Variable frequency cabinet, compressor and heating and ventilation equipment

Abstract

The application discloses a variable frequency cabinet, a compressor and a heating and ventilation device, and relates to the technical field of cabinets, specifically a variable frequency cabinet, which comprises a cabinet body provided with a containing cavity configured to contain electronic devices, wherein the containing cavity comprises a first cavity and a second cavity; a first radiator is arranged in the first cavity and is configured to reduce the temperature in the first cavity through gas circulation; a second radiator is configured to dissipate heat for the electronic devices in the second cavity through heat conduction; and an airflow driving element is configured to form a heat dissipation airflow in the first cavity, which flows through the electronic devices in the first cavity and the first radiator. According to the variable frequency cabinet provided by the application, the electronic devices are placed in the first cavity and the second cavity, and the first radiator and the second radiator are used to dissipate heat for the electronic devices, so that the heat dissipation effect of the variable frequency cabinet can be improved, and the noise of the variable frequency cabinet can be reduced.

Description

Technical Field

[0001] This invention relates to the field of frequency converter technology, and in particular to a frequency converter cabinet, a compressor including the frequency converter cabinet, and a heating, ventilation, and air conditioning system including the frequency converter cabinet. Background Technology

[0002] Variable frequency drive (VFD) control cabinets, or VFDs for short, are widely used in various medium-voltage motor equipment such as pumps, fans, compressors, rolling mills, injection molding machines, and belt conveyors in industries such as metallurgy, chemical, petroleum, water supply, mining, building materials, and motors.

[0003] A frequency converter cabinet contains frequency converter cabinet power components, frequency converter cabinet control components, and frequency converter cabinet control components. When the frequency converter cabinet is working, these components will generate heat. If this heat cannot be effectively dissipated, it will directly affect the working environment of these components and thus affect their service life.

[0004] Furthermore, in related technologies, the air outlet of the frequency converter cabinet is usually located at the top or upper front wall of the cabinet. When the frequency converter cabinet is placed inside an air compressor, if the air outlet is located at the top of the cabinet, the hot air exiting the outlet will still be drawn into the air compressor because the outlet is very close to the compressor's inlet. This will cause the internal temperature of the air compressor to become too high, affecting its performance and stability. If the air outlet is located on the upper front wall of the cabinet, the hot air exiting the outlet must use a filter grille with a certain level of protection, causing the air to be discharged diagonally downwards. Therefore, the hot air exiting the outlet will still be drawn into the air inlet located at the lower front wall, causing the internal temperature of the frequency converter cabinet to become too high, affecting its performance and stability. Summary of the Invention

[0005] One objective of this invention is to provide a frequency converter cabinet that can improve the heat dissipation effect of the frequency converter cabinet.

[0006] Another object of the present invention is to provide a compressor that includes the aforementioned frequency converter cabinet.

[0007] Another object of the present invention is to provide a heating, ventilation and air conditioning (HVAC) device that includes the aforementioned compressor or frequency converter cabinet.

[0008] According to an embodiment of the present invention, a frequency converter cabinet includes: a cabinet body, the cabinet body having a receiving cavity configured to receive electronic devices, the receiving cavity including a first cavity and a second cavity; a first heat sink disposed in the first cavity and configured to reduce the temperature in the first cavity by means of gas flow; a second heat sink configured to dissipate heat for the electronic devices in the second cavity by means of heat conduction; and an airflow drive configured to form a cooling airflow flowing through the electronic devices in the first cavity and the first heat sink in the first cavity.

[0009] According to the present invention, the frequency converter cabinet uses a first cavity and a second cavity to house electronic components, and uses a first heat sink and a second heat sink to dissipate heat from the electronic components, which can improve the heat dissipation effect of the frequency converter cabinet and reduce the noise of the frequency converter cabinet.

[0010] In addition, the frequency converter cabinet according to the above embodiments of the present invention may also have the following additional technical features:

[0011] Optionally, the first cavity is configured as an annular cavity, and the airflow within the first cavity is adapted to circulate under the driving action of the airflow driving element to dissipate heat.

[0012] Optionally, the first cavity includes a first flow channel located at the bottom of the cabinet and configured to guide the heat dissipation airflow from a first side of the cabinet to a second side.

[0013] Optionally, the first heat sink is disposed in the first flow channel.

[0014] Optionally, a drain port is provided on the bottom wall of the first flow channel to drain the condensate in the first cavity.

[0015] Optionally, the first cavity further includes a second flow channel located on the second side of the cabinet, which guides the heat dissipation airflow from the bottom of the cabinet to the top of the cabinet.

[0016] Optionally, the flow channel wall of the first flow channel includes a first guide plate near the second flow channel, and the flow channel wall of the second flow channel includes a second guide plate near the first flow channel. The first guide plate and the second guide plate are connected in a direction from the first side to the second side, and in the direction from the first side to the second side, the first guide plate is inclined downward relative to the horizontal direction, and the second guide plate is inclined upward relative to the horizontal direction.

[0017] Optionally, the first cavity further includes a third flow channel disposed on the upper part of the cabinet, the third flow channel guiding the heat dissipation airflow from the second side of the cabinet to the first side.

[0018] Optionally, the first cavity further includes a fourth flow channel disposed on the first side, the fourth flow channel guiding the heat dissipation airflow from the top of the cabinet to the bottom of the cabinet.

[0019] Optionally, the first cavity is configured as an annular shape extending along the peripheral wall of the cabinet within the cabinet body.

[0020] Optionally, the first cavity is configured as a closed annular cavity, and the second cavity is spaced apart from the first cavity.

[0021] Optionally, the first cavity is located inside the cabinet near the back panel of the cabinet.

[0022] Optionally, the frequency converter cabinet further includes a door, which is connected to the cabinet and configured to open and close the receiving cavity, and when the door closes the receiving cavity, it covers the second cavity.

[0023] Optionally, the second radiator is a parallel flow radiator; and / or the first radiator is an evaporator.

[0024] Optionally, the electronic devices in the first cavity include a first electronic device and a second electronic device, wherein the heating power of the first electronic device is less than that of the second electronic device, and the first electronic device is upstream of the second electronic device along the flow direction of the heat dissipation airflow.

[0025] Optionally, the electronic device includes a third electronic device disposed within the second cavity, and the second heat sink is stacked with the third electronic device to dissipate heat from the third electronic device.

[0026] Optionally, the second heat sink is at least partially disposed within the second cavity; or, the second heat sink is disposed on the back of the cabinet and corresponds to the position of at least a portion of the electronic components within the second cavity.

[0027] Optionally, the accommodating cavity is provided with a circuit breaker, a reactor, a capacitor, an IGBT, and a diode. The circuit breaker, the reactor, the capacitor, the IGBT, and the diode are electrically connected, and at least one of the circuit breaker, the reactor, the capacitor, the IGBT, and the diode is located in the first cavity, and at least one is located in the second cavity.

[0028] The compressor according to an embodiment of the present invention includes the frequency converter cabinet as described above.

[0029] The HVAC equipment according to embodiments of the present invention includes the aforementioned frequency converter cabinet; or the aforementioned compressor.

[0030] This invention provides a frequency converter cabinet, a compressor, and HVAC equipment. The frequency converter cabinet has a first chamber and a second chamber, and uses different methods for heat dissipation. It can dissipate heat according to the heat output of different components within the frequency converter cabinet. The components can reduce the mutual heat transfer between components, thus reducing the impact on heat dissipation. It can also provide a movable isolation effect, achieving the purpose of anti-interference. In addition, in the compressor and HVAC equipment with this frequency converter cabinet, due to the high stability of the frequency converter cabinet, the operating stability of the compressor can be improved, the failure rate of the HVAC equipment can be reduced, and the working efficiency of the HVAC equipment can be improved. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0032] Figure 2 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0033] Figure 3 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0034] Figure 4 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0035] Figure 5 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0036] Figure 6 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0037] Figure 7 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0038] Figure 8 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0039] Figure 9 This is a schematic diagram of a frequency converter cabinet according to an embodiment of the present invention.

[0040] Reference numerals: 100, frequency converter cabinet; 10, cabinet body; 101, accommodating cavity; 102, first cavity; 1021, first flow channel; 1022, second flow channel; 1023, third flow channel; 1024, fourth flow channel; 103, second cavity; 11, first radiator; 12, second radiator; 121, first guide plate; 122, second guide plate; 13, junction box; 14, airflow drive component; 141, first fan; 142, second fan; 20, door; 31, circuit breaker; 32, reactor; 33, capacitor; 34, IGBT; 35, diode; 36, transformer; 37, contactor. Detailed Implementation

[0041] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0042] Combination Figures 1 to 9According to an embodiment of the present invention, the frequency converter cabinet 100 includes a cabinet body 10, the cabinet body 10 is provided with a receiving cavity 101, the receiving cavity 101 is configured to receive electronic devices, the receiving cavity 101 includes a first cavity 102, the first cavity 102 can be configured to dissipate heat by means of gas flow, in other words, the heat on the electronic devices in the first cavity 102 can be carried away by the flow of air in the first cavity 102, thereby achieving the purpose of heat dissipation of the electronic devices.

[0043] The first cavity 102 can be equipped with a first heat sink 11, which can provide cooling. When the heat inside the first cavity 102 is reduced by airflow, the first heat sink 11 can remove heat from the airflow, effectively dissipating heat from the airflow and facilitating better heat dissipation between the airflow and the electronic components inside the first cavity 102, thereby improving the heat dissipation effect inside the first cavity 102. In other words, the first heat sink 11 and the electronic components inside the first cavity 102 are exchanged through airflow, thereby reducing the temperature inside the first cavity 102 through airflow.

[0044] To facilitate airflow within the first cavity 102, the cabinet 10 may further include an airflow drive 14. This airflow drive 14 is configured to drive the airflow within the first cavity 102 to form a cooling airflow. This cooling airflow can flow through the electronic components and the first heat sink 11 within the first cavity 102. When the airflow flows through the first heat sink 11, it can exchange heat in the airflow with the first heat sink 11 to lower the airflow temperature and absorb the cold energy from the first heat exchanger for cooling the first cavity 102. When the airflow flows through the electronic components within the first cavity 102, it can exchange the cold energy in the airflow with the electronic components within the first cavity 102 and carry away the heat from the electronic components within the first cavity 102, thereby achieving heat dissipation for the electronic components within the first cavity 102. In other words, the heat from the electronic components within the first cavity 102 is transferred to the first heat sink 11, achieving heat dissipation for the electronic components within the first cavity 102.

[0045] Additionally, the accommodating cavity 101 may also include a second cavity 103. The heat dissipation method for the electronic devices in the second cavity 103 may differ from that for the electronic devices in the first cavity 102. For example, a second heat sink 12 corresponding to the second cavity 103 may be provided, and the second heat sink 12 may be configured to dissipate heat from the electronic devices in the second cavity 103 via heat conduction. This achieves heat dissipation for the electronic devices in the second cavity 103. Through heat conduction, heat dissipation efficiency and effectiveness can be improved, enabling rapid heat dissipation from electronic devices operating at high temperatures.

[0046] According to an embodiment of the present invention, the frequency converter cabinet 100 is provided with a first cavity 102 and a second cavity 103. The first cavity 102 can exchange heat by means of gas flow, and the first heat sink 11 is used to reduce the temperature inside the first cavity 102, thereby reducing the temperature of the electronic devices inside the first cavity 102. The second heat sink 12 can be used to reduce the temperature of the electronic devices inside the second cavity 103. By using different heat dissipation methods, heat dissipation can be targeted at different types of electronic devices, which can reduce heat conduction between different electronic devices and improve the stability of operation of each electronic device. At the same time, through the isolation between the first cavity 102 and the second cavity 103, interference between different electronic devices can be reduced, improving the stability of the frequency converter cabinet 100 and reducing the failure rate.

[0047] like Figure 1 As shown, a fourth electronic device A and a fifth electronic device B are provided in the accommodating cavity 101. The fourth electronic device A is located in the first cavity 102 and is adapted to dissipate heat through the first heat sink 11. The fifth electronic device B is located in the second cavity 103 and is adapted to dissipate heat through the second heat sink 12.

[0048] In some embodiments of the present invention, the first cavity 102 is a closed chamber that forms a closed flow channel within the cabinet 10. The combination of the airflow drive 14 and the first heat sink 11 can be used to dissipate heat from the electronic components within the first cavity 102. The second cavity 103 can be designed as an open space; for example, the space outside the first cavity 102 within the cabinet 10 can be designated as the second cavity 103. Since the second cavity 103 is an open space, it facilitates the installation and maintenance of the electronic components within it. Furthermore, a door 20 can be installed on the cabinet 10 to open and close it. Specifically, in some embodiments, the door 20 can be used to open and close the second cavity 103. When the door 20 is open, the second cavity 103 is open, which facilitates the installation and protection of electronic components inside the second cavity 103, and allows for easy inspection of the operating status of the frequency converter cabinet 100 through the electronic components inside the second cavity 103. At this time, the first cavity 102 is in a closed state, which does not affect the space inside the second cavity 103. The second cavity 103 can maintain a low humidity and low dust environment, and its heat dissipation effect and operational stability will be relatively high. When the door 20 is closed, the second cavity 103 is closed. At this time, a relatively closed environment will be formed inside the second cavity 103. Under the action of natural convection or other means, the temperature in various parts of the second cavity 103 can also be relatively uniform, and heat dissipation of electronic components inside the second cavity 103 can also be achieved to a certain extent.

[0049] In addition, in this invention, the second cavity 103 may not have a fan or other airflow drive structure. In this way, the electronic devices in the second cavity 103 will operate with lower noise, effectively reducing the noise of the frequency converter cabinet 100, and preventing the introduction of high-humidity air or dusty airflow from the outside into the second cavity 103, thereby extending the service life of the electronic devices in the second cavity 103. Of course, the second cavity 103 may also have a fan or other airflow drive structure. In this way, sufficient heat exchange can be achieved for the electronic devices in the second cavity 103, maintaining the temperature environment of the electronic devices in the second cavity 103, and improving the operational stability and service life of the electronic devices in the second cavity 103.

[0050] The first cavity 102 in this invention can be configured as a heat dissipation channel in the form of a straight line, a curve, or a broken line. Through the driving action of the airflow drive 14, the heat is carried away by the first heat sink 11. For example, the heat dissipation airflow can enter from one end of the first cavity 102 and flow out from the second end of the first cavity 102. Of course, this may have an adverse effect on the surrounding environment and may also cause dust-laden airflow from the external environment to enter the first cavity 102, affecting the operating environment inside the first cavity 102.

[0051] Furthermore, a first heat sink 11 is provided in this invention to remove heat from the first cavity 102. During the circulating flow of the cooling airflow within the first cavity 102, the first heat sink 11 can also remove heat from the electronic components in the second cavity 103. Therefore, to reduce the impact on the surrounding environment during heat dissipation, the first cavity 102 can be configured as an annular cavity, with the airflow within it circulating under the drive of the airflow drive 14 for heat dissipation. Through airflow circulation, the temperature within the first cavity 102 can be effectively reduced, achieving heat dissipation for the electronic components within the first cavity 102 and providing a better temperature environment for their operation. Simultaneously, the impact of heat from the first cavity 102 on the surrounding environment can be reduced, especially the impact of heat from the first cavity 102 on the electronic components in the second cavity 103, improving the overall stability of the inverter cabinet 100. In addition, the first heat sink 11 also has a condensation function, enabling the regulation of humidity within the first cavity 102 and optimizing the humidity environment for the electronic components within the first cavity 102.

[0052] The first cavity 102 in this invention can be configured as a circular ring, an elliptical ring, a polygonal ring, or other irregularly shaped annular cavity. The first cavity 102 of a specific embodiment of this invention is described below with reference to the accompanying drawings.

[0053] like Figure 7In some embodiments of the present invention, the first cavity 102 may include a first flow channel 1021, which is located at the bottom of the cabinet 10 and configured to guide the heat dissipation airflow from a first side to a second side of the cabinet 10. (See attached diagram.) Figure 7 The first flow channel 1021 is located at the bottom of the cabinet 10 and extends from left to right to guide the heat dissipation airflow from the left side of the bottom of the cabinet 10 to the right side of the cabinet 10, thereby achieving heat dissipation at the bottom of the cabinet 10. At the same time, if condensation occurs in the first cavity 102, it will flow into the first flow channel 1021 and accumulate at the bottom of the first flow channel 1021, or be discharged through the guide structure provided in the first flow channel 1021.

[0054] During the airflow circulation process within the first cavity 102, the temperature at the location of the first radiator 11 is relatively low. Therefore, condensation is easily generated at the location of the first radiator 11, resulting in condensate. Therefore, in this invention, the first radiator 11 is placed within the first flow channel 1021. In this way, when condensation occurs on the first radiator 11, it can flow to the bottom of the cabinet 10 more quickly, avoiding the impact of condensate on other electronic components caused by the flow within the first cavity 102, and improving the stability of the frequency converter cabinet 100.

[0055] In this invention, a discharge port is provided on the bottom wall of the first flow channel 1021. After condensation occurs in the first cavity 102, the condensation can be discharged through the discharge port, thereby achieving effective drainage of condensation in the first cavity 102 and improving the stability and safety of the electronic devices operating in the first cavity 102. In addition, the first cavity 102 in this invention can be configured as a closed flow channel. Since the internal space of the first cavity 102 is relatively closed, it is difficult for external dust-laden airflow, high-humidity airflow, etc. to enter the first cavity 102. The first heat sink 11 installed in the first cavity 102 can have a certain condensation capacity. Therefore, through the cooperation of the discharge port and the first heat sink 11, the humidity in the first cavity 102 can be effectively reduced, maintaining the stable operation of the components in the first cavity 102.

[0056] Of course, the bottom of the first cavity 102 of the present invention may not be provided with a drain port. When condensation is generated in the first cavity 102, the condensation can be stored in the first cavity 102. Due to the provision of the first radiator 11, the humidity in the first cavity 102 can be effectively reduced. The condensation stored at the bottom of the first cavity 102 can maintain the humidity in the first cavity 102 and prevent the humidity in the first cavity 102 from being too low.

[0057] In some embodiments of the present invention, the first cavity 102 further includes a second flow channel 1022, which is located on the second side of the cabinet 10 and guides the heat dissipation airflow from the bottom of the cabinet 10 to the upper part of the cabinet 10. (See attached diagram) Figure 7The second flow channel 1022 is located on the right side of the cabinet 10 and extends vertically, with its lower end connected to the right end of the first flow channel 1021. The second flow channel 1022 can transport the cooling airflow from the first flow channel 1021 to the upper part of the cabinet 10, thereby dissipating heat from the electronic components on the upper part of the cabinet 10. Electronic components can be housed within the second flow channel 1022, which is then cooled by the cooling airflow passing through it. Alternatively, the second flow channel 1022 can be used solely as a channel for airflow transport. The second flow channel 1022 can be adjusted according to actual usage requirements.

[0058] When no electronic components are installed in the second flow channel 1022, some electronic components in the second cavity 103 can be placed close to the second flow channel 1022. This not only utilizes the cooling capacity of the second flow channel 1022 to dissipate heat from these electronic components, but also further reduces mutual interference between them. Furthermore, when no electronic components are installed in the second flow channel 1022, the thickness of the second flow channel 1022 in the left-right direction can be set relatively small to optimize the space utilization of the inverter cabinet 100. For example, the thickness of the second flow channel 1022 in the left-right direction can be set smaller than the thickness of the first flow channel 1021 in the up-down direction. Of course, in conjunction with the following embodiments, the thickness of the second flow channel 1022 in the left-right direction can also be set smaller than the thickness of the third flow channel 1023 in the up-down direction, and the thickness of the second flow channel 1022 in the left-right direction can also be set smaller than the thickness of the fourth flow channel 1024 in the left-right direction.

[0059] In some embodiments of the present invention, the flow channel wall of the first flow channel 1021 includes a first guide plate 121. The first guide plate 121 is disposed near the second flow channel 1022 and is inclined downward relative to the horizontal direction from the first side to the second side. Through the first guide plate 121, the airflow in the first flow channel 1021 can be guided to the first heat sink 11, so that the airflow can better exchange heat with the first heat sink 11, and so that the airflow can carry the cold air of the first heat sink 11 to other locations in the first cavity 102, thereby achieving heat dissipation for the electronic devices in the first cavity 102.

[0060] Due to the guiding effect of the first guide plate 121, the cross-sectional area of ​​the first flow channel 1021 is reduced, resulting in a relatively large air resistance. Therefore, in this invention, the flow channel wall of the second flow channel 1022 is configured to include the second guide plate 122. The second guide plate 122 is close to the first flow channel 1021. The first flow channel 1021 plate and the second flow channel 1022 plate are connected in a direction from the first side to the second side, and the second guide plate 122 is inclined upward relative to the horizontal direction in the direction from the first side to the second side. The second guide member can increase the airflow area, thereby facilitating airflow and effectively reducing noise during airflow, improving the stability of the frequency converter cabinet 100, and achieving noise reduction of the frequency converter cabinet 100.

[0061] In addition, the first cavity 102 also includes a third flow channel 1023 disposed in the upper part of the cabinet 10, the third flow channel 1023 guiding the heat dissipation airflow from the second side to the first side of the cabinet 10. Figure 5 The third flow channel 1023 is located on the upper part of the cabinet 10 and extends in the left-right direction, with its right end connected to the upper end of the second flow channel 1022. The third flow channel 1023 facilitates airflow guidance. Located on the upper part of the cabinet 10, the cooled airflow can be guided by the aforementioned first and second flow channels 1021 and 1022. Electronic components can be placed within the third flow channel 1023. Due to its relatively high position, the third flow channel 1023 avoids the influence of condensation, thus allowing for the placement of electronic components and improving their operational stability.

[0062] The third flow channel 1023 can house diodes 35. Multiple diodes 35 can be arranged in the third flow channel 1023, and the multiple diodes 35 can be arranged along the airflow direction. For example, multiple rows of diodes 35 can be arranged in the third flow channel 1023, and each row includes at least one diode 35. The multiple rows of diodes 35 are arranged sequentially at intervals along the airflow direction, and adjacent rows of diodes 35 can be arranged side by side or staggered.

[0063] Optionally, the first cavity 102 further includes a fourth flow channel 1024 disposed on the first side, the fourth flow channel 1024 guiding the heat dissipation airflow from the top of the cabinet 10 to the bottom of the cabinet 10. (See attached diagram) Figure 7The fourth flow channel 1024 can be located on the left side of the cabinet 10 and extends vertically. The upper end of the fourth flow channel 1024 is connected to the left end of the third flow channel 1023, and the lower end of the fourth flow channel 1024 is connected to the left end of the first flow channel 1021. Through the guiding effect of the fourth flow channel 1024, the airflow can be guided to the first flow channel 1021, so that the first flow channel 1021, the second flow channel 1022, the third flow channel 1023 and the fourth flow channel 1024 combine to form an annular heat exchange channel.

[0064] The fourth flow channel 1024 is located at the end of the circulation flow channel. At this time, the cooling capacity of the heat dissipation airflow is limited. Therefore, some electronic devices with low temperature requirements can be placed in the fourth flow channel 1024, or in other words, electronic devices with high operating temperatures can be placed in the fourth flow channel 1024.

[0065] Optionally, the airflow drive 14 of the present invention includes a plurality of airflow drive 14 arranged along the extending direction of the first cavity 102 and configured to drive the airflow in the first cavity 102 to flow through the first heat sink 11 and electronic devices in the first cavity 102.

[0066] The airflow drive component 14 may include a first fan 141, which is located at the connection between the first flow channel 1021 and the second flow channel 1022. The first fan 141 is configured to drive airflow from the first flow channel 1021 to the second flow channel 1022. By providing the first fan 141, airflow can be facilitated, and the impact of air resistance at the corner between the first flow channel 1021 and the second flow channel 1022 on the heat dissipation airflow can be reduced.

[0067] In addition, the main intake and exhaust directions of the first fan 141 are both tilted towards the second side relative to the vertically upward direction. This further reduces air resistance, facilitates airflow, and improves the efficiency and effectiveness of the heat dissipation lines.

[0068] Additionally, the airflow drive 14 may include a second fan 142, which is located at the connection between the third flow channel 1023 and the fourth flow channel 1024. The second fan 142 is configured to drive airflow from the third flow channel 1023 to the fourth flow channel 1024, thereby improving heat dissipation efficiency and effectiveness.

[0069] Optionally, the cabinet 10 of the present invention is provided with a partition 15, which divides the cabinet 10 into a first cavity 102 and a second cavity 103. The first cavity 102 is adapted for airflow to reduce the temperature inside the first cavity 102. The first cavity 102 is separated from the second cavity 103, and the first cavity 102 and the second cavity 103 are respectively used to accommodate electronic devices.

[0070] In combination with the foregoing, such as Figure 8In some embodiments of the present invention, the side plate 151 includes a first plate portion 1511 that is vertically opposite to the bottom plate of the inverter cabinet 100. The first cavity 102 includes a first flow channel 1021 located between the first plate portion 1511 and the bottom plate. The first flow channel 1021 is located at the bottom of the cabinet 10 and is configured to guide the heat dissipation airflow from the first side of the cabinet 10 to the second side. The first radiator 11 is disposed in the first flow channel 1021. The first plate portion 1511 includes a first guide plate 121 near the second side of the cabinet 10. In the direction from the first side to the second side, the first guide plate 121 is inclined downward relative to the horizontal direction. The first guide plate 121 is configured to guide the airflow to the first radiator 11.

[0071] The side panel 151 also includes a second plate portion 1512 opposite to the side wall of the second side of the inverter cabinet 100. The first cavity 102 includes a second flow channel 1022 located between the second plate portion 1512 and the side wall of the second side of the inverter cabinet 100. The second flow channel 1022 communicates with the first flow channel 1021. The second plate portion 1512 includes a second guide plate 122 near the first flow channel 1021. The second guide plate 122 is connected to the first guide plate 121 in a direction from the first side to the second side, and in the direction from the first side to the second side, the second guide plate 122 is inclined upward relative to the horizontal direction.

[0072] The side panel 151 also includes a third plate portion 1513 opposite to the top wall of the frequency converter cabinet 100. The first cavity 102 includes a third flow channel 1023 located between the third plate portion 1513 and the top wall of the frequency converter cabinet 100. The third flow channel 1023 is connected to the second flow channel 1022.

[0073] The side panel 151 also includes a fourth plate portion 1514 opposite to the side wall of the first side of the frequency converter cabinet 100. The first cavity 102 includes a fourth flow channel 1024 located between the fourth plate portion 1514 and the side wall of the first side of the frequency converter cabinet 100. The fourth flow channel 1024 is connected to the third flow channel 1023 and the first flow channel 1021.

[0074] The partition 15 may also include a front panel 152, which is opposite to the back panel of the cabinet 10 and extends circumferentially along the cabinet 10, and the front panel 152 covers the front side of the first cavity 102. This simplifies the structure of the partition 15 and optimizes the structural strength and stability of the frequency converter cabinet 100.

[0075] Optionally, the first cavity 102 is configured as an annular structure extending along the peripheral wall of the cabinet 10 within the cabinet 10. In this case, the first cavity 102 can have a simpler structure and a larger coverage area. Moreover, the first cavity 102 does not sever the second cavity 103, and the second cavity 103 can also have a larger space to place electronic components. It can also facilitate the arrangement of electronic components within the second cavity 103, thereby facilitating the maintenance and use of the frequency converter cabinet 100, optimizing the performance of the frequency converter cabinet 100, reducing the failure rate of the frequency converter cabinet 100, and improving stability.

[0076] Optionally, the first cavity 102 is configured as a closed annular cavity, and the second cavity 103 is separated from the first cavity 102. The closed configuration of the first cavity 102 facilitates the airflow drive 14 in driving the airflow, enabling sufficient heat exchange between the airflow and the first heat sink 11. This effectively improves the heat dissipation efficiency and effect on the airflow and electronic devices within the first cavity 102, and also prevents the heat from the electronic devices within the first cavity 102 from affecting the surrounding environment, and conversely, prevents the surrounding environment from affecting the electronic devices within the first cavity 102. Simultaneously, it reduces the impact of dust, water, and high-humidity air in the external environment on the stable operation of the electronic devices within the first cavity 102.

[0077] Optionally, the first cavity 102 is located inside the cabinet 10 near the back panel of the cabinet 10. This facilitates the installation and maintenance of electronic components in the second cavity 103. Furthermore, in conjunction with the aforementioned embodiment, the first cavity 102 is a closed annular cavity. By placing the first cavity 102 near the back panel, the electronic components in the second cavity 103 can be installed after the first cavity 102 has been assembled. In this case, the first cavity 102 will not affect the installation of components in the second cavity 103, thereby improving the installation efficiency of electronic components in the frequency converter cabinet 100.

[0078] Optionally, such as Figure 2 As shown, the frequency converter cabinet 100 also includes a door 20, which is connected to the cabinet 10 and configured to open and close the accommodating cavity 101. When the door 20 closes the accommodating cavity 101, it covers the second cavity 103. The electronic components inside the second cavity 103 can be wired, installed, maintained, and debugged by opening and closing the door 20. The door 20 facilitates the installation of electronic components and the use of the frequency converter cabinet 100.

[0079] Optionally, the second heat sink 12 is a parallel flow heat sink. The parallel flow heat sink can have a higher cooling capacity, thereby enabling effective heat dissipation of the electronic components in the second cavity 103, so as to maintain the stable operation of the electronic components in the second cavity 103, improve the operating stability of the frequency converter cabinet 100, and reduce the failure rate.

[0080] The first radiator 11 is an evaporator. The first radiator 11 can be combined with a compressor, condenser, etc., utilizing refrigerant phase change to achieve heat dissipation, optimizing the heat dissipation efficiency and effect within the first cavity 102. In use, the first radiator 11 is installed within the first cavity 102, and the airflow within the first cavity 102 can be used to transfer the cold energy from the first radiator 11 to other locations within the first cavity 102, thereby achieving heat dissipation for the electronic components within the first cavity 102, optimizing the operating environment of the electronic components within the first cavity 102, and improving the stability and service life of the frequency converter cabinet 100.

[0081] Optionally, the electronic devices within the first cavity 102 include a first electronic device and a second electronic device. The heating power of the first electronic device is less than that of the second electronic device, and the first electronic device is located upstream of the second electronic device along the flow direction of the cooling airflow. In other words, during the flow of the cooling airflow, the airflow will pass through the first heat sink 11, the first electronic device, and the second electronic device. The cooling airflow passing through the first heat sink 11 will first pass through the first electronic device to carry away the heat from the first electronic device and maintain its stable operation. After passing through the first electronic device, the temperature rise of the cooling airflow is relatively small, and it can still have a good heat dissipation effect when the cooling airflow continues to flow through the second electronic device, so as to facilitate the heat dissipation of the second electronic device.

[0082] Of course, the cooling airflow passing through the first heat sink 11 can also pass through the second electronic device first and then through the first electronic device. In this way, the cooling airflow can better dissipate heat from the second electronic device and improve the cooling effect.

[0083] Optionally, the electronic device includes a third electronic device, which is disposed within the second cavity 103, and the second heat sink 12 is stacked with the third electronic device to dissipate heat from the third electronic device. This stacking arrangement allows the cooling energy of the second heat sink 12 to be quickly transferred to the third electronic device, resulting in better heat dissipation compared to airflow heat exchange. Therefore, electronic devices with relatively high heat generation power in the inverter cabinet 100 can generally be cooled by the second heat sink 12, directly dissipating heat through thermal conduction.

[0084] Optionally, the second heat sink 12 can be at least partially disposed within the second cavity 103, enabling stable heat dissipation for electronic devices stacked or adjacent to the second heat sink 12; at the same time, the second heat sink 12 can also reduce the temperature within the second cavity 103, thereby achieving the purpose of heat dissipation for other electronic devices within the second cavity 103.

[0085] Of course, installing the second radiator 12 within the second cavity 103 is relatively complex. Therefore, in this invention, the second radiator 12 can also be installed on the back of the cabinet 10, corresponding to the position of at least some of the electronic components within the second cavity 103. This not only facilitates the installation of the second radiator 12 but also prevents condensate generated during the operation of the second radiator 12 from flowing into the cabinet 10, thereby improving the operational stability of the frequency converter cabinet 100.

[0086] like Figures 1 to 9 In some embodiments of the present invention, the accommodating cavity 101 is equipped with a circuit breaker 31, a reactor 32, a capacitor 33, an IGBT 34, and a diode 35. The circuit breaker 31, the reactor 32, the capacitor 33, the IGBT 34, and the diode 35 are electrically connected to realize the frequency conversion function. They can be connected to each other through metal busbars (such as copper busbars) to reduce the resistance of the frequency converter cabinet 100 during operation, reduce energy consumption, and save energy and protect the environment.

[0087] In addition, at least one of the circuit breaker 31, reactor 32, capacitor 33, IGBT 34, and diode 35 is disposed in the first cavity 102, and at least one is disposed in the second cavity 103. By placing these electronic devices in the first cavity 102 or the second cavity 103, effective heat dissipation of each electronic device can be achieved, improving the efficiency and effect of heat dissipation.

[0088] Different heat dissipation methods can be provided for different types of electronic devices. For example, the circuit breaker 31 generates relatively little heat during operation and can be placed in the second cavity 103, at a position relatively far from the second heat sink 12. The reactor 32 generates relatively high heat during operation and can be placed in the first cavity 102, using gas flow for heat dissipation. The capacitor 33 generates less heat than the reactor 32 during operation and can also be placed in the first cavity 102, using gas flow for heat dissipation. In the direction of the heat dissipation airflow, the first heat sink 11 and the capacitor 33 are positioned such that... The reactors 32 are arranged in sequence to achieve good heat dissipation for each component. The IGBT 34 and diode 35 have relatively high operating temperatures. Placing them in the first cavity 102 may affect the heat dissipation of other components in the first cavity 102. Therefore, in this invention, it is preferable to place the IGBT 34 and diode 35 in the second cavity 103 and use the second heat sink 12 to dissipate heat from them. This not only improves the heat dissipation effect of the IGBT 34 and diode 35, but also prevents the heat generated by the IGBT 34 and diode 35 from affecting the stable operation of other electronic devices.

[0089] The present invention provides a frequency converter cabinet 100, which has a first cavity 102 and a second cavity 103 and uses different methods for heat dissipation. It can dissipate heat according to the heat generation power of different components in the frequency converter cabinet 100. The components can reduce the mutual heat transfer between components, thus reducing the heat dissipation effect. In addition, it can also play a mobile isolation role and achieve the purpose of anti-interference.

[0090] Combination Figures 1 to 9 The frequency converter cabinet 100 of the present invention includes a cabinet body 10 and a door 20. The cabinet body 10 has a receiving cavity 101, which can be opened and closed through the door 20. The receiving cavity 101 is divided into a first cavity 102 and a second cavity 103. The first cavity 102 is a closed annular cavity and is arranged along the peripheral wall of the cabinet body 10. The first cavity 102 surrounds the second cavity 103. The first cavity 102 includes a first flow channel 1021, a second flow channel 1022, a third flow channel 1023 and a fourth flow channel 1024 connected in sequence. A first heat sink 11 is provided in the first flow channel 1021. A first fan 141 is provided between the first flow channel 1021 and the second flow channel 1022. A capacitor 33 is provided in the third flow channel 1023. A reactor 32 is provided in the fourth flow channel 1024. A second fan 142 is provided between the third flow channel 1023 and the fourth flow channel 1024. Driven by the first fan 141 and the second fan 142, the airflow can flow in a loop along the first flow channel 1021, the second flow channel 1022, the third flow channel 1023 and the fourth flow channel 1024. The airflow passes through the first heat sink 11, the first fan 141, the capacitor 33, the second fan 142 and the reactor 32 in sequence to achieve heat dissipation for electronic devices.

[0091] The second cavity 103 can accommodate structures such as a circuit breaker 31, diode 35, IGBT 34, transformer 36, contactor 37, and electrical control board. Since the IGBT and diode 35 operate at high temperatures, a second heat sink 12 is provided to dissipate heat from them. The second heat sink 12 can be stacked on the back of the cabinet 10. The IGBT 34 and diode 35 are arranged side-by-side and stacked on the back panel of the cabinet 10. The contactor 37 and transformer 36 are stacked on the back panel of the cabinet 10 and located below the IGBT 34.

[0092] Additionally, a junction box 13 is provided on the outside of the cabinet 10. The junction box 13 is located near the circuit breaker 31. The junction box 13, circuit breaker 31, reactor 32, diode 35, IGBT 34, transformer 36, contactor 37, etc. are electrically connected to form a frequency conversion circuit (for example, connected to form a frequency conversion structure in related technologies).

[0093] Furthermore, this invention also provides a compressor that may include the aforementioned frequency converter cabinet. The frequency converter cabinet enables the compressor to switch frequencies, allowing for convenient adjustment of the compressor's frequency according to different operating conditions, thereby improving energy efficiency. Moreover, the use of the aforementioned frequency converter cabinet in this invention improves the stability and effectiveness of frequency conversion, enabling the compressor to operate stably, reducing the compressor's failure rate, and facilitating stable operation of the compressor at a predetermined frequency, thus improving energy efficiency and promoting energy conservation and environmental protection.

[0094] This invention also provides a heating, ventilation, and air conditioning (HVAC) system, which may include the aforementioned variable frequency drive (VFD) cabinet, or the aforementioned compressor. By incorporating the aforementioned VFD cabinet, the operational stability of the HVAC system can be improved. Furthermore, the first and second radiators in the VFD cabinet can utilize a refrigerant phase change method for heat dissipation. For example, the first and second radiators can be connected to the HVAC system's unit or compressor, thereby utilizing the compressor to dissipate heat from the electronic components within the VFD cabinet, improving the stability of both the HVAC system and the VFD cabinet. Additionally, it simplifies the structure of the HVAC system and optimizes its space utilization and stability.

[0095] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0096] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0097] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0098] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0099] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A frequency converter cabinet, characterized in that, include: The cabinet (10) is provided with a receiving cavity (101), the receiving cavity (101) is configured to receive electronic devices, and the receiving cavity (101) includes a first cavity (102) and a second cavity (103); A first radiator (11) is disposed in the first cavity (102) and configured to reduce the temperature in the first cavity (102) by means of gas flow; The second heat sink (12) is configured to dissipate heat from the electronic devices in the second cavity (103) by means of heat conduction; An airflow drive is configured to form a heat dissipation airflow within the first cavity (102) that flows through the electronic devices within the first cavity (102) and the first heat sink (11); The first cavity (102) includes a first flow channel (1021), which is located at the bottom of the cabinet (10) and configured to guide the heat dissipation airflow from a first side of the cabinet (10) to a second side; The first heat sink (11) is disposed in the first flow channel (1021); And / or, the bottom wall of the first flow channel (1021) is provided with a discharge port to discharge the condensate in the first cavity (102); The first cavity (102) is configured as a closed annular cavity; The electronic devices in the first cavity (102) include a first electronic device and a second electronic device. The heating power of the first electronic device is less than that of the second electronic device. Along the flow direction of the heat dissipation airflow, the first electronic device is upstream of the second electronic device. And / or, the electronic device includes a third electronic device disposed in the second cavity (103), and the second heat sink (12) is stacked with the third electronic device to dissipate heat from the third electronic device; The second heat sink (12) is at least partially disposed within the second cavity (103); or, the second heat sink (12) is disposed on the back of the cabinet (10) and corresponds to the position of at least a portion of the electronic components within the second cavity (103); The first cavity (102) further includes a second flow channel (1022); The flow channel wall of the first flow channel (1021) includes a first guide plate (121) near the second flow channel (1022), and the flow channel wall of the second flow channel (1022) includes a second guide plate (122) near the first flow channel (1021). The first guide plate and the second guide plate are connected in a direction from the first side to the second side, and in the direction from the first side to the second side, the first guide plate (121) is inclined downward relative to the horizontal direction, and the second guide plate (122) is inclined upward relative to the horizontal direction.

2. The frequency converter cabinet according to claim 1, characterized in that, The airflow in the first cavity (102) is adapted to circulate under the driving action of the airflow drive to dissipate heat.

3. The frequency converter cabinet according to claim 2, characterized in that, The second flow channel (1022) is located on the second side of the cabinet (10) and guides the heat dissipation airflow from the bottom of the cabinet (10) to the top of the cabinet (10).

4. The frequency converter cabinet according to claim 3, characterized in that, The first cavity (102) further includes a third flow channel (1023) disposed on the upper part of the cabinet (10), the third flow channel (1023) guiding the heat dissipation airflow from the second side of the cabinet (10) to the first side.

5. The frequency converter cabinet according to claim 4, characterized in that, The first cavity (102) further includes a fourth flow channel (1024) disposed on the first side, the fourth flow channel (1024) guiding the heat dissipation airflow from the top of the cabinet (10) to the bottom of the cabinet (10).

6. The frequency converter cabinet according to any one of claims 1-5, characterized in that, The first cavity (102) is configured as an annular shape extending along the peripheral wall of the cabinet (10) within the cabinet body (10); And / or, the second cavity (103) is spaced apart from the first cavity (102); And / or, the first cavity (102) is located inside the cabinet (10) near the back panel of the cabinet (10).

7. The frequency converter cabinet according to any one of claims 1-5, characterized in that, The frequency converter cabinet also includes: A door (20) is connected to the cabinet (10) and configured to open and close the receiving cavity (101). When the door (20) closes the receiving cavity (101), it covers the second cavity (103).

8. The frequency converter cabinet according to any one of claims 1-5, characterized in that, The second radiator (12) is a parallel flow radiator; and / or the first radiator (11) is an evaporator.

9. The frequency converter cabinet according to any one of claims 1-5, characterized in that, The accommodating cavity (101) is provided with a circuit breaker (31), a reactor (32), a capacitor (33), an IGBT (34), and a diode (35). The circuit breaker (31), the reactor (32), the capacitor (33), the IGBT (34), and the diode (35) are electrically connected. At least one of the circuit breaker (31), the reactor (32), the capacitor (33), the IGBT (34), and the diode (35) is located in the first cavity (102), and at least one is located in the second cavity (103).

10. A compressor, characterized in that, Includes the frequency converter cabinet according to any one of claims 1-9.

11. A heating, ventilation, and air conditioning (HVAC) device, characterized in that, Includes the frequency converter cabinet according to any one of claims 1-9; or the compressor according to claim 10.

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