Thin-film capacitors and electronic circuit boards incorporating them

By employing roughened metal foil and an open dielectric film structure in film capacitors, the problems of large ESR and ESL, poor short circuit, and complex structure of existing film capacitors are solved. This achieves same-side configuration of terminal electrodes and thinning of the capacitor, thereby improving the reliability and sealing of the capacitor.

CN115720677BActive Publication Date: 2026-06-30TDK CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TDK CORP
Filing Date
2020-12-24
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing film capacitors have problems such as large ESR and ESL, easy short circuit failure, complex structure, inability to connect terminal electrodes from one side, and thick thickness.

Method used

The structure involves roughening one main surface of a metal foil to form an opening in the metal foil covered by a dielectric film, and then placing a first electrode layer on the dielectric film in contact with the metal foil, while a second electrode layer remains in contact with the dielectric film instead of the metal foil.

Benefits of technology

This design enables the configuration of a pair of terminal electrodes on the same surface, avoiding short-circuit defects, simplifying the structure, reducing thickness, and improving adhesion and reliability with the dielectric film.

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    Figure CN115720677B_ABST
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Abstract

The present invention provides a thin-film capacitor that is less prone to electrode layer peeling. The thin-film capacitor (1) comprises: a metal foil (10) having a roughened upper surface (11); a dielectric film (D) covering the upper surface (11) of the metal foil (10) and having an opening that partially exposes the metal foil (10); a first electrode layer that is in contact with the metal foil (10) via the opening and with the dielectric film (D); and a second electrode layer that is in contact with the dielectric film (D) but not with the metal foil (10). Thus, both the first and second electrode layers can be disposed on the upper surface (11) of the metal foil (10). Moreover, since the first electrode layer is in contact with both the metal foil (10) and the dielectric film (D), peeling of the first electrode layer is less likely to occur.
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