A cooling runner device and power converter

By forming flow channels between the housings of the power converter and utilizing a flow guiding structure, the problem of low single-sided cooling efficiency is solved, achieving double-sided heat dissipation and improving cooling efficiency and heat dissipation effect.

CN115700974BActive Publication Date: 2026-07-21WEICHAI POWER CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WEICHAI POWER CO LTD
Filing Date
2022-09-27
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

The existing power converter uses single-sided cooling, which is inefficient and cannot effectively dissipate heat.

Method used

A cooling channel device is adopted, which forms a channel between the first shell and the second shell. When the cooling medium flows in the channel, it simultaneously cools and dissipates heat for the electrical components on both sides. The flow is guided by the flow guiding structure to achieve double-sided heat dissipation.

Benefits of technology

It improves heat dissipation efficiency, with the cooling medium directly contacting the shell surface, enhancing the heat dissipation effect, adapting to the high heat generation requirements of electrical components, and achieving rapid and uniform cooling.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a cooling flow channel device and a power converter. The cooling flow channel device comprises a first shell and a second shell arranged oppositely, the first shell has a first wall facing the second shell, the second shell has a second wall facing the first shell, at least one of the first wall and the second wall is provided with a groove structure, and the first wall and the second wall are butted to form a flow channel for cooling medium, and the groove structure constitutes a part of the flow channel.
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Description

Technical Field

[0001] This invention relates to the field of cooling and heat dissipation technology, specifically to a cooling channel device and a power converter. Background Technology

[0002] The power converter contains multiple sets of electrical components, which generate heat during operation and require cooling. Current solutions involve installing cooling channels on the outer wall of the bottom of the electrical component housing, while the electrical components are located on the inner wall of the bottom of the housing. This cooling method is unilateral and has low cooling efficiency. Summary of the Invention

[0003] This application provides a cooling channel device, including a first housing and a second housing disposed opposite to each other. The first housing has a first wall facing the second housing, and the second housing has a second wall facing the first housing. At least one of the first wall and the second wall is provided with a groove structure. The first wall and the second wall are joined together to form a channel for the flow of cooling medium, and the groove structure constitutes part of the channel.

[0004] In one specific embodiment, the flow channel includes an inlet flow channel, an outlet flow channel, and a cooling flow channel, wherein the inlet flow channel, the cooling flow channel, and the outlet flow channel are connected in series.

[0005] In one specific embodiment, the cooling channel device further includes a flow guiding structure for guiding the direction of the cooling medium in the channel.

[0006] In one specific embodiment, the flow channel includes a cooling flow channel, the cooling flow channel includes at least two cooling branch channels, at least one of the cooling branch channels is provided with the flow guiding structure, the flow guiding structure separates the cooling branch channel into two layers of first flow channel cavity and second flow channel cavity extending along the extension direction of the cooling branch channel, one end of the first flow channel cavity is an inlet and the other end is an outlet, the outlet of the first flow channel cavity is connected to the inlet of one end of the second flow channel cavity, and the other end of the second flow channel cavity is an outlet.

[0007] In one specific embodiment, the flow guiding structure includes a first partition, a second partition, and a connecting plate extending along the extension direction of the cooling distribution channel. The connecting plate connects the first partition and the second partition. The first partition and the wall of the cooling distribution channel cooperate to form a first flow channel cavity, and the second partition and the wall of the cooling distribution channel cooperate to form a second flow channel cavity.

[0008] In one specific embodiment, the wall of the cooling channel has ribs extending along the extension direction of the cooling channel, and the first channel cavity and / or the second channel cavity are divided into two or more compartments by the corresponding ribs.

[0009] In one specific embodiment, the flow guiding structure has a side facing the adjacent cooling channel, and the side is provided with a connecting cavity; the connecting cavity connects to the adjacent cooling channel, and the connecting cavity connects to the inlet of the first flow channel cavity or the outlet of the second flow channel cavity.

[0010] In one specific embodiment, the flow guiding structure further includes a central partition extending along the extension direction of the cooling channel, the connecting plate simultaneously connecting the central partition, and two partition plates perpendicular to the extension direction of the cooling channel. The central partition, the partition plates, the first partition, and the second partition form the communicating cavity.

[0011] In one specific embodiment, the two ends of the partition plate are connected to the first partition plate and the second partition plate, and one of the partition plates connecting the end edges of the first partition plate and the second partition plate is the first partition plate, and the other partition plate is the second partition plate; the middle partition plate, the partition plate, the first partition plate, and the second partition plate enclose and form two communicating cavities.

[0012] In one specific embodiment, the two parts of the first partition plate separated by the central partition plate each have a notch facing the adjacent cooling channel, and the connecting cavity connects to the second channel cavity or the first channel cavity through the notch.

[0013] In one specific embodiment, the flow guiding structure further includes a plurality of baffles, the baffles being perpendicular to the extending direction of the cooling distribution channel, the baffles connecting the first partition, the middle partition, and the second partition, and the baffles and the partitions being arranged along the extending direction of the flow guiding structure.

[0014] In one specific embodiment, the side edge of the second partition is provided with a notch.

[0015] In one specific embodiment, the connecting plate is partially or completely hollowed out corresponding to the communicating cavity.

[0016] In one specific embodiment, the cooling channel includes three cooling branch channels arranged side by side. The cooling branch channels on both sides are provided with the flow guiding structure. The cooling medium is connected to the cooling branch channel in the middle through the connecting cavity of the flow guiding structure in the cooling branch channel on one side, and the cooling branch channel in the middle is connected to the first channel cavity of the flow guiding structure in the cooling branch channel on the other side.

[0017] In one specific embodiment, a first electrical component is installed in the mounting area of ​​the first housing and the second housing corresponding to the cooling distribution channels on both sides, and a second electrical component is installed in the mounting area of ​​the first housing and the second housing corresponding to the cooling distribution channel in the middle.

[0018] This application also provides a power converter including the cooling channel device described in any of the above claims.

[0019] In this application, the cooling channel device forms a channel between the first and second housings. When the cooling medium flows in the channel, it can simultaneously cool and dissipate heat for the electrical components inside both the first and second housings, achieving double-sided heat dissipation and fully utilizing the channel to improve heat dissipation efficiency. Moreover, the channel is formed by the bottoms of the first and second housings joining together, which simplifies the channel formation process and allows the cooling medium to directly contact both housings while flowing in the channel, resulting in better heat dissipation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the cooling channel device in the embodiments of this application;

[0021] Figure 2 for Figure 1 A schematic diagram of the interior of the first shell.

[0022] Figure 3 for Figure 1 A schematic diagram of the interior of the second shell.

[0023] Figure 4 for Figure 1 A schematic diagram of the bottom of the first shell.

[0024] Figure 5 for Figure 1 A schematic diagram of the bottom of the second housing;

[0025] Figure 6 for Figure 1 A cross-sectional view along the X direction after the first and second shells are docked;

[0026] Figure 7 This is a partial sectional view of the second shell in section 1;

[0027] Figure 8 for Figure 7 A schematic diagram of the flow guide structure installed in the first cooling distribution channel;

[0028] Figure 9 for Figure 8 A schematic diagram of the central guide structure from another perspective;

[0029] Figure 10 for Figure 7A schematic diagram of the flow guide structure installed in the second cooling distribution channel;

[0030] Figure 11 for Figure 1 A cross-sectional view of the first shell in the middle;

[0031] Figure 12 for Figure 5 Enlarged view of the location of the intermediate cooling channel;

[0032] Figure 13 for Figure 1 Schematic diagram of the flow path in the middle channel.

[0033] Figure 1-13 The annotations in the attached figures are explained as follows:

[0034] 1-First shell; 11-First groove segment; 12-Second groove segment; 13-Third groove segment; 131-Guide rib; 13a-First interface; 14-Fourth groove segment; 15-Fifth groove segment;

[0035] 2-Second shell; 21-First groove segment; 22-Second groove segment; 23-Third groove segment; 231-Guide rib; 23a-Second interface; 24-Fourth groove segment; 241-Protruding rib; 25-Fifth groove segment;

[0036] 3-Flow guiding structure; 3a-Connecting cavity; 31-First partition; 32-Second partition; 33-Connecting plate; 34-Middle partition; 351-First dividing plate; 352-Second dividing plate; 36-Water baffle;

[0037] A - First cooling channel; A1 - First channel cavity; A2 - Second channel cavity; B - Bottom cooling channel; C - Second cooling channel; C1 - First channel cavity; C2 - Second channel cavity. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] This embodiment provides a cooling channel device, which is specifically a converter unit in a power converter, but can also be used in other electrical equipment to dissipate heat from corresponding electrical components. This embodiment mainly uses a power converter as an example for illustration; other electrical equipment can be understood by analogy.

[0040] Please refer to Figure 1-3 , Figure 1 This is a schematic diagram of the cooling channel device in the embodiments of this application; Figure 2 for Figure 1 A schematic diagram of the interior of the first shell 1; Figure 3 for Figure 1 A schematic diagram of the interior of the second shell 2.

[0041] The cooling channel device includes a first housing 1 and a second housing 2 arranged opposite to each other. Both the first housing 1 and the second housing 2 are used to install the aforementioned electrical components. The electrical components installed in the first housing 1 and the second housing 2 can be the same or different. The first housing 1 and the second housing 2 can have the same structure or different structures. Figure 2 , 3 As can be seen, both the first housing 1 and the second housing 2 are housing structures with an opening on one side, and their internal structures are identical, with the interior serving as mounting areas for electrical components. Specifically, the mounting areas of the first housing 1 include a first mounting area 1-1, a second mounting area 1-2, and a third mounting area 1-3. First mounting areas 1-1 and 1-3 can mount first electrical components, such as MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) and DIODEs (Metal-Semiconductor Diodes). The second mounting area 1-2, located in the middle, can mount second electrical components, such as power inductors. The mounting areas of the second housing 2 include a first mounting area 2-1, a second mounting area 2-2, and a third mounting area 2-3, identical to those of the first housing 1. Of course, this is merely an example of the distribution of electrical components; the first housing 1 and the second housing 2 can house the same type of electrical component, or multiple types of electrical components. This embodiment does not impose any limitations.

[0042] Please continue to refer to this. Figure 4-6 understand, Figure 4 for Figure 1 A schematic diagram of the bottom of the first housing 1; Figure 5 for Figure 1 A schematic diagram of the bottom of the second housing 2; Figure 6 for Figure 1 The first housing 1 and the second housing 2 are connected in a cross-sectional view along the X direction, which is perpendicular to the arrangement direction of the first mounting area 1-1, the second mounting area 1-2, and the third mounting area 1-3.

[0043] Figure 1 In this design, the first housing 1 and the second housing 2 are arranged with openings on one side and their bottoms facing each other. The openings on one side of both housings constitute the bottom. Both housings also include peripheral portions surrounding their bottoms. The first housing 1 has a first wall facing the second housing 2, and the second housing 2 has a second wall facing the first housing 1. The first wall is the bottom wall of the first housing 1, and the second wall is the bottom wall of the second housing 2. The first and second walls are arranged opposite each other. If the first housing 1 and the second housing 2 are considered as a single unit, it is equivalent to the two housings sharing a common bottom.

[0044] It is worth noting that in this embodiment, at least one of the first wall of the first housing 1 and the second wall of the second housing 2 is provided with a groove structure. After the first wall and the second wall are joined together, a flow channel for the cooling medium is formed, and the groove structure constitutes part of the flow channel. For example, if either the first wall or the second wall is provided with a groove structure, and the other includes a flat wall, then the flat wall covers the groove structure to form a flow channel. Alternatively, the first wall is provided with a first groove structure, and the second wall is provided with a second groove structure. The groove openings of the first groove structure and the second groove structure are opposite each other, and the two are joined together to form a flow channel. Figure 3 In the first shell 1, the first wall is provided with a first groove structure, which includes multiple groove segments, namely the first groove segment 11, the second groove segment 12, the third groove segment 13, the fourth groove segment 14, and the fifth groove segment 15. The second wall of the second shell 2 is provided with a second groove structure, which includes multiple groove segments, namely the first groove segment 21, the second groove segment 22, the third groove segment 23, the fourth groove segment 24, and the fifth groove segment 25. Each groove segment of the first groove structure and the corresponding groove segment of the second groove structure are connected to form part of the flow channel.

[0045] This configuration creates a flow channel between the first housing 1 and the second housing 2. When the cooling medium flows through this channel, it can simultaneously cool and dissipate heat for the electrical components within both the first housing 1 and the second housing 2, achieving double-sided heat dissipation and fully utilizing the flow channel to improve heat dissipation efficiency. Furthermore, the flow channel is formed by the bottoms of the first housing 1 and the second housing 2 joining together. This method of channel formation is simple, and the cooling medium directly contacts both the first housing 1 and the second housing 2 when flowing through the channel, resulting in even better heat dissipation.

[0046] Furthermore, the flow channels include an inlet flow channel, an outlet flow channel, and a cooling flow channel, which are connected in series. The cooling medium can be, for example, water. The cooling medium enters through the inlet flow channel, flows through the cooling flow channel, and then flows out through the outlet flow channel. The cooling flow channels are mainly distributed in the areas where electrical components are arranged in the first housing 1 and the second housing 2, such as the three installation areas mentioned above. In this way, cooling can be achieved with just one inlet and one outlet, and the introduction or exit of the cooling medium is relatively simple. Of course, depending on the design of the installation area, multiple parallel flow channels can also be set up.

[0047] Specifically, in this embodiment, the cooling channel is divided into multiple cooling branch channels in the area where the electrical components are located. The first slot segment 11 of the first slot structure and the second slot segment 21 of the second slot structure are connected to form an inlet channel. The second slot segment 12 and the second slot segment 22 are connected to form a first cooling branch channel A. The third slot segment 13 and the third slot segment 23 are connected to form a bottom cooling branch channel B. The fourth slot segment 14 and the fourth slot segment 24 are connected to form a second cooling branch channel C.

[0048] You can continue to refer to this. Figure 7-10 understand, Figure 7This is a partial sectional view of the second shell 2 in section 1, specifically a sectional view along the X direction; Figure 8 for Figure 7 A schematic diagram of the flow guiding structure 3 installed in the first cooling distribution channel A; Figure 9 for Figure 8 A schematic diagram of the central guide structure 3 from another perspective; Figure 10 for Figure 7 A schematic diagram of the flow guide structure 3 installed in the second cooling channel C. Figure 8-10 The flow path of the cooling medium at the guide structure 3 is shown in the form of a dashed arrow.

[0049] The cooling channel device in this embodiment also includes a flow guiding structure 3, which is used to guide the direction of the cooling medium in the cooling channel. That is, by setting the flow guiding structure 3 in the cooling channel, the cooling medium can be guided to flow according to demand, such as forming circulation, bending, etc., making the flow direction of the cooling medium more flexible and achieving a better cooling effect.

[0050] In this embodiment, the cooling channel includes at least two cooling branch channels, and at least one cooling branch channel is provided with a guide structure 3, in order to... Figure 2 , 3 The distribution of electrical components is adapted to the cooling flow channels, which include a first cooling branch channel A, a second cooling branch channel C, and a bottom cooling branch channel B. The first cooling branch channel A corresponds to the first mounting area 1-1 of the first housing 1 and the third mounting area 2-1 of the second housing 2. The second cooling branch channel C corresponds to the third mounting area 1-3 of the first housing 1 and the third mounting area 2-3 of the second housing 2. The bottom cooling branch channel B corresponds to the second mounting area 1-2 of the first housing 1 and the second mounting area 2-2 of the second housing 2.

[0051] like Figure 7 As shown, a flow guiding structure 3 is provided in the first cooling channel A and the second cooling channel C located on both sides of the bottom cooling channel B. The flow guiding structure 3 can separate the corresponding cooling channel into two layers: a first flow channel cavity and a second flow channel cavity extending along the extension direction of the cooling channel. Figure 7In the first cooling channel A, a first flow channel cavity A1 and a second flow channel cavity A2 are separated, and a second cooling channel C is divided into a first flow channel cavity C1 and a second flow channel cavity C2. One end of the first flow channel cavity A1 / C1 is an inlet, and the other end is an outlet. The outlet of the first flow channel cavity A1 / C1 is connected to the inlet of one end of the second flow channel cavity A2 / C2, and the other end of the second flow channel cavity A2 / C2 is an outlet. The cooling medium can flow along the first flow channel cavity A1 / C1 and then flow back in the opposite direction from the second flow channel cavity A2 / C2. By layering the first cooling channel A and the second cooling channel C, the flow of the cooling medium can be accelerated, and heat exchange can be performed more quickly. This is suitable for the heat dissipation of electrical components that generate a lot of heat. For example, the first cooling channel A and the second cooling channel C mentioned above correspond to the arrangement area of ​​MOSFETs and DIODEs. MOSFETs and DIODEs are electrical components that generate a lot of heat. After layering, the flow rate of the cooling medium can be significantly increased, and a reciprocating flow path can be formed. Layering can realize the three-dimensional circulation of the cooling medium, and the heat dissipation effect can be greatly improved.

[0052] like Figure 6 As shown, the cross-sectional thickness of the first cooling channel A and the second cooling channel C is higher than that of the bottom cooling channel C. The higher cross-sectional thickness design facilitates layering. On the other hand, the outer walls of the first cooling channel A and the second cooling channel C and the outer wall of the bottom cooling channel B form a recess, which facilitates the injection of glue to fix the corresponding electrical components, such as fixing power inductors.

[0053] The specific structure of the flow guiding structure 3 is as follows: Figure 8-10 As shown, the flow guiding structure 3 includes a first baffle 31, a second baffle 32, and a connecting plate 33 located between the first baffle 31 and the second baffle 32. The first baffle 31, the second baffle 32, and the connecting plate 33 all extend along the extension direction of the cooling distribution channel, i.e. Figure 1 , 8 As shown in the diagram, both the first cooling channel A and the second cooling channel C extend along the Y-direction. The surfaces of the first baffle 31 and the first baffle 32 of the flow guiding structure 3 are arranged opposite each other and relatively parallel, and the connecting plate 33 is perpendicular to the first baffle 31 and the first baffle 32. Figure 6 As shown, the first partition 31 and the wall of the corresponding cooling channel cooperate to form the first flow channel cavity A1 / C1, specifically the side wall and bottom wall of the second slot section 22 or the fourth slot section 24 cooperate. The first partition 32 and the wall of the cooling channel cooperate to form the second flow channel cavity A2 / C2, specifically the side wall and bottom wall of the second slot section 12 and the fourth slot section 14 cooperate.

[0054] Taking the flow guiding structure 3 installed in the first cooling channel A as an example, the first partition 31 and the second groove section 12 of the first groove structure of the first housing 1 abut against each other and are sealed, and there is a gap between the bottom wall of the second groove section 12, thereby enclosing and forming the second flow channel cavity A1. The second partition 32 and the second groove section 22 of the second groove structure of the second housing 2 abut against each other and are sealed, and there is a gap between the bottom wall of the second groove section 22, thereby enclosing and forming the second flow channel cavity A1. In order to achieve faster and more uniform flow and improve heat dissipation capacity, ribs can also be provided. The ribs divide the first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2 into at least two sub-cavities extending along the extension direction of the cooling channel, such as... Figure 6 As shown, the second segment 12 and the fourth segment 14 of the first slot structure, and the second segment 22 and the fourth segment 24 of the second slot structure, have a raised rib in the middle at the position corresponding to the first cooling channel A and the second cooling channel C. Figure 5 The diagram shows the rib 241. The cross-sectional profile of the groove segment where the rib 241 is located is M-shaped. The first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2 are M-shaped cavities, that is, they are roughly divided into two sub-cavities. There can still be gaps between the first partition plate 31, the second partition plate 32 and the rib, and the separated sub-cavities are connected.

[0055] The first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2, separated by the first partition 31 and the first partition 32, have a relatively simple structure. By simply placing the flow guiding structure 3 into the corresponding first cooling channel A and second cooling channel C, a layered configuration can be achieved. Compared to directly creating layered cooling channels, this is easier to manufacture. It is understood that the layering method of the flow guiding structure is not limited to this; for example, a single partition can be used for layering. The aforementioned layering method results in a smaller thickness for the first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2, which can better accelerate the cooling of the medium.

[0056] Furthermore, the flow guiding structure 3 has a side section. Figure 8 In this embodiment, the two sides of the flow guide structure 3 are distributed on both sides in the Y direction, with the sides facing the X direction. The sides of the flow guide structure 3 are close to the adjacent cooling distribution channels, and a connecting cavity 3a is provided in the part near the end of the flow guide structure 3. In this way, the connecting cavity 3a can be connected with the upstream or downstream cooling distribution channels. In this embodiment, multiple cooling distribution channels are arranged along the X direction. By providing a connecting cavity 3a in the side facing the X direction, the connection of adjacent cooling distribution channels can be directly realized, which facilitates the connection of each cooling distribution channel.

[0057] Specifically, such as Figure 8As shown, the flow guiding structure 3 also includes a central baffle 34 extending along the extension direction (i.e., the Y direction) of the cooling distribution channel. The central baffle 34 is located between the first baffle 31 and the second baffle 32. The surfaces of the central baffle 34, the first baffle 31, and the second baffle 32 are opposite to each other and parallel to each other. The connecting plate 33 connects the central baffle 34. It also includes two partition plates perpendicular to the extension direction of the first cooling distribution channel A or the second cooling distribution channel C, which are defined as the first partition plate 351 and the second partition plate 352, respectively. The central baffle 34, the two partition plates, and the first baffle plate 31 or the second baffle plate 32 enclose a communicating cavity 3a. Figure 8 In this embodiment, the two partition plates and the first partition plate 31 form a communicating cavity 3a located on the upper side of the middle partition plate 34. The two ends of the two partition plates in this embodiment are connected to the first partition plate 31 and the second partition plate 32, so the two partition plates and the second partition plate 32 also enclose a communicating cavity 3a located on the lower side of the middle partition plate 34.

[0058] Figure 8 In this design, the first partition plate 351 connects the end edges of the first partition plate 31 and the second partition plate 32, with the second partition plate 352 and the first partition plate 351 spaced a certain distance apart. Both parts of the first partition plate 351, separated by the middle partition plate 34, are provided with notches 351a. This allows the second flow channel cavity A2 located above the first partition plate 31 or the first flow channel cavity A1 located below the second partition plate 32 to connect to the connecting cavity 3a through the notches 351a, and then to the adjacent cooling distribution channel through the connecting cavity 3a. The method of providing the notches 351a is relatively simple; however, other methods can also be used, such as providing through holes in the first partition plate 351.

[0059] like Figure 9 As shown, the middle partition 34 extends from both ends of the first partition 31 and the second partition 32 along the extension direction of the flow guiding structure 3. The part extending from one end corresponding to the outlet of the first flow channel cavity A1 / C1 is approximately U-shaped, thus forming an opening 34a. The opening 34a can serve as an interface connecting the first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2. The part extending from the other end can separate the first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2, preventing the cooling medium from entering the first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2 simultaneously.

[0060] Combination Figure 11-13 understand, Figure 11 for Figure 1 A cross-sectional view of the first housing 1 in the middle; Figure 12 For the image Figure 5 Enlarged view of the location of the intermediate cooling channel; Figure 13 for Figure 1 Schematic diagram of the flow path in the middle channel.

[0061] like Figure 7 , 12As shown, the cooling medium flows into the inlet channel from the guide structure 3 of the first cooling channel A, and then enters the first channel cavity A1 formed by the wall cooperation of the guide structure 3 and the first cooling channel A. Part of the cooling medium enters the connecting cavity 3a on the lower side of the guide structure 3, but does not continue to move within the first baffle 31 and the second baffle 32. After flowing along the lower connecting cavity 3a, the cooling medium flows upward into the second channel cavity A2, where it flows in the opposite direction. Then it flows to the end of the guide structure 3 near the inlet channel, where it can enter the connecting cavity 3a on the upper side of the guide structure 3 through the notch 351a. It can then flow through the connecting cavity 3a to the bottom cooling channel B, as shown. Figure 3 As shown, the bottom cooling channel B is provided with a first interface 13a, which is located in the third groove section 13 of the first housing 1. The bottom cooling channel B is also provided with a second interface 23a, which is located in the third groove section 23 of the second housing 2. After the cooling medium enters the bottom cooling channel B, it flows through the second interface 23a to the guide structure 3 in the second cooling channel C. This guide structure 3 is arranged in the opposite direction to the guide structure 3 in the first cooling channel A. At this time, the cooling medium flows through the connecting cavity 3a located on the lower side of the guide structure 3 in the second cooling channel C, and through the notch 351a to the first flow channel cavity C1 of the second cooling channel C. After flowing to the end of the first flow channel cavity C1, it flows upward to the second flow channel cavity C2. After flowing in the reverse direction, it flows out from the end of the second flow channel cavity C2 and enters the outlet flow channel, which can be combined with Figure 13 Understand the overall flow path of the cooling medium.

[0062] The direction of the flow guiding structure 3 in the second cooling channel C is opposite to that in the first cooling channel A. In this way, the cooling medium can flow from left to right and then from right to left along the Y direction in the first cooling channel A, while it can flow from right to left and then from left to right along the Y direction in the second cooling channel C. This promotes the reversal of the cooling medium and improves the heat exchange efficiency. Moreover, this also makes the first interface 13a and the second interface 23a of the bottom cooling channel B staggered in the Y direction, further making the flow of the cooling medium more balanced.

[0063] It is understood that in the above embodiments, the first partition plate 351 and the second partition plate 352 separate and form two communicating cavities 3a, one above the other. Figure 7In this design, the lower connecting cavity 3a in the first cooling channel A and the upper connecting cavity 3a in the second cooling channel C do not actually serve a connecting function. The purpose of having two connecting cavities 3a is to allow the two flow guiding structures 3 to be structurally identical, thus eliminating the need for separate fabrication. However, it is understandable that the design can be tailored to actual needs. For example, in the flow guiding structure 3 located in the first cooling channel A, the first partition plate 351 and the second partition plate 352 only need to connect the first partition plate 31 and the middle partition plate 34. Similarly, in the flow guiding structure 3 located in the second cooling channel C, the first partition plate 351 and the second partition plate 352 only need to connect the second partition plate 32 and the middle partition plate 34.

[0064] In addition, the flow guiding structure 3 in this embodiment also includes a baffle 36. The baffle 36 is perpendicular to the extension direction of the cooling distribution channel. Similar to the partition plate mentioned above, the baffle 36 also connects the first partition plate 31, the middle partition plate 34 and the second partition plate 32. The baffle 36 and the partition plate are arranged along the extension direction of the flow guiding structure 3. The baffle 36 can restrict the cooling medium from continuing to flow along the extension direction of the cooling distribution channel after passing through the connecting cavity 3a, so as to ensure that the cooling medium only connects from the first flow channel cavity A1 / C1 and the second flow channel cavity A2 / C2. The baffle 36 and the partition plate can act as reinforcing ribs to improve the strength of the flow guiding structure 3.

[0065] Please look again. Figure 8 The second partition plate 352 also has a notch 352a on its side edge. This allows the cooling medium to flow from the connecting cavity 3a to the cavity between the adjacent baffles 36, effectively increasing the volume of the connecting cavity 3a. This prevents the cooling medium from indirectly flowing into the connecting cavity 3a and causing excessive flow resistance due to its small volume, thus promoting smooth flow of the cooling medium. Figure 8 For example, after the cooling medium enters the connecting cavity 3a through the notch 351a, it can continue to flow to the position of a baffle 36, that is, it can enter the two compartments at the left end of the flow guiding device 3.

[0066] Furthermore, in this embodiment, the connecting plate 33 is hollowed out at the position of the connecting cavity 3a. This hollowing out can be partial or complete, meaning the connecting plate 33 does not extend to the position of the connecting cavity 3a. In this case, the first partition plate 351 and the second partition plate 352 are not only set on one side of the connecting plate 33, but are also divided into two parts by the connecting plate 33. This allows the flow guiding structure 3 to be set with the same structure for assembly into any cooling channel, adapting to the flow of cooling medium into or out of either side. It also increases the volume of the connecting cavity 3a, serving as a buffer to reduce flow resistance. At this time, notches 351a and 352a are provided on both sides of the first partition plate 351 and the second partition plate 352.

[0067] In addition, such as Figure 12 As shown, guide ribs 231 and 131 can also be provided in the bottom cooling channel B. Guide ribs 231 and 131 are arranged along the Y direction. Guide rib 131 is located in the third groove section 13 of the first housing 1, and guide rib 231 is located in the third groove section 23 of the second housing 2. Guide ribs 131 and 231 are joined to separate the bottom cooling channel B. The length of guide ribs 231 and 131 along the Y direction is less than the length of the bottom cooling channel B, and there is a gap between them and the two ends of the bottom cooling channel B, allowing the cooling medium to flow through the gaps. Thus, after the cooling medium flows to the bottom cooling channel B, it can flow relatively evenly under the guidance of guide rib 231. (Refer to...) Figure 13 Understanding the flow path reveals that the arrangement and number of guide ribs 231 are not limited to this and can be designed according to actual needs.

[0068] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A cooling channel device, characterized in that, The device includes a first housing and a second housing disposed opposite to each other. The first housing has a first wall facing the second housing, and the second housing has a second wall facing the first housing. At least one of the first wall and the second wall is provided with a groove structure. When the first wall and the second wall are joined together, they form a flow channel for the flow of cooling medium. The groove structure constitutes part of the flow channel. The cooling channel device further includes a flow guiding structure, which is used to guide the direction of the cooling medium in the channel; The flow channel includes a cooling flow channel, which includes at least two cooling branch channels. At least one of the cooling branch channels is provided with the flow guiding structure. The flow guiding structure divides the cooling branch channel into two layers: a first flow channel cavity and a second flow channel cavity extending along the extension direction of the cooling branch channel. One end of the first flow channel cavity is an inlet, and the other end is an outlet. The outlet of the first flow channel cavity is connected to the inlet at one end of the second flow channel cavity, and the other end of the second flow channel cavity is an outlet. The flow guiding structure includes a first partition, a second partition, and a connecting plate located between the first partition and the second partition, extending along the extension direction of the cooling distribution channel. The connecting plate connects the first partition and the second partition. The first partition and the wall of the cooling distribution channel cooperate to form a first flow channel cavity, and the second partition and the wall of the cooling distribution channel cooperate to form a second flow channel cavity. The flow guiding structure has a side facing the adjacent cooling channel, and the side is provided with a connecting cavity; the connecting cavity connects to the adjacent cooling channel, and the connecting cavity connects to the inlet of the first flow channel cavity or the outlet of the second flow channel cavity; The flow guiding structure further includes a central partition extending along the extension direction of the cooling channel, the connecting plate connecting the central partition, and two partition plates perpendicular to the extension direction of the cooling channel. The central partition, the partition plates, the first partition, and the second partition plate enclose the communicating cavity. The two ends of the partition plate connect the first partition plate and the second partition plate. One of the partition plates connecting the end edges of the first partition plate and the second partition plate is the first partition plate, and the other partition plate is the second partition plate. The middle partition plate, the partition plate, the first partition plate, and the second partition plate enclose and form two communicating cavities. The first partition plate, which is divided into two parts by the central partition plate, each has a notch facing the adjacent cooling channel, and the connecting cavity connects to the second channel cavity or the first channel cavity through the notch.

2. The cooling channel device according to claim 1, characterized in that, The flow channel includes an inlet flow channel and an outlet flow channel, which are connected in series.

3. The cooling channel device according to claim 1, characterized in that, The wall of the cooling channel has ribs extending along the extension direction of the cooling channel, and the first channel cavity and / or the second channel cavity are divided into two or more compartments by the corresponding ribs.

4. The cooling channel device according to claim 1, characterized in that, The flow guiding structure also includes several baffles, which are perpendicular to the extension direction of the cooling channel. The baffles connect the first partition, the middle partition, and the second partition. The baffles and the partitions are arranged along the extension direction of the flow guiding structure.

5. The cooling channel device according to claim 4, characterized in that, The second partition has a notch on its side edge.

6. The cooling channel device according to claim 5, characterized in that, The connecting plate is partially or completely hollowed out corresponding to the communicating cavity.

7. The cooling channel device according to any one of claims 1-6, characterized in that, The cooling channel includes three cooling sub-channels arranged side by side. The cooling sub-channels on both sides are provided with the flow guiding structure. The cooling medium is connected to the cooling sub-channel in the middle through the connecting cavity of the flow guiding structure in the cooling sub-channel on one side, and the cooling sub-channel in the middle is connected to the first flow channel cavity of the flow guiding structure in the cooling sub-channel on the other side.

8. The cooling channel device according to claim 7, characterized in that, A first electrical component is installed in the mounting area of ​​the first housing and the second housing corresponding to the cooling channel on both sides, and a second electrical component is installed in the mounting area of ​​the first housing and the second housing corresponding to the cooling channel in the middle.

9. A power converter, characterized in that, Includes the cooling channel device as described in any one of claims 1-8.