Leveling system and additive manufacturing apparatus

Abstract

The application discloses a leveling system and an additive manufacturing device, which mainly adjusts the inclination angle or height of a supporting unit through a processor unit to control a leveling unit, so that automatic leveling of the supporting unit is realized, and manual adjustment error is avoided.The technical scheme of the application is as follows: a leveling system comprises a supporting unit, a plurality of leveling units connected with the supporting unit, a processor unit and a leveling circuit, the processor unit is electrically connected with the leveling circuit, the leveling circuit is electrically connected with the leveling unit, and the processor unit is used for adjusting the inclination angle and height of the supporting unit through the leveling circuit to control the leveling unit.The application is mainly used for leveling of the additive manufacturing device.

Description

Technical Field

[0001] This invention relates to the field of 3D printing technology, and more particularly to a leveling system and additive manufacturing equipment. Background Technology

[0002] In a photopolymer additive manufacturing equipment, a light-transmitting screen is set on the top plate. After the resin box is filled with resin, it is placed on the light-transmitting screen. The release film is attached to the light-transmitting screen. The forming platform is immersed in the resin and maintains a uniform gap with the release film at the bottom of the resin box. The light source is irradiated onto the resin on one side of the release film according to the cross-sectional shape of the object to be formed, so that the resin between the forming platform and the release film is cured. Layer by layer, three-dimensional printing is achieved.

[0003] The formation of the first layer of the model is crucial. A uniform gap must exist between the forming surface of the molding platform and the release film. Since the release film relies on the light-transmitting screen for support, its tilt and flatness are determined by the screen. Therefore, ensuring the light-transmitting screen is parallel to the forming surface of the molding platform and that the distance is precise guarantees the accuracy of the printed product. Changing the molding platform or mechanical errors can easily alter the longitudinal position of the molding platform and the light-transmitting screen. For example, if the forming surface of the molding platform is not parallel to the light-transmitting screen or the spacing changes, the first layer of the model will fail to adhere to the molding platform, or the adhesion of the first layer on the molding platform will be uneven. This will result in poor stability during the model printing process, and model tilting will cause printing distortion.

[0004] Existing leveling technologies involve leveling the molding platform to ensure its molding surface is parallel to the light-transmitting screen. This can lead to instability in the molding platform's position, making it prone to loosening during printing. Alternatively, leveling technologies may involve leveling the resin cartridge. For example, patent CN208841857U discloses a leveling mechanism for a photopolymer additive manufacturing device. This mechanism includes a printing tray, with a auger connected to the tray via bearings. When the auger levels the tray, the movement of the bearings and auger allows the tray, which is fixedly connected to the bearings, to rotate smoothly up and down. A level connected to the moving ring is used to check if the bubble inside the level is centered, thus determining if the tray is level. Leveling the printing tray manually by rotating the auger and observing the level requires repeated adjustments and observations to ensure the tray is level, a cumbersome and time-consuming process. Summary of the Invention

[0005] In view of this, embodiments of the present invention provide a leveling system and additive manufacturing equipment, which mainly uses a processor unit to control a leveling unit to adjust the tilt angle and height of a support unit, thereby achieving automatic leveling of the support unit and avoiding errors from manual adjustment.

[0006] To achieve the above objectives, the present invention mainly provides the following technical solutions:

[0007] On one hand, embodiments of the present invention provide a leveling system, the leveling system comprising:

[0008] Support unit, on which a resin box is mounted;

[0009] Multiple leveling units, wherein the leveling units are connected to the support unit;

[0010] The processor unit is electrically connected to the leveling circuit, and the leveling circuit is electrically connected to the leveling unit. The processor unit is used to control the leveling unit to adjust the tilt angle and height of the support unit through the leveling circuit.

[0011] The leveling circuit includes a level conversion circuit;

[0012] The input terminal of the level conversion circuit is electrically connected to the processor unit, and the output terminal of the level conversion circuit is electrically connected to the leveling unit. The number of output terminals of the level conversion circuit corresponds to the number of leveling units.

[0013] The level conversion circuit is used to convert the level of the first control signal sent by the processor unit and generate a second control signal for controlling the leveling unit.

[0014] The level conversion circuit includes a conversion chip, and the leveling system also includes a power supply unit. The power supply terminal of the conversion chip is electrically connected to the power supply unit, the input terminal of the conversion chip is electrically connected to the processor unit, and the output terminal of the conversion chip is electrically connected to a plurality of the leveling units respectively. The number of output terminals of the conversion chip corresponds to the number of the leveling units.

[0015] The conversion chip is used to convert the first control signal into the second control signal.

[0016] The leveling circuit further includes multiple driving circuits, the number of which corresponds to the number of leveling units. The first end of the driving circuit is electrically connected to the output end of the level conversion circuit, and the second end of the driving circuit is electrically connected to the leveling unit.

[0017] The driving circuit includes a first resistor, a first capacitor, and a second capacitor;

[0018] The first end of the first resistor is electrically connected to the output end of the level conversion circuit, the second end of the first resistor is electrically connected to the leveling unit, the first end of the first capacitor is electrically connected to the second end of the first resistor, the second end of the first capacitor is grounded, the power supply end of the leveling unit is electrically connected to the first end of the second capacitor and the power supply unit respectively, and the second end of the second capacitor is grounded.

[0019] The first resistor is used for overcurrent protection of the leveling unit, and the first capacitor and the second capacitor are used for filtering.

[0020] The leveling system further includes multiple detection units, the number of which is the same as the number of leveling units. Each detection unit is connected to a leveling unit in a one-to-one correspondence. The detection units are positioned relative to the forming platform of the additive manufacturing equipment and are used to detect the position of the forming platform and generate detection signals.

[0021] The leveling circuit also includes a signal acquisition circuit. The number of input terminals of the signal acquisition circuit corresponds to the number of detection units. The input terminals of the signal acquisition circuit are electrically connected to the detection units, and the output terminals of the signal acquisition circuit are electrically connected to the processor unit.

[0022] The signal acquisition circuit is used to output the position information of the forming platform according to the detection signal, and the processor unit is used to control the leveling unit to adjust the tilt angle and height of the support unit according to the position information;

[0023] The signal acquisition circuit includes an acquisition chip, a pull-up resistor assembly, and a third capacitor;

[0024] The input terminal of the acquisition chip is electrically connected to the detection unit, the output terminal of the acquisition chip is electrically connected to the processor unit, the first terminal of the pull-up resistor assembly is electrically connected to the power supply unit, the second terminal of the pull-up resistor assembly is electrically connected to the output terminal of the acquisition chip, the first terminal of the third capacitor is electrically connected to the power supply unit, and the first terminal of the third capacitor is electrically connected to the power supply terminal of the acquisition chip, and the second terminal of the third capacitor is grounded.

[0025] The acquisition chip is used to output the position information of the molding platform based on the detection signal.

[0026] The leveling circuit further includes a voltage divider circuit, the number of which corresponds to the number of detection units. The first end of the voltage divider circuit is electrically connected to the output end of the detection unit, and the second end of the voltage divider circuit is electrically connected to the input end of the signal acquisition circuit.

[0027] The voltage divider circuit includes a fifth resistor and a fourth capacitor;

[0028] The first end of the fifth resistor is electrically connected to the detection unit, the second end of the fifth resistor is electrically connected to the input terminal of the acquisition chip, the first end of the fourth capacitor is electrically connected to the power supply unit, and the first end of the fourth capacitor is electrically connected to the power supply terminal of the detection unit, and the second end of the fourth capacitor is grounded.

[0029] The leveling system further includes a connection unit, which is electrically connected to the processor unit and the leveling circuit respectively.

[0030] The connection unit is used for data transmission between the processor unit and the leveling circuit.

[0031] The leveling system further includes a power supply unit, which includes a power source, a first conversion unit, and a second conversion unit. The power source is electrically connected to the first conversion unit, the first conversion unit is electrically connected to the leveling circuit, and the second conversion unit is electrically connected to the processor unit and the leveling circuit, respectively.

[0032] The first conversion unit and the second conversion unit are used for level conversion and to supply power to the leveling circuit.

[0033] The leveling unit includes a first fixing component, a driver, and a first moving component;

[0034] The first movable component is movably connected to the first fixed component, the first movable component is connected to the support unit, the driver is connected to the first fixed component and the first movable component respectively, and the driver is electrically connected to the leveling circuit;

[0035] The processor unit is used to control the driver so that the driver drives the first movable member to move relative to the first fixed member in order to level the support unit.

[0036] The detection unit includes a second fixed component, a detector, and a second movable component;

[0037] The second fixing member is connected to the support unit, the detector is connected to the second fixing member, the second movable member is movably connected to the second fixing member, the first end of the second movable member is opposite to the detector, and the second end of the second movable member is correspondingly set to the molding platform;

[0038] The leveling circuit is electrically connected to the detector;

[0039] The second movable component is used to move under the action of the forming platform, and the detector is used to generate the detection signal based on the displacement of the second movable component.

[0040] On the other hand, the present invention also provides an additive manufacturing apparatus, including a leveling system as described in any of the above claims, as well as a printer body, a light source assembly, a guide frame assembly, and a forming platform. The light source assembly and the forming platform are both electrically connected to the processor unit. The leveling unit is connected to the printer body. The light source assembly is disposed within the printer body. The guide frame assembly is disposed on the printer body. The forming platform is connected to the guide frame assembly.

[0041] The processor unit is used to control the light emitted by the light source assembly to be projected onto the light-transmitting port of the support unit, control the molding platform to move relative to the support unit for 3D printing, and control the leveling unit to level the support unit.

[0042] This invention discloses a leveling system and additive manufacturing equipment. The system primarily uses a processor unit to control leveling units to adjust the tilt angle and height of support units, achieving automatic leveling of the support units and avoiding errors from manual adjustments. In existing technologies, leveling the molding platform results in instability, making it prone to loosening during printing. Leveling the resin cartridge requires manual operation, which is cumbersome, time-consuming, and inaccurate. In contrast, this application uses multiple leveling units between the support unit and the printer body. The processor unit controls these units to adjust the angle of the support unit, thereby adjusting the angle of the resin cartridge supported by the support unit. This ensures a uniform distance between the release film of the resin cartridge and the molding surface of the molding platform, guaranteeing accurate model printing. Attached Figure Description

[0043] Figure 1 This is a structural block diagram of a leveling system provided in an embodiment of the present invention;

[0044] Figure 2 This is a partial structural schematic diagram of a leveling system provided in an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of the structure of a leveling unit and a detection unit in a leveling system provided by an embodiment of the present invention;

[0046] Figure 4 This is an exploded view of some components of a leveling unit and a detection unit in a leveling system provided by an embodiment of the present invention;

[0047] Figure 5 A circuit diagram of a level conversion circuit and a first connector provided for an embodiment of the present invention;

[0048] Figure 6 A circuit diagram of a driving circuit provided in an embodiment of the present invention;

[0049] Figure 7 A circuit diagram of a signal acquisition circuit provided in an embodiment of the present invention;

[0050] Figure 8 A circuit diagram of a voltage divider circuit provided in an embodiment of the present invention;

[0051] Figure 9 A circuit diagram of a second connector provided in an embodiment of the present invention;

[0052] Figure 10 A circuit diagram of a first conversion unit provided in an embodiment of the present invention;

[0053] Figure 11 This is a circuit diagram of a second conversion unit provided in an embodiment of the present invention. Detailed Implementation

[0054] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the following detailed description, in conjunction with the accompanying drawings and preferred embodiments, describes the specific implementation, structure, features and effects of a leveling system and additive manufacturing equipment proposed according to the present invention.

[0055] On the one hand, such as Figure 1 As shown, this embodiment of the invention provides a leveling system for additive manufacturing equipment. The additive manufacturing equipment includes a printer body and a forming platform 800. The leveling system includes:

[0056] A leveling system, characterized in that the leveling system comprises:

[0057] Support unit 100, on which a resin box is mounted;

[0058] Multiple leveling units 200 are connected to the support unit 100;

[0059] The processor unit 300 and the leveling circuit 400 are electrically connected. The leveling circuit 400 is electrically connected to the leveling unit 200. The processor unit 300 is used to control the leveling unit 200 to adjust the tilt angle and height of the support unit 100 through the leveling circuit 400.

[0060] Specifically, the printer body can be the base box of the additive manufacturing equipment, and the support unit 100 can be located at the top of the base box. In one embodiment, the support unit 100 is a flat frame structure and includes a light-transmitting opening 110. Depending on the type of printer, the light-transmitting opening 110 is used to lay different light-transmitting components. For example, in a bottom-transmitting additive manufacturing equipment, an optomechanical assembly is provided in the base box, and a light-transmitting plate is laid in the light-transmitting opening 110. The light-transmitting plate can be an acrylic plate or a glass plate. The light-transmitting plate is located above the optomechanical assembly. The light emitted by the optomechanical assembly with a specific contour passes through the light-transmitting plate and is projected onto the resin box above the light-transmitting plate.

[0061] Alternatively, a gate can be installed in the light-transmitting port 110. The gate displays an image with a specific outline, causing light emitted from the optomechanical assembly to pass through in that specific outline, thereby causing the printing resin in the resin cartridge on the gate to cure in that specific outline. The gate can be an LED screen.

[0062] The leveling unit 200 is disposed between the base housing and the support unit 100. There can be two leveling units 200, each connected to at least two sides of the support unit 100 of the light-transmitting opening 110, such as on the left and right sides of the light-transmitting opening 110. Alternatively, there can be three leveling units 200 located on different sides of the light-transmitting opening 110, or four leveling units 200 positioned at the four corners of the light-transmitting opening 110. By adjusting the height of the support unit 100 at different positions on at least two sides of the light-transmitting opening 110, the angle of the support unit 100 is changed, thereby altering the angle of the light-transmitting element.

[0063] The processor unit 300 can specifically be an MCU, used to receive data, perform calculations, and output control signals to control the leveling unit 200 to achieve automatic leveling of the support unit 100. The processor unit 300 is connected to a signal receiving module 800. In one embodiment, the signal receiving module 800 is connected to a user terminal, and the processor unit 300 can perform leveling by receiving user commands. For example, the user can issue a leveling command to a specific leveling unit 200, causing the leveling unit 200 to adjust the height of the support unit 100 according to the command, thereby achieving flexible adjustment of the support unit 100. Alternatively, in another embodiment, the signal receiving module 800 can be a switch button fixed to the base housing or a button on a touchscreen. Pressing the switch button sends a signal to the processor unit 300 to initiate leveling, and the processor unit 300 performs automatic leveling according to a pre-set program. The leveling system may also include a detection unit 500, which acquires the position information of the forming surface of the forming platform 800. The processor unit 300 acquires the position information and adjusts the angle of the support unit 100 according to the position information so that the angle of the support unit 100 is consistent with the angle of the forming surface.

[0064] The leveling circuit 400 acquires the detection signal generated by the detector 520 in the detection unit 500, generates position information of the molding platform 800, and sends it to the processor unit 300. The processor unit 300 then parses the information and generates a first control signal for one or more leveling units 200. This first control signal undergoes level conversion via the leveling circuit 400, transforming it into a second control signal that can control devices such as the driver 220 in the leveling unit 200, thereby controlling the tilt angle or height of the support unit 100. The specific adjustment method and implementation of the leveling circuit 400 will be described in detail below.

[0065] This invention discloses a leveling system and additive manufacturing equipment. The system primarily uses a processor unit to control leveling units to adjust the angle of a support unit, achieving automatic leveling of the support unit and avoiding errors from manual adjustments. In existing technologies, leveling the molding platform results in instability, making it prone to loosening during printing. Leveling the resin cartridge manually is cumbersome, time-consuming, and inaccurate. In contrast, this application uses multiple leveling units between the support unit and the printer body. The processor unit controls these units to adjust the angle of the support unit, thereby adjusting the angle of the resin cartridge supported by the support unit. This ensures a uniform distance between the release film of the resin cartridge and the molding surface of the molding platform, guaranteeing accurate model printing.

[0066] In one implementation, such as Figure 1 and Figure 5As shown, the leveling circuit 400 includes a level conversion circuit 410. The input terminal of the level conversion circuit 410 is electrically connected to the processor unit 300, and the output terminal of the level conversion circuit 410 is electrically connected to the leveling unit 200. The number of output terminals of the level conversion circuit 410 corresponds to the number of leveling units 200. The level conversion circuit 410 is used to perform level conversion on the first control signal issued by the processor unit 300, generating a second control signal for controlling the leveling unit 200.

[0067] The level conversion circuit 410 is a control signal conversion circuit. In one embodiment, taking the driver 220 in the leveling unit 200 as a servo motor as an example, the input signal voltage of the servo motor needs to be 5V to control the servo motor's movement, while the control signal output by the processor unit 300, i.e., the first control signal, is a 3.3V signal. The level conversion circuit 410 is used to convert the 3.3V first control signal into a 5V second control signal to control the servo motor's movement, and then perform leveling.

[0068] In one implementation, such as Figure 5 As shown, the level conversion circuit 410 includes a conversion chip U1, and the leveling system includes a power supply unit. The power supply terminals VCCA and VCCB of the conversion chip U1 are electrically connected to the power supply unit. The input terminals A1, A2, A3, and A4 of the conversion chip U1 are electrically connected to the processor unit 300, and the output terminals B1, B2, B3, and B4 of the conversion chip U1 are electrically connected to multiple leveling units 200, respectively. The number of output terminals of the conversion chip U1 corresponds to the number of leveling units 200. The conversion chip U1 is used to convert a first control signal into a second control signal.

[0069] For example Figure 2-4 As shown, the leveling system includes four leveling units 200, which are located on the outer sides of the four corners of the light-transmitting port 110. The specific principle of the level conversion circuit 410 is illustrated using this example. The input pins A1, A2, A3, and A4 of the conversion chip U1 are all electrically connected to the processor unit 300, used to acquire the first control signals sent by the processor unit 300 to the four leveling units 200 respectively. The VCCA pin is connected to the output terminal of the second conversion unit 730 of the power supply unit, which provides a 3.3V level to the VCCA pin. The VCCB pin is connected to the output terminal of the first conversion unit 720 of the power supply unit, which provides a 5V level to the VCCB pin. The conversion chip U1 can convert the first 3.3V control signal received by pins A1, A2, A3 and A4 according to the 3.3V level and the 5V level, and generate a second 5V control signal, which is output to the servo motor through the output pins B1, B2, B3 and B4. S1, S2, S3 and S4 in the circuit are the interfaces of the servo motors in the four leveling units 200, respectively.

[0070] The level conversion circuit 410 also includes a first filter capacitor C0 and a second filter capacitor C01. The two ends of the first filter capacitor C0 are connected to the VCCA pin and ground, respectively, to filter the VCCA pin. The two ends of the second filter capacitor C01 are connected to the VCCB pin and ground, respectively, to filter the VCCB pin. The NC pin of the conversion chip U1 is unused, and the OE pin of the conversion chip U1 is grounded and connected to VCCA through a pull-down resistor R0. In one embodiment, the VCCA pin of the conversion chip U1 is connected to the output terminal of the second conversion unit 730 through a first ferrite bead L3, which suppresses high-frequency noise and spike interference on the signal lines and power lines.

[0071] The specific structures of the aforementioned power supply unit, the first conversion unit 720, and the second conversion unit 730 in the embodiments of this application will be described in detail later.

[0072] In one implementation, such as Figure 6 As shown, the leveling circuit 400 also includes a drive circuit 420. The number of drive circuits 420 corresponds to the number of leveling units 200. The first terminal of the drive circuit 420 is electrically connected to the output terminal of the level conversion circuit 410, and the second terminal of the drive circuit 420 is electrically connected to the leveling unit 200. The drive circuit 420 includes a first resistor R1, a first capacitor C1, and a second capacitor C2. The first terminal of the first resistor R1 is electrically connected to the output terminal of the level conversion circuit 410, and the second terminal of the first resistor R1 is electrically connected to the driver 220 of the leveling unit 200. The first terminal of the first capacitor C1 is electrically connected to the second terminal of the first resistor R1, and the second terminal of the first capacitor C1 is grounded. The power supply terminal of the leveling unit 200 is electrically connected to the first terminal of the second capacitor C2 and the output terminal of the first conversion unit 720 of the power supply unit, respectively, and the second terminal of the second capacitor C2 is grounded. The first resistor R1 is used for overcurrent protection of the leveling unit 200, and the first capacitor C1 and the second capacitor C2 are used for filtering.

[0073] Each servo motor is equipped with a drive circuit 420. The first end of the first resistor R1 is connected to the output pins B1, B2, B3 or B4 of the level conversion circuit 410. The second control signal is transmitted to the control terminal of the servo motor after being filtered by the first capacitor C1. The servo motor is powered by 5V. The power supply terminal of the servo motor is electrically connected to the output terminal of the first conversion unit 720 of the power supply unit. The output terminal of the first conversion unit 720 is used to provide a 5V level to the servo motor. The power supply terminal of the servo motor is also connected to a second capacitor C2, which is used for filtering.

[0074] In one implementation, such as Figure 1-4As shown, the leveling system also includes multiple detection units 500, the number of which is the same as the number of leveling units 200. Each detection unit 500 is connected to a corresponding leveling unit 200. The detection units are positioned relative to the forming platform 800 of the additive manufacturing equipment and are used to detect the position of the forming platform 800 and generate detection signals. The leveling circuit 400 also includes a signal acquisition circuit 430, the number of which corresponds to the number of detection units 500. The inputs of the signal acquisition circuit 430 are electrically connected to the detection units 500, and the output is electrically connected to the processor unit 300. The signal acquisition circuit 430 outputs position information of the forming platform 800 based on the detection signals, and the processor unit 300 controls the leveling unit 200 to adjust the angle of the support unit 100 based on the position information.

[0075] The position information can be the height information of different points on the forming surface, the contact information of the forming surface with the leveling unit 200, or the tilt angle information of the forming surface, etc. The signal acquisition circuit 430 is used to perform analog-to-digital A / D conversion on the analog quantities acquired by the detection unit 500 to generate digital signals that can be received and analyzed by the processor unit 300.

[0076] In one implementation, such as Figure 7 As shown, the signal acquisition circuit 430 includes an acquisition chip U2, a pull-up resistor assembly, and a third capacitor C3. The input terminals AIN0, AIN1, AIN2, and AIN3 of the acquisition chip U2 are electrically connected to the detection unit 500. The output terminals SCL and SDA of the acquisition chip U2 are electrically connected to the processor unit 300. The first end of the pull-up resistor assembly is connected to the power supply unit, and the second end of the pull-up resistor assembly is electrically connected to the output terminals SCL and SDA of the acquisition chip U2. The first end of the third capacitor C3 is connected to the power supply unit, and the first end of the third capacitor C3 is also electrically connected to the power supply terminal VDD of the acquisition chip U2. The second end of the third capacitor C3 is grounded. The acquisition chip U2 is used to output the position information of the molding platform 800 based on the detection signal.

[0077] When the leveling system includes four leveling units 200, it also includes four detection units 500, with each detection unit 500 connected to a leveling unit 200 in a one-to-one correspondence. The pull-up resistor assembly includes a second resistor R2, a third resistor R3, and a fourth resistor R4. The acquisition chip U2 includes a first output terminal SCL, a second output terminal SDA, and a built-in comparator output terminal ALERT / RDY. The first end of the second resistor R2 is connected to the output terminal of the second conversion unit 730 of the power supply unit, and the second end of the second resistor R2 is electrically connected to the built-in comparator output terminal ALERT / RDY of the acquisition chip U2. The first end of the third resistor R3 is connected to the output terminal of the second conversion unit 730 of the power supply unit, and the second end of the third resistor R3 is electrically connected to the first output terminal SCL of the acquisition chip U2. The first end of the fourth resistor R4 is connected to the output terminal of the second conversion unit 730 of the power supply unit, and the second end of the fourth resistor R4 is electrically connected to the second output terminal SDA of the acquisition chip U2. The AIN0, AIN1, AIN2, and AIN3 pins of the acquisition chip U2 are electrically connected to the output of the leveling unit 200, respectively, to receive the detection signal from the leveling unit 200. The first and second outputs of the acquisition chip U2 are the SCL and SDA pins, respectively, and both the SCL and SDA pins are electrically connected to the processor unit 300. After the detection signal from the leveling unit 200 is converted into a digital signal by the acquisition chip U2, the position information of the molding platform 800 is generated and sent to the processor unit 300. The SCL and SDA pins are also connected to the output of the second conversion unit 730 of the power supply unit through the third resistor R3 and the fourth resistor R4, respectively. The output of the built-in comparator of the acquisition chip U2 is the ALERT / RDY pin of the acquisition chip U2. The ALERT / RDY pin is connected to the output of the second conversion unit 730 of the power supply unit through the second resistor R2. The second conversion unit 730 provides a 3.3V level, which serves to provide a stable high level for the acquisition chip U2 and avoid interference from the power supply signal to the output analog signal. The power supply pin VDD of the acquisition chip U2 is connected to the output of the second conversion unit 730 of the power supply unit. The power supply pin VDD is also connected to a third capacitor C3, which is used for filtering. The address pin ADDR of the acquisition chip U2 is grounded through the second ferrite bead L4. The second ferrite bead L4 is used to suppress high-frequency noise and spike interference on the signal lines and power lines.

[0078] In one implementation, such as Figure 8As shown, the leveling circuit 400 also includes a voltage divider circuit 440. The number of voltage divider circuits 440 corresponds to the number of detection units 500. The first terminal of the voltage divider circuit 440 is electrically connected to the output terminal of the detection unit 500, and the second terminal of the voltage divider circuit 440 is electrically connected to the input terminal of the signal acquisition circuit 430. The voltage divider circuit 440 includes a fifth resistor R5 and a fourth capacitor C4. The first terminal of the fifth resistor R5 is electrically connected to the detection unit 500, and the second terminal of the fifth resistor R5 is electrically connected to the input terminal AIN0, AIN1, AIN2, or AIN3 of the acquisition chip U2. The first terminal of the fourth capacitor C4 is connected to the power supply unit, and the first terminal of the fourth capacitor C4 is also electrically connected to the power supply terminal of the detection unit 500. The second terminal of the fourth capacitor C4 is grounded.

[0079] For each detector 520 in the detection unit 500, a voltage divider circuit 440 is set. The first end of the fifth resistor R5 is electrically connected to the AIN0, AIN1, AIN2 or AIN3 pins of the acquisition chip U2. The detection signal of the detector 520 is transmitted to the acquisition chip U2 after passing through the fifth resistor R5. When the detector 520 is a displacement sensor, the power supply voltage of the detector 520 is 3.3V. The power supply terminal of the detector 520 is electrically connected to the output terminal of the second conversion unit 730 of the power supply unit. The power supply terminal of the detector 520 is also connected to the fourth capacitor C4, which is used for filtering.

[0080] In one implementation, such as Figure 1 , 5 and Figure 9 As shown, the leveling system also includes a connection unit 600, which is electrically connected to both the processor unit 300 and the leveling circuit 400. The connection unit 600 is used for data transmission between the processor unit 300 and the leveling circuit 400.

[0081] The connection unit 600 facilitates the connection between the leveling circuit 400 and the processor unit 300. The connection unit 600 includes a first connector CON1 and a second connector CON2, which are specifically plug-in boards. CON1 is electrically connected to the input pins A1, A2, A3, and A4 of the conversion chip U1 to transmit the control signals from the processor unit 300 to the conversion chip U1. CON2 is electrically connected to the SCL pin, SDA pin, and ALERT / RDY pin of the acquisition chip U2 to receive the position information from the acquisition chip U2.

[0082] In one implementation, such as Figure 1 , Figure 10-11As shown, the leveling system also includes a power supply unit, which comprises a power supply 710, a first conversion unit 720, and a second conversion unit 730. The power supply 710 is electrically connected to the first conversion unit 720, and the first conversion unit 720 is electrically connected to the leveling circuit 400. The second conversion unit 730 is electrically connected to both the processor unit 300 and the leveling circuit 400. The first conversion unit 720 and the second conversion unit 730 are used for conversion and power supply to the leveling circuit 400.

[0083] The second conversion unit 730 outputs a 3.3V level, and the first conversion unit 720 outputs a 5V level. The power supply 710 provides a raw 24V voltage, and the first conversion unit 720 powers the servos and other components in the circuit that require a 5V level. In an embodiment with four servos, there can be two first conversion units 720, each powering two servos. The voltage provided by the first conversion unit 720 is stable, avoiding interference to circuit signals. The first conversion unit 720 can be implemented using various conversion chips, such as a high-frequency buck switching regulator.

[0084] like Figure 10 As shown, the first conversion unit 720 includes a first power supply chip U3. The first conversion unit 720 also includes a first diode D1, a fifth capacitor C5, a sixth capacitor C6, a sixth resistor R6, a seventh resistor R7, and an eighth resistor R8. The anode of the first diode D1 is electrically connected to the power supply 710, and the cathode of the first diode D1 is electrically connected to the VIN pin of the first power supply chip U3. The first terminal of the fifth capacitor C5 is electrically connected to the VIN pin of the first power supply chip U3, and the second terminal of the fifth capacitor C5 is grounded. The first terminal of the sixth capacitor C6 is electrically connected to the VIN pin of the first power supply chip U3, and the second terminal of the sixth capacitor C6 is grounded. The fifth capacitor C5 and the sixth capacitor C6 are used for filtering the supply voltage of the power supply 710. The VIN pin of the first power supply chip U3 is also electrically connected to the first terminal of the sixth resistor R6, and the second terminal of the sixth resistor R6 is electrically connected to the EN pin of the first power supply chip U3. The EN pin of the first power supply chip U3 is also electrically connected to the first terminal of the seventh resistor R7, and the second terminal of the seventh resistor R7 is grounded. An eighth resistor R8 is also connected between the FREQ pin of the first power supply chip U3 and ground. The GND and PAD pins of the first power chip U3 are grounded.

[0085] The first conversion unit 720 also includes a second diode D2 and a seventh capacitor C7. The first terminal of the second diode D2 is grounded, and the second terminal of the second diode D2 is electrically connected to the first terminal of the seventh capacitor C7. The first terminal of the seventh capacitor C7 is also electrically connected to the SW pin of the first power chip U3, and the second terminal of the seventh capacitor C7 is electrically connected to the BST pin of the first power chip U3. The second diode D2 is a Zener diode, and the seventh capacitor C7 is a bypass capacitor.

[0086] The first conversion unit 720 also includes an eighth capacitor C8, a ninth capacitor C9, and a ninth resistor R9. The first terminal of the eighth capacitor C8 is electrically connected to the COMP pin of the first power chip U3, the second terminal of the eighth capacitor C8 is electrically connected to the first terminal of the ninth resistor R9, the second terminal of the ninth resistor R9 is grounded, and the two terminals of the ninth capacitor C9 are electrically connected to the COMP pin of the first power chip U3 and the second terminal of the ninth resistor R9, respectively. The eighth capacitor C8, the ninth capacitor C9, and the ninth resistor R9 are used for loop frequency compensation.

[0087] The first conversion unit 720 also includes a first inductor L1, a tenth resistor R10, an eleventh resistor R11, a tenth capacitor C10, an eleventh capacitor C11, a third diode D3, a fourth diode D4, and a twelfth resistor R12. The first end of the first inductor L1 is electrically connected to the output pin SW of the first power chip U3. The first end of the tenth resistor R10 is electrically connected to the second end of the first inductor L1. The second end of the tenth resistor R10 is electrically connected to both the FB pin of the first power chip U3 and the first end of the eleventh resistor R11. The second end of the eleventh resistor R11 is grounded. The first ends of the tenth capacitor C10 and the eleventh capacitor C11 are both electrically connected to the second end of the first inductor L1. The second ends of both the tenth capacitor C10 and the eleventh capacitor C11 are grounded for filtering. The cathode of the third diode D3 is electrically connected to the second terminal of the first inductor L1, and the anode of the third diode D3 is grounded. The first terminal of the twelfth resistor R12 is electrically connected to the cathode of the third diode D3, and the second terminal of the twelfth resistor R12 is electrically connected to the anode of the fourth diode D4, and the cathode of the fourth diode D4 is grounded. The first inductor L1 is a 15uH / 3A inductor to prevent sudden changes in output voltage. The fourth diode D4 is a light-emitting diode used to indicate the operating status. The twelfth resistor R12 is a 0603 resistor.

[0088] In one embodiment, the cathode of the third diode D3 is electrically connected to the leveling circuit 400, and the cathode of the third diode D3 is used to output a 5V level. Specifically, the cathode of the third diode D3 is electrically connected to the power supply terminal of the servo motor, i.e., the second capacitor C2, to provide 5V power to the servo motor. The cathode of the third diode D3 is also electrically connected to the VCCB pin of the conversion chip U1, thereby providing a stable 5V level to the conversion chip U1.

[0089] like Figure 11As shown, the second conversion unit 730 includes a second power supply chip U4, and also includes a thirteenth resistor R13, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth resistor R14, and a fourteenth capacitor C14. The first terminal of the thirteenth resistor R13 is connected to the power supply voltage, and the second terminal of the thirteenth resistor R13 is electrically connected to the power supply terminal VIN pin of the second power supply chip U4. The first terminal of the twelfth capacitor C12 is electrically connected to the VIN pin, and the second terminal of the twelfth capacitor C12 is grounded. The first terminal of the thirteenth capacitor C13 is electrically connected to the VIN pin, and the second terminal of the thirteenth capacitor C13 is grounded. The first terminal of the fourteenth resistor R14 is electrically connected to the VIN pin, and the second terminal of the fourteenth resistor R14 is electrically connected to the first terminal of the fourteenth capacitor C14, and the second terminal of the fourteenth capacitor C14 is grounded. Both the second terminal of the fourteenth resistor R14 and the first terminal of the fourteenth capacitor C14 are electrically connected to the EN terminal of the second power supply chip U4.

[0090] The second conversion unit 730 also includes a fifteenth capacitor C15, a sixteenth capacitor C16, and a seventeenth capacitor C17. The first terminal of the fifteenth capacitor C15 and the first terminal of the sixteenth capacitor C16 are both electrically connected to the output pin (OUT) of the second power supply chip U4, and the second terminals of the fifteenth capacitor C15 and the sixteenth capacitor C16 are both grounded. The first terminal of the seventeenth capacitor C17 is electrically connected to the D=ADJ pin of the second power supply chip U4, and the second terminal of the seventeenth capacitor C17 is grounded. The twelfth capacitor C12, the thirteenth capacitor C13, the fourteenth capacitor C14, the fifteenth capacitor C15, the sixteenth capacitor C16, and the seventeenth capacitor C17 are all used for filtering.

[0091] The output pin (OUT) of the second power supply chip U4 is electrically connected to the leveling circuit 400 to output a 3.3V level. Specifically, the OUT pin of the second power supply chip U4 is electrically connected to the VCCA pin of the conversion chip U1, providing a stable 3.3V level for the conversion chip U1. The SCL and SDA pins of the acquisition chip U2 are connected to the OUT pin of the second power supply chip U4 through the third resistor R3 and the fourth resistor R4, respectively. The ALERT / RDY pin of the acquisition chip U2 is connected to the OUT pin of the second power supply chip U4 through the second resistor R2. The OUT pin of the second power supply chip U4 provides a stable 3.3V level for the acquisition chip U2, preventing the analog signals output from the SCL, SDA, and ALERT / RDY pins from being interfered with by the power supply signal. The OUT pin of the second power supply chip U4 is also electrically connected to the power supply terminal of the detector 520, providing a 3.3V level for the detector 520.

[0092] The following describes the specific structure of the leveling unit 200 and the detection unit 500, etc., in a leveling system according to one embodiment, as well as the leveling process:

[0093] like Figure 2-4 As shown, the leveling unit 200 includes a first fixed member 210, a driver 220, and a first movable member 230. The first movable member 230 is movably connected to the first fixed member 210 and is also connected to the support unit 100. The driver 220 is connected to both the first fixed member 210 and the first movable member 230, and is electrically connected to the leveling circuit 400. The processor unit 300 controls the driver 220 to move the first movable member 230 relative to the first fixed member 210, thereby leveling the support unit 100. The driver 220 can be the aforementioned servo motor.

[0094] The detection unit 500 includes a second fixed member 510, a detector 520, and a second movable member 530. The second fixed member 510 is connected to the first movable member 230, the detector 520 is connected to the second fixed member 510, and the second movable member 530 is movably connected to the second fixed member 510. The first end of the second movable member 530 is opposite to the detector 520, and the second end of the second movable member 530 is correspondingly positioned with respect to the forming platform 800. The leveling circuit 400 is electrically connected to the detector 520. The second movable member 530 is used to move under the action of the forming platform 800, and the detector 520 is used to generate a detection signal based on the displacement of the second movable member 530.

[0095] The leveling unit 200 and the detection unit 500 are fixed to each other and located on different sides outside the light-transmitting opening 110, corresponding to the four corners of the forming platform 800, enabling adjustment of the height or tilt angle of the support unit 100 from different positions. The detector 520 is a displacement sensor and / or a distance sensor; taking a displacement sensor as an example. The second fixing member 510 is connected to the first movable member 230, so that the detection unit 500 is linked to the first movable member 230, that is, the detection unit 500 moves up and down synchronously with the first movable member 230, so that the detection unit 500 reflects the actual height of the support unit 100 in real time. The second movable component 530 protrudes from the upper surface of the support unit 100. When the molding platform 800 descends to a preset height, the second movable component 530 will be pushed downwards by the molding platform 800, thereby pushing the detection head of the displacement sensor to move. The displacement sensor converts the vertical displacement of the second movable component 530 into a voltage signal, i.e., a detection signal. After that, the detection signal is converted into position information through the voltage divider circuit 440 and the signal acquisition circuit 430, and then transmitted to the processor unit 300 through the connection unit 600. The four points of the support unit 100 corresponding to the four leveling units 200 are respectively called the first leveling point, the second leveling point, the third leveling point, and the fourth leveling point. The processor unit 300 receives four sets of position information corresponding to the four displacement sensors. Among them, the leveling point with the largest change in the displacement sensor signal is the highest point among all the leveling points, i.e., the point closest to the molding platform 800. The first leveling point is taken as the highest point in the following example. The processor unit 300 sends a leveling signal to control the driver 220 of the leveling unit 200 corresponding to any point different from the first leveling point. This drives the first movable part 230 to rise, thereby raising the second leveling point. As the first movable part 230 rises, the detection unit 500 moves synchronously with the first movable part 230 because the second fixed part 510 is connected to it. This causes the second movable part 530 to rise simultaneously, while the position of the forming platform 800 remains unchanged. The second movable part 530 will generate new position information under the action of the forming platform 800. The processor unit 300 compares the difference between the new position information and the previous position information of the second leveling point. When the difference is less than 0.05 mm, the leveling of the second leveling point is completed. The leveling process is repeated for the third and fourth leveling points, and finally the first leveling point is leveled. When all leveling points are leveled, the upper surface of the support unit 100 is in contact with the forming surface of the forming platform 800, and the leveling is completed.

[0096] On the other hand, embodiments of the present invention also provide an additive manufacturing apparatus, including a leveling system as described above, as well as a printer body, a light source assembly, a guide frame assembly, and a forming platform 800. The light source assembly and the forming platform 800 are both electrically connected to the processor unit 300, the leveling unit 200 is connected to the printer body, the light source assembly is disposed within the printer body, the guide frame assembly is disposed on the printer body, and the forming platform 800 is connected to the guide frame assembly.

[0097] The processor unit 300 is used to control the light emitted by the light source assembly to be projected onto the light-transmitting port 110 of the support unit 100, control the molding platform 800 to move relative to the support unit 100 for 3D printing, and control the leveling unit 200 to level the support unit 100.

[0098] The technical solution of the present invention is as follows:

[0099] On one hand, embodiments of the present invention provide a leveling system, the leveling system comprising:

[0100] Support unit 100, on which a resin box is mounted;

[0101] Multiple leveling units 200 are connected to the support unit 100;

[0102] The processor unit 300 and the leveling circuit 400 are electrically connected. The leveling circuit 400 is electrically connected to the leveling unit 200. The processor unit 300 is used to control the leveling unit 200 to adjust the tilt angle and height of the support unit 100 through the leveling circuit 400.

[0103] The leveling circuit 400 includes a level conversion circuit 410;

[0104] The input terminal of the level conversion circuit 410 is electrically connected to the processor unit 300, and the output terminal of the level conversion circuit 410 is electrically connected to the leveling unit 200. The number of output terminals of the level conversion circuit 410 corresponds to the number of leveling units 200.

[0105] The level conversion circuit 410 is used to convert the level of the first control signal sent by the processor unit 300 and generate a second control signal for controlling the leveling unit 200.

[0106] The level conversion circuit 410 includes a conversion chip U1, and the leveling system also includes a power supply unit. The power supply terminal of the conversion chip U1 is electrically connected to the power supply unit, the input terminal of the conversion chip U1 is electrically connected to the processor unit 300, and the output terminal of the conversion chip U1 is electrically connected to multiple leveling units 200 respectively. The number of output terminals of the conversion chip U1 corresponds to the number of leveling units 200.

[0107] The conversion chip U1 is used to convert the first control signal into the second control signal.

[0108] The leveling circuit 400 also includes multiple driving circuits 420, the number of driving circuits 420 corresponding to the number of leveling units 200. The first end of the driving circuit 420 is electrically connected to the output end of the level conversion circuit 410, and the second end of the driving circuit 420 is electrically connected to the leveling unit 200.

[0109] The driving circuit 420 includes a first resistor R1, a first capacitor C1, and a second capacitor C2;

[0110] The first end of the first resistor R1 is electrically connected to the output end of the level conversion circuit 410, the second end of the first resistor R1 is electrically connected to the leveling unit 200, the first end of the first capacitor C1 is electrically connected to the second end of the first resistor R1, the second end of the first capacitor C1 is grounded, the power supply end of the leveling unit 200 is electrically connected to the first end of the second capacitor C2 and the power supply unit respectively, and the second end of the second capacitor C2 is grounded.

[0111] The first resistor R1 is used for overcurrent protection of the leveling unit 200, and the first capacitor C1 and the second capacitor C2 are used for filtering.

[0112] The leveling system also includes multiple detection units 500, the number of which is the same as the number of leveling units 200. The detection units 500 and leveling units 200 are connected in a one-to-one correspondence. The detection units are set relative to the forming platform 800 of the additive manufacturing equipment to detect the position of the forming platform 800 and generate detection signals.

[0113] The leveling circuit 400 also includes a signal acquisition circuit 430. The number of input terminals of the signal acquisition circuit 430 corresponds to the number of detection units 500. The input terminals of the signal acquisition circuit 430 are electrically connected to the detection units 500, and the output terminals of the signal acquisition circuit 430 are electrically connected to the processor unit 300.

[0114] The signal acquisition circuit 430 is used to output the position information of the molding platform 800 according to the detection signal, and the processor unit 300 is used to control the leveling unit 200 to adjust the tilt angle and height of the support unit 100 according to the position information.

[0115] The signal acquisition circuit 430 includes an acquisition chip U2, a pull-up resistor assembly, and a third capacitor C3;

[0116] The input terminal of the acquisition chip U2 is electrically connected to the detection unit 500, the output terminal of the acquisition chip U2 is electrically connected to the processor unit 300, the first terminal of the pull-up resistor assembly is electrically connected to the power supply unit, the second terminal of the pull-up resistor assembly is electrically connected to the output terminal of the acquisition chip U2, the first terminal of the third capacitor C3 is electrically connected to the power supply unit, and the first terminal of the third capacitor C3 is also electrically connected to the power supply terminal of the acquisition chip U2, and the second terminal of the third capacitor C3 is grounded.

[0117] The acquisition chip U2 is used to output the position information of the molding platform 800 based on the detection signal.

[0118] The leveling circuit 400 also includes a voltage divider circuit 440. The number of voltage divider circuits 440 corresponds to the number of detection units 500. The first end of the voltage divider circuit 440 is electrically connected to the output end of the detection unit 500, and the second end of the voltage divider circuit 440 is electrically connected to the input end of the signal acquisition circuit 430.

[0119] The voltage divider circuit 440 includes a fifth resistor R5 and a fourth capacitor C4;

[0120] The first end of the fifth resistor R5 is electrically connected to the detection unit 500, the second end of the fifth resistor R5 is electrically connected to the input end of the acquisition chip U2, the first end of the fourth capacitor C4 is electrically connected to the power supply unit, and the first end of the fourth capacitor C4 is electrically connected to the power supply end of the detection unit 500, and the second end of the fourth capacitor C4 is grounded.

[0121] The leveling system also includes a connection unit 600, which is electrically connected to the processor unit 300 and the leveling circuit 400 respectively.

[0122] The connection unit 600 is used for data transmission between the processor unit 300 and the leveling circuit 400.

[0123] The leveling system also includes a power supply unit, which includes a power supply 710, a first conversion unit 720, and a second conversion unit 730. The power supply 710 is electrically connected to the first conversion unit 720, the first conversion unit 720 is electrically connected to the leveling circuit 400, and the second conversion unit 730 is electrically connected to the processor unit 300 and the leveling circuit 400, respectively.

[0124] The first conversion unit 720 and the second conversion unit 730 are used for level conversion and to supply power to the leveling circuit 400.

[0125] The leveling unit 200 includes a first fixing member 210, a driver 220, and a first movable member 230.

[0126] The first movable member 230 is movably connected to the first fixed member 210, the first movable member 230 is connected to the support unit 100, the driver 220 is connected to the first fixed member 210 and the first movable member 230 respectively, and the driver 220 is electrically connected to the leveling circuit 400.

[0127] The processor unit 300 is used to control the driver 220 so that the driver 220 drives the first movable member 230 to move relative to the first fixed member 210 to level the support unit 100.

[0128] The detection unit 500 includes a second fixing member 510, a detector 520, and a second moving member 530;

[0129] The second fixing member 510 is connected to the support unit 100, the detector 520 is connected to the second fixing member 510, the second movable member 530 is movably connected to the second fixing member 510, the first end of the second movable member 530 is opposite to the detector 520, and the second end of the second movable member 530 is correspondingly set to the molding platform 800.

[0130] The leveling circuit 400 is electrically connected to the detector 520;

[0131] The second movable part 530 is used to move under the action of the forming platform 800, and the detector 520 is used to generate a detection signal based on the displacement of the second movable part 530.

[0132] On the other hand, the present invention also provides an additive manufacturing apparatus, including a leveling system as described above, as well as a printer body, a light source assembly, a guide frame assembly, and a forming platform 800. The light source assembly and the forming platform 800 are both electrically connected to the processor unit 300, the leveling unit 200 is connected to the printer body, the light source assembly is disposed in the printer body, the guide frame assembly is disposed on the printer body, and the forming platform 800 is connected to the guide frame assembly.

[0133] The processor unit 300 is used to control the light emitted by the light source assembly to be projected onto the light-transmitting port 110 of the support unit 100, control the molding platform 800 to move relative to the support unit 100 for 3D printing, and control the leveling unit 200 to level the support unit 100.

[0134] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A leveling system, characterized in that, The leveling system, used in additive manufacturing equipment, includes: Support unit, on which a resin box is mounted; Multiple leveling units, wherein the leveling units are connected to the support unit; The processor unit and the leveling circuit are electrically connected, the processor unit and the leveling circuit are electrically connected, and the processor unit is used to control the leveling unit to adjust the tilt angle and height of the support unit through the leveling circuit. Multiple detection units, the number of which is the same as the number of leveling units, are connected one-to-one with each leveling unit. The detection units are positioned relative to the forming platform of the additive manufacturing equipment and are used to detect the position of the forming platform and generate detection signals. The leveling circuit also includes a signal acquisition circuit. The number of input terminals of the signal acquisition circuit corresponds to the number of detection units. The input terminals of the signal acquisition circuit are electrically connected to the detection units, and the output terminals of the signal acquisition circuit are electrically connected to the processor unit. The detection unit includes a second fixed component, a detector, and a second movable component; The second fixing member is connected to the support unit, the detector is connected to the second fixing member, the second movable member is movably connected to the second fixing member, the first end of the second movable member is opposite to the detector, and the second end of the second movable member is correspondingly set to the molding platform; The leveling circuit is electrically connected to the detector; The second movable component is used to move under the action of the forming platform, and the detector is used to generate the detection signal based on the displacement of the second movable component.

2. The leveling system according to claim 1, characterized in that, The leveling circuit includes a level conversion circuit; The input terminal of the level conversion circuit is electrically connected to the processor unit, and the output terminal of the level conversion circuit is electrically connected to the leveling unit. The number of output terminals of the level conversion circuit corresponds to the number of leveling units. The level conversion circuit is used to convert the level of the first control signal sent by the processor unit and generate a second control signal for controlling the leveling unit. The level conversion circuit includes a conversion chip, and the leveling system also includes a power supply unit. The power supply terminal of the conversion chip is electrically connected to the power supply unit, the input terminal of the conversion chip is electrically connected to the processor unit, and the output terminal of the conversion chip is electrically connected to a plurality of the leveling units respectively. The number of output terminals of the conversion chip corresponds to the number of the leveling units. The conversion chip is used to convert the first control signal into the second control signal.

3. The leveling system according to claim 2, characterized in that, The leveling circuit further includes multiple driving circuits, the number of which corresponds to the number of leveling units. The first end of the driving circuit is electrically connected to the output end of the level conversion circuit, and the second end of the driving circuit is electrically connected to the leveling unit. The driving circuit includes a first resistor, a first capacitor, and a second capacitor; The first end of the first resistor is electrically connected to the output end of the level conversion circuit, the second end of the first resistor is electrically connected to the leveling unit, the first end of the first capacitor is electrically connected to the second end of the first resistor, the second end of the first capacitor is grounded, the power supply end of the leveling unit is electrically connected to the first end of the second capacitor and the power supply unit respectively, and the second end of the second capacitor is grounded. The first resistor is used for overcurrent protection of the leveling unit, and the first capacitor and the second capacitor are used for filtering.

4. The leveling system according to claim 1, characterized in that, The signal acquisition circuit is used to output the position information of the forming platform according to the detection signal, and the processor unit is used to control the leveling unit to adjust the tilt angle and height of the support unit according to the position information; The signal acquisition circuit includes an acquisition chip, a pull-up resistor assembly, and a third capacitor; the leveling system also includes a power supply unit. The input terminal of the acquisition chip is electrically connected to the detection unit, the output terminal of the acquisition chip is electrically connected to the processor unit, the first terminal of the pull-up resistor assembly is electrically connected to the power supply unit, the second terminal of the pull-up resistor assembly is electrically connected to the output terminal of the acquisition chip, the first terminal of the third capacitor is electrically connected to the power supply unit, and the first terminal of the third capacitor is electrically connected to the power supply terminal of the acquisition chip, and the second terminal of the third capacitor is grounded. The acquisition chip is used to output the position information of the molding platform based on the detection signal.

5. The leveling system according to claim 4, characterized in that, The leveling circuit also includes a voltage divider circuit, the number of which corresponds to the number of detection units. The first end of the voltage divider circuit is electrically connected to the output end of the detection unit, and the second end of the voltage divider circuit is electrically connected to the input end of the signal acquisition circuit. The voltage divider circuit includes a fifth resistor and a fourth capacitor; The first end of the fifth resistor is electrically connected to the detection unit, the second end of the fifth resistor is electrically connected to the input terminal of the acquisition chip, the first end of the fourth capacitor is electrically connected to the power supply unit, and the first end of the fourth capacitor is electrically connected to the power supply terminal of the detection unit, and the second end of the fourth capacitor is grounded.

6. The leveling system according to claim 1, characterized in that, The leveling system also includes: A connection unit, which is electrically connected to both the processor unit and the leveling circuit; The connection unit is used for data transmission between the processor unit and the leveling circuit.

7. The leveling system according to claim 1, characterized in that, The leveling system also includes: The power supply unit includes a power source, a first conversion unit, and a second conversion unit. The power source is electrically connected to the first conversion unit, the first conversion unit is electrically connected to the leveling circuit, and the second conversion unit is electrically connected to the processor unit and the leveling circuit, respectively. The first conversion unit and the second conversion unit are used for level conversion and to supply power to the leveling circuit.

8. The leveling system according to claim 1, characterized in that, The leveling unit includes a first fixed component, a driver, and a first movable component; The first movable component is movably connected to the first fixed component, the first movable component is connected to the support unit, the driver is connected to the first fixed component and the first movable component respectively, and the driver is electrically connected to the leveling circuit; The processor unit is used to control the driver so that the driver drives the first movable member to move relative to the first fixed member in order to level the support unit.

9. An additive manufacturing apparatus, characterized in that, The system includes a leveling system as described in any one of claims 1 to 8, a printer body, a light source assembly, a guide frame assembly, and a forming platform. The light source assembly and the forming platform are both electrically connected to the processor unit. The leveling unit is connected to the printer body. The light source assembly is disposed within the printer body. The guide frame assembly is disposed on the printer body. The forming platform is connected to the guide frame assembly. The processor unit is used to control the light emitted by the light source assembly to be projected onto the light-transmitting port of the support unit, control the molding platform to move relative to the support unit for 3D printing, and control the leveling unit to level the support unit.

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