真空吸附系统

By controlling the vacuum pressure of the vacuum adsorption system with a cylinder and a vacuum pressure control device, the problem of uncontrollable contact force when the vacuum nozzle picks up electronic devices is solved, thus protecting the electronic devices and preventing damage.

CN115704417BActive Publication Date: 2026-07-17TYCO ELECTRONICS (SHANGHAI) CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TYCO ELECTRONICS (SHANGHAI) CO LTD
Filing Date
2021-08-06
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing vacuum nozzles cannot effectively control the contact force when picking up electronic devices, which can easily lead to damage to the electronic devices.

Method used

By employing a cylinder and a vacuum pressure control device, the vacuum pressure inside the cylinder is controlled to ensure that the contact force applied by the piston rod when adsorbing an object is not greater than the predetermined contact force, and can even be controlled to zero.

Benefits of technology

This effectively prevents damage to electronic devices during the adsorption process, especially high-precision chips, ensuring that the contact force is within the allowable range and protecting the integrity of the electronic devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明公开一种真空吸附系统，包括：气缸，包括缸体和安装在所述缸体中的活塞和活塞杆；和真空压力控制装置，用于控制所述缸体的内腔中的真空压力。在所述活塞杆上形成有用于吸附物体的真空吸孔，所述真空吸孔与所述内腔连通；所述真空压力控制装置适于通过控制所述内腔中的真空压力，使得所述活塞杆在吸附所述物体时施加在所述物体上的接触力不大于预定接触力。因此，本发明能够避免物体因遭受过大接触力而受损。
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