LTCC radio frequency device and electronic equipment

Abstract

The application provides an LTCC radio frequency device and electronic equipment. The LTCC radio frequency device comprises a ceramic main body, an electromagnetic shielding layer, an inductance capacitance assembly and an external electrode. The electromagnetic shielding layer covers a first surface of the ceramic main body. The inductance capacitance assembly is arranged in the ceramic main body and comprises a plurality of internal electrodes. Adjacent internal electrodes are insulated by the ceramic main body arranged therebetween. The external electrode is arranged on a second surface of the ceramic main body, and the second surface is arranged opposite to the first surface. The plurality of internal electrodes are connected with corresponding external electrodes. The application covers the electromagnetic shielding layer on the surface of the ceramic main body, can avoid external electromagnetic interference, reduce the parasitic influence on the internal capacitor and inductor, and is beneficial to the performance stability of small-sized products.

Description

Technical Field

[0001] This application relates to the field of LTCC device technology, specifically to an LTCC (Low Temperature Co-fired Ceramic) radio frequency device and electronic equipment. Background Technology

[0002] With the rapid development of 5G communication technology, the number of communication frequency bands has increased, and the frequencies are gradually trending towards higher frequencies. Furthermore, different applications require different characteristics from RF devices, such as filters. The modern communication market has become a competitive arena for various RF devices. RF devices based on LTCC (Low Temperature Co-fired Ceramic) technology have high dielectric constant and low loss characteristics, and therefore have been widely used. LTCC RF devices are devices that integrate multiple LC (capacitor) and inductor structures. Current trends in RF device development towards miniaturization and high performance have led to severe electromagnetic interference, such as parasitic effects on internal capacitors and inductors, which is detrimental to the performance stability of miniaturized products. Summary of the Invention

[0003] In view of this, this application provides an LTCC radio frequency device and electronic device that can avoid external electromagnetic interference, reduce parasitic effects on internal capacitors and inductors, and is beneficial to the performance stability of miniaturized products.

[0004] This application provides an LTCC radio frequency device, including:

[0005] Ceramic body;

[0006] An electromagnetic shielding layer covers the first surface of the ceramic body;

[0007] An inductor-capacitor assembly is disposed within the ceramic body. The inductor-capacitor assembly includes multiple internal electrodes, and adjacent internal electrodes are insulated from each other by the ceramic body sandwiched therebetween.

[0008] An external electrode is disposed on the second surface of the ceramic body, the second surface being disposed opposite to the first surface, and the plurality of internal electrodes are connected to the corresponding external electrodes.

[0009] Optionally, the electromagnetic shielding layer is made of metal and / or magnetic material.

[0010] Optionally, the thickness of the electromagnetic shielding layer is H1, and 0.005mm≦H1≦0.2mm.

[0011] Optionally, the plurality of internal electrodes form a first capacitor to a sixth capacitor, and a first inductor to a fifth inductor; the LTCC RF device includes three external electrodes, which serve as an input terminal, an output terminal, and a ground terminal, respectively;

[0012] The first capacitor and the second capacitor are connected in series between the input terminal and the output terminal;

[0013] The third inductor and the third capacitor are connected in parallel to form a parallel resonant circuit, with one end connected between the input terminal and the first capacitor, and the other end connected to the ground terminal;

[0014] The fifth inductor and the sixth capacitor are connected in parallel to form a parallel resonant circuit, with one end connected between the output terminal and the second capacitor, and the other end connected to the ground terminal;

[0015] The first inductor, the fourth inductor, and the fourth capacitor are connected in parallel to form a parallel resonant circuit connected to the ground terminal;

[0016] The second inductor, the fourth inductor, and the fifth capacitor are connected in parallel to form a parallel resonant circuit connected to the ground terminal.

[0017] Optionally, the LTCC RF device includes a first electrode layer to a fifth electrode layer, and the ceramic body includes multiple dielectric layers; at least one of the dielectric layers is disposed between two adjacent electrode layers.

[0018] The first electrode layer includes an unconnected first portion and a first second portion; the first electrode layer is disposed adjacent to the electromagnetic shielding layer and the first surface;

[0019] The second electrode layer includes an integrally formed second part, a second second part, and a second third part;

[0020] Third electrode layer;

[0021] The fourth electrode layer includes a fourth part, a fourth second part, a fourth third part, and a fourth fourth part that are not connected to each other;

[0022] Fifth electrode layer; the fifth electrode layer is disposed adjacent to the second surface;

[0023] Along a direction perpendicular to the first surface, the fourth portion and the third electrode layer at least partially overlap to form the first capacitor, the third electrode layer and the fourth portion at least partially overlap to form the second capacitor, the fourth portion and the fifth electrode layer at least partially overlap to form the third capacitor, the fourth portion and the fifth electrode layer at least partially overlap to form the fourth capacitor, the fourth portion and the fifth electrode layer at least partially overlap to form the fifth capacitor, and the fourth portion and the fifth electrode layer at least partially overlap to form the sixth capacitor;

[0024] The LTCC radio frequency device further includes a first metal resonant pillar to an eighth metal resonant pillar;

[0025] The second part is connected to the third metal resonant pillar to form the first inductor;

[0026] The second and third parts are connected to the sixth metal resonant pillar to form the second inductor;

[0027] The first part is connected to the first metal resonant pillar and the second metal resonant pillar to form a third inductor;

[0028] The second part is connected to the fourth metal resonant pillar to form the fourth inductor;

[0029] The first and second parts are connected to the seventh and eighth metal resonant pillars to form the fifth inductor.

[0030] Optionally, the first metal resonant pillar passes through the dielectric layer between the first part and the fourth part, and its two ends abut against the first part and the fourth part, respectively;

[0031] The second metal resonant pillar passes through the dielectric layer between the first part and the fifth electrode layer, and its two ends abut against the first part and the fifth electrode layer, respectively.

[0032] The third metal resonant pillar passes through the dielectric layer between the second part and the fourth part, and its two ends abut against the second part and the fourth part, respectively;

[0033] The fourth metal resonant pillar passes through the dielectric layer between the second part and the third electrode layer, and its two ends abut against the second part and the third electrode layer, respectively.

[0034] The sixth metal resonant pillar passes through the dielectric layer between the second and third parts and the fourth and fourth parts, and its two ends abut against the second and third parts and the fourth and fourth parts, respectively;

[0035] The seventh metal resonant pillar passes through the dielectric layer between the first and second parts and the fourth and third parts, and its two ends abut against the first and second parts and the fourth and third parts, respectively;

[0036] The eighth metal resonant pillar passes through the dielectric layer between the first two parts and the fifth electrode layer, and its two ends abut against the first two parts and the fifth electrode layer, respectively.

[0037] Optionally, the fourth part is connected to the input terminal via the fifth metal resonant pillar; the fourth part is connected to the output terminal via the fifth metal resonant pillar.

[0038] Optionally, the fifth electrode layer is provided with a notch, and the fourth metal resonant pillar passes through the notch and is connected to the ground terminal.

[0039] Optionally, the LTCC RF device is a filter or a combiner.

[0040] This application provides an electronic device including an LTCC radio frequency device as described in any of the preceding claims.

[0041] As described above, this application covers the surface of the ceramic body with an electromagnetic shielding layer, which can avoid external electromagnetic interference, reduce parasitic effects on internal capacitors and inductors, and is beneficial to the performance stability of miniaturized products. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the structure of an LTCC radio frequency device provided in an embodiment of this application;

[0043] Figure 2 A schematic diagram showing the electromagnetic shielding layer and the ceramic body separated in an embodiment of this application;

[0044] Figure 3 A schematic diagram of a layered structure of a ceramic body and an internal electrode provided in an embodiment of this application;

[0045] Figure 4 This is a circuit equivalent diagram of an LTCC radio frequency device provided in an embodiment of this application. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only a part of the embodiments of this application, and not all of them. Unless otherwise specified, the following embodiments and their technical features can be combined with each other, and also belong to the technical solutions of this application.

[0047] It should be understood that in the description of the embodiments of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solutions of the corresponding embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0048] Please refer to the following: Figures 1 to 3This is a schematic diagram of the structure of an LTCC RF device 1 according to an embodiment of this application. It should be noted that, for ease of observation and understanding of the internal structural components, the diagram uses a perspective view, showing, for example, the positions and connections between some internal and external structural components of the LTCC RF device 1. In practical scenarios, it is manufactured based on LTCC technology, hence the name LTCC RF device 1, which can specifically be a filter, combiner, or coupler. The LTCC RF device 1 includes a ceramic body 101, an electromagnetic shielding layer 102, an inductor-capacitor assembly, and external electrodes.

[0049] The shape and size of the LTCC RF device 1 are not limited in this application. For example, the shape can be a cuboid, rectangle, or other similar tetrahedron as shown in the figure. The length L direction of the LTCC RF device 1 is the first direction x, the width W direction is the third direction z, and the height H2 direction is the second direction y. The first direction x, the second direction y, and the third direction z are all perpendicular to each other and can be regarded as the three coordinate axes of a three-dimensional rectangular coordinate system.

[0050] The term "perpendicular" as used throughout this application does not require the included angle between two points to be exactly 90°, but rather allows for a deviation of ±10°. In other words, "perpendicular" can be understood as an angle between any two directions ranging from 80° to 100°. Similarly, the term "parallel" as used throughout this application does not require the included angle between two points to be exactly 0° or 180°, but rather allows for a deviation of ±10°. In other words, "parallel" can be understood as an angle between any two directions ranging from 0° to 10° or from 170° to 190°.

[0051] The electromagnetic shielding layer 102 covers the first surface of the ceramic body 101. For example, along the second direction y-line of sight, the orthographic projection of a plurality of internal electrodes falls into the orthographic projection of the electromagnetic shielding layer 102.

[0052] The inductor-capacitor assembly is disposed within the ceramic body 101. The inductor-capacitor assembly includes multiple internal electrodes, and adjacent internal electrodes are insulated from each other by the ceramic body 101 (also known as the dielectric layer) sandwiched therebetween.

[0053] The external electrode is disposed on the second surface of the ceramic body 101. The second surface is disposed opposite to the first surface along the second direction y, and therefore can also be referred to as the lower surface and upper surface of the ceramic body 101. Multiple internal electrodes are connected to the corresponding external electrodes.

[0054] The electromagnetic shielding layer 102 can be made of a semiconductor material with nonlinear characteristics, such as a metal and / or a magnetic material. The inner electrode of the inductor-capacitor assembly is connected to the outer electrode, and the inner electrode can be made of a conductive material composed of silver, palladium, platinum, or a silver-palladium or silver-platinum alloy.

[0055] The external electrode can also be made of the same material as the internal electrode. In some scenarios, the LTCC RF device 1 can be provided with three external electrodes 501, 502, and 503, which serve as the output terminal 501, ground terminal 502, and input terminal 503 of the LTCC RF device 1, respectively. The function and working principle of these external electrodes can be found in the descriptions of existing filters and other RF devices, and will not be elaborated here.

[0056] This application covers the surface of the ceramic body 101 with an electromagnetic shielding layer 102, which can avoid external electromagnetic interference, reduce parasitic effects on internal capacitors and inductors, and is beneficial to the performance stability of miniaturized products.

[0057] The thickness and other parameters of the electromagnetic shielding layer 102 can be determined according to the size of the LTCC RF device 1. For example, for an LTCC RF device 1 with length L*width W*height H2 ≥ 0.4mm*0.2mm*0.2mm, the thickness of the electromagnetic shielding layer 102 can optionally be H1, and 0.005mm ≦H1 ≦0.2mm.

[0058] Please see Figure 4 This is a circuit equivalent diagram of LTCC RF device 1. Multiple internal electrodes form the first capacitor C1 to the sixth capacitor C6, and the first inductor L1 to the fifth inductor L5; the three external electrodes 501, 502, and 503 serve as the output terminal P2, the ground terminal GND, and the input terminal P1, respectively.

[0059] The first capacitor C1 and the second capacitor C2 are connected in series between the input terminal P1 and the output terminal P2.

[0060] The third inductor L3 and the third capacitor C3 are connected in parallel to form a parallel resonant circuit, with one end connected between the input terminal P1 and the first capacitor C1, and the other end connected to the ground terminal GND. The fifth inductor L5 and the sixth capacitor C6 are connected in parallel to form a parallel resonant circuit, with one end connected between the output terminal P2 and the second capacitor C2, and the other end connected to the ground terminal GND. Thus, a symmetrical parallel resonant circuit to ground is formed.

[0061] The first inductor L1, the fourth inductor L4, and the fourth capacitor C4 are connected in parallel to form a parallel resonant circuit connected to the ground terminal GND. The second inductor L2, the fourth inductor L4, and the fifth capacitor C5 are connected in parallel to form a parallel resonant circuit connected to the ground terminal GND. Thus, a symmetrical parallel resonant circuit to ground is formed.

[0062] The signal is input from input terminal P1 and output from output terminal P2. When the signal passes through the first capacitor C1 and the second capacitor C2, the high-frequency signal passes through while the low-frequency signal is blocked. The third inductor L3 and the third capacitor C3, the sixth capacitor C6 and the fifth inductor L5 form symmetrical parallel resonant circuits to ground, which mainly introduce transmission zeros to the LTE band and the second harmonic band, thus suppressing the low-frequency and high-frequency parts of the signal. The fourth capacitor C4, the fifth capacitor C5, the first inductor L1, the second inductor L2 and the fourth inductor L4 together form a parallel resonant circuit to ground, which mainly introduces transmission zeros on both sides of the passband, thus suppressing the out-of-band signal on both sides of the passband, improving the rectangular coefficient of the LTCC RF device 1, and effectively adjusting the center frequency and passband bandwidth.

[0063] The following is based on Figures 1 to 3 This paper describes the physical structure of the LTCC radio frequency device 1 according to an embodiment of the present application, and how the above-mentioned 6 capacitors and 5 inductors are formed based on the physical structure.

[0064] like Figures 1 to 3 As shown, the LTCC radio frequency device 1 includes a first electrode layer to a fifth electrode layer stacked sequentially in the opposite direction of the second direction y, and a dielectric layer 11 disposed between adjacent conductor layers.

[0065] The inner electrodes in the first to fifth electrode layers are conductive electrodes and can be made of conductive materials such as silver, palladium, platinum, or silver-palladium or silver-platinum alloys. The manufacturing methods for each inner electrode can be found in existing technologies, such as printing and sintering, and will not be elaborated here.

[0066] The first electrode layer includes a first part 201 and a first second part 204 that are disposed at relatively intervals; the first electrode layer is disposed adjacent to the electromagnetic shielding layer 102 and the first surface.

[0067] The second electrode layer includes a second part 202, a second part 205, and a second part 203. The second electrode layer is arranged in an E-shape and is an integrally formed structural component.

[0068] The third electrode layer 303 is an integrally formed structural component.

[0069] The fourth electrode layer includes a fourth part 301, a fourth second part 302, a fourth third part 305, and a fourth fourth part 306 that are not connected to each other.

[0070] The fifth electrode layer 304 is disposed adjacent to the second surface.

[0071] Along the second direction y, the fourth part 302 and the third electrode layer 303 at least partially overlap to form a first capacitor C1, the third electrode layer 303 and the fourth part 305 at least partially overlap to form a second capacitor C2, the fourth part 302 and the fifth electrode layer 304 at least partially overlap to form a third capacitor C3, the fourth part 301 and the fifth electrode layer 304 at least partially overlap to form a fourth capacitor C4, the fourth part 306 and the fifth electrode layer 304 at least partially overlap to form a fifth capacitor C5, and the fourth part 305 and the fifth electrode layer 304 at least partially overlap to form a sixth capacitor C6.

[0072] The second part 202 is connected to the third metal resonant pillar 403 to form the first inductor L1.

[0073] The second and third parts 203 are connected to the sixth metal resonant pillar 406 to form the second inductor L2.

[0074] The first part 201 is connected to the first metal resonant pillar 401 and the second metal resonant pillar 402 to form the third inductor L3.

[0075] The second part 205 is connected to the fourth metal resonant pillar 404 to form the fourth inductor L4.

[0076] The first and second parts 204 are connected to the seventh metal resonant pillar 407 and the eighth metal resonant pillar 408 to form the fifth inductor L5.

[0077] It should be noted that the formation process of the so-called metal resonant pillar is as follows: a through hole is opened in the dielectric layer 11 located between the two electrode layers, and a conductive material (such as the conductive material used to form the inner electrode of the upper layer) is filled into the through hole to solidify and form a conductive pillar. Multiple conductive pillars are stacked on top of each other to form a metal pillar.

[0078] The entire manufacturing process of the LTCC RF device 1 can refer to existing technologies. For example, it can be processed using steps such as molding, cutting, debinding and sintering, chamfering, and electroplating. For instance, relevant materials meeting the requirements are prepared, and a ceramic layer (insulating layer) with conductive patterns is fabricated. The resulting ceramic layers are stacked and connected in a certain regular manner to obtain the required inductance and capacitance, forming a single ceramic body containing several internal electrodes. The connected ceramic bodies are then divided into individual ceramic bodies 101 using a specific cutting method. After separation, the independent LTCC RF device 1 is treated at a certain temperature to remove excess organic solvent and then sintered at high temperature to obtain the device with the required electrical characteristics. Silver is applied to the bottom surface of the ceramic body 101, and the silver treatment initially forms the external electrode. A nickel layer and a tin layer are then sequentially formed outside the silver layer of the external electrode through an electroplating process to obtain the final external electrode.

[0079] The aforementioned electrode layers are electrically connected via corresponding metal resonant pillars, using the aforementioned 5 inductors and 6 capacitors to achieve the following: Figure 4 The electrical connections are shown. Specifically:

[0080] The first metal resonant pillar 401 passes through the dielectric layer 11 between the first part 201 and the fourth part 302, and its two ends abut against the first part 201 and the fourth part 302, respectively.

[0081] The second metal resonant pillar 402 passes through the dielectric layer 11 between the first part 201 and the fifth electrode layer 304, and its two ends abut against the first part 201 and the fifth electrode layer 304, respectively.

[0082] The third metal resonant pillar 403 passes through the dielectric layer 11 between the second part 202 and the fourth part 301, and its two ends abut against the second part 202 and the fourth part 301, respectively.

[0083] The fourth metal resonant pillar 404 passes through the dielectric layer 11 between the second part 205 and the third electrode layer 303, and its two ends abut against the second part 205 and the third electrode layer 303 respectively; the fifth electrode layer 304 may be provided with a notch, and the fourth metal resonant pillar 404 passes through the notch and connects to the ground terminal 502.

[0084] The sixth metal resonant pillar 406 passes through the dielectric layer 11 between the second and third parts 203 and the fourth and fourth parts 306, and its two ends abut against the second and third parts 203 and the fourth and fourth parts 306, respectively.

[0085] The seventh metal resonant pillar 407 passes through the dielectric layer 11 between the first and second parts 204 and the fourth and third parts 305, and its two ends abut against the first and second parts 204 and the fourth and third parts 305, respectively.

[0086] The eighth metal resonant pillar 408 passes through the dielectric layer 11 between the first two parts 204 and the fifth electrode layer 304, and its two ends abut against the first two parts 204 and the fifth electrode layer 304, respectively.

[0087] The fourth part 302 is connected to the input terminal 503 through the fifth metal resonant pillar 4051.

[0088] The fourth and third parts 305 are connected to the output terminal 501 through the fifth two-metal resonant pillar 4052.

[0089] This application also provides an electronic device including the LTCC radio frequency device 1 of any of the above embodiments. The electronic device may be provided with a housing for forming a cavity, and the LTCC radio frequency device 1 is mounted in the housing. Therefore, the beneficial effects of the LTCC radio frequency device 1 of the corresponding embodiments can be achieved.

[0090] In real-world scenarios, this electronic device can be implemented in various specific forms. For example, the electronic devices described in this application may include mobile terminals such as mobile phones, tablets, laptops, handheld computers, personal digital assistants (PDAs), portable media players (PMPs), navigation devices, wearable devices, smart bracelets, pedometers, and other mobile terminals, as well as fixed terminals such as digital TVs, broadcasting equipment, and desktop computers.

[0091] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. For those skilled in the art, any equivalent structural transformations made using the content of this specification and drawings are similarly included within the patent protection scope of this application.

[0092] Although this document uses terms such as "first," "second," etc., to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. Furthermore, the singular forms "a," "an," and "the" are intended to also include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or meaning either one or any combination thereof. Exceptions to this definition only arise when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

Claims

1. An LTCC radio frequency device, characterized in that, include: Ceramic body; An electromagnetic shielding layer covers the first surface of the ceramic body; An inductor-capacitor assembly is disposed within the ceramic body. The inductor-capacitor assembly includes multiple internal electrodes, which are insulated from each other by the ceramic body sandwiched between them. The multiple internal electrodes form a first capacitor to a sixth capacitor and a first inductor to a fifth inductor. Three external electrodes, serving as the input, output, and ground terminals of the LTCC RF device, are disposed on the second surface of the ceramic body, opposite to the first surface. The plurality of internal electrodes are connected to their corresponding external electrodes, wherein: The first capacitor and the second capacitor are connected in series between the input terminal and the output terminal; The third inductor and the third capacitor are connected in parallel to form a parallel resonant circuit, with one end connected between the input terminal and the first capacitor and the other end connected to the ground terminal; the fifth inductor and the sixth capacitor are connected in parallel to form a parallel resonant circuit, with one end connected between the output terminal and the second capacitor and the other end connected to the ground terminal; the parallel resonant circuit formed by the third inductor and the third capacitor and the parallel resonant circuit formed by the fifth inductor and the sixth capacitor form a symmetrical parallel resonant circuit to ground; The first inductor, the fourth inductor, and the fourth capacitor are connected in parallel to form a parallel resonant circuit connected to the ground terminal; the second inductor, the fourth inductor, and the fifth capacitor are connected in parallel to form a parallel resonant circuit connected to the ground terminal, and together with the parallel resonant circuit formed by the first inductor, the fourth inductor, and the fourth capacitor, they form a symmetrical parallel resonant circuit to ground.

2. The LTCC RF device according to claim 1, characterized in that, The electromagnetic shielding layer is made of metal and / or magnetic material.

3. The LTCC radio frequency device according to claim 1, characterized in that, The thickness of the electromagnetic shielding layer is H1, and 0.005mm≦H1≦0.2mm.

4. The LTCC RF device according to claim 1, characterized in that, The LTCC radio frequency device includes a first electrode layer to a fifth electrode layer, and the ceramic body includes multiple dielectric layers; at least one of the dielectric layers is disposed between two adjacent electrode layers. The first electrode layer includes an unconnected first portion and a first second portion; the first electrode layer is disposed adjacent to the electromagnetic shielding layer and the first surface; The second electrode layer includes an integrally formed second part, a second second part, and a second third part; Third electrode layer; The fourth electrode layer includes a fourth part, a fourth second part, a fourth third part, and a fourth fourth part that are not connected to each other; Fifth electrode layer; The fifth electrode layer is disposed adjacent to the second surface; Along a direction perpendicular to the first surface, the fourth portion and the third electrode layer at least partially overlap to form the first capacitor, the third electrode layer and the fourth portion at least partially overlap to form the second capacitor, the fourth portion and the fifth electrode layer at least partially overlap to form the third capacitor, the fourth portion and the fifth electrode layer at least partially overlap to form the fourth capacitor, the fourth portion and the fifth electrode layer at least partially overlap to form the fifth capacitor, and the fourth portion and the fifth electrode layer at least partially overlap to form the sixth capacitor; The LTCC radio frequency device further includes a first metal resonant pillar to an eighth metal resonant pillar; The second part is connected to the third metal resonant pillar to form the first inductor; The second and third parts are connected to the sixth metal resonant pillar to form the second inductor; The first part is connected to the first metal resonant pillar and the second metal resonant pillar to form a third inductor; The second part is connected to the fourth metal resonant pillar to form the fourth inductor; The first and second parts are connected to the seventh and eighth metal resonant pillars to form the fifth inductor.

5. The LTCC RF device according to claim 4, characterized in that, The first metal resonant pillar passes through the dielectric layer between the first part and the fourth part, and its two ends abut against the first part and the fourth part, respectively. The second metal resonant pillar passes through the dielectric layer between the first part and the fifth electrode layer, and its two ends abut against the first part and the fifth electrode layer, respectively. The third metal resonant pillar passes through the dielectric layer between the second part and the fourth part, and its two ends abut against the second part and the fourth part, respectively; The fourth metal resonant pillar passes through the dielectric layer between the second part and the third electrode layer, and its two ends abut against the second part and the third electrode layer, respectively. The sixth metal resonant pillar passes through the dielectric layer between the second and third parts and the fourth and fourth parts, and its two ends abut against the second and third parts and the fourth and fourth parts, respectively; The seventh metal resonant pillar passes through the dielectric layer between the first and second parts and the fourth and third parts, and its two ends abut against the first and second parts and the fourth and third parts, respectively; The eighth metal resonant pillar passes through the dielectric layer between the first two parts and the fifth electrode layer, and its two ends abut against the first two parts and the fifth electrode layer, respectively.

6. The LTCC RF device according to claim 5, characterized in that, The fourth part is connected to the input terminal via the fifth metal resonant pillar; The fourth and third parts are connected to the output terminal through the fifth and second metal resonant pillars.

7. The LTCC RF device according to claim 6, characterized in that, The fifth electrode layer has a notch, and the fourth metal resonant pillar passes through the notch and is connected to the ground terminal.

8. The LTCC RF device according to claim 1, characterized in that, The LTCC RF device is a filter or a combiner.

9. An electronic device, characterized in that, The electronic device includes an LTCC radio frequency device as described in any one of claims 1 to 8 above.

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