Display panel and its manufacturing method, display device

CN115734658BActive Publication Date: 2026-08-14BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-08-27
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

然而,切割操作或其它外力的作用容易导致显示面板出现裂纹,从而大大影响显示面板的质量

Benefits of technology

[0031]本申请上述实施例提供的显示面板及其制备方法以及显示装置,通过在边框区设置阻隔槽,有利于将显示区向外延伸的无机材料隔断,且阻隔槽中填充有柔性材料层,能够提高裂纹阻隔区的柔性,显示面板外围受到切割或其它外力时,裂纹阻隔区能够提供较好的缓冲,避免裂纹向显示区域延伸,且可将封装保证区、切割预留区与裂纹阻隔区交叠设置,有利于减小边框区尺寸。

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Abstract

This application provides a display panel, a method for manufacturing the same, and a display device. The display panel includes a flexible substrate and an inorganic material layer disposed on the flexible substrate. A barrier groove is provided in the frame area, the barrier groove penetrating at least through the inorganic material layer and filled with the flexible material layer. The barrier groove includes a first side near the display area and a second side opposite to the first side. In the direction along the inorganic material layer toward the flexible substrate, at least a portion of the first side extends toward the side near the display area and / or at least a portion of the second side extends toward the side away from the display area. By providing the barrier groove, the display panel effectively blocks the inorganic material extending outward from the display area. Furthermore, the flexible material layer filling the barrier groove improves the flexibility of the crack-blocking area. When the periphery of the display panel is subjected to cutting or other external forces, the crack-blocking area provides better buffering, preventing cracks from extending into the display area.
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Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Currently, flexible AMOLED (Active-matrix organic light-emitting diode) display panels possess technological advantages such as bendability, narrow bezels, high contrast, and wide color gamut. Flexible AMOLED display panels are already widely used in terminal products such as mobile phones and televisions. During the manufacturing process of flexible AMOLED display panels, the bezels need to be cut. However, cutting operations or other external forces can easily cause cracks in the display panel, significantly affecting its quality. Summary of the Invention

[0003] According to a first aspect of the present application, a display panel is provided, the display panel having a display area and a border area located outside the display area, the display panel including a flexible substrate and an inorganic material layer disposed on the flexible substrate, the border area having a barrier groove, the barrier groove at least penetrating the inorganic material layer, and the barrier groove being filled with a flexible material layer, the barrier groove including a first side near the display area and a second side opposite to the first side, wherein in the direction along the inorganic material layer toward the flexible substrate, at least a portion of the first side extends toward the side near the display area and / or at least a portion of the second side extends toward the side away from the display area.

[0004] In some embodiments, in the direction along the inorganic material layer toward the flexible substrate, the first side extends generally toward the side closer to the display area and / or the second side extends generally toward the side away from the display area.

[0005] In some embodiments, the first side is an inclined plane and / or the second side is an inclined plane.

[0006] In some embodiments, the first side surface includes a first side surface segment and a second side surface segment distributed and connected in the direction along the inorganic material layer toward the flexible substrate, the second side surface segment extending toward the side closer to the display area in the direction along the inorganic material layer toward the flexible substrate; and / or,

[0007] The second side includes a third side segment and a fourth side segment distributed and connected in the direction along the inorganic material layer toward the flexible substrate, the fourth side segment extending toward the side opposite to the display area in the direction along the inorganic material layer toward the flexible substrate.

[0008] In some embodiments, the second side is symmetrically arranged with respect to the first side.

[0009] In some embodiments, the barrier groove includes a first groove extending through the inorganic material layer and a second groove formed in the flexible substrate, wherein the first groove and the second groove are connected.

[0010] In some embodiments, the display area includes a pixel driving circuit layer disposed on the flexible substrate, the pixel driving circuit being disposed therein, and the pixel driving circuit layer including an isolation layer;

[0011] The inorganic material layer includes an isolation layer extending from the display area to the border area.

[0012] In some embodiments, the display area includes a light-emitting layer, an encapsulation layer, and a touch layer sequentially stacked on the side of the pixel driving circuit layer facing away from the flexible substrate. The touch layer includes a touch planarization layer located on the side facing away from the flexible substrate, and the flexible material layer and the touch planarization layer are formed in the same layer.

[0013] According to a second aspect of the embodiments of this application, a method for manufacturing a display panel is provided, the method comprising:

[0014] Provide flexible substrates;

[0015] An inorganic material layer is formed on the flexible substrate;

[0016] A barrier groove is formed on the inorganic material layer; wherein the barrier groove at least penetrates the inorganic material layer, and the barrier groove includes a first side surface near the display area and a second side surface opposite to the first side surface. In the direction along the inorganic material layer toward the flexible substrate, at least a portion of the first side surface extends toward the side near the display area, and at least a portion of the second side surface extends toward the side away from the display area.

[0017] A flexible material layer is filled into the barrier groove.

[0018] In some embodiments, after providing the flexible substrate, the method for fabricating the display panel includes:

[0019] A pixel driving circuit layer is formed on the flexible substrate; wherein the pixel driving circuit layer includes an isolation layer close to the flexible substrate;

[0020] The formation of the inorganic material layer on the flexible substrate specifically includes:

[0021] The isolation layer is formed on the flexible substrate located in the display area and the bezel area, and the isolation layer located in the bezel area serves as the inorganic material layer.

[0022] In some embodiments, after forming the pixel driving circuit layer, the method for fabricating the display panel includes forming a light-emitting layer on the side of the pixel driving circuit layer opposite to the flexible substrate.

[0023] In some embodiments, after forming the light-emitting layer, the method for manufacturing the display panel includes:

[0024] Barrier grooves are formed on the inorganic material layer.

[0025] In some embodiments, after forming the light-emitting layer, the method for manufacturing the display panel includes forming a camera hole; wherein the camera hole and the barrier groove are formed in the same process.

[0026] In some embodiments, after forming the barrier groove, the method for manufacturing the display panel includes:

[0027] An encapsulation layer is formed on the side of the light-emitting layer that is away from the flexible substrate;

[0028] A touch layer is formed on the side of the encapsulation layer opposite to the flexible substrate; wherein the touch layer includes a touch planarization layer located on the side opposite to the flexible substrate.

[0029] In some embodiments, the flexible material layer and the touch planarization layer are formed in the same process.

[0030] According to a third aspect of the embodiments of this application, a display device is provided, the display device including the display panel as described above.

[0031] The display panel, its manufacturing method, and the display device provided in the above embodiments of this application, by setting a barrier groove in the bezel area, facilitate the isolation of inorganic materials extending outward from the display area. Moreover, the barrier groove is filled with a flexible material layer, which can improve the flexibility of the crack barrier area. When the periphery of the display panel is subjected to cutting or other external forces, the crack barrier area can provide better buffering and prevent cracks from extending into the display area. Furthermore, the encapsulation guarantee area, the cutting reserved area, and the crack barrier area can be overlapped, which is beneficial to reducing the size of the bezel area. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of a display panel provided in an exemplary embodiment of this application, which mainly illustrates the display area and the border area;

[0033] Figure 2 This is a schematic diagram of a portion of the layer structure of a display panel provided in an exemplary embodiment of this application;

[0034] Figure 3 This is a schematic diagram of a border area provided in an exemplary embodiment of this application;

[0035] Figure 4 This is a schematic diagram of another border area provided in an exemplary embodiment of this application;

[0036] Figure 5 This is a flowchart of a method for preparing a display panel provided in an exemplary embodiment of this application. Detailed Implementation

[0037] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0038] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0039] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0040] Flexible AMOLED (Active-matrix organic light-emitting diode) display panels offer technological advantages such as bendability, narrow bezels, high contrast, and wide color gamut. Currently, flexible AMOLED display panels are widely used in terminal products such as mobile phones and televisions. The fabrication process of flexible AMOLED display panels requires cutting the bezel. Typically, the bezel area of ​​a display panel, moving outwards from the display area, includes, in sequence, a barrier area, an encapsulation protection area, a crack barrier area, and a cutting pre-cut area. Some display panels also include an inner connection area within the barrier area, located between the barrier area and the display area. Cutting can be performed within the cutting pre-cut area during the panel fabrication process. Research has shown that cutting operations or other external forces can easily cause cracks in the display panel, significantly affecting its quality.

[0041] Based on this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device. The display panel, its manufacturing method, and the display device according to embodiments of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments can complement or combine with each other.

[0042] This application provides a display panel. See also... Figure 1 and combine when necessary Figures 2 to 4 As shown, the display panel has a display area 101 and a border area 102 located outside the display area 101. The display panel may also include a bent area 103 located on the outer side of one side of the display area 101. Correspondingly, the border area 102 is located in the other areas of the outer periphery of the display area 101, excluding the bent area 103.

[0043] Please combine Figure 3 and Figure 4 As shown, in some embodiments, the border area 102 may include, in sequence along the direction outward from the display area 101, a retaining wall inner connection area Q1, a retaining wall area Q2, an encapsulation guarantee area Q3, a crack blocking area Q4, and a cutting reservation area Q5.

[0044] The display panel 100 includes a flexible substrate 10 and an inorganic material layer 2001 disposed on the flexible substrate 10. The frame area is provided with a barrier groove 70, which at least penetrates the inorganic material layer 2001 and is filled with a flexible material layer 80. The barrier groove 70 includes a first side 71 near the display area 101 and a second side 72 opposite to the first side 71. In the direction along the inorganic material layer 2001 toward the flexible substrate 10, at least a portion of the first side 71 extends toward the side near the display area 101, and at least a portion of the second side 72 extends toward the side away from the display area 101.

[0045] It should be noted that the barrier groove can also be configured such that, in the direction along the inorganic material layer 2001 toward the flexible substrate 10, at least a portion of the first side extends toward the side closer to the display area, or at least a portion of the second side extends toward the side away from the display area.

[0046] By setting the barrier groove 70 in the frame area 102, it is beneficial to block the material (such as inorganic material during packaging) extending outward from the display area 101. The barrier groove 70 is filled with a flexible material layer 80, which can improve the flexibility of the crack barrier area Q4. When the periphery of the display panel 100 is subjected to cutting or other external forces, the crack barrier area Q4 can provide better buffering and prevent cracks from extending to the display area 101.

[0047] In some embodiments, the encapsulation guarantee area Q3, the cutting reservation area Q5, and the crack barrier area Q4 can be overlapped together. For example, the crack barrier area Q4 or a part thereof can be directly used as the cutting reservation area or the width of the cutting reservation area can be reduced. Alternatively, the crack barrier area Q4 or a part thereof can be used as the encapsulation guarantee area or the width of the encapsulation guarantee area can be reduced, thereby helping to reduce the size of the border area 102.

[0048] In some embodiments, the material of the flexible substrate 10 may include one or more of polyimide, polyethylene terephthalate, and polycarbonate.

[0049] Please combine Figure 3 and Figure 4 As shown, in some embodiments, the barrier groove 70 is formed on the inorganic material layer 2001 and the flexible substrate 10. Accordingly, the barrier groove 70 includes a first groove portion 701 penetrating the inorganic material layer 2001 and a second groove portion 702 formed on the flexible substrate 10, the first groove portion 701 and the second groove portion 702 being connected. The second groove portion 702 does not penetrate the flexible substrate 10, and the bottom of the barrier groove 70 is located within the flexible substrate 10. Of course, in other embodiments, the barrier groove penetrates the inorganic material layer, and the surface of the flexible substrate near the inorganic material layer serves as the bottom of the barrier groove.

[0050] The barrier groove 70 includes a bottom surface 73, a first side surface 71 and a second side surface 72 respectively connected to opposite sides of the bottom surface 73. In the direction along the inorganic material layer 2001 toward the flexible substrate 10, the first side surface 71 extends generally toward the side closer to the display area 101, and the second side surface 72 extends generally toward the side away from the display area 101.

[0051] In some embodiments, the first side 71 is an inclined plane, and the second side 72 is also an inclined plane, for example... Figure 3 and Figure 4 As shown.

[0052] In some embodiments, the second side 72 is symmetrically arranged with the first side 71 to facilitate the creation of the barrier groove 70. Taking the first side 71 and the second side 72 as inclined planes as an example, the cross-section of the formed barrier groove 70 can be as follows: Figure 3 and Figure 4 The trapezoidal structure shown here. The arrangement of the first and second sides 72 can effectively isolate materials (such as inorganic materials used in packaging) extending outward from the display area 101.

[0053] It should be noted that in some other embodiments, the first and second sides may also be uneven surfaces, such as concave arc surfaces or other irregular surfaces. Furthermore, the second side may be asymmetrically arranged with respect to the first side. Additionally, in some other embodiments, along the direction from the inorganic material layer to the flexible substrate, the barrier groove may be configured such that the first side extends entirely towards the side closer to the display area, and the second side extends entirely towards the side away from the display area. This application does not limit this, and the configuration can be tailored to specific circumstances.

[0054] Please combine Figure 2 As shown, in some embodiments, the first side 71 includes a first side segment 711 and a second side segment 712 distributed and connected in the direction from the inorganic material layer 2001 to the flexible substrate 10. The second side segment 712 extends towards the side closer to the display area 101 in the direction from the inorganic material layer 2001 to the flexible substrate 10. The second side 72 includes a third side segment 721 and a fourth side segment 722 distributed and connected in the direction from the inorganic material layer 2001 to the flexible substrate 10. The fourth side segment 722 extends away from the display area 101 in the direction from the inorganic material layer 2001 to the flexible substrate 10. The arrangement of the second side segment 712 and the fourth side segment 722 effectively isolates materials extending outward from the display area 101 (such as inorganic materials during encapsulation).

[0055] In some embodiments, the second side segment 712 is an inclined plane, and the fourth side segment 722 is an inclined plane. Optionally, the first side segment 711 is also a plane, and the third side segment 721 is also a plane. For example, the first side segment 711 may be a plane extending away from the display area 101 in the direction from the inorganic material layer 2001 to the flexible substrate 10, and the third side segment 721 may be a plane extending closer to the display area 101 in the direction from the inorganic material layer 2001 to the flexible substrate 10, thereby forming a plane as shown in the figure. Figure 2 The barrier groove 70 shown has a constricted shape in the middle.

[0056] In some embodiments, the second side 72 may be symmetrically arranged with the first side 71 to facilitate the opening of the barrier groove 70, for example, it may be formed as follows: Figure 2The barrier groove 70 shown herein, wherein the cross-section of the groove portion corresponding to the first side section 711 in the barrier groove 70 may be shaped as follows: Figure 2 The inverted trapezoid shown, the cross-section of the groove corresponding to the second side section 712 can be shaped as follows: Figure 2 The regular trapezoid shown.

[0057] Of course, in other embodiments, the first side may also be an uneven surface, and the corresponding second side segment may also be an uneven surface; the second side and the first side may also be asymmetrically arranged. Furthermore, in other embodiments, in the direction along the inorganic material layer toward the flexible substrate, the barrier groove may be configured such that the second side segment extends toward the side closer to the display area, or the fourth side segment extends toward the side away from the display area. This application does not limit this, and the configuration can be made according to specific circumstances.

[0058] It should be noted that the border area 102 may be provided with one or more blocking grooves. If multiple blocking grooves 70 are provided, the multiple blocking grooves 70 are arranged at intervals along the width direction W of the border area 102.

[0059] In some embodiments, the flexible material layer 80 is made of organic materials. For example, the flexible material layer 80 may be made of one or more resin-based materials, such as epoxy resin, phenolic resin, polyamide resin, polyimide, and phenylcyclobutene.

[0060] Furthermore, the display area 101 includes a pixel driving circuit layer 20 disposed on the flexible substrate 10. The pixel driving circuit is disposed within the pixel driving circuit layer 20. The pixel driving circuit includes a thin-film transistor. The thin-film transistor includes an active layer, a gate electrode 201 located on the side of the active layer opposite to the flexible substrate 10, a first electrode 203, and a second electrode 204. The active layer includes an active region 2021 and a first region 2023 and a second region 2022 located on opposite sides of the active region 2021. One of the first region 2023 and the second region 2022 is a source region and the other is a drain region. One of the first electrode 203 and the second electrode 204 is a source electrode and the other is a drain electrode.

[0061] The pixel driving circuit layer 20 includes an isolation layer 22 near the flexible substrate 10, and a gate insulating layer 23, a first interlayer dielectric layer 24, a second interlayer dielectric layer 25, a passivation layer 26, and a pixel planarization layer 27 sequentially disposed on the side of the isolation layer 22 away from the flexible substrate 10. The active layer is disposed on the side of the isolation layer 22 away from the flexible substrate 10. The gate insulating layer 23 is located between the active layer and the gate electrode 201. The first interlayer dielectric layer 24 is located on the side of the gate electrode 201 away from the flexible substrate 10. The first electrode 203 and the second electrode 204 are electrically connected to the active layer through vias penetrating the gate insulating layer 23, the first interlayer dielectric layer 24, and the second interlayer dielectric layer 25. The pixel planarization layer 27 is located on the side of the first electrode 203 and the second electrode 204 away from the flexible substrate 10, covering the exposed passivation layer 26.

[0062] The material of the isolation layer 22 is an inorganic material. For example, it may include SiO2. x SiN x These features can prevent moisture from entering the device from the bottom of the flexible substrate 10, and at the same time prevent impurity atoms from precipitating into the pixel driving circuit and forming doping.

[0063] In some embodiments, the isolation layer 22 extends to the border area 102. Accordingly, the inorganic material layer 2001 is the isolation layer 22 extending from the display area to the border area 102.

[0064] Furthermore, in some embodiments, the pixel driving circuit layer 20 includes a buffer layer 21 located between the isolation layer 22 and the flexible substrate layer, the buffer layer also being made of an inorganic material. Both the isolation layer 22 and the buffer layer can extend to the border area 102. Accordingly, the inorganic material layer 2001 may include the buffer layer 21 and the isolation layer 22 extending from the display area to the border area 102.

[0065] Furthermore, in some embodiments, the display area 101 includes a light-emitting layer 30, an encapsulation layer 40, and a touch layer sequentially stacked on the side of the pixel driving circuit layer facing away from the flexible substrate 10.

[0066] The touch layer includes a touch planarization layer 501 located on the side opposite to the flexible substrate 10. During the formation of the touch planarization layer, the upper surface of the inorganic material layer 2001 of the border region 102 is also covered with this touch planarization layer 501, for example... Figure 4 As shown. The flexible material layer 80 is formed in the same layer as the touch planarization layer 501.

[0067] The light-emitting layer 30 may include an anode 31, a pixel-defining layer 32, a support pillar 33, an organic light-emitting layer, a cathode, etc.

[0068] This application also provides a method for preparing a display panel, which can be applied to the preparation of the above-mentioned display panel 100. Figure 5 This is a flowchart of a method for fabricating a display panel according to an exemplary embodiment of this application. The method for fabricating the display panel includes the following steps S1 to S7:

[0069] Step S1: Provide a flexible substrate;

[0070] Step S3: Form an inorganic material layer on the flexible substrate;

[0071] Step S5: Form a barrier groove on the inorganic material layer; wherein the barrier groove at least penetrates the inorganic material layer, and the barrier groove includes a first side near the display area and a second side opposite to the first side. In the direction along the inorganic material layer toward the flexible substrate, at least a portion of the first side extends toward the side near the display area, and at least a portion of the second side extends toward the side away from the display area.

[0072] Step S7: Fill the barrier groove with a flexible material layer.

[0073] Please refer to the following: Figure 5 and combine when necessary Figures 1 to 4 The manufacturing method of the display panel will be described in detail.

[0074] In step S1, a flexible substrate 10 may be provided. The specific details of the provided flexible substrate 10 can be found in the above description and will not be repeated here.

[0075] In step S3, an inorganic material layer 2001 is formed on the flexible substrate 10.

[0076] After step S1, a pixel driving circuit layer 20 can be formed on the flexible substrate 10. Specifically, the driving circuit layer 20 can be formed through the following steps S21 to S29.

[0077] Step S21: Form an isolation layer 22 on the flexible substrate 10.

[0078] Step S22: An active layer is formed on the side of the isolation layer 22 that is away from the flexible substrate 10.

[0079] Step S23: A gate insulating layer 23 is formed on the side of the isolation layer 22 and the active layer away from the flexible substrate 10.

[0080] Step S24: A gate electrode 201 is formed on the side of the gate insulating layer 23 facing away from the flexible substrate 10.

[0081] Step S25: A first interlayer dielectric layer 24 and a second interlayer dielectric layer 25 are formed on the side of the gate insulating layer 23 facing away from the flexible substrate 10. The first interlayer dielectric layer 24, the second interlayer dielectric layer 25, and the structural layers between them can be implemented through different steps, which will not be described in detail here.

[0082] Step S26: Form a via opposite to the active layer, the via penetrating the gate insulating layer 23, the first interlayer dielectric layer 24 and the second interlayer dielectric layer 25.

[0083] Step S27: Form the first electrode 203 and the second electrode 204.

[0084] Step S28: A passivation layer 26 is formed on the side of the first electrode 203, the second electrode 204, and the second interlayer dielectric layer 25 that is away from the flexible substrate 10.

[0085] Step S29: A pixel planarization layer 27 is formed on the side of the passivation layer 26 that is away from the flexible substrate 10.

[0086] In some embodiments, an inorganic material layer 2001 located in the border region 102 can be formed through the above-described step S21. This inorganic material layer 2001 is formed in the same process as the isolation layer 22. That is, the isolation layer 22 is formed on the flexible substrate 10, including forming the isolation layer 22 on both the flexible substrate 10 located in the display region and the flexible substrate 10 located in the border region, wherein the isolation layer 22 located in the border region serves as the inorganic material layer 2001. Accordingly, after the isolation layer 22 is formed, in the subsequent structure of the pixel driving circuit layer 20, a patterning process can be used to etch away the structure formed in the border region 102 and located on the inorganic material layer 2001.

[0087] It should be noted that in step S24, a full-layer gate electrode layer can be formed on the side of the gate isolation layer 221 facing away from the flexible substrate 10, and the full-layer gate electrode layer can be patterned by etching to form the required gate electrode 201. The active region 2021, the first region 2023, the second region 2022, the first electrode 203, and the second electrode 204 can all be formed using a similar method.

[0088] Of course, for cases where a buffer layer 21 is also provided between the isolation layer 22 and the flexible substrate 10, step S20 is included after step S1 and before step S21:

[0089] Step S20: Form a buffer layer 21 on the flexible substrate 10.

[0090] After step S3 and before step S5, the method for preparing the display panel further includes the following step S4.

[0091] Step S4: Form a light-emitting layer 30 on the side of the pixel driving circuit layer 20 that is away from the flexible substrate 10.

[0092] The light-emitting layer 30 may specifically include an anode 31, a pixel-defining layer 32, a support pillar 33, an organic light-emitting layer, and a cathode. The anode 31, pixel-defining layer 32, support pillar 33, organic light-emitting layer, and cathode are formed sequentially.

[0093] In step S5, a barrier groove 70 is formed on the inorganic material layer 2001.

[0094] For display panels that require a camera hole, after step S4, the method for preparing the display panel further includes forming a camera hole.

[0095] It is understood that in some embodiments, the camera hole is formed in the display area of ​​the display panel, such as in a full-screen display where the camera hole is formed in the display area. Specifically, after step S4, the method for manufacturing the display panel further includes forming the camera hole in the display area of ​​the display panel.

[0096] Of course, in some other embodiments, the camera hole is formed in the non-display area of ​​the display panel, such as in non-full-screen displays where the camera hole is formed in the non-display area. Specifically, after step S4, the method for manufacturing the display panel further includes forming the camera hole in the non-display area of ​​the display panel.

[0097] In some embodiments, the barrier groove 70 formed in step S5 can be formed in the same process as the camera hole. That is, the barrier groove 70 is formed at the same time as the camera hole, so as to avoid forming the barrier groove 70 separately, saving manufacturing processes and production steps.

[0098] Of course, in some embodiments, the barrier groove 70 can also be formed using a separate process. Specifically, the barrier groove 70 can be formed after the light-emitting layer 30 is formed.

[0099] The specific shape and structure of the barrier groove 70 formed in step S5 can be referred to the above-mentioned structural description of the display panel 100, and will not be repeated here.

[0100] It should be noted that during the formation of the light-emitting layer 30, due to the use of a patterning process, the material used to form the light-emitting layer 30 will not be deposited in the border area.

[0101] After the barrier groove 70 is formed in step S5, the method for manufacturing the display panel includes the following steps S61 and S62.

[0102] Step S62: An encapsulation layer 40 is formed on the side of the light-emitting layer 30 that is away from the flexible substrate 10.

[0103] Please combine Figure 3As shown, in some embodiments, the encapsulation layer 40 may adopt a structure including a bottom layer 41, an interlayer 42, and a top layer 43. The bottom layer 41 and the top layer 43 may both be inorganic material layers, and the interlayer 42 may be an organic material layer. Specifically, step S62 may include the following steps:

[0104] Step S621: A bottom layer 41 is formed on the side of the light-emitting layer 30 away from the flexible substrate 10.

[0105] Step S622: A sandwich layer 42 is formed on the side of the bottom layer 41 that is away from the flexible substrate 10.

[0106] In step S623, a top layer 43 is formed on the side of the interlayer 42 facing away from the flexible substrate 10.

[0107] In practice, this step can be implemented using CVD film formation technology to form the bottom layer 41 and the top layer 43.

[0108] Due to the function of the retaining wall area Q2, the three-layer encapsulation layer 40 is located within the connecting area Q1 and the display area 101 of the retaining wall, while the material of the bottom layer 41 and the top layer 43 still extends to the retaining wall area Q2 and its outer portion to form the extension portion 401. In this application, a barrier groove 70 is formed so that the material of the bottom layer 41 and the top layer 43 can be prevented from continuing to spread outward when the encapsulation layer 40 is formed. Specifically, when the bottom layer 41 and the top layer 43 are formed, the material forming the bottom layer 41 and the top layer 43 will fall to the bottom of the barrier groove 70 when passing through it, and cannot continue to spread outward.

[0109] Of course, in other embodiments, the encapsulation layer may be formed using other encapsulation materials and other processes, and this application does not limit this.

[0110] Step S62: A touch layer is formed on the side of the encapsulation layer opposite to the flexible substrate 10. The touch layer includes a touch planarization layer 501 located on the side opposite to the flexible substrate 10.

[0111] In some embodiments, the touch planarization layer 501 is made of a flexible organic material, such as OC organic adhesive.

[0112] In some embodiments, while forming the touch planarization layer 501 in step S62, the barrier groove 70 may be filled with the material used to form the touch planarization layer 501 to form a flexible material layer 80. That is, the flexible material layer 80 and the touch planarization layer 501 are formed in the same process. The flexible material layer 80 and the touch planarization layer 501 are made of the same material, such as OC organic adhesive.

[0113] In other embodiments, the flexible material layer 80 may also be formed using other materials and other processes.

[0114] This application also provides a display device, which includes the display panel described in any of the above embodiments.

[0115] In one embodiment, the display device further includes a driver and a power supply circuit, wherein the driver is used to provide a driving signal to drive the light-emitting structure of the light-emitting layer to emit light, and the power supply circuit is used to supply power to the display panel.

[0116] In one embodiment, the display device further includes a housing, and the display panel is disposed within the housing or assembled onto the housing.

[0117] The display device provided in this application embodiment can be any device with display function, such as a mobile phone, tablet computer, television, laptop computer, or vehicle-mounted equipment.

[0118] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0119] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0120] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A display panel having a display area and a border area located outside the display area, characterized in that, The display panel includes a flexible substrate and an inorganic material layer disposed on the flexible substrate. The frame area is provided with a barrier groove. The barrier groove at least penetrates the inorganic material layer and is filled with a flexible material layer. The barrier groove includes a first side near the display area and a second side opposite to the first side. In the direction along the inorganic material layer toward the flexible substrate, at least a portion of the first side extends toward the side near the display area and / or at least a portion of the second side extends toward the side away from the display area. The barrier groove includes a first groove penetrating the inorganic material layer and a second groove formed in the flexible substrate, the first groove and the second groove being connected; the bottom of the barrier groove is located in the flexible substrate; the barrier groove is tapered in the middle of the display panel in the thickness direction; The first side includes a first side segment and a second side segment distributed and connected in the direction along the inorganic material layer toward the flexible substrate, the second side segment extending toward the side closer to the display area in the direction along the inorganic material layer toward the flexible substrate; And / or, The second side includes a third side segment and a fourth side segment distributed and connected in the direction along the inorganic material layer toward the flexible substrate, the fourth side segment extending away from the display area in the direction along the inorganic material layer toward the flexible substrate.

2. The display panel as described in claim 1, characterized in that, In the direction along the inorganic material layer toward the flexible substrate, the first side extends generally toward the side closer to the display area and / or the second side extends generally toward the side away from the display area.

3. The display panel as described in claim 2, characterized in that, The first side is an inclined plane and / or the second side is an inclined plane.

4. The display panel as described in any one of claims 1 to 3, characterized in that, The second side is symmetrically arranged with respect to the first side.

5. The display panel as described in claim 1, characterized in that, The display area includes a pixel driving circuit layer disposed on the flexible substrate, the pixel driving circuit is disposed therein, and the pixel driving circuit layer includes an isolation layer; The inorganic material layer includes an isolation layer extending from the display area to the border area.

6. The display panel as described in claim 5, characterized in that, The display area includes a light-emitting layer, an encapsulation layer, and a touch layer sequentially stacked on the side of the pixel driving circuit layer facing away from the flexible substrate. The touch layer includes a touch planarization layer located on the side facing away from the flexible substrate, and the flexible material layer and the touch planarization layer are formed in the same layer.

7. A method for manufacturing a display panel, used to manufacture a display panel as described in any one of claims 1 to 6, characterized in that, The method for manufacturing the display panel includes: Provide flexible substrates; An inorganic material layer is formed on the flexible substrate; A barrier groove is formed on the inorganic material layer; wherein the barrier groove at least penetrates the inorganic material layer, and the barrier groove includes a first side surface near the display area and a second side surface opposite to the first side surface. In the direction along the inorganic material layer toward the flexible substrate, at least a portion of the first side surface extends toward the side near the display area, and at least a portion of the second side surface extends toward the side away from the display area. A flexible material layer is filled into the barrier groove.

8. The method for manufacturing a display panel as described in claim 7, characterized in that, After providing the flexible substrate, the method for manufacturing the display panel includes: A pixel driving circuit layer is formed on the flexible substrate; wherein the pixel driving circuit layer includes an isolation layer close to the flexible substrate; The formation of the inorganic material layer on the flexible substrate specifically includes: The isolation layer is formed on the flexible substrate located in the display area and the bezel area, and the isolation layer located in the bezel area serves as the inorganic material layer.

9. The method for manufacturing a display panel as described in claim 8, characterized in that, After forming the pixel driving circuit layer, the method for fabricating the display panel includes forming a light-emitting layer on the side of the pixel driving circuit layer opposite to the flexible substrate.

10. The method for manufacturing a display panel as described in claim 9, characterized in that, After forming the light-emitting layer, the method for manufacturing the display panel includes: Barrier grooves are formed on the inorganic material layer.

11. The method for manufacturing a display panel as described in claim 10, characterized in that, After the light-emitting layer is formed, the method for manufacturing the display panel includes forming a camera hole; wherein the camera hole and the barrier groove are formed in the same process.

12. The method for manufacturing a display panel as described in claim 10, characterized in that, After forming the barrier groove, the method for manufacturing the display panel includes: An encapsulation layer is formed on the side of the light-emitting layer that is away from the flexible substrate; A touch layer is formed on the side of the encapsulation layer opposite to the flexible substrate; wherein the touch layer includes a touch planarization layer located on the side opposite to the flexible substrate.

13. The method for manufacturing a display panel as described in claim 12, characterized in that, The flexible material layer and the touch planarization layer are formed in the same process.

14. A display device, characterized in that, The display device includes a display panel as claimed in any one of claims 1 to 6.

Citation Information

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