A device and process suitable for large size metal support multilayer ceramic dielectric capacitor

By designing stacking and mounting fixtures, and combining magnetic and clamping components, the problem of solder paste stress affecting large-size ceramic capacitors during the welding process was solved. This enabled high-quality metal bracket and chip welding and flux removal, improving the stability of the finished product and the ease of electrical assembly.

CN115740686BActive Publication Date: 2026-02-27HANGZHOU LINGTONG ELECTRONICS
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202211626465.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-17
Publication Date
2026-02-27
Estimated Expiration
2042-12-17

AI Technical Summary

Technical Problem

When manufacturing large-size multilayer ceramic chip capacitors, the tensile stress of the metal in the solder paste has a significant impact on the metal support, leading to device damage. Existing technologies are unable to effectively reduce this stress effect.

Method used

The device employs stacking fixtures and die-loading fixtures combined with magnetic suction components and clamping components. Through red glue curing and high-temperature welding, it ensures full contact between the metal bracket and the chip. A through groove is designed to facilitate uniform heating of the solder paste and discharge of flux, reducing residue.

Benefits of technology

It effectively reduces the impact of tensile stress during the welding process on ceramic capacitors, improves the manufacturing quality and stability of large-size metal-supported multilayer ceramic capacitors, reduces flux residue, and simplifies the subsequent electrical assembly process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115740686B_ABST
    Figure CN115740686B_ABST
Patent Text Reader

Abstract

The application discloses a device and a process suitable for large-size metal support multilayer ceramic dielectric capacitors, relates to the technical field of chip multilayer ceramic dielectric capacitor manufacturing, and comprises a laminated clamp, a chip mounting clamp, and a tray support for bearing the chip mounting clamp. The laminated clamp is provided with a laminated groove, the chip mounting clamp is provided with a chip mounting groove, the chip mounting clamp is provided with a clamping part for clamping the capacitor in the chip mounting groove, and the chip mounting clamp is provided with a magnetic attraction part corresponding to the clamping part. The application can fully extrude and diffuse the solder paste between the metal support and the chip, effectively compress the space for deformation of the metal in the solder paste due to thermal expansion and cold contraction, effectively reduce the influence of the tensile stress on the chip multilayer ceramic dielectric capacitor, and is suitable for the manufacturing of large-size metal support multilayer ceramic dielectric capacitors. In the welding process, the metal support, the chip and the solder paste are uniformly heated, the flux in the solder paste is fully discharged from the lower notch of the chip mounting groove, and the chip mounting clamp is convenient to clean.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Multi-core-group radial lead multilayer ceramic dielectric capacitor and production process thereof

    CN110797190A

  • Clamp for multilayer ceramic dielectric capacitor without encapsulation metal bracket

    CN210587887U

  • Multistage plate stand

    JP2014147564A