Stacked package structure with metal bridge and manufacturing method thereof

Abstract

Disclosed are a stacked package structure with a metal bridge and a manufacturing method thereof. The stacked package structure with the metal bridge comprises a substrate, a chip, a metal bridge and a component. The chip is mounted on the substrate, the metal bridge is mounted on the substrate at the periphery of the chip, and the chip is directly below the bridge surface, wherein the bridge surface is divided into two separated half bridge surfaces from the middle. The component is bonded on the bridge surface of the metal bridge, and finally the component is molded. The stacked package structure with the metal bridge can realize the characteristics of small packaging area, good integration and high reliability of the component.

Description

Technical Field

[0001] Embodiments of the present invention relate to semiconductor devices, and in particular, to stacked package structures with metal bridges and methods for fabricating the same. Background Technology

[0002] As electronic devices become smaller and more multifunctional, the types and numbers of chip components that need to be integrated and packaged together are increasing, thus raising the requirements for packaging structures and processes. Currently, semiconductor packaging widely integrates chips with various active and passive devices with different performance characteristics to form a single standard package, creating a small, low-power system.

[0003] However, conventional power module packaging often employs a planar layout, where the chip and passive components are placed on the same plane. This is not conducive to improving power density per unit area. ECP (embedded chip package) requires special substrate processing, resulting in higher overall costs. Furthermore, embedded passive components require special copper terminals, and the internal metal wiring is thinner, leading to higher parasitic resistance. Summary of the Invention

[0004] In view of one or more problems or drawbacks in the prior art, the present invention provides a stacked packaging structure with metal bridges and a method for manufacturing the same, which solves the problems of large packaging area, low integration and low integration density in the prior art.

[0005] A first aspect of the present invention provides a stacked package structure with a metal bridge, comprising: a substrate having pre-arranged wiring inside the substrate; a chip mounted on the substrate; a metal bridge having a bridge surface and four first metal pins connected to the bridge surface, the four first metal pins being mounted on the substrate, wherein the bridge surface of the metal bridge is broken in the middle to form two separate half-bridges, each half-bridge having two of the first metal pins; a molding compound for filling the upper surface of the substrate, the periphery of the metal bridge, the entire chip, and the gap between the chip and the metal bridge, and exposing the bridge surface of the metal bridge; and a first component bonded to the bridge surface of the metal bridge.

[0006] A second aspect of this application discloses a method for fabricating a stacked package structure with metal bridges, comprising: mounting a chip on a substrate; bonding a metal bridge to the substrate, wherein the chip is located below the metal bridge, and the metal bridge has a bridge surface and four first metal pins connected to the bridge surface; filling the upper surface of the substrate, the periphery of the metal bridge, the entire chip, and the gap between the chip and the metal bridge with a molding compound, and exposing the bridge surface of the metal bridge; etching the bridge surface of the metal bridge and breaking the bridge surface of the metal bridge in the middle to form two separate bridge surfaces; and bonding a first component to the two separate bridge surfaces.

[0007] As described above, the stacked packaging structure with metal bridge and its manufacturing method disclosed in this invention have the following advantages: standardized design allows a single copper bridge design to be applied to multiple modules; the copper bridge thickness greatly reduces the parasitic resistance of the circuit; there are no chip thickness limitations, resulting in high manufacturing flexibility; compared to embedded chip modules that must use copper terminal components, this structure can use ordinary components; the process yield is high, and the relative loss is low; and it can be manufactured by conventional packaging plants, effectively reducing costs and ensuring supply chain security. Attached Figure Description

[0008] Figure 1 The diagram shown is a 3D schematic of a stacked package structure 100 with metal bridges according to an embodiment of the present invention.

[0009] Figure 2 As shown Figure 1 An exploded view of the stacked package structure 100 with metal bridges shown.

[0010] Figure 3 The illustration shows an embodiment of the present invention. Figure 1 The diagram shows a cross-sectional view of the stacked package structure 100 with metal bridges along the A-A' axis.

[0011] Figure 4 The illustration shows another embodiment of the present invention. Figure 1 The diagram shows a cross-sectional view of the stacked package structure 100 with metal bridges along the A-A' axis.

[0012] Figure 5 The diagram shown is a cross-sectional schematic of a stacked packaging structure with metal bridges according to another embodiment of the present invention.

[0013] Figure 6 The diagram shown is a 3D schematic of a stacked package structure 200 with metal bridges according to another embodiment of the present invention.

[0014] Figure 7 As shown Figure 6 An exploded view of the stacked package structure 200 with metal bridges shown.

[0015] Figures 8A-8H The diagram illustrates a method for manufacturing according to an embodiment of the present disclosure. Figure 1 The diagram shows a packaging method flow chart of a stacked package structure 100 with metal bridges.

[0016] As shown in the accompanying drawings, the same reference numerals refer to the same parts in all different views. The accompanying drawings provided herein are for illustrative purposes, demonstrating embodiments, principles, concepts, etc., and are not drawn to scale.

[0017] Icons: 1-Substrate; 2-Adhesive layer; 3-Metal bridge; 4-Adhesive layer; 5-Molding compound; 6-Molding compound; 10-Chip; 11-Copper pillar; 20-First component; 30-Second component; 40-Third component; 31-Bridge surface; 32-First metal pin; 33-Second metal pin. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0020] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product is in use, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Similarly, terms such as "first" or "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Furthermore, throughout the specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the invention. Therefore, the phrases "in an embodiment," "in an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Moreover, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination.

[0022] Figure 1 The diagram shown is a 3D schematic of a stacked package structure 100 with metal bridges according to an embodiment of the present invention. Figure 1 As shown, the stacked package structure 100 includes a substrate 1, a molding compound 5, and a first component 20. The molding compound 5 encapsulates a chip and a metal bridge; in some embodiments, the molding compound 5 may encapsulate other components in addition to the chip and metal bridge. The top surface of the molding compound 5 exposes the metal bridge 3. The first component 20 is bonded to the metal bridge 3 via an adhesive layer 4.

[0023] Figure 2 It indicated Figure 1 An exploded view of the stacked package structure 100 with metal bridges is shown. Figure 2 As shown, the stacked package structure 100 with metal bridges includes a chip 10 and a metal bridge 3. The chip 10 is mounted on a substrate 1. The metal bridge 3 is mounted on the substrate 1 via an adhesive layer 2, and the chip 10 is located directly below the metal bridge 3. In one embodiment, the substrate 1 has pre-arranged wiring inside. Furthermore, in one embodiment, the stacked package structure 100 with metal bridges also includes a second component 30. The second component 30 is mounted together with the chip 10 directly below the metal bridge 3. In one embodiment, the second component 30 is bonded to the substrate 1 via the adhesive layer 2. In one embodiment, the second component 30 includes components such as capacitors and resistors.

[0024] like Figure 2As shown, the metal bridge 3 includes a square bridge surface 31 and four first metal pins 32 connected to the bridge surface 31. The four first metal pins 32 are respectively connected to the four corners of the square bridge surface 31, thereby supporting the bridge surface 31 in the vertical direction. The four first metal pins 32 and the square bridge surface 31 are integrally formed, requiring no additional soldering process. In one embodiment, the four first metal pins 32 are "L"-shaped pins. The bridge surface 31 of the metal bridge 3 is broken in the middle to form two separate half-bridges, and the edges of the two broken half-bridges are separated by a certain distance, i.e., the separated half-bridges are separated by a certain distance. Each half-bridge has two first metal pins 32. The four first metal pins 32 are bonded to the substrate 1 by an adhesive layer 2. In one embodiment, the adhesive layer 2 includes solder paste. In one embodiment, the metal bridge 3 includes a copper bridge; in other embodiments, the metal bridge 3 may also be made of other suitable metal materials.

[0025] The molding compound 5 is used to fill the upper surface of the substrate 1, the periphery of the metal bridge 3, the entire chip 10, and the gap between the chip 10 and the metal bridge 3, forming a standard cuboid shape. At the same time, the molding compound 5 exposes the bridge surface 31 of the metal bridge 3.

[0026] The first component 20 is bonded to the bridge surface 31 of the exposed metal bridge 3 via an adhesive layer 4. In one embodiment, the adhesive layer 4 comprises solder paste. In another embodiment, the first component 20 comprises an inductor.

[0027] Figure 3 The illustration shows an embodiment of the present invention. Figure 1 A schematic cross-sectional view of the stacked package structure 100 with metal bridges along the A-A' axis.

[0028] like Figure 3 As shown, the upper surface of substrate 1 is connected to chip 10 via copper pillars 11. Those skilled in the art will understand that the connection between chip 10 and substrate 1 via copper pillars 11 is merely illustrative. In one embodiment, the upper surface of substrate 1 and the back surface of chip 10 may also be connected via adhesive, while the front surface of chip 10 will be connected to the circuitry of substrate 1 via bonding wires. In other embodiments, chip 10 may be connected to substrate 1 in other feasible and reasonable ways.

[0029] Metal bridge 3 is located above chip 10. The metal pins 32 of metal bridge 3 are bonded to substrate 1 by adhesive layer 2. The bridge surface 31 of metal bridge 3 is broken in the middle to form two separate half-bridges, and the edges of the two broken half-bridges have a first distance W1.

[0030] The molding compound 5 fills the upper surface of the substrate 1, the periphery of the metal bridge 3, the entire chip 10, and the gap between the chip and the metal bridge. The molding compound 5 does not cover the bridge surface 31 of the metal bridge 3; the bridge surface 31 is exposed. Simultaneously, the height of the molding compound filling between the two disconnected bridge surfaces 31 is less than the height of the molding compound surrounding the metal bridge 3. This height difference is illustrated as H1.

[0031] The first component 20 is bonded to the bridge surface of the exposed metal bridge 3 via the adhesive layer 4. Because the height of the molding compound filling between the two disconnected bridge surfaces 31 is less than the height of the molding compound surrounding the metal bridge 3, a cavity exists between the lower surface of the first component 20 and the molding compound 5. The formation of this cavity effectively prevents leakage current caused by contamination at the bottom of the device.

[0032] Figure 4 The illustration shows yet another embodiment of the present invention. Figure 1 This is a schematic cross-sectional view of the stacked package structure 100 with metal bridges along the A-A' axis. Figure 3 Compared to the structure shown, in Figure 4 In the structure shown, the metal bridge 3 can be further reduced in size, allowing the edge of the chip 10 to be adjacent to or extend beyond the inner edge of the metal pin 32 (i.e., the inner edge of the metal pin 32 and the edge of the chip 10 overlap in the A-A' direction). This further reduces the overall device package size. In one embodiment, other passive components can also be placed on the substrate 1 at the same horizontal position as the chip 10 below the metal bridge 3 to further increase integration density.

[0033] Figure 5 The diagram shown is a cross-sectional schematic of a stacked package structure with metal bridges according to another embodiment of the present invention. It can be used to... Figure 3 or Figure 4 The schematic structure is formed by secondary injection molding. Figure 5 The structure shown is used to further enclose the first component 20 on the metal bridge 3.

[0034] In some other embodiments, at least two additional metal pins may be added to both sides of the metal bridge 3 to mount a second component. In one embodiment, the second component includes a resistor, capacitor, etc. Figure 6 A schematic diagram illustrating the structure of a stacked package structure 200 with metal bridges according to yet another embodiment of the present invention is shown. Figure 6 As shown, third components 40 are also installed on both sides of the metal bridge 3 and on the top surface of the molding compound 5. For a more detailed illustration, please refer to [link to diagram]. Figure 7 as shown Figure 6 Exploded view of structure 200.

[0035] like Figure 7As shown, the second metal pins 33 are located on both sides of the metal bridge 3, maintaining an independent state and not connected to the bridge surface 31 of the metal bridge 3. Figure 7 In the illustrated embodiment, the second metal pin 33 is also an "L"-shaped pin with a bottom end and a top end. The bottom end of the second metal pin 33 can be adhered to the substrate 1 using an adhesive. The top end area of ​​the second metal pin 33 is larger than the bottom end area, and the top end of the second metal pin 33 is exposed outside the molding compound 5 for mounting the third component 40. In one embodiment, each side of the metal bridge 3 includes two second metal pins 33.

[0036] Figures 8A to 8H A schematic flowchart of a packaging method for a stacked package structure with metal bridges according to an embodiment of the present disclosure is shown, particularly illustrating... Figure 5 The diagram shows a flow chart of a stacked package structure with metal bridges. Those skilled in the art should understand that... Figures 8A to 8H The cross-sectional schematic diagram only shows a portion of the process stages of the stacked package structure with metal bridges.

[0037] refer to Figure 8A As illustrated, an adhesive is brushed onto the prepared semiconductor frame or substrate 1 to form an adhesive layer 2. In one embodiment, the adhesive layer 2 includes solder paste.

[0038] Next, refer to Figure 8B Chip 10 is mounted on substrate 1.

[0039] Continue to refer to Figure 8C A complete metal bridge 3 is mounted above the chip. The first metal pin 32 of the metal bridge 3 is fixed to the substrate 1 by an adhesive layer 2. The bridge surface 31 and the first metal pin 32 of the metal bridge 3 are integrally formed. In one embodiment, the bridge surface 31 includes a first portion (edge ​​portion) and a second portion (middle portion), wherein the first portion has a first thickness and the second portion has a second thickness, and the first thickness is greater than the second thickness. Furthermore, the widths of the first portion and the second portion along the A-A' axis can be selected according to actual electrical isolation requirements.

[0040] Continue to refer to Figure 8D The molding compound 5 is formed by infusion through an auxiliary membrane. At the same time, it is ensured that the bridge surface 31 of the metal bridge 3 is exposed on the upper surface of the molding compound.

[0041] Continue to refer to Figure 8EThe second part of the metal bridge 3 is chemically etched, causing the bridge surface 31 to break in the middle, forming two half-bridge surfaces, thus isolating the circuits on both sides. The width of the second part of the bridge surface 31 along the A-A' axis (i.e., the distance between the two half-bridge surfaces) can be selected according to the actual circuit isolation requirements. Therefore, the difference between the height of the molding compound filling between the two broken bridge surfaces 31 and the height of the molding compound covering the outside of the metal bridge 3, H1, is the thickness of the second part of the bridge surface 31 of the metal bridge 3. In other embodiments, the second part of the bridge surface 31 can also be removed by chemical polishing.

[0042] Continue to refer to Figure 8F After etching bridge deck 31, adhesive is brushed onto the remaining first part to form adhesive layer 4.

[0043] Continue to refer to Figure 8G The first component 20 is attached to the first part of the bridge surface 31 through the adhesive layer 4.

[0044] Next reference Figure 8H ,exist Figure 8G A second injection molding process is performed on the prepared semiconductor structure to completely encapsulate the semiconductor device.

[0045] As described above, the stacked package structure with metal bridges and its fabrication method disclosed in this invention are standard designs, allowing a single copper bridge design to be applied to multiple modules. Simultaneously, the copper bridge thickness significantly reduces parasitic resistance, eliminates chip thickness limitations, and offers high manufacturing flexibility. Compared to embedded chip modules that require copper terminal components, this structure can use ordinary components, resulting in high process yield and relatively low losses. This stacked package structure with metal bridges can be manufactured in conventional packaging plants, effectively reducing costs and ensuring supply chain security.

[0046] While some embodiments of the present invention have been described in detail above, it should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Other possible alternative embodiments will be understood by those skilled in the art upon reading this disclosure.

Claims

1. A stacked packaging structure with metal bridges, characterized in that, The stacked packaging structure includes: A substrate having pre-arranged circuitry inside; The chip is mounted on the substrate; A metal bridge has a bridge surface and four first metal pins connected to the bridge surface. The four first metal pins are mounted on a substrate surrounding the chip, with the chip located directly below the bridge surface. The bridge surface of the metal bridge is broken in the middle to form two separate half-bridge surfaces, and each half-bridge surface is connected to two of the first metal pins. A molding compound is used to fill the upper surface of the substrate, the periphery of the metal bridge, the chip, and the gap between the chip and the metal bridge, exposing two separate half-bridge surfaces of the metal bridge, wherein the height of the molding compound filling between the two separate half-bridge surfaces is less than the height of the molding compound surrounding the metal bridge; and The first component is bonded to the two separate half-bridge surfaces.

2. The stacked packaging structure as described in claim 1, characterized in that, The stacked package structure further includes a second component mounted on a substrate under a metal bridge, the second component being adjacent to the chip.

3. The stacked packaging structure as described in claim 1, characterized in that, The metal bridge further includes at least two second metal pins, which are separated from the bridge surface of the metal bridge and located on the side of the bridge surface. The second metal pins include a top end and a bottom end, with the top end of the second metal pin exposed outside the molding compound and the bottom end of the second metal pin mounted on the substrate.

4. The stacked packaging structure as described in claim 3, characterized in that, The stacked package structure further includes a third component, which is bonded to the top of the second metal pin.

5. The stacked packaging structure as described in claim 1, characterized in that, The stacked packaging structure further includes an adhesive layer, through which the metal bridge is mounted on the substrate.

6. The stacked packaging structure as described in claim 1, characterized in that, There is a cavity between the top surface of the molding compound and the bottom surface of the first component.

7. A method for fabricating a stacked packaging structure with metal bridges, characterized in that, The manufacturing method includes: Mount the chip onto the substrate; A metal bridge is bonded to a substrate, wherein the metal bridge has a bridge surface and four first metal pins connected to the bridge surface, and the chip is located below the bridge surface of the metal bridge; The upper surface of the substrate, the periphery of the metal bridge, the chip, and the gap between the chip and the metal bridge are filled with molding compound, and the bridge surface of the metal bridge is exposed, wherein the height of the molding compound filling between the two separate half-bridge surfaces is less than the height of the molding compound wrapping the outside of the metal bridge. The bridge surface of the metal bridge is etched, and the bridge surface of the metal bridge is split in the middle to form two separate half-bridge surfaces; and The first component is attached to the two separate half-bridge surfaces.

8. The manufacturing method as described in claim 7, characterized in that, The bridge deck includes a first part and a second part, wherein the first part has a first thickness and the second part has a second thickness, and the first thickness is greater than the second thickness.

9. The manufacturing method as described in claim 8, characterized in that, The steps of etching the metal bridge deck and breaking the metal bridge deck in the middle to form two separate half-bridge decks include: etching away a second portion of the bridge deck to form two separate half-bridge decks.

10. The manufacturing method as described in claim 7, characterized in that, Further includes: The second component is mounted on the substrate, wherein both the second component and the chip are located below the metal bridge.

11. The manufacturing method as described in claim 7, characterized in that, The metal bridge further includes at least two second metal pins separate from the bridge surface, the second metal pins having a top end and a bottom end, and the step of bonding the metal bridge to the substrate includes: bonding the bottom ends of the first metal pin and the second metal pin of the metal bridge to the substrate.

12. The manufacturing method as described in claim 11, characterized in that, The step of exposing the bridge surface of the metal bridge includes: exposing the bridge surface of the metal bridge and the top of the second metal pin.

13. The manufacturing method as described in claim 12, characterized in that, The manufacturing method further includes attaching a third component to the top of the second metal pin.

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