subject; a housing configured to house the high-voltage generator and define the exterior of the AED; and a potting material comprising an insulating material. The high-voltage generator includes: a high-voltage circuit board; and high-voltage electronic components disposed on the high-voltage circuit board. The potting material covers the terminals of the high-voltage circuit board and the high-voltage electronic components and contacts the high-voltage circuit board and the housing to secure the high-voltage circuit board to the housing. Attached Figure Description

[0006] Figure 1 This is a block diagram illustrating the configuration of an automated external defibrillator (hereinafter abbreviated as AED) according to an embodiment of the present disclosure (hereinafter referred to as the present embodiment).

[0007] Figure 2This is a three-dimensional diagram showing the specific structure of the high-voltage generator.

[0008] Figure 3 This is a view showing a high-voltage generator housed within a housing before the potting material is injected into the housing.

[0009] Figure 4 This is a view showing a high-voltage generator housed within a housing after potting material has been injected into the housing.

[0010] Figure 5 It is along Figure 4 The diagram shows a three-dimensional cross-sectional view of the outer casing and the high-voltage generator taken by line AA. Detailed Implementation

[0011] The embodiments will now be described with reference to the accompanying drawings. For ease of explanation, the dimensions of the various components shown in the drawings may differ from the actual dimensions of the components.

[0012] also, Figure 3 The X-axis, Y-axis, and Z-axis directions shown for AED 1 may be appropriately mentioned in the description of the embodiments. One of the X-axis, Y-axis, and Z-axis directions is perpendicular to the other two X-axis, Y-axis, and Z-axis directions.

[0013] First, the following will refer to Figure 1 The configuration of Automated External Defibrillator 1 (hereinafter referred to as AED 1) is described. Figure 1 This is a block diagram illustrating the structure of AED 1 according to this embodiment. (As shown...) Figure 1 As shown, AED 1 includes an AED controller 2, a high-voltage generator 3, an energy storage unit 4, a power supply 6, a power circuit 5, a storage unit 7, and an external communication unit 8. AED 1 also includes a display unit 9, an operation unit 10, an audio output unit 11, and an ECG processing circuit 12.

[0014] AED 1 is a medical device configured to deliver an electric shock to the heart of a patient experiencing cardiac arrest due to ventricular fibrillation, thereby restoring cardiac function. AED controller 2 is configured to control each component located within AED 1. AED controller 2 may consist, for example, of a microcontroller including a processor and memory, and an integrated circuit such as an ASIC (Application-Specific Integrated Circuit). The processor includes at least one of, for example, a CPU (Central Processing Unit), an MPU (Microprocessor Unit), and a GPU (Graphics Processing Unit). The memory includes ROM (Read-Only Memory) and RAM (Random Access Memory).

[0015] The high-voltage generator 3 is configured to charge the energy storage unit 4 to deliver an electric shock to the patient (subject) for defibrillation and to release the electrical energy stored in the energy storage unit 4. The specific configuration of the voltage generator 3 will be described later. The energy storage unit 4 is configured to store electrical energy for delivering an electric shock to the patient for defibrillation. For example, the energy storage unit 4 may be a high-voltage thin-film capacitor made of a dielectric film.

[0016] Power supply 6 is a battery configured to supply power to the components of AED 1. For example, power supply 6 is a primary lithium battery. Power supply circuit 5 is configured to convert the voltage of power supply 6 to the voltage required by the various components of AED 1. Power supply circuit 5 may be constructed, for example, by a switching regulator or a series regulator. Storage unit 7 is configured to store various programs, audio data, and patient electrocardiogram data used to operate AED 1. Storage unit 7 may be constructed, for example, by flash memory or a hard disk.

[0017] The external communication unit 8 is configured to send various data stored in the storage unit 7 to an external device or receive data from an external device. The external communication unit 8 can be an interface into which a connector for a wired cable, such as a LAN cable, is inserted, or it can be a wireless communication module compatible with wireless communication standards such as Bluetooth (registered trademark) and Wi-Fi (registered trademark). When the external communication unit 8 is a wireless communication module, it can have a transmitting / receiving antenna, high-frequency circuitry, and signal processing circuitry.

[0018] Display unit 9 is configured to display the status of AED 1 and the patient's vital signs (such as electrocardiogram data) to the operator. Display unit 9 may include, for example, an indicator for displaying the status of AED 1, such as the remaining battery power of power source 6; and a liquid crystal display for displaying the patient's electrocardiogram waveform. Operation unit 10 is configured to accept operations from the operator. For example, operation unit 10 may include a power button for activating AED 1 and a shock button for delivering an electric shock to the patient. Audio output unit 11 may be a speaker configured to output voice instructions or warnings related to the operation of AED 1.

[0019] ECG processing circuit 12 is configured to process electrocardiogram (ECG) signals output from two defibrillator pads 13 attached to the patient. For example, ECG processing circuit 12 may have a differential amplifier and an analog-to-digital converter (AD converter). The differential amplifier amplifies the difference between the potential signal output from one defibrillator pad 13 and the potential signal output from the other defibrillator pad 13 to generate ECG data, and the AD converter converts the ECG data into digital data. The defibrillator pads 13 are detachably attached to the AED 1.

[0020] Next, refer to Figure 2 The specific structure of the high-voltage generator 3 according to this embodiment is described. Figure 2 This is a perspective view showing the specific structure of the high-voltage generator 3. (For example...) Figure 2 As shown, the high voltage generator 3 includes a high voltage circuit board 20, high voltage electronic components arranged on the high voltage circuit board 20, a relay circuit board 30, and relay electronic components arranged on the relay circuit board 30.

[0021] The high-voltage circuit board 20 is a circuit board used to generate electrical energy (biphase discharge waveform) to deliver an electric shock to a patient. The high-voltage circuit board 20 has a front side 20a, a back side 20b, and a side side 20c. High-voltage electronic components are arranged on the front side 20a. The back side 20b is located on the side opposite to the front side 20a. The side side 20c is located between the front side 20a and the back side 20b. As examples of high-voltage electronic components arranged on the high-voltage circuit board 20, IGBT (Insulated Gate Bipolar Transistor) control transformers 21 and 29, high-voltage diodes 44, IGBTs 22 and 42, film capacitors 23, coils 24, relays 27, internal discharge resistors 33, and DC-DC transformers 43 are mounted on the high-voltage circuit board 20. In the following description, for ease of description, these electronic components mounted on the high-voltage circuit board 20 will be collectively referred to as "high-voltage electronic components".

[0022] Relay circuit board 30 is a circuit board used to relay signals output from high-voltage circuit board 20 or signals to be input to high-voltage circuit board 20. Relay circuit board 30 is electrically connected to high-voltage circuit board 20. In this embodiment, relay circuit board 30 is physically connected to high-voltage circuit board 20. Incidentally, although relay circuit board 30 is electrically connected to high-voltage circuit board 20, it should be noted that relay circuit board 30 does not necessarily have to be physically connected to high-voltage circuit board 20. Relay circuit board 30 has a front side 30a, a back side 30b, and a side side 30c. Relay electronic components are arranged on the front side 30a. The back side 30b is located on the side opposite to the front side 30a. The side side 30c is located between the front side 30a and the back side 30b. The front side 30a of relay circuit board 30 is generally perpendicular to the front side 20a of high-voltage circuit board 20. As examples of relay electronic components arranged on relay circuit board 30, high-voltage output connector 28, electrolytic capacitor 26, and high-voltage control connector 25 are mounted on relay circuit board 30. In the following description, for ease of description, these electronic components mounted on relay circuit board 30 will be collectively referred to as "relay electronic components".

[0023] Next, we will refer to the following. Figures 3 to 5 Describes a high-voltage generator 3 housed in an outer casing 100 that defines the exterior of the AED 1. Figure 3 This shows the application of potting material 40 (see...) Figure 4 A view of the high-voltage generator 3 housed in the housing 100 before it is injected into the housing 100.

[0024] Figure 4 This is a view showing the high-voltage generator 3 housed in the housing 100 after the potting material 40 is injected into the housing 100. Figure 5 It is the outer casing 100 and the high voltage generator 3 along Figure 4 The diagram shows a three-dimensional cross-section taken by line AA. Although Figure 1 Other components of the AED 1 shown, besides the high-voltage generator 3, are also housed in the housing 100, but for ease of explanation, the illustrations of these components are omitted.

[0025] like Figure 3 As shown, the housing 100 is made of a resin material such as polycarbonate, ABS resin, or PBT resin. The housing 100 has three housing areas S1 to S3. The high-voltage generator 3 and the partition 120 are housed in housing area S1 (an example of the first housing area). A control board (not shown), including at least the AED controller 2, is housed in housing area S2. The energy storage unit 4 (e.g., a high-voltage film capacitor) is housed in housing area S3.

[0026] The high-voltage generator 3 is housed in the housing region S1 such that the back surface 20b of the high-voltage circuit board 20 faces the bottom surface 102 of the housing 100. Furthermore, a partition 120 is arranged inside the housing region S1 with the high-voltage generator 3 positioned therein. The partition 120 may be made of, for example, the same resin material as the housing 100. The partition 120 facing the side surface 20c of the high-voltage circuit board 20 is positioned between the outer wall portion 103 of the housing 100 and the side surface 20c of the high-voltage circuit board 20. In this respect, the partition 120 is arranged inside the housing region S1 to extend along at least a portion of the outline of the high-voltage circuit board 20.

[0027] To ensure electrical insulation between the terminals of the high-voltage electronic components arranged on the high-voltage circuit board 20, Figure 3 After the potting material 40 is injected into the receiving area S1 from the Z-axis direction in the state shown, the potting material 40 cures. Thus, the high-voltage generator 3 is partially covered by the potting material 40, as shown. Figure 4 and Figure 5 As shown.

[0028] In this respect, the potting material 40 covers the high-voltage circuit board 20 and the terminals of the high-voltage electronic components disposed on the high-voltage circuit board 20 (e.g., the terminals of the internal discharge resistor 33). Specifically, while ensuring electrical insulation, the terminals of the high-voltage electronic components are completely covered by the potting material 40, the high-voltage electronic components are partially exposed from the potting material 40. For example, while the terminals 33a of the internal discharge resistor 33 are completely covered by the potting material 40, such as… Figure 3 and Figure 4As shown, the main body of the internal discharge resistor 33 is partially exposed from the potting material 40. Furthermore, the potting material 40 partially covers the relay circuit board 30.

[0029] Furthermore, the potting material 40 contacts the high-voltage circuit board 20 and the housing 100, thereby fixing the high-voltage circuit board 20 to the housing 100, such as... Figure 5 As shown. Specifically, the front 20a, back 20b, and side 20c of the high-voltage circuit board 20 are completely covered by the potting material 40. Furthermore, the potting material 40 contacts the partition 120 and the relay circuit board 30 to secure the partition 120 and the relay circuit board 30 to the housing 100. Specifically, the potting material 40 fills the space surrounded by the outer wall portion 103 of the housing 100, the inner wall portion 110 of the housing 100 defining the receiving area S1, the bottom surface 102 of the housing 100, and the partition 120. The potting material 40 contacts the outer wall portion 103, the inner wall portion 110, and the bottom surface 102 of the housing 100.

[0030] Furthermore, potting material 40 is filled between the side surface 20c of the high-voltage circuit board 20 and the outer wall 103 of the housing 100, between the back surface 20b of the high-voltage circuit board 20 and the bottom surface 102 of the housing 100, and between the relay circuit board 30 and the inner wall 110 of the housing 100. Therefore, the high-voltage circuit board 20 and the housing 100 can be firmly fixed together.

[0031] For example, insulating materials such as ceramics or insulating resins can be used as the potting material 40. Specifically, the potting material 40 can be formed from insulating resins such as epoxy resin, polybutadiene resin, polyurethane resin, silicone resin, acrylic resin, or polyester resin. In particular, as the material of the potting material 40, a resin material with high adhesion to the housing 100 is preferred. The potting material 40 is preferably formed, for example, from a resin containing polybutadiene as the main material.

[0032] According to this embodiment, as described above, the high-voltage circuit board 20 is directly fixed to the housing 100 by the potting material 40. Therefore, it is not necessary to separately provide a dedicated housing for accommodating the high-voltage circuit board 20 in the housing 100, nor is it necessary to separately provide mechanical fasteners (e.g., bolts or rib structures) for fixing the dedicated housing to the housing 100. Therefore, it is possible to miniaturize the AED1 and improve its durability.

[0033] Furthermore, the potting material 40 is in contact with the high-voltage circuit board 20 and the housing 100. Therefore, the heat generated by the high-voltage electronic components is effectively conducted to the housing 100 through the high-voltage circuit board 20 and the potting material 40. Thus, the heat generated by the high-voltage electronic components can be effectively dissipated to the outside of the AED 1, thereby improving the heat dissipation performance of the AED 1. Therefore, the durability and heat dissipation performance of the AED 1 can be improved, and the AED 1 can be miniaturized.

[0034] Furthermore, in this embodiment, while the terminals of the high-voltage electronic components are completely covered by the potting material 40, the high-voltage electronic components are partially exposed from the potting material 40. For example, while the terminal 33a of the internal discharge resistor 33 is completely covered by the potting material 40, the main body of the internal discharge resistor 33 is partially exposed from the potting material 40. Therefore, it is possible to ensure electrical insulation between the terminals of the high-voltage electronic components by means of the potting material 40 while suppressing the amount of potting material 40 filling the housing 100. Thus, by suppressing the amount of potting material 40 filling, the weight of the AED 1 can be reduced.

[0035] In this embodiment, the partition 120 is disposed between the side 20c of the high-voltage circuit board 20 and the housing 100, extending along a portion of the outline of the high-voltage circuit board 20. Therefore, the amount of potting material 40 filling the housing 100 can be suppressed, thereby reducing the weight of the AED 1.

[0036] In this embodiment, potting material 40 is filled between the back surface 20b of the high-voltage circuit board 20 and the bottom surface 102 of the housing 100. Therefore, the high-voltage circuit board 20 and the housing 100 can be reliably fixed to each other by the potting material 40, and the heat generated by the high-voltage electronic components can be effectively dissipated to the outside of the AED 1. Therefore, the heat dissipation performance of the AED 1 can be improved.

[0037] Furthermore, in this embodiment, the front surface 30a of the relay circuit board 30 and the front surface 20a of the high-voltage circuit board 20 are approximately perpendicular to each other. Therefore, the size of the high-voltage generator 3 can be miniaturized. Consequently, the accommodating area S1 of the housing 100 for accommodating the high-voltage generator 3 can be reduced, thereby enabling the miniaturization of the AED 1.

[0038] While embodiments of this disclosure have been described above, the technical scope of this disclosure should not be construed as limiting by the description of the embodiments. These embodiments are merely exemplary, and those skilled in the art will understand that various changes can be made to the embodiments within the scope of this disclosure as described within the scope of the claims. The technical scope of this disclosure should be determined based on the scope of this disclosure as set forth in the claims and the scope of its equivalents.

[0039] For example, in this embodiment, multiple high-voltage electronic components are mounted on the high-voltage circuit board 20. However, the number of high-voltage electronic components mounted on the high-voltage circuit board 20 can be only one. Similarly, the number of relay electronic components mounted on the relay circuit board 30 can be only one.

[0040] Furthermore, in this embodiment, the high-voltage generator 3 has a high-voltage circuit board 20 and a relay circuit board 30. However, the high-voltage generator 3 does not necessarily have to have a relay circuit board 30. In this case, the high-voltage electronic components and the relay electronic components can be mounted on the high-voltage circuit board 20.

[0041] This application is based on Japanese Patent Application No. 2020-103070, filed on June 15, 2020, the entire contents of which are incorporated herein by reference.

Claims

1. An automated external defibrillator, comprising: A high-voltage generator configured to charge and discharge energy to deliver an electric shock to a subject for defibrillation. An outer casing configured to house the high-voltage generator and define the exterior of the automated external defibrillator; as well as Encapsulating material, which includes insulating material. The high-voltage generator includes: High voltage circuit boards; and High-voltage electronic components are arranged on the high-voltage circuit board. The potting material covers the terminals of the high-voltage circuit board and the high-voltage electronic components, and contacts the high-voltage circuit board and the housing to secure the high-voltage circuit board to the housing. The terminals of the high-voltage electronic component are completely covered by the potting material, and the high-voltage electronic component is partially exposed from the potting material.

2. The automated external defibrillator according to claim 1, wherein The high-voltage circuit board includes: The high-voltage electronic components are arranged on the front side; The back side, which is located on the opposite side of the front side; and The side, located between the front and the back, The automated external defibrillator further includes: A partition, the partition facing the side of the high-voltage circuit board and disposed between the housing and the side of the high-voltage circuit board, The potting material is in contact with the partition.

3. The automated external defibrillator according to claim 2, wherein, The partition is arranged to extend along at least a portion of the outline of the high-voltage circuit board.

4. The automated external defibrillator according to any one of claims 1 to 3, wherein, The housing has a first receiving area, in which the high-voltage generator is received, and The potting material contacts the inner wall of the outer casing that defines the first accommodating area.

5. The automated external defibrillator according to any one of claims 1 to 3, wherein, The potting material is made of a resin containing polybutadiene as the main material.

6. The automated external defibrillator according to any one of claims 1 to 3, wherein, The high-voltage circuit board includes: The high-voltage electronic components are arranged on the front side; The back side, which is located on the opposite side of the front side; and The side, located between the front and the back, The potting material is disposed between the back side of the high-voltage circuit board and the outer casing.

7. The automated external defibrillator according to any one of claims 1 to 3, wherein The high-voltage generator also includes: A relay circuit board, which is physically electrically connected to the high-voltage circuit board; and A relay electronic component, which is arranged on the relay circuit board. The front side of the relay circuit board where the relay electronic components are arranged is substantially perpendicular to the front side of the high-voltage circuit board where the high-voltage electronic components are arranged. The potting material partially covers the relay circuit board.

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