Stacked three-dimensional inductor

Abstract

The application discloses a laminated three-dimensional inductor, which comprises a plurality of layers of insulating material substrates, and each substrate is provided with a 1 / 4-3 / 4 annular transmission channel on the same side, and the transmission channels of two adjacent layers form a complete annular structure; each transmission channel is only provided with an opening at one end, and the opening end and the unopened end of the two adjacent transmission channels are arranged alternately; the plurality of substrates are laminated, and the adjacent transmission channels are communicated at the opening to form a spiral structure. The application does not rely on a magnetic core winding, has a wide application range, a low fault tolerance and a reduced volume of medium and high power inductors.

Description

Technical Field

[0001] This invention belongs to the field of inductor technology and relates to a multilayer three-dimensional inductor. Background Technology

[0002] Inductors are essential components in all fields of electronics, electrical engineering, communications, and energy storage. However, traditional inductors are mostly composed of air-core or magnetic core coils, which are characterized by large size, heavy weight, and limited application scenarios. Therefore, planar composite inductors have attracted attention. Existing planar / chip multilayer inductors all use various coil structures and metal support structures, resulting in large structural volume, inconvenience in use, and the need to increase the diameter or thickness of the conductive coil to provide overcurrent capacity, causing design and manufacturing inconveniences. Summary of the Invention

[0003] To address the aforementioned issues, this invention provides a multilayered three-dimensional inductor that does not rely on magnetic core winding, has a wide range of applications, low fault tolerance, and reduces the size of medium-to-high power inductors, thus solving the problems existing in the prior art.

[0004] The technical solution adopted in this invention is a stacked three-dimensional inductor, comprising a substrate of multiple insulating materials, each substrate having a 1 / 4-3 / 4 annular transmission channel on the same side, and two adjacent transmission channels forming a complete ring; each transmission channel has an opening at only one end, and the opening ends and unopened ends of two adjacent transmission channels are arranged alternately; multiple substrates are stacked, and adjacent transmission channels are connected at the opening to form a spiral structure.

[0005] Furthermore, each of the transmission channels has a through hole at one end and no through hole at the other end. A through hole pad is provided on the adjacent substrate at the position corresponding to the through hole. The through hole pad and the transmission channel are located on opposite sides of the substrate. Reflow soldering is performed at the through hole pad to connect the transmission channels on the two adjacent substrates, ensuring that the alternating current forms a complete flow loop.

[0006] Furthermore, a transmission channel is obtained by covering the substrate with a metal conductive layer.

[0007] Furthermore, the transmission channel is a 1 / 2 ring, and the adjacent transmission channels are 1 / 2 rings; or the transmission channel is a 1 / 4 ring, and the adjacent transmission channels are 3 / 4 rings.

[0008] Furthermore, the adjacent upper and lower transmission channels are both 3 / 4 rings.

[0009] Furthermore, the substrate has a hollow area in the middle.

[0010] Furthermore, the substrate is a PCB.

[0011] Furthermore, the substrate is provided with a stacked auxiliary structure symmetrically at the position where the transmission channel is not provided, to ensure that the spacing between the two sides of two adjacent substrates is consistent.

[0012] Furthermore, the width of the transmission channel is 0.1mm-100mm, and the diameter of the through hole is 0.1mm-100mm.

[0013] Furthermore, the substrate and the transmission channel constitute a circuit board, with a single-layer circuit board thickness of 0.02mm-50mm and a spacing between adjacent substrates ranging from 0.1mm to 20mm.

[0014] The beneficial effects of this invention are:

[0015] 1. The embodiments of the present invention do not rely on magnetic core winding, thus avoiding the problems of magnetic ring inductance; the width and thickness of the circuit board can be adjusted (1-20mm) to meet the application of different rated currents, and to meet the needs of various circuits from low frequency to high frequency, with a wide range of applications.

[0016] 2. The structural design of this invention can achieve precise assembly through standard reflow soldering, and the fault tolerance is much lower than that of manually or mechanically wound enameled wire magnetic ring inductors.

[0017] 3. The embodiments of the present invention greatly reduce the size of medium and high power inductors (greater than 0.5A), especially for various consumer electronic products, such as mobile phones, smartwatches, smart glasses, tablets and laptops.

[0018] 4. According to the design, the embodiments of the present invention can meet the requirements of high current (less than 20A) and meet the requirements of high Q value (greater than 3) without the need for a magnetic core. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is the top copper layer distribution of the circuit board in Embodiment 1 of the present invention.

[0021] Figure 2 This is the distribution of the bottom copper layer of the circuit board in Embodiment 1 of the present invention.

[0022] Figure 3 This is an exploded view of Embodiment 1 of the present invention.

[0023] Figure 4 This is an exploded view of Embodiment 1 of the present invention from another angle.

[0024] Figure 5 This is a side view of Embodiment 1 of the present invention.

[0025] Figure 6 This is an electromagnetic field distribution diagram of the working state of Embodiment 1 of the present invention.

[0026] Figure 7 This is the simulated inductance value of Embodiment 1 of the present invention.

[0027] Figure 8 This is a physical image of Embodiment 1 of the present invention.

[0028] Figure 9 This is a physical image of Embodiment 2 of the present invention.

[0029] Figure 10 This is a photograph of the actual product after welding according to Embodiment 1 of the present invention.

[0030] Figure 11 This is a physical diagram of the overall structure of Embodiment 1 of the present invention.

[0031] Figure 12 This is a side view of Embodiment 1 of the present invention.

[0032] Figure 13 This is a side view of Embodiment 4 of the present invention.

[0033] In the figure, 1. substrate, 2. through hole, 3. transmission channel, 4. stack-up auxiliary structure, 5. hollow area, 6. through hole pad. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] Example 1,

[0036] A type of multilayer three-dimensional inductor, such as Figure 1-2 As shown, the invention includes a multilayer copper-clad circuit board. Each copper-clad circuit board includes a substrate 1. Each substrate 1 has a 1 / 2 annular transmission channel 3 on the same side. The surface of the transmission channel 3 is covered with a copper layer. The transmission channels 3 on two adjacent substrates 1 are symmetrically arranged. One end of each transmission channel 3 is provided with a through hole 2, and the other end is not provided with a through hole 2. The open and closed ends of two adjacent transmission channels 3 are staggered. Multiple substrates 1 are stacked, and adjacent transmission channels 3 are electrically connected at the through hole 2 to form a spiral structure.

[0037] like Figure 3, 4 As shown in Figures 5 and 8, after the multilayer copper-clad circuit boards are stacked, through-hole pads 6 are provided on adjacent substrates 1 at positions corresponding to through-holes 2. The through-hole pads 6 and the transmission channels 3 are located on opposite sides of substrates 1. Overlap soldering is applied at the through-hole pads 6, with the solder pillars passing through the corresponding through-holes 2, connecting the transmission channels 3 on the two adjacent substrates 1, ensuring that the alternating current forms a complete flow loop. The two adjacent copper-clad circuit boards are symmetrical about their centroid (i.e., one copper-clad circuit board can overlap after rotating 180° around its centroid), and multiple copper-clad circuit boards are stacked to form a spiral structure. The inductor sheets can be directly soldered together for use, greatly reducing the overall inductor volume. See Figure 5. Figure 11-12 At the same time, the magnetic field flow range is smaller, reducing electromagnetic interference to other devices. High-speed, small-range magnetic field flow technology is applied.

[0038] The copper-clad circuit board has a hollow area 5 in the middle. The hollow design in the middle is to allow strong electromagnetic fields to pass through the conductive metal path, form a magnetic circuit, and close the magnetic circuit uniform compression technology.

[0039] The substrate 1 is an insulating layer; in this embodiment, the substrate 1 of the copper-clad circuit board is a PCB, which is easy to manufacture, easy to use, easy to match, and low in cost; AC power and signal form a closed loop through the transmission channel 3 on the PCB surface and the solder pillars in the through hole 2, generating a strong electromagnetic field closed loop, which satisfies the required inductance value and Q value.

[0040] The substrate 1 is provided with a stacking auxiliary structure 4 symmetrically at the position where the transmission channel 3 is not provided, with the spacing on the upper and lower sides being consistent, to ensure that there is a stacking auxiliary structure on both sides of the upper and lower PCB boards; in this embodiment, the stacking auxiliary structure 4 is a copper foil.

[0041] The transmission channel 3 of the single-layer copper-clad circuit board determines the amount of current that can pass through and increases the inductance value of the single layer. In the embodiment, the width of the transmission channel 3 is 0.1mm-100mm. When the current in the PCB copper foil increases, there will be a temperature rise, but this can be overcome by increasing the copper foil width. The thickness of the single-layer copper-clad circuit board is 0.02mm-50mm. Outside this range, it is difficult to process and the price is high. The thickness of the substrate 1 is the basic thickness of the PCB board. The spacing between two adjacent substrates 1 is 0.1mm-20mm. Within this range, the electromagnetic field attenuation generated by the transmission channel is small, which can ensure the low loss of the three-dimensional inductance proposed in the patent. At the same time, magnetic materials can be added between the two substrates to increase the inductance value and Q value.

[0042] The through-hole 2 determines the current flow through the connecting layers of thin sheets (the entire inductor sheet) and the overall mechanical strength of the inductor. In this embodiment, the diameter of the through-hole 2 ranges from 0.1mm to 100mm. This through-hole is used for current transmission and heat conduction between the upper and lower plates and is adjusted according to different real-world scenarios.

[0043] The embodiments of this invention can design inductors adapted to different frequencies, covering the range of 10Hz-100GHz. By using magnetically conductive materials with corresponding frequency characteristics, the volume of multilayer inductors can be effectively reduced. Magnetically conductive materials are applied to the outermost top and bottom layers of the inductor to form an efficient magnetic circuit, thus reducing the physical volume.

[0044] The inductance value can be increased by varying the number of copper-clad circuit boards. The experimental data is shown in Table 1.

[0045] Table 1 PCB Inductor Fabrication

[0046] 4 0.285μh 0.250μh 5 0.28μh 0.330μh 6 0.367μh 0.350μh 7 0.36μh 0.360μh 9 0.44μh 0.428μh 10 0.44μh 0.459μh 15 0.749μh 0.622μh 16 0.75μh 0.66μh 17 0.86μh 0.90μh 18 0.88μh 0.94μh 19 0.97μh 1.02μh 20 0.99μh 1.27μh 21 1.09μh 1.32μh 22 1.12μh 1.39μh 23 1.21μh 1.40μh 24 1.32μh 1.39μh 25 1.36μh 1.42μh 26 1.39μh 1.48μh 27 1.46μh 1.47μh 28 1.47μh 1.63μh 29 1.57μh 1.71μh

[0047] from Figure 6 It can be seen that the electric field of the PCB stacked inductor is uniformly surrounding the copper-clad path when it is working.

[0048] from Figure 7 It can be seen that the simulated inductance value and the measured inductance value of the PCB inductor are completely consistent at the corresponding frequency points. Figure 7 The vertical axis represents the inductance value, in H.

[0049] Example 2,

[0050] A multilayer three-dimensional inductor, wherein the transmission channel 3 on a certain substrate 1 is a 3 / 4 ring, such as Figure 9 As shown, the surface of transmission channel 3 is provided with a copper layer, which can be replaced with a silver layer or other conductive metal layers; the transmission channel 3 adjacent to the 3 / 4 ring is a 1 / 4 ring, and the upper and lower transmission channels 3 must ensure that a complete ring path is formed.

[0051] Example 3,

[0052] Both adjacent upper and lower transmission channels 3 are 3 / 4 ring-shaped, or in other words, they overlap in projection. Adjacent transmission channels 3 are rotated 90 degrees backward and are electrically connected at the through-hole 2, forming a complete ring-shaped path. This increases the inductance despite the limited product thickness. By increasing or decreasing the width of the transmission channels 3, the power passing through the inductor or the temperature rise of the inductor can be adjusted. For the same area, embodiments 1 and 2 have a wider bandwidth and better heat dissipation performance.

[0053] Example 4,

[0054] A type of multilayer three-dimensional inductor, such as Figure 13 As shown, in Embodiment 1, a magnetically conductive material is added between two adjacent substrates 1 to increase the electromagnetic field flow capability (magnetic flux) between substrates 1, thereby increasing the inductance and Q value of the inductor.

[0055] The structural unit of this invention embodiment is a copper-clad circuit board with the same structure (see...). Figure 10 After rotating 180° and stacking to the required inductance value, the entire unit can be directly soldered onto other circuit boards as a surface-mount component, allowing the PCB inductor to be used independently; or a magnetic core and two wires can be added to use it as a general magnetic ring inductor, greatly reducing the PCB size and increasing the power throughput.

[0056] This invention uses a conventional PCB as its design basis, and through conductive line design, it meets different size requirements, conduction current magnitudes, and inductance values. Different inductance values ​​can be achieved simply by soldering multiple identical substrates. This redefines high-power, high-Q inductors, breaking away from traditional hollow and magnetic inductor models. The copper-clad PCB with a specific structure replaces the complex coil winding, special materials, and manufacturing processes of traditional inductors. This invention does not rely on a magnetic core for winding, eliminating the temperature rise problem caused by magnetic loss and avoiding the problems associated with magnetic ring inductors, such as enameled wire coating cracking. The width and thickness of the copper-clad PCB can be adjusted to meet different rated current applications. Unlike machine-wound magnetic ring inductors, which require larger diameter magnetic rings and thicker enameled wires, thus avoiding wasted space and materials...

[0057] The multilayer three-dimensional inductor of this invention can be applied to all fields that require inductance, such as consumer electronics, home appliances, automobiles, industry, aerospace, and military.

[0058] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A multilayer three-dimensional inductor, comprising a substrate (1) of multiple insulating materials, characterized in that, Each substrate (1) has a 1 / 4-3 / 4 annular transmission channel (3) on the same side, and two adjacent transmission channels (3) form a complete ring; each transmission channel (3) has an opening at only one end, and the opening ends and unopened ends of two adjacent transmission channels (3) are arranged alternately; multiple substrates (1) are stacked, and adjacent transmission channels (3) are connected at the opening to form a spiral structure. Each of the transmission channels (3) has a through hole (2) at one end and no through hole (2) at the other end. A through hole pad (6) is provided on the adjacent substrate (1) at the position corresponding to the through hole (2). The through hole pad (6) and the transmission channel (3) are located on opposite sides of the substrate (1). Reflow soldering is performed at the through hole pad (6) to connect the transmission channels (3) on the two adjacent substrates (1) to ensure that the alternating current forms a complete transmission loop. The transmission channel (3) is a 1 / 2 ring, and the adjacent transmission channel (3) is a 1 / 2 ring; or the transmission channel (3) is a 1 / 4 ring, and the adjacent transmission channel (3) is a 3 / 4 ring. The substrate (1) has a hollow area (5) in the middle. The substrate (1) is a PCB; The substrate (1) is provided with a stacked auxiliary structure (4) symmetrically at the position where the transmission channel (3) is not provided, so as to ensure that the spacing between the two sides of the two adjacent substrates (1) is consistent.

2. The multilayered three-dimensional inductor according to claim 1, characterized in that, A transmission channel (3) is obtained by covering the substrate (1) with a metal conductive layer.

3. The multilayered three-dimensional inductor according to claim 1, characterized in that, The adjacent upper and lower transmission channels (3) are both 3 / 4 rings.

4. The multilayered three-dimensional inductor according to claim 1, characterized in that, The transmission channel (3) has a width of 0.1mm-100mm, and the through hole (2) has a diameter of 0.1mm-100mm.

5. The multilayered three-dimensional inductor according to claim 1, characterized in that, The substrate (1) and the transmission channel (3) constitute a circuit board. The thickness of a single-layer circuit board is 0.02mm-50mm, and the spacing between two adjacent substrates (1) is 0.1mm-20mm.

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