Ultra-high heat conduction composite heat dissipation module

Abstract

The application provides a super-high heat conduction composite heat dissipation module, which comprises a heat plate and a heat pipe, the heat plate is provided with a capillary structure, the heat plate is continuously bent along the length direction to form a fin structure in an array form, so that the heat plate forms a plurality of first notches and second notches which are staggered along the length direction, the opening of the first notch faces downward, and the opening of the second notch faces upward; the heat pipe is fixedly connected with the heat plate. The super-high heat conduction composite heat dissipation module of the application is formed by fixing the heat plate and the heat pipe into one body and forming a new heat pipe, and due to the capillary structure on the heat plate, after the heat plate is continuously bent to form the fin structure in the array form, the fin structure not only has the capillary structure in the sheet part arranged side by side, but also has the capillary structure in the bent part, so that the distribution of the capillary structure is increased, and compared with the traditional heat pipe with the same thickness and the copper sheet which is only arranged in intervals for heat dissipation, the heat conduction is higher, and the heat dissipation efficiency is higher.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic products, and in particular to a composite heat dissipation module with ultra-high thermal conductivity. Background Technology

[0002] Currently, the mainstream cooling modules for laptops consist of metal fin heatsinks, copper plates, and heat pipes. Heat is rapidly transferred from the heat source to the fins via water vapor circulation within the heat pipes. Then, a fan creates forced convection on the fins to dissipate the heat. These traditional cooling modules typically use aluminum and copper fins, with the aluminum or copper fins arranged alternately. The highest thermal conductivity is 409 W / (k*m), indicating relatively low thermal conductivity. Furthermore, there is a significant temperature difference between the fin tip and base, resulting in a low fin utilization rate. Additionally, traditional heat pipes are usually curved rather than straight due to the internal structure of laptops. The bends reduce the heat pipe's conductivity, decreasing the overall cooling performance of the module. For example, a right-angle L-bend heat pipe can result in a 48% heat loss due to the bend. The above two aspects have become bottlenecks in heat dissipation, restricting the improvement of the heat dissipation efficiency of traditional heat dissipation modules. At present, the development trend of laptop products is towards being cool, quiet, light, and thin. While maintaining the high performance of laptops, making laptops thinner and lighter, and maintaining a good temperature experience, puts forward increasingly higher requirements for the heat dissipation efficiency of heat dissipation modules.

[0003] Therefore, it is necessary to provide an ultra-high thermal conductivity composite heat dissipation module that can improve the heat dissipation efficiency of the radiator. Summary of the Invention

[0004] The purpose of this invention is to provide an ultra-high thermal conductivity composite heat dissipation module that can improve the heat dissipation efficiency of a radiator.

[0005] To achieve the above objectives, the present invention provides an ultra-high thermal conductivity composite heat dissipation module, including a heat spreader and heat pipes. The heat spreader is provided with a capillary structure, and the heat spreader is continuously bent along its length to form an arranged fin structure, so that the heat spreader forms a plurality of staggered first and second recesses along its length, the openings of the first recesses facing downwards and the openings of the second recesses facing upwards; the heat pipes are fixedly connected to the heat spreader.

[0006] Preferably, the heat pipe and the heat spreader are fixed together by welding.

[0007] Preferably, the heat pipe has a first groove that exposes its internal metal layer, the heat spreader is disposed in the first groove and fixedly connected to the metal layer, and the first groove communicates with the internal cavity of the heat pipe to form a sealed gas-liquid cavity.

[0008] Preferably, a copper plate is fixedly connected to the heat pipe, and the heat spreader is fixedly connected to the copper plate.

[0009] Preferably, the copper plate is provided with a second groove, the heat spreader is disposed in the second groove and fixedly connected to the copper plate, and the first notch communicates with the second groove to form a sealed gas-liquid cavity.

[0010] Preferably, the heat spreader includes a heat spreader body and a heat spreader base. The heat spreader body is continuously bent along its length to form the fin structure. The first notch and the second notch are formed on the heat spreader body. The heat spreader body is fixedly connected to the heat spreader base. The heat spreader base is fixedly connected to the heat pipe.

[0011] Preferably, the heat spreader base has a bent structure.

[0012] Preferably, the heat spreader base includes a first base portion and a second base portion formed by bending and extending from one end of the first base portion, the first base portion being fixedly connected to the heat pipe, and the heat spreader body being disposed on the second base portion.

[0013] Preferably, the first base portion is provided with an insertion hole, and the heat pipe is inserted and fixed in the insertion hole.

[0014] Preferably, the heat pipe has a stepped plug end, the inner wall of the socket is stepped to match the plug end, and the plug end is inserted into the socket.

[0015] Compared with existing technologies, the ultra-high thermal conductivity composite heat dissipation module of the present invention forms a novel heat pipe by fixing the heat spreader and heat pipe together. Because the heat spreader has capillary structures, and after the heat spreader is continuously bent to form an arranged fin structure, the fin structure has capillary structures not only in the parallel sheet-like portions but also in the bent portions, increasing the distribution of capillary structures. Compared with traditional heat pipes of the same thickness where copper sheets are only spaced apart for heat dissipation, the ultra-high thermal conductivity composite heat dissipation module of the present invention has higher thermal conductivity and higher heat dissipation efficiency. Compared with heat spreaders of the same thickness, the ultra-high thermal conductivity composite heat dissipation module of the present invention is smaller in size and lower in cost, solving the performance loss problem caused by the flattening of traditional heat pipes, and improving the overall heat dissipation efficiency of the heat dissipation module. The ultra-high thermal conductivity composite heat dissipation module of the present invention achieves the effect of no temperature difference between the two ends of the heat sink through the heat spreader, solving the problems of low thermal conductivity of traditional metal fin heat sink materials and temperature difference between the two ends, thereby improving the heat dissipation efficiency of the heat dissipation module. Attached Figure Description

[0016] Figure 1 This is a structural diagram of the heat spreader plate of the present invention before continuous bending.

[0017] Figure 2 This is a three-dimensional structural diagram of the first embodiment of the ultra-high thermal conductivity composite heat dissipation module of the present invention.

[0018] Figure 3 This is a structural diagram of the first embodiment of the heat spreader of the present invention.

[0019] Figure 4 This is a schematic diagram of the first embodiment of the ultra-high thermal conductivity composite heat dissipation module of the present invention.

[0020] Figure 5 This is a three-dimensional structural diagram of the second embodiment of the ultra-high thermal conductivity composite heat dissipation module of the present invention.

[0021] Figure 6 This is a schematic diagram of the second embodiment of the ultra-high thermal conductivity composite heat dissipation module of the present invention.

[0022] Figure 7 yes Figure 6 The exploded view of the ultra-high thermal conductivity composite heat dissipation module is shown.

[0023] Figure 8 This is a three-dimensional structural diagram of the third embodiment of the ultra-high thermal conductivity composite heat dissipation module of the present invention.

[0024] Figure 9 yes Figure 8 The exploded view of the ultra-high thermal conductivity composite heat dissipation module is shown. Detailed Implementation

[0025] To illustrate the technical content and structural features of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0026] Please see Figures 1 to 4The ultra-high thermal conductivity composite heat dissipation module 100 of the present invention includes a heat spreader 1 and a heat pipe 2. The heat spreader 1 is provided with a capillary structure 15. The heat spreader 1 is continuously bent along its length to form an arranged fin structure, resulting in several staggered first recesses 11 and second recesses 12 along its length. The openings of the first recesses 11 face downwards, and the openings of the second recesses 12 face upwards. The heat pipe 2 is fixedly connected to the heat spreader 1. The heat pipe 2 and the heat spreader 1 are fixed by welding, but this is not a limitation. In this embodiment, the capillary structure 15 is arranged along the direction of continuous bending of the heat spreader 1, but this is not a limitation. For example, the capillary structure 15 can also be arranged perpendicular to the direction of continuous bending of the heat spreader 1. More specifically, the heat spreader 1 can be made of existing copper plate material, and the capillary structure 15 is formed by etching on the copper plate. The specific structure and principle of the capillary structure 15 are well known to those skilled in the art, and therefore will not be described in detail here. By continuously bending the heat spreader 1 along its length to form an arranged fin structure, the fin structure has capillary structures 15 not only in the side-by-side sheet-like parts, but also in the bent parts, increasing the distribution of capillary structures 15. Compared with the traditional heat pipe 2 of the same thickness where the copper sheets are only arranged at intervals for heat dissipation, the ultra-high thermal conductivity composite heat dissipation module 100 of the present invention has higher thermal conductivity and higher heat dissipation efficiency.

[0027] Please see Figures 2 to 4 In the first embodiment, the heat pipe 2 has a first groove 21 exposing its internal metal layer. The heat spreader 1 is disposed within the first groove 21 and fixedly connected to the metal layer. The first notch 11 communicates with the internal cavity of the heat pipe 2 to form a sealed gas-liquid cavity 3. The openings on both sides of the first notch 11 can be sealed by welding or bonding to form the sealed gas-liquid cavity 3. Specifically, after the heat spreader 1 is continuously bent to form the first notch 11, the sidewalls of the first notches on both sides of the heat spreader 1 can be welded to the inner wall of the first groove 21 of the heat pipe 2 to form the sealed gas-liquid cavity 3. However, this is not a limitation; for example, the straight edges at both ends of the heat spreader 1 can also be welded to the inner wall of the first groove 21 of the heat pipe 2 to form the sealed gas-liquid cavity 3. The fixed connection method between the heat spreader 1 and the first groove 21 of the metal layer is not limited to welding; for example, existing bonding methods can also be used. The metal layer is the copper powder layer of the heat pipe 2, but this is not a limitation.

[0028] Please see Figures 5 to 7In the second embodiment, a copper plate 4 is fixedly connected to the heat pipe 2, and a heat spreader 1 is fixedly connected to the copper plate 4. Specifically, the copper plate 4 has a second groove 41, the heat spreader 1 is disposed in the second groove 41 and fixedly connected to the copper plate 4, and the first notch 11 communicates with the second groove 41 to form a sealed gas-liquid cavity 3. The openings on both sides of the first notch 11 can be sealed by welding or bonding to form a sealed gas-liquid cavity 3. More specifically, the heat spreader 1 is welded to the inner wall of the second groove 41 of the copper plate 4, but this is not a limitation.

[0029] Please see Figure 8 and Figure 9 In the third embodiment, the heat spreader 1 includes a heat spreader body 13 and a heat spreader base 14. The heat spreader body 13 is continuously bent along its length to form a fin structure. A first notch 11 and a second notch 12 are formed on the heat spreader body 13. The heat spreader body 13 is fixedly connected to the heat spreader base 14, and the heat spreader base 14 is fixedly connected to the heat pipe 2. The heat spreader base 14 and the heat pipe 2 can be fixed by welding, but this is not a limitation. Further, the heat spreader base 14 has a bent structure. Specifically, the heat spreader base 14 includes a first base portion 141 and a second base portion 142 formed by bending and extending from one end of the first base portion 141. The first base portion 141 is fixedly connected to the heat pipe 2, and the heat spreader body 13 is disposed on the second base portion 142. The heat spreader base 14 has an "L" shaped structure, but this is not a limitation. In some feasible embodiments, a slot for accommodating the heat spreader body 13 may also be provided on the heat spreader base 14, and the slot is used to communicate with the first recess 11 of the heat spreader body 13 to form a gas-liquid cavity 3.

[0030] Please continue reading. Figure 8 and Figure 9 The first base portion 141 is provided with an insertion hole 141a, into which the heat pipe 2 is inserted and fixed. Specifically, the heat pipe 2 has a stepped insertion end 22, and the inner wall of the insertion hole 141a is stepped to match the insertion end 22. The insertion end 22 is inserted into the insertion hole 141a. After the insertion end 22 is inserted into the insertion hole 141a, the first base portion 141 of the heat spreader base 14 can be welded together with the heat pipe 2. Since the inner wall of the insertion hole 141a matches the stepped insertion end 22, a good contact area can be ensured between the copper powder layer of the heat pipe 2 and the copper powder layer of the heat spreader 1, while good airtightness is ensured in the welded section, thereby ensuring that the ultra-high thermal conductivity composite heat dissipation module 100 of the present invention can achieve good water vapor circulation.

[0031] In summary, the ultra-high thermal conductivity composite heat dissipation module 100 of the present invention forms a novel heat pipe 2 by fixing the heat spreader 1 and the heat pipe 2 together. Because the heat spreader 1 has capillary structures 15, after the heat spreader 1 is continuously bent to form an arranged fin structure, the fin structure has capillary structures 15 not only in the parallel-arranged sheet-like portions but also in the bent portions, increasing the distribution of capillary structures 15. Compared to traditional heat pipes 2 of the same thickness where copper sheets are only spaced apart for heat dissipation, the ultra-high thermal conductivity composite heat dissipation module 100 of the present invention has higher thermal conductivity and higher heat dissipation efficiency. Furthermore, the ultra-high thermal conductivity composite heat dissipation module 100 of the present invention has the characteristics of small size and low cost, solving the problem of… The performance loss caused by flattening traditional heat pipe 2 can be addressed by improving the overall heat dissipation efficiency of the heat dissipation module. The ultra-high thermal conductivity composite heat dissipation module 100 of the present invention achieves the effect of no temperature difference between the two ends of the heat sink through the heat dissipation plate 1, solving the problems of low thermal conductivity of traditional metal fin heat sink materials and temperature difference between the two ends, thereby improving the heat dissipation efficiency of the heat dissipation module. The ultra-high thermal conductivity composite heat dissipation module 100 of the present invention can be configured by the heat dissipation plate 1 as a combination of heat dissipation plate body 13 and heat dissipation plate base 14 with a bent structure, so as to reduce the thermal resistance at the bend, thereby achieving high thermal conductivity at the bend, and thus improving the heat dissipation efficiency of the heat dissipation module, solving the problem of poor thermal conductivity at the bend of traditional heat pipe 2.

[0032] The above-disclosed examples are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are within the scope of the present invention.

Claims

1. A composite heat dissipation module with ultra-high thermal conductivity, characterized in that, include: A heat spreader plate is provided with a capillary structure. The heat spreader plate is continuously bent along its length to form an arranged fin structure, so that the heat spreader plate forms a number of staggered first and second recesses along its length. The opening of the first recess faces downward and the opening of the second recess faces upward. A heat pipe is fixedly connected to a heat spreader plate; the heat pipe has a first groove exposing its internal metal layer, the heat spreader plate is disposed in the first groove and fixedly connected to the metal layer, and the first groove communicates with the internal cavity of the heat pipe to form a sealed gas-liquid cavity.

2. The ultra-high thermal conductivity composite heat dissipation module according to claim 1, characterized in that, The heat pipe is fixed to the heat spreader by welding.

3. The ultra-high thermal conductivity composite heat dissipation module according to claim 1, characterized in that, A copper plate is fixedly connected to the heat pipe, and the heat spreader is fixedly connected to the copper plate.

4. The ultra-high thermal conductivity composite heat dissipation module according to claim 3, characterized in that, The copper plate is provided with a second groove, the heat spreader is disposed in the second groove and fixedly connected to the copper plate, and the first notch communicates with the second groove to form a closed gas-liquid cavity.

5. The ultra-high thermal conductivity composite heat dissipation module according to claim 1, characterized in that, The heat spreader includes a heat spreader body and a heat spreader base. The heat spreader body is continuously bent along its length to form the fin structure. The first notch and the second notch are formed on the heat spreader body. The heat spreader body is fixedly connected to the heat spreader base. The heat spreader base is fixedly connected to the heat pipe.

6. The ultra-high thermal conductivity composite heat dissipation module according to claim 5, characterized in that, The heat spreader base has a bent structure.

7. The ultra-high thermal conductivity composite heat dissipation module according to claim 6, characterized in that, The heat spreader base includes a first base portion and a second base portion formed by bending and extending from one end of the first base portion. The first base portion is fixedly connected to the heat pipe, and the heat spreader body is disposed on the second base portion.

8. The ultra-high thermal conductivity composite heat dissipation module according to claim 7, characterized in that, The first base portion is provided with an insertion hole, and the heat pipe is inserted and fixed in the insertion hole.

9. The ultra-high thermal conductivity composite heat dissipation module according to claim 8, characterized in that, The heat pipe has a stepped plug end, and the inner wall of the plug hole is stepped to match the plug end. The plug end is inserted into the plug hole.

Images