antenna module

CN115764281BActive Publication Date: 2026-09-22AU OPTRONICS CORP
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Patent Information

Application Number
CN202211564340.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2022-08-18
Filing Date
2022-12-07
Publication Date
2026-09-22
Estimated Expiration
2042-12-07

AI Technical Summary

Technical Problem

然而,这种作法会让电磁波在传输时因基板材料不同而产生界面反射,且基板材料与贴合材料自身的介电损耗也会造成电磁波的能量损耗,导致天线模块整体的传输效率降低

Benefits of technology

[0006]基于上述,在本发明的一实施例的天线模块中,馈线与接地电极分别设置在介电常数不同的第一基板与第二基板上,且这两个基板是经由中介层相接合。通过中介层的介电常数小于这两个基板各自的介电常数,可使大部分的传递电磁波在中介层内传递;又因该中介层具有较低的介电损耗,可有效降低电磁波信号在这两基板间传递时的介电损耗,进而提升天线模块的天线效能。

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Abstract

An antenna module includes a first substrate, a second substrate, a third substrate, a feed line, a ground electrode, an antenna electrode, and an interposer. The second substrate is disposed overlapping the first substrate. A dielectric constant of the second substrate is different from a dielectric constant of the first substrate. The third substrate is disposed on a side of the second substrate facing away from the first substrate and overlapping the second substrate. The feed line is disposed on the first substrate. The ground electrode is disposed on the second substrate. The antenna electrode is disposed on the third substrate. The interposer is disposed between the first substrate and the second substrate. A dielectric constant of the interposer is less than or equal to a dielectric constant of each of the first substrate and the second substrate. A dielectric loss of the interposer is less than or equal to a dielectric loss of each of the first substrate and the second substrate.
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Description

Technical Field

[0001] This invention relates to an antenna module, and more particularly to an antenna module having a heterogeneous substrate. Background Technology

[0002] With the commercialization of fifth-generation mobile communication technology (5G), applications such as telemedicine, VR live streaming, 4K live streaming, and smart homes have all seen new development opportunities. Because 5G offers advantages such as high data rates, reduced latency, energy savings, lower costs, increased system capacity, and massive device connectivity, businesses from different sectors can also form cross-industry alliances to jointly build a new generation of 5G ecosystem.

[0003] Unlike traditional antenna modules that fabricate the signal feed line and radiating antenna on the same substrate (such as a low-dielectric-loss circuit board), a solution has been proposed to meet the needs of diverse applications by fabricating different components of the antenna structure on different substrates and then bonding them together. However, this approach causes interface reflections of electromagnetic waves during transmission due to the different substrate materials, and the dielectric losses of the substrate and bonding materials themselves also contribute to energy loss of the electromagnetic waves, resulting in a decrease in the overall transmission efficiency of the antenna module. This problem is more severe in large-size antenna arrays due to their longer transmission distances. Summary of the Invention

[0004] The purpose of this invention is to provide an antenna module having at least two heterogeneous substrates, which has better transmission efficiency of electromagnetic waves between the two heterogeneous substrates.

[0005] The antenna module of the present invention includes a first substrate, a second substrate, a third substrate, a feed line, a ground electrode, an antenna electrode, and an interposer. The second substrate overlaps the first substrate. The dielectric constant of the second substrate is different from that of the first substrate. The third substrate is disposed on the side of the second substrate opposite to the first substrate and overlaps the second substrate. The feed line is disposed on the first substrate. The ground electrode is disposed on the second substrate. The antenna electrode is disposed on the third substrate. The interposer is disposed between the first substrate and the second substrate. The dielectric constant of the interposer is less than or equal to the dielectric constants of the first substrate and the second substrate. The dielectric loss of the interposer is less than or equal to the dielectric loss of the first substrate and the second substrate.

[0006] Based on the above, in an antenna module according to an embodiment of the present invention, the feed line and the ground electrode are respectively disposed on a first substrate and a second substrate with different dielectric constants, and the two substrates are joined together via an interposer. Since the dielectric constant of the interposer is smaller than that of the two substrates, most of the transmitted electromagnetic waves can be transmitted within the interposer; and because the interposer has low dielectric loss, the dielectric loss of the electromagnetic wave signal when it is transmitted between the two substrates can be effectively reduced, thereby improving the antenna performance of the antenna module. Attached Figure Description

[0007] Figure 1 This is a cross-sectional schematic diagram of an antenna module according to a first embodiment of the present invention.

[0008] Figure 2 yes Figure 1 A schematic diagram of some of the membrane layers of the antenna module.

[0009] Figure 3 This is a cross-sectional schematic diagram of an antenna module according to a second embodiment of the present invention.

[0010] Figure 4 This is a cross-sectional schematic diagram of an antenna module according to a third embodiment of the present invention.

[0011] Figure 5 yes Figure 4 A schematic diagram of some of the membrane layers of the antenna module.

[0012] Figure 6 This is a cross-sectional schematic diagram of an antenna module according to the fourth embodiment of the present invention.

[0013] The attached figures are labeled as follows:

[0014] 10, 10A, 20, 20A: Antenna modules

[0015] 101: First substrate

[0016] 101s1, 101s2, 102s1, 102s2: Surface

[0017] 102: Second substrate

[0018] 103: Third substrate

[0019] 110, 110A: Feeder

[0020] 110fe: Feed-in end

[0021] 120: Grounding electrode

[0022] 120a: Open

[0023] 130: Antenna electrode

[0024] 150, 150A: Intermediate Layer

[0025] 160: Spacer

[0026] 180: Liquid Crystal Layer

[0027] AG: Air gap

[0028] S: Shortest spacing

[0029] t1, t2: thickness

[0030] W: Width Detailed Implementation

[0031] As used herein, “about,” “approximately,” “essentially,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or, for example, within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” “essentially,” or “substantially” herein may be chosen to select a more acceptable range of deviations or standard deviations depending on the nature of the measurement, the cutting nature, or other properties, and may not require a single standard deviation to apply to all properties.

[0032] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to a physical and / or electrical connection. Furthermore, an "electrical connection" may mean the presence of other elements between two elements.

[0033] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one figure is flipped, an element described as being “down” to another element will be oriented “up” to that element. Thus, the exemplary term “down” can include both “down” and “up” orientations, depending on the specific orientation of the figure. Similarly, if a device in one figure is flipped, an element described as being “below” or “under” another element will be oriented “above” that element. Thus, the exemplary terms “above” or “below” can include both “up” and “down” orientations.

[0034] This document describes exemplary embodiments with reference to cross-sectional views as schematic diagrams of idealized embodiments. Therefore, variations in the shape of the illustrations can be expected as a result of, for example, manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the patent.

[0035] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0036] Figure 1 This is a cross-sectional schematic diagram of an antenna module according to a first embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of some of the film layers of the antenna module. Please refer to... Figure 1 and Figure 2 The antenna module 10 includes a first substrate 101, a second substrate 102, a third substrate 103, a feed line 110, a ground electrode 120, and an antenna electrode 130. The first substrate 101, the second substrate 102, and the third substrate 103 are disposed overlapping each other. The third substrate 103 is disposed on the side of the second substrate 102 opposite to the first substrate 101. The feed line 110 is disposed on the first substrate 101. The ground electrode 120 is disposed on the second substrate 102. The antenna electrode 130 is disposed on the third substrate 103. For example, the antenna electrode 130 is a patch antenna, and the side of the third substrate 103 opposite to the antenna electrode 130 serves as both the receiving and radiating side for electromagnetic waves (e.g., millimeter waves).

[0037] In this embodiment, the number of feed lines 110 and antenna electrodes 130 can each be multiple, and these antenna electrodes 130 can be arranged into an antenna array, such as an 8×8 antenna array. Correspondingly, the feed lines 110 can be extended into an 8×8 feed line array (e.g., Figure 2 (As shown). More specifically, the feed line 110 in this embodiment may have 64 feed terminals 110fe, and these feed terminals 110fe are respectively arranged overlapping 64 antenna electrodes 130. However, the present invention is not limited thereto. In other embodiments, the number of antenna electrodes 130 and feed terminals 110fe can be adjusted according to actual needs. On the other hand, the ground electrode 120 disposed on the second substrate 102 and the feed line 110 disposed on the first substrate 101 can serve as a transmission structure for electromagnetic wave signals.

[0038] It should be noted that the dielectric constant of the first substrate 101 is different from that of the second substrate 102. That is, the first substrate 101 and the second substrate 102 are made of different materials. For example, the first substrate 101 can be a low dielectric loss substrate (e.g., a Rogers substrate), while the second substrate 102 and the third substrate 103 can be glass substrates or polymer substrates (e.g., polymethyl methacrylate, polycarbonate, polyimide, etc.), but are not limited thereto.

[0039] To bond the first substrate 101 and the second substrate 102, the antenna module 10 further includes an interposer 150 disposed between the first substrate 101 and the second substrate 102. For example, the first substrate 101 has opposing surfaces 101s1 and 101s2, and the second substrate 102 has opposing surfaces 102s1 and 102s2, while the interposer 150 connects the surface 101s2 of the first substrate 101 and the surface 102s1 of the second substrate 102. Preferably, the thickness t1 of the interposer 150 along the normal direction of the surface 101s2 of the first substrate 101 is greater than or equal to 10 micrometers.

[0040] In this embodiment, the feed line 110 is disposed on the surface 101s1 of the first substrate 101 facing away from the second substrate 102, while the ground electrode 120 is disposed on the surface 102s2 of the second substrate 102 facing away from the first substrate 101. That is, in this embodiment, the first substrate 101 and the second substrate 102 are located between the feed line 110 and the ground electrode 120. It is particularly noteworthy that, in order to reduce the dielectric loss when electromagnetic waves propagate between the feed line 110 and the ground electrode 120, the dielectric constant of the interposer 150 is less than the dielectric constants of the first substrate 101 and the second substrate 102. Preferably, the dielectric loss of the interposer 150 is less than or equal to the dielectric loss of the first substrate 101 and the second substrate 102, but this is not a limitation.

[0041] Furthermore, the antenna module 10 may also include a liquid crystal layer 180 disposed between the second substrate 102 and the third substrate 103, and a ground electrode 120 located between the antenna electrode 130 and the feed line 110 may have an opening 120a. The antenna electrode 130, the feed line 110, and the interposer 150 overlap the opening 120a of the ground electrode 120. The electromagnetic wave signal transmitted between the feed line 110 and the ground electrode 120 and transmitted to the feed end 110fe of the feed line 110 can be coupled to the antenna electrode 130 and radiated out through the opening 120a of the ground electrode 120. For example, the liquid crystal layer 180 may change the arrangement state of its liquid crystal molecules (not shown) under the action of the electric field generated between the antenna electrode 130 and the ground electrode 120, and this change in arrangement state will change the dielectric constant of the liquid crystal layer 180, thereby modulating the frequency and phase of the electromagnetic wave radiated by the antenna module 10.

[0042] Other embodiments will be listed below to illustrate this disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and they will not be repeated below.

[0043] Figure 3 This is a cross-sectional schematic diagram of an antenna module according to a second embodiment of the present invention. Please refer to... Figure 3 In this embodiment, the antenna module 10A and Figure 1 The difference between the antenna module 10 and the other is the location of the feed line. Specifically, the feed line 110A of the antenna module 10A is disposed on the surface 101s2 of the first substrate 101 facing the second substrate 102. That is, only the second substrate 102 is provided between the feed line 110A and the ground electrode 120. Accordingly, the dielectric loss of electromagnetic wave signals during transmission between the feed line 110A and the ground electrode 120 can be further reduced, which helps to improve the antenna performance of the antenna module 10A.

[0044] Figure 4 This is a cross-sectional schematic diagram of an antenna module according to a third embodiment of the present invention. Figure 5 yes Figure 4 A schematic diagram of some of the film layers of the antenna module. Please refer to... Figure 4 and Figure 5 In this embodiment, the antenna module 20 and Figure 1 The difference between the antenna module 10 and the other one lies in the configuration of the interposer layer. Specifically, an air gap AG may be provided between the first substrate 101 and the second substrate 102 of the antenna module 20, and the interposer layer 150A surrounds the air gap AG. Preferably, the thickness t2 of the air gap AG along the normal direction of the surface 101s2 of the first substrate 101 is greater than or equal to 10 micrometers.

[0045] In this embodiment, the feed line 110 is located on the surface 101s1 of the first substrate 101 facing away from the air gap AG, while the ground electrode 120 is located on the surface 102s2 of the second substrate 102 facing away from the air gap AG. By setting this air gap AG, the dielectric loss of electromagnetic wave signals when transmitted between the first substrate 101 and the second substrate 102 can be effectively reduced.

[0046] Figure 6 This is a cross-sectional schematic diagram of an antenna module according to a fourth embodiment of the present invention. Please refer to... Figure 6 In this embodiment, the antenna module 20A and Figure 4 The main difference between the antenna module 20 and the previous one lies in the location of the feed line. Specifically, the feed line 110A of the antenna module 20A is located on the surface 101s2 of the first substrate 101 facing the second substrate 102, and the feed line 110A is exposed through the air gap AG. That is, only the second substrate 102 is located between the feed line 110A and the ground electrode 120. Therefore, compared to... Figure 6 For the antenna module 20, the dielectric loss of electromagnetic wave signals during transmission between the feed line 110A and the ground electrode 120 can be further reduced, which helps to improve the antenna performance of the antenna module 20A.

[0047] On the other hand, in this embodiment, to ensure the uniformity of the thickness of the air gap AG, the antenna module 20A may also selectively include a plurality of spacers 160, which are dispersedly disposed within the air gap AG. It is particularly noteworthy that the shortest distance S between each of these spacers 160 and the feed line 110A is greater than the width W of the feed line 110A (e.g., the width perpendicular to the extension direction of the feed line 110A), to avoid dielectric loss caused by the placement of these spacers 160 when electromagnetic wave signals are transmitted between the ground electrode 120 and the feed line 110A.

[0048] In summary, in an embodiment of the antenna module of the present invention, the feed line and the ground electrode are respectively disposed on a first substrate and a second substrate with different dielectric constants, and the two substrates are bonded together via an interposer. Since the dielectric constant of the interposer is lower than that of the two substrates, most of the transmitted electromagnetic waves can be transmitted within the interposer; furthermore, because the interposer has low dielectric loss, the dielectric loss of the electromagnetic wave signal during transmission between the two substrates can be effectively reduced, thereby improving the antenna performance of the antenna module.

Claims

1. An antenna module, comprising: First substrate; A second substrate is disposed overlapping the first substrate, wherein the dielectric constant of the second substrate is different from that of the first substrate; A third substrate is disposed on the side of the second substrate opposite to the first substrate and overlaps the second substrate; A feeder line is disposed on the first substrate; A grounding electrode is disposed on the surface of the second substrate opposite to the first substrate; An antenna electrode is disposed on the third substrate; as well as An interposer layer is disposed between the first substrate and the second substrate. The dielectric constant of the interposer layer is less than or equal to the dielectric constants of the first substrate and the second substrate, and the dielectric loss of the interposer layer is less than or equal to the dielectric loss of the first substrate and the second substrate.

2. The antenna module of claim 1, wherein at least one of the first substrate and the second substrate is located between the feed line and the ground electrode.

3. The antenna module of claim 1, wherein the thickness of the interposer layer is greater than or equal to 10 micrometers.

4. The antenna module as described in claim 1, further comprising: An air gap is disposed between the first substrate and the second substrate, and the interlayer surrounds the air gap.

5. The antenna module of claim 4, wherein the air gap exposes the feed line and the ground electrode is located on the side surface of the second substrate opposite to the air gap.

6. The antenna module of claim 4, wherein the feed line is located on the side surface of the first substrate opposite to the air gap, and the ground electrode is located on the side surface of the second substrate opposite to the air gap.

7. The antenna module as described in claim 4, further comprising: Multiple gap materials are dispersedly disposed within the air gap.

8. The antenna module of claim 7, wherein the shortest distance between each of the plurality of spacers and the feed line is greater than a width of the feed line.

9. The antenna module as claimed in claim 1, wherein a liquid crystal layer is provided between the second substrate and the third substrate, the ground electrode is located between the antenna electrode and the feed line and has an opening, and the antenna electrode, the feed line and the interlayer overlap the opening.