Device and method for automatic sandpaper replacement during sanding
Patent Information
- Application Number
- CN202211336122.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-28
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2042-10-28
AI Technical Summary
[0017] This invention provides an automatic sandpaper replacement device for grinding. A positioning mechanism is installed in the hopper, which contains at least one piece of sandpaper. The positioning mechanism positions the target grinding disc in the grinding unit aligned with the hopper opening. A pushing mechanism pushes the sandpaper in the hopper to adhere to the target grinding disc, resulting in a properly fitted grinding disc. Simultaneously, a detection system checks whether the sandpaper on the fitted target grinding disc is properly attached. During sandpaper replacement in the grinding head, the grinding disc is positioned above the sandpaper in the hopper, aligned with the sandpaper at the hopper opening. The sandpaper is then pushed closer to the grinding disc, attaching it to the disc. The device detects the adhered sandpaper and supplies the properly fitted grinding disc to the processed product. This allows for the automatic and successful attachment of a large number of pieces of sandpaper to the grinding disc, increasing the speed of sandpaper replacement, improving processing efficiency, and reducing manpower consumption. This achieves the technical effect of increasing the speed of sandpaper replacement, improving processing efficiency, and reducing the manpower required.
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Figure CN115709431B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of mechanical processing equipment technology, and specifically relates to a device and method for automatically changing sandpaper during grinding. Background Technology
[0002] Grinding is widely used in the processing of mechanical parts. After the mechanical parts are processed, sandpaper is used to grind the surface of the parts in order to reduce the roughness of the surface and improve the smoothness of the surface.
[0003] Currently, in existing machining equipment technology, the usual procedure is to manually remove the used sandpaper from the grinding head before polishing the machine parts. Then, new sandpaper is manually applied to the grinding head, relying on experience to check if the new sandpaper is correctly attached. Only after the new sandpaper is properly attached can normal processing begin, using the newly attached sandpaper to polish the product. However, manually attaching sandpaper to the grinding head involves a large quantity of sandpaper, with inconsistent sizes, requiring frequent sandpaper changes. Manually attaching sandpaper is labor-intensive, slow, prone to misalignment, and reduces processing efficiency.
[0004] In summary, existing machining equipment technology suffers from technical problems such as slow sandpaper replacement speed, low processing efficiency, and high manpower requirements. Summary of the Invention
[0005] The technical problem to be solved by this invention is that the speed of changing sandpaper is slow, the processing efficiency is low, and a lot of manpower is required.
[0006] To solve the above-mentioned technical problems, the present invention provides an automatic sandpaper replacement device for grinding. The device includes: a hopper for accommodating at least one piece of sandpaper, a positioning mechanism installed in the hopper, a grinding component having at least one target grinding disc, a pushing mechanism, and a detection system. The positioning mechanism is used to position the target grinding disc so that the target grinding disc is aligned with the opening of the hopper; the pushing mechanism is used to push the sandpaper in the hopper to adhere to the target grinding disc; and the detection system is used to detect whether the target grinding disc and the sandpaper have been properly adhered.
[0007] Furthermore, the positioning mechanism includes: a positioning block disposed at the opening of the chamber, the positioning block being arc-shaped to match the target grinding disc, the positioning block being able to block the target grinding disc.
[0008] Furthermore, the positioning mechanism also includes: a fixing block and a groove disposed in the opening of the compartment, the fixing block being installed in the groove, and one end of the fixing block extending into the opening of the compartment contacting the sandpaper.
[0009] Furthermore, the pushing mechanism includes: a first cylinder, a support plate movably disposed within the hopper, a push rod, two buffers, and a support base. The first cylinder is fixed to the support base. One end of the push rod is connected to the first cylinder, and the other end of the push rod passes through the support plate and contacts the sandpaper. The push rod is located between the two buffers. One end of the buffer is connected to the support plate, and the other end of the buffer is connected to the support base.
[0010] Furthermore, the pushing mechanism also includes a support column, one end of which is fixedly connected to the support base, and the other end of which is fixedly connected to the hopper.
[0011] Furthermore, at least one observation window is provided in the silo, and the observation window extends along the height direction of the silo.
[0012] Furthermore, the device also includes a moving mechanism and a disengaging mechanism, wherein the moving mechanism can move the grinding component to the sandpaper clamping area; and the disengaging mechanism is used to tear off the sandpaper on the target grinding disc in the grinding component located in the sandpaper clamping area, so as to separate the sandpaper on the target grinding disc.
[0013] Furthermore, the detachment mechanism includes: a fixed bracket, a second cylinder, and a gripper. The fixed bracket can support the second cylinder, and the second cylinder drives the gripper to tear off the sandpaper on the target grinding disc located in the sandpaper clamping area. The detection system is installed on the fixed bracket.
[0014] According to another aspect of the present invention, the present invention also provides a method for automatically changing sandpaper during polishing, the method comprising: step S1, positioning a target grinding disc aligned with the opening of the hopper; step S2, pushing the sandpaper in the hopper to adhere to the target grinding disc to obtain a adhered grinding disc; step S3, moving the adhered grinding disc to a detection area to detect whether the sandpaper on the adhered grinding disc is properly adhered; step S4, if yes, rotating the next grinding disc to the position of the adhered grinding disc, and using the next grinding disc as the target grinding disc; step S5, moving the target grinding disc to the sandpaper clamping area to tear off the sandpaper on the target grinding disc; step S6, moving the target grinding disc after tearing off the sandpaper to the detection area to detect whether the sandpaper on the target grinding disc has been successfully detached; step S7, if yes, executing steps S1 to S4; step S8, if no, executing steps S5 to S6.
[0015] Furthermore, moving the bonded grinding disc to the detection area to detect whether the sandpaper on the bonded grinding disc has been properly bonded includes: performing laser scanning on the edge of the grinding disc using a detection system to obtain scanning information; comparing the obtained scanning information with preset edge information to determine whether the sandpaper on the grinding disc has been properly bonded.
[0016] Beneficial effects:
[0017] This invention provides an automatic sandpaper replacement device for grinding. A positioning mechanism is installed in the hopper, which contains at least one piece of sandpaper. The positioning mechanism positions the target grinding disc in the grinding unit aligned with the hopper opening. A pushing mechanism pushes the sandpaper in the hopper to adhere to the target grinding disc, resulting in a properly fitted grinding disc. Simultaneously, a detection system checks whether the sandpaper on the fitted target grinding disc is properly attached. During sandpaper replacement in the grinding head, the grinding disc is positioned above the sandpaper in the hopper, aligned with the sandpaper at the hopper opening. The sandpaper is then pushed closer to the grinding disc, attaching it to the disc. The device detects the adhered sandpaper and supplies the properly fitted grinding disc to the processed product. This allows for the automatic and successful attachment of a large number of pieces of sandpaper to the grinding disc, increasing the speed of sandpaper replacement, improving processing efficiency, and reducing manpower consumption. This achieves the technical effect of increasing the speed of sandpaper replacement, improving processing efficiency, and reducing the manpower required. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A schematic diagram of an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 1 ;
[0020] Figure 2 A schematic diagram of an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 2 ;
[0021] Figure 3 A schematic diagram of the hopper in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 1 ;
[0022] Figure 4 A schematic diagram of the hopper in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 2;
[0023] Figure 5 A schematic diagram of the hopper in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 3 ;
[0024] Figure 6 A schematic diagram of a fixing block in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 1 ;
[0025] Figure 7 A schematic diagram of a fixing block in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 2 ;
[0026] Figure 8 A flowchart of a method for automatically changing sandpaper during polishing, provided as an embodiment of the present invention;
[0027] The meanings of the labels in the attached diagram are as follows: 1—hopper, 11—hopper opening, 111—groove, 12—observation window;
[0028] 2—Positioning mechanism, 21—Positioning block, 22—Fixed block, 22a—Through groove, 22b—Moving end;
[0029] 3—Pushing mechanism, 31—First cylinder, 32—Support plate, 33—Push rod, 34—Buffer, 35—Support seat, 36—Support column. Detailed Implementation
[0030] This invention discloses an automatic sandpaper replacement device. A positioning mechanism 2 is installed in a hopper 1, which contains at least one piece of sandpaper. The positioning mechanism 2 positions the target grinding disc in the grinding component to align with the opening 11 of the hopper 1. A pushing mechanism 3 pushes the sandpaper in the hopper 1 to adhere to the target grinding disc, resulting in a properly adhered grinding disc. Simultaneously, a detection system checks whether the sandpaper on the adhered target grinding disc is properly attached. Thus, during sandpaper replacement in the grinding head, the grinding disc is positioned above the sandpaper in the hopper 1, aligned with the sandpaper at the opening 11. The sandpaper is then pushed closer to the grinding disc, attaching it to the disc. The device detects the adhered sandpaper and supplies the properly adhered grinding disc to the processed product. This enables the automatic and successful attachment of a large number of pieces of sandpaper to the grinding disc, increasing the speed of sandpaper replacement, improving processing efficiency, and reducing manpower consumption. This achieves the technical effect of increasing the speed of sandpaper replacement, improving processing efficiency, and reducing the manpower required.
[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art are within the scope of protection of the present invention. The keyword "and / or" involved in this embodiment indicates two situations: and or. In other words, A and / or B mentioned in the embodiments of the present invention indicates two situations: A and B, or A or B. It describes three states of A and B. For example, A and / or B means: only A is included but not B; only B is included but not A; and A and B are included.
[0032] It should be understood that while the terms “first,” “second,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or segment from another. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion. Spatially related terms, such as “below,” “above,” etc., may be used herein to facilitate the description of the relationship between one element or feature and another element or feature. It is understood that, in addition to the orientations shown in the figures, spatially related terms also include different orientations of the device in use or operation. For example, if the device in the figures is flipped, then an element or feature described as “below” will be oriented to be “above” other elements or features. Therefore, the exemplary term “below” may include both above and below orientations. The device may be oriented (rotated 90 degrees or in other orientations), and the spatially related descriptors used herein are interpreted accordingly.
[0033] In this embodiment of the invention, when a component is described as "fixed to" another component, it can be directly on the other component or an intermediate component may be present. When a component is considered to be "connected to" another component, it can be directly connected to the other component or an intermediate component may be present. When a component is considered to be "set on" another component, it can be directly set on the other component or an intermediate component may be present. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this embodiment of the invention are for illustrative purposes only and are not intended to limit the invention.
[0034] Example 1
[0035] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 , Figure 1 This is a schematic diagram of an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 1 , Figure 2 This is a schematic diagram of an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 2 , Figure 3 This is a schematic diagram of the material hopper 1 in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 1 , Figure 4 This is a schematic diagram of the material hopper 1 in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 2 , Figure 5 This is a schematic diagram of the material hopper 1 in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 3 , Figure 6 This is a schematic diagram of the fixing block 22 in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 1 ; Figure 7 This is a schematic diagram of the fixing block 22 in an automatic sandpaper changing device provided in an embodiment of the present invention. Figure 2 The present invention provides an automatic sandpaper replacement device, comprising a hopper 1 for accommodating at least one sandpaper, a positioning mechanism 2 installed in the hopper 1, a grinding component having at least one target grinding disc, a pushing mechanism 3, and a detection system. The hopper 1 for accommodating at least one sandpaper, the positioning mechanism 2 installed in the hopper 1, the grinding component having at least one target grinding disc, the pushing mechanism 3, and the detection system will now be described in detail:
[0036] For a hopper 1 having a container for at least one piece of sandpaper and a positioning mechanism 2 installed on the hopper 1:
[0037] At least one observation window 12 is provided on the hopper 1, and the observation window 12 extends along the height direction of the hopper 1. A positioning mechanism 2 is used to position the target grinding disc so that it aligns with the opening 11 of the hopper 1. The positioning mechanism 2 includes a positioning block 21 installed on the opening 11 and a fixing block 22 installed in a groove 111 in the opening 11. The number of grooves 111 is the same as the number of fixing blocks 22, and the grooves 111 are evenly spaced, so the fixing blocks 22 are also evenly spaced. The positioning block 21 is arc-shaped to match the target grinding disc and can resist the target grinding disc; the fixing blocks 22 are evenly spaced, and one end of each fixing block 22 extending into the opening 11 contacts the sandpaper. Figure 7As shown, the movable end 22b of the opening 11 extends into the interior of the opening 11 and contacts the sandpaper. At least one fixed block 22 can be provided between the positioning block 21 and the opening 11.
[0038] Specifically, the hopper 1 has a space inside to accommodate at least one piece of sandpaper. The hopper 1 can be a cylindrical opening slot that matches the sandpaper, allowing the sandpaper to be stacked neatly. The edge of the opening of the cylindrical opening slot is the hopper opening 11 of the hopper 1, which can be circular. Multiple pieces of sandpaper can be placed inside the cylindrical opening slot. Multiple pieces of sandpaper can refer to one, two, three, four, etc., stacked sequentially along the bottom of the hopper 1 towards the opening. The sandpaper can be in the shape of a disc. The diameter of the hopper 1 with the cylindrical opening slot is slightly larger than the diameter of the sandpaper, allowing the sandpaper to move freely up and down inside the hopper 1. At least one observation window 12 is provided on the side wall of the hopper 1. The observation window 12 can be used to display the remaining amount of sandpaper inside the hopper 1 in real time, so as to replenish the hopper 1 with new sandpaper in a timely manner.
[0039] Additionally, the target grinding disc can refer to a grinding disc that requires sandpaper replacement, such as when sandpaper needs to be attached to the target grinding disc. The positioning block 21 in the positioning mechanism 2 can be arc-shaped, meaning the positioning block 21 has a concave arc shape forming towards the center of the hopper opening 11. When the target grinding disc is moved above the hopper opening 11 by the robotic arm, and continues to move horizontally until it is tightly fitted with the positioning block 21, the positioning block 21 will block one side of the target grinding disc in the horizontal direction, ensuring the target grinding disc is aligned with the hopper opening 11. Multiple fixing blocks 22 are installed at equal intervals on the hopper opening 11, ensuring more even force distribution on the sandpaper. A strip-shaped through groove 22a can be formed in the middle of the fixing block 22. A bolt passes through the through groove 22a and is threadedly connected to the hopper opening 11 to lock the fixing block 22 in place and adjust its position. This allows for adjustment of the length of the end of the fixing block 22 extending into the hopper opening 11, accommodating different sizes of sandpaper and limiting its movement. A ramp and a horizontal blocking surface connected to the ramp are provided on the side of the fixing block 22 extending into the hopper opening 11 near the sandpaper. The ramp guides the sandpaper onto the horizontal blocking surface, which then blocks the edges of the sandpaper. During the descent of the push rod 33, the elastic force in the buffer 34 pushes the support plate 32 upwards, lifting the sandpaper. At this time, multiple fixing blocks 22 block the edges of the sandpaper from all sides, ensuring the sandpaper remains inside the hopper 1 and does not overflow from the hopper opening 11. Meanwhile, as the push rod 33 rises, it pushes the sandpaper out of the multiple fixed blocks 22, so that the sandpaper is located outside the hopper 1 and can move with the target grinding disc.
[0040] For the grinding component, the feeding mechanism 3, and the detection system having at least one target grinding disc:
[0041] The pushing mechanism 3 is used to push the sandpaper in the hopper 1 to adhere to the target grinding disc, thereby obtaining a properly adhered grinding disc. The pushing mechanism 3 includes a first cylinder 31, a support plate 32 movably disposed inside the hopper 1, a push rod 33, two buffers 34, a support base 35, and a support column 36. One end of the push rod 33 is connected to the first cylinder 31, and the other end of the push rod 33 passes through the support plate 32 and contacts the sandpaper. The push rod 33 is located between the two buffers 34, and one end of each buffer 34 is connected to the support plate 32. The first cylinder 31 is fixed to the support base 35, and the support base 35 is connected to the other end of the buffer 34. One end of the support column 36 is fixedly connected to the support base 35, and the other end of the support column 36 is fixedly connected to the hopper 1. The detection system can be used to detect whether the sandpaper on the adhered grinding disc has been properly adhered.
[0042] Specifically, the support base 35 supports the first cylinder 31. After the first cylinder 31 is installed on the support base 35, it can drive the push rod 33 to move up and down. The support plate 32 has a through hole through which the push rod 33 can pass. The diameter of the through hole is smaller than the diameter of the sandpaper. After the push rod 33 passes through the support plate 32, it will contact the sandpaper and lift it up. When the first cylinder 31 drives the push rod 33 to move upward, the upward-moving push rod 33 will push the sandpaper towards the opening 11, so that the sandpaper fits tightly against the grinding disc and adheres it to the grinding disc. When the first cylinder 31 drives the push rod 33 to move downward, the downward-moving push rod 33 will move away from the opening 11. The sandpaper will also move away from the opening 11 under its own weight. However, at this time, the buffer 34 will lift the support plate 32 upward, so that the sandpaper contacts the multiple fixing blocks 22. The buffer 34 can be a spring, which constantly pushes the sandpaper upwards to keep it flat, ensuring close contact between the grinding disc and the sandpaper surface and improving the accuracy of the contact. Simultaneously, as the sandpaper inside the hopper 1 is consumed, the buffer 34 constantly pushes it upwards, reshaping bent sandpaper into flat pieces, thus achieving sandpaper reshaping. Multiple support columns 36 can fix the hopper 1 to the support base 35, which provides support for the hopper 1.
[0043] It is important to note that the grinding components may include multiple grinding discs and a robotic arm for rotating and mounting these discs. The robotic arm can move and rotate the multiple grinding discs. For example, the first grinding disc that needs to be replaced or fitted with sandpaper can be rotated to face the disengagement mechanism, and this disc can be designated as the target grinding disc. If the first grinding disc does not have sandpaper fitted, the robotic arm can move it above the hopper opening 11. After the positioning mechanism 2 positions the first grinding disc aligned with the hopper opening 11, the sandpaper in the hopper 1 is pushed to fit against the first grinding disc, resulting in a fitted first grinding disc. The fitted first grinding disc is then moved to the inspection area to check whether the sandpaper on the fitted first grinding disc has been properly fitted. If so, the second grinding disc on the robotic arm is rotated to the position of the first grinding disc after it has been properly bonded. The robotic arm then moves the second grinding disc above the hopper opening 11. After the positioning mechanism 2 positions the second grinding disc aligned with the hopper opening 11, the sandpaper in the hopper 1 is pushed to bond with the second grinding disc, resulting in a bonded second grinding disc. The bonded second grinding disc is then moved to the detection area to check if the sandpaper on the bonded second grinding disc is properly bonded. Alternatively, if sandpaper is already bonded to the first grinding disc, the robotic arm can move the first grinding disc to the position of the gripper connected to the second cylinder in the disengagement mechanism. The second cylinder then drives the gripper to tear the sandpaper off the first grinding disc, separating the sandpaper from the first grinding disc. The first grinding disc after the sandpaper has been removed is then moved to the detection area to check if the sandpaper on the target grinding disc has been successfully detached. If detachment is successful, the robotic arm moves the first grinding disc above the hopper opening 11. After the positioning mechanism 2 positions the first grinding disc aligned with the hopper opening 11, the sandpaper in the hopper 1 is pushed to adhere to the first grinding disc, resulting in a properly adhered first grinding disc. The adhered first grinding disc is then moved to the detection area to check if the sandpaper on it is properly adhered, thus allowing for the replacement of the sandpaper on the first grinding disc. If so, the second grinding disc on the robotic arm is rotated to the position of the properly adhered first grinding disc. The replacement of the sandpaper on the second grinding disc is performed in the same way as the first grinding disc, and will not be repeated here.
[0044] It is worth mentioning that the detection system can use a sandpaper detection lens. Since the diameter of sandpaper is larger than that of the grinding disc, the sandpaper detection lens can perform laser scanning on the edge of the grinding disc. By pre-setting the edge information of the grinding disc, which can refer to the numerical value of the edge size of the grinding disc without sandpaper attached (hereinafter referred to as value A), and then obtaining the scanning information obtained after laser scanning the edge of the grinding disc, which can refer to the numerical value of the edge size of the grinding disc at this time (hereinafter referred to as value B), if B is equal to A, it is determined that the sandpaper has not been completely attached to the grinding disc at this time. If B is greater than A, it is determined that the sandpaper has been completely attached to the grinding disc at this time.
[0045] The automatic sandpaper replacement device provided in Embodiment 1 of the present invention further includes a moving mechanism and a disengaging mechanism. The moving mechanism can move the sanding component to the sandpaper clamping area, which is the area near the gripper. After the sanding component moves to the sandpaper clamping area, the gripper can separate the target grinding disc in the sanding component from the sandpaper on the target grinding disc within the sandpaper clamping area. The disengaging mechanism is used to tear off the sandpaper on the target grinding disc in the sanding component within the sandpaper clamping area, thereby separating the sandpaper on the target grinding disc. The disengaging mechanism includes a fixed bracket, a second cylinder, and grippers. The fixed bracket supports the second cylinder, which drives the gripper to tear off the sandpaper on the target grinding disc within the sandpaper clamping area. The detection system is mounted on the fixed bracket.
[0046] Specifically, the moving mechanism can refer to a robotic arm, and the fixed support is configured to provide support for the second cylinder, grippers, and detection system. The second cylinder is fixedly mounted on the fixed support. The second cylinder drives the grippers to clamp the sandpaper attached to the grinding wheel, and then the movement of the grippers driven by the second cylinder peels the sandpaper off the grinding wheel. When the grinding wheel with sandpaper attached approaches the grippers, the second cylinder drives the grippers to clamp the edge of the sandpaper, and then the relative movement between the robotic arm and the grippers peels the sandpaper off the grinding wheel, causing the sandpaper to detach from the grinding wheel.
[0047] This invention provides an automatic sandpaper replacement device. A positioning mechanism 2 is installed in a hopper 1, which contains at least one piece of sandpaper. The positioning mechanism 2 positions the target grinding disc in the grinding component to align with the opening 11 of the hopper 1. A pushing mechanism 3 pushes the sandpaper in the hopper 1 to adhere to the target grinding disc, resulting in a properly adhered grinding disc. Simultaneously, a detection system checks whether the sandpaper on the adhered target grinding disc is properly attached. Thus, during sandpaper replacement in the grinding head, the grinding disc is positioned above the sandpaper in the hopper 1, aligned with the sandpaper at the opening 11. The sandpaper is then pushed closer to the grinding disc, attaching it to the disc. The adhered sandpaper is detected, and the properly adhered grinding disc is supplied to the processed product. This allows for the automatic and successful attachment of a large number of pieces of sandpaper to the grinding disc, increasing the speed of sandpaper replacement, improving processing efficiency, and reducing manpower consumption. This achieves the technical effect of increasing the speed of sandpaper replacement, improving processing efficiency, and reducing the manpower required.
[0048] To provide a detailed description of the automatic sandpaper replacement method for sanding provided by the present invention, the above embodiment 1 provides a detailed description of an automatic sandpaper replacement device for sanding. Based on the same inventive concept, this application also provides an automatic sandpaper replacement method for sanding, as detailed in embodiment 2.
[0049] Example 2
[0050] Please see Figure 8 , Figure 8This is a flowchart of a method for automatically changing sandpaper during sanding, provided by an embodiment of the present invention. Embodiment two of the present invention provides a method for automatically changing sandpaper during sanding, including step S1: positioning the target sanding disc aligned with the hopper opening 11; step S2: pushing the sandpaper in the hopper 1 to adhere to the target sanding disc, thereby obtaining a adhered sanding disc; step S3: moving the adhered sanding disc to a detection area to detect whether the sandpaper on the adhered sanding disc is properly adhered; step S4: if yes, rotating the next sanding disc to the position of the adhered sanding disc, and using the next sanding disc as the target sanding disc. Embodiment two of the present invention also provides a method for automatically changing sandpaper during sanding, further including: step S5: moving the target sanding disc to the sandpaper clamping area to tear off the sandpaper on the target sanding disc; step S6: moving the target sanding disc after tearing off the sandpaper to a detection area to detect whether the sandpaper on the target sanding disc has been successfully detached; step S7: if yes, executing steps S1 to S4; step S8: if no, executing steps S5 to S6. The step of moving the matted grinding disc to the detection area to detect whether the sandpaper on the matted grinding disc has been properly matted includes: performing laser scanning on the edge of the grinding disc using a detection system to obtain scanning information; comparing the obtained scanning information with preset edge information to determine whether the sandpaper on the grinding disc has been properly matted.
[0051] This invention provides a method for automatically changing sandpaper during grinding. The method involves positioning a target grinding disc aligned with the opening 11 of the storage compartment; pushing the sandpaper in the storage compartment 1 to adhere to the target grinding disc; moving the adhered grinding disc to a detection area to check if the sandpaper on the adhered grinding disc is properly adhered; if so, rotating the next grinding disc to the position of the adhered grinding disc and using this next grinding disc as the target grinding disc. In this way, during the sandpaper replacement process, the grinding disc is positioned above the sandpaper in the storage compartment 1, aligned with the sandpaper at the opening 11, and then the sandpaper is pushed towards the grinding disc to adhere it. Simultaneously, the adhered sandpaper on the grinding disc is checked, and the grinding disc with properly adhered sandpaper is supplied for use in the processed products. This method enables the automatic and successful attachment of a large number of sandpapers to the grinding disc, increasing the speed of sandpaper replacement, improving processing efficiency, and reducing manpower consumption. This achieves the technical effect of increasing the speed of sandpaper replacement, improving processing efficiency, and reducing the manpower required.
[0052] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A device for automatically changing sandpaper during polishing, characterized in that, The device includes: a hopper for accommodating at least one piece of sandpaper, a positioning mechanism installed in the hopper, a grinding component having at least one target grinding disc, a pushing mechanism, and a detection system. The positioning mechanism positions the target grinding disc so that it aligns with the opening of the hopper. The pushing mechanism pushes the sandpaper in the hopper to adhere to the target grinding disc. The detection system detects whether the target grinding disc and the sandpaper are properly adhered. The positioning mechanism includes: a positioning block disposed at the opening of the hopper, the positioning block being arc-shaped to match the target grinding disc, and the positioning block being able to resist the target grinding disc. The positioning mechanism also includes: a fixing block and a groove disposed at the opening of the hopper, the fixing block being installed in the groove, and the fixing block extending... One end of the feed hopper contacts the sandpaper. The feeding mechanism includes: a first cylinder, a support plate movable within the feed hopper, a push rod, two buffers, and a support base. The first cylinder is fixed to the support base. One end of the push rod is connected to the first cylinder, and the other end of the push rod passes through the support plate and contacts the sandpaper. The push rod is located between the two buffers. One end of the buffer is connected to the support plate, and the other end of the buffer is connected to the support base. The device further includes: a moving mechanism and a disengaging mechanism. The moving mechanism can move the grinding component to the sandpaper clamping area. The disengaging mechanism is used to tear off the sandpaper on the target grinding disc in the grinding component located in the sandpaper clamping area to separate the sandpaper from the target grinding disc.
2. The automatic sandpaper changing device for sanding as described in claim 1, characterized in that, The material pushing mechanism further includes a support column, one end of which is fixedly connected to the support base, and the other end of which is fixedly connected to the hopper.
3. The automatic sandpaper changing device for polishing as described in claim 1, characterized in that: The silo is provided with at least one observation window, which extends along the height direction of the silo.
4. The automatic sandpaper changing device for sanding as described in claim 1, characterized in that, The detachment mechanism includes a fixed bracket, a second cylinder, and a gripper. The fixed bracket supports the second cylinder, and the second cylinder drives the gripper to tear off the sandpaper from the target grinding disc located in the sandpaper clamping area. The detection system is installed on the fixed bracket.
5. A method for automatically changing sandpaper during sanding, applied to the apparatus for automatically changing sandpaper during sanding as described in any one of claims 1-4, characterized in that, The method includes: Step S1: Position the target grinding disc so that it is aligned with the opening of the hopper; Step S2: Push the sandpaper in the hopper to fit against the target grinding disc to obtain a fitted grinding disc; Step S3: Move the bonded grinding disc to the detection area to check whether the sandpaper on the bonded grinding disc has been properly bonded; Step S4: If yes, rotate the next grinding disc to the position of the mated grinding disc, and use the next grinding disc as the target grinding disc. Step S5: Move the target grinding disc into the sandpaper clamping area to tear off the sandpaper from the target grinding disc; Step S6: Move the target grinding disc after the sandpaper has been removed to the detection area to detect whether the sandpaper on the target grinding disc has been successfully removed. Step S7: If yes, then execute steps S1 to S4. Step S8: If not, proceed to steps S5 to S6.
6. The method for automatically changing sandpaper during polishing as described in claim 5, characterized in that, The process of moving the bonded grinding disc to the detection area to detect whether the sandpaper on the bonded grinding disc has been properly bonded includes: The edge of the grinding disc is laser-scanned using a detection system to obtain scanning information. The obtained scanning information is compared with the preset edge information to determine whether the sandpaper on the grinding disc has been properly adhered.
Citation Information
Patent Citations
Full-automatic abrasive paper replacing system
CN112123207A
Polishing system and television production line
CN211517069U