Copper foil product with multiple tear tabs anti-glue-out processing system and method

Abstract

The present application relates to a kind of copper foil product anti-glue processing system and method with multiple tear hand, including first copper foil unwinding roller, substrate conductive adhesive unwinding roller, substrate conductive adhesive self paper winding roller, auxiliary material release film unwinding roller, glue copper foil winding roller, substrate conductive adhesive self paper unwinding roller, silicon rubber protective film unwinding roller, first die cutting mechanism, second copper foil unwinding roller, second die cutting mechanism, row profile waste winding roller, finished product winding roller and several attaching mechanisms.Compared with prior art, the present application can solve the problem of pulling glue, avoid the phenomenon of lack of glue, improve the processing quality of copper foil product.

Description

Technical Field

[0001] This invention belongs to the die-cutting industry, specifically relating to a copper foil product anti-short glue processing system and method with multiple tear handles. Background Technology

[0002] Copper foil is a cathodic electrolytic material, a thin, continuous metal foil deposited on the substrate layer of a circuit board, serving as a conductor. It easily adheres to insulating layers, receives printed protective layers, and is etched to form circuit patterns. Copper foil is typically bonded to substrate-free conductive adhesive, primarily used for electromagnetic shielding, specifically electrical signal shielding and magnetic signal shielding. Electrical signal shielding relies mainly on the excellent conductivity of copper itself, while magnetic shielding requires the conductive material "nickel" on the adhesive surface of the copper foil tape to achieve magnetic shielding. Therefore, it is widely used in mobile phones, laptops, and other digital products.

[0003] Due to the unique nature of substrate-free double-sided tape (the adhesive is applied directly to the release paper for molding), substrate-free double-sided tape may experience adhesive stretching during manufacturing. For example... Figure 1 The copper foil adhesive product shown has a cut line at the tear handle position, dividing it into two parts (Tear Handle 1 and Tear Handle 2). The tear handle film is release paper. During manufacturing, the tear handle position and cut line are cut together with the adhesive. Because the adhesive is not discharged as waste, only cuts are made. The characteristic of substrate-free adhesive is its fluidity; after the copper foil is applied in the second die-cutting, the adhesive does not decrease. During the processing, in the first die-cutting, several cut lines are made on the substrate-free conductive adhesive and the auxiliary release film. The adhesive on the substrate-free conductive adhesive easily sticks to the auxiliary release film, causing damage to the adhesive tape when the auxiliary release film is removed. In the first die-cutting, the lines on the left and right sides of the tear handle do not affect the product if the adhesive pull is small. However, the cut line in the middle can cause adhesive shortages in the final product. Because the tear handle film is applied over the adhesive, it is impossible to confirm whether the adhesive is intact, leading to problems with insufficient adhesive and unidentifiable defects, ultimately affecting customer use. Summary of the Invention

[0004] The purpose of this invention is to solve the problem of insufficient adhesive in copper foil products with multiple tear handles during die-cutting, and to provide a processing system and method for preventing insufficient adhesive in copper foil products with multiple tear handles.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A copper foil product anti-slip processing system with multiple tear handles, used for producing copper foil products with multiple tear handles, includes a copper foil adhesive application unit and a copper foil die-cutting unit, wherein:

[0007] The copper foil adhesive application unit includes:

[0008] The first copper foil unwinding roller is used to release the copper foil.

[0009] The substrate-free conductive adhesive unwinding roller is located downstream of the first copper foil unwinding roller along the material strip movement direction, and is used to release the substrate-free conductive adhesive and adhere it to the upper part of the copper foil;

[0010] The substrate-free conductive adhesive self-paper take-up roller is located downstream of the substrate-free conductive adhesive unwinding roller along the material belt movement direction, and is used to take up the self-paper on the substrate-free conductive adhesive.

[0011] The auxiliary release film unwinding roller is located downstream of the substrate-free conductive adhesive self-contained paper take-up roller along the material belt movement direction, and is used to release the auxiliary release film and adhere it to the upper part of the substrate-free conductive adhesive.

[0012] Adhesive-coated copper foil take-up roller, used to take up copper foil that has been coated with adhesive;

[0013] The copper foil die-cutting unit includes:

[0014] Substrate-free conductive adhesive self-contained paper unwinding roller, used to release the substrate-free conductive adhesive self-contained paper;

[0015] The silicone protective film unwinding roller is located downstream of the substrate-free conductive adhesive self-adhesive paper unwinding roller along the material belt movement direction, and is used to release the silicone protective film and adhere it to the lower part of the substrate-free conductive adhesive self-adhesive paper.

[0016] The first die-cutting mechanism is used to die-cut the substrate-free conductive adhesive self-adhesive paper and silicone protective film after lamination, and punch out the tear handle and the outline of the cut line of the copper foil product in one go.

[0017] The second copper foil unwinding roller is located downstream of the first die-cutting mechanism along the direction of material strip movement. It is used to release the copper foil with adhesive and adhere it to the upper part of the substrate-free conductive adhesive self-adhesive paper.

[0018] The second die-cutting mechanism is used to die-cut the copper foil, substrate-free conductive adhesive paper, and silicone protective film after they have been bonded and glued, and to punch out the outline of the copper foil product in a second time.

[0019] The waste material take-up roller is located downstream of the second die-cutting mechanism along the material strip movement direction and is used to take up the waste material after secondary punching.

[0020] Finished product take-up rollers, used for winding finished copper foil products; and

[0021] Several bonding mechanisms are arranged between each unwinding roller and each take-up roller to bond the various strips together.

[0022] As a preferred technical solution, the core diameter of the adhesive copper foil take-up roller is 6 inches or more.

[0023] As a preferred technical solution, the copper foil is wound with the copper foil facing outwards during winding. The copper foil material is relatively brittle and easily wrinkles, thus preventing the copper foil from wrinkling.

[0024] As a preferred technical solution, the bonding mechanism consists of a pair of rotating rollers.

[0025] As a preferred technical solution, the first die-cutting mechanism includes a first upper die-cutting unit and a first lower die-cutting unit corresponding to the first upper die-cutting unit. The first upper die-cutting unit is provided with a first die-cutting cutter, and the blade profile of the first die-cutting cutter matches the shape of the tear handle and the outline of the tangent of the copper foil product.

[0026] As a preferred technical solution, the first die-cutting tool includes:

[0027] The first tearing line cutter is used to cut the outer contour of the tearing line on copper foil products;

[0028] A wire cutter is used to cut the wires in copper foil products.

[0029] As a preferred technical solution, the second die-cutting mechanism includes a second upper die-cutting unit and a second lower die-cutting unit corresponding to the second upper die-cutting unit, wherein the second upper die-cutting unit is provided with a second die-cutting tool;

[0030] The second die-cutting tool includes:

[0031] The second tearing blade is used to further cut the tearing line of the copper foil product;

[0032] Product contour cutting tool, used for cutting the outer contour of copper foil products.

[0033] As a preferred technical solution, the copper foil product has a three-layer structure, including a copper foil layer, a substrate-free conductive adhesive layer, and a silicone protective film layer, with multiple tear handles on the edge.

[0034] A method for preventing adhesive loss in copper foil products with multiple tear handles, using the aforementioned processing system, specifically includes the following steps:

[0035] (1) The first copper foil unwinding roller releases the copper foil, the substrate-free conductive adhesive unwinding roller releases the substrate-free conductive adhesive and adheres to the upper part of the copper foil, and is pressed by the bonding mechanism. The substrate-free conductive adhesive self-paper take-up roller takes up the self-paper on the substrate-free conductive adhesive for later use.

[0036] (2) The auxiliary release film release roller releases the auxiliary release film and adheres it to the upper part of the substrate-free conductive adhesive. It is then pressed by the bonding mechanism, and then the adhesive copper foil take-up roller takes up the adhesive copper foil for later use.

[0037] (3) The substrate-free conductive adhesive self-paper unwinding roller releases the substrate-free conductive adhesive self-paper, and the silicone protective film unwinding roller releases the silicone protective film and adheres to the lower part of the substrate-free conductive adhesive self-paper, and is pressed together by the bonding mechanism.

[0038] (4) The first die-cutting mechanism performs die-cutting on the laminated substrate-free conductive adhesive self-adhesive paper and silicone protective film, and punches out the tear handle and the outline of the cut line of the copper foil product in one go.

[0039] (5) The second copper foil unwinding roller releases the copper foil with adhesive and adheres it to the upper part of the substrate-free conductive adhesive paper, and then presses it together by the bonding mechanism;

[0040] (6) The second die-cutting mechanism performs die-cutting on the bonded copper foil, the substrate-free conductive adhesive paper, and the silicone protective film, and punches out the outline of the copper foil product in a second time.

[0041] (7) The outline waste rewinding roller rewinds the waste material after secondary punching, and the finished product rewinding roller rewinds the finished copper foil product.

[0042] The substrate-free conductive adhesive in step (3) comes from step (1); the copper foil with adhesive applied in step (5) comes from step (2).

[0043] This invention solves the problem of insufficient adhesive in the die-cutting of copper foil products with multiple tear handles by improving the product die-cutting system and process. The main innovations of this application lie in the arrangement design of each roller, the design of the preparation process, and the unique waste removal method. Compared with the prior art, this invention first bonds the adhesive to the copper foil, rolls it up, and leaves the self-supporting paper of the substrate-free conductive adhesive. This paper is used to punch the cut lines and part of the tear handle lines from the first punching. Then, the copper foil with adhesive is attached to the self-supporting paper of the adhesive and punched a second time to punch out the outline. After punching out the outline, the waste is removed, leaving the product. After the adhesive and copper foil are bonded together, there is no problem of insufficient adhesive. Then, the whole product is attached to the self-supporting paper of the substrate-free conductive adhesive, avoiding the problem of adhesive pulling, and achieving very good technical results.

[0044] Compared to existing processing methods, there is a problem of glue pulling when dispensing auxiliary materials and release film, with a glue pulling rate of about 15%. The glue shortage caused by glue pulling cannot be detected because it is covered by the tearing hands, which may result in missed products being sent to the customer and causing the risk of defective workpieces. By using the method of this invention, the glue pulling problem can be completely avoided and there is no glue shortage phenomenon. Attached Figure Description

[0045] Figure 1 A schematic diagram of the structure of a copper foil adhesive product;

[0046] Figure 2 This is a schematic diagram of the copper foil adhesive application unit of the present invention;

[0047] Figure 3This is a schematic diagram of the copper foil die-cutting unit of the present invention;

[0048] Figure 4 This is a schematic diagram of the punching tool of the first die-cutting mechanism of the present invention;

[0049] Figure 5 This is a schematic diagram of the process of punching the material strip by the first die-cutting mechanism of the present invention;

[0050] Figure 6 This is a schematic diagram of the punching tool of the second die-cutting mechanism of the present invention;

[0051] Figure 7 This is a schematic diagram of the process of punching the material strip by the second die-cutting mechanism of the present invention;

[0052] Figure 8 A schematic diagram of an existing copper foil adhesive product manufacturing system;

[0053] Figure 9 A schematic diagram of the structure of a punching and cutting tool in an existing copper foil adhesive product manufacturing system;

[0054] Figure 10 A schematic diagram of the process of cutting a strip of material in an existing copper foil adhesive product manufacturing system.

[0055] Figure 11 A schematic diagram of the structure of a two-punch cutting tool in an existing copper foil adhesive product manufacturing system;

[0056] Figure 12 This is a schematic diagram of the two-stage punching process for cutting the material strip in the existing copper foil adhesive product manufacturing system. Detailed Implementation

[0057] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0058] Comparative Example

[0059] Figure 1 This is a structural diagram of a copper foil adhesive product. Figure 1 The copper foil adhesive product shown has a tangent line at the tear handle position, dividing the tear handle into two parts (tear handle 1 and tear handle 2).

[0060] like Figures 8-12This diagram illustrates the existing copper foil adhesive product manufacturing system. Due to the unique nature of the substrate-free process (adhesive is directly applied to release paper for molding), substrate-free double-sided adhesives experience adhesive stretching during production. The release liner is part of the release paper; during manufacturing, the adhesive is cut along with the release liner and along the cut lines. Since the adhesive is not discharged as waste, only cuts are made. The substrate-free adhesive is fluid, and after the copper foil is applied in the second die-cutting process, the adhesive does not decrease. During the first die-cutting, several cut lines are made on the substrate-free conductive adhesive and the auxiliary release liner. The adhesive on the substrate-free conductive adhesive easily adheres to the auxiliary release liner, causing damage to the adhesive tape when the auxiliary release liner is removed. While the cut lines on the left and right sides do not affect the product if the adhesive stretching is small, the cut lines in the middle can lead to adhesive shortages in the final product. Because the release liner is applied over the adhesive, it is impossible to confirm the integrity of the adhesive, resulting in unidentifiable defects due to adhesive shortages, ultimately affecting customer use.

[0061] Example

[0062] Reference Figure 1-7 A copper foil product anti-slip processing system with multiple tear handles, used for producing copper foil products with multiple tear handles, includes a copper foil adhesive application unit and a copper foil die-cutting unit, wherein:

[0063] like Figure 2 The copper foil bonding unit includes:

[0064] The first copper foil unwinding roller 100 is used to release the copper foil;

[0065] The substrate-free conductive adhesive unwinding roller 200 is located downstream of the first copper foil unwinding roller 100 along the material strip moving direction, and is used to release the substrate-free conductive adhesive and adhere it to the upper part of the copper foil.

[0066] The substrate-free conductive adhesive self-paper take-up roller 300 is located downstream of the substrate-free conductive adhesive unwinding roller 200 along the material belt movement direction, and is used to wind up the self-paper on the substrate-free conductive adhesive.

[0067] The auxiliary release film unwinding roller 400 is located downstream of the substrate-free conductive adhesive self-contained paper take-up roller 300 along the material belt moving direction. It is used to release the auxiliary release film and adhere it to the upper part of the substrate-free conductive adhesive.

[0068] 500 adhesive copper foil winding roller, used to wind up copper foil that has been coated with adhesive;

[0069] like Figure 3 The copper foil die-cutting unit includes:

[0070] The substrate-free conductive adhesive self-contained paper unwinding roller 600 is used to release the substrate-free conductive adhesive self-contained paper.

[0071] The silicone protective film unwinding roller 700 is located downstream of the substrate-free conductive adhesive self-adhesive paper unwinding roller 600 along the material belt moving direction. It is used to release the silicone protective film and adhere it to the lower part of the substrate-free conductive adhesive self-adhesive paper.

[0072] The first die-cutting mechanism 800 is used to die-cut the substrate-free conductive adhesive self-adhesive paper and silicone protective film after lamination, and punch out the tear handle and the outline of the cut line of the copper foil product in one go.

[0073] The second copper foil unwinding roller 900 is located downstream of the first die-cutting mechanism 800 along the material belt moving direction. It is used to release the copper foil with adhesive and adhere it to the upper part of the substrate-free conductive adhesive self-adhesive paper.

[0074] The second die-cutting mechanism 1000 is used to die-cut the copper foil, the substrate-free conductive adhesive paper, and the silicone protective film after they have been bonded and glued, and to punch out the outline of the copper foil product in a second time.

[0075] The waste material take-up roller 1100 is located downstream of the second die-cutting mechanism 1000 along the material strip moving direction and is used to take up the waste material after secondary punching.

[0076] Finished product winding roller 1200, used for winding finished copper foil products; and

[0077] Several bonding mechanisms 1300 are arranged between each unwinding roller and the take-up roller to bond the various material strips.

[0078] As a preferred technical solution, the core diameter of the adhesive copper foil take-up roller 500 is more than 6 inches. When the adhesive copper foil take-up roller 500 is winding, the copper foil is wound outward. The copper foil material is relatively brittle and easily wrinkles, so as to prevent the copper foil from wrinkling.

[0079] The bonding mechanism consists of a pair of rotating rollers, and the die-cutting system is also equipped with several auxiliary rollers 1400.

[0080] The first die-cutting mechanism 800 includes a first upper die-cutting unit and a first lower die-cutting unit corresponding to the first upper die-cutting unit. The first upper die-cutting unit is provided with a first die-cutting cutter. The blade profile of the first die-cutting cutter matches the shape of the tear line and tangent profile of the copper foil product. The first die-cutting cutter includes: a first tear line cutter 801, used to cut the outer contour of the tear line of the copper foil product; and a tangent cutter 802, used to cut the tangent of the copper foil product.

[0081] The second die-cutting mechanism 1000 includes a second upper die-cutting unit and a second lower die-cutting unit corresponding to the second upper die-cutting unit. The second upper die-cutting unit is provided with a second die-cutting tool. The second die-cutting tool includes: a second tear line cutter 1002, used to further punch the tear line of the copper foil product; and a product contour cutter 1001, used to punch the outer contour of the copper foil product.

[0082] The copper foil product has a three-layer structure, including a copper foil layer, a substrate-free conductive adhesive layer, and a silicone protective film layer, with multiple tear handles on the edges.

[0083] The processing method of the above system specifically includes the following steps:

[0084] 1. The first copper foil unwinding roller 100 releases the copper foil, the substrate-free conductive adhesive unwinding roller 200 releases the substrate-free conductive adhesive and adheres it to the upper part of the copper foil, and presses it through the bonding mechanism. The substrate-free conductive adhesive self-paper take-up roller 300 takes up the self-paper on the substrate-free conductive adhesive for later use.

[0085] 2. The auxiliary release film unwinding roller 400 releases the auxiliary release film and adheres it to the top of the substrate-free conductive adhesive. It is then pressed by the bonding mechanism, and then the adhesive copper foil winding roller 500 winds up the adhesive copper foil for later use.

[0086] 3. The substrate-free conductive adhesive self-paper unwinding roller 600 releases the substrate-free conductive adhesive self-paper, and the silicone protective film unwinding roller 700 releases the silicone protective film and adheres to the lower part of the substrate-free conductive adhesive self-paper. The film is then pressed together by the bonding mechanism. The substrate-free conductive adhesive self-paper comes from step 1.

[0087] 4. The first die-cutting mechanism 800 performs die-cutting on the laminated substrate-free conductive adhesive self-adhesive paper and silicone protective film, punching out the tear handle and the outline of the cut line of the copper foil product in one go.

[0088] 5. The second copper foil unwinding roller 900 releases the copper foil with adhesive and adheres it to the top of the conductive adhesive paper without substrate. The two are then pressed together by the bonding mechanism. The copper foil with adhesive comes from step 2.

[0089] 6. The second die-cutting mechanism 1000 performs die-cutting on the bonded copper foil, the substrate-free conductive adhesive paper, and the silicone protective film, and punches out the outline of the copper foil product in a second cut.

[0090] 7. The 1100 profile waste winding roller winds up the waste material after secondary punching, and the 1200 finished product winding roller winds up the finished copper foil product.

[0091] By improving the product die-cutting system and process, the problem of insufficient adhesive in copper foil products with multiple tear handles during die-cutting is solved. Compared with the existing processing method, there is a problem of adhesive pulling when laying the release film, with a pulling rate of about 15%. The adhesive shortage caused by adhesive pulling cannot be detected because it is covered by the tear handle, resulting in missed products being sent to the customer and causing the risk of defective workpieces. With the method of this invention, the adhesive pulling problem can be completely avoided, and there is no adhesive shortage.

[0092] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. A copper foil product anti-slip processing system with multiple tear handles, used for producing copper foil products with multiple tear handles, characterized in that, Includes a copper foil bonding unit and a copper foil die-cutting unit, wherein: The copper foil adhesive application unit includes: The first copper foil unwinding roller (100) is used to release the copper foil; The substrate-free conductive adhesive unwinding roller (200) is located downstream of the first copper foil unwinding roller (100) along the material strip moving direction, and is used to release the substrate-free conductive adhesive and adhere it to the upper part of the copper foil. The substrate-free conductive adhesive self-paper take-up roller (300) is located downstream of the substrate-free conductive adhesive unwinding roller (200) along the material belt movement direction, and is used to take up the self-paper on the substrate-free conductive adhesive; The auxiliary release film unwinding roller (400) is located downstream of the substrate-free conductive adhesive self-contained paper take-up roller (300) along the material belt moving direction, and is used to release the auxiliary release film and adhere it to the upper part of the substrate-free conductive adhesive. Adhesive-coated copper foil take-up roller (500), used to take up copper foil that has been coated with adhesive; The copper foil die-cutting unit includes: Substrate-free conductive adhesive self-contained paper unwinding roller (600) is used to release substrate-free conductive adhesive self-contained paper; The silicone protective film unwinding roller (700) is located downstream of the substrate-free conductive adhesive self-adhesive paper unwinding roller (600) along the material belt moving direction, and is used to release the silicone protective film and adhere it to the lower part of the substrate-free conductive adhesive self-adhesive paper. The first die-cutting mechanism (800) is used to die-cut the substrate-free conductive adhesive self-adhesive paper and silicone protective film after lamination, and punch out the tear handle and the outline of the cut line of the copper foil product in one go. The second copper foil unwinding roller (900) is located downstream of the first die-cutting mechanism (800) along the material strip moving direction. It is used to release the copper foil with adhesive and adhere it to the upper part of the substrate-free conductive adhesive self-adhesive paper. The second die-cutting mechanism (1000) is used to die-cut the copper foil, the substrate-free conductive adhesive paper, and the silicone protective film after they are bonded and glued, and to punch out the outline of the copper foil product in a second time. The waste material take-up roller (1100) is located downstream of the second die-cutting mechanism (1000) along the material strip moving direction and is used to take up the waste material after secondary punching. Finished product winding roll (1200), used for winding finished copper foil products; and Several bonding mechanisms (1300) are arranged between each unwinding roller and the rewinding roller to bond the various strips together.

2. The anti-slip adhesive processing system for copper foil products with multiple tear handles according to claim 1, characterized in that, The core diameter of the adhesive copper foil take-up roller (500) is 6 inches or more.

3. The anti-slip adhesive processing system for copper foil products with multiple tear handles according to claim 1, characterized in that, When the adhesive copper foil take-up roller (500) is winding, the copper foil is wound outwards.

4. The anti-slip adhesive processing system for copper foil products with multiple tear handles according to claim 1, characterized in that, The bonding mechanism consists of a pair of rotating rollers, and the copper foil die-cutting unit is also provided with several auxiliary rollers (1400).

5. The anti-slip adhesive processing system for copper foil products with multiple tear handles according to claim 1, characterized in that, The first die-cutting mechanism (800) includes a first upper die-cutting unit and a first lower die-cutting unit corresponding to the first upper die-cutting unit. The first upper die-cutting unit is provided with a first die-cutting cutter. The blade profile of the first die-cutting cutter matches the shape of the tear handle and tangent profile of the copper foil product.

6. A copper foil product anti-shortage processing system with multiple tear handles according to claim 5, characterized in that, The first die-cutting tool includes: The first tearing blade (801) is used to cut the outer contour of the tearing line of copper foil products; The wire cutter (802) is used for cutting the wires of copper foil products.

7. A copper foil product anti-shortage processing system with multiple tear handles according to claim 1, characterized in that, The second die-cutting mechanism (1000) includes a second upper die-cutting unit and a second lower die-cutting unit corresponding to the second upper die-cutting unit, wherein the second upper die-cutting unit is provided with a second die-cutting tool; The second die-cutting tool includes: The second tearing blade (1002) is used to further punch and cut the tearing line of the copper foil product; Product contour cutter (1001), used for punching the outer contour of copper foil products.

8. The anti-slip adhesive processing system for copper foil products with multiple tear handles according to claim 1, characterized in that, The copper foil product has a three-layer structure, including a copper foil layer, a substrate-free conductive adhesive layer, and a silicone protective film layer, with multiple tear handles on the edge.

9. A method for preventing adhesive loss in copper foil products with multiple tear handles, characterized in that, The manufacturing process, using the processing system described in any one of claims 1-8, specifically includes the following steps: (1) The first copper foil unwinding roller (100) releases the copper foil, the substrate-free conductive adhesive unwinding roller (200) releases the substrate-free conductive adhesive and adheres it to the upper part of the copper foil, and presses it by the bonding mechanism. The substrate-free conductive adhesive self-paper take-up roller (300) takes up the self-paper on the substrate-free conductive adhesive for later use. (2) The auxiliary release film unwinding roller (400) releases the auxiliary release film and adheres it to the upper part of the substrate-free conductive adhesive. It is then pressed by the bonding mechanism, and then the adhesive copper foil winding roller (500) winds up the adhesive copper foil for later use. (3) The substrate-free conductive adhesive self-paper unwinding roller (600) releases the substrate-free conductive adhesive self-paper, and the silicone protective film unwinding roller (700) releases the silicone protective film and adheres to the lower part of the substrate-free conductive adhesive self-paper, and is pressed together by the bonding mechanism. (4) The first die-cutting mechanism (800) performs die-cutting on the laminated substrate-free conductive adhesive self-adhesive paper and silicone protective film, and punches out the tear handle and the outline of the cut line of the copper foil product in one go; (5) The second copper foil unwinding roller (900) releases the copper foil with adhesive and adheres it to the upper part of the substrate-free conductive adhesive self-contained paper, and presses it together by the bonding mechanism; (6) The second die-cutting mechanism (1000) performs die-cutting on the bonded copper foil, the substrate-free conductive adhesive paper, and the silicone protective film, and punches out the outline of the copper foil product in a second time. (7) Outline waste take-up roller (1100) takes up the waste after secondary punching, and finished product take-up roller (1200) takes up the finished copper foil product.

10. A method for preventing adhesive loss in copper foil products with multiple tear handles according to claim 9, characterized in that, The substrate-free conductive adhesive in step (3) comes from step (1); the copper foil with adhesive applied in step (5) comes from step (2).

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