Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel has a display area and a bending area located at one side of the display area. The display area is provided with a pixel driving circuit, and the bending area is provided with a lead wire electrically connected with the pixel driving circuit. The display panel comprises a flexible substrate, an insulating layer located on the flexible substrate, and a flexible material layer. The bending area is provided with a groove penetrating through the insulating layer. The lead wire is arranged in the groove. The flexible material layer is filled in the groove and located above the lead wire and the interval area of the lead wire. The display panel has the groove penetrating through the insulating layer in the bending area, and the flexible material layer is filled above the lead wire and the interval area of the lead wire. The occurrence of the fracture of the bending area can be effectively reduced, the fracture of the lead wire in the bending area can be reduced, and the yield of the lead wire and the yield of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Currently, flexible AMOLED (Active-matrix organic light-emitting diode) displays have become the mainstream configuration and development direction for high-end mobile display devices. Due to the requirements of mobile display devices for screen-to-body ratio and narrow bezels, flexible substrates need to fold the driver chip and leads to the back of the screen while reducing the bezels, thereby increasing the display area on the front. However, because folding is required, the structure and wiring of the bent parts are at risk of damage. Summary of the Invention

[0003] According to a first aspect of the present application, a display panel is provided. The display panel has a display area and a bent area located on one side of the display area. The display area is provided with a pixel driving circuit, and the bent area is provided with leads that can extend to the display area to be electrically connected to the pixel driving circuit. The display panel includes a flexible substrate, an insulating layer on the flexible substrate, and a flexible material layer. The bent area is provided with a trench that penetrates the insulating layer. A portion of the leads is disposed in the trench, and the flexible material layer fills the trench and is located above the leads and in the spacer region between the leads.

[0004] In some embodiments, the display area includes a pixel driving circuit layer disposed on the flexible substrate, the pixel driving circuit layer is provided with the pixel driving circuit, and the pixel driving circuit layer includes an isolation buffer layer, a gate insulating layer, an interlayer dielectric layer and a planarization layer.

[0005] The insulating layer includes the isolation buffer layer covering the bending region, the gate insulating layer, and the interlayer dielectric layer.

[0006] In some embodiments, the flexible material layer and the planarization layer are disposed in the same layer.

[0007] In some embodiments, the trench includes a bottom surface and a first side surface and a second side surface located on both sides of the bottom surface and connected to the bottom surface. A portion of the surface of the flexible substrate facing the insulating layer serves as the bottom surface of the trench. The flexible material layer fills the area between the first side surface and the second side surface of the trench, excluding the area provided with leads.

[0008] In some embodiments, the lead includes a first conductive lead layer and a second conductive lead layer located on the side of the first conductive lead layer opposite to the flexible substrate.

[0009] According to a second aspect of the embodiments of this application, a method for manufacturing a display panel is provided, comprising:

[0010] Provide flexible substrates;

[0011] An insulating layer is formed on the flexible substrate;

[0012] A groove is formed in the bending area that penetrates the insulating layer;

[0013] A lead is formed extending from the bending area to the display area, wherein a portion of the lead located at the bending area is located within the trench;

[0014] A flexible material layer is filled in the trench, and the flexible material layer fills the area above the lead wire and the spacer area of ​​the lead wire.

[0015] In some embodiments, forming an insulating layer on the flexible substrate includes:

[0016] An isolation buffer layer, a gate insulating layer, and an interlayer dielectric layer are formed on the flexible substrate, with the isolation buffer layer, gate insulating layer, and interlayer dielectric layer located in the bending region forming the insulating layer.

[0017] In some embodiments, the method includes: forming a via in the gate insulating layer of the display area and the interlayer dielectric layer, wherein the trench and the via are formed in the same process.

[0018] In some embodiments, after forming the trench, the method includes:

[0019] A first metal conductive layer is formed; the first metal conductive layer is located at least in the bending region;

[0020] A second metal conductive layer is formed on the surface of the first metal conductive layer; the second metal conductive layer is located in the display area and the bending area.

[0021] The second conductive metal layer is etched to form the second conductive lead layer;

[0022] The first conductive metal layer is etched to form a first conductive lead layer, thereby forming a lead including the first conductive lead layer and the second conductive lead layer.

[0023] In some embodiments, the second metal conductive layer is etched using a dry etching method, and the first metal conductive layer is etched using a wet etching method.

[0024] In some embodiments, after forming the second metallic conductive layer, the method includes:

[0025] The second metal conductive layer is etched to form a second conductive lead layer and a source and drain located in the display area.

[0026] In some embodiments, after forming the source and drain, the method includes:

[0027] A planarization layer is formed; the planarization layer is located above the source electrode, above the drain electrode, above the exposed interlayer dielectric layer, and in the trench, wherein the planarization layer in the trench serves as the flexible material layer.

[0028] According to a third aspect of the embodiments of this application, a display device is provided, the display device including the display panel described above.

[0029] The display panel, its manufacturing method, and the display device provided in the above embodiments of this application have a groove penetrating the insulating layer in the bending area of ​​the display panel, and a flexible material layer is filled on the lead wire and in the space between the lead wires, which can effectively reduce the occurrence of breakage in the bending area and the breakage of the lead wire in the bending area, thereby improving the yield of the lead wire and the yield of the display panel. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a display panel provided in an exemplary embodiment of this application;

[0031] Figure 2 and Figure 3 This is a partial process flow diagram of the fabrication of a display panel provided in an exemplary embodiment of this application;

[0032] Figure 4 This is a flowchart of a method for preparing a display panel provided in an exemplary embodiment of this application. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0034] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0035] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0036] This application provides a display panel, a method for manufacturing the same, and a display device. The display panel, its manufacturing method, and the display device described in this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments can complement or combine with each other.

[0037] This application provides a display panel. See also... Figure 1 and combine when necessary Figure 2 As shown, the display panel has a display area S1, a bending area S2 located on one side of the display area S1, and a bonding area. The bonding area and the display area S1 are located on opposite sides of the bending area S2, so that after the display panel is bent, the bonding area is located on the back of the display panel and can be connected to external chips, etc. The display area S1 is provided with a pixel driving circuit for driving the light-emitting structure, and the bending area S2 is provided with a lead 60, one end of which can extend to the display area to be electrically connected to the pixel driving circuit, and the other end of the lead 60 can extend to the bonding area to electrically connect the pixel driving circuit to the external chip.

[0038] The display panel includes a flexible substrate 10, an insulating layer 201 on the flexible substrate 10, and a flexible material layer 70. A groove 30 is provided in the bending region S2, penetrating the insulating layer 201. A portion of the lead 60 is disposed within the groove 30. The flexible material layer 70 fills the groove 30 and is located above the lead 60 and in the space between the lead 60s. The portion of the lead 60 located within the groove 30 is attached to the inner wall of the groove 30.

[0039] In some embodiments, the material of the flexible substrate 10 may include one or more of polyimide, polyethylene terephthalate, and polycarbonate.

[0040] Please refer to Figure 1As shown, in some embodiments, the flexible substrate 10 includes a first substrate layer 11, a second substrate layer 12, and a third substrate layer 13 stacked sequentially. The first substrate layer 11 and the third substrate layer 13 may be formed of organic materials, such as one or more of polyimide, polyethylene terephthalate, and polycarbonate. The second substrate layer 12 may be formed of inorganic materials and may serve as a buffer layer for the flexible substrate.

[0041] It should be noted that in some other embodiments, the flexible substrate may also be made of other materials or have other forms of layer structure. This application does not limit this and the setting can be made according to the specific situation.

[0042] In some embodiments, the flexible material layer 70 is made of organic materials. For example, the flexible material layer 70 may be one or more resin-based materials, such as epoxy resin, phenolic resin, polyamide resin, polyimide, and styrene.

[0043] The display area S1 includes a pixel driving circuit layer 20 disposed on the flexible substrate 10, and the pixel driving circuit is disposed within the pixel driving circuit layer 20. The pixel driving circuit includes a thin-film transistor 90. The thin-film transistor 90 includes an active layer 91, a gate electrode 92 located on the side of the active layer 91 opposite to the flexible substrate 10, a first electrode 93, and a second electrode 94. One of the first electrode 93 and the second electrode 94 is a source electrode, and the other is a drain electrode.

[0044] The pixel driving circuit layer 20 includes a stacked isolation buffer layer 21, a gate insulating layer 221, an interlayer dielectric layer, and a planarization layer 224. The active layer 91 is disposed on the side of the isolation buffer layer 21 facing away from the flexible substrate 10. The gate insulating layer 221 is located between the active layer 91 and the gate electrode 92. The interlayer dielectric layer is located on the side of the gate electrode 92 facing away from the flexible substrate 10. The first electrode 93 and the second electrode 94 are electrically connected to the active layer 91 through vias penetrating the gate insulating layer 221 and the interlayer dielectric layer. The planarization layer 224 is located on the side of the first electrode 93 and the second electrode 94 facing away from the flexible substrate 10, covering the exposed interlayer dielectric layer.

[0045] Figure 1 The display panel structure shown has two gate electrodes 92 spaced apart along the thickness direction of the display panel. Correspondingly, the interlayer dielectric layer may include a first interlayer dielectric layer 222 located on the side of the lower gate electrode layer facing away from the flexible substrate 10, and a second interlayer dielectric layer 223 located on the side of the upper gate electrode layer facing away from the flexible substrate 10. The upper gate electrode layer is located on the side of the first interlayer dielectric layer 222 away from the flexible substrate 10.

[0046] In some embodiments, the planarization layer 224 is made of an organic material, such as one or more resin materials, such as epoxy resin, phenolic resin, polyamide resin, polyimide and phenylcyclobutene.

[0047] The material of the isolation buffer layer 21 is an inorganic material, such as SiO2. x SiN x Materials such as SiON and Al2O3 can prevent moisture from entering the device from the bottom of the flexible substrate 10, and at the same time prevent impurity atoms from precipitating into the pixel driving circuit and forming doping. In some embodiments, the isolation buffer layer 21 includes a buffer layer 211 and an isolation layer 212 located on the side of the buffer layer 211 facing away from the flexible substrate 10.

[0048] Accordingly, the insulating layer 201 includes an isolation buffer layer 21 covering the bending region S2, a gate insulating layer 221, and an interlayer dielectric layer. Please refer to... Figure 2 As shown, the groove 30 of the bending region S2 penetrates the entire insulating layer 201 along the thickness direction of the insulating layer 201, so that the portion of the flexible substrate 10 located below the groove 30 is exposed.

[0049] Further, the trench 30 includes a bottom surface 33 and a first side surface 31 and a second side surface 32 located on both sides of the bottom surface 33 and connected to it. In some embodiments, the trench 30 extends just to the surface of the flexible substrate 10 facing the insulating layer 201. Accordingly, the area of ​​the surface of the flexible substrate 10 facing the insulating layer 201 exposed from the trench 30 serves as the bottom surface of the trench 30. In other embodiments, a chamfered region 301 recessed into the flexible substrate 10 is formed at the junction of the bottom surface 33 and the first side surface 31 and / or at the junction of the bottom surface 33 and the second side surface 32. A lead 60 disposed in the trench 30 may partially fill the chamfered region 301. Specifically, the flexible material layer 70 fills the area between the first side surface 31 and the second side surface 32 of the trench 30, excluding the area where the lead is disposed.

[0050] In some embodiments, the lead 60 includes a first conductive lead layer 62 adjacent to the inner wall of the trench 30 and a second conductive lead layer 61 located on the side of the first conductive lead layer 62 facing away from the flexible substrate 10. The first conductive lead layer 62 can be a metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first conductive lead layer 62 can serve as the substrate layer of the lead 60. The second conductive lead layer 61 can serve as the main conductive layer of the lead 60. The material of the second conductive lead layer 61 can be the same as the material of the source and drain electrodes.

[0051] The lead wire 60 provided in the groove 30 can partially fill the chamfered region 301. Specifically, it can be understood that part of the first conductive lead wire layer 62 fills the chamfered region 301.

[0052] The second conductive lead layer 61 can be formed by dry etching, while the first conductive lead layer 62 can be formed by wet etching. Taking advantage of the poor anisotropy of wet etching, the spacing area of ​​the entire lead 60 can be etched more thoroughly (for example, the portion of the first conductive lead layer 62 located in the chamfered area 301 of the spacing area of ​​the lead 60 will be etched more cleanly). Furthermore, the etchant used in wet etching does not react with the second conductive lead layer 61, thus the formation of the first conductive lead layer does not affect the second conductive lead layer 61. The inclusion of the first conductive lead layer 62 helps reduce the short-circuit risk of the lead 60, improves the bending resistance of the entire bending area, reduces bending stress in the bending area, and avoids the risk of cracks in the bending and bonding areas, thereby improving the overall performance of the display panel.

[0053] Furthermore, in some embodiments, the flexible material layer 70 and the planarization layer 224 are disposed in the same layer, and the two are an integral structure formed in the same process. The material of the flexible material layer 70 is the same as that of the planarization layer 224.

[0054] Furthermore, in some embodiments, the display panel further includes a light-emitting layer 80 located on the side of the pixel driving circuit layer 20 away from the flexible substrate 10. This light-emitting layer 80 may include electrodes 81, pixel defining layers 82, etc.

[0055] This application also provides a method for manufacturing a display panel. Figure 4 This is a flowchart of a method for preparing a display panel according to an exemplary embodiment of this application. The method for preparing the display panel includes the following steps 101 to 105:

[0056] Step 101: Provide a flexible substrate;

[0057] Step 102: Form an insulating layer on the flexible substrate;

[0058] Step 103: Form a trench that penetrates the insulation layer in the bending area;

[0059] Step 104: Form a lead extending from the bending area to the display area, wherein a portion of the lead located in the bending area is located within the groove;

[0060] Step 105: Fill the trench with a flexible material layer, which fills the area above the lead wire and the space between the lead wires.

[0061] Please refer to the following: Figure 4 and combine when necessary Figures 1 to 3 The manufacturing method of the display panel will be described in detail.

[0062] In step 101, a flexible substrate 10 may be provided. The specific details of the provided flexible substrate 10 can be found in the above description and will not be repeated here.

[0063] In step 102, an isolation buffer layer 21, a gate insulating layer 221, and an interlayer dielectric layer may be formed on the display area S1 and the bending area S2 of the flexible substrate 10. Accordingly, the isolation buffer layer 21, the gate insulating layer 221, and the interlayer dielectric layer located in the bending area S2 form an insulating layer 201.

[0064] Specifically, step 102 can be achieved through the following steps:

[0065] Step 1021: An isolation buffer layer 21 is formed on the flexible substrate 10.

[0066] Step 1022: An active layer 91 is formed on the side of the isolation buffer layer 21 that is away from the flexible substrate 10.

[0067] Step 1023: A gate insulating layer 221 is formed on the side of the isolation buffer layer 21 and the active layer 91 that is away from the flexible substrate 10.

[0068] Step 1024: A gate electrode 92 is formed on the side of the gate insulating layer 221 that is away from the flexible substrate 10.

[0069] Step 1025: Form an interlayer dielectric layer.

[0070] Thus, the insulating layer 201 located in the bending region S2 can be formed through the above steps 1021 to 1025.

[0071] It should be noted that in step 1024, a full-layer gate electrode layer can be formed on the side of the gate insulating layer 221 away from the flexible substrate 10, and the full-layer gate electrode layer can be patterned by etching to form the required gate electrode 92.

[0072] Of course, for layer structures comprising multiple sub-layers, they can be formed sequentially according to the order of each sub-layer. For example, for an isolation buffer layer 21 comprising a buffer layer 211 and an isolation layer 212 located on the side of the buffer layer 211 facing away from the flexible substrate 10, the buffer layer 211 can be formed on the flexible substrate 10 first, and then the isolation layer 212 can be formed on the side of the buffer layer 211 facing away from the flexible substrate 10. For structures comprising two gate electrodes 92 and interlayer dielectric layers 222 and 223, the gate electrodes 92 and the corresponding interlayer dielectric layers can also be formed sequentially.

[0073] Furthermore, in step 103, a trench 30 penetrating the insulating layer 201 is formed in the bending region S2, so that the lower surface of the lead 60 can partially contact the flexible substrate 10. Compared with the embodiment in which the trench 30 does not penetrate the insulating layer, this is beneficial to improving the flexibility of the bending region S2.

[0074] Specifically, in some embodiments, trenches 30 can be formed in the insulating layer 201 by dry etching.

[0075] In some embodiments, the trench 30 may include, for example, Figure 2 The chamfered area 301 is shown.

[0076] In some embodiments, the display panel manufacturing method further includes: forming a first via 40 and a second via 50 in the gate insulating layer 221 of the display area and the interlayer dielectric layer to provide a first electrode 93 and a second electrode 94 connected to the active layer 91.

[0077] In a preferred embodiment, the trench 30 may be formed in the same process as the first via 40 and the second via 50, such as in the same etching process.

[0078] Furthermore, in some embodiments, step 104 can be implemented by the following steps 1041 to 1044:

[0079] Step 1041: First, form a first metallic conductive layer on the entire surface of the side where the opening of the trench 30 is located. Of course, in some other embodiments, the first metallic conductive layer may only be located in the bending region.

[0080] Step 1042: Form a second metal conductive layer on the surface of the first metal conductive layer; the second metal conductive layer is located in the display area and the bending area;

[0081] Step 1043: Etch the second metal conductive layer to form the second conductive lead layer;

[0082] Step 1044: Etch the first metal conductive layer to form a first conductive lead layer, thereby forming a lead including the first conductive lead layer and the second conductive lead layer.

[0083] While forming the second conductive lead layer in step 1043, the first electrode 93 and the second electrode 94 located in the display area can also be formed, i.e., the source and drain electrodes are formed. That is, in step 1043, the second metal conductive layer is etched, and the second conductive lead layer 61, the source electrode, and the drain electrode are formed simultaneously. In other words, the second conductive lead layer 61, the source electrode, and the drain electrode are formed in the same process.

[0084] It should be noted that, in some embodiments, the first electrode 93 and the second electrode 94 may be formed by dry etching in this step.

[0085] It should be noted that, in some embodiments, the second metal conductive layer is etched using a dry etching method to form the second conductive lead layer 61, and the first metal conductive layer is etched using a wet etching method to form the first conductive lead layer 62, so as to form a lead 60 including the first conductive lead layer 62 and the second conductive lead layer 61.

[0086] This method utilizes the poor anisotropy of wet etching to ensure more thorough etching of the spacing area of ​​the entire lead 60 (for example, the portion of the first conductive lead layer 62 located in the chamfered area 301 of the lead 60 spacing area will be etched more cleanly). Furthermore, the etchant used in wet etching does not react with the second conductive lead layer 61, thus the formation of the first conductive lead layer does not affect the second conductive lead layer 61. The inclusion of the first conductive lead layer 62 helps reduce the risk of short circuits in the lead 60, improves the bending resistance of the entire bending area, reduces bending stress in the bending area, and avoids the risk of cracks in the bending and bonding areas, thereby improving the overall performance of the display panel.

[0087] After step 1044, a flexible material layer 70 may be filled into the trench 30. This flexible material layer 70 fills the area above the lead 60 and the spaced areas of the lead 60, i.e., step 105.

[0088] Specifically, in some embodiments, a planarization layer 224 may be formed after step 1044. This planarization layer 224 is located above the first electrode 93, above the second electrode 94, above the exposed interlayer dielectric layer, and within the trench 30. The planarization layer 224 within the trench 30 forms a flexible material layer 70. This method of simultaneously forming the flexible material layer 70 during the process of forming the planarization layer 224 helps to streamline the display panel fabrication process, reduce fabrication time, and improve fabrication efficiency.

[0089] Of course, in some other embodiments, the flexible material layer may also be formed separately, in the process of forming the planarization layer.

[0090] Subsequently, a light-emitting layer 80, an encapsulation layer, and a touch layer can be sequentially disposed on the side of the pixel driving circuit layer 20 away from the flexible substrate 10 to form a complete display panel.

[0091] It should be noted that the lead 60 here can be a graphical lead or a non-graphical lead.

[0092] This application also provides a display device, which includes the display panel described in any of the above embodiments.

[0093] In one embodiment, the display device further includes a driver and a power supply circuit, wherein the driver is used to provide a driving signal to drive the light-emitting structure of the light-emitting layer to emit light, and the power supply circuit is used to supply power to the display panel.

[0094] In one embodiment, the display device further includes a housing, and the display panel is disposed within the housing or assembled onto the housing.

[0095] The display device provided in this application embodiment can be any device with display function, such as a mobile phone, tablet computer, television, laptop computer, or vehicle-mounted equipment.

[0096] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0097] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0098] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A display panel having a display area and a bent area located on one side of the display area, the display area having a pixel driving circuit, and the bent area having leads extending to the display area for electrical connection with the pixel driving circuit, characterized in that, The display panel includes a flexible substrate, an insulating layer on the flexible substrate, and a flexible material layer. A trench is provided in the bending area, penetrating the insulating layer and extending to the flexible substrate. A chamfered region recessed into the flexible substrate is formed at the connection between the trench and the flexible substrate. A portion of the lead is disposed within the trench. The lead includes a first conductive lead layer and a second conductive lead layer located on the side of the first conductive lead layer facing away from the flexible substrate. A portion of the first conductive lead layer fills the chamfered region. The second conductive lead layer is formed by dry etching, and the first conductive lead layer is formed by wet etching to form a spacing region between adjacent leads. The flexible material layer fills the trench and is located above the leads and in the spacing region between the leads. The display area includes a pixel driving circuit layer disposed on the flexible substrate. The pixel driving circuit layer contains the pixel driving circuit. The pixel driving circuit layer includes an isolation buffer layer, a gate insulating layer, an interlayer dielectric layer, and a planarization layer. The insulating layer includes the isolation buffer layer covering the bending region, the gate insulating layer, and the interlayer dielectric layer; The flexible material layer is disposed in the same layer as the planarization layer.

2. The display panel as described in claim 1, characterized in that, The trench includes a bottom surface and a first side surface and a second side surface located on both sides of the bottom surface and connected to the bottom surface. A portion of the surface of the flexible substrate facing the insulating layer serves as the bottom surface of the trench. The flexible material layer fills the area between the first side surface and the second side surface of the trench, excluding the area provided with the lead wire.

3. A method for manufacturing a display panel, used to manufacture a display panel as described in any one of claims 1 to 2, characterized in that, It includes: Provide flexible substrates; An insulating layer is formed on the flexible substrate; A trench is formed in the bending area that penetrates the insulating layer and extends to the flexible substrate. A chamfered region that is recessed into the flexible substrate is formed at the connection between the trench and the flexible substrate. A lead is formed extending from the bending area to the display area, wherein a portion of the lead located in the bending area is located within the trench. The lead includes a first conductive lead layer and a second conductive lead layer located on the side of the first conductive lead layer opposite to the flexible substrate. A portion of the first conductive lead layer fills the chamfered area. The second conductive lead layer is formed by dry etching, and the first conductive lead layer is formed by wet etching to form a spacing region between adjacent leads. A flexible material layer is filled in the trench, and the flexible material layer fills the area above the lead wire and the spacer area of ​​the lead wire.

4. The method for manufacturing a display panel as described in claim 3, characterized in that, Forming an insulating layer on the flexible substrate includes: An isolation buffer layer, a gate insulating layer, and an interlayer dielectric layer are formed on the flexible substrate, with the isolation buffer layer, gate insulating layer, and interlayer dielectric layer located in the bending region forming the insulating layer.

5. The method for manufacturing a display panel as described in claim 4, characterized in that, The method includes: forming vias in the gate insulating layer and the interlayer dielectric layer of the display area, wherein the trench and the vias are formed in the same process.

6. The method for manufacturing a display panel as described in claim 4 or 5, characterized in that, After forming the trench, the method includes: A first metal conductive layer is formed; the first metal conductive layer is located at least in the bending region; A second metal conductive layer is formed on the surface of the first metal conductive layer; the second metal conductive layer is located in the display area and the bending area. The second conductive metal layer is etched to form the second conductive lead layer; The first conductive metal layer is etched to form a first conductive lead layer, thereby forming a lead including the first conductive lead layer and the second conductive lead layer.

7. The display panel as described in claim 6, characterized in that, The second metal conductive layer is etched using a dry etching method, and the first metal conductive layer is etched using a wet etching method.

8. The display panel as described in claim 6, characterized in that, After forming the second metallic conductive layer, the method includes: The second metal conductive layer is etched to form a second conductive lead layer and a source and drain located in the display area.

9. The display panel as described in claim 8, characterized in that, After forming the source and drain, the method includes: A planarization layer is formed; the planarization layer is located above the source electrode, above the drain electrode, above the exposed interlayer dielectric layer, and in the trench, wherein the planarization layer in the trench serves as the flexible material layer.

10. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1 to 2.

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