Semiconductor processing apparatus

Abstract

The application provides a semiconductor processing equipment, comprising: a process chamber, a wafer device, a nozzle and a recovery container; at least two process chambers are arranged for accommodating semiconductor workpieces to perform different semiconductor processing processes; the wafer device comprises a wafer table and a wafer table driving device; the wafer table is used for carrying semiconductor workpieces, and the wafer table driving device is connected with the wafer table and can move the wafer table to each process chamber; the nozzle is used for spraying different process liquids on the semiconductor workpieces in each process chamber; and the recovery container is connected with the corresponding process chamber and is used for recovering the process liquids in the corresponding process chamber, so that different process liquids can be recycled separately, and the process cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a semiconductor processing apparatus. Background Technology

[0002] In semiconductor photolithography, the most commonly used coating method is spin coating. This involves first applying photoresist to the center of the wafer, then rotating the wafer at high speed. The centrifugal acceleration applied by the rotation causes the photoresist to spread rapidly and evenly across the wafer surface. Excess photoresist is then flung off the wafer, resulting in a thin film covering the entire wafer. Spin coating achieves good film thickness uniformity and surface smoothness, making it an excellent coating method.

[0003] However, 90% of the photoresist that is ejected from the wafer surface during spin coating accounts for the total photoresist consumption, resulting in huge waste and greatly increasing the production cost of semiconductor processing.

[0004] Therefore, it is necessary to develop a new type of semiconductor processing equipment that can improve some of the problems existing in the prior art. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor processing apparatus capable of separately recovering process liquids used in different process chambers.

[0006] To achieve the above objectives, the present invention provides a semiconductor processing apparatus comprising: a process chamber, a wafer carrier, a nozzle, and a recovery container; at least two process chambers are arranged along a first direction for accommodating semiconductor workpieces to perform different semiconductor processing processes; the wafer carrier includes a wafer stage and a wafer stage driving device; the wafer stage is used to carry the semiconductor workpiece, and the wafer stage driving device is connected to the wafer stage, enabling the wafer stage to move along the first direction to each of the process chambers; the nozzle is used to spray different process liquids onto the semiconductor workpieces in each of the process chambers; the recovery container is connected to the corresponding process chamber and is used to recover the process liquids in the corresponding process chamber.

[0007] The beneficial effects of the semiconductor processing equipment provided by the present invention are as follows: at least two process chambers are arranged in a manner, and a wafer carrier is used to transfer the semiconductor workpiece between the process chambers. When the semiconductor workpiece performs different processing processes in different process chambers, the recycling container is used to recover the process liquid in the corresponding process chambers respectively, thereby realizing the separate recycling and reuse of different process liquids and reducing process costs.

[0008] Optionally, the first direction is a vertical direction, and the process chambers are stacked sequentially in this vertical direction. Each process chamber is provided with a wafer stage channel, through which the wafer stage moves to each of the process chambers. The advantages are: when semiconductor processing requires multiple process steps to be linked, multiple process chambers are needed to cooperate; stacking the process chambers helps reduce the footprint of the semiconductor processing equipment; furthermore, the height also helps reduce the risk of process liquids that are difficult to flow under gravity drainage conditions clogging the pipelines.

[0009] Optionally, the stage driving device includes a telescopic mechanism, the telescopic end of which is connected to the stage, and the stage moves within the stage channel when the telescopic end extends or retracts. Its advantage is that the telescopic structure helps to minimize the space occupied by the stage driving device when the process chambers are arranged, thereby reducing the size of the semiconductor processing equipment.

[0010] Optionally, the fixed end of the telescopic mechanism is connected to a rotating mechanism, which is used to drive the telescopic mechanism to rotate around its telescopic direction as the axis of rotation.

[0011] Optionally, a sealing element is provided in the slide stage channel for sealing between the slide stage channel and the slide carrier device. Its advantages include: facilitating the sealing of the process chamber and enabling the recovery of the process liquid.

[0012] Optionally, a workpiece transfer channel is provided on the side wall of the process chamber for the semiconductor workpiece to enter and exit the process chamber through the workpiece transfer channel.

[0013] Optionally, it also includes a transport device for transporting the semiconductor workpiece, allowing the semiconductor workpiece to enter and exit the process chamber from the workpiece transfer channel.

[0014] Optionally, the conveying device includes a lifting mechanism and a pick-and-place mechanism. The lifting mechanism is connected to the pick-and-place mechanism to drive the pick-and-place mechanism to move along the first direction. The moving direction of the pick-and-place mechanism is perpendicular to the first direction to convey the semiconductor workpiece through the workpiece transfer channel.

[0015] Optionally, the central region on the bottom surface of the process chamber is higher than the edge region, allowing the process liquid to collect towards the edge region of the bottom surface, with the recovery container connected to the edge region. This facilitates the recovery of the process liquid. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the semiconductor processing equipment described in an embodiment of the present invention.

[0017] Figure label:

[0018] 1. First process chamber; 2. Second process chamber; 3. Third process chamber; 101. Plate carrier channel; 102. Workpiece transfer channel; 103. Transfer gate; 301. Plate carrier; 302. Telescopic mechanism; 303. Rotating mechanism; 4. Nozzle; 501. First recycling container; 502. Second recycling container; 503. Third recycling container; 601. Lifting mechanism; 602. Picking and delivering mechanism; 7. Collection tray. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0020] To address the problems existing in the prior art, embodiments of the present invention provide a semiconductor processing apparatus, comprising a process chamber, a wafer carrier, a nozzle, and a recovery container; at least two process chambers are arranged along a first direction for accommodating semiconductor workpieces to perform different semiconductor processing processes; the wafer carrier includes a wafer stage and a wafer stage driving device; the wafer stage is used to carry the semiconductor workpiece, and the wafer stage driving device is connected to the wafer stage, enabling the wafer stage to move along the first direction to each of the process chambers; the nozzle is used to spray different process liquids onto the semiconductor workpieces in each of the process chambers; the recovery container is connected to the corresponding process chamber and is used to recover the process liquids in the corresponding process chamber.

[0021] In some embodiments of the present invention, the semiconductor processing equipment may be a coating equipment, the semiconductor workpiece may be a wafer, and the process liquid may be photoresist.

[0022] In some embodiments of the present invention, reference is made to Figure 1 The first direction is the vertical direction, and the process chambers are stacked sequentially in the vertical direction, that is, arranged along direction A in the figure.

[0023] In some embodiments of the present invention, reference is made to Figure 1 The process chambers include a first process chamber 1, a second process chamber 2, and a third process chamber 3, which are stacked vertically in sequence, i.e., arranged along direction A in the figure. Each process chamber has a slide stage channel 101 along the stacking direction, for the slide stage 301 to move between the first process chamber 1, the second process chamber 2, and the third process chamber 3. The recovery containers include a first recovery container 501, a second recovery container 502, and a third recovery container 503, which are respectively connected to the first process chamber 1, the second process chamber 2, and the third process chamber 3, allowing for the separate recovery of the three different process liquids.

[0024] In some embodiments of the present invention, reference is made to Figure 1 The top of the process chamber is open, meaning that the process chamber only has four side walls and a bottom.

[0025] In some embodiments of the present invention, the process chambers can be arranged in a specified direction, and the arrangement of the wafer carrier device matches the arrangement direction of the process chambers. For example, if the process chambers are arranged in a horizontal direction, the wafer stage driving device drives the wafer stage to move horizontally in the horizontal direction, so that the wafer stage moves between the process chambers arranged in the horizontal direction.

[0026] In some embodiments of the present invention, reference is made to Figure 1 The number of nozzles 4 can be multiple, used to spray different process liquids, such as photoresist, deionized water, photoresist diluent, etc.

[0027] In some embodiments of the present invention, the number of nozzles can be multiple, and the position of the nozzles can be configured to spray the process liquid onto the top surface of the semiconductor workpiece, the edge of the semiconductor workpiece, or the bottom surface of the semiconductor workpiece.

[0028] In some embodiments of the present invention, the number of nozzles may be one, the nozzle may move between the process chambers, and the nozzle may be connected to several different containers for holding the process liquids through multiple pipelines, so as to spray different process liquids, such as photoresist, deionized water, photoresist diluent, etc., in different process chambers.

[0029] In some embodiments of the present invention, the nozzle is connected to the wafer stage, and when the wafer stage moves from one process chamber to another, the nozzle moves along with the wafer stage.

[0030] In some embodiments of the present invention, reference is made to Figure 1 The radial dimension of the stage 301 is smaller than the inner diameter of the stage channel 101.

[0031] In some specific embodiments, reference is made to Figure 1 The size of the wafer stage channel 101 can be set according to the size of the semiconductor workpiece to be processed, so that when the wafer stage 301 passes through the wafer stage channel 101, the semiconductor workpiece carried on the wafer stage 301 also passes through the wafer stage channel 101 and enters another process chamber for processing, so as to realize the function of transporting the semiconductor workpiece.

[0032] In some embodiments of the present invention, reference is made to Figure 1 The stage drive device includes a telescopic mechanism 302, which may include a linkage mechanism, a cylinder, or other mechanism capable of reciprocating in a specified direction to achieve the telescopic function.

[0033] In some embodiments of the present invention, reference is made to Figure 1 The telescopic mechanism 302 includes a telescopic end that can be extended and a fixed end that is fixedly set. The slide stage 301 is fixedly connected to the telescopic end, so that the slide stage 301 can move along the direction A shown in the figure.

[0034] In some embodiments of the present invention, reference is made to Figure 1 The stage 301 driving mechanism includes a rotating mechanism 303, which is fixedly connected to the fixed end of the telescopic mechanism 302. When the rotating mechanism 303 rotates, it drives the telescopic mechanism 302 to rotate with its telescopic direction as the rotation axis, thereby driving the stage 301 to rotate in the direction shown in Figure B.

[0035] In some embodiments of the present invention, a sealing element is provided between the wafer stage channel and the wafer carrier device to prevent the process liquid from flowing out of the process chamber from the wafer stage channel.

[0036] In some specific embodiments, the seal is disposed between the slide stage 301 and the slide stage channel 101.

[0037] In other specific embodiments, the seal is disposed between the telescopic mechanism 302 and the slide stage channel 101.

[0038] In some specific embodiments of the present invention, the semiconductor processing equipment further includes a transport device for transporting the semiconductor workpiece. After the semiconductor workpiece completes the corresponding processing process in any of the process chambers, the transport device takes out the semiconductor workpiece from the workpiece transfer channel on the side wall of the process chamber and puts it into another process chamber through another workpiece transfer channel.

[0039] In some embodiments of the present invention, reference is made to Figure 1 A transfer gate 103 is provided at one end of the workpiece transfer channel near the process chamber. When the semiconductor workpiece needs to be transferred, the transfer gate 103 opens, allowing the process chamber to connect with the outside through the workpiece transfer channel. When the semiconductor workpiece is processed in the process chamber, the transfer gate 103 closes, and the wafer stage 301 rotates at high speed under the drive of the rotating mechanism 303, throwing the process liquid out of the wafer stage 301. The transfer gate 103 can block the splashed process liquid and leave the process liquid in the process chamber, which is then recovered through the recovery container.

[0040] In some embodiments of the present invention, reference is made to Figure 1 The conveying device includes a lifting mechanism 601 and a pick-and-place mechanism 602 connected to each other. The lifting mechanism 601 moves along the stacking direction of the process chambers, causing the pick-and-place mechanism 602 to move to the side wall of different process chambers. The pick-and-place mechanism 602 moves in and out of the process chambers along the extension direction of the workpiece transfer channel and clamps the semiconductor workpiece.

[0041] In some specific embodiments of the present invention, reference is made to Figure 1 The pick-and-place mechanism 602 picks up the semiconductor workpiece to be processed, the lifting mechanism 601 moves the pick-and-place mechanism 601 to the outside 1 of the first process chamber, the conveyor door 103 opens, and the pick-and-place mechanism 601 sends the semiconductor workpiece into the first process chamber 1 in the horizontal right direction shown in the figure and places it on the wafer stage 301 for processing.

[0042] In some specific embodiments of the present invention, reference is made to Figure 1 After the processing in the first process chamber 1 is completed, the lifting mechanism 601 drives the pick-and-place mechanism 601 to move to the outside 1 of the first process chamber, the transfer door 103 opens, and the pick-and-place mechanism 601 takes the processed semiconductor workpiece out of the first process chamber 1 in the horizontal left direction shown in the figure. The lifting mechanism 601 drives the pick-and-place mechanism 601 to move to the outside 2 of the second process chamber, the transfer door 103 opens, and the pick-and-place mechanism 601 sends the semiconductor workpiece into the second process chamber 2 in the horizontal right direction shown in the figure and places it on the wafer stage 301 for processing.

[0043] In some specific embodiments of the present invention, reference is made to Figure 1After the pick-and-place mechanism 601 removes the processed semiconductor workpiece from the first process chamber 1 in the horizontal left direction shown in the figure, the wafer stage 301 moves from the first process chamber 1 to the second process chamber 2 through the wafer stage channel 101, so as to wait for the transport mechanism to place the semiconductor workpiece on the wafer stage 301 for processing.

[0044] In some embodiments of the present invention, reference is made to Figure 1 The lifting mechanism 601 may be equipped with multiple pick-and-place mechanisms 602, and the moving directions of the pick-and-place mechanisms 602 are parallel to each other, so as to realize the simultaneous handling of multiple semiconductor workpieces in multiple process chambers.

[0045] In some embodiments of the present invention, the process chambers are stacked, and the bottom surface of the process chamber includes a central region near the stage channel 101 and an edge region near the side wall of the process chamber. As the bottom surface of the process chamber extends from the stage channel 101 to the side wall of the process chamber, the height gradually decreases, so that the process liquid gathers at the side wall of the process chamber.

[0046] In some embodiments of the present invention, reference is made to Figure 1 The slide stage channel 101 is provided with a collection tray 7 for collecting the process liquid dripping from below the slide stage 301. The collection tray 7 is connected to the recycling container.

[0047] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A semiconductor processing apparatus, characterized in that, include: At least two process chambers are arranged along a first direction to accommodate semiconductor workpieces for performing different semiconductor processing processes. The first direction is a vertical direction. Each process chamber is independently arranged and stacked sequentially in the vertical direction. Each process chamber is provided with a wafer stage channel, and each process chamber has a workpiece transfer channel on its side wall for the semiconductor workpiece to enter and exit the process chamber through the workpiece transfer channel. A wafer carrier device, the wafer carrier device including a wafer stage and a wafer stage driving device; The wafer stage is used to carry semiconductor workpieces. The wafer stage driving device is connected to the wafer stage and can move the wafer stage along the first direction through the wafer stage channel to each of the process chambers. A sealing element is provided in the wafer stage channel for sealing between the wafer stage channel and the wafer carrier device. Nozzles are used to spray different process liquids onto the semiconductor workpiece in each of the process chambers; At least two recovery containers are connected to the corresponding process chambers, and the recovery containers are used to recover the process liquid in the corresponding process chambers.

2. The semiconductor processing equipment according to claim 1, characterized in that, The stage drive includes a telescopic mechanism, the telescopic end of which is connected to the stage, and the stage moves within the stage channel when the telescopic end extends or retracts.

3. The semiconductor processing equipment according to claim 2, characterized in that, The stage drive includes a rotating mechanism, and the fixed end of the telescopic mechanism is connected to the rotating mechanism. The rotating mechanism is used to drive the telescopic mechanism to rotate with its telescopic direction as the rotation axis.

4. The semiconductor processing equipment according to claim 1, characterized in that, It also includes a transport device for transporting the semiconductor workpiece, allowing the semiconductor workpiece to enter and exit the process chamber from the workpiece transfer channel.

5. The semiconductor processing equipment according to claim 4, characterized in that, The conveying device includes a lifting mechanism and a pick-and-place mechanism. The lifting mechanism is connected to the pick-and-place mechanism to drive the pick-and-place mechanism to move along the first direction. The moving direction of the pick-and-place mechanism is perpendicular to the first direction to convey the semiconductor workpiece through the workpiece transfer channel.

6. The semiconductor processing equipment according to claim 1, characterized in that, The central region on the bottom surface of the process chamber is higher than the edge region, which allows the process liquid to converge towards the edge region of the bottom surface, and the recovery container is connected to the edge region.

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