Anisotropic conductive film

Abstract

An anisotropic conductive film (1A) having a conductive particle dispersed layer (4) in which conductive particles (3) are dispersed in an insulating adhesive (2) in a predetermined dispersed state, is provided with a defective portion presentation unit (mark Q) that presents position information of a defective portion (P) of the conductive particle dispersed layer (4). In a method of attaching the anisotropic conductive film (1A) and an electronic component (100), based on the position information of the defective portion (P) obtained from the defective portion presentation unit (mark Q), a non-defective portion of the anisotropic conductive film (1A) is attached to a region where a terminal or a terminal column of the anisotropic conductive connection electronic component exists.

Description

Technical Field

[0001] This invention relates to anisotropic conductive films, methods for bonding anisotropic conductive films, and devices for bonding anisotropic conductive films. Background Technology

[0002] Anisotropic conductive films are widely used when mounting electronic components such as IC chips onto substrates. In recent years, high-density wiring has been required in small electronic devices such as mobile phones and laptops. As a method to make anisotropic conductive films correspond to this high density, various approaches have been explored to arrange conductive particles in a regular pattern. Known techniques include, for example, spreading conductive particles on an extended film, extending the film biaxially, thereby arranging the conductive particles in a single layer (Patent Documents 1, 2), or holding the conductive particles in a substrate material and transferring the conductive particles to an adhesive film to achieve a predetermined arrangement (Patent Documents 3, 4, 5), etc.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent No. 5147048; Patent Document 2: Japanese Patent No. 5147049; Patent document 3: Japanese Patent Application Publication No. 2007-165056; Patent document 4: Japanese Patent Application Publication No. 2005-209454; Patent document 5: Japanese Patent Application Publication No. 2004-335663. Summary of the Invention

[0004] The problem that the invention aims to solve However, even when using the techniques described in Patent Documents 1, 2, 3, 4, and 5 to manufacture anisotropic conductive films, it is difficult to completely eliminate the absence or aggregation of conductive particles. On the other hand, when anisotropic conductive films are used for the connection of electronic components, the absence or aggregation of conductive particles can cause poor conductivity or short circuits.

[0005] To address this, one approach is to inspect the dispersion of conductive particles before shipping the anisotropic conductive film, discarding any with defects or agglomeration. However, this method reduces the yield of the anisotropic conductive film, increasing its manufacturing cost.

[0006] Therefore, the present invention aims to address the issue of preventing poor conductivity or short circuits when using anisotropic conductive films with defects or agglomeration in the connection of electronic components, given a predetermined dispersion state of conductive particles.

[0007] Solution for solving the problem The inventors discovered that if, when inspecting the dispersion state of conductive particles in an anisotropic conductive film, and finding defects or agglomeration of conductive particles in a given dispersion state such as uniform dispersion under a given lattice arrangement, a given side-by-side configuration, or a given particle density, the defective areas can be clearly identified so that these defective areas can be avoided when using the anisotropic conductive film to connect electronic components, the aforementioned problem can be solved, and thus the present invention was conceived.

[0008] That is, the present invention provides an anisotropic conductive film having a conductive particle dispersion layer in which conductive particles are dispersed in an insulating adhesive in a predetermined dispersion state. The anisotropic conductive film has a defect location indication unit, which indicates the location information of the defective part of the dispersion state of the conductive particles.

[0009] In particular, the prompting unit that provides location information of the defective part can be provided in a manner in which a mark is provided on the anisotropic conductive film, or in a manner in which the anisotropic conductive film has a defective part information holding unit that records the location information of the defective part on the recording medium.

[0010] In addition, the present invention provides a method for pasting the above-mentioned anisotropic conductive film and electronic components, which, based on the location information of the defective part obtained from the defective part indication unit, pastes the non-defective part of the anisotropic conductive film to the area where the terminals or terminal rows of the anisotropic conductive connected electronic components exist.

[0011] Furthermore, the present invention provides an adhesive bonding apparatus for bonding the aforementioned anisotropic conductive film and electronic components, comprising: an alignment unit for aligning the anisotropic conductive film and electronic components by means of connecting the non-defective parts of the anisotropic conductive film and the terminals of the electronic components based on the position information of the defective parts obtained from the defective parts indication unit; and a pressing unit for bonding the anisotropic conductive film and electronic components.

[0012] Invention Effects The anisotropic conductive film of the present invention includes a defect indication unit that indicates the location of defective areas by indicating the dispersion state of conductive particles. Therefore, according to the bonding method and bonding apparatus of the present invention using the anisotropic conductive film, based on the location information of the defective areas obtained from the defect indication unit, only the non-defective areas of the anisotropic conductive film, i.e., the areas of the anisotropic conductive film that do not contain defective areas, are bonded to the areas where terminals or terminal rows of electronic components are connected via anisotropic conductivity. This allows only the non-defective areas of the anisotropic conductive film to be used for connecting the terminals of electronic components. Therefore, the reliability of connections using the anisotropic conductive film is improved without reducing the yield rate of the anisotropic conductive film. Attached Figure Description

[0013] [Figure 1 ] Figure 1 This is a schematic plan view of an anisotropic conductive film 1A, which is an embodiment of a defective part indication unit with a marking.

[0014] [ Figure 2 ] Figure 2 This is a schematic plan view of an anisotropic conductive film 1B, which is an embodiment of a defective part indication unit with a marking.

[0015] [ Figure 3 ] Figure 3 This is a schematic plan view of an anisotropic conductive film 1C, which is an embodiment of a defective part indication unit with a marking.

[0016] [ Figure 4 ] Figure 4 This is a schematic plan view of an anisotropic conductive film 1D, which is an embodiment of a defective part indication unit with markings.

[0017] [ Figure 5A ] Figure 5A This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0018] [ Figure 5B ] Figure 5B This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0019] [ Figure 5C ] Figure 5C This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0020] [ Figure 5D ] Figure 5D This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0021] [ Figure 5E ] Figure 5E This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0022] [ Figure 5F ] Figure 5F This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0023] [ Figure 6A ] Figure 6A This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0024] [ Figure 6B ] Figure 6BThis is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0025] [ Figure 6C ] Figure 6C This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0026] [ Figure 7A ] Figure 7A This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0027] [ Figure 7B ] Figure 7B This is a process diagram illustrating the method of attaching a marked anisotropic conductive film to electronic components.

[0028] [ Figure 8 ] Figure 8 This is an explanatory diagram of the location information of the defective part recorded in the defective part information holding unit.

[0029] [ Figure 9 ] Figure 9 This is a schematic diagram of a bonding device for attaching an anisotropic conductive film with a defect information retention unit to an electronic component. Detailed Implementation

[0030] The present invention will now be described in detail with reference to the accompanying drawings. Furthermore, in the drawings, the same reference numerals denote the same or equivalent structural elements.

[0031] <Anisotropic conductive film with markings> Figure 1 This is a schematic plan view of an anisotropic conductive film 1A according to an embodiment of the present invention, used in FOG or COG. The anisotropic conductive film 1A has a layer structure consisting of a conductive particle dispersion layer 4 in which conductive particles 3 are dispersed in a predetermined dispersion state in an insulating adhesive 2, and a substrate material film 5. More specifically, the conductive particles 3 in the conductive particle dispersion layer 4 are arranged in a square lattice and located at the intersections of the lattice lines (shown as dashed lines in the figure), i.e., lattice points.

[0032] Furthermore, in this invention, the dispersion of conductive particles in a predetermined dispersion state simply means that the conductive particles exist with a predetermined regularity. The conductive particles are not limited to a square grid arrangement; they can also be arranged in rectangular, rhomboid, or hexagonal grids, etc. In addition, not only can individual particles be arranged at grid points, but a predetermined number of conductive particles can also be arranged in groups. The conductive particles can be arranged side-by-side at a predetermined distance between particles, or they can be randomly dispersed while maintaining a predetermined distance between particles. There are no particular limitations on the method used to disperse the conductive particles in a predetermined dispersion state. For example, it can be a biaxial extension method using a film covered with conductive particles, as described in Patent Documents 1 and 2; it can be a method of transferring conductive particles held in a substrate material to a film, as described in Patent Documents 3, 4, and 5; or it can be a method using other known transfer molds. Examples include Japanese Patent Application Publication No. 2009-152160 and Japanese Patent Application Publication No. 2010-33793.

[0033] There are no particular restrictions on the structure or number density of the conductive particles themselves, or on the composition of the insulating adhesive itself; they can be set to be the same as those of known anisotropic conductive films.

[0034] Even when aiming to manufacture an anisotropic conductive film in which conductive particles are dispersed in a predetermined state, there are still defective areas in the actually manufactured anisotropic conductive film where the conductive particles are not in the predetermined dispersion state. Examples of such defective areas include: in the case of intending to arrange the conductive particles in a lattice pattern, areas where conductive particles are missing at lattice points or elsewhere; in anisotropic conductive films where conductive particles are evenly dispersed at a predetermined density regardless of the presence or absence of a lattice pattern, or in anisotropic conductive films for COG where conductive particles are arranged at a relatively high density; and in the case of metallic conductive particles, areas where they agglomerate due to magnetism. Figure 1 The diagram illustrates an example of a defective part in an anisotropic conductive film 1A, in which conductive particles are arranged in a square lattice, and a defective part P is present where conductive particles 3 are missing at lattice points.

[0035] The defective area P can be identified by examining the dispersion state of conductive particles in the anisotropic conductive film 1A through the combined use of a camera device and an image analysis and processing system (such as Mitani Corporation, WinROOF, etc.). Furthermore, as an example, a camera device with a maximum output pixel count (H) × (V) of 648 × 494 and a frame rate of 30–60 fps can be used.

[0036] The anisotropic conductive film 1A of this embodiment is characterized by having a mark Q as a defect indication unit for indicating defective areas P. This mark Q is an irradiation mark with a diameter of 0.3 to 1.0 mm, formed by irradiating the conductive particle dispersion layer 4 of the anisotropic conductive film 1A with a laser, thereby changing or modifying the surface state of the resin constituting the conductive particle dispersion layer 4 (thermosetting). In the case where the anisotropic conductive film 1A has a transparent cover film on the conductive particle dispersion layer 4 to prevent foreign matter contamination, the conductive particle dispersion layer 4 can also be irradiated with a laser through the cover film.

[0037] The irradiation conditions for forming such irradiation marks depend on the material of the surface of the anisotropic conductive film 1A to which the irradiation laser is applied. However, in the case of a thermosetting resin such as PET, a YAG laser or a YVO4 laser can be used. As an example, when a cover film made of transparent PET is laminated on the conductive particle dispersion layer 4, by irradiating the cover film with a laser at a wavelength of 1064 nm, an output of 1.3 to 10 W, and a duration of 100 to 1000 milliseconds, a mark Q can be formed only in the resin forming the conductive particle dispersion layer 4. The thickness of such a cover film can be practically set to 10 to 50 μm.

[0038] The mark Q can also be formed on the substrate material film 5. From the perspective of forming in a short time, it is preferable to modify the curable resin that forms the conductive particle dispersion layer 4 to form the mark Q. From the perspective of not applying unnecessary energy to the resin used for anisotropic conductive connections, it is preferable to form it on the substrate material film 5. Furthermore, when the mark Q is formed on the anisotropic conductive film 1A by laser irradiation, the generation or scattering of foreign matter that would cause obstacles to the connection using the anisotropic conductive film 1A is prevented.

[0039] In the anisotropic conductive film 1A of this embodiment, when performing a connection operation using the anisotropic conductive film 1A, a predetermined range upstream of the mark Q is designated as an area not used in the connection of electronic components. From this perspective, the mark Q is positioned downstream of the flow direction a of the anisotropic conductive film 1A during the connection operation, compared to the defective portion P. Furthermore, if the mark Q is discovered during the connection process using the anisotropic conductive film, the defective portion P located nearby can be excluded from connection. Therefore, corresponding to the device structure used in the connection process, the mark Q can also be formed upstream of the flow direction a of the anisotropic conductive film 1A, compared to the defective portion P. That is, the process of detecting the defective portion P after forming the anisotropic conductive film and forming the mark Q can be performed in any of the processes following the formation of the anisotropic conductive film, and the mark Q can be positioned either upstream or downstream of the defective portion P.

[0040] From the perspective of productivity of anisotropic conductive films and reducing the number of anisotropic conductive films that cannot be used for connection due to defective parts P, the distance L1 between the mark Q in the long side direction of the anisotropic conductive film 1A and the defective part P is set to a predetermined distance. That is, if the distance L1 is too short, the winding speed of the anisotropic conductive film needs to be slowed down after the mark Q is formed in the manufacturing process of the anisotropic conductive film, and productivity will decrease. Therefore, it is preferable to be 1 mm or more, more preferably 2 mm or more, and even more preferably 3 mm or more. On the other hand, if the distance L1 is too long, the area that can be used for the connection of the anisotropic conductive film becomes too narrow, which is not preferred. Therefore, the distance L1 is preferably less than half the length of the anisotropic conductive film required for the connection of each electronic component. Thus, the preferred length of the distance L1 varies with the length of the connected electronic component, but for example, when using COG, the distance L1 is preferably 15 mm or less, more preferably 10 mm or less, and even more preferably 5 mm or less.

[0041] Furthermore, the distance L2 between the defective portion P and the center of the mark Q in the short side direction (width direction) of the anisotropic conductive film 1A can be zero, as shown in the figure, or it can be set near the side edge in the long side direction of the anisotropic conductive film 1A, regardless of the position of the defective portion P. In the latter case, the area of ​​the detection mark Q can be limited to the vicinity of the side edge of the anisotropic conductive film when connecting the anisotropic conductive film and the electronic component. In addition, if the vicinity of the side edge in the long side direction of the anisotropic conductive film is originally unusable for connecting the electronic component due to the film width of the anisotropic conductive film and the size of the electronic component, by setting the mark Q near the side edge in the long side direction of the anisotropic conductive film, the area that cannot be used for connecting the electronic component due to the presence of the mark Q can be reduced.

[0042] In addition to using laser irradiation to form an irradiation mark, the marking Q can also be formed by first dispersing a substance that can be colored or changed by irradiation with light of a predetermined wavelength onto the substrate material film 5, and then forming a colored part by irradiating with light of that wavelength. Alternatively, it can be formed by printing or by bonding a seal.

[0043] Figure 2 In the anisotropic conductive film 1B shown above, a mark Q is provided for a defective location P where multiple conductive particles are aggregated at a single lattice point. In this case, regarding the formation position of the mark Q, with respect to the long side direction of the anisotropic conductive film 1B, the distance between the lattice point in the defective location P where conductive particles should be present and the center of the mark Q is a predetermined distance L1, while with respect to the short side direction of the anisotropic conductive film, it is located near the side edge of the anisotropic conductive film 1B in the long side direction.

[0044] Figure 3This is a schematic plan view of the anisotropic conductive film 1C used in a COG embodiment. Preferably, a mark Q corresponding to a defective area P is formed in the region 7 between the bonding position 6 of the electronic component (chip), indicated by the dashed line in the figure, and the side edge of the anisotropic conductive film 1C. Because the mark Q is present in this region 7, the area unusable for connecting electronic components (chips) can be reduced.

[0045] In addition, such as Figure 4 As shown in the embodiment of COG, the anisotropic conductive film 1D can also be used to form a mark Q corresponding to the defective part P in the non-adhesive area 8 of the electronic component (chip) that is periodically present in the long side direction of the anisotropic conductive film.

[0046] <Method for attaching marked anisotropic conductive films> If an anisotropic conductive film marked Q is used for connecting electronic components, based on the location information of the defective portion guided by the mark Q, it is possible to adhere only the non-defective portion of the anisotropic conductive film to the area where the terminals or terminal arrays of the electronic component are located for anisotropic conductive connection. This invention includes such an adhesion method. This adhesion method includes two modes: adhering only the non-defective portion of the anisotropic conductive film to the electronic component; and adhering not only the non-defective portion but also the defective portion P and the mark Q to the electronic component, but ensuring that the adhesion positions of the defective portion P and the mark Q do not obstruct the anisotropic conductive connection between the electronic components. In the latter mode, it is determined whether the adhesion position of the defective portion P and the mark Q obstructs the anisotropic conductive connection between the electronic components. If it obstructs the connection, adjustments are made to the alignment of the anisotropic conductive film and the electronic component, the feeding or retraction of the anisotropic conductive film, and the size of the thermoforming connector used during adhesion. The following section will explain in detail the former method (the method of attaching only the non-defective parts of the anisotropic conductive film to the electronic components).

[0047] (First pasting method) Figures 5A to 5F This is one method of bonding, which is a process illustration of a method for bonding an anisotropic conductive film 1 to a first electronic component such as an FPC, rigid substrate, ceramic substrate, plastic substrate, or glass substrate. In this bonding method, as described below, a predetermined area 11 containing the defective part P is removed from the anisotropic conductive film 1, and the remaining non-defective part is bonded to the electronic component.

[0048] Furthermore, the anisotropic conductive film 1 used here, as an example, has a laminated structure of a conductive particle dispersion layer 4 and a substrate material film 5, with the mark Q set at a predetermined distance downstream of the defective site P from the flow direction of the film.

[0049] First, such as Figure 5A As shown, the anisotropic conductive film 1 wound on the spool is unwound, and the mark Q is detected by a mark detection device 10, such as a CCD. As the mark detection device 10, a CCD or color sensor, a laser-based device, etc., can be used, and for example, a mark alignment detection device can also be used.

[0050] Next, in order to remove the predetermined area containing the defective portion P guided by the mark Q, firstly, a half-cut line 12 is formed on the line marking the area 11 using a half-cut forming unit. This half-cut line 12 is preferably formed from the conductive particle dispersion layer 4 side of the anisotropic conductive film 1 to the substrate material film 5 (…). Figure 5B ).

[0051] Next, adhesive tape 13 is applied to the area 11, including the defective part P, that should be removed. Figure 5C ), peel off the adhesive tape 13, thereby transferring the conductive particle dispersion layer 4 of region 11 to the adhesive tape 13 ( Figure 5D ).

[0052] After removing the conductive particle dispersion layer 4 from region 11, an edge detection device 15 such as a CCD is used to detect the edge portion 14 of the conductive particle dispersion layer 4 remaining in the anisotropic conductive film 1. Figure 5E Using an alignment unit (not shown), the anisotropic conductive film 1 and the first electronic component 100, such as an FPC, rigid substrate, ceramic substrate, plastic substrate, or glass substrate, are aligned with the edge 14 as a reference. The anisotropic conductive film 1 and the first electronic component 100 are temporarily pressed together using a thermoforming device 16 as a pressing unit. Figure 5F ).

[0053] Then, using common methods, the substrate material film 5 is peeled off from the anisotropic conductive film 1 temporarily pressed against the first electronic component 100, overlapped with the second electronic component such as an IC chip, IC module, FPC, etc., and formally pressed together. Alternatively, IC chips or IC modules can be similarly pasted, and these can be stacked to make the second electronic components anisotropically conductive to each other.

[0054] In this way, even if the anisotropic conductive film 1 has defective parts P, electronic components can be connected using only the areas without defective parts P. The present invention also includes an adhesive bonding device that, based on the location information of the defective parts P guided by a marker Q, adheres only the areas of the anisotropic conductive film without defective parts P to the electronic components.

[0055] (Second pasting method) As a method of attaching only the area of ​​the anisotropic conductive film that does not contain the defective part P to the electronic component based on the location information of the defective part guided by the mark Q, it is also possible to leave a predetermined area 11 containing the defective part on the substrate material film 5, so that the area 11 will not be used for connection with the electronic component and will be discharged.

[0056] For example, such as Figure 6A As shown, if a mark Q is detected from the anisotropic conductive film 1 released from the roll, a semi-tangent 17a is formed at a predetermined distance L3 from the center of the mark, in a direction upstream of the defective area P. Furthermore, a semi-tangent 17b is also formed upstream of this semi-tangent 17a at the location where the electronic component is to be pasted. Next, as... Figure 6B As shown, the area sandwiched between the semi-tangents 17a and 17b is aligned with the electronic component 100 using an alignment unit, and temporarily pressed together using a heat-pressing device 16. Thus, as... Figure 6C As shown, the conductive particle dispersion layer 4, which is attached to the electronic component 100, is peeled off from the substrate material film 5, while the defective part P remains on the substrate material film 5 and is discharged.

[0057] Furthermore, if the defective part P is discharged in a state where it remains in the substrate material film 5, the half-tangents 17a and 17b can be omitted, and the formation position of the half-tangent 17a can be set as the reference position for the bonding position such as the bonding position of the electronic component upstream from that position.

[0058] (Third pasting method) As a method of attaching only the area of ​​the anisotropic conductive film that does not contain the defective part P to the electronic component based on the location information of the defective part guided by the mark Q, it is also possible to cut out the predetermined area 11 containing the defective part P from the anisotropic conductive film and use the remaining area that does not contain the defective part for connection with the electronic component.

[0059] For example, such as Figure 7A As shown, if a mark Q is detected from the anisotropic conductive film 1 released from the reel, the anisotropic conductive film 1 is cut at a predetermined distance L3 from the center of the mark, upstream of the defective area P, from the mark Q. In the figure, reference numeral 18 indicates this cutting line. Furthermore, the remaining anisotropic conductive film 1 (after removing the predetermined region 11 containing the defective area P) is... Figure 7B Align and attach the components to the electronic parts.

[0060] <Anisotropic conductive film with a recording medium for recording information of defective areas> In the anisotropic conductive film of the present invention, the defective part indicating unit, which indicates the location information of the defective part P, can also replace the aforementioned marker Q and include a defective part information holding unit that records the location information of the defective part on a recording medium. Here, the location information of the defective part is, for example, as... Figure 8 As shown, the predetermined position of the anisotropic conductive film 1 is taken as the origin O of an xy coordinate system with the short and long sides of the anisotropic conductive film as the coordinate axes. The xy coordinates represent the positions of defective parts P1, P2, ... The position information of the defective parts is recorded in the memory card 20, and the memory card 20 is attached to the product of the anisotropic conductive film 1.

[0061] In the bonding apparatus for bonding the anisotropic conductive film 1 and the electronic component 100, the first, second, or third bonding method described above is performed based on the defect information read from the memory card 20.

[0062] In this invention, the defective part information storage unit of the recording medium records the location information of the defective part. Besides the memory card 20, it can be constructed using a known information recording medium such as a USB memory. Alternatively, the location information can be recorded on a small IC chip and attached to an anisotropic conductive film, such as in a film packaging bag or roll, and the location information can be read using short-range wireless communication technology such as NFC.

[0063] In addition, such as Figure 9 As shown, a defect information holding unit that records the location information of defective parts on a recording medium can also be installed in the processing unit 30 for quality management, product management, etc., of the anisotropic conductive film. In this case, for example, an identification mark 31 from which defect information can be obtained from the processing unit 30 can be first set on the outer packaging of the anisotropic conductive film 1. The identification mark 31 can be composed of characters, numbers, symbols, or combinations thereof. The identification mark 31 can also be represented by a two-dimensional code (QR code (registered trademark), barcode, etc.). Alternatively, based on the batch number of the anisotropic conductive film 1, the defect information can be retrieved from the processing unit 30 and delivered separately via email or the like.

[0064] Furthermore, the location information can be used in the computing device 30, which records the location information of the defective parts, to write information related to the connection quality of the electronic components during actual use. By sending it back to the destination of the anisotropic conductive film, it is expected to achieve improved quality management and corresponding efficiency.

[0065] As a method for attaching the anisotropic conductive film 1 with identification mark 31 to the electronic component 100, for example, an attachment device used for this attachment, such as... Figure 9The device includes: a semi-tangent forming unit 32 that forms a semi-tangent in the anisotropic conductive film based on the location information of the defective part; an adhesive bonding unit 33 that transfers the adhesive tape containing the defective part P to a predetermined area; an edge detection unit 34 that removes the predetermined area containing the defective part P from the anisotropic conductive film 1; an alignment unit for the edge-detected anisotropic conductive film and electronic components; a thermoforming device 35 that bonds the anisotropic conductive film and electronic components; and a controller 36 that controls their operation. When the controller 36 and the arithmetic unit 30 for managing the products of the anisotropic conductive film are connected via a communication line, information of the identification mark 31 is sent from the controller 36 to the arithmetic unit 30, and the location information of the defective part corresponding to the identification mark 31 is sent from the arithmetic unit 30 to the controller 36. Thus, based on the location information of the defective part, the controller 36 can bond the non-defective part of the anisotropic conductive film 1 to the electronic component.

[0066] According to this method, the location information of the inherent defective parts of the anisotropic conductive film 1 with identification mark 31 is provided from the computing device 30, so it is also possible to identify regular anisotropic conductive film products for product management and anisotropic conductive film products that are not regularly manufactured in imitation of the anisotropic conductive film. Example

[0067] The present invention will be specifically described below through examples.

[0068] (1) Fabrication of anisotropic conductive films (1-1) Fabrication of anisotropic conductive films with gaps in the arrangement of conductive particles The conductive particles are arranged in a 4-square grid as follows, but the anisotropic conductive film is missing some of the conductive particles at certain grid points.

[0069] Prepare a 2mm thick nickel plate and form cylindrical recesses (5μm inner diameter, 6μm depth) using a 4-square grid pattern. These recesses will serve as the transfer template (the distance between adjacent recesses is 8μm, and the density of recesses is 16,000 / mm²). 2 However, in a portion of the 4-square grid pattern, the grid dots are intentionally not recessed, thus creating a defect in the arrangement of the grid dots in the recesses. (Design value 14400 dots / mm) 2 ) On the obtained transfer print, a photopolymerizable resin composition containing 60 parts by weight of phenoxy resin (YP-50, Nippon Steel & Sumitomo Chemical Co., Ltd.), 29 parts by weight of acrylate resin (M208, Toa Synthetic Co., Ltd.), and 2 parts by weight of photopolymerization initiator (IRGACURE184, BASF Corporation of Japan) was coated onto a PET film to achieve a dry thickness of 30 μm. After drying at 80°C for 5 minutes, the print was irradiated with 1000 mJ of light using a high-pressure mercury lamp to create the transfer print.

[0070] The transfer body is peeled off from the original and wrapped around a 20cm diameter stainless steel roller with the raised portion facing outwards. While the roller is rotating, a micro-adhesive composition containing 70 parts by weight of epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.) and 30 parts by weight of phenoxy resin (YP-50, Nippon Steel & Sumitomo Chemical Co., Ltd.) is brought into contact with an adhesive sheet impregnated with nonwoven fabric. The micro-adhesive composition is then attached to the top surface of the raised portion, forming a 1μm thick micro-adhesive layer to obtain the transfer body.

[0071] After dispersing conductive particles (nickel-plated resin particles (AUL704, Sekisui Chemicals Co., Ltd.)) with an average particle size of 4 μm on the surface of the transfer material, conductive particles that are not attached to the micro-adhesive layer are removed by blowing air. The number of blowing air cycles is adjusted appropriately to intentionally cause the absence of conductive particles.

[0072] The conductive particles attached to the transfer body are pressed onto the insulating adhesive substrate, i.e., a sheet-like thermosetting insulating adhesive film with a thickness of 5 μm (a film formed from an insulating adhesive composition containing 60 parts by weight of phenoxy resin (YP-50, Nippon Steel & Sumitomo Chemical Co., Ltd.), 40 parts by weight of epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.), 2 parts by weight of cationic curing agent (SI-60L, Sanshin Chemical Industry Co., Ltd.), and 20 parts by weight of silica microparticles (AEROSIL RY200, AEROSIL Co., Ltd., Japan), at a temperature of 50°C and a pressure of 0.5 MPa, thereby transferring the conductive particles to the insulating adhesive substrate.

[0073] On the conductive particle transfer surface of the obtained insulating adhesive substrate, a sheet-like insulating adhesive film with a thickness of 15 μm is laminated as a transparent insulating adhesive capping layer. This film is formed from an insulating adhesive composition containing 60 parts by weight of phenoxy resin (YP-50, Nippon Steel & Sumitomo Chemical Co., Ltd.), 40 parts by weight of epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.), and 2 parts by weight of cationic curing agent (SI-60L, Sanshin Chemical Industry Co., Ltd.). The film is then laminated at a temperature of 60°C and a pressure of 2 MPa. An anisotropic conductive film is thus obtained.

[0074] (1-2) Fabrication of anisotropic conductive films with condensation of conductive particles in the arrangement of conductive particles The depth of the recesses in the original transfer plate is 4.4 μm, the inner diameter of the recesses is 4.8 μm, the distance between the centers of adjacent recesses is 5.6 μm, and the density of the recesses is increased to 32,000 / mm². 2 This makes it a transfer original that easily causes the aggregation of conductive particles. However, there was no intention to create defects in the grid arrangement of the recesses.

[0075] Using this transfer original, except that the number of times the ink is applied is less than that of (1-1), (1-1) is repeated to obtain an anisotropic conductive film.

[0076] (2) Formation of the mark Using an optical microscope (MX50, OLYMPUS Co., Ltd.), the arrangement of conductive particles in the anisotropic conductive films (1-1) and (1-2) was observed from the insulating adhesive capping layer side. In the anisotropic conductive film (1-1), defects were observed in 32% of all grid points, while in the anisotropic conductive film (1-2), aggregation was observed in 26% of all grid points. In this embodiment, locations where no conductive particles are present in 10 or more adjacent grid points are evaluated as "defects," and locations where 4 or more conductive particles are in contact are evaluated as "aggregates."

[0077] In the event of a defective area P such as a defect or agglomeration, a mark consisting of laser irradiation marks is formed on the anisotropic conductive film as a defect indication unit.

[0078] The laser irradiation mark was formed by irradiating the insulating adhesive capping layer with a laser using a laser marker (ML-7111A) manufactured by AMADA MIYACHI Co., Ltd. (irradiation conditions: 7W). Furthermore, the laser irradiation mark was formed at the side edge of the anisotropic conductive film along its long side, with the center of the laser irradiation mark positioned 2 mm away from the long side of the anisotropic conductive film where defects or agglomerations (P) can be observed.

[0079] The irradiation mark is approximately 350 μm in diameter.

[0080] Using an infrared spectrophotometer (manufactured by Nippon Spectrophotometer Co., Ltd., product number FT / IR-4100), the IR spectra before and after installation were measured at a distance of 300 μm from the center of the irradiation mark. The attenuation (%) of the absorption wavelength of the epoxy ring or the attenuation (%) of the absorption wavelength of the unsaturated group was calculated, thereby determining that the reactivity rate of the resin in the insulating adhesive capping layer was 40%. Similarly, the reactivity rate at a distance of 700 μm from the center of the irradiation mark was determined to be 0%. Therefore, it can be confirmed that when the distance from the center of the irradiation mark is 700 μm or more, the adhesion performance of the anisotropic conductive film does not decrease and does not hinder the connection performance.

[0081] (3) Connection of marked anisotropic conductive film and electronic components Two anisotropic conductive films manufactured by (1) were used respectively. A black and white camera module (Sony XC-HR50) and a machine vision lens (MORITEX MML1-ST65) were used to detect the marks. The anisotropic conductive films were attached to the substrate (a glass substrate with wiring with a wiring width of 15 μm and a wiring space of 15 μm) in a way that avoids the defective parts P guided by the marks. Then, the substrate and the chip (an IC chip with gold bumps of size 15×100 μm, height 15 μm, and bump space of 15 μm) were anisotropically conductively connected under the conditions of 180°C, 60MPa, and 5 seconds.

[0082] (4) Evaluation of the connection structure between the substrate and electronic components For the two connection structures obtained from (3), the following evaluations were made: (a) initial on-resistance, (b) on-resistance, and (c) short-circuit occurrence rate.

[0083] (a) Initial on-resistance The initial on-resistance of the connection structure was measured using a resistance meter (digital multimeter 7565, Yokogawa Electric Corporation). An initial on-resistance of 0.5Ω or less is considered good. The initial on-resistance of both connection structures was 0.5Ω or less.

[0084] (b) Conductivity The connection structure used for initial on-resistance measurement was placed in an aging test chamber set at 85°C and 85% humidity, and the on-resistance was measured after 500 hours, similar to the initial on-resistance measurement. The desired on-resistance after this aging test was below 5Ω. Both connection structures showed on-resistance below 5Ω after the aging test, indicating excellent conduction reliability.

[0085] (c) Short circuit occurrence rate For the two connection structures obtained in the same manner as in (3), the occurrence of short circuits between adjacent wirings was investigated. The expected short circuit rate was below 50 ppm. The short circuit rate for both connection structures was below 50 ppm.

[0086] The above methods confirmed that the lack of conductive particles caused poor conductivity or the agglomeration of conductive particles caused short circuits.

[0087] Label Explanation 1. Anisotropic conductive film; 2. Insulating adhesive; 3. Conductive particles; 4. Conductive particle dispersion layer; 5. Substrate material film; 6. Chip bonding position; 7. Area between the chip bonding position and the side edge of the anisotropic conductive film; 8. Non-bonded area of ​​the chip; 10. Marking detection device; 11. Removed area; 12. Half-tangent; 13. Adhesive tape; 14. Edge portion; 15. Edge detection device; 16. Thermobonding device; 17a, 17b. Half-tangent; 18. Cutting line; 20. Memory card; 30. Computing unit; 31. Identification mark; 32. Half-tangent forming unit; 33. Adhesive tape bonding unit; 34. Edge detection unit; 35. Thermobonding device; 36. Controller; 100. Electronic components; P, P1, P2. Defective areas; Q. Mark; a. Flow direction during anisotropic conductive film bonding; L1 L1: Distance between the defective part in the long side direction of the anisotropic conductive film and the center of the mark; L2: Distance between the defective part in the short side direction of the anisotropic conductive film and the center of the mark; L3: Distance between the bonding reference position and the center of the mark.

Claims

1. An anisotropic conductive film comprising a conductive particle dispersion layer in which conductive particles are dispersed in an insulating adhesive in a predetermined lattice arrangement. The anisotropic conductive film includes a defect location indication unit, which indicates the location information of the defect location based on the dispersion state of the conductive particles. As a defect indication unit, a mark is provided on the anisotropic conductive film. The distance between the mark and the defective area along the long side of the anisotropic conductive film is within 15 mm. A defective area in the dispersion of the conductive particles is a location where conductive particles are missing at the grid point, or a location where conductive particles aggregate at the grid point or elsewhere.

2. An anisotropic conductive film, comprising a conductive particle dispersion layer in which conductive particles are dispersed in an insulating adhesive in a predetermined lattice arrangement. The anisotropic conductive film has a substrate material film and a defect location indication unit, which indicates the location information of the defect location based on the dispersion state of the conductive particles. As a defect indication unit, a mark is provided on the substrate material film. The distance between the mark and the defective area along the long side of the anisotropic conductive film is within 15 mm. A defective area in the dispersion of the conductive particles is a location where conductive particles are missing at the grid point, or a location where conductive particles aggregate at the grid point or elsewhere.

3. The anisotropic conductive film as described in claim 1 or 2, wherein, The distance between the mark and the defective area in the long side direction of the anisotropic conductive film is within 5 mm.

4. The anisotropic conductive film as described in claim 1 or 2, wherein, The markings are positioned near the side edge of the anisotropic conductive film along its long side.

5. The anisotropic conductive film as described in claim 1, wherein, The marker is disposed in the conductive particle dispersion layer.

6. The anisotropic conductive film as described in claim 1 or 2, wherein, The markings are laser irradiation marks.

7. The anisotropic conductive film as described in claim 1 or 2, wherein, As a defective part indication unit, it has a defective part information retention unit that records the location information of the defective part on the recording medium.

8. The anisotropic conductive film as described in claim 7, wherein, As a defect information retention unit, a recording medium containing defect information is attached to an anisotropic conductive film.

9. The anisotropic conductive film as described in claim 7, wherein, As a defect information holding unit, it has a computing device for managing an anisotropic conductive film, and an identification mark is provided on the anisotropic conductive film that can obtain defect information from the computing device.

10. A method for pasting anisotropic conductive film and electronic components according to any one of claims 1 to 9, wherein, based on the location information of the defective part obtained from the defective part indication unit, the non-defective part of the anisotropic conductive film is pasted to the area where the terminals or terminal rows of the anisotropically conductive electronic components exist.

11. The pasting method as described in claim 10, wherein, In the case of anisotropic conductive film having a substrate material film, based on the location information of the defective parts, the predetermined area containing the defective parts is removed from the conductive particle dispersion layer, and the remaining non-defective parts are bonded to the electronic components.

12. The pasting method as described in claim 10, wherein, Based on the location information of the defective parts, the components are sent out in a way that excludes the predetermined area containing the defective parts, and the remaining non-defective parts are attached to the electronic components.

13. The pasting method as described in claim 10, wherein, Based on the location information of the defective part, the predetermined area containing the defective part of the anisotropic conductive film is cut off, and the remaining non-defective part is pasted to the electronic component.

14. The pasting method according to any one of claims 10 to 13, wherein, By sending identification tag information to the management computing device, information on defective parts is obtained from the management computing device, and this information on defective parts is used.

15. A bonding apparatus for bonding an anisotropic conductive film and an electronic component according to any one of claims 1 to 9, comprising: an alignment unit for aligning the anisotropic conductive film and the electronic component by connecting a non-defective part of the anisotropic conductive film and a terminal of the electronic component based on position information of the defective part obtained from a defective part indicating unit; and a pressing unit for bonding the anisotropic conductive film and the electronic component.

16. The adhesive device as claimed in claim 15, wherein, The adhesive device is an adhesive device for anisotropic conductive films according to any one of claims 1 to 6, and has a marking detection device.

17. A connection structure formed by anisotropically conductively connecting a first electronic component and a second electronic component via an anisotropic conductive film as described in any one of claims 1 to 9.

18. A connection method for anisotropically conductively connecting a first electronic component and a second electronic component via an anisotropic conductive film as described in any one of claims 1 to 9.

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