Method, device and equipment for detecting abnormality of slide size deviation and storage medium

Abstract

The application provides a detection method, device and equipment for size deviation anomaly of a sliding sledge and a storage medium. Key position images of a sliding sledge to be detected are obtained, the key position images including a top view image of a positioning pin, a side view image of the positioning pin, a top view image of a connecting rod and a side view image of the connecting rod; according to the images corresponding to the key positions, a target horizontal distance of the positioning pin and a target vertex height of the positioning pin, a target parallelism of the connecting rod and a target levelness of the connecting rod are determined; the target horizontal distance, the target vertex height, the target parallelism and the target levelness are compared with a standard horizontal distance and a standard vertex height of a positioning pin of a standard sliding sledge and a standard parallelism and a standard levelness of a connecting rod of the standard sliding sledge one by one, and a size deviation of the sliding sledge to be detected is obtained; whether the size deviation of the sliding sledge to be detected is abnormal is determined according to the size deviation, and the method is suitable for detection of sizes of various types of sliding sledge.

Description

Technical Field

[0001] This application relates to the field of precision instrument technology, and in particular to a method, apparatus, equipment and storage medium for detecting abnormal dimensional deviations of a skid. Background Technology

[0002] In the automotive manufacturing industry, skids are typically used to transport car bodies during welding and painting operations. Locating pins on these skids support and secure the car body chassis. Prolonged use in environments with high temperature, high humidity, and heavy loads can cause wear and deformation of the skids, leading to misalignment of the locating pins. This can result in the skids becoming unable to stably support the car body during movement, and may even cause the car body to slip off, resulting in economic losses and potential quality issues. Therefore, it is necessary to regularly measure the dimensions of key components on the skids to check for misalignment of the locating pins.

[0003] In related technologies, to detect whether the positioning pins on the skid are misaligned, a high-precision, fixed, and complex mechanical device is designed to conduct contact measurements on the dimensions of key parts of the skid. However, the mechanical device cannot adapt to changes in the type of skid, and the measurement process requires manual intervention, which has certain limitations. Summary of the Invention

[0004] This application provides a method, apparatus, equipment, and storage medium for detecting abnormal dimensional deviations of a skid, which is used to measure the dimensional deviations of key parts of the skid, further detect whether the dimensional deviations of the skid are abnormal, and solve the limitations of contact measurement through mechanical devices.

[0005] In a first aspect, this application provides a method for detecting abnormal dimensional deviations in a skid, comprising:

[0006] Images of key components of the skid to be tested are acquired, including top-view images of the locating pin, side-view images of the locating pin, and top-view and side-view images of the connecting rod. Based on the top-view image of the locating pin, the target lateral distance of the locating pin is determined. Based on the side-view image of the locating pin, the target apex height of the locating pin is determined. Based on the top-view image of the connecting rod, the target parallelism of the connecting rod is determined. Based on the side-view image of the connecting rod, the target horizontality of the connecting rod is determined. The target lateral distance, target apex height, target parallelism, and target horizontality are then compared one by one with the standard lateral distance and standard apex height of the locating pin of a standard skid, as well as the standard parallelism and standard horizontality of the connecting rod of a standard skid, to obtain the dimensional deviations of the skid to be tested. These dimensional deviations include locating pin position deviation, locating pin height deviation, connecting rod parallelism deviation, and connecting rod horizontality deviation. The standard lateral distance, standard apex height, standard parallelism, and standard horizontality are obtained based on the key component images of a standard skid. Based on the dimensional deviations, it is determined whether the dimensional deviations of the skid to be tested are abnormal.

[0007] In one possible implementation, the key part image is acquired when the skid to be tested is placed on an L-shaped reference platform, wherein the two adjacent sides of the skid to be tested are respectively placed against the L-shaped reference platform.

[0008] In one possible implementation, determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation includes: determining the target dimensional deviation based on the dimensional deviation and dimensional data. The dimensional data is obtained by calibrating the camera using the measured dimensions of the positioning pin and connecting rod of the standard skid. The dimensional data includes the lateral and height dimensional data of the positioning pin of the standard skid, as well as the parallelism and horizontality dimensional data of the connecting rod of the standard skid. The target dimensional deviation includes the position deviation of the target positioning pin, the height deviation of the target positioning pin, the parallelism deviation of the target connecting rod, and the horizontality deviation of the target connecting rod. If at least one of the position deviation of the target positioning pin, the height deviation of the target positioning pin, the parallelism deviation of the target connecting rod, and the horizontality deviation of the target connecting rod is determined to be greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal.

[0009] In one possible implementation, determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation includes: determining whether the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold; if the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal; if both the parallelism deviation and horizontal deviation of the target connecting rod are less than or equal to the corresponding deviation threshold, then determining whether the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold; if the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal.

[0010] In one possible implementation, obtaining images of key parts of the skid to be detected includes: acquiring original captured images of the key parts of the skid to be detected; and performing image binarization processing on the original captured images to obtain images of the key parts.

[0011] In one possible implementation, the top view image of the locating pin includes patterns of the top and edge regions of the locating pin, the patterns of the top and edge regions forming a ring. Based on the top view image of the locating pin, the target lateral distance of the locating pin of the skid to be detected is determined, including: extracting the first center coordinates of the pattern corresponding to the top region in the top view image of the locating pin, and fitting the second center coordinates of the ring.

[0012] Based on the coordinates of the first and second center circles, determine the target lateral distance of the positioning pin of the skid to be tested.

[0013] In one possible implementation, the side view image of the locating pin includes patterns of the top and bottom regions of the locating pin, with the connection between the top and bottom regions forming the middle region. Determining the target vertex height of the locating pin based on the side view image includes: extracting the first coordinates of the pattern corresponding to the top region, the second coordinates of the pattern corresponding to the bottom region, and the third coordinates of the middle region from the side view image; and determining the target vertex height of the locating pin based on the first, second, and third coordinates.

[0014] Secondly, this application provides a device for detecting abnormal dimensional deviations of a skid, comprising:

[0015] The acquisition module is used to acquire images of key parts of the skid to be inspected, including top view images, side view images, top view images, and side view images of the connecting rod. The first determination module is used to determine the target lateral distance of the locating pin of the skid to be inspected based on the top view image; the target apex height of the locating pin based on the side view image; the target parallelism of the connecting rod of the skid to be inspected based on the top view image; and the target horizontality of the connecting rod based on the side view image. The comparison module is used to compare the target lateral distance and target apex height. The height, target parallelism, and target levelness are compared one by one with the standard lateral distance and standard vertex height of the positioning pin of the standard skid, as well as the standard parallelism and standard levelness of the connecting rod of the standard skid, to obtain the dimensional deviation of the skid to be tested. The dimensional deviation includes the positioning pin position deviation, positioning pin height deviation, connecting rod parallelism deviation, and connecting rod levelness deviation. The standard lateral distance, standard vertex height, standard parallelism, and standard levelness are obtained based on images of key parts of the standard skid. The second determination module is used to determine whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation.

[0016] In one possible implementation, the key part image is acquired when the skid to be tested is placed on an L-shaped reference platform, wherein the two adjacent sides of the skid to be tested are respectively placed against the L-shaped reference platform.

[0017] In one possible implementation, the second determining module is specifically used to: determine the target size deviation based on the size deviation and scale data. The scale data is obtained by calibrating the camera using the measured dimensions of the positioning pin and connecting rod of the standard skid. The scale data includes the lateral and height scale data of the positioning pin of the standard skid, as well as the parallelism and horizontality scale data of the connecting rod of the standard skid. The target size deviation includes the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation. If at least one of the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation is determined to be greater than the corresponding deviation threshold, then the size deviation of the skid to be tested is determined to be abnormal.

[0018] In one possible implementation, the second determining module can also be used to: determine whether the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold; if the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold, then determine that the dimensional deviation of the skid to be tested is abnormal; if both the parallelism deviation and horizontal deviation of the target connecting rod are less than or equal to the corresponding deviation threshold, then determine whether the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold; if the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold, then determine that the dimensional deviation of the skid to be tested is abnormal.

[0019] In one possible implementation, the acquisition module is specifically used to: acquire original captured images of the key parts of the skid to be detected; and perform image binarization processing on the original captured images to obtain images of the key parts.

[0020] In one possible implementation, the top view image of the locating pin includes patterns of the top and edge regions of the locating pin, and the patterns of the top and edge regions form a ring. The first determining module is specifically used to: extract the first center coordinates of the pattern corresponding to the top region in the top view image of the locating pin, and fit the second center coordinates of the ring; and determine the target lateral distance of the locating pin of the skid to be detected based on the first and second center coordinates.

[0021] In one possible implementation, the side view image of the locating pin includes patterns of the top and bottom regions of the locating pin, with the connection between the top and bottom regions forming the middle region. The first determining module can also be used to: extract the first coordinates of the pattern corresponding to the top region, the second coordinates of the pattern corresponding to the bottom region, and the third coordinates of the middle region from the side view image of the locating pin; and determine the target vertex height of the locating pin based on the first, second, and third coordinates.

[0022] Thirdly, this application provides an electronic device, comprising:

[0023] At least one processor;

[0024] and memory connected to at least one processor;

[0025] The memory is used to store at least one processor-executable instruction, which is executed by at least one processor to enable the at least one processor to perform the skid dimensional deviation anomaly detection method provided in the first aspect.

[0026] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which are executed by a processor to implement the method for detecting abnormal skid dimensional deviations provided in the first aspect.

[0027] Fifthly, this application provides a program product comprising computer-executable instructions. When the computer-executable instructions are executed, the method for detecting abnormal skid dimensional deviations provided in the first aspect is implemented.

[0028] This application provides a method, apparatus, device, and storage medium for detecting abnormal dimensional deviations in a skid. The method involves acquiring top-view images of the locating pin, side-view images of the locating pin, top-view images of the connecting rod, and side-view images of the connecting rod of the skid to be tested. Based on the top-view image of the locating pin, the target lateral distance of the locating pin is determined; based on the side-view image of the locating pin, the target apex height of the locating pin is determined; based on the top-view image of the connecting rod, the target parallelism of the connecting rod is determined; based on the side-view image of the connecting rod, the target horizontality of the connecting rod is determined; and the target lateral distance, target apex height, target parallelism, and target horizontality are compared with a target... The standard lateral distance and standard vertex height of the locating pins of the standard skid, as well as the standard parallelism and standard horizontality of the connecting rods of the standard skid, are compared one by one to obtain the dimensional deviations of the skid to be tested, namely, the locating pin position deviation, locating pin height deviation, connecting rod parallelism deviation, and connecting rod horizontality deviation. Based on the dimensional deviations, it is determined whether the dimensional deviations of the skid to be tested are abnormal. The corresponding dimensional deviations are obtained from the images of the key parts of the skid to be tested, realizing high-precision and non-contact measurement of the dimensional deviations of the key parts of the skid, thus improving the measurement accuracy. In addition, this detection method is applicable to various types of skids and does not limit the type of skid. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0030] Figure 1 This is a schematic diagram of the structure of a skid provided in an embodiment of this application;

[0031] Figure 2 A flowchart illustrating a method for detecting abnormal dimensional deviations of a skid according to an embodiment of this application;

[0032] Figure 3 A schematic diagram of key parts of the skid to be tested provided in an embodiment of this application;

[0033] Figure 4 A schematic diagram of the height coordinates of the side view image of the positioning pin provided in this application embodiment;

[0034] Figure 5 A schematic diagram of the structure of the skid to be tested placed on an L-shaped reference platform, as provided in an embodiment of this application;

[0035] Figure 6 A flowchart of a method for detecting abnormal dimensional deviations of a skid provided in another embodiment of this application;

[0036] Figure 7 A flowchart of a method for detecting abnormal dimensional deviations of a skid provided in another embodiment of this application;

[0037] Figure 8 A schematic diagram of the integrated judgment mechanism provided in the embodiments of this application;

[0038] Figure 9 A flowchart of a method for detecting abnormal dimensional deviations of a skid provided in another embodiment of this application;

[0039] Figure 10a A schematic diagram illustrating the measurement process of the target lateral distance of the positioning pin of the skid to be tested, provided in an embodiment of this application;

[0040] Figure 10b A schematic diagram illustrating the measurement process of the apex height of the positioning pin of the skid to be tested, provided in an embodiment of this application.

[0041] Figure 10c A schematic diagram illustrating the process of measuring the parallelism of the connecting rod of the skid to be tested, provided in an embodiment of this application.

[0042] Figure 10d A schematic diagram illustrating the measurement process of the horizontality of the connecting rod of the skid to be tested, provided in an embodiment of this application;

[0043] Figure 11 A schematic diagram of the structure of a skid dimensional deviation detection device provided in an embodiment of this application;

[0044] Figure 12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0045] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] In related technologies, to detect whether the positioning pins on a skid are misaligned, one approach is to design a high-precision, fixed, and complex mechanical device to perform contact measurement on the entire skid. However, this mechanical device cannot adapt to changes in the type of skid, the operation is cumbersome, and the measurement process requires manual intervention, thus having certain limitations. Another approach is to use a correction device consisting of a trigger probe and a lifting mechanism to detect the positioning pins on the skid. However, during the measurement process, repeated contact with the trigger probe can easily cause wear and deformation of the contact probe, resulting in deviations in the measurement of the skid positioning pins.

[0048] To address the problems existing in related technologies, this application embodiment uses a camera to acquire images of key parts of the skid, and detects the dimensional deviations of the key parts of the skid based on the images, thereby achieving high-precision and non-contact measurement of the dimensional deviations of the key parts of the skid. In addition, this method is applicable to the detection of dimensional deviations of key parts of various types of skids and is not limited to the type of skid.

[0049] To facilitate understanding, a brief introduction to the application scenarios involved in the embodiments of this application will be given first.

[0050] Figure 1 This is a schematic diagram of a skid provided in an embodiment of this application. Figure 1 As shown, the skid 10 mainly consists of a positioning pin 11, a connecting rod 12, and a connecting rod 13. The structural diagram within the dashed box is a schematic diagram of the positioning pin 11. The connecting rods 12 and 13 are two vertical connecting rods, which can be collectively referred to as connecting rods in this embodiment. Figure 1 As can be seen, a skid may include multiple positioning pins and connecting rods. In this embodiment, the number of positioning pins and connecting rods of the skid is not limited, and the specific number of positioning pins and connecting rods is determined by the type of positioning pin.

[0051] It is understood that the key components of the skid in the embodiments of this application may be the positioning pin and the connecting rod.

[0052] It should be noted that the embodiments of this application do not limit the type of skid, and the detection method provided in the embodiments of this application is applicable to various types of skids.

[0053] based on Figure 1 The following describes in detail the method for detecting abnormal dimensional deviations of skids provided in this application, using specific embodiments as examples.

[0054] Figure 2 This is a flowchart of a method for detecting abnormal dimensional deviations of a skid provided in an embodiment of this application.

[0055] like Figure 2As shown, the method for detecting abnormal dimensional deviations in the skid includes the following steps:

[0056] S201, acquire images of key parts of the skid to be tested, including top view image of the locating pin, side view image of the locating pin, top view image of the connecting rod, and side view image of the connecting rod.

[0057] Optionally, the key parts of the skid to be tested can be Figure 1 The locating pin and connecting rod are shown in the diagram.

[0058] In some embodiments, the images of key components can be outlines of the locating pins and connecting rods. Figure 3 This is a schematic diagram showing images of key parts of the skid to be detected provided in an embodiment of this application. Wherein, Figure 3 In the image, 'a' is a top view of the locating pin. Figure 3 In the image, b is a side view of the locating pin. Figure 3 In the image, c is a top view of the connecting rod. Figure 3 In the image, 'd' represents the side view of the connecting rod. (Combined with...) Figure 1 The schematic diagram of the positioning pin shown is from... Figure 3 As can be seen from point a, the white circle in the middle represents the top area of ​​the locating pin, and the white frame around the edge represents the outline of the locating pin. From Figure 3 As can be seen from point c, the top view of the connecting rod consists of two parallel lines. From Figure 3 As can be seen from point d, the side view of the connecting rod resembles a line. It should be noted that... Figure 3 The figure shown in d is a side view with the connecting rods completely parallel. Therefore, the two parallel lines will completely overlap, so only one parallel line is shown in the side view.

[0059] S202, based on the top view image of the locating pin, determine the target lateral distance of the locating pin of the skid to be tested; based on the side view image of the locating pin, determine the target apex height of the locating pin; based on the top view image of the connecting rod, determine the target parallelism of the connecting rod of the skid to be tested; based on the side view image of the connecting rod, determine the target horizontality of the connecting rod.

[0060] Optionally, the target lateral distance of the locating pin can be determined by... Figure 3 The coordinates of the center of the top region of the locating pin (x1, y1) and the coordinates of the center of the outline region of the locating pin (x2, y2) are shown in the top view image of the locating pin shown in Figure a. The coordinates of the center of the top region of the locating pin and the coordinates of the center of the outline region of the locating pin may be the same or different.

[0061] Optionally, the target vertex height of the positioning pin can be determined by... Figure 3The height coordinates in the side view image of the locating pin shown in Figure b are represented. For example, the height coordinates may include the top coordinates, middle coordinates, and bottom coordinates of the locating pin. Figure 4 This is a structural schematic diagram of the height coordinates of a side view image of a positioning pin provided in an embodiment of this application. (See attached diagram.) Figure 4 As shown, y3 represents the top coordinate, y4 represents the middle coordinate, and y5 represents the bottom coordinate.

[0062] Optionally, the target parallelism of the connecting rod can be determined by... Figure 3 The coordinates (y6, y8) and (y7, y9) of the ends of the two horizontal lines in the top view image of the connecting rod shown in C are represented.

[0063] Optionally, the target levelness of the connecting rod can be determined by... Figure 3 The end coordinates (y and y) of the two horizontal lines in the side view image of the connecting rod shown in d are as follows: 10 y 12 ) and (y 11 y 13 )express.

[0064] It should be noted that when determining the coordinate positions mentioned above, any corner of the corresponding image is used as the coordinate zero point. In the embodiments of this application, the upper left corner of the corresponding image is used as the coordinate zero point when determining the coordinate positions mentioned above.

[0065] S203, the target lateral distance, target vertex height, target parallelism, and target levelness are compared one by one with the standard lateral distance and standard vertex height of the positioning pin of the standard skid, as well as the standard parallelism and standard levelness of the connecting rod of the standard skid, to obtain the dimensional deviation of the skid to be tested. The dimensional deviation includes the positioning pin position deviation, positioning pin height deviation, connecting rod parallelism deviation, and connecting rod levelness deviation.

[0066] Among them, the standard lateral distance, standard vertex height, standard parallelism, and standard levelness are obtained based on images of key parts of the standard skid.

[0067] Optionally, the standard skid is of the same type as the skid to be tested described above. In the embodiments of this application, all are... Figure 1 The following explanation uses the skid type shown as an example. It is understood that the dimensions of key components of a standard skid are without deviation; that is, the locating pins of a standard skid are not misaligned.

[0068] In some embodiments, the standard lateral distance and standard vertex height of the positioning pins of the standard skid, as well as the standard parallelism and standard horizontality of the connecting rod of the standard skid, can be directly obtained from the positioning database. Specifically, the methods for determining the standard lateral distance and standard vertex height of the positioning pins of the standard skid, as well as the standard parallelism and standard horizontality of the connecting rod of the standard skid, are similar to the methods for determining the corresponding skid to be tested described above, and will not be repeated here.

[0069] In some embodiments, the difference between the standard lateral distance and the target lateral distance can be used as the positioning pin position deviation; the difference between the standard vertex height and the target vertex height can be used as the positioning pin height deviation; the difference between the standard parallelism and the target parallelism can be used as the connecting rod parallelism deviation; and the difference between the standard levelness and the target levelness can be used as the connecting rod levelness deviation.

[0070] In other embodiments, the difference between the end coordinates of the two parallel lines used to represent the target parallelism can be used as the parallelism deviation of the connecting rod, and the difference between the end coordinates of the two parallel lines used to represent the target levelness can be used as the levelness deviation of the connecting rod.

[0071] S204, Based on the dimensional deviation, determine whether the dimensional deviation of the skid to be tested is abnormal.

[0072] In some embodiments, by correcting the dimensional deviation and further comparing the corrected dimensional deviation with the maximum dimensional deviation threshold under the condition that the skid under test can be used normally, it is determined whether the dimensional deviation of the skid under test is abnormal, so as to determine whether the skid under test needs to be calibrated.

[0073] In this embodiment, the following steps are taken: A top view image, a side view image, a top view image, and a side view image of the locating pin of the skid to be tested are acquired. Based on the top view image, the target lateral distance of the locating pin is determined. Based on the side view image, the target apex height of the locating pin is determined. Based on the top view image, the target parallelism of the connecting rod is determined. Based on the side view image, the target horizontality of the connecting rod is determined. The target lateral distance, target apex height, target parallelism, and target horizontality are then compared with the standard lateral distance of the locating pin of a standard skid. The distance, standard vertex height, and standard parallelism and levelness of the connecting rod of the standard skid are compared one by one to obtain the dimensional deviations of the skid to be tested, namely, the deviation of the locating pin position, the deviation of the locating pin height, the deviation of the connecting rod parallelism, and the deviation of the connecting rod levelness. Based on the dimensional deviations, it is determined whether the dimensional deviations of the skid to be tested are abnormal. The corresponding dimensional deviations are obtained from the images of the key parts of the skid to be tested. This achieves high-precision and non-contact measurement of the dimensional deviations of the key parts of the skid, improving the measurement accuracy. In addition, this detection method is applicable to various types of skids and does not limit the type of skid.

[0074] Optionally, in step S201 above, the key component images of the skid to be tested are acquired when the skid to be tested is placed on an L-shaped reference platform, wherein the two adjacent sides of the skid to be tested are respectively placed against the L-shaped reference platform. For example, the L-shaped reference platform can be made of a hard and wear-resistant metal, and its flatness and straightness tolerances need to be no greater than 0.1 mm. Figure 5 This is a schematic diagram showing the structure of the skid to be tested placed on an L-shaped reference platform, as provided in an embodiment of this application. Figure 5 As shown, the light gray area represents the L-shaped reference platform, and the dark gray area represents the skid to be tested. The leftmost and topmost edges of the skid to be tested are aligned with the L-shaped reference platform.

[0075] Optionally, the top view image of the locating pin includes patterns of the top and edge regions of the locating pin, the patterns of the top and edge regions forming a ring. In some embodiments, determining the target lateral distance of the locating pin of the skid to be detected based on the top view image of the locating pin may specifically include the following steps: extracting the first center coordinates of the pattern corresponding to the top region in the top view image of the locating pin, and fitting the second center coordinates of the ring; determining the target lateral distance of the locating pin of the skid to be detected based on the first and second center coordinates.

[0076] Optionally, the side view image of the locating pin includes patterns of the top and bottom regions of the locating pin, with the connection between the top and bottom regions forming the middle region. In some embodiments, determining the target vertex height of the locating pin based on the side view image may specifically include the following steps: extracting the first coordinates of the pattern corresponding to the top region, the second coordinates of the pattern corresponding to the bottom region, and the third coordinates of the middle region from the side view image; and determining the target vertex height of the locating pin based on the first, second, and third coordinates.

[0077] Optionally, the top view image of the connecting rod includes a pattern of the top view contour region of the connecting rod. In some embodiments, determining the target parallelism of the connecting rod of the skid to be detected based on the top view image of the connecting rod may specifically include the following steps: extracting the fourth and fifth coordinates of the pattern corresponding to the top view contour region in the top view image of the connecting rod; and determining the target parallelism of the connecting rod based on the fourth and fifth coordinates.

[0078] Optionally, the side view image of the connecting rod includes a pattern of the side profile region of the connecting rod. In some embodiments, determining the target parallelism of the connecting rod of the skid to be detected based on the side view image of the connecting rod may specifically include the following steps: extracting the sixth and seventh coordinates of the pattern corresponding to the side profile region in the side view image of the connecting rod; and determining the target parallelism of the connecting rod based on the sixth and seventh coordinates.

[0079] The following is combined with Figure 6 The following is a detailed explanation of step S204, which involves determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation.

[0080] Figure 6 A flowchart illustrating a method for detecting abnormal dimensional deviations of a skid, as provided in another embodiment of this application. Figure 6 As shown, determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation may also include the following steps:

[0081] S601, Based on the size deviation and scale data, determine the target size deviation. The scale data is obtained by calibrating the camera using the measured dimensions of the positioning pin and connecting rod of the standard skid. The scale data includes the lateral and height scale data of the positioning pin of the standard skid, as well as the parallelism and horizontality scale data of the connecting rod of the standard skid. The target size deviation includes the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation.

[0082] Optionally, the scale data is used to correct for the deviation distance of the dimensional deviation in physical space. The camera is used to capture raw images of key parts of the skid to be inspected and / or a standard skid. It is understood that for dimensional measurements captured by the camera, the camera needs to be calibrated to obtain the physical length represented by one pixel in the corresponding captured image.

[0083] In some embodiments, the ratio of the actual diameter of the positioning pin of the standard skid to the diameter obtained after edge extraction and fitting from a top-view image of the positioning pin taken by a camera can be used as lateral dimension data; the ratio of the side platform height of the actual positioning pin of the standard skid to the side platform height obtained after edge extraction and fitting from a side-view image of the positioning pin taken by a camera can be used as height dimension data; the ratio of the distance between the two rods of the actual connecting rod of the standard skid to the distance between the two rods obtained after edge extraction and fitting from a top-view image of the connecting rod taken by a camera can be used as parallelism dimension data; and the ratio of the side height of the actual connecting rod of the standard skid to the height obtained after edge extraction and fitting from a side-view image of the connecting rod taken by a camera can be used as parallelism dimension data. For example, the unit of the dimension data can be pixels.

[0084] In other embodiments, the product of the positioning pin position deviation and the lateral dimension data can be used as the target positioning pin position deviation; the product of the positioning pin height deviation and the height dimension data can be used as the target positioning pin height deviation; the product of the connecting rod parallelism deviation and the parallelism dimension data can be used as the target connecting rod parallelism deviation; and the product of the connecting rod horizontality deviation and the horizontality dimension data can be used as the target connecting rod horizontality deviation.

[0085] S602, if it is determined that at least one of the following is greater than the corresponding deviation threshold: target positioning pin position deviation, target positioning pin height deviation, target connecting rod parallelism deviation, and target connecting rod horizontality deviation, then the dimensional deviation of the skid to be tested is determined to be abnormal.

[0086] Optionally, the corresponding deviation threshold can be a threshold of the same size.

[0087] It is understandable that if any one of the following deviations—target positioning pin position deviation, target positioning pin height deviation, target connecting rod parallelism deviation, and target connecting rod horizontality deviation—is greater than the corresponding deviation threshold, it indicates that the dimensional deviation of the skid under test is abnormal and needs to be corrected.

[0088] In this embodiment, the target size deviation is determined based on size deviation and dimensional data. This dimensional data is obtained by calibrating the camera using the measured dimensions of the positioning pins and connecting rods of the standard skid. The dimensional data includes the lateral and height dimensions of the positioning pins of the standard skid, as well as the parallelism and horizontality dimensions of the connecting rods. The target size deviation includes the position deviation of the target positioning pin, the height deviation of the target positioning pin, the parallelism deviation of the target connecting rod, and the horizontality deviation of the target connecting rod. If at least one of these deviations is greater than the corresponding deviation threshold, the size deviation of the skid under test is determined to be abnormal. The size deviation is corrected using the size data, ensuring the accuracy of the size deviation anomaly detection.

[0089] It is understandable that when there are abnormal deviations in the target positioning pin position deviation, target positioning pin height deviation, target connecting rod parallelism deviation, and target connecting rod horizontality deviation of the skid under test, these deviations are correlated, making it impossible to accurately pinpoint the specific cause of the abnormal deviation. For example, if the connecting rod has an abnormal horizontality deviation, it will affect the position and height of the positioning pin. Specifically, when the target positioning pin position deviation is abnormal, the cause may be a deviation of the positioning pin itself, a deviation in the parallelism of the target connecting rod, or a deviation in the horizontality of the target connecting rod; when the target positioning pin height deviation is abnormal, the cause may be a deviation of the positioning pin itself and a deviation in the horizontality of the target connecting rod; when the target connecting rod parallelism deviation is abnormal, the cause may be a deviation in the parallelism of the connecting rod itself; when the target connecting rod horizontality deviation is abnormal, the cause may be a deviation in the horizontality of the connecting rod itself.

[0090] Therefore, in order to accurately output abnormal results of the skid, based on the above embodiments, the following is combined with... Figure 7 The following is a detailed explanation of step S204, which involves determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation.

[0091] Figure 7 A flowchart illustrating a method for detecting abnormal dimensional deviations of a skid, provided in another embodiment of this application. Figure 7 As shown, determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation may also include the following steps:

[0092] S701, determine whether the parallelism deviation and / or horizontality deviation of the target connecting rod are greater than the corresponding deviation threshold;

[0093] If the target connecting rod parallelism deviation and / or target connecting rod horizontality deviation are greater than the corresponding deviation threshold, then proceed to step S702; if both the target connecting rod parallelism deviation and target connecting rod horizontality deviation are less than or equal to the corresponding deviation threshold, then proceed to step S703.

[0094] Based on the correlation between the different deviations mentioned above, in order to accurately output abnormal results of the skid, this application proposes a comprehensive judgment mechanism. Specifically, the judgment of this mechanism can be divided into two stages. The first stage first judges whether there are abnormal deviations in the levelness and parallelism of the connecting rod. The second stage, if no abnormal deviations are found in the first stage, then judges the abnormal deviations in the height and position of the locating pin. Figure 8 This is a schematic diagram of the comprehensive judgment mechanism provided in the embodiments of this application. For example... Figure 8As shown, dashed box 81 is used to determine whether the horizontal and parallelism deviations of the connecting rod are abnormal, and dashed box 82 is used to determine whether the position and height deviations of the locating pin are abnormal. The items in dashed box 81 are judged first, followed by the items in dashed box 82; the judgment order of the two dashed boxes cannot be changed. The judgment order of items within the same dashed box can be adjusted.

[0095] S702, It is determined that the dimensional deviation of the skid to be tested is abnormal.

[0096] S703, determine whether the target positioning pin position deviation and / or target positioning pin height deviation are greater than the corresponding deviation threshold.

[0097] If the target positioning pin position deviation and / or target positioning pin height deviation are greater than the corresponding deviation threshold, then return to step S702.

[0098] In this embodiment, it is determined whether the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold. If the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold, the dimensional deviation of the skid to be tested is determined to be abnormal. If both the parallelism deviation and horizontal deviation of the target connecting rod are less than or equal to the corresponding deviation threshold, it is determined whether the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold. If the position deviation and / or height deviation of the target locating pin are greater than the corresponding deviation threshold, the dimensional deviation of the skid to be tested is determined to be abnormal. Based on the comprehensive judgment mechanism, the dimensional deviation abnormality of the skid to be tested is determined, and the abnormal result of the skid to be tested can be accurately output according to the determination result of the dimensional deviation abnormality, which is convenient for the skid to be tested to be corrected.

[0099] The method for detecting abnormal dimensional deviations of skids provided in this application is a non-contact detection method. Its non-contact nature is mainly reflected in the acquisition of images of key parts of the skid. The following describes the method in conjunction with... Figure 9 The process of obtaining images of key parts of the skid to be inspected in step S201 is described in detail.

[0100] Figure 9 A flowchart illustrating a method for detecting abnormal dimensional deviations of a skid, as provided in another embodiment of this application. Figure 9 As shown, acquiring images of key parts of the skid to be inspected can specifically include the following steps:

[0101] S901, acquires raw images of the key parts of the skid to be inspected.

[0102] Optionally, the original captured image can be an image obtained directly by the camera. Based on Figure 1The schematic diagram of the skid shown illustrates that the camera can be used for shooting either by moving the camera with a robotic arm or by using a fixed array of multiple cameras for stationary shooting. Specifically, in the multi-camera array shooting method, the number and position of the cameras correspond to the number and position of the positioning pins and connecting rods of the skid. For example, the camera's installation position is related to the shooting angle.

[0103] S902 performs image binarization on the original captured image to obtain images of key parts.

[0104] Image binarization is the process of setting the grayscale value of pixels in an image to 0 or 255, thus giving the entire image a distinct black and white effect.

[0105] Optionally, the above Figure 3 The top view image, side view image, top view image, and side view image of the connecting rod shown are images obtained by binarizing the original top view image, side view image, top view image, and side view image of the connecting rod.

[0106] In this embodiment of the application, by acquiring the original captured images of the key parts of the skid to be detected, and performing image binarization processing on the original captured images to obtain the images of the key parts, non-contact detection of abnormal dimensional deviations of the skid is realized.

[0107] Based on the above-described methods for detecting abnormal dimensional deviations of skids, the following schematic diagram illustrates the measurement process of the target lateral distance and target vertex height of the positioning pin of the skid to be tested, as well as the target parallelism and target horizontality of the connecting rod of the skid to be tested, in this embodiment of the application. Figure 10a A schematic diagram illustrating the measurement process of the target lateral distance of the positioning pin of the skid to be tested, provided in an embodiment of this application; Figure 10b A schematic diagram illustrating the measurement process of the apex height of the positioning pin of the skid to be tested, provided in an embodiment of this application. Figure 10c A schematic diagram illustrating the process of measuring the parallelism of the connecting rod of the skid to be tested, provided in an embodiment of this application. Figure 10d This is a schematic diagram illustrating the measurement process of the levelness of the connecting rod of the skid to be tested, as provided in an embodiment of this application. The specific testing method is similar to that described above and will not be repeated here.

[0108] The following are embodiments of the apparatus described in this application, which can be used to execute the embodiments of the method described in this application. For details not disclosed in the apparatus embodiments of this application, please refer to the embodiments of the method described in this application.

[0109] Figure 11This is a schematic diagram of a device for detecting abnormal dimensional deviations of a skid provided in an embodiment of this application. Figure 11 As shown, the skid size deviation detection device 110 includes: an acquisition module 111, a first determination module 112, a comparison module 113, and a second determination module 114.

[0110] The acquisition module 111 is used to acquire images of key parts of the skid to be inspected, including a top view image, a side view image, a top view image, and a side view image of the connecting rod of the skid to be inspected. The first determination module 112 is used to determine the target lateral distance of the positioning pin of the skid to be inspected based on the top view image; determine the target apex height of the positioning pin based on the side view image; determine the target parallelism of the connecting rod of the skid to be inspected based on the top view image; and determine the target horizontality of the connecting rod based on the side view image. The comparison module 113 is used to compare the target lateral distance... The target vertex height, target parallelism, and target levelness are compared one by one with the standard lateral distance and standard vertex height of the positioning pin of the standard skid, as well as the standard parallelism and standard levelness of the connecting rod of the standard skid, to obtain the dimensional deviation of the skid to be tested. The dimensional deviation includes the positioning pin position deviation, positioning pin height deviation, connecting rod parallelism deviation, and connecting rod levelness deviation. The standard lateral distance, standard vertex height, standard parallelism, and standard levelness are obtained based on the key part images of the standard skid. The second determining module 114 is used to determine whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation.

[0111] In one possible implementation, the key part image is acquired when the skid to be tested is placed on an L-shaped reference platform, wherein the two adjacent sides of the skid to be tested are respectively placed against the L-shaped reference platform.

[0112] In one possible implementation, the second determining module 114 is specifically used to determine the target size deviation based on the size deviation and scale data. The scale data is obtained by calibrating the camera using the measured dimensions of the positioning pin and connecting rod of the standard skid. The scale data includes the lateral and height scale data of the positioning pin of the standard skid, as well as the parallelism and horizontality scale data of the connecting rod of the standard skid. The target size deviation includes the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation. If at least one of the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation is determined to be greater than the corresponding deviation threshold, then the size deviation of the skid to be tested is determined to be abnormal.

[0113] In one possible implementation, the second determining module 114 can also be used to: determine whether the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold; if the parallelism deviation and / or horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold, then determine that the size deviation of the skid to be tested is abnormal; if both the parallelism deviation and horizontal deviation of the target connecting rod are less than or equal to the corresponding deviation threshold, then determine whether the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold; if the position deviation of the target locating pin and / or the height deviation of the target locating pin are greater than the corresponding deviation threshold, then determine that the size deviation of the skid to be tested is abnormal.

[0114] In one possible implementation, the acquisition module 111 is specifically used to: acquire the original captured image of the key part of the skid to be detected; and perform image binarization processing on the original captured image to obtain the key part image.

[0115] In one possible implementation, the top view image of the locating pin includes patterns of the top and edge regions of the locating pin, and the patterns of the top and edge regions form a ring. The first determining module 112 is specifically used to: extract the first center coordinates of the pattern corresponding to the top region in the top view image of the locating pin, and fit the second center coordinates of the ring; and determine the target lateral distance of the locating pin of the skid to be detected based on the first and second center coordinates.

[0116] In one possible implementation, the side view image of the positioning pin includes patterns of the top and bottom regions of the positioning pin, and the connection between the top and bottom regions is the middle region. The first determining module 112 can also be used to: extract the first coordinates of the pattern corresponding to the top region, the second coordinates of the pattern corresponding to the bottom region, and the third coordinates of the middle region from the side view image of the positioning pin; and determine the target vertex height of the positioning pin based on the first, second, and third coordinates.

[0117] The apparatus provided in this application embodiment can be used to execute the method steps in the above method embodiment. Its implementation principle and technical effect are similar, and will not be described again here.

[0118] It should be noted that the division of the various modules in the above device is merely a logical functional division. In actual implementation, they can be fully or partially integrated into a single physical entity, or they can be physically separated. Furthermore, these modules can be implemented entirely in software via processing element calls; they can be fully implemented in hardware; or some modules can be implemented by processing element calls to software, while others are implemented in hardware. For example, a processing module can be a separate processing element, or it can be integrated into a chip within the device. Alternatively, it can be stored as program code in the device's memory, and its functions can be called and executed by a processing element. The implementation of other modules is similar. Moreover, these modules can be fully or partially integrated together, or they can be implemented independently. The processing element here can be an integrated circuit with signal processing capabilities. During implementation, each step of the above method or each of the above modules can be completed through integrated logic circuits in the hardware of the processor element or through software instructions.

[0119] Figure 12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 12 As shown, the electronic device 12 includes at least one processor 121, a memory 122, a communication interface 123, and a system bus 124. The memory 122 and the communication interface 123 are connected to the processor 121 via the system bus 124 and communicate with each other. The memory 122 stores instructions, the communication interface 123 communicates with other devices, and the processor 121 calls the instructions in the memory to execute the scheme described in the above embodiment of the method for detecting abnormal skid size deviation. The specific implementation and technical effects are similar and will not be repeated here.

[0120] Should Figure 12 The system bus 124 mentioned in the figure can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This system bus 124 can be divided into address bus, data bus, control bus, etc. For ease of representation, it is represented by only one thick line in the figure, but this does not indicate that there is only one bus or one type of bus.

[0121] Communication interface 123 is used to enable communication between the database access device and other devices (such as clients, read-write databases, and read-only databases).

[0122] The memory 122 may include random access memory (RAM) and may also include non-volatile memory, such as at least one disk storage device.

[0123] Processor 121 can be a general-purpose processor, including a central processing unit, a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0124] This application also provides a computer-readable storage medium storing computer-executable instructions. When executed by a processor, the computer-executable instructions are used to implement the method steps as described in the above method embodiments. The specific implementation methods and technical effects are similar and will not be repeated here.

[0125] This application also provides a program product comprising computer-executable instructions. When the computer-executable instructions are executed, they implement the method steps as described in the above method embodiments. The specific implementation and technical effects are similar and will not be repeated here.

[0126] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0127] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

[0128] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of the relevant data must comply with the relevant laws, regulations and standards of the relevant countries and regions, and corresponding operation portals are provided for users to choose to authorize or refuse.

Claims

1. A method for detecting abnormal dimensional deviations in a skid, characterized in that, include: Acquire images of key parts of the skid to be tested. The images of key parts include a top view image of the positioning pin, a side view image of the positioning pin, a top view image of the connecting rod, and a side view image of the connecting rod. The images of key parts are acquired when the skid to be tested is placed on an L-shaped reference platform, with the two adjacent sides of the skid to be tested respectively attached to the L-shaped reference platform. The top view image of the locating pin includes patterns of the top and edge regions of the locating pin, and the patterns of the top and edge regions form a ring. In the top view image of the locating pin, the coordinates of the first center of the pattern corresponding to the top area are extracted, and the coordinates of the second center of the ring are fitted. Based on the first and second center coordinates, the target lateral distance of the locating pin of the skid to be tested is determined. Based on the side view image of the locating pin, the target apex height of the locating pin is determined. Based on the top view image of the connecting rod, the target parallelism of the connecting rod of the skid to be tested is determined. Based on the side view image of the connecting rod, the target horizontality of the connecting rod is determined. The target lateral distance, target vertex height, target parallelism, and target levelness are compared one by one with the standard lateral distance and standard vertex height of the positioning pin of the standard skid, as well as the standard parallelism and standard levelness of the connecting rod of the standard skid, to obtain the dimensional deviation of the skid to be tested. The dimensional deviation includes the positioning pin position deviation, positioning pin height deviation, connecting rod parallelism deviation, and connecting rod levelness deviation. The standard lateral distance, standard vertex height, standard parallelism, and standard levelness are obtained based on images of key parts of the standard skid. Based on the dimensional deviation, determining whether the dimensional deviation of the skid to be tested is abnormal includes: determining whether the parallelism deviation of the target connecting rod and / or the horizontality deviation of the target connecting rod are greater than the corresponding deviation threshold; If the parallelism deviation and / or the horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal; if both the parallelism deviation and the horizontal deviation of the target connecting rod are less than or equal to the corresponding deviation threshold, then it is determined whether the position deviation of the positioning pin and / or the height deviation of the positioning pin are greater than the corresponding deviation threshold; if the position deviation of the positioning pin and / or the height deviation of the positioning pin are greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal.

2. The detection method according to claim 1, characterized in that, The step of determining whether the dimensional deviation of the skid to be tested is abnormal based on the dimensional deviation includes: Based on the dimensional deviation and scale data, the target dimensional deviation is determined. The scale data is obtained by calibrating the camera using the measured dimensions of the positioning pin and connecting rod of the standard skid. The scale data includes the lateral and height scale data of the positioning pin of the standard skid, as well as the parallelism and horizontality scale data of the connecting rod of the standard skid. The target dimensional deviation includes the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation. If at least one of the target positioning pin position deviation, the target positioning pin height deviation, the target connecting rod parallelism deviation, and the target connecting rod horizontality deviation is determined to be greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal.

3. The detection method according to claim 1, characterized in that, The acquisition of images of key parts of the skid to be detected includes: Obtain original images of the key parts of the skid to be detected; The original captured image is subjected to image binarization processing to obtain the image of the key part.

4. The detection method according to claim 3, characterized in that, The side view image of the locating pin includes patterns of the top and bottom regions of the locating pin, with the connection between the top and bottom regions forming the middle region. Determining the target vertex height of the locating pin based on the side view image includes: In the side view image of the locating pin, the first coordinates of the pattern corresponding to the top region, the second coordinates of the pattern corresponding to the bottom region, and the third coordinates of the middle region are extracted respectively. The target vertex height of the positioning pin is determined based on the first coordinate, the second coordinate, and the third coordinate.

5. A device for detecting abnormal dimensional deviations of a skid, characterized in that, include: The acquisition module is used to acquire images of key parts of the skid to be tested. The key part images include a top view image of the positioning pin, a side view image of the positioning pin, a top view image of the connecting rod, and a side view image of the connecting rod of the skid to be tested. The key part images are acquired when the skid to be tested is placed on an L-shaped reference platform, with the two adjacent sides of the skid to be tested respectively attached to the L-shaped reference platform. The top view image of the locating pin includes patterns of the top and edge regions of the locating pin, and the patterns of the top and edge regions form a ring. The first determining module is used to extract the first center coordinates of the pattern corresponding to the top area in the top view image of the positioning pin, and fit the second center coordinates of the ring; determine the target lateral distance of the positioning pin of the skid to be detected based on the first and second center coordinates; determine the target vertex height of the positioning pin based on the side view image of the positioning pin; determine the target parallelism of the connecting rod of the skid to be detected based on the top view image of the connecting rod; and determine the target horizontality of the connecting rod based on the side view image of the connecting rod. The comparison module is used to compare the target lateral distance, the target vertex height, the target parallelism, and the target levelness with the standard lateral distance and standard vertex height of the positioning pin of the standard skid, as well as the standard parallelism and standard levelness of the connecting rod of the standard skid, one by one, to obtain the dimensional deviation of the skid to be tested. The dimensional deviation includes the positioning pin position deviation, the positioning pin height deviation, the connecting rod parallelism deviation, and the connecting rod levelness deviation. The second determining module is used to determine whether the size deviation of the skid to be tested is abnormal based on the size deviation, including: determining whether the parallelism deviation of the target connecting rod and / or the horizontality deviation of the target connecting rod are greater than the corresponding deviation threshold; If the parallelism deviation and / or the horizontal deviation of the target connecting rod are greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal; if both the parallelism deviation and the horizontal deviation of the target connecting rod are less than or equal to the corresponding deviation threshold, then it is determined whether the position deviation of the positioning pin and / or the height deviation of the positioning pin are greater than the corresponding deviation threshold; if the position deviation of the positioning pin and / or the height deviation of the positioning pin are greater than the corresponding deviation threshold, then the dimensional deviation of the skid to be tested is determined to be abnormal.

6. An electronic device, characterized in that, include: At least one processor; and a memory connected to the at least one processor; The memory is used to store instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the method for detecting abnormal skid size deviation as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed, are used to implement the method for detecting abnormal skid dimensional deviations as described in any one of claims 1 to 4.

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