显示装置
By using a first fixing element to press against the adhesive layer during the manufacturing process of the LED display panel, the problem of LED element misalignment was solved, achieving high-yield bonding and improving the overall quality of the display device.
CN115719750BActive Publication Date: 2026-07-17AU OPTRONICS CORP
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AU OPTRONICS CORP
- Filing Date
- 2022-12-27
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
During the manufacturing process of LED display panels, misalignment of the LED components can prevent the electrodes from effectively engaging with the pads on the drive backplane, thus affecting the yield of the display device.
Method used
The first fixing element is used to press against the adhesive layer of the light-emitting element substrate. The light-emitting element is bonded to the pad of the driving back plate by laser irradiation, and the adhesive layer is fixed by the first fixing element to prevent positional displacement.
Benefits of technology
This improved the bonding yield between the LED components and the driving backplane, reduced positional shifts caused by thermal expansion and contraction, and improved the overall yield of the display device.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN115719750B_ABST
Abstract
一种显示装置包括承载基底、像素驱动电路、绝缘层、接垫组、发光元件及第一固定元件。像素驱动电路设置于承载基底上。绝缘层设置于像素驱动电路上。接垫组设置于绝缘层上且电性连接至像素驱动电路。发光元件电性连接至接垫组。第一固定元件设置于绝缘层上且至少位于接垫组的相对两侧。发光元件在垂直于承载基底的方向上具有高度HLED。第一固定元件在垂直于承载基底的方向上具有高度HPS1。接垫组的接垫在垂直于承载基底的方向上具有厚度HPAD。HLED、HPS1及HPAD满足：HLED≦HPS1<1.4(HLED+HPAD)。或者，HLED、HPS1及HPAD满足：HLED+90μm≦HPS1<1.4(HLED+HPAD+90μm)。
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