Atomizing core, atomizer, aerosol generating device and atomizing core processing method

Abstract

The application provides an atomizing core, an atomizer, an aerosol generating device and an atomizing core processing method. The atomizing core is formed with an atomizing surface on at least one side of a substrate, a micro-channel structure is arranged on the atomizing surface, and a heating layer is arranged on the other side of the substrate. When the atomizing core works, the aerosol-forming substrate in a storage cavity is adsorbed to the micro-channel structure by capillary force of the micro-channel structure, the micro-channel structure transmits the adsorbed aerosol-forming substrate to the atomizing surface of the substrate, and the heating layer is used to heat and atomize the aerosol-forming substrate. The atomizing core not only overcomes the problems of uneven heating of the aerosol-forming substrate and easy dry burning of the atomizing core in the traditional atomizing core, but also can save the liquid guiding material for adsorbing and storing the aerosol-forming substrate, effectively avoiding the phenomenon of carbonization of the liquid guiding material caused by heating. The atomizing core processing method provided by the application has high yield, low cost and good product consistency, and is suitable for mass production.

Description

Technical Field

[0001] This invention belongs to the field of atomizer core processing and simulated smoking technology, and in particular, relates to an atomizer core, an atomizer, an aerosol generating device, and a method for processing the atomizer core. Background Technology

[0002] Currently, in atomizers of aerosol generators using the Joule heating principle, the atomizing core typically employs a structure combining a metal heating wire and a liquid-conducting material. This atomizing core utilizes the heat generated when the metal heating wire is energized to heat the aerosol-forming matrix stored within the liquid-conducting material, thus atomizing the aerosol-forming matrix. However, atomizing cores with this metal heating wire-liquid-conducting material structure are susceptible to factors such as the configuration of the metal heating wire, the distribution of the aerosol-forming matrix stored within the liquid-conducting material, and uneven heating due to poor contact between the atomizing core and the liquid-conducting material. These factors can lead to uneven heating of the aerosol-forming matrix, as well as problems such as dry burning of the atomizing core and carbonization of the liquid-conducting material. Summary of the Invention

[0003] Based on the aforementioned problems in the prior art, one of the objectives of this invention is to provide an atomizing core that uses a microchannel structure on the atomization surface of a substrate and a heating layer on the other surface of the substrate to transfer an aerosol forming matrix to the atomization surface of the substrate via the capillary force of the microchannel structure, and uses the heating layer to heat and atomize the aerosol forming matrix.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: to provide an atomizing core, comprising:

[0005] The substrate has at least one atomizing surface for heating and atomizing the aerosol forming matrix;

[0006] A microchannel structure, disposed on the atomizing surface, is used to adsorb the aerosol forming matrix and transport the adsorbed aerosol forming matrix to the atomizing surface; and

[0007] A heating layer is disposed on the substrate and is used to heat the aerosol forming matrix.

[0008] Furthermore, the microchannel structure includes multiple flow channels disposed on the atomizing surface, and the multiple flow channels are arranged in an array on the atomizing surface.

[0009] Furthermore, the multiple flow channels are arranged in a matrix on the atomizing surface; or, the multiple flow channels are arranged in a ring array on the atomizing surface.

[0010] Furthermore, the length of the flow channel is 30–5000 μm, the width of the flow channel is 0.1–1000 μm, and the depth of the flow channel is 0.1–5000 μm.

[0011] Furthermore, the atomizing core also includes a first insulating protective layer disposed between the substrate and the heating layer, the first insulating protective layer being disposed on the other side of the substrate, and the heating layer being disposed on the side of the first insulating protective layer facing away from the substrate.

[0012] Furthermore, the heating layer is a metal thin film formed on the first insulating protective layer by means of a thin film.

[0013] Furthermore, the atomizing core also includes a second insulating protective layer, which is applied to the side of the heating layer opposite to the first insulating protective layer.

[0014] Furthermore, the substrate is a wafer substrate or a glass substrate, the atomization surface is disposed on the top surface of the wafer substrate or the glass substrate, and the heating layer is disposed on the bottom surface of the wafer substrate or the glass substrate.

[0015] Based on the aforementioned problems in the prior art, a second objective of this invention is to provide an atomizer that provides a microchannel structure on the atomization surface of a substrate and a heating layer on the other surface of the substrate, wherein the aerosol forming matrix is ​​transported to the atomization surface of the substrate by the capillary force of the microchannel structure, and the heating layer is used to heat and atomize the aerosol forming matrix on the atomization surface.

[0016] To achieve the above objectives, the technical solution adopted by the present invention is as follows: an atomizer is provided, including an atomizing core and an atomizer body having an atomizing chamber and a liquid storage chamber inside. The atomizing core is the atomizing core provided by any of the above solutions. The atomizing core is disposed in the atomizing chamber. The microchannel structure can transport the aerosol forming matrix in the liquid storage chamber to the atomizing surface.

[0017] Furthermore, the atomizer also includes a liquid storage component, which has a liquid storage chamber inside and an outlet on the liquid storage component for permeating the aerosol matrix in the liquid storage chamber to the microchannel structure.

[0018] Based on the aforementioned problems in the prior art, a third objective of this invention is to provide an aerosol generating device that provides a microchannel structure on the atomization surface of a substrate and a heating layer on the other surface of the substrate, thereby transferring the aerosol forming matrix to the atomization surface of the substrate through the capillary force of the microchannel structure, and heating and atomizing the aerosol forming matrix using the heating layer.

[0019] To achieve the above objectives, the technical solution adopted by the present invention is to provide an aerosol generating device, including the atomizing core or the atomizer provided by any of the above solutions.

[0020] Compared with the prior art, one or more technical solutions in the embodiments of the present invention have at least one of the following beneficial effects:

[0021] The atomizing core, atomizer, and aerosol generating device in this embodiment of the invention have an atomizing surface formed on at least one side of the substrate of the atomizing core, a microchannel structure provided on the atomizing surface, and a heating layer provided on the substrate. When the atomizing core is working, the aerosol forming matrix is ​​transported to the atomizing surface of the substrate by the capillary force of the microchannel structure, and then the heating layer heats and atomizes the aerosol forming matrix. This not only overcomes the problems of uneven heating of the aerosol forming matrix and the tendency for the atomizing core to dry-burn in traditional atomizing cores, but also eliminates the need for a liquid-conducting material to adsorb and store the aerosol forming matrix, effectively avoiding the carbonization of the liquid-conducting material due to heat.

[0022] Based on the aforementioned problems in the existing technology, the fourth objective of this invention is to provide an atomizing core processing method. This method employs microfabrication technology to process a microchannel structure on the atomizing surface of a substrate and fabricates a heating layer on the other side of the substrate. The capillary force of the microchannel structure can be used to atomize the aerosol forming matrix substrate. The heating layer can heat and atomize the aerosol forming matrix, thereby improving the uniformity of heating of the aerosol forming matrix.

[0023] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a method for processing an atomizing core, comprising the following steps:

[0024] Substrate fabrication: Fabricating a wafer substrate or glass substrate of a predetermined thickness, and forming an atomizing surface on one side of the wafer substrate or glass substrate for heating and atomizing the aerosol forming matrix;

[0025] Microchannel fabrication: Microchannel structures are fabricated on the atomizing surface using an etching process. The microchannel structures are used to adsorb aerosols to form a matrix and transport the adsorbed aerosols to the atomizing surface.

[0026] Fabrication of the heating layer: A metal thin film is fabricated on the substrate using thin film technology to grow the heating layer on the substrate.

[0027] Optionally, the atomizing core processing method further includes an insulating protective layer processing step prior to the heating layer processing step. The insulating protective layer processing step includes: processing a first insulating protective layer on the other side of the wafer substrate or the glass substrate using a film coating process, wherein the heating layer is grown on the side of the first insulating protective layer opposite to the substrate, so that the first insulating protective layer is disposed between the substrate and the heating layer.

[0028] Optionally, the processing method of the atomizing core further includes: after growing the heating layer on the first insulating protective layer, processing a second insulating protective layer on the side of the heating layer opposite to the first insulating protective layer by a coating process, so that the heating layer is sandwiched between the first insulating protective layer and the second insulating protective layer.

[0029] Optionally, the thickness of the first insulating protective layer is 1 nm to 100 μm.

[0030] Optionally, the thickness of the substrate is 200um to 5000um.

[0031] Optionally, the thickness of the heating layer is 1 nm to 100 μm.

[0032] Compared with the prior art, one or more technical solutions in the embodiments of the present invention have at least one of the following beneficial effects:

[0033] The atomizing core processing method in this invention involves forming an atomizing surface on at least one side of the substrate of the atomizing core, processing a microchannel structure on the atomizing surface using an etching process, and processing a heating layer on the substrate using a thin-film process. When the atomizing core is in operation, the capillary force of the microchannel structure transports the aerosol-forming matrix to the atomizing surface of the substrate, and the heating layer then heats and atomizes the aerosol-forming matrix. This not only overcomes the problems of uneven heating of the aerosol-forming matrix and the tendency for dry burning in traditional atomizing cores, but also eliminates the need for a liquid-conducting material to adsorb and store the aerosol-forming matrix, effectively avoiding the carbonization of the liquid-conducting material due to heat. Furthermore, the atomizing cores manufactured using microfabrication technology have high yield, low cost, and good product consistency, making them suitable for mass production. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 A three-dimensional structural diagram of the atomizing core provided in an embodiment of the present invention;

[0036] Figure 2 This is a top view of the atomizing core provided in an embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram of the substrate structure provided in an embodiment of the present invention;

[0038] Figure 4This is a schematic diagram of a structure in which a first insulating protective layer is deposited on a substrate, as provided in an embodiment of the present invention.

[0039] Figure 5 This is a schematic diagram of the structure of the heating layer grown on the first insulating protective layer provided in an embodiment of the present invention;

[0040] Figure 6 This is a schematic diagram of a structure in which a second insulating protective layer is applied to the heating layer according to an embodiment of the present invention.

[0041] Figure 7 This is a top view of the atomizing core provided in another embodiment of the present invention;

[0042] Figure 8 This is a schematic diagram of a liquid storage device disposed on a microchannel structure according to an embodiment of the present invention.

[0043] The following are the labeling elements in the figure:

[0044] 1-Substrate; 2-Microchannel structure; 3-First insulating protective layer; 4-Heating layer;

[0045] 5-Atomizing surface; 6-Flow channel; 7-Liquid storage component; 8-Second insulating protective layer. Detailed Implementation

[0046] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0047] It should be noted that when a component is referred to as "connected to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0048] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0049] Throughout this specification, reference to "an embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in one embodiment," "in some embodiments," or "in some of these embodiments" appear in various places throughout the specification, and not all refer to the same embodiment. Furthermore, in one or more embodiments, a particular feature, structure, or characteristic may be combined in any suitable manner.

[0050] Please refer to the following: Figures 1 to 2 The atomizing core provided in this embodiment of the invention will now be described. The atomizing core provided in this embodiment of the invention is used in the atomizer of an aerosol generating device. It can be heated under electric drive, heating and atomizing the aerosol forming matrix to form smoke for the user to inhale, achieving a simulated smoking effect. Please refer to the following references. Figure 1 and Figure 2 The atomizing core provided in this embodiment of the invention includes a substrate 1, a microchannel structure 2, and a heating layer 4. At least one side of the substrate 1 has an atomizing surface 5 for heating and atomizing the aerosol-forming matrix. The microchannel structure 2 is disposed on the atomizing surface 5. The aerosol-forming matrix in the liquid storage chamber of the atomizer can be adsorbed into the microchannel structure 2 by capillary force. The aerosol-forming matrix adsorbed into the microchannel structure 2 is then transported to the atomizing surface 5 through the microchannel structure 2. When the heating layer 4 on the substrate 1 is energized, it can heat the aerosol-forming matrix transported to the atomizing surface 5, forming smoke that can be inhaled by the user. Of course, in other embodiments, the aerosol-forming matrix in the liquid storage chamber of the atomizer can be uniformly adsorbed into the microchannel structure 2 by capillary force. The aerosol-forming matrix adsorbed into the microchannel structure 2 is then uniformly diffused, permeated, or penetrated to the atomizing surface 5 through the capillary structure of the substrate 1, allowing the heating layer 4 to uniformly heat the aerosol-forming matrix on the atomizing surface 5. Understandably, the aerosol forming matrix adsorbed into the microchannel structure 2 can also be heated by the heating layer 4 to form smoke, which will flow out through the atomizing surface 5 and with the airflow on the atomizing surface 5. In some embodiments, when the substrate 1 is a glass substrate with insulating and heat-insulating properties, the atomizing surface 5 is disposed on the top surface of the glass substrate, and the heating layer 4 can be directly disposed on the bottom surface of the glass substrate. In this way, the top surface of the substrate 1 (the side of the substrate 1 facing the mouthpiece of the atomizer) has the atomizing surface 5, and the microchannel structure 2 is processed on the atomizing surface 5 by micromachining techniques such as etching. In this way, the aerosol forming matrix in the liquid storage chamber of the atomizer can flow into the microchannel structure 2 from the front or the side, and can be directly transferred to the atomizing surface 5 through the microchannel structure 2, eliminating the need for a liquid guiding material to adsorb and store the aerosol forming matrix.

[0051] The atomizing core provided in this embodiment of the invention, compared with the prior art, has an atomizing surface 5 formed on at least one side of the substrate 1 of the atomizing core, a microchannel structure 2 disposed on the atomizing surface 5, and a heating layer 4 disposed on the substrate 1. When the atomizing core is working, the aerosol forming matrix is ​​transported to the atomizing surface 5 of the substrate 1 by the capillary force of the microchannel structure 2, and then the aerosol forming matrix on the atomizing surface 5 is heated and atomized by the heating layer 4. This not only overcomes the problems of uneven heating of the aerosol forming matrix and easy dry burning of the atomizing core in traditional atomizing cores, but also eliminates the need for a liquid guiding material to adsorb and store the aerosol forming matrix, effectively avoiding the phenomenon of heat carbonization of the liquid guiding material.

[0052] In other embodiments, when the substrate 1 is a conductive glass substrate, wafer substrate, or metal substrate, the atomizing surface 5 is disposed on the top surface of the substrate 1. The atomizing core also includes a first insulating protective layer 3 disposed on the bottom surface of the substrate 1. A heating layer 4 is then disposed on the side of the first insulating protective layer 3 facing away from the substrate 1. The heating layer 4 is indirectly disposed on the bottom surface of the glass substrate through the first insulating protective layer 3, so that the first insulating protective layer 3 is separated from the substrate 1 and the heating layer 4. In this way, the first insulating protective layer 3 can not only serve as insulation, preventing the heating layer 4 from directly contacting the substrate 1 and causing conductivity, but also serve as heat insulation and anti-oxidation, preventing the other side of the substrate 1 from oxidizing under high temperature conditions, thereby enhancing the oxidation resistance of the substrate 1. Understandably, in some embodiments, the first insulating protective layer 3 is coated onto the bottom surface of the substrate 1 (the side of the substrate 1 facing away from the nozzle of the atomizer) using a coating process. The first insulating protective layer 3 can be made of one or more materials selected from silicon nitride, silicon oxide, and silicon carbide, giving it both good insulation and high-temperature resistance and oxidation resistance, as well as good thermal conductivity. Because the first insulating protective layer 3 has good thermal conductivity, the heating layer 4 is disposed on the side of the first insulating protective layer 3 facing away from the substrate 1. The heat generated by the heating layer 4 when energized can be quickly and evenly transferred to the substrate 1 through the first insulating protective layer 3, ensuring that the aerosol forming matrix transferred to the atomizing surface 5 is uniformly heated. This not only overcomes the problems of uneven heating of the aerosol forming matrix and the tendency for the atomizing core to dry-burn in traditional atomizing cores, but also eliminates the need for a liquid-conducting material that adsorbs and stores the aerosol forming matrix, effectively preventing the phenomenon of carbonization of the liquid-conducting material due to heat. Understandably, substrate 1 may be a glass substrate, wafer substrate or metal substrate mentioned in the above embodiments, but substrate 1 may not be limited to a glass substrate, wafer substrate or metal substrate in other embodiments.

[0053] Please refer to the following: Figure 1 and Figure 2In some embodiments, the microchannel structure 2 includes multiple flow channels 6 disposed on the atomizing surface 5, and the multiple flow channels 6 are arranged in an array on the atomizing surface 5. By adopting the above scheme, the microchannel structure 2 includes multiple flow channels 6 disposed on the atomizing surface 5, and arranging the multiple flow channels 6 in an array on the atomizing surface 5, which further enables the aerosol forming matrix to diffuse rapidly and uniformly on the atomizing surface 5, which is beneficial to the uniform heating of the aerosol forming matrix on the atomizing surface 5. In some embodiments, the length of the flow channel 6 is 30-5000 μm, the width of the flow channel 6 is 0.1-1000 μm, and the depth of the flow channel 6 is 0.1-5000 μm.

[0054] Understandably, please refer to the following: Figure 1 and Figure 2 In some embodiments, multiple flow channels 6 may be arranged in a matrix on the atomizing surface 5. Please refer to [reference needed]. Figure 7 In some embodiments, multiple channels 6 may be arranged in a ring array on the atomizing surface 5. In other embodiments, the microchannel structure 2 may be composed of a rectangular arrangement of single microchannels, or a arrangement of single microchannels in arc, rhombus, or other polygonal shapes. The microchannels may be independent of each other or interconnected. The microchannel structure 2 may consist of 1 to 10,000 individual channels, with a length of 30 to 5,000 μm, a width of 0.1 to 1,000 μm, and a depth of 0.1 to 5,000 μm. In other embodiments, the microchannel structure 2 fabricated on the surface of the substrate 1 by etching technology may be replaced by a porous silicon crystal structure fabricated by hydrogen fluoride etching.

[0055] In some embodiments, the heating layer 4 is a metal thin film formed on the first insulating protective layer 3 by a thin-film method, and the thickness of the metal thin film is 1 nm to 100 μm. By adopting the above scheme, forming a metal thin film on the first insulating protective layer 3 by a thin-film method can enhance the bonding strength between the heating layer 4 and the first insulating protective layer 3. The metal thin film can be, but is not limited to, copper, nickel, perlite, aluminum, gold, etc., and can also be other conductive metal oxides or other conductive material thin films.

[0056] Please refer to the following: Figure 6In some embodiments, the atomizing core further includes a second insulating protective layer 8, which is applied to the side of the heating layer 4 facing away from the first insulating protective layer 3. By adopting the above solution, applying the second insulating protective layer 8 to the side of the heating layer 4 facing away from the first insulating protective layer 3 not only protects both sides of the heating layer 4 through the first insulating protective layer 3 and the second insulating protective layer 8 respectively—providing insulation to prevent conductivity and anti-oxidation—but also allows the heat generated on the side of the heating layer 4 facing away from the first insulating protective layer 3 to be quickly and evenly transferred to the first insulating protective layer 3 through the second insulating protective layer 8, preventing heat loss or local accumulation, and ensuring that the aerosol forming matrix on the atomizing surface 5 is heated evenly. Understandably, in some embodiments, the area of ​​the heating layer 4 is smaller than the area of ​​the first insulating protective layer 3, and the heating layer 4 can be, but is not limited to, rectangular, circular, elliptical, arc-shaped, S-shaped, or rhomboid shapes.

[0057] This invention also provides an atomizer, which includes an atomizing core and an atomizer body having an atomizing chamber and a liquid storage chamber inside. The atomizing core is the same as that provided in any of the above embodiments. The atomizing core is disposed in the atomizing chamber, and the microchannel structure 2 can adsorb and diffuse the aerosol matrix in the liquid storage chamber onto the atomizing surface 5. Because the atomizer has all the technical features of the atomizing core provided in any of the above embodiments, it has the same technical effects as the atomizing core.

[0058] Please refer to the following: Figure 8 In some embodiments, the atomizer further includes a liquid storage component 7, which has a liquid storage chamber inside and an outlet (not shown) on the liquid storage component 7 for permeating the aerosol forming matrix in the liquid storage chamber to the microchannel structure 2. Understandably, in other embodiments, the liquid storage component 7 can be disposed on the microchannel structure 2 of the atomizing surface 5, with the outlet positioned at the center of the microchannel structure 2. The aerosol forming matrix in the liquid storage chamber permeates downward through the outlet into the microchannel structure 2, and then flows outwards within the microchannel structure 2 to evenly diffuse the aerosol forming matrix across the entire atomizing surface 5. The aerosol forming matrix diffused on the atomizing surface 5 is heated and atomized by the heat generated by the heating layer 4, and the atomized smoke flows out from the front of the microchannel structure 2. Understandably, in some other embodiments, the aerosol forming matrix in the storage chamber can also seep into the microchannel structure 2 from both sides through the outlet, and then flow into the microchannel structure 2 under the capillary action of the microchannel structure 2, so as to evenly diffuse the aerosol forming matrix to the entire atomizing surface 5. The aerosol forming matrix diffused on the atomizing surface 5 is heated and atomized by the heat generated by the heating layer 4, and the smoke formed by atomization flows out from the front of the microchannel structure 2.

[0059] This invention also provides an aerosol generating device, which includes the atomizing core or the atomizer provided in any of the above embodiments. Because the aerosol generating device possesses all the technical features of the atomizing core or atomizer provided in any of the above embodiments, it has the same technical effects as the atomizing core.

[0060] This invention also provides a method for processing an atomizing core, comprising the following steps:

[0061] Substrate 1 fabrication: Please refer to the following: Figure 3 A wafer substrate or glass substrate of a predetermined thickness is fabricated. The thickness of substrate 1 is 200um to 5000um. An atomization surface 5 for heating and atomizing the aerosol formation matrix is ​​formed on one side of the wafer substrate or glass substrate. Understandably, the wafer substrate can be a common crystalline silicon wafer, a low-resistivity silicon wafer doped with boron, phosphorus, or other ions, or a silicon-on-insulator (SOI) wafer.

[0062] WeChat channel creation: Please refer to the following: Figure 6 Microchannel structures 2 are fabricated on the atomizing surface 5 using an etching process. These microchannel structures 2 adsorb aerosol-forming matrix and uniformly diffuse the adsorbed aerosol-forming matrix onto the atomizing surface 5. Understandably, the microchannel structure 2 includes multiple channels 6 disposed on the atomizing surface 5. These channels 6 are arranged in an array on the atomizing surface 5, further enabling the aerosol-forming matrix to diffuse rapidly and uniformly onto the atomizing surface 5, which is beneficial for uniform heating of the aerosol-forming matrix on the atomizing surface 5. In some embodiments, the length of the channels 6 is 30–5000 μm, the width of the channels 6 is 0.1–1000 μm, and the depth of the channels 6 is 0.1–5000 μm. The fabrication process of the microchannel structure 2 can be dry etching, wet etching, or other processes used in bulk silicon semiconductor fabrication, or sandblasting processes used in glass etching. Understandably, in some embodiments, the multiple channels 6 can be arranged in a matrix on the atomizing surface 5. In other embodiments, multiple channels 6 may be arranged in a ring array on the atomizing surface 5. In other embodiments, the microchannel structure 2 may be composed of a rectangular arrangement of single microchannels, or a arrangement of single microchannels in arc, rhombus, or other polygonal shapes. The microchannels may be independent of each other or interconnected. The microchannel structure 2 may consist of 1 to 10,000 individual channels, with a length of 30 to 5,000 μm, a width of 0.1 to 1,000 μm, and a depth of 0.1 to 5,000 μm. In other embodiments, the microchannel structure 2 fabricated on the surface of the substrate 1 by etching technology may be replaced by a porous silicon crystal structure fabricated by hydrogen fluoride etching.

[0063] Fabrication of heating layer 4: Please refer to the following: Figure 5 A metal thin film is fabricated on substrate 1 using thin film processing technology to grow a heating layer 4 on substrate 1. The thickness of heating layer 4 is 1 nm to 100 μm. Substrate 1 can be, but is not limited to, a glass substrate, and the metal thin film can be, but is not limited to, copper, nickel, perlite, aluminum, gold, or other metal thin films. The metal thin film can also be other conductive metal oxides or other conductive material thin films.

[0064] The atomizing core processing method provided in this invention, compared with the prior art, involves forming an atomizing surface 5 on at least one side of the substrate 1 of the atomizing core, processing a microchannel structure 2 on the atomizing surface 5 using an etching process, and processing a heating layer 4 on the substrate 1 using a thin-film process. When the atomizing core is working, the aerosol forming matrix is ​​transported to the atomizing surface 5 of the substrate 1 by the capillary force of the microchannel structure 2. The heating layer 4 then heats and atomizes the aerosol forming matrix transported to the atomizing surface 5. This not only overcomes the problems of uneven heating of the aerosol forming matrix and the tendency for dry burning in traditional atomizing cores, but also eliminates the need for a liquid-conducting material to adsorb and store the aerosol forming matrix, effectively avoiding the carbonization of the liquid-conducting material due to heat. Furthermore, the atomizing core manufactured using microfabrication technology has a high yield, low cost, and good product consistency, making it suitable for mass production.

[0065] Please refer to the following: Figure 4 , Figure 5 and Figure 6 In some embodiments, the atomizing core processing method provided by the present invention further includes the fabrication of an insulating protective layer: please refer to [reference needed]. Figure 4 On the other side of the wafer substrate or metal substrate, a first insulating protective layer 3 is fabricated using a coating process. The thickness of the first insulating protective layer 3 is 1 nm to 100 μm. Understandably, in some embodiments, the first insulating protective layer 3 may be made of one or more materials selected from silicon nitride, silicon oxide, and silicon carbide, giving it both good insulation and high-temperature oxidation resistance, as well as good thermal conductivity. Due to the good thermal conductivity of the first insulating protective layer 3, the heat-generating layer 4 is disposed on the side of the first insulating protective layer 3 facing away from the substrate 1. The heat generated by the heat-generating layer 4 when energized can be quickly and uniformly transferred to the substrate 1 through the first insulating protective layer 3, ensuring uniform heating of the aerosol-forming matrix transferred to the atomization surface 5. In other embodiments, the first insulating protective layer 3 may also be other chemically stable electrically insulating materials suitable for semiconductor long-film processes.

[0066] Please refer to the following: Figure 6In some embodiments, the atomizing core processing method provided by the present invention further includes: after growing a heating layer 4 on a first insulating protective layer 3, a second insulating protective layer 8 is processed on the side of the heating layer 4 facing away from the first insulating protective layer 3 through a coating process, so that the heating layer 4 is sandwiched between the first insulating protective layer 3 and the second insulating protective layer 8, and the thickness of the first insulating protective layer 3 is 1nm to 100um. In this way, the first insulating protective layer 3 and the second insulating protective layer 8 can protect both sides of the heating layer 4 respectively, providing insulation to prevent conductivity and anti-oxidation. At the same time, the heat generated on the side of the heating layer 4 facing away from the first insulating protective layer 3 can also be quickly and evenly transferred to the first insulating protective layer 3 through the second insulating protective layer 8, avoiding heat loss or local accumulation, and further ensuring that the aerosol forming matrix on the atomizing surface 5 can be heated evenly. Understandably, in some embodiments, the second insulating protective layer 8 may be made of one or more materials selected from silicon nitride, silicon oxide, and silicon carbide, so that the second insulating protective layer 8 has both good insulation and high-temperature oxidation resistance, as well as good thermal conductivity. In other embodiments, the second insulating protective layer 8 may also be other chemically stable electrically insulating materials that conform to semiconductor long film technology.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An atomizing core, characterized in that, include: The substrate has at least one atomizing surface for heating and atomizing the aerosol forming matrix; A microchannel structure is disposed on the atomizing surface to adsorb aerosol forming matrix and to transport the adsorbed aerosol forming matrix to the atomizing surface; as well as A heating layer, disposed on the substrate, is used to heat the aerosol forming matrix; Wherein, the substrate is a wafer substrate or a glass substrate, the atomization surface is disposed on the top surface of the wafer substrate or the glass substrate, and the heating layer is disposed on the bottom surface of the wafer substrate or the glass substrate; The microchannel structure includes multiple flow channels disposed on the atomizing surface, and the multiple flow channels are arranged in an array on the atomizing surface; The atomizing core further includes a first insulating protective layer disposed between the substrate and the heating layer, the first insulating protective layer being disposed on the other side of the substrate, and the heating layer being disposed on the side of the first insulating protective layer facing away from the substrate; The heating layer is a metal thin film formed on the first insulating protective layer by means of a thin film.

2. The atomizing core as described in claim 1, characterized in that, Multiple flow channels are arranged in a matrix on the atomizing surface; or, multiple flow channels are arranged in a ring array on the atomizing surface.

3. The atomizing core as described in claim 1, characterized in that, The length of the flow channel is 30~5000um, the width of the flow channel is 0.1~1000um, and the depth of the flow channel is 0.1~5000um.

4. The atomizing core as described in claim 1, characterized in that, The atomizing core also includes a second insulating protective layer, which is applied to the side of the heating layer opposite to the first insulating protective layer.

5. An atomizer, comprising an atomizing core and an atomizer body having an atomizing chamber and a liquid storage chamber inside, characterized in that, The atomizing core is the atomizing core as described in any one of claims 1 to 4, the atomizing core is disposed in the atomizing cavity, and the microchannel structure can transport the aerosol forming matrix in the liquid storage cavity to the atomizing surface.

6. The atomizer as described in claim 5, characterized in that, The atomizer also includes a liquid storage component, which has a liquid storage chamber inside and an outlet on the liquid storage component for permeating the aerosol matrix in the liquid storage chamber to the microchannel structure.

7. An aerosol generating device, characterized in that, Includes the atomizing core as described in any one of claims 1 to 4 or the atomizer as described in claim 5.

8. A method for processing an atomizing core, characterized in that, Includes the following steps: Substrate fabrication: Fabricating a wafer substrate or glass substrate of a predetermined thickness, and forming an atomizing surface on one side of the wafer substrate or glass substrate for heating and atomizing the aerosol forming matrix; Microchannel fabrication: Microchannel structures are fabricated on the atomizing surface using an etching process. The microchannel structures are used to adsorb aerosols to form a matrix and transport the adsorbed aerosols to the atomizing surface. Fabrication of the heating layer: A metal thin film is fabricated on the substrate using thin-film processing technology to grow the heating layer on the substrate. The atomizing core processing method further includes an insulating protective layer processing step prior to the heating layer processing step. The insulating protective layer processing step includes: processing a first insulating protective layer on the other side of the wafer substrate or the glass substrate using a film coating process, and growing the heating layer on the side of the first insulating protective layer facing away from the substrate, so that the first insulating protective layer is disposed between the substrate and the heating layer. The processing method of the atomizing core further includes: after growing the heating layer on the first insulating protective layer, processing a second insulating protective layer on the side of the heating layer away from the first insulating protective layer by a film coating process, so that the heating layer is sandwiched between the first insulating protective layer and the second insulating protective layer.

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