Process for preparing a carrier tape substrate with improved thermal expansion properties

Abstract

The present application belongs to the technical field of preparation of carrier tape substrate, and particularly relates to a preparation process of carrier tape substrate with improved thermal expansion performance. The preparation process of carrier tape substrate with improved thermal expansion performance comprises the following steps: winding 2-3 glass fibers around a carrier tape to form a glass fiber bundle; pre-impregnating the glass fiber bundle with molten PET resin to wrap the surface of the glass fiber bundle with a layer of micron-sized resin, thereby increasing the subsequent resin wettability; curing and weaving the pre-impregnated glass fiber bundle to form a glass fiber cloth blank; and winding the glass fiber cloth blank into a roll, passing through molten PET resin, and being shaped through an oven, and then being placed in an oven for semi-curing operation. The present application provides a preparation process of carrier tape substrate with improved thermal expansion performance, and solves the problems of high cost, poor heat resistance and easy deformation at high temperature of the existing carrier tape substrate.

Description

Technical Field

[0001] This invention belongs to the field of carrier substrate preparation technology, and specifically relates to a preparation process for a carrier substrate with improved thermal expansion properties. Background Technology

[0002] With the ubiquitous application of IC cards in daily life, suppliers are paying increasing attention to the performance and cost of raw materials for IC card connectors. IC cards are used in a variety of harsh environments, and scenarios involving high and low temperatures and bending require IC card micro-connectors to have good performance.

[0003] Existing manufacturers typically use PI (polyimide resin) or PET (ethylene terephthalate) as the substrate for flexible copper-clad laminates. These three substrates account for 98% of the IC card substrate market. Of course, special IC card substrates use higher-performance BT resin, which is expensive. Although pure PET resin is inexpensive, its thermal expansion rate (0.02%) is far from meeting industry requirements. Meanwhile, the high price of PI deters many IC card manufacturers. With the addition of fiberglass cloth, using fiberglass impregnated with PET can achieve the required thermal expansion rate (0.04%) while keeping costs within a reasonable range.

[0004] CN103341949A discloses a method for processing photocurable glass fiber injection molded parts. The preparation steps are as follows: take an appropriate amount of glass fiber cloth pre-impregnated with modified epoxy resin and cut it to the required size; take an appropriate amount of transparent PET sheet and cut it to the size of the glass fiber cloth; print the designed pattern on the PET sheet using ink printing technology; bond the glass fiber cloth to the side of the PET sheet with the printed pattern to form a glass fiber board, and then place it on a UV lamp irradiation device for UV curing, with irradiation lasting 8-16 seconds; place the UV-cured glass fiber board into the mold cavity of a functional structure injection mold and perform injection molding to obtain the photocurable glass fiber injection molded part; the PET sheet is used as an intermediate tool as a carrier for receiving epoxy resin glass fiber cloth, and is removed after UV lamp irradiation and is not part of the product. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a preparation process for a carrier substrate with improved thermal expansion performance, thereby solving the problems of high cost, poor heat resistance and easy deformation at high temperature of existing carrier substrates.

[0006] The preparation process of the carrier substrate with improved thermal expansion properties according to the present invention includes the following steps: (1) Select electronic-grade glass fibers with a diameter of 30-100μm; (2) Two to three glass fibers are wound together by a machine to form an electronic-grade glass fiber bundle. The glass fiber bundle is tightly wound and there is no looseness when visually inspected. (3) Pre-impregnate the electronic-grade glass fiber bundle with molten PET resin, and then coat the surface of the electronic-grade glass fiber bundle with micron-sized PET resin to increase the wettability of subsequent resins; (4) The pre-impregnated electronic-grade glass fiber bundles are cured and woven to form a blank of electronic-grade glass fiber cloth; (5) The electronic grade glass fiber cloth blank roll is rolled together and passed through molten PET resin to form glass fiber PET cloth. After being shaped in the drying tunnel, it is placed in the oven for semi-curing to obtain a carrier substrate with high thermal expansion performance.

[0007] The electronic-grade glass fiber used in step (1) is of type 2116, 1027, 2008 or 2118.

[0008] The fiber tension in step (2) is 25-35N, and the winding speed is 40-80r / min.

[0009] The temperature of the molten PET resin in step (3) is 290-310℃; the thickness of the micron-sized PET resin is 8-12μm.

[0010] The curing temperature in step (4) is 190-210℃ and the curing time is 25-35min.

[0011] The weaving specifications for step (4) are 1m*200m.

[0012] In step (5), after passing through the molten PET resin, a glass fiber PET cloth with a total thickness of 80-120 μm is formed.

[0013] In step (5), the oven temperature is 140-160℃ and the setting time is 0.8-1.2min.

[0014] In step (5), the semi-curing temperature is 150-170℃ and the semi-curing time is 8-12h.

[0015] Specifically, the preparation process of the carrier substrate with improved thermal expansion properties includes the following steps: (1) Select electronic-grade glass fibers of type 2116, type 1027, type 2008 or type 2118 with a diameter of 30-100μm; (2) Wrap 2-3 glass fibers together in a machine, set the fiber tension to 25-35N and the winding speed to 40-80r / min to form an electronic grade glass fiber bundle. The glass fiber bundle is tightly wrapped and visually inspected for looseness. (3) Pre-impregnate the electronic grade glass fiber bundle with molten PET resin at 290-310℃, and wrap the surface of the electronic grade glass fiber bundle with a layer of resin of 8-12μm to increase the wettability of subsequent resins. (4) The pre-impregnated electronic-grade glass fiber bundles are cured at 190-210℃ for 25-35 minutes and woven according to the size specification of 1m*200m to form the blank of electronic-grade glass fiber cloth. (5) The electronic grade glass fiber cloth blank roll is rolled together and passed through molten PET resin to form a glass fiber PET cloth with a total thickness of 80-120μm. It is then shaped in a drying tunnel at 140-160℃ for 0.8-1.2min and then placed in an oven at 150-170℃ for semi-curing for 8-12h to obtain a carrier substrate with high thermal expansion performance.

[0016] Compared with the prior art, the beneficial effects of the present invention are: (1) The substrate prepared by the present invention has a thermal expansion performance of less than 0.04%, which is highly accurate.

[0017] (2) The preparation process of the carrier substrate with improved thermal expansion performance of the present invention is low in cost. Compared with the traditional IC card carriers prepared by PI, BT resin, etc., the price can be reduced by 40%, which reduces the operating cost of enterprises. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the roll-to-roll impregnation process of PET resin in the preparation process of the carrier substrate for improving thermal expansion performance according to the present invention. Detailed Implementation

[0019] The present invention will be further described below with reference to specific embodiments.

[0020] Example 1 The process for preparing the carrier substrate with improved thermal expansion properties includes the following steps: (1) Select 2118 type electronic grade glass fiber with a diameter of 30μm; (2) Two 8m glass fibers are wound together by a machine with a fiber tension of 25N and a winding speed of 40r / min to form an electronic-grade glass fiber bundle. The glass fiber bundle is tightly wound and there is no looseness when visually inspected. (3) Pre-impregnate the electronic-grade glass fiber bundle with molten PET resin at 290°C, and wrap an 8μm layer of resin on the surface of the electronic-grade glass fiber bundle to increase the wettability of subsequent resins; (4) The pre-impregnated electronic-grade glass fiber bundles are cured at 210°C for 25 minutes and woven in a single layer with a size of 1m*200m to form a blank of electronic-grade glass fiber cloth. (5) The electronic grade glass fiber cloth blank roll is rolled together and passed through molten PET resin to form a glass fiber PET cloth with a total thickness of 80μm. It is then shaped in a 140℃ oven for 1.2min and then placed in a 170℃ oven for semi-curing for 8h to obtain PET resin glass fiber cloth, which is a carrier substrate with high thermal expansion performance.

[0021] After the carrier substrate was subjected to a high temperature of 160℃ for 10 hours, the thermal expansion rate of the PET resin fiberglass cloth was 3.4 parts per ten thousand.

[0022] Example 2 The process for preparing the carrier substrate with improved thermal expansion properties includes the following steps: (1) Select 2008 type electronic grade glass fiber with a diameter of 60μm; (2) Three 8m glass fibers are wound together by a machine with a fiber tension of 30N and a winding speed of 60r / min to form an electronic-grade glass fiber bundle. The glass fiber bundle is tightly wound and there is no looseness when visually inspected. (3) Pre-impregnate the electronic-grade glass fiber bundle with molten PET resin at 300°C, and wrap an 8-12μm layer of resin on the surface of the electronic-grade glass fiber bundle to increase the wettability of subsequent resins. (4) The pre-impregnated electronic-grade glass fiber bundles are cured at 200°C for 30 minutes and woven according to the size specification of 1m*200m to form a blank of electronic-grade glass fiber cloth; (5) The electronic grade glass fiber cloth blank roll is rolled together and passed through molten PET resin to coat the surface with 100μm of PET resin. It is then shaped in a 150℃ oven for 1 minute and then placed in a 160℃ oven for semi-curing for 10 hours to obtain a carrier substrate with high thermal expansion performance.

[0023] After the carrier substrate was subjected to a high temperature of 160°C for 10 hours, the thermal expansion rate of the PET resin fiberglass cloth was 2.9 parts per ten thousand.

[0024] Example 3 The process for preparing the carrier substrate with improved thermal expansion properties includes the following steps: (1) Select 1027 type electronic grade glass fiber with a diameter of 100μm; (2) Three 8m glass fibers are wound together by a machine with a fiber tension of 35N and a winding speed of 80r / min to form an electronic-grade glass fiber bundle. The glass fiber bundle is tightly wound and there is no looseness when visually inspected. (3) Pre-impregnate the electronic-grade glass fiber bundle with molten PET resin at 310°C, and wrap a 12μm layer of resin on the surface of the electronic-grade glass fiber bundle to increase the wettability of subsequent resins. (4) The pre-impregnated electronic-grade glass fiber bundles are cured at 190°C for 35 minutes and woven according to the size specification of 1m*200m to form a blank of electronic-grade glass fiber cloth. (5) The electronic grade glass fiber cloth blank roll is rolled together and passed through molten PET resin to form a glass fiber PET cloth with a total thickness of 120μm. It is then shaped in a drying tunnel at 160℃ for 0.8min and then placed in a 150℃ oven for semi-curing for 12h to obtain a carrier substrate with high thermal expansion performance.

[0025] After the carrier substrate was subjected to a high temperature of 160°C for 10 hours, the thermal expansion rate of the PET resin fiberglass cloth was 3.0 parts per ten thousand.

[0026] Comparative Example 1 A process for preparing a carrier substrate includes the following steps: (1) Select 1027 type glass fiber with a diameter of 100μm; (2) Mechanically wind three 8m glass fibers together, set the fiber tension to 35N and the winding speed to 80r / min to form a tight winding, and visually inspect for any loose glass fiber bundles; (3) Pre-impregnate the glass fiber bundles with molten epoxy resin at 300±10℃ to coat the surface of the glass fiber bundles with a 12μm layer of resin. (4) After curing the pre-impregnated glass fiber bundles at 200℃ for 35 minutes, weave them according to the epoxy cloth specifications required by the customer. Usually, it is a single layer with a specification size of 1m*200m, thus forming a glass fiber cloth blank. (5) The glass fiber cloth blank rolls are rolled together and molten epoxy resin to form a glass fiber epoxy cloth with a total thickness of 120 μm. Then, it is dried in a 160℃ oven for 1.2 min to set the shape, and then placed in a 160℃ oven for 12 h for post-curing.

[0027] After the carrier substrate was subjected to a high temperature of 160°C for 10 hours, the thermal expansion rate of the epoxy resin fiberglass cloth was 13 parts per ten thousand.

[0028] Of course, the above description is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the embodiments of the present invention. The present invention is also not limited to the above examples, and all equivalent changes and improvements made by those skilled in the art within the scope of the present invention should fall within the patent coverage of the present invention.

Claims

1. A process for preparing a carrier substrate with improved thermal expansion properties, characterized in that: Includes the following steps: (1) Select electronic-grade glass fibers with a diameter of 30-100μm; (2) Wrap 2-3 glass fibers together to form an electronic-grade glass fiber bundle; the fiber tension in step (2) is 25-35N and the winding speed is 40-80r / min; (3) Pre-impregnate the electronic-grade glass fiber bundle with molten PET resin, and then coat the surface of the electronic-grade glass fiber bundle with micron-sized PET resin; the temperature of the molten PET resin is 290-310℃; the thickness of the micron-sized resin is 8-12μm; (4) The pre-impregnated electronic-grade glass fiber bundles are cured at a temperature of 190-210℃ and a curing time of 25-35min. They are then woven with a weaving specification of 1m*200m to form a blank of electronic-grade glass fiber cloth. (5) The electronic grade glass fiber cloth blank roll is rolled together and passed through molten PET resin to form a glass fiber PET cloth with a total thickness of 80-120μm. It is then shaped in an oven at a temperature of 140-160℃ for 0.8-1.2min. Then it is placed in an oven for semi-curing at a temperature of 150-170℃ for 8-12h to obtain a carrier substrate with high thermal expansion performance.

2. The preparation process of the carrier substrate with improved thermal expansion properties according to claim 1, characterized in that: The electronic-grade glass fiber used in step (1) is of type 2116, 1027, 2008 or 2118.

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