A bonding machine for semiconductor devices

Abstract

The application provides a bonding machine for semiconductor devices, and relates to the field of semiconductors.The bonding machine for semiconductor devices comprises a cabinet, a mounting frame is fixedly connected to the middle of the lower end face of the top plate of the cabinet, limiting sliding grooves are fixedly arranged on the inner walls of the two sides of the mounting frame, sliding rods are fixedly connected between the upper and lower inner walls of the two limiting sliding grooves, mounting sliding blocks are slidably sleeved on the outer walls of the two sliding rods, a mounting plate is fixedly connected between the two mounting sliding blocks, a driving motor is fixedly connected to the upper end face of the mounting plate, and a threaded rod is fixedly connected to the output end of the driving motor and penetrates through the mounting plate.The bonding machine for semiconductor devices has a reasonable overall structure design and is convenient to use, can guarantee pressure balance, protect the bellows, prevent the bellows from being broken, and can facilitate the transportation and movement of workers, and is very convenient.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, specifically to a bonding machine for semiconductor devices. Background Technology

[0002] A bonding machine is a device that directly combines two homogeneous or heterogeneous semiconductor materials with clean, atomically flat surfaces after surface cleaning and activation treatment, under certain conditions, by bonding the wafers together through van der Waals forces, molecular forces, or even atomic forces.

[0003] Existing bonding pressurization methods are mainly divided into two types: rigid pressurization, which directly presses the bonding through a high-rigidity pressure plate, and flexible pressurization, which commonly uses a bellows to apply pressure. The upper pressure plate applies pressure, and as the bellows contracts, it gradually forms a rigid pipe, thus ensuring uniform stress. However, relying solely on bellows for pressurization can easily cause rupture due to the high air pressure inside the pipe. In addition, most current bonding machines are large in size, requiring multiple people to handle during transport, which is quite troublesome. Therefore, we propose an improved bonding machine for semiconductor devices. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a bonding machine for semiconductor devices that solves the problems of bellows rupture caused by relying solely on bellows for pressurization, and the inconvenience of moving and transporting the device.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: a bonding machine for semiconductor devices, comprising a chassis, a mounting frame fixedly connected to the middle of the lower end face of the top plate of the chassis, limit grooves fixedly formed on both inner walls of the mounting frame, a sliding rod fixedly connected between the upper and lower inner walls of the two limit grooves, mounting sliders slidably sleeved on the outer walls of the two sliding rods, a mounting plate fixedly connected between the two mounting sliders, a drive motor fixedly connected to the upper end face of the mounting plate, a threaded rod fixedly connected to the output end of the drive motor through the mounting plate, a T-shaped connector fixedly connected to the lower end face of the threaded rod, a bearing seat rotatably sleeved on the outer wall of the T-shaped connector, a main pressure plate fixedly connected to the lower end face of the bearing seat, a bellows fixedly connected to the lower end face of the main pressure plate, a plurality of dampers fixedly arranged inside the bellows, shock-absorbing springs movably sleeved on the outer walls of the plurality of dampers, an upper pressure plate fixedly connected to the lower end face of the bellows, and a lower pressure plate fixedly arranged below the upper pressure plate;

[0008] A horizontal plate is fixedly connected to the lower part of the inner end of the chassis. Limiting rods are fixedly connected to both sides of the lower end face of the horizontal plate. Limiting blocks are slidably sleeved on the outer walls of the two limiting rods. A connecting rod is fixedly connected between the two limiting blocks. An adjusting slider is fixedly sleeved in the middle of the connecting rod. A slide block is fixedly connected to the lower end of the adjusting slider. Multiple universal pulleys are fixedly connected to the lower end of the slide block near the front and rear positions. A drive shaft is rotatably sleeved in the middle of the horizontal plate. A driven gear is fixedly sleeved on the outer wall of the drive shaft. An adjusting screw is fixedly connected to the lower end of the drive shaft through the horizontal plate. An adjusting motor is fixedly installed inside the chassis. A driving gear is fixedly connected to the output end of the adjusting motor. The driving gear meshes with the driven gear.

[0009] Preferably, support legs are fixedly connected to the lower end face of the chassis near the four corners.

[0010] Preferably, an upper door is rotatably provided on the front side of the chassis near the upper end, and a door handle is fixedly connected to the front side of the upper door. A lower door is rotatably provided on one side of the chassis near the lower end.

[0011] Preferably, a viewing window is fixedly provided on one side of the front face of the chassis and on the adjacent side wall, and the viewing window is made of explosion-proof transparent glass.

[0012] Preferably, the upper and lower ends of the plurality of dampers and shock-absorbing springs are fixedly connected to the lower end face of the main pressure plate and the upper end face of the upper pressure plate, respectively, and the plurality of dampers and shock-absorbing springs are evenly distributed between the main pressure plate and the upper pressure plate.

[0013] Preferably, the plurality of the universal pulleys are evenly distributed on the lower end surface of the slide block.

[0014] Preferably, the upper end of the drive shaft is rotatably sleeved on the inner wall of the housing, and the adjusting screw is threadedly sleeved on the inner end of the adjusting slider.

[0015] Preferably, a rectangular opening is fixedly provided at the lower end of the chassis, and the upper area of ​​the rectangular opening is larger than the lower area of ​​the slide.

[0016] Working principle: When in use, the device is driven by a motor to rotate a threaded rod, which in turn moves the mounting slider up and down on the rod, allowing the mounting plate to move stably. This facilitates the operation of the auxiliary drive motor. The T-shaped connector rotates within the bearing seat, causing the main pressure plate to move down and further press the bellows. Simultaneously, dampers and shock-absorbing springs buffer the pressure, evenly transmitting it to the upper pressure plate. This, combined with the lower pressure plate, achieves balanced pressing. When the device moves, the adjusting motor drives the drive gear to rotate, which in turn drives the driven gear, which in turn drives the drive shaft, which in turn drives the adjusting screw, which in turn drives the adjusting slider to move up and down. This movement of the slider further drives the sliding block to move up and down, and ultimately causes the universal pulley to move down to the ground, lifting the device and facilitating its movement.

[0017] (III) Beneficial Effects

[0018] This invention provides a bonding machine for semiconductor devices, which has the following advantages:

[0019] 1. This invention provides a bonding machine for semiconductor devices. The device drives a threaded rod to rotate via a drive motor. Under the action of a T-shaped connector, the main pressure plate is pressed down. The sliding block is mounted on the slide rod, which ensures the smooth operation of the drive motor and provides more precise pressure through the drive. At the same time, by setting up a damper and a shock-absorbing spring, the bellows is buffered as it is compressed and gradually becomes a rigid tube, preventing the bellows from breaking. This makes the upper pressure plate more uniformly stressed and the bonding effect better.

[0020] 2. The present invention provides a bonding machine for semiconductor devices. The device drives the driving gear to rotate by adjusting the motor, which in turn drives the driven gear to rotate, which in turn drives the drive shaft to rotate, which in turn drives the adjusting screw to rotate, which in turn drives the adjusting slider to move up and down, and in turn drives the slide to move up and down. Thus, when the device needs to be transported, the universal pulley moves down to touch the ground and lifts the device, making it easy to move the device.

[0021] 3. The present invention provides a bonding machine for semiconductor devices. The device can ensure that the adjusting slider remains stable during the lifting and lowering process by setting a limiting block that slides on the limiting rod, and prevent it from rotating.

[0022] 4. The present invention provides a bonding machine for semiconductor devices. The device has a reasonable overall structure design and is easy to use. It can not only ensure pressure balance and protect the bellows from rupture, but also facilitate transportation and movement by workers, which is very convenient. Attached Figure Description

[0023] Figure 1This is a schematic diagram of the external structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the upper part of the chassis of the present invention;

[0025] Figure 3 This is a schematic diagram of the internal structure of the lower end of the chassis of the present invention;

[0026] Figure 4 This is a schematic diagram of the mounting plate structure of the present invention;

[0027] Figure 5 This is a schematic diagram of the internal structure of the adjusting screw of the present invention.

[0028] The components are as follows: 1. Chassis; 2. Support leg; 3. Upper door; 4. Door handle; 5. Viewing window; 6. Lower door; 7. Mounting frame; 8. Limiting slide groove; 9. Slide rod; 10. Mounting slider; 11. Mounting plate; 12. Drive motor; 13. Threaded rod; 14. T-shaped connector; 15. Bearing pressure seat; 16. Main pressure plate; 17. Bellows; 18. Upper pressure plate; 19. Damper; 20. Shock-absorbing spring; 21. Lower pressure plate; 22. Horizontal plate; 23. Limiting rod; 24. Limiting block; 25. Connecting rod; 26. Adjusting slider; 27. Slide seat; 28. Universal pulley; 29. ​​Drive shaft; 30. Driven gear; 31. Adjusting screw; 32. Adjusting motor; 33. Drive gear; 34. Rectangular opening. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example:

[0031] like Figure 1-5As shown, this embodiment of the invention provides a bonding machine for semiconductor devices, including a chassis 1. A mounting frame 7 is fixedly connected to the middle of the lower end face of the top plate of the chassis 1. Limiting grooves 8 are fixedly formed on the inner walls of both sides of the mounting frame 7. Sliding rods 9 are fixedly connected between the upper and lower inner walls of the two limiting grooves 8. Mounting sliders 10 are slidably sleeved on the outer walls of the two sliding rods 9. A mounting plate 11 is fixedly connected between the two mounting sliders 10. A drive motor 12 is fixedly connected to the upper end face of the mounting plate 11. The output end of the drive motor 12 passes through the mounting plate 11 and is fixedly connected to a threaded rod 13. A T-shaped connector 14 is fixedly connected to the lower end face of the threaded rod 13. A bearing pressure seat 15 is rotatably sleeved on the outer wall of the T-shaped connector 14. A main pressure plate 16 is fixedly connected to the lower end face of the bearing pressure seat 15. A bellows 17 is fixedly connected to the lower end face. Multiple dampers 19 are fixedly installed inside the bellows 17. Each damper 19 is movably sleeved with a shock-absorbing spring 20 on its outer wall. An upper pressure plate 18 is fixedly connected to the lower end face of the bellows 17. A lower pressure plate 21 is fixedly installed below the upper pressure plate 18. The drive motor 12 drives the threaded rod 13 to rotate. The mounting slider 10 moves up and down on the slide rod 9, so that the mounting plate 11 can move up and down stably, which facilitates the operation of the drive motor 12. Furthermore, the T-shaped connector 14 rotates in the bearing pressure seat 15, which drives the main pressure plate 16 to move down, further pressing the bellows 17. At the same time, the dampers 19 and the shock-absorbing springs 20 are used for buffering, and the pressure is evenly transmitted to the upper pressure plate 18, which works with the lower pressure plate 21 to achieve pressing.

[0032] A horizontal plate 22 is fixedly connected to the inner end of the chassis 1 near the bottom. Limiting rods 23 are fixedly connected to both sides of the lower end face of the horizontal plate 22. Limiting blocks 24 are slidably sleeved on the outer walls of the two limiting rods 23. A connecting rod 25 is fixedly connected between the two limiting blocks 24. An adjusting slider 26 is fixedly sleeved in the middle of the connecting rod 25. A slide block 27 is fixedly connected to the lower end of the adjusting slider 26. Multiple universal pulleys 28 are fixedly connected to the lower end of the slide block 27 near the front and rear positions. A drive shaft 29 is rotatably sleeved in the middle of the horizontal plate 22. A driven gear 30 is fixedly sleeved on the outer wall of the drive shaft 29. The lower end of the drive shaft 29 passes through the horizontal plate 22. An adjusting screw 31 is fixedly connected to the device, and an adjusting motor 32 is fixedly installed inside the housing 1. The output end of the adjusting motor 32 is fixedly connected to a drive gear 33, which meshes with a driven gear 30. The adjusting motor 32 drives the drive gear 33 to rotate, which in turn drives the driven gear 30 to rotate, which in turn drives the drive shaft 29 to rotate, which in turn drives the adjusting screw 31 to rotate, which in turn drives the adjusting slider 26 to move up and down, which in turn drives the slide block 27 to move up and down, which in turn drives the universal pulley 28 to move up and down. The device can be moved downwards when needed to facilitate its movement.

[0033] Support legs 2 are fixedly connected to the four corners of the lower end face of the chassis 1 to stabilize the support device. An upper door 3 is rotatably mounted on the upper side of the front end face of the chassis 1, with a door handle 4 fixedly connected to the front surface of the upper door 3. A lower door 6 is rotatably mounted on one side of the chassis 1 near the lower end face. Viewing windows 5, made of explosion-proof transparent glass, are fixedly mounted on one side of the front end face and the adjacent side wall of the chassis 1. Multiple dampers 19 and shock-absorbing springs 20 are fixedly connected to the lower end face of the main pressure plate 16 and the upper end face of the upper pressure plate 18, respectively. The damper 19 and the shock-absorbing spring 20 are evenly distributed between the main pressure plate 16 and the upper pressure plate 18 to ensure uniform force distribution. Multiple universal pulleys 28 are evenly distributed on the lower end face of the slide block 27. The upper end of the drive shaft 29 is rotatably sleeved on the inner wall of the housing 1. The adjusting screw 31 is threadedly sleeved on the inner end of the adjusting slider 26. The adjusting screw 31 rotates to drive the adjusting slider 26 to move up and down. A rectangular opening 34 is fixedly opened at the lower end of the housing 1. The upper area of ​​the rectangular opening 34 is larger than the lower area of ​​the slide block 27. When the slide block 27 moves down, it passes through the rectangular opening 34.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A bonding machine for semiconductor devices, comprising a chassis (1), characterized in that: A mounting frame (7) is fixedly connected to the middle of the lower end face of the top plate of the chassis (1). Limiting grooves (8) are fixedly opened on both inner walls of the mounting frame (7). Sliding rods (9) are fixedly connected between the upper and lower inner walls of the two limiting grooves (8). Mounting sliders (10) are slidably sleeved on the outer walls of the two sliding rods (9). A mounting plate (11) is fixedly connected between the two mounting sliders (10). A drive motor (12) is fixedly connected to the upper end face of the mounting plate (11). The output end of the drive motor (12) passes through the mounting plate (11) and is fixedly connected to a threaded rod (13). 13) A T-shaped connector (14) is fixedly connected to the lower end face. A bearing seat (15) is rotatably sleeved on the outer wall of the T-shaped connector (14). A main pressure plate (16) is fixedly connected to the lower end face of the bearing seat (15). A bellows (17) is fixedly connected to the lower end face of the main pressure plate (16). Multiple dampers (19) are fixedly installed at the inner end of the bellows (17). Shock-absorbing springs (20) are movably sleeved on the outer wall of each of the multiple dampers (19). An upper pressure plate (18) is fixedly connected to the lower end face of the bellows (17). A lower pressure plate (21) is fixedly installed below the upper pressure plate (18). A horizontal plate (22) is fixedly connected to the inner end of the chassis (1) near the bottom. Limiting rods (23) are fixedly connected to both sides of the lower end face of the horizontal plate (22). Limiting blocks (24) are slidably sleeved on the outer walls of the two limiting rods (23). A connecting rod (25) is fixedly connected between the two limiting blocks (24). An adjusting slider (26) is fixedly sleeved in the middle of the connecting rod (25). A slide block (27) is fixedly connected to the lower end of the adjusting slider (26). The lower end of the slide block (27) is near the front and rear positions. Multiple universal pulleys (28) are fixedly connected at each point. A drive shaft (29) is rotatably sleeved in the middle of the cross plate (22). A driven gear (30) is fixedly sleeved on the outer wall of the drive shaft (29). The lower end of the drive shaft (29) passes through the cross plate (22) and is fixedly connected to an adjusting screw (31). An adjusting motor (32) is fixedly installed inside the housing (1). A drive gear (33) is fixedly connected to the output end of the adjusting motor (32). The drive gear (33) meshes with the driven gear (30).

2. The bonding machine for semiconductor devices according to claim 1, characterized in that: Support legs (2) are fixedly connected to the lower end face of the chassis (1) near the four corners.

3. A bonding machine for semiconductor devices according to claim 1, characterized in that: The front end face of the chassis (1) is provided with an upper door (3) which is rotatably provided on the side near the top. A door handle (4) is fixedly connected to the front end face of the upper door (3). The lower door (6) is rotatably provided on the side of the chassis (1) near the bottom.

4. A bonding machine for semiconductor devices according to claim 1, characterized in that: A viewing window (5) is fixedly provided on one side of the front face of the chassis (1) and on the adjacent side wall. The viewing window (5) is made of explosion-proof transparent glass.

5. A bonding machine for semiconductor devices according to claim 1, characterized in that: The upper and lower ends of the multiple dampers (19) and shock absorbers (20) are fixedly connected to the lower end face of the main pressure plate (16) and the upper end face of the upper pressure plate (18), respectively. The multiple dampers (19) and shock absorbers (20) are evenly distributed between the main pressure plate (16) and the upper pressure plate (18).

6. A bonding machine for semiconductor devices according to claim 1, characterized in that: Multiple universal pulleys (28) are evenly distributed on the lower end surface of the slide block (27).

7. A bonding machine for semiconductor devices according to claim 1, characterized in that: The upper end of the drive shaft (29) is rotatably sleeved on the inner wall of the housing (1), and the adjusting screw (31) is threadedly sleeved on the inner end of the adjusting slider (26).

8. A bonding machine for semiconductor devices according to claim 1, characterized in that: The lower end of the chassis (1) is fixedly provided with a rectangular opening (34), and the upper area of ​​the rectangular opening (34) is larger than the lower area of ​​the slide (27).

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