FPC mounting module, electronic device and mounting method

Abstract

The application provides an FPC mounting module, an electronic device and a mounting method. The FPC mounting module comprises a mounting portion and an FPC. The mounting portion is provided with a mounting hole. The FPC is arranged in the mounting hole and has a gap between the FPC and the inner wall surface of the mounting hole. The first surface of the FPC is glued to the first wall surface of the mounting hole through a first glue joint. The gap is filled with flowable glue to form a second glue joint. The FPC is sealed and fixed in the mounting hole through the second glue joint. The application can prevent water from entering the electronic device through the gap between the mounting hole and the FPC, thereby corroding the electronic device and causing damage. Compared with the traditional FPC mounting scheme, the flowable glue can better fill and seal narrow and special-shaped gaps. Therefore, the application can match mounting holes of different shapes, so that the FPC can be applied to more installation scenarios.

Description

Technical Field

[0001] This application relates to the field of waterproofing electronic devices, and in particular to an FPC mounting module, electronic device, and mounting method. Background Technology

[0002] With the continuous upgrading of electronic devices, their waterproof performance has become an increasingly important concern. Since electronic devices often have openings or gaps in their casings, these openings or gaps pose a significant risk of water ingress. For example, there are assembly gaps between the buttons and the casing of electronic devices. Furthermore, for some foldable electronic devices, which often require a hinge to rotate or bend the devices on both sides of the hinge, safety gaps are needed between the devices on both sides of the hinge and between the devices and the hinge to allow for the rotation space required for bending.

[0003] Therefore, water can enter the electronic device through the various gaps mentioned above, which may corrode the internal components and damage the device.

[0004] It is evident that existing electronic devices have a significant risk of water ingress and poor waterproofing performance. Summary of the Invention

[0005] The purpose of this application is to address the significant water ingress risks and poor waterproofing performance of existing electronic devices. Therefore, this application provides an FPC mounting module, an electronic device, and an installation method, which improves the waterproofing performance of the electronic device and helps make FPC suitable for more installation scenarios.

[0006] This application provides an FPC mounting module, including a mounting part and an FPC. The mounting part has a mounting hole, the FPC passes through the mounting hole, and there is a gap between the FPC and the inner wall surface of the mounting hole.

[0007] The first surface of the FPC is bonded to the first wall of the mounting hole via a first adhesive portion.

[0008] The gap is filled with a flowable adhesive to form a second adhesive portion, through which the FPC is sealed and fixed in the mounting hole.

[0009] In the embodiments of this application, the first adhesive portion enables the first surface of the FPC to fit tightly against the first wall of the mounting hole, thereby ensuring a sealing effect between the FPC and the first wall of the mounting hole. Furthermore, the second adhesive portion formed by the flowing adhesive fills the gap between the FPC and the mounting hole, sealing and fixing the FPC inside the mounting hole, and forming a closed sealing structure around the FPC, thereby preventing water from entering the interior of the electronic device through the gap between the mounting hole and the FPC and corroding the electronic device, causing damage. Furthermore, compared with traditional FPC installation schemes, because the flowing adhesive has a certain fluidity, it can better fill and seal the narrow and irregular gaps inside the electronic device. Therefore, this embodiment can match mounting holes of different shapes, which helps to make the FPC suitable for more installation scenarios.

[0010] In some embodiments, the FPC mounting module further includes a bracket and a third adhesive portion. The bracket is bonded to the second surface of the FPC through the third adhesive portion. The second surface of the FPC is opposite to the first surface. The bracket is pressed between the third adhesive portion and the second wall of the mounting hole. The second wall of the mounting hole is opposite to the first wall. The FPC, the first adhesive portion, the bracket, and the third adhesive portion are all sealed and fixed in the mounting hole through the second adhesive portion.

[0011] The embodiments of this application can reduce the distance between the second surface of the FPC and the second wall of the mounting hole by using the bracket and the third adhesive part, thereby reducing the amount of flowing adhesive filling, which helps to avoid the phenomenon of flowing adhesive overflowing the mounting hole when the amount of flowing adhesive filling is large during the processing.

[0012] In some possible embodiments, the FPC mounting module further includes foam adhesive, which is fixed between the second surface of the FPC and the second wall of the mounting hole. The FPC, the first adhesive portion, and the foam adhesive are all sealed and fixed in the mounting hole by the second adhesive portion.

[0013] In this embodiment, foam adhesive can replace the bracket and the third adhesive part to reduce the gap between the second surface of the FPC and the second wall of the mounting hole, thereby reducing the amount of flowing adhesive. This helps to avoid the phenomenon of flowing adhesive overflowing the mounting hole when the amount of flowing adhesive is large during processing. Furthermore, since foam adhesive itself has an adhesive effect and a certain thickness, the installation structure is simpler, thereby simplifying the installation steps.

[0014] In some embodiments, along the width direction of the FPC, the FPC is located between two opposing side edges of the first adhesive portion, the third adhesive portion is located between two opposing side edges of the FPC, and the bracket is located between two opposing side edges of the third adhesive portion.

[0015] In some possible embodiments, the cross-sections of the integral structure formed by the first adhesive portion, the FPC, the third adhesive portion, and the support are stepped on both sides along the width direction of the FPC.

[0016] The embodiments of this application utilize the above-described structure, which helps to avoid the phenomenon that some gaps are not filled due to poor flowability of the adhesive during processing.

[0017] In some embodiments, both the first adhesive portion and the third adhesive portion are double-sided adhesive.

[0018] In some embodiments, the cross-sectional shape of the mounting hole is trapezoidal.

[0019] This application also provides an electronic device, including the FPC mounting module involved in the above embodiments.

[0020] In some possible embodiments, the electronic device has a button, and the side frame of the electronic device, which is disposed opposite to the button, and the back cover of the electronic device constitute a mounting part. The side frame of the electronic device is provided with a mounting groove, and the mounting groove and the back cover of the electronic device enclose a mounting hole.

[0021] In some embodiments, the electronic device is a foldable electronic device, which includes a first device body, a second device body, and a pivot, wherein the first device body and the second device body are rotatably connected by the pivot.

[0022] The main body of the first device has a middle frame and a rear cover. The side frame of the middle frame near the rotating shaft and the rear cover constitute a mounting part. The side frame of the middle frame is provided with a mounting groove, and the mounting groove and the rear cover together form a mounting hole.

[0023] In some embodiments, the electronic device is a foldable electronic device, which includes a first device body, a second device body, and a pivot, wherein the first device body and the second device body are rotatably connected by the pivot.

[0024] The FPC mounting module has multiple modules, including a first FPC mounting module and a second FPC mounting module. The side frame near the pivot of the middle frame of the first device body and the rear cover of the first device body constitute the mounting part of the first FPC mounting module. The side frame of the first device body is provided with a first mounting groove. The first mounting groove and the rear cover together form the mounting hole of the first FPC mounting module.

[0025] The electronic device has buttons. The side frame of the electronic device, which is opposite to the buttons, and the back cover of the electronic device constitute the mounting part of the second FPC mounting module. The side frame of the electronic device, which is opposite to the buttons, is provided with a second mounting groove. The second mounting groove and the back cover of the electronic device enclose and form the mounting hole of the second FPC mounting module.

[0026] The embodiments of this application can effectively prevent water ingress at the hinge and button areas of foldable electronic devices.

[0027] This application also provides an installation method for the FPC mounting module involved in the above embodiments, including: bonding the first surface of the FPC to the first wall surface of the mounting hole through a first adhesive portion.

[0028] The flowable adhesive is filled into the gap to form a second adhesive portion, thereby sealing the gap.

[0029] In some embodiments, before filling the gap with the flowing adhesive and forming a second adhesive portion to seal the gap, the method further includes: securing the bracket to the second surface of the FPC via a third adhesive portion to press the bracket between the FPC and the second wall surface of the mounting hole. Attached Figure Description

[0030] Figure 1a This is a cross-sectional view of the FPC mounting module along the width direction of the FPC in one embodiment of this application, wherein the mounting part is a split structure;

[0031] Figure 1b This is a cross-sectional view of the FPC mounting module along the width direction of the FPC in one embodiment of this application, wherein the mounting part is an integral structure;

[0032] Figure 1c This is a cross-sectional view of an FPC mounting module in one embodiment of this application, showing that the module is not filled with flowing adhesive along the width of the FPC, and the mounting part is a split structure.

[0033] Figure 2 This is a partial top view of the FPC mounting module in one embodiment of this application when it is not filled with flowable adhesive;

[0034] Figure 3 for Figure 2 A partially enlarged structural diagram;

[0035] Figure 4 This is a top view of the first adhesive portion and the FPC in an embodiment of the present application.

[0036] Figure 5 This is a schematic diagram of the structure of an FPC mounting module located near the pivot in an electronic device according to an embodiment of this application;

[0037] Figure 6a This is a three-dimensional cross-sectional view of the FPC mounting module in an electronic device along the length of the FPC in one embodiment of this application.

[0038] Figure 6bThis is a cross-sectional view of an FPC mounting module in an electronic device along the length of the FPC, according to one embodiment of this application.

[0039] Figure 6c This is a three-dimensional side view of the FPC mounting module located near the pivot of an electronic device in one embodiment of this application.

[0040] Figure 6d This is a three-dimensional structural diagram of an FPC mounting module located near the junction of an electronic device in one embodiment of this application.

[0041] Figure 7a This is a three-dimensional structural diagram of the FPC mounting module located at the button in an electronic device in one embodiment of the present application when it is not filled with flowable adhesive;

[0042] Figure 7b This is a top view of the FPC mounting module located at the button in an electronic device in one embodiment of the present application, when no flowable adhesive is filled;

[0043] Figure 8 This is a schematic diagram of the internal structure of an electronic device according to an embodiment of this application;

[0044] Figure 9 This is a schematic flowchart of an installation method for an FPC mounting module according to an embodiment of this application;

[0045] Figure 10 This is a flowchart illustrating the installation method of the FPC mounting module in one embodiment of this application. Figure 2 .

[0046] Explanation of reference numerals in the attached figures:

[0047] 1: FPC mounting module;

[0048] 10: FPC; 101: First surface; 102: Second surface;

[0049] 11: Installation Department;

[0050] 12: Mounting hole; 121: Gap; 122: First wall surface; 123: Second wall surface; 124: Third wall surface; 125: Fourth wall surface; 13: Second adhesive part; 14: Bracket; 15: Third adhesive part; 16: First adhesive part;

[0051] 1A: FPC mounting module;

[0052] 10A: FPC;

[0053] 11A: Installation Department;

[0054] 120A: Mounting groove; 121A: Gap; 122A: First wall surface; 123A: Second wall surface; 13A: Second adhesive part; 14A: Bracket; 15A: Third adhesive part; 16A: First adhesive part;

[0055] 1B: FPC mounting module;

[0056] 10B: FPC;

[0057] 120B: Mounting groove; 121B: Gap; 122B: First wall surface; 13B: Second adhesive part; 14B: Bracket; 141B: Recess; 15B: Third adhesive part; 16B: First adhesive part;

[0058] 2: Electronic devices;

[0059] 20: Gap; 21: First equipment body; 211: Middle frame; 2111: Side frame; 2112: Side frame; 212: Back cover; 2121: Adhesive line; 22: Second equipment body; 221: Middle frame; 23: Shaft. Detailed Implementation

[0060] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0061] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0062] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0063] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0064] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0065] Please see Figures 1a to 1c , Figure 1a This is a cross-sectional view of the FPC mounting module along the width of the FPC in one embodiment of this application, wherein the mounting part is a split structure. Figure 1b This is a cross-sectional view of the FPC mounting module along the width direction of the FPC in one embodiment of this application, wherein the mounting part is an integral structure. Figure 1c This is a cross-sectional view of an FPC mounting module without the flowable adhesive along the width direction of the FPC in one embodiment of this application.

[0066] Please see Figure 1a The FPC mounting module 1 provided in this application includes a mounting part 11 and an FPC (Flexible Printed Circuit) 10. The mounting part 11 is provided with a mounting hole 12, the FPC 10 passes through the mounting hole 12, and there is a gap 121 between the FPC 10 and the inner wall surface of the mounting hole 12 (e.g., Figure 1c (As shown).

[0067] Specifically, the inner wall surface of the mounting hole 12 includes a first wall surface 122 and a second wall surface 123 arranged opposite to each other, and a third wall surface 124 and a fourth wall surface 125 arranged opposite to each other. The third wall surface 124, the first wall surface 122, the second wall surface 123 and the fourth wall surface 125 are connected in sequence to form the mounting hole 12.

[0068] Among them, the gap 121 between FPC10 and the inner wall surface of mounting hole 12 (e.g.) Figure 1c (As shown) can be a safety space created to facilitate assembly, or a safety space designed to meet other requirements.

[0069] Along the width direction W of the FPC, the shape of the cross-section of the mounting hole 12 is not limited; it can be rectangular, such as a square or rectangle, or it can be trapezoidal (e.g., ...). Figure 1a (As shown in the diagram), it can also be an irregular shape. Or it can be understood that the third wall surface 124 and the fourth wall surface 125 of the mounting hole 12 can be perpendicular to the first wall surface 122, or they can be not perpendicular to the first wall surface 122. The third wall surface 124 and the fourth wall surface 125 can be, for example, inclined surfaces, or curved surfaces, etc.

[0070] For some implementation methods, please refer to Figure 1a The mounting hole 12 can be formed by different structural components within the electronic device, or it can be understood that the mounting portion 11 is a separate structure. Specifically, for example, the mounting hole 12 can be formed by the back cover and the mid-frame of the electronic device. Furthermore, the first wall surface 122 of the mounting hole 12 can be part of the mid-frame, and the second wall surface 123 of the mounting hole 12 can be formed by the surface of the back cover of the electronic device near the mid-frame. Specifically, taking a mobile phone as an example, the back cover can be the battery cover of the mobile phone. For other embodiments, please refer to... Figure 1b The mounting hole 12 can be located on the middle frame of the electronic device. Therefore, the first wall surface 122, the second wall surface 123, the third wall surface 124, and the fourth wall surface 125 of the mounting hole 12 are all part of the middle frame, or it can be understood that the mounting part 11 is an integral structure, for example, it can be formed by directly opening a hole in the middle frame.

[0071] The first surface 101 of the FPC10 is bonded to the first wall surface 122 of the mounting hole 12 via the first adhesive portion 16 (e.g., ...). Figure 1a As shown), the gap is filled with flowing adhesive to form a second adhesive part 13, and the FPC is sealed and fixed in the mounting hole 12 through the second adhesive part 13.

[0072] The first adhesive portion 16 can be, for example, double-sided adhesive, adhesive backing, foam adhesive, etc., or it can be an adhesive portion formed by filling the first surface 101 of the FPC and the first wall surface 122 of the mounting hole with flowing adhesive through a dispensing process and then curing it. As long as the FPC can be glued to the mounting hole 12, it does not deviate from the scope of this embodiment. In addition, the thickness of the first adhesive portion 16 is not limited and can be selected according to the size of the mounting hole 12, for example, it can be 0.1mm-0.5mm, etc.

[0073] Furthermore, the first adhesive portion 16 may be a portion of the wall surface of the first wall surface 122 of the mounting hole 12, or it may be the entire wall surface of the first wall surface 122 of the mounting hole 12.

[0074] Flowable adhesives can be understood as adhesives with a certain viscosity and fluidity that can gradually form a bond between the bonded objects over time, such as silicone, UV adhesives, hot melt adhesives, etc. The type of adhesive is not limited; any flowable adhesive that has a certain fluidity and can be cured by heating, natural standing, or UV irradiation is within the scope of this application.

[0075] In one example of installation, a portion of the flowing adhesive is filled between the first surface 101 of the FPC 10 and the first wall surface 122 of the mounting hole 12 using a dispensing process to form a first adhesive portion. Then, another portion of the flowing adhesive is filled into the gap 121 using a dispensing process to form a second adhesive portion, thereby fixing and sealing the FPC into the mounting hole 12. The first and second adhesive portions can be formed separately using a dispensing process, or they can be formed by dispensing the adhesive together in one go within the mounting hole. During the dispensing process, the first adhesive portion 16 is first formed between the first wall surface 122 of the mounting hole and the first surface 101 of the FPC, and then the second adhesive portion 13 is formed at the gap.

[0076] It should be understood that the FPC mounting module 1 of this application can be applied to any scenario where FPCs are assembled and water ingress at the FPC mounting point is required. For example, it can be applied to FPCs at the button positions in electronic devices, or to FPCs that need to be bent in foldable electronic devices. The type of electronic device is not limited; it can be, for example, smart electronic devices such as mobile phones, smartwatches, and smart home devices, or other electronic devices such as remote controls and wearable devices. Furthermore, the type of button is not limited; it can be, for example, a fingerprint button, a lock screen button, or a control button.

[0077] In this application, the first adhesive portion 16 enables the first surface 101 of the FPC10 to fit tightly against the first wall surface 122 of the mounting hole 12, thereby ensuring the sealing effect between the FPC10 and the first wall surface 122 of the mounting hole 12. Furthermore, the second adhesive portion 13 formed by the flowing adhesive fills the gap 121 between the FPC10 and the mounting hole 12, sealing and fixing the FPC10 in the mounting hole 12, and forming a closed sealing structure around the FPC10, thereby preventing water from entering the interior of the electronic device through the gap 121 between the mounting hole 12 and the FPC10 and corroding the electronic device, causing damage. Furthermore, compared with the traditional FPC installation scheme, since the flowing adhesive has a certain fluidity, it can better fill and seal the narrow and irregular gaps inside the electronic device. Therefore, this embodiment can match mounting holes of different shapes, which helps to make the FPC10 suitable for more installation scenarios.

[0078] For further details, please see Figure 1a , Figure 1b The FPC mounting module 1 also includes a bracket 14 and a third adhesive portion 15. The bracket 14 is bonded to the second surface 102 of the FPC via the third adhesive portion 15, and the second surface 102 of the FPC faces away from the first surface 101. The bracket 14 is pressed between the third adhesive portion 15 and the second wall surface 123 of the mounting hole 12, and the second wall surface 123 of the mounting hole 12 is opposite to the first wall surface 122. The FPC 10, the first adhesive portion 16, the bracket 14, and the third adhesive portion 15 are all sealed and fixed in the mounting hole 12 by the second adhesive portion 13 formed by the flowable adhesive.

[0079] The third adhesive portion 15 can be, for example, double-sided adhesive, adhesive backing, etc., as long as it can bond the FPC to the bracket 14, it does not deviate from the scope of this embodiment. The thickness of the third adhesive portion 15 is not limited and can be selected according to the distance between the FPC and the second wall of the mounting hole, for example, it can be 0.1mm-0.5mm, etc.

[0080] In alternative embodiments, the bracket 14 and the third adhesive portion 15 can be entirely replaced with foam adhesive, which is applied to the second surface 102 of the FPC near the surface of the FPC and pressed between the FPC and the second wall surface 123 of the mounting hole 12.

[0081] This embodiment of the application can reduce the distance between the second surface 102 of the FPC and the second wall surface 123 of the mounting hole by using the bracket 14 and the third adhesive portion 15, thereby reducing the amount of flowing adhesive filling. This helps to avoid the phenomenon of flowing adhesive overflowing the mounting hole when the amount of flowing adhesive filling is large during the processing. In addition, since the bracket 14 is pressed onto the surface of the FPC, it can prevent the FPC from arching and deforming when it is bent in application scenarios that require bending (such as foldable electronic devices).

[0082] For further details, please see Figures 2-4 and combined Figure 1a understand, Figure 2 This is a partial top view of the FPC mounting module in one embodiment of this application when it is not filled with flowable adhesive. Figure 3 for Figure 2 A partially enlarged structural diagram. Figure 4 This is a top view of the first adhesive portion and the FPC in an embodiment of the present application.

[0083] Along the width direction W of FPC10 (as shown by the arrow in the figure), FPC10 is located between the two opposite side edges of the first adhesive portion 16, and the third adhesive portion 15 is located between the two opposite side edges of FPC10, as shown in the figure. Figure 1a As shown, the bracket 14 is located between the two opposite side edges of the third adhesive portion 15. Alternatively, it can be understood that: along the width direction W of the FPC (as shown by the arrow in the figure), the cross-section of the overall structure formed by the first adhesive portion 16, FPC 10, third adhesive portion 15, and bracket 14 is stepped on both sides. It can also be understood that: the first adhesive portion 16, FPC 10, third adhesive portion 15, and bracket 14 gradually shrink inward, and the cross-section of the overall structure formed is similar to a "pyramid".

[0084] In another embodiment, along the width direction W of the FPC10, the bracket 14 may have only a portion of its two side edges located between the two side edges of the third adhesive portion 15, while the remaining edge portions of the bracket 14 may be flush with the two side edges of the third adhesive portion 15. In one embodiment, along the width direction W of the FPC10, the two side edges of the bracket are flush with the two side edges of the third adhesive portion, and each side edge of the bracket is provided with a recess 141B (see details). Figure 7a (Shown bracket 14B).

[0085] Along the thickness direction of the FPC (or can be understood as the depth direction of the mounting hole), the closer to the first wall surface 122 of the mounting hole 11, the smaller the gap that the flowable adhesive needs to fill. However, the flowability of the flowable adhesive usually decreases over time. Therefore, the above structure adopted in this application embodiment can help avoid the phenomenon that some gaps are not filled due to the poor flowability of the flowable adhesive during the processing.

[0086] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure of an FPC mounting module located near the hinge in an electronic device according to one embodiment of this application. Figure 5As shown, this application provides an electronic device including an FPC mounting module 1A, which can adopt the structure of the FPC mounting module 1 described in the various embodiments of the above-described examples.

[0087] Specifically, the electronic device is a foldable electronic device, comprising a first device body 21, a second device body 22, and a pivot 23. The first device body 21 and the second device body 22 are rotatably connected via the pivot 23. The first device body 21 has a middle frame 211 and a back cover 212, and the second device body 22 also has a middle frame 221 and a back cover (not shown in the figure). During the use of this foldable electronic device, since both the first device body 21 and the second device body 22 can rotate around the pivot 23, a gap 20 is provided between the middle frame 211 of the first device body 21 and the middle frame 221 of the second device body 22 to allow rotation between the devices. The FPC 10A is inserted through the middle frame of the foldable electronic device. Specifically, the FPC 10A can, for example, be inserted through the side frame 2111 of the middle frame 211 of the first device body 21. Water can enter the interior of the electronic device along the gap 20 and flow along... Figure 5 The path indicated by the middle arrow flows to the vicinity of the mounting hole in the mounting section 11A.

[0088] The FPC10A is used to electrically connect the electronic units of the first device body 21 and the electronic units of the second device body 22. Taking a mobile phone as an example, the first device body 21 may contain a motherboard and a camera, while the second device body 22 may contain a USB interface, a power supply, etc. The FPC10A is disposed between the first device body 21 and the second device body 22 to achieve electrical connection between the motherboard and the USB interface, camera, power supply, etc. In other alternative embodiments, the camera and motherboard may be located on different device bodies. Furthermore, the above-described electronic units are merely illustrative; in actual implementation, other electronic units may also be used.

[0089] Please see Figures 6a-6d , Figure 6a This is a three-dimensional cross-sectional view of the FPC mounting module in an electronic device along the length of the FPC in one embodiment of this application. Figure 6b This is a cross-sectional view of an FPC mounting module in an electronic device along the length of the FPC, according to one embodiment of this application. Figure 6c This is a three-dimensional side view of the FPC mounting module located near the pivot of an electronic device in one embodiment of this application. Figure 6d This is a three-dimensional structural diagram of the FPC mounting module located near the water inlet of an electronic device according to one embodiment of this application; the water inlet path of the electronic device can be referenced. Figure 6a As indicated by the middle arrow.

[0090] like Figures 5-6dAs shown, the side frame 2111 near the pivot 23 and the back cover 212 of the middle frame 211 constitute the mounting part 11A of the FPC mounting module 1A. Specifically, the side frame 2111 near the pivot 23 of the middle frame 211 is provided with a mounting groove 120A. The mounting groove 120A and the back cover 212 enclose each other to form a mounting hole. The bottom surface of the mounting groove 120A constitutes the first wall surface 122A of the mounting hole, and the surface of the back cover 212 near the mounting groove 120A constitutes the second wall surface 123A of the mounting hole. The back cover 212 may include an adhesive backing line 2121, and the back cover 212 is glued to the side frame 2111 of the middle frame 211 by the adhesive backing line 2121.

[0091] For further details, please see Figure 7a and 7b , Figure 7a This is a three-dimensional structural diagram of the FPC mounting module located at the button in an electronic device according to one embodiment of this application, when it is not filled with flowable adhesive. Figure 7b This is a top view of the FPC mounting module located at the button in an electronic device according to one embodiment of this application, when it is not filled with flowable adhesive. Figure 7a and Figure 7b As shown, the foldable electronic device provided in this embodiment also includes an FPC mounting module 1B disposed at the button. This FPC mounting module 1B can adopt the structure of the FPC mounting module 1 described in the various embodiments above. The foldable electronic device has a button (not shown in the figure). During use, because there is an assembly gap (not shown in the figure) between the button and the outer casing of the electronic device, water can enter through this assembly gap and flow along... Figure 7b The path indicated by the dashed arrow flows from the M side to the N side of the mid-frame, and then flows to the vicinity of the mounting hole on the side frame 2112 opposite to the button. Here, FPC10B can be an FPC used to electrically connect the button contacts to the motherboard of an electronic device.

[0092] Specifically, the side frame 2112 and the rear cover (not shown) opposite to the button in the middle frame 211 of the first device body 21 constitute the mounting part of the FPC mounting module 1B. The side frame 2112 of the middle frame 211 is provided with a mounting groove 120B, and the mounting groove 120B and the rear cover (not shown) enclose to form a mounting hole. After the FPC 10B passes through the mounting hole, a gap 121B is formed between it and the inner wall of the mounting hole. The flowable adhesive is filled into the gap 121B by a dispensing process and cured to form a second adhesive part.

[0093] Those skilled in the art will understand that the FPC mounting module 1B can be applied to the button area in any electronic device. Specifically, it can be applied to the button area of ​​foldable electronic devices as well as the button area of ​​non-foldable electronic devices. It should be noted that when the FPC mounting module 1B is applied to the button area of ​​a non-foldable electronic device, the mounting portion of the FPC mounting module 1B can be formed by the side frame and the back cover of the electronic device's middle frame, which are disposed opposite to the button.

[0094] For further details, please refer to... Figure 8 , Figure 8 This is a schematic diagram of the internal structure of an electronic device according to one embodiment of this application. The electronic device is a foldable electronic device and has buttons. The structure of the foldable electronic device and the water inlet path can be understood with reference to the preceding text.

[0095] There are multiple FPC mounting modules, including FPC mounting module 1A and FPC mounting module 1B. FPC mounting module 1A can be used... Figures 5-6d The aforementioned solution. The FPC mounting module 1B can be adopted... Figures 7a-7b The aforementioned solution.

[0096] Specifically, the side frame 2111 near the pivot in the middle frame 211 of the first device body 21 and the rear cover (not shown in the figure) of the first device body 21 constitute the mounting part of the FPC mounting module 1A. The side frame 2111 of the first device body 21 is provided with a mounting groove 120A, and the mounting groove 120A and the rear cover together form the mounting hole of the FPC mounting module 1A.

[0097] The electronic device has a button, and an FPC mounting module 1B is provided at the button. The side frame 2112 of the middle frame 211 of the electronic device, which is opposite to the button, and the rear cover of the electronic device (not shown in the figure) constitute the mounting part of the FPC mounting module 1B. The side frame 2112 of the middle frame 211 of the electronic device, which is opposite to the button, is provided with a mounting groove 120B. The mounting groove 120B and the rear cover of the electronic device enclose and form the mounting hole of the FPC mounting module 1B.

[0098] It should be noted that in this embodiment, both FPC mounting module 1A and FPC mounting module 1B are located on the first device body 21. Those skilled in the art will understand that FPC mounting module 1A and FPC mounting module 1B can also be located on the second device body 22, or they can be located on different device bodies.

[0099] Furthermore, the multiple FPC mounting modules also include an FPC mounting module located on the second device body 22. The structure of this FPC mounting module is the same as that of the FPC mounting module 1A. Specifically, the FPC mounting module 1A in the first device body 21 and the FPC mounting module in the second device body 22 can be symmetrically arranged about the axis of rotation, and the FPC10A in the FPC mounting module 1A of the first device body 21 and the FPC in the FPC mounting module of the second device body 22 can be shared.

[0100] As can be seen, the embodiments of this application can utilize the above structure to form a closed sealing structure around the FPC, so as to prevent water from entering at multiple locations of the electronic device, such as the rotation space of the foldable electronic device and the button area of ​​the electronic device, thereby effectively preventing water from entering the hinge of the foldable electronic device.

[0101] Please see Figure 9 , Figure 9 This is a schematic flowchart of the installation method of the FPC mounting module in one embodiment of this application.

[0102] This application also provides a method for installing an FPC mounting module, including:

[0103] Step S31: Glue the first surface of the FPC to the first wall of the mounting hole through the first adhesive part.

[0104] Step S32: Fill the gap with the flowing adhesive to form a second adhesive portion, thereby sealing the gap.

[0105] In some embodiments, the first adhesive portion and the second adhesive portion can be the same adhesive, i.e., a flowing adhesive. Therefore, the operations of steps S31 and S32 can be performed continuously. For example, the flowing adhesive is filled between the first surface of the FPC and the first wall surface of the mounting hole to form the first adhesive portion by a dispensing process, and then dispensing continues to fill the gap with flowing adhesive to form the second adhesive portion. In other embodiments, the first adhesive portion and the second adhesive portion can be different adhesives. Therefore, steps S31 and S32 can be performed discontinuously, i.e., operated separately.

[0106] For further details, please see Figure 10 , Figure 10 This is a flowchart illustrating the installation method of the FPC mounting module in one embodiment of this application. Figure 2 Before step S32, step S32' is also included: fixing the bracket to the second surface of the FPC by the third adhesive part, so that the bracket is pressed between the FPC and the second wall surface of the mounting hole.

[0107] In one example installation process, step S31 is executed first, then step S32' is executed, and finally step S32' is executed.

[0108] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An FPC mounting module, characterized in that, It includes a mounting part and an FPC. The mounting part is provided with a mounting hole, the FPC passes through the mounting hole, and there is a gap between the FPC and the inner wall surface of the mounting hole. The first surface of the FPC is bonded to the first wall of the mounting hole via a first adhesive portion; The gap is filled with a flowable adhesive to form a second adhesive portion, and the FPC is sealed and fixed in the mounting hole through the second adhesive portion; The FPC mounting module further includes a bracket and a third adhesive portion. The bracket is bonded to the second surface of the FPC via the third adhesive portion. The second surface of the FPC is opposite to the first surface along the thickness direction of the FPC. The bracket is pressed between the third adhesive portion and the second wall surface of the mounting hole. The second wall surface of the mounting hole is opposite to the first wall surface along the thickness direction of the FPC. The FPC, the first adhesive portion, the bracket, and the third adhesive portion are all sealed and fixed within the mounting hole via the second adhesive portion. Along the width direction of the FPC, the FPC is located between two opposite side edges of the first adhesive portion, the third adhesive portion is located between two opposite side edges of the FPC, and the bracket is located between two opposite side edges of the third adhesive portion.

2. The FPC mounting module as described in claim 1, characterized in that, Both the first adhesive portion and the third adhesive portion are double-sided adhesive.

3. The FPC mounting module according to claim 1 or 2, characterized in that, The cross-sectional shape of the mounting hole is trapezoidal.

4. An electronic device, characterized in that, Includes the FPC mounting module as described in any one of claims 1 to 3.

5. The electronic device as claimed in claim 4, characterized in that, The electronic device has buttons, and the side frame of the electronic device that is opposite to the buttons and the back cover of the electronic device constitute the mounting part; The side frame of the middle frame is provided with a mounting groove, and the mounting groove and the back cover of the electronic device together form the mounting hole.

6. The electronic device as claimed in claim 4, characterized in that, The electronic device is a foldable electronic device, which includes a first device body, a second device body, and a rotating shaft. The first device body and the second device body are rotatably connected through the rotating shaft. The first device body has a middle frame and a rear cover. The side frame of the middle frame near the pivot and the rear cover constitute the mounting part. The side frame of the middle frame is provided with a mounting groove. The mounting groove and the rear cover enclose the mounting hole.

7. The electronic device as claimed in claim 4, characterized in that, The electronic device is a foldable electronic device, which includes a first device body, a second device body, and a rotating shaft. The first device body and the second device body are rotatably connected through the rotating shaft. The FPC mounting module has multiple modules, including a first FPC mounting module and a second FPC mounting module. The side frame near the pivot of the middle frame of the first device body and the rear cover of the first device body constitute the mounting part of the first FPC mounting module. The side frame of the first device body is provided with a first mounting groove, and the first mounting groove and the rear cover together form the mounting hole of the first FPC mounting module. The electronic device has a button. The side frame of the middle frame of the electronic device, which is opposite to the button, and the back cover of the electronic device constitute the mounting part of the second FPC mounting module. The side frame of the middle frame of the electronic device, which is opposite to the button, is provided with a second mounting groove. The second mounting groove and the back cover of the electronic device enclose and form the mounting hole of the second FPC mounting module.

8. A method for installing the FPC mounting module according to any one of claims 1 to 3, characterized in that, include: The first surface of the FPC is glued to the first wall of the mounting hole through the first adhesive part; The bracket is fixed to the second surface of the FPC by a third adhesive part, so that the bracket is pressed between the FPC and the second wall of the mounting hole; The flowable adhesive is filled into the gap to form the second adhesive portion, thereby sealing the gap.

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