Methods and apparatus for aligning substrates

Abstract

The present invention relates to a method and apparatus for aligning substrates. Prior to the alignment, a third X-Y position and / or a third alignment orientation of a third alignment mark (22) on the first substrate support (10) and / or the first substrate (16) is additionally detected by a third detection unit (7), and the alignment is controlled by means of the third detection unit (7), wherein, in order to align the first substrate (16) and the second substrate (17), the third X-Y position and / or the third alignment orientation is correlated with at least one of a) the first X-Y position and / or the first alignment orientation and b) the second X-Y position and / or the second alignment orientation, and real-time measurement and adjustment are performed during the alignment.

Description

[0001] This application is a divisional application of the invention patent application with application number 201680088184.9, application date 2016-08-29, and invention title "Method and apparatus for aligning substrates". Technical Field

[0002] The present invention relates to a method for aligning and contacting a first substrate with a second substrate, and a corresponding apparatus. Background Technology

[0003] In the semiconductor industry, alignment facilities are used to align substrates, especially wafers, to each other so that they can be joined together in further process steps. This joining process is called bonding.

[0004] The following alignment process is called face-to-face alignment: where the alignment marks are placed on the substrate surface to be joined.

[0005] As long as the substrate is not transparent to the electromagnetic radiation used to measure the substrate, so that the position and orientation of the alignment marks can be detected and / or determined from the surface of the outer substrate away from the surface of the substrate to be joined, the alignment marks are detected between the substrates using an image detection device before the substrates approach each other.

[0006] This has various drawbacks, especially particulate contamination by the camera and the large spacing between the substrates, which is necessary to place the camera used for detection between the two substrates. This results in alignment errors when they are close to each other.

[0007] The alignment facility described in publication US6214692B1 illustrates an improved scheme for face-to-face alignment, which can be considered the closest prior art. In this alignment facility, two sets of optics are used, each set having optics positioned opposite each other to create a system with two reference points, the substrate being positioned relative to the system. The reference point is the intersection of the optical axes of the two opposing optics.

[0008] The problem with existing technologies is that the increased alignment accuracy requirements can no longer be achieved through the disclosed open, controlled methods.

[0009] Publication US6214692B1 is based on the comparison and position correction of two images of alignment marks. The orientation of the alignment marks on two substrates arranged face-to-face is detected individually using a camera system. The calculated relative orientation and position of the alignment marks are then used to manipulate a positioning platform (substrate support and stage) to correct for erroneous positions. The positioning platform has incremental stroke sensors positioned near the guide and near the actuator. Summary of the Invention

[0010] Therefore, the objective of this invention is to describe an apparatus and method for aligning and contacting a substrate, thereby achieving more precise and efficient alignment and contact of the substrate.

[0011] The task is solved using the solutions disclosed in this application. Advantageous extensions of the invention are also described in this application. All combinations of at least two features described in this application also fall within the scope of the invention. In the case of the described value range, values ​​within the mentioned boundaries are also disclosed as boundary values ​​and can be claimed in any combination. Specifically, according to a method for aligning and contacting a first contact surface of a first substrate with a second contact surface of a second substrate, the method comprises the following steps, in particular the following process: fixing a first support surface of the first substrate to a first substrate support, and fixing a second support surface of the second substrate to a second substrate support, the second substrate support being arranged opposite to the first substrate support; detecting a first alignment mark, particularly with respect to the focal plane of a first detection unit, a first XY position and / or a first alignment orientation, wherein the first alignment mark is particularly arranged in the surrounding area of ​​the first substrate; detecting a second alignment mark, particularly with respect to the focal plane of a second detection unit, a second XY position and / or a second alignment orientation, wherein the second alignment mark is particularly arranged in the surrounding area of ​​the first substrate. In the area surrounding the second substrate; aligning the first substrate relative to the second substrate; and contacting the first substrate with the second substrate, wherein the first substrate is aligned relative to the second substrate, characterized in that, prior to the alignment, a third detection unit additionally detects a third XY position and / or a third alignment orientation of a third alignment mark on the first substrate support and / or the first substrate, and controls the alignment by means of the third detection unit, wherein, in order to align the first substrate and the second substrate, the third XY position and / or the third alignment orientation is correlated with at least one of a) the first XY position and / or the first alignment orientation and b) the second XY position and / or the second alignment orientation, and is measured and adjusted in real time during the alignment.According to the present invention, an apparatus for aligning and contacting a first contact surface of a first substrate with a second contact surface of a second substrate, the apparatus comprising: a first substrate support for fixing a first support surface of the first substrate; a second substrate support for fixing a second support surface of the second substrate, wherein the second substrate support is arranged opposite to the first substrate support; a first detection unit for detecting a first XY position and / or a first alignment orientation of a first alignment mark; a second detection unit for detecting a second XY position and / or a second alignment orientation of a second alignment mark; an alignment device for aligning the first substrate relative to the second substrate; and a contact device for contacting the first substrate with the second substrate. The first substrate is in contact with the second substrate, wherein the first substrate is aligned relative to the second substrate; characterized in that the device has a third detection unit for detecting a third XY position and / or a third alignment orientation of the first substrate support and / or the first substrate, and the alignment can be controlled by means of the third detection unit, wherein in order to align the first substrate and the second substrate, the third XY position and / or the third alignment orientation can be correlated with at least one of a) the first XY position and / or the first alignment orientation and b) the second XY position and / or the second alignment orientation, and real-time measurement and adjustment can be performed during the alignment.

[0012] The present invention is based on the idea of ​​additionally detecting additional (especially third) alignment marks before alignment, which are either placed on one of the substrates to be aligned or on the substrate support. In particular, the additional alignment marks are not arranged on the contact surface of the substrate. The additional alignment marks are preferably arranged on a side of the substrate or substrate support opposite to the contact surface or on a side parallel to the contact surface.

[0013] The alignment of substrates with each other is performed, in particular indirectly, by means of alignment marks located on the contact surfaces of the substrates. The alignment marks on opposite sides of opposing substrates are particularly complementary to each other. The alignment marks can be any objects that can be aligned with each other, such as crosses, circles or squares, propeller shapes or grid structures, especially phase grids for spatial frequency domains.

[0014] Alignment marks are preferably detected using electromagnetic radiation of a defined wavelength and / or wavelength range. These currently include infrared, visible, or ultraviolet radiation. However, shorter wavelength radiation, such as EUV or X-rays, can also be used.

[0015] A particularly independent aspect of the invention is that the alignment is performed solely by means of detecting additional alignment marks. “Solely” means that other (especially first and second) alignment marks are not detected or cannot be detected during alignment.

[0016] According to an advantageous embodiment of the invention, the first substrate and the second substrate are arranged between the first substrate support and the second substrate support with a distance A between the first contact surface and the second contact surface in the Z direction. The distance A is particularly less than 500 micrometers, particularly preferably less than 100 micrometers, best of all less than 50 micrometers, and ideally less than 10 micrometers.

[0017] The method according to the invention is particularly a method for aligning at least two substrates face to face using any electromagnetic radiation, especially UV light, more preferably infrared light, most preferably visible light, and / or sequentially releasing optical paths for observing first and second alignment marks, wherein supplementary optical paths are provided for accurately reconstructing the positions of the substrates and substrate supports, which, during the alignment of the substrates, are not arranged between the substrates or extend between the substrates, but rather enable detection from the outside.

[0018] The method according to the invention improves alignment accuracy, in particular by means of additional XY position and / or orientation information, which is detected by additionally arranged detection units and / or measurement and adjustment systems and used to control the alignment.

[0019] Therefore, the device according to the invention has a control unit, particularly software-supported, by means of which the steps and components described herein are controlled. According to the invention, the closed regulating circuit and regulation are understood to be incorporated into the control unit.

[0020] The X and Y directions, or X and Y positions, are understood as directions or positions extending within the XY coordinate system or in any Z-plane of the XY coordinate system. The Z-direction is arranged orthogonally to the XY directions.

[0021] The X and Y directions correspond in particular to the lateral direction.

[0022] Positional characteristics are derived / calculated from the position and / or orientation values ​​of the alignment marks on the substrate and from the alignment marks on the substrate support.

[0023] According to the invention, at least one additional positional feature is detected using at least one additional measurement system with a new, additional optical path. At least one additional alignment mark is preferably located near the position of the alignment mark on the substrate.

[0024] Therefore, the method and apparatus according to the invention particularly include at least one additional measurement and / or adjustment system, wherein alignment accuracy is improved through the correlation of the additional measurement value and at least one of the measurement values ​​of other detection units. Direct observability of the alignment marks is achieved through the correlation between at least one of the measured alignment marks in the bonding interface between the contact surfaces and alignment marks that are also visible during substrate alignment, thus enabling real-time measurement and adjustment during alignment. Therefore, the alignment accuracy of the substrate is improved.

[0025] Additional alignment marks are arranged, in particular, on the rear side of the substrate support.

[0026] A clear correlation is established between additional positional features on the substrate support and positional features on the substrate, and this correlation is preferably not changed until alignment and during alignment.

[0027] Because of the additional positional features on the substrate support, the direct observation of the positional features on the substrate can be replaced by observing the diameter of the positional features on the substrate support, wherein the additional positional features are explicitly related to the positional features on the substrate. This has the advantage that the observable portion of the substrate support can be practically always positioned within the field of view or measurement range of the additional measurement system.

[0028] Compared to controlled positioning in the prior art, active feedback of data for positioning and position correction improves accuracy because it provides the controllability of the actual state of the position within a closed adjustment circuit. In particular, instead of traveling a pre-given distance with a given number of increments, the distance traveled is measured, allowing for a comparison between nominal and actual values, particularly with respect to velocity and / or acceleration. The object of the present invention is to improve the alignment accuracy of two substrates using a method in which the alignment can be observed in real time, particularly from outside the bonding interface. Here, the substrates are arranged with minimal spacing between them, and preferably no device objects are located between the substrates.

[0029] The core idea of ​​this invention is particularly the introduction of at least one additional measurement and adjustment system, and the correlation between existing measurements and additional, newly detected position and / or orientation values. Direct observability and real-time measurement and adjustment of the additional alignment marks are achieved through the correlation between measured alignment marks in the mating interface and alignment marks, especially those directly detectable on the substrate support, particularly on the rear side of the substrate support, and / or on the substrate, particularly on the rear side of the substrate, during alignment. This measure improves alignment accuracy.

[0030] During the detection of the first alignment mark, the second substrate and the second substrate support are moved out of the optical axis of the first detection unit in the XY direction in order to achieve detection.

[0031] During the detection of the second alignment mark, the first substrate and the first substrate support are moved out of the optical axis of the second detection unit in the XY direction to enable detection.

[0032] equipment The apparatus according to the invention for aligning at least two substrates has at least one optical system, which consists of two optical devices or detection units aligned with each other, the optical paths of which preferably meet at a common focal point.

[0033] According to an advantageous embodiment, the optical system includes beamforming and / or deflection elements, such as mirrors, lenses, prisms, radiation sources particularly for Köhler illumination; and image detection devices, such as cameras (CMOS sensors or CCDs, or area detection devices or line detection devices or point detection devices, such as phototransistors); and a focusing device; and an evaluation device for adjusting the optical system.

[0034] In one embodiment of the device according to the invention, the optical system and the rotation system are used for substrate positioning according to the principle of reversal adjustment (Umschlagjustierung), see Hansen, Friedrich: Justierung, VEBVerlag Technik, 1964, paragraph 6.2.4, Umschlagmethode (reversal method), wherein at least one measurement is performed in a defined position, and at least one measurement is performed in a 180-degree rotated, oppositely oriented, reversed position. Therefore, the obtained measurement results particularly eliminate eccentricity errors.

[0035] An extension of the device according to the invention comprises two, particularly identical, structurally identical optical systems having optical devices aligned with each other and capable of being fixed relative to each other.

[0036] The device, according to an extension of the invention, comprises more than two identical optical systems having aligned optical elements.

[0037] Furthermore, the device according to the invention includes a substrate holder for accommodating a substrate to be aligned.

[0038] In another embodiment of the device according to the invention, at least one substrate support is used, which is at least partially transparent, preferably more than 95%, at a defined location for simultaneous observation, particularly on both substrate sides.

[0039] In another embodiment of the device according to the invention, at least one substrate support is used, which has an opening and / or slit and / or viewing window at a defined location for simultaneous observation, particularly on both substrate sides.

[0040] Furthermore, the device according to the invention may include a system for generating pre-joints.

[0041] Furthermore, the device according to the invention preferably includes: a moving device having a drive system, a guide system, a fixing and holding device (Festhaltung) and a measuring system, so as to move, position and align the optical system and the substrate support and / or substrate with each other.

[0042] The moving device can generate each movement due to individual movements, so the moving device can preferably include a fast, coarse positioning device that does not meet the accuracy requirements and a fine positioning device that works with precision.

[0043] The rated value of the location to be approached is the ideal value. The moving device approaches the ideal value. Reaching the ideal value and the defined surrounding area can be understood as reaching the rated value.

[0044] If the starting and / or repeatability accuracy differs from the rated value by more than 0.1%, preferably more than 0.05%, and particularly preferably more than 0.01%, with respect to the entire travel path or rotation range, or a full 360-degree rotation in the case of a rotary drive capable of circumduction, then the positioning device is understood as a coarse positioning device.

[0045] Therefore, in the case of a coarse positioning device, for example, a starting accuracy of 600mm * 0.01%, i.e., more than 60 micrometers, is obtained with a travel path exceeding 600mm, as a residual uncertainty. In other embodiments of coarse positioning, the residual uncertainty of starting or repeatability accuracy is less than 100 micrometers, preferably less than 50 micrometers, and particularly preferably less than 10 micrometers. Thermal interference parameters should preferably be taken into account here.

[0046] A coarse positioning device performs a positioning task with sufficient accuracy only when the deviation between the actual position reached and the nominal position is within the travel range of the assigned fine positioning device.

[0047] An alternative coarse positioning device can perform a positioning task with sufficient accuracy only when the deviation between the actual position reached and the nominal position is within half the range of the assigned fine positioning device.

[0048] If the residual uncertainty of the starting and / or repeatability accuracy with respect to the total travel path or rotation range differs from the nominal value by no more than 500 ppb, preferably less than 100 ppb, and ideally 1 ppb, then the positioning device is understood to be a fine positioning device. The fine positioning device according to the present invention will preferably have an absolute positioning error of less than 5 micrometers, preferably less than 1 micrometer, particularly preferably less than 100 nm, very particularly preferably less than 10 nm, in the best case less than 5 nm, and in the ideal case less than 1 nm.

[0049] This apparatus and associated methods utilize at least two positioning devices with the highest accuracy and reproducibility. To improve substrate alignment quality, a mutual error correction scheme can be used. Therefore, due to known offsets (twists and / or displacements) of the substrate and its corresponding positioning device, alignment accuracy can be improved by adjusting and correcting the positions of another positioning device and another substrate using correction values ​​or correction vectors. Here, the issue is the magnitude and type of twists and / or displacements, and how the control or adjustment applies coarse and fine positioning, or only coarse positioning, or only fine positioning, for error correction.

[0050] In the following text, positioning devices (coarse or fine or combined positioning devices) and alignment devices are considered and used as synonyms.

[0051] According to the invention, the alignment of substrates with each other can be performed in all six degrees of freedom of movement: three translations according to the coordinate directions x, y, and z, and three rotations about the coordinate directions. According to the invention, movement can be performed in any direction and orientation. The alignment of the substrates preferably includes, in particular, passive or active wedge error compensation, according to the disclosure in publication EP2612109B1.

[0052] Robots used for substrate handling are classified as mobile devices. Fixing and holding devices can be integrated as components or functionally integrated into the mobile device.

[0053] Furthermore, the device according to the invention preferably includes an adjustment system and / or an evaluation system, in particular a computer, to implement the described steps, in particular the movement process, perform corrections, analyze and store the operating status of the device according to the invention.

[0054] The method is preferably created as a formula (Rezept) and implemented in a machine-readable form. The formula is an optimized set of values ​​for parameters that are interrelated in a functional or methodological manner. The use of the formula is permitted to ensure the reproducibility of the production process.

[0055] Furthermore, the device according to an advantageous embodiment of the invention includes supply and auxiliary and / or supplementary systems (compressed air, vacuum, electrical energy, liquids such as hydraulic fluid, coolant, heating medium, devices and / or equipment for temperature stabilization, electromagnetic shielding devices).

[0056] Furthermore, the device according to the invention includes a frame, a housing, and an active or passive subsystem for vibration suppression, damping, or absorption.

[0057] Measurement Furthermore, the device according to the invention includes at least one measuring system, which preferably has a measuring unit for each moving axis, said measuring unit being, in particular, a path measuring system and / or an angle measuring system.

[0058] Tactile, i.e., touch-based or non-tactile measurement methods can be used. The measurement reference or unit can exist as a physical entity, especially a scale, or it can be implicitly present in the measurement process, such as the wavelength of the radiation used.

[0059] At least one measurement system can be selected and used for alignment accuracy. The measurement system implements the measurement method. In particular, the following can be used: ●Inductive method and / or ● Capacitive methods and / or ● Resistive methods and / or ● Comparison methods, especially optical image recognition methods and / or ● Incremental or absolute methods (especially using glass references as scales, or interferometers, particularly laser interferometers, or magnetic references) and / or ● Runtime measurements (Doppler method, time-of-flight method) or other time recording methods and / or ● Triangulation methods, especially laser triangulation. ●Autofocus method and / or ●Intensity measurement methods, such as fiber optic telemetry.

[0060] Features a variable additional measurement system and substrate support. Furthermore, a particularly preferred embodiment of the device according to the invention includes at least one additional measuring system that detects the XY position and / or alignment and / or angular orientation of at least one of the substrates and / or one of the substrate supports with respect to a defined reference, particularly with respect to the frame. Components, particularly made of natural hard stone or mineral cast iron or ductile iron or hydraulic concrete, may be provided as the frame, said components being particularly vibration-damping and / or vibration-isolieving and / or equipped with vibration-absorbing devices.

[0061] According to the invention, measurements can be combined and / or referenced and / or correlated with each other, such that the position of another alignment mark associated therewith can be determined by measuring the alignment mark.

[0062] In one embodiment of the invention, the position of the substrate support is detected at a point (or location, measurement point, or field of view) with respect to a reference, particularly a first alignment mark on a first substrate and / or a second alignment mark on a second substrate.

[0063] In another embodiment of the invention, the position of the substrate support is detected at exactly two points with respect to a reference object.

[0064] In another embodiment of the invention, the position of the substrate support is detected at exactly three points with respect to a reference object, and thus the position and orientation of the substrate support are determined.

[0065] In a first embodiment of the invention, optical pattern recognition is used with the aid of a camera system, and a pattern applied to a substrate is used to determine the position at one, two, three, or any number of points. In a real-time system, the pattern is continuously detected, particularly during alignment. The listed measurement methods can also be used for position determination.

[0066] The reverse approach is: according to the present invention, it is conceivable, in particular, to place the detection unit on the substrate support and the alignment mark on the frame.

[0067] In order to enable detection, evaluation and control at any point in time, especially continuously, the pattern distribution according to the advantageous implementation is spread over an area larger than the field of view of the image detection system of the detection unit, so as to continuously supply measurement values ​​to the control unit (and / or adjustment unit).

[0068] In another embodiment of the device according to the invention, at least one of the substrate supports has a through hole for detecting alignment marks from the support side of the substrate.

[0069] According to the invention, it is advantageous that at least one of the substrates has at least one alignment mark on the surface to be joined (contact surface) and at least one alignment mark on the opposite surface (support surface).

[0070] Alignment marks are preferably a plurality of alignment marks distributed, preferably uniformly, in a manner particularly capable of one-to-one allocation, on at least one of the support surfaces of the substrate. The alignment marks on the support surface can be correlated, at least with respect to their XY position and / or alignment orientation, with respect to the XY position and / or alignment orientation of alignment marks on the same substrate. This achieves continuous position determination during substrate loading and alignment up to substrate contact.

[0071] In an extended embodiment of the invention, the alignment marks on the support surface are distributed particularly evenly except in the edge exclusion zone of the substrate.

[0072] In another embodiment of at least one of the substrates, the alignment marks on the support surface are distributed one-to-one with the contact surface of the same substrate and the alignment marks arranged on the contact surface.

[0073] In another embodiment of the invention, at least one interferometer, along with a correspondingly constructed, particularly monolithic, reflector for determining the XY position and / or orientation of the substrate support, can be used to determine the XY position at at least one point. The number of interferometers is specifically equal to the number of reflecting surfaces of the reflector.

[0074] In particular, the substrate support composed of monolithic blocks preferably has at least two of the following functions: ●Substrate fixation is achieved using a vacuum (vacuum track, connection). ● Preferably, especially according to embodiments EP2656378B1 and WO2014191033A1, shape compensation for substrate deformation is performed by means of mechanical and / or hydraulic and / or piezoelectric and / or thermoelectric and / or electrothermal manipulation elements. ●Location and / or orientation determination (measuring reference, reflecting surface and / or prism, especially reflectors for interferometry, registration marks and / or registration mark fields, measuring references for planar structures of planes, volume references, especially grading) ●Movement (guide rail).

[0075] The mobile device according to the invention, not used for fine adjustment, is particularly configured as a robotic system, preferably configured with incremental path indicators. The accuracy of such a mobile device for assisting movement is decoupled from the accuracy of alignment for substrate stacking, such that the assisting movement is carried out with a lower repeatability accuracy of less than 1 mm, preferably less than 500 micrometers, and particularly preferably less than 150 micrometers.

[0076] The control and / or adjustment of the moving device for (lateral) alignment (fine adjustment) according to the invention is performed primarily based on the XY position and / or alignment orientation detected by other measuring devices. Preferably, the accuracy of the moving device is less than 200 nm, more preferably less than 100 nm, particularly preferably less than 50 nm, very particularly preferably less than 20 nm, in the best case less than 10 nm, and in the ideal case less than 1 nm.

[0077] method A first embodiment of the alignment method according to the invention includes the following steps, particularly at least partially sequential and / or simultaneous, especially the following process: First method step: Load a support surface onto the first / lower substrate on the first / lower substrate support, wherein a first alignment mark is provided (present) on the opposite side (contact surface).

[0078] Second method step: The first / lower substrate, especially when using a moving device for coarse adjustment, is moved together with the substrate support into the field of view of the detection position of the first / upper detection unit of the optical system.

[0079] Third method step: The optical system moves to the detection position, provided this has not already been completed through the second method step. Optionally, the self-calibration of the optical system can be performed now or before starting to move to the detection position.

[0080] Fourth method step: Focus the first / upper detection unit onto the pattern to be identified on the first alignment mark, the pattern being arranged on the contact surface of the substrate to be bonded.

[0081] Optionally, the optical system can adjust the second / lower detection unit onto the focusing plane of the first / upper detection unit.

[0082] Fifth method step: In particular, the first alignment mark is detected by means of pattern recognition. At the same time, especially by synchronization with the first detection unit, preferably on the side other than the contact surface, the XY position and / or alignment orientation of the first substrate support and / or the first substrate is detected by an additional measurement system (with a third detection unit) according to the invention.

[0083] The sixth method step: In particular, by reducing all degrees of freedom to zero, the position of the optical system is clamped mechanically and / or electronically and / or magnetically.

[0084] Seventh method step: The optical system adjusts the second / lower detection unit onto the focusing plane of the first / upper detection unit.

[0085] Optionally, the adjustment has been performed and cancelled after the fourth method step.

[0086] Eighth method step: Adjust and evaluate the computer (especially in the control unit) to perform abstraction and / or calculation to obtain measurement results for control of alignment: Adjust and evaluate the computer in particular to establish the correlation between the measurement results of the optical system and the additional (third) measurement system, and store the results, especially as the nominal values ​​of the XY position and / or alignment orientation of the first / lower substrate support and the first / lower substrate.

[0087] Ninth method step: The first / lower substrate support is removed from the field of view of the optical system (the optical path used for detection). This eliminates obstruction to the optical path of the first detection unit. The optical system preferably remains fixed.

[0088] Tenth method step: The second / upper substrate is loaded onto the second / upper substrate support. This method step may have been performed prior to one of the preceding method steps.

[0089] Eleventh method step: The second / upper substrate support is moved together with the second / upper substrate into the field of view of the optical system.

[0090] The twelfth method step: The second / lower detection unit of the optical system locates and detects the alignment marks on the second / upper substrate in a manner similar to that of the first / upper detection unit. The optical system is not mechanically moved here, but focus correction is conceivable. However, focus movement is preferably not performed.

[0091] Thirteenth method step: The second / upper substrate and the second / upper substrate support block the optical path of the first / upper detection unit, making it impossible to directly observe / detect the contact surface of the first / lower substrate to be joined in the aligned position.

[0092] Fourteenth method step: Adjusting and evaluating the alignment error determined by the computer, with reference to the disclosures in publications US6214692B1 and WO2014202106A1. Specifically, an alignment error vector is created from the alignment error. In particular, at least one correction vector is then calculated. The correction vector can be a vector parallel to and opposite to the alignment error vector, such that the sum of the alignment error vector and the correction vector yields zero. In special cases, additional parameters are considered in the calculation of the correction vector, such that the result differs from zero.

[0093] The fifteenth method step: Adjust according to the correction vector, and then clamp the XY position and / or alignment of the second / upper substrate (together with the substrate support) so that the calculated alignment error is at least minimized, preferably eliminated.

[0094] Sixteenth method step: After clamping / fixing the second / upper substrate, the XY position of the second upper substrate is detected / checked again using the second / lower detection unit. Therefore, any displacement and / or distortion caused by clamping can be identified and minimized, and in particular eliminated, through iterations of process steps twelve through fifteen.

[0095] Alternatively, detected displacement and / or torsion can be considered to create correction values ​​and / or correction vectors that can be eliminated in subsequent method steps. Preferably, the correction value for displacement is less than 5 micrometers, preferably less than 1 micrometer, particularly preferably less than 100 nanometers, very particularly preferably less than 10 nanometers, best in the case less than 5 nanometers, and ideally less than 1 nanometer. The correction value for torsion is particularly less than 50 microradians, preferably less than 10 microradians, particularly preferably less than 5 microradians, very particularly preferably less than 1 microradian, best in the case less than 0.1 microradians, and ideally less than 0.05 microradians.

[0096] In the fifteenth method step, similar to the twelfth method step, at least one position measurement may be performed before fixing the upper substrate, and at least one measurement may be performed after fixing the upper substrate. According to the invention, it is conceivable that repeated error correction ensures that the next method step is performed only after the defined accuracy requirement (threshold) is achieved.

[0097] Sixteenth method step: The first / lower substrate support is moved back to its previously detected position and orientation (see eighth method step). Here, the XY position and alignment orientation of the lower substrate support (together with the substrate) are controlled in real time using an additional measurement system. The observability of the first alignment mark of the first substrate is not given because the clamped upper substrate support obstructs the optical path.

[0098] Seventeenth method step: Correct the actual XY position and alignment of the first / lower substrate support until the difference from the nominal value is zero, but at least ensure that the defined threshold is not exceeded.

[0099] Eighteenth, optional method step: Connect the substrate, wherein reference is made to the disclosure of publication WO2014191033A1.

[0100] Nineteenth method step: Unload the substrate stack from the device.

[0101] A second alternative embodiment of the alignment method according to the invention, relative to the first embodiment, includes the following changes to the loading order of the upper and lower substrates: As a first method step according to the present invention, a first / lower substrate is mounted on a first / lower substrate support.

[0102] As a second method step according to the invention, the second / upper substrate is loaded onto the second / upper substrate support.

[0103] Then the method steps of the first embodiment are applied in a similar manner.

[0104] In a third embodiment of the method according to the invention, the first and / or second methods are modified in that the upper and lower directions are interchanged not only in the device according to the invention but also in the method. In particular, therefore, at least one additional measuring system is used to observe the upper substrate support.

[0105] In a fourth embodiment of the method according to the invention, the listed processes are modified in that the order in which the substrates are loaded is interchanged while maintaining the same method results.

[0106] In a fifth embodiment of the method according to the invention, acceleration is achieved by parallelizing the method steps, particularly since the loading of the second substrate has been performed during the pattern recognition step on the first substrate.

[0107] In a sixth embodiment of the method and associated apparatus according to the invention, an additional measuring system can detect the position and / or orientation of the upper substrate support and the lower substrate support and / or the position and / or orientation of the upper substrate and the lower substrate.

[0108] In a seventh embodiment of the method and associated apparatus according to the invention, an additional measuring system can detect the position and / or orientation of the upper substrate support and / or the upper substrate.

[0109] All technically possible combinations and / or arrangements and multiplications of the functional and / or material portions of the device, and the resulting changes in at least one of the method steps or methods, are considered to be disclosed.

[0110] Where device features are disclosed in the current and / or subsequent descriptions of the accompanying drawings, those device features are also publicly applicable as method features, and vice versa. Attached Figure Description

[0111] Other advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the accompanying drawings. Wherein: Figure 1 A schematic cross-sectional view of one embodiment of the device according to the invention is shown. Figure 2a Shown in the first method step according to Figure 1 A schematic enlarged cross-sectional view of the implementation method. Figure 2b Shown in the second method step according to Figure 1 A schematic enlarged cross-sectional view of the implementation method. Figure 2c It is shown that in the third method step, according to Figure 1 An enlarged schematic cross-sectional view of the implementation method. Detailed Implementation

[0112] In the figures, the advantages and features of the invention are indicated by respective identifiable reference numerals according to embodiments of the invention, wherein components or features having the same or identical functions are indicated by the same reference numerals.

[0113] Figure 1 A schematic, non-scale functional diagram depicting the main components of a first embodiment of the alignment facility 1. The alignment facility 1 is capable of aligning substrates 16 (represented as first and / or lower substrates), 17 (represented as second and / or upper substrates), and / or stacked substrates to each other, and at least partially connecting and / or temporarily connecting them (so-called pre-bonding), wherein the substrates are not in... Figure 1 The possible movements / degrees of freedom of the functional components described below are represented by arrows.

[0114] The first substrate 16 is mounted on the first substrate support 10 and can be fixed on the first substrate support without the remaining degrees of freedom of the substrate 16 relative to the first substrate support 10. The second substrate 17 is mounted on the second substrate support 13 and can be fixed on the second substrate support without the remaining degrees of freedom of the substrate 16 relative to the second substrate support 13.

[0115] First, in particular, the lower substrate support 10 is arranged on the first moving device 11 for holding and carrying out the transport and adjustment movement (alignment) of the first substrate support 10.

[0116] Secondly, in particular, the upper substrate support 13 is arranged on the second moving device 14 for holding and carrying out the transport and adjustment movement (alignment) of the second substrate support 13. The moving devices 11 and 14 are fixed to a common solid platform or frame 9 in order to reduce / minimize vibration of all functional components.

[0117] Optical system 2 is used to observe (detect) the first alignment mark 20 and the second alignment mark 21, wherein the optical system comprises the following: The first detection unit 3, in particular the image detection device, is used to detect the first alignment mark 20 on the first substrate 16, and The second detection unit 4, in particular the image detection device, is used to detect the second alignment mark on the second substrate 17.

[0118] The optical system 2 can be focused onto a preferred common focal plane 12, which is located between the first substrate 16 and the second substrate 17 when the first substrate and the second substrate are arranged for alignment. Movement of the optical system 2, particularly in the X, Y, and Z directions, is achieved by means of a positioning device 5 for positioning the optical system 2. The positioning device 5 is particularly fixed to a solid platform or frame. In a particularly preferred embodiment (not shown), the entire optical system 2 (including the positioning device 5, detection units 3 and 4, etc.) is used in a (in) double mirror-symmetric implementation.

[0119] At least one additional, particularly optical, measuring system 6, together with at least one third detection unit 7 of the additional measuring system 6, is used to improve the alignment accuracy by detecting the third alignment mark 22 according to the invention. Movement of the additional measuring system is implemented using a positioning device 8.

[0120] As long as the optical measurement system 6 is involved, the positioning device 8 can focus on the third alignment mark 22 by moving the third detection unit 7 in the Z direction. Similarly, positioning in the XY direction is conceivable, where, during alignment, the fixing of the measurement system 6 is preferably performed on a platform / frame. Alternatively, the accurate XY position of the measurement system 8 must be known.

[0121] In the embodiment of the invention shown in the alignment facility 1, the XY position and / or orientation (especially rotational orientation) of the lower substrate support 10 is detected with particularly high accuracy using an additional measuring system 6.

[0122] In another embodiment of the invention, not shown, of the alignment facility 1, the position and / or orientation of the upper substrate support is detected with particularly high accuracy using an additional measuring system.

[0123] In another embodiment of the invention, not shown, of the alignment facility 1, the position and / or orientation of the upper substrate support and the lower substrate support are detected with particularly high accuracy using an additional measuring system.

[0124] In another embodiment of the invention, not shown, of the alignment facility, the position and / or orientation of at least one of the substrates is detected with particularly high precision by means of at least one measuring system. For this purpose, alignment marks on the contact surface and marks on the side opposite to the contact surface are detected.

[0125] Figure 2a The diagram illustrates the method steps according to the invention for assigning measurements of at least two detection units to each other, the two detection units being, in particular, two detection units for detecting at least two XY positions of alignment marks 20, 22 arranged on different sides of the first substrate 16 and / or the first substrate support 10.

[0126] The first / lower substrate 16 is fixed to the first fixing surface 10a of the first substrate support 10. Fixation is achieved, in particular, by mechanical and / or electrostatic clamping or pressing forces, wherein the pressing force is generated by the pressure difference between the surrounding environment in normal atmosphere and the negative pressure of the first substrate support 10, also known as vacuum fixing. This fixing is particularly effective so that the first substrate 16 does not experience any parasitic or undesirable movement relative to the first substrate holder 10 throughout the entire process according to the invention; especially, thermal expansion can be suppressed or reduced as long as the first substrate support 10 and the first substrate 16 each have corresponding, preferably linearly corresponding, coefficients of thermal expansion, wherein the difference between the linear changes in the coefficients of thermal expansion and / or the coefficients of thermal expansion is preferably less than 5%, preferably less than 3%, and particularly preferably less than 1%.

[0127] The facility is preferably operated in a temperature-stable environment, particularly in a cleanroom, wherein during alignment cycles, it can withstand temperature variations of less than 0.5 Kelvin, preferably less than 0.1 Kelvin, particularly preferably 0.05 Kelvin, and optimally less than 0.01 Kelvin. The fixed first substrate 16 and the first substrate support 10 can be understood as quasi-monolithic bodies for implementing the movement of the first substrate 16, which are not allowed to move relative to each other.

[0128] The substrate fixing can be performed in a form-fit and / or preferably force-fit manner. Quasi-monolithic bonding results in at least a reduction, preferably at least an order of magnitude reduction, and particularly preferably the elimination of effects that may cause displacement and / or torsion and / or deformation between the substrate support and the substrate. These effects may be thermal and / or mechanical and / or flow-induced and / or inherent to the material (particles).

[0129] The substrate can be connected to the substrate support using form fit or force fit, which can suppress differential thermal expansion in particular. In addition, the substrate support can be used to reduce, eliminate and / or correct autonomous deformation of the substrate, as disclosed in EP2656378B1.

[0130] During the detection of the first alignment mark 20, the first substrate support 10 is located in the optical path of the first (upper) detection unit 3. The first alignment mark 20 is arranged on the contact surface 16i of the first substrate 16 to be joined in the field of view of the first (upper) detection unit 3, especially in the optical path. The first detection unit 3 generates an image, especially a digital image, which is schematically represented herein as alignment marks in the form of a cross. The first alignment mark 20 may also consist of multiple alignment marks. Measurement values ​​are generated / calculated from the image of the alignment marks, which particularly characterize the XY position and / or alignment orientation of the first substrate 16 (especially in the rotational direction about the Z direction), i.e., the alignment state.

[0131] During the detection of the first alignment mark 20, the second / lower detection unit 4 preferably does not provide a measurement value, especially because the second substrate 17 is arranged / has been arranged outside the optical path of the first detection unit 3.

[0132] The first / lower substrate support 10 and / or the first / lower substrate 16 have a third alignment mark 22, according to which the XY position and / or alignment orientation (especially in the rotational direction about the Z direction) of the substrate support 10 and / or the first substrate 16 is detected, in particular, from another direction, preferably from a direction exactly opposite to the first detection in the Z direction, i.e., the alignment state.

[0133] Preferably, the relative movement of the first detection unit 3 relative to the third detection unit 7 can be measured. More preferably, the relative movement between the first detection unit 3 and the third detection unit 7 is not implemented from the detection of the first alignment mark 20 and the third alignment mark 22 until the contact between the first substrate 16 and the second substrate 17.

[0134] The third (additional) detection unit 7 of the additional measurement system 6 provides measurements of the XY position and / or orientation of the first / lower substrate support 10 by measuring the third alignment mark 22 of the first / lower substrate support 10. The measurements are generated, in particular, by a preferred digital image, which is represented by a cross symbol. The third alignment mark 22 may also consist of multiple alignment marks.

[0135] Two measurements (the XY position and / or alignment orientation of the first alignment mark 20 of the first substrate 16 and the XY position and / or alignment orientation of the third alignment mark 22 of the first substrate support 10 or the first substrate 16) are assigned to each other and / or correlated with each other, such that the XY position and / or alignment orientation of the first alignment mark 20 can be assigned one-to-one to the third alignment mark based on the XY position and / or alignment orientation, especially by detecting the XY position and / or alignment orientation.

[0136] Through the method steps described, alignment can be achieved during the alignment and / or contact of the first substrate 16 and the second substrate 17 without directly detecting the XY position and / or alignment orientation of the first alignment mark 20 and / or the second alignment mark 21. Furthermore, the spacing between the substrates can be minimized during alignment. During the detection of the first and second alignment marks, the spacing can preferably correspond to the substrate spacing.

[0137] In other words, an unobstructed optical path is provided between the substrate support 10 and the additional measurement system 6, by means of which substrate alignment can be performed or carried out in the adjustment circuit. Through the method steps, the XY position and / or alignment orientation of the first substrate support 10, and thus the XY position and / or alignment orientation of the first substrate fixed on the first substrate support 10, can be accurately determined and reconstructed in a reproducible manner.

[0138] In particular, the reconstructed representation of the XY position and / or alignment of the substrate support 10 and the substrate monolithically connected thereto: especially the core aspect. The method steps used for this have been discussed elsewhere.

[0139] In particular, repeatability accuracy (measured as the relative alignment error between two substrates) of positioning less than 1 micrometer, preferably less than 100 nm, particularly preferably less than 30 nm, very particularly preferably less than 10 nm, optimally less than 5 nm, and ideally less than 1 nm is achieved. This repeatability accuracy is also known as the reversal gap. The reversal gap can also be a repeated start-up (Anfahren) at a given position by means of moving devices 11, 14 and / or 5, 8. The reversal gap is caused by the movement of the moving devices, and only the change in position is detected, resulting in a measurement magnitude as a relative alignment error. The positioning accuracy of the moving devices, which have no effect on the substrates, can be understood as an irrelevant reversal gap.

[0140] According to the invention, to further improve alignment accuracy, the first detection unit 3 preferably operates in time synchronization with the second detection unit 7, particularly with a time difference in the detection of measured values ​​that is less than one-tenth of a second, preferably less than 1 millisecond, particularly preferably less than 10 microseconds, very particularly preferably less than 1 microsecond, optimally less than 1 ns, and ideally 0.0 ns. This is particularly advantageous because it eliminates the effects of interference such as mechanical vibrations. Mechanical vibrations also propagate in materials as solid-borne sound at speeds of several kilometers per second. If the adjustment and detection device operates faster than the propagation speed of the solid-borne sound, the interference is reduced or eliminated.

[0141] If the interference alters the orientation of the first substrate 16 on the first substrate support 10, such that the first detection unit 3 has already recorded a measurement value, but the additional measurement system 6 with the detection unit 7 has not yet recorded a measurement value, then the interference may cause... The proportion of alignment accuracy is reduced because rapid mechanical positional changes, on the order of nanometers or micrometers, can occur, especially during the time between the recording of measurements from detection devices 3 and 7. If the measurement recording is performed with a time delay (on the order of seconds or minutes), other disturbances, such as thermally induced shape or length changes, also reduce alignment accuracy.

[0142] If the first detection unit 3 and the third detection unit 7 are synchronized with each other (especially by simultaneously triggering detection and balancing the detection time and / or the integration time of the camera system), some interference effects can be reduced, and in the best case, eliminated, because the detection should be performed at a time point in which the interference effects have the least possible impact on the detection accuracy.

[0143] In possible implementations of the facility, detection can be performed under known, especially periodic, interference effects, particularly in a synchronized manner at the peak of the oscillation. To this end, the interference effects are received at a point in the facility relevant to accuracy in the front end of the vibration sensor (accelerometer, interferometer, vibrometer), and processed, particularly in a computing unit or computer, to eliminate them. In another implementation, the vibration sensor may be fixedly mounted at a characteristic point of the facility.

[0144] In another possible implementation, the facility is implemented, in particular, in a combination of active and / or passive vibration damping, active and / or passive vibration absorption, and / or active and / or passive vibration isolation, and is also used in a cascaded manner. Additionally, vibrations as disturbance effects can be superimposed with forced vibrations, allowing the detection of alignment marks to be performed using a so-called lock-in method. Modal analysis and / or FEM can be used to characterize the facility and examine its vibration condition. This, and the design of such a facility, is known to those skilled in the art.

[0145] The first detection unit 3 and the third detection unit 7 are clamped before, during, or after the detection of the first alignment mark 20 and the third alignment mark 22, wherein the absolute and / or relative degrees of freedom in at least the X and Y directions are reduced to zero. “Relative” means the movement of the first detection unit 3 relative to the third detection unit 7.

[0146] Figure 2bThis is a schematic diagram of the method steps for measuring values ​​of a second / upper substrate 17 according to the present invention. The optical system 2 is in particular in a clamped state, and the image and / or XY position of at least one alignment mark of the first / lower substrate 16 is stored (not shown). In the clamped state, at least the absolute and / or relative degrees of freedom of the second detection unit relative to the first detection unit are reduced to zero in the X and Y directions.

[0147] With the clamped position, the XY positions and / or alignment orientations of the first, second, and third alignment marks can be referenced to the same XY coordinate system. Alternatively or additionally, the first, second, and third detection units are calibrated on the same XY coordinate system.

[0148] The second / upper substrate 17, fixed on the second / upper substrate support 13, is moved to the detection position by means of the second moving device 14 for moving the second substrate support 13, and the XY position and / or alignment orientation of the second alignment mark 21 of the second substrate 17 is detected by the second / lower detection unit 4.

[0149] The objective is to align the second substrate 17 as perfectly as possible with respect to the XY position and / or orientation of the first / lower substrate 16. Since the lower substrate 16 may be an obstacle in the optical path for observing the second alignment mark 21 of the second / upper substrate 17 through the second detection unit 4, the first / lower substrate 16 is removed from the optical path, especially by movement in the X and / or Y directions, preferably without any movement in the Z direction.

[0150] The correction of the XY positions and relative orientations of the two substrates is performed in relation to the third alignment mark by comparing the XY positions and / or alignment orientations of the first and second alignment marks.

[0151] After the alignment of the second / upper substrate is achieved with particularly minimal, preferably eliminated, alignment error, the upper substrate support is clamped in this method step, i.e., its degrees of freedom are lost at least in the X and Y directions.

[0152] Figure 2c A schematic diagram of the method steps according to the present invention for aligning a first substrate 16 relative to, in particular, a clamped second substrate 17 is shown.

[0153] During alignment, the optical path of the optical system 2 is blocked between the first detection unit 3 and the second detection unit 4 by the first substrate support 10 and the second substrate support 13, so that the detection units 3 and 4 cannot be used during alignment.

[0154] The additional measurement system 6, having a third detection unit 7, preferably generates image data in real time, and in particular continuously, the image data which can be used as raw data for adjusting the XY position and / or orientation, wherein the additional measurement system is, in a particularly preferred embodiment, a camera system with a microscope.

[0155] The (theoretical or average) spacing of the contact surfaces 16i and 17i to be joined (especially without considering any pre-tensioning or sagging) is particularly less than 1 mm, preferably less than 500 micrometers, particularly preferably less than 100 micrometers, best of all less than 50 micrometers, and ideally less than 10 micrometers. In particular, the spacing can be adjusted by the moving device 11 and / or 14.

[0156] In particular, according to Figure 2a The determined / specified ratings are used for the alignment of substrates 16 and 17. The ratings include, in particular, image data of the third alignment mark 22 of the first substrate support 10 and / or determined XY position data and / or alignment orientation data of the moving device 11 of the first substrate support 10 and / or adjustment parameters such as the trajectory curve for optimal proximity (anfahrren) for XY position and / or, in particular, machine-readable values ​​for the actuator.

[0157] In another embodiment, the residual error may be considered as a correction value for positioning another (lower or upper) substrate, wherein the residual error was not eliminated during the positioning of the upper and / or lower substrate.

[0158] Using the first moving device 11, the first substrate support 10 is moved in a positional adjustment manner, and particularly in an orientation adjustment manner, until the alignment error is minimized, ideally eliminated, or a termination criterion is met, wherein the alignment error is calculated by the rating of the additional measuring system and the current position and / or orientation of the substrate support. In other words, the lower substrate support 10 is moved back to the known, measured XY alignment position in a controlled and adjusted manner.

[0159] In another embodiment, the residual error can also be considered as a correction value for positioning another (lower or upper) substrate, wherein the residual error was not eliminated during the positioning of the upper and / or lower substrate.

[0160] Additional correction factors can be obtained, in particular, from the vibration state of the facility or facility portion as previously described. These additional correction factors are used for substrate positioning, reducing residual positioning uncertainty, and improving alignment accuracy. For verification of the final position, all known interference factors and effects can be reconsidered and corrected accordingly.

[0161] Finally, in the method step according to the invention, movement of the substrate supports 10, 13 in the XY direction is prevented by clamping all the actuators.

[0162] After substrates 16 and 17 are aligned according to one of the methods according to the invention, at least one of the substrates may be deformed in the direction of the other substrate using substrate deformation device 15 in order to join the substrates together in a pre-bonding manner.

[0163] Figure Labels 1 Alignment facility 2 Optical System 3 First / Upper Detection Unit 4 Second / Lower Detection Unit 5. Positioning devices 6 Additional Measurement Systems 7 Third / Additional Detection Unit 8. Positioning equipment for additional measurement systems 9 frames 10 First substrate support 10a First Fixed Surface 11 First moving device 12 Common theoretical focal plane of optical systems 13 Second / Upper Substrate Support 13a Second fixed surface 14 Second moving device 15 Substrate Deformation Equipment 16 Lower substrate 16i first contact surface 16° First Support Surface 17 Upper substrate 17i second contact surface 17° Second Support Surface 20 First alignment mark 21 Second alignment mark 22 Third alignment mark

Claims

1. A method for aligning and contacting a first contact surface (16i) of a first substrate (16) with a second contact surface (17i) of a second substrate (17), the method comprising the steps of: - The first support surface (16o) of the first substrate (16) is fixed on the first substrate support (10), and the second support surface (17o) of the second substrate (17) is fixed on the second substrate support (13), wherein the second substrate support can be arranged opposite to the first substrate support (10); - Detect the first XY position and / or first alignment orientation of the first alignment mark (20) on the first substrate (16); - Detect the second XY position and / or second alignment orientation of the second alignment mark (21) on the second substrate (17); - Align the first substrate (16) with respect to the second substrate (17); and - The first substrate (16), which is aligned relative to the second substrate (17), is brought into contact with the second substrate (17). in, Prior to the alignment, a third detection unit (7) additionally detects the third XY position and / or third alignment orientation of the third alignment mark (22) of the first substrate support (10) and / or the first substrate (16), and controls the alignment by means of the third detection unit (7), wherein the third alignment mark (22) is also visible when the first substrate (16) is aligned relative to the second substrate (17). In order to align the first substrate (16) and the second substrate (17), the third XY position and / or the third alignment orientation is associated with at least one of a) the first XY position and / or the first alignment orientation and b) the second XY position and / or the second alignment orientation, and is measured and adjusted in real time during the alignment.

2. The method of claim 1, wherein the first alignment mark (20) and the third alignment mark (22) are arranged on opposite sides of the first substrate (16) or the first substrate support (10) in the Z direction.

3. The method of claim 1, wherein the detection of the first alignment mark (20) and the third alignment mark (22) is performed in successive method steps by synchronization of the first detection unit (3) and the third detection unit (7).

4. The method of claim 3, wherein the detection of the first alignment mark (20) and the third alignment mark (22) is performed simultaneously in successive method steps.

5. The method according to any one of claims 1-4 above, wherein the second substrate support (13) is fixed at least in the XY direction during the alignment.

6. The method according to any one of claims 1-4 above, wherein the first detection unit (3) and the second detection unit (4) are disposed on a common XY positioning device, and / or the optical axes of the first detection unit (3) and the second detection unit (4) are aligned or assigned relative to each other.

7. The method according to any one of claims 1-4 above, wherein during the detection at least until the alignment, the third detection unit (7) is fixedly arranged in the X and Y directions relative to the optical system (2) composed of the first detection unit (3) and the second detection unit (4), and has no degrees of freedom.

8. The method of any one of claims 1-4, wherein the alignment control is performed solely by means of the detection of the third XY position and / or the third alignment orientation.

9. The method of any one of claims 1-4, wherein the first substrate and the second substrate are arranged between the first substrate support and the second substrate support at a distance between the first contact surface and the second contact surface in the Z direction during the detection and until the alignment.

10. The method of claim 9, wherein the spacing is less than 500 micrometers.

11. The method of claim 9, wherein the spacing is less than 100 micrometers.

12. The method of claim 9, wherein the spacing is less than 50 micrometers.

13. The method of claim 9, wherein the spacing is less than 10 micrometers.

14. An apparatus for aligning and contacting a first contact surface (16i) of a first substrate (16) with a second contact surface (17i) of a second substrate (17), the apparatus comprising: - A first substrate support (10) for fixing the first support surface (16o) of the first substrate (16), - A second substrate support (13) that can be disposed opposite to the first substrate support (10) is used to fix the second support surface (17o) of the second substrate (17). - A first detection unit (3) is used to detect the first XY position and / or first alignment orientation of the first alignment mark (20) on the first substrate (16). - A second detection unit (4) is used to detect the second XY position and / or second alignment orientation of the second alignment mark (21) on the second substrate (17). - Alignment device for aligning the first substrate (16) relative to the second substrate (17), and - A contact device (15) for contacting the first substrate (16), which is aligned with the second substrate (17), with the second substrate (17). in, The device has a third detection unit (7) for detecting the third XY position and / or third alignment orientation of the third alignment mark (22) of the first substrate support (10) and / or the first substrate (16), and the alignment can be controlled by means of the third detection unit (7), wherein the third alignment mark (22) is also visible when the first substrate (16) is aligned relative to the second substrate (17). In order to align the first substrate (16) and the second substrate (17), the third XY position and / or the third alignment orientation can be associated with at least one of a) the first XY position and / or the first alignment orientation and b) the second XY position and / or the second alignment orientation, and can be measured and adjusted in real time during the alignment.

15. The device of claim 14, wherein the first detection unit (3) and the third detection unit (7) are capable of being synchronized.

16. The device of claim 14, wherein the second substrate support (13) is configured to be fixed at least in the XY direction during the alignment.

17. The device of claim 14, wherein the first detection unit (3) and the second detection unit (4) are disposed on a common XY positioning device, and / or the optical axes of the first detection unit (3) and the second detection unit (4) are aligned or assigned relative to each other.

18. The device of claim 14, wherein during the detection at least until the alignment, the third detection unit (7) is fixedly positioned in the X and Y directions relative to the optical system (2) composed of the first detection unit (3) and the second detection unit (4), and has no degrees of freedom.

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