Display device

Abstract

A display device is provided, including: a substrate having a through portion configured to pass through the substrate; and a light emitting element on the substrate, the light emitting element including a pixel electrode, an opposite electrode facing the pixel electrode, and an emission layer arranged between the pixel electrode and the opposite electrode; wherein the opposite electrode is interrupted by a step portion between the through portion and the light emitting element.

Description

[0001] This application is a divisional application of the invention patent application "Display Device" filed on January 16, 2017, with application number 201710029741.6. Technical Field

[0002] One or more embodiments relate to a display device. Background Technology

[0003] Recently, the purposes of display devices have become more diversified. Furthermore, display devices are characterized by slim profiles and light weight, thus expanding their application range. Specifically, display devices are now used not only in monitors and mobile phones, but also in various types of devices such as clocks, and therefore, various methods are being actively researched in terms of display device shape design. Summary of the Invention

[0004] One or more embodiments include a display device having a through portion.

[0005] Other aspects will be set forth in part in the description which follows and will be apparent in part from the description, or may be learned by practice of embodiments of the invention.

[0006] According to one or more embodiments, a display device includes: a substrate; an insulating layer disposed on the substrate; a through portion configured to pass through the substrate and the insulating layer; a pixel array located on the insulating layer and including pixels, each pixel including a light-emitting element, the light-emitting element including a pixel electrode and a counter electrode facing each other, and an emitting layer disposed between the pixel electrode and the counter electrode, the pixels at least partially surrounding the through portion; and a patterned portion disposed between the through portion and the pixel array, wherein the patterned portion includes: a groove recessed along the thickness direction of the insulating layer; and a covering layer disposed on the insulating layer, the covering layer being configured to cover the groove and comprising a material different from the insulating layer.

[0007] The substrate may include a display area in which a pixel array is located and a non-display area adjacent to the display area, and the non-display area may include a first sub-non-display area surrounding the outer edge of the display area and a second sub-non-display area surrounding the outer edge of the through portion between the through portion and the display area.

[0008] The pattern portion can be placed in the second sub-non-display area.

[0009] The insulating layer may include an inorganic layer.

[0010] The display device may further include: pixel circuitry, including thin-film transistors and storage capacitors, wherein the insulating layer comprises a plurality of insulating layers, and at least one of the plurality of insulating layers is disposed between the electrodes of the thin-film transistors or between the electrodes of the storage capacitors to insulate the electrodes.

[0011] The depth of the groove can be less than or correspond to the thickness of the insulating layer.

[0012] The coating layer may contain organic materials.

[0013] The light-emitting element may further include at least one of a first functional layer disposed between the pixel electrode and the emitting layer and a second functional layer disposed between the emitting layer and the opposing electrode. The covering layer may include at least one of a first material layer and a second material layer. The first material layer may contain an insulating material, and the second material layer may contain the same material as at least one of the at least one functional layer and the emitting layer.

[0014] The covering layer may include a first material layer, and a portion of the first material layer may be located inside the groove.

[0015] The covering layer may include a second material layer, and a portion of the second material layer may be located inside the groove.

[0016] The display device may further include: a metal pattern located below the recess, the upper surface of the metal pattern corresponding to the bottom surface of the recess.

[0017] The covering layer may include a stacked body, which includes a first material layer and a second material layer disposed on the first material layer.

[0018] The continuous section can be a single closed curve.

[0019] The groove may have an annular shape that surrounds the through portion and has a diameter larger than that of the through portion.

[0020] The through portion may extend to at least one edge of the display device.

[0021] The display device may further include a layer disposed on the cover layer and comprising the same material as the opposing electrode.

[0022] The display device may further include an encapsulation layer configured to cover the pixel array.

[0023] The sealing layer may include inorganic sealing layers and organic sealing layers.

[0024] The display device may further include: an obstacle disposed between the pattern portion and the pixel array; and an end of an organic sealing layer located between the obstacle and the pixel array.

[0025] The inorganic sealing layer can extend toward the through portion and cover the patterned portion.

[0026] The inorganic sealing layer can directly contact the insulating layer in the area between the through portion and the patterned portion.

[0027] The insulating layer may include auxiliary grooves corresponding to the area between the through portion and the patterned portion.

[0028] The display device may further include: a stepped portion having an undercut shape and disposed between the through portion and the pixel array.

[0029] The opposite electrode can extend toward the through portion and can be broken by the stepped portion.

[0030] According to an embodiment, a display device including a through portion within the display area can prevent cracks from forming around the through portion or prevent cracks from propagating around the through portion. As will be understood by those skilled in the art, the scope of the present invention is not limited to this effect. Attached Figure Description

[0031] These and / or other aspects will become apparent and more readily understood from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a plan view of a display device according to one embodiment;

[0033] Figure 2 It is to amplify and surround Figure 1 A floor plan of the display area of ​​the through section;

[0034] Figure 3 It is along Figure 2 A cross-sectional view taken from line III-III in the diagram;

[0035] Figure 4 and Figure 5 This is a partial cross-sectional view showing a portion of the display area and the second sub-non-display area of ​​a display device according to one embodiment;

[0036] Figure 6 It is a plan view enlarged around the through portion in a display device according to another embodiment;

[0037] Figure 7 It is along Figure 6 A cross-sectional view taken from line VII-VII;

[0038] Figure 8 , Figure 9 and Figure 10 It shows Figure 7A view of a variant implementation;

[0039] Figure 11 It shows Figure 10 An enlarged view of part XI;

[0040] Figure 12A , Figure 12B and Figure 12C This illustrates an embodiment. Figure 10 A cross-sectional view of the manufacturing method;

[0041] Figure 13 It shows Figure 10 A view of a variant implementation;

[0042] Figure 14 It is a plan view enlarged around the through portion in a display device according to another embodiment;

[0043] Figure 15 It is along Figure 14 A cross-sectional view taken from line XV-XV;

[0044] Figure 16 , Figure 17 and Figure 18 It shows Figure 15 A view of a variant implementation;

[0045] Figure 19 This is a plan view of a display device according to another embodiment;

[0046] Figure 20 It shows Figure 19 A partial plan view of the area surrounding the through section;

[0047] Figure 21A , Figure 21B , Figure 21C , Figure 21D , Figure 21E , Figure 21F and Figure 21G According to one implementation method, along Figure 20 A cross-sectional view taken from line XXI-XXI;

[0048] Figure 22 This is a plan view of a display device according to another embodiment;

[0049] Figure 23 It shows Figure 22 A partial plan view of the area surrounding the penetrating section; and

[0050] Figure 24A , Figure 24B , Figure 24C , Figure 24D , Figure 24E and Figure 24F According to one implementation method, along Figure 22 The cross-sectional view taken from line XXIV-XXIV. Detailed Implementation

[0051] Because the inventive concept allows for various variations and multiple implementations, exemplary embodiments will be shown in the accompanying drawings and described in detail in the written description. The effects and features of the inventive concept, as well as methods of implementing them, will be apparent from the embodiments and drawings described below. However, the inventive concept is not limited to the embodiments described below, but can be implemented in various forms.

[0052] In the following description, the inventive concept will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the inventive concept are illustrated. When describing with reference to the accompanying drawings, similar reference numerals denote similar or corresponding elements, and repetitive descriptions will be omitted.

[0053] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0054] It should be understood that although the terms "first," "second," etc., may be used in this document to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0055] As used herein, the singular forms “a”, “an”, and “the” are also intended to include the plural forms unless the context clearly indicates otherwise.

[0056] It should be further understood that the terms “comprise” and / or “comprising” as used herein mean that the stated features or components are present, but do not exclude the presence or addition of one or more other features or components.

[0057] For ease of illustration, the dimensions of the components in the accompanying drawings may be enlarged. In other words, for ease of illustration, the dimensions and thicknesses of the parts in the accompanying drawings are shown arbitrarily, and the following embodiments are not limited thereto.

[0058] When certain implementation methods can be carried out differently, a particular process sequence can be performed in a different order than that described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0059] It should be understood that when a layer, region, or component is referred to as being "connected" to another layer, region, or component, it may be "directly connected" to the other layer, region, or component or it may be "indirectly connected" to the other layer, region, or component with other layers, regions, or components inserted in between. For example, it should be understood that when a layer, region, or component is referred to as being "electrically connected" to another layer, region, or component, it may be "directly electrically connected" to the other layer, region, or component or it may be "indirectly electrically connected" to the other layer, region, or component with other layers, regions, or components inserted in between.

[0060] Figure 1 This is a plan view of a display device 1 according to one embodiment.

[0061] refer to Figure 1 The display device 1 includes a substrate 100 and a pixel array 10 on the substrate 100.

[0062] The substrate 100 may comprise materials such as glass, metal, or organic materials. According to one embodiment, the substrate 100 may comprise an elastic material. For example, the substrate 100 may comprise a material such as polyimide (PI), which can be easily bent and folded or rolled, but this is merely exemplary and the embodiments are not limited thereto.

[0063] The substrate 100 includes a display area DA and a non-display area NDA. A through-hole TH is located in the display area DA. The through-hole TH is a hole that passes through the substrate 100, the sealing layer 400 and the layers disposed therebetween, and the hole is located inside the display area DA and surrounded by a pixel array 10 including a plurality of pixels P.

[0064] Each pixel P of the pixel array 10 includes pixel circuitry and a light-emitting element, such as an organic light-emitting diode (OLED), electrically connected to the pixel circuitry. Each pixel provides a predetermined image by using light emitted from the light-emitting element. The pixel array 10 is sealed by a sealing layer as described below. The sealing layer may be multilayered, including layers containing organic materials and layers containing inorganic materials.

[0065] The non-display area NDA is the area that does not provide an image and includes a first sub-non-display area NDA1 surrounding the outer edge of the display area DA and a second sub-non-display area NDA2 surrounding the outer edge of the through portion TH.

[0066] The first sub-non-display area NDA1 may include a scan driver (not shown) and a data driver (not shown) for transmitting predetermined signals to each pixel PX of the display area DA. The second sub-non-display area NDA2 is arranged between the through portion TH and the display area DA.

[0067] although Figure 1The illustration shows the through portion TH located at the center of the display area DA of the display device 1, but the implementation is not limited to this. The through portion TH may be surrounded by pixels P and located at any position in the display area DA, and the specific position of the through portion TH is not limited.

[0068] although Figure 1 The illustration shows a circular through-part TH, but the implementation is not limited to this. The through-part TH can have various shapes, such as polygonal shapes including quadrilateral shapes or elliptical shapes. One or more through-parts TH can be formed.

[0069] although Figure 1 The illustration shows that the display area DA is circular, but the implementation is not limited to this. The display area DA can have various shapes, such as polygonal shapes including quadrilateral shapes or elliptical shapes.

[0070] Figure 2 It is to amplify and surround Figure 1 A floor plan of the display area of ​​the through section, and Figure 3 It is along Figure 2 The cross-sectional view taken from line III-III.

[0071] refer to Figure 2 and Figure 3 The through portion TH is surrounded by pixel P, and the area where pixel P is not set (i.e., the second sub-non-display area NDA2) is located between the through portion TH and pixel P.

[0072] The through-portion TH can pass through the substrate 100, the sealing layer 400, and the layers disposed therebetween. The through-portion TH can be formed using a laser or the like via a cutting / drilling device. However, due to the impact during the process of forming the through-portion TH using a cutting device, cracks may appear near the through-portion TH. To prevent the cracks from propagating toward the pixel P, a patterned portion 300A is arranged in the second sub-non-display area NDA2.

[0073] The patterned portion 300A includes a groove 310A and a covering layer 320A that covers the groove 310A. For example... Figure 2 As shown, the groove 310A has an annular shape with a radius greater than that of the through portion TH, and the groove surrounds the outer edge of the through portion TH.

[0074] although Figure 2 The illustration shows a case where the through portion TH has a circular shape and the groove 310A has an annular shape, but the implementation is not limited to this. The groove 310A may have a polygonal annular shape, such as a triangular annular shape or a square annular shape, or an elliptical annular shape.

[0075] The groove 310A is a recessed groove type that runs along the thickness direction of the insulating layer 110 on the substrate 100 and prevents cracks from propagating toward the display area DA. The depth "d1" of the groove 310A may be less than or correspond to the thickness "t" of the insulating layer 110. In one embodiment, the depth "d1" of the groove 310A may be approximately to approximately

[0076] The insulating layer 110 including the groove 310A may include an inorganic layer and may include a single inorganic layer or multiple inorganic layers. For example, the insulating layer 110 may contain inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride.

[0077] The covering layer 320A overlaps with the groove 310A to cover the groove 310A. The covering layer 320A is disposed directly above the portion of the insulating layer 110 that includes the groove 310A so as to directly contact the groove 310A, and a portion of the covering layer 320A may be disposed inside the groove 310A.

[0078] The overlay 320A may contain an organic insulating material. For example, the overlay 320A may contain the same material as the via insulating layer 130 and / or pixel defining layer 150 described below.

[0079] The covering layer 320A can provide a relatively flat upper surface while covering the groove 310A. The overall thickness of the covering layer 320A, that is, the thickness of the covering layer 320A filling the groove 310A from the bottom to the top surface, can be approximately to However, the implementation methods are not limited to this.

[0080] By reducing the stress in the portion of the insulating layer 110 (which is an inorganic layer) where the groove 310A is formed, the covering layer 320A prevents crack propagation. In addition, by covering the groove 310A, the covering layer 320A can prevent particles generated during the manufacturing process from being stored in the groove 310A and subsequently moving to the light-emitting element 500 of the pixel P, thus preventing dark spots.

[0081] refer to Figure 3 An auxiliary groove 315 may be arranged between the through portion TH and the patterned portion 300A. The auxiliary groove 315 is a groove type that is recessed along the thickness direction of the insulating layer 110 and can be formed simultaneously during the same process as forming the groove 310A. The depth of the auxiliary groove 315 may be substantially the same as the depth of the groove 310A.

[0082] The auxiliary groove 315 may be located near the end of the through portion TH of the insulating layer 110 and spatially connected to the through portion TH. Like the patterned portion 300A, the auxiliary groove 315 prevents cracks caused by impacts generated during the formation of the through portion TH from propagating toward the pixel P.

[0083] The inorganic sealing layers 410 and 430 included in the sealing layer 400 cover the patterned portion 300A and the auxiliary groove 315. Since the insulating layer 110 (which is an inorganic layer) contacts the inorganic sealing layers 410 and 430 in the edge region of the adjacent through portion TH of the second sub-non-display area NDA2 (i.e., in the region between the patterned portion 300A and the through portion TH), external oxygen or moisture can be prevented from penetrating in the lateral direction through the interface between the insulating layer 110 (which is an inorganic layer) and the inorganic sealing layers 410 and 430, thereby improving the sealing characteristics.

[0084] Sealing layer 400 includes inorganic sealing layers 410 and 430 and an organic sealing layer 420. For example, sealing layer 400 can be formed by sequentially stacking inorganic sealing layer 410, organic sealing layer 420, and inorganic sealing layer 430. Inorganic sealing layers 410 and 430 may contain at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cesium oxide, and silicon oxynitride. For example, inorganic sealing layers 410 and 430 can be formed by a chemical vapor deposition (CVD) process.

[0085] The organic sealing layer 420 may contain at least one of acrylaldehyde resin, methacrylate resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and dinaphthalene-based phenyl resin.

[0086] In one embodiment, the organic sealing layer 420 can be formed by an atomic layer deposition (ALD) process using materials such as hexamethyldisiloxane (HMDSO) or tetraethyl silicone ester (TEOS) as raw materials.

[0087] In another embodiment, the organic seal layer 420 can be formed by depositing a liquid monomer and then curing the monomer using heat or light such as ultraviolet light. Here, to prevent the liquid monomer from flowing toward the patterned portion 300A and to prevent the edge of the organic seal layer 420 from forming, a barrier 350 can be arranged in the second sub-non-display area NDA2. Through the barrier 350, the end of the organic seal layer 420 is located between the barrier 350 and the pixel P.

[0088] Although the case in which the sealing layer 400 includes two inorganic sealing layers 410 and 430 and an organic sealing layer 420 has been described, the stacking order and number of the inorganic and organic sealing layers are not limited thereto.

[0089] The pixel circuit 200 and the light-emitting element 500 are located in the display area DA.

[0090] The light-emitting element 500 includes a pixel electrode 510 electrically connected to the pixel circuit 200, a counter electrode 530 facing the pixel electrode 510, and an intermediate layer 520 disposed between the pixel electrode 510 and the counter electrode 530, wherein a via insulating layer 130 including vias is disposed between the pixel electrode and the pixel circuit. In one embodiment, the via insulating layer 130 may comprise an insulating organic material.

[0091] Pixel electrode 510 is exposed via an opening formed in pixel defining layer 150. Pixel defining layer 150, comprising an insulating organic material, may cover the edges of pixel electrode 510. In one embodiment, pixel electrode 510 may comprise silver, magnesium, aluminum, platinum, palladium, gold, nickel, neodymium, iridium, chromium, or compounds thereof.

[0092] The counter electrode 530 can be integrally formed and can completely cover the display area DA. In one embodiment, the counter electrode 530 may include a thin film metal layer containing silver and magnesium, or a transparent conductive oxide (TCO) layer containing indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO).

[0093] The intermediate layer 520 includes an emitting layer 522. The emitting layer 522 may include an organic material comprising a fluorescent or phosphorescent material that emits red, green, and blue light and may be patterned to correspond to a pixel P in the display area DA. The intermediate layer 520 may include at least one of a first functional layer 521 disposed between the emitting layer 522 and the pixel electrode 510 and a second functional layer 523 disposed between the emitting layer 522 and the opposing electrode 530.

[0094] The first functional layer 521 may include at least one of a hole injection layer (HIL) and a hole transport layer (HTL). The HIL allows holes to be easily emitted from the anode, and the HTL allows holes from the HIL to be transported to the emitter layer.

[0095] HILs may include phthalocyanine compounds, such as copper phthalocyanine, DNTPD (N,N'-diphenyl-N,N'-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4'-diamine), m-MTDATA (4,4',4"-tris(3-tolylphenylamino)triphenylamine), TDATA (4,4'4"-tris(N,N-diphenylamino)triphenylamine), 2T-NATA (4,4',4"- Tris{N,-(2-naphthyl)-N-phenylamino}-triphenylamine), PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / poly(sodium 4-styrenesulfonate)), PANI / DBSA (polyaniline / dodecylbenzenesulfonic acid), PANI / CSA (polyaniline / camphorsulfonic acid), or PANI / PSS (polyaniline / poly(sodium 4-styrenesulfonate) or polyaniline / poly(4-styrenesulfonate)), but not limited to these.

[0096] HTLs may include, but are not limited to, carbazole derivatives such as N-phenylcarbazole, polyvinylcarbazole, and triphenylamine-based materials such as TPD (N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1-biphenyl]-4,4'-diamine), NPB (N,N'-bis(1-naphthyl)-N,N'-diphenylbenzidine), and TCTA (4,4',4"-tris(N-carbazolyl)triphenylamine).

[0097] The second functional layer 523 may include at least one of an electron transport layer (ETL) and an electron injection layer (EIL). The EIL allows electrons to be easily emitted from the cathode, and the ETL allows electrons from the EIL to be transported to the emission layer.

[0098] ETLs may include Alq3, BCP (2,9-dimethyl-4,7-diphenyl-1,10-o-phenanthroline), Bphen (4,7-diphenyl-1,10-o-phenanthroline), TAZ (3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), NTAZ (4-(naphthylacetamido-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), tBu-PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), BAlq (bis(2-methyl-8-hydroxyquinoline-N1,O8)-(1,1'-biphenyl-4-hydroxy)aluminum), Bebq2 (bis(benzoquinoline-10-ol sodium salt) beryllium), ADN (9,10-bis(naphthylacetamido-2-yl)anthracene), and are not limited thereto.

[0099] EILs may include, but are not limited to, lithium fluoride (LiF), sodium chloride (NaCl), cesium fluoride (CsF), lithium oxide (Li2O), barium oxide (BaO), and 8-hydroxyquinoline-lithium (Liq).

[0100] The ends of the first functional layer 521 and the second functional layer 523 disposed in the display area DA are spatially separated from the patterned portion 300A. During the manufacturing process of the display device 1, the first functional layer 521 and the second functional layer 523 are formed to cover not only the display area DA but also the second sub-non-display area NDA2 surrounding the through portion TH. Then, before forming the sealing layer 400, a portion of the first functional layer 521 and the second functional layer 523 corresponding to the second sub-non-display area NDA2 can be removed. In one embodiment, the first functional layer 521 and the second functional layer 523 can be removed by using laser etching.

[0101] In a comparative example, if the first functional layer 521 and the second functional layer 523 cover both the display area DA and the second sub-non-display area NDA2, then the insulating layer 110 (which is an inorganic layer) and the inorganic sealing layer 410 are not in direct contact with each other in the region adjacent to the through portion TH. That is, the first functional layer 521 and the second functional layer 523 are disposed between the insulating layer 110 and the inorganic sealing layer 410, which provides a path for moisture or oxygen to penetrate in the lateral direction. However, according to one embodiment, since the insulating layer 110 and the inorganic sealing layer 410, which have good moisture or oxygen barrier functions, are in direct contact with each other, the sealing characteristics can be improved.

[0102] Figure 4 and Figure 5 This is a cross-sectional view extracting a portion of the display area and the second sub-non-display area of ​​a display device according to one embodiment. Because Figure 4 and Figure 5 The display device includes a reference Figure 3 Since the display device described has the same structure, the pixel circuit 200 and the insulating layer 110 will be mainly described below.

[0103] refer to Figure 4 The pixel circuit 200 includes a thin-film transistor (TFT) 210 and a storage capacitor 220. The insulating layer 110 may include a buffer layer 101, a gate insulating layer 103, a dielectric insulating layer 105, and a sandwich insulating layer 107 sequentially located on the substrate 100.

[0104] A buffer layer 101 is disposed on the substrate 100 to prevent impurities from penetrating. A gate insulating layer 103 is disposed between the semiconductor layer 211 and the gate electrode 213 of the TFT 210. A dielectric insulating layer 105 is disposed between the lower electrode 221 and the upper electrode 223 of the storage capacitor 220. An interlayer insulating layer 107 is disposed between the gate electrode 213, the source electrode 215s and the drain electrode 215d of the TFT 210.

[0105] All buffer layers 101, gate insulating layers 103, dielectric insulating layers 105, and interlayer insulating layers 107 comprise insulating inorganic materials. For example, each of the buffer layers 101, gate insulating layers 103, dielectric insulating layers 105, and interlayer insulating layers 107 may comprise silicon nitride, silicon oxide, and / or silicon oxynitride.

[0106] The groove 310A of the patterned portion 300A is recessed along the thickness direction of the insulating layer 110. (Reference) Figure 4 The recess 310A can be formed by etching the interlayer insulating layer 107, the dielectric insulating layer 105, the gate insulating layer 103, and the buffer layer 101 until a portion of the buffer layer 101 is exposed. The etching process for forming the recess 310A can be dry etching and can be performed simultaneously during the process of forming contact holes for connecting the semiconductor layer 211 to the source electrode 215s and drain electrode 215d of the TFT 210.

[0107] although Figure 4 The diagram shows the overlapping of TFT 210 and storage capacitor 220, and thus, the gate electrode 213 of TFT 210 serves as the lower electrode 221 of storage capacitor 220, but the implementation is not limited to this.

[0108] refer to Figure 5 The TFT 210 and storage capacitor 220 of the pixel circuit 200 can be arranged in different positions.

[0109] According to the structure of the pixel circuit 200, the insulating layer 110 may include a buffer layer 101, a gate insulating layer 103, and a sandwich insulating layer 107 sequentially located on the substrate 100. For example... Figure 5 As shown, the interlayer insulating layer 107 is arranged between the lower electrode 221 and the upper electrode 223 of the storage capacitor 220 and acts as a dielectric.

[0110] The groove 310A of the patterned portion 300A can be formed by etching the interlayer insulating layer 107, the gate insulating layer 103, and the buffer layer 101 until a portion of the buffer layer 101 is exposed. The etching process for forming the groove 310A can be dry etching and can be performed simultaneously during the process of forming contact holes for connecting the semiconductor layer 211 to the source electrode 215s and drain electrode 215d of the TFT 210.

[0111] although Figure 4 and Figure 5 The illustration shows a case where the TFT 210 of the pixel circuit 200 is a top-gate TFT, but the implementation is not limited to this. In another embodiment, the TFT 210 can be a bottom-gate TFT. Furthermore, although... Figure 5The illustration shows that the lower electrode 221 and the upper electrode 223 of the storage capacitor 220 are located in the same layer as the layer in which the gate electrode 213, the source electrode 215s and the drain electrode 215d are arranged, and contain the same material as the gate electrode 213, the source electrode 215s and the drain electrode 215d. However, the implementation is not limited to this and various changes can be made.

[0112] Figure 6 This is a magnified plan view of the display area surrounding the through portion in the display device 2 according to another embodiment. Figure 7 It is along Figure 6 A cross-sectional view taken from line VII-VII. Figures 8 to 10 It shows Figure 7 A view of a variant implementation. Figure 11 It shows Figure 10 A magnified view of part XI. Figures 12A to 12C This illustrates an embodiment. Figure 10 A cross-sectional view of the manufacturing method, and Figure 13 It shows Figure 10 A view of a variant implementation.

[0113] because Figure 6 and Figure 7 The display device 2 shown in the figure has the same characteristics as the above reference. Figure 1 and Figure 2 The display device 1 described is basically the same in structure and construction, so the main differences are described below.

[0114] refer to Figure 6 and Figure 7 The patterned portion 300B includes a groove 310B and a covering layer 320B covering the groove 310B, and the covering layer 320B includes a first material layer 320B1 and a second material layer 320B2. Because the groove 310B of the patterned portion 300B is consistent with the above reference... Figure 2 and Figure 3 The groove 310A is described in the same way, so its description is omitted.

[0115] The first material layer 320B1 overlaps with and covers the groove 310B. The first material layer 320B1 may be disposed directly above the portion of the insulating layer 110 including the groove 310B to directly contact the groove 310B, and a portion of the first material layer 320B1 may be disposed inside the groove 310B.

[0116] References above Figure 2 and Figure 3Similar to the described overlay layer 320A, the first material layer 320B1 is an insulating material layer containing an insulating organic material. For example, the first material layer 320B1 may contain the same material as the via insulating layer 130 and / or the pixel defining layer 150.

[0117] The second material layer 320B2 contains the same material as at least one of the first functional layer 521, the emitting layer 522, and the second functional layer 523. Since the first functional layer 521 and the second functional layer 523 are layers for the injection and movement of holes and electrons and are therefore conductive, the second material layer 320B2, which contains the same material as the first functional layer 521 and the second functional layer 523, may contain a conductive material.

[0118] In one implementation, such as Figure 7 As shown, the second material layer 320B2 may have a multilayer structure containing the same material as the first functional layer 521 and the second functional layer 523. In another embodiment, the second material layer 320B2 may be a single layer 321 containing the same material as the first functional layer 521, or it may be a single layer 323 containing the same material as the second functional layer 523.

[0119] In another embodiment, such as Figure 8 As shown, the second material layer 320B2 may further include a layer 322 having the same material as the emission layer 522. Alternatively, the second material layer 320B2 may be a multilayer 321 and 322 containing the same material as the first functional layer 521 and the emission layer 522, or it may be a multilayer 322 and 323 containing the same material as the second functional layer 523 and the emission layer 522. In another embodiment, the second material layer 320B2 may be a single layer 322 containing the same material as the emission layer 522.

[0120] For ease of description, the second material layer 320B2 is described below as having a multilayer structure containing the same materials as the first functional layer 521 and the second functional layer 523.

[0121] The second material layer 320B2 can be formed during the process of removing the first functional layer 521 and the second functional layer 523 formed in the second sub-non-display area NDA2 of the substrate 100. For example, during the process of manufacturing the display device 2, the first functional layer 521 and the second functional layer 523 can be formed to cover not only the display area DA but also the second sub-non-display area NDA2 surrounding the through portion TH, and before forming the sealing layer 400, a portion of the first functional layer 521 and the second functional layer 523 corresponding to the second sub-non-display area NDA2 can be removed by laser etching. The second material layer 320B2 can be formed by retaining a portion of the first functional layer 521 and the second functional layer 523 overlapping with the first material layer 320B1 when removing the portion corresponding to the second sub-non-display area NDA2.

[0122] As referenced above Figure 3 As shown, when the portions of the first functional layer 521 and the second functional layer 523 corresponding to the second sub-non-display area NDA2 are removed via laser etching, a portion of the first material layer 320B1 may dissipate due to the energy of the laser beam. In this case, the flatness of the upper surface of the first material layer 320B1 and the flatness of the upper surface of the second material layer 320B2 disposed on the first material layer 320B1 will deteriorate. If the flatness of the upper surface of the patterned portion 300B deteriorates, the likelihood of cracks forming in the inorganic sealing layers 410 and 430 will increase.

[0123] However, according to one embodiment, since the display device 2 includes a patterned portion 300B, that is, the patterned portion includes a second material layer 320B2 formed when the first functional layer 521 and the second functional layer 523 on the first material layer 320B1 are not removed, the possibility of cracks forming in the inorganic sealing layers 410 and 430 and the possibility of crack propagation can be reduced.

[0124] The relative electrode 530 completely covers the display area DA. In one embodiment, such as... Figure 7 As shown, when a masking material is formed to cover the second sub-non-display area NDA2 before the formation of the relative electrode 530, the relative electrode 530 is formed to cover the display area DA and the second sub-non-display area NDA2, and then the masking material is removed, the relative electrode 530 is not held on the second sub-non-display area NDA2.

[0125] In another embodiment, without forming the aforementioned mask material and forming a counter electrode 530 to cover the display area DA and the second sub-non-display area NDA2, the counter electrode 530 can be removed simultaneously by using laser etching to remove the first functional layer 521 and the second functional layer 523. In this case, as referenced above... Figure 7As stated above, since the portion corresponding to pattern portion 300B is not laser-etched, therefore, as Figure 9 As shown, a layer 340 containing the same material as the opposite electrode 530 can be further formed on the patterned portion 300B.

[0126] According to another embodiment, the opposing electrode 530 can be formed after the laser etching process. In this case, as... Figure 10 As shown, the relative electrode 530 can cover the second sub-non-display area NDA2 and can be integrally connected to layer 340.

[0127] refer to Figure 10 and Figure 11 In the second sub-non-display area NDA2, the opposing electrode 530 can be disconnected via a stepped portion 365 having an undercut shape. The stepped portion 365 has an undercut shape with a lower width W1 smaller than an upper width W2. This can be achieved using the following reference... Figures 12A to 12C The process described is used to form the step section 365.

[0128] refer to Figure 12A During the process of forming an insulating layer 110 comprising multiple inorganic layers, a metal pattern layer M and a hole 110MH are formed in the insulating layer 110, and the upper surface of the metal pattern layer M is exposed. The hole 110MH may be formed during the process of forming the groove 310B. Subsequently, when the pixel electrode 510 of the display area DA is patterned, a stepped portion 365 with an undercut shape is formed when the metal pattern layer M is etched by patterning the pixel electrode 510 using an etchant (see...). Figure 12B Next, during the process of forming organic layers including first functional layers 521 to second functional layers 523 on the display area DA, these organic layers are also formed on the portion of the insulating layer 110 having a stepped portion 365. Afterwards, the organic layers are removed by laser etching, and the desired result is obtained. Figure 12B The state shown in the image.

[0129] After that, as Figure 12C The opposite electrode 530 is formed as shown. The opposite electrode 530 is disconnected by the undercut shape of the stepped portion 365. Since the opposite electrode 530 is disconnected, the lateral moisture penetration path through the interface between the opposite electrode 530 and the adjacent layer can be blocked.

[0130] although Figures 12A to 12C The illustration shows a scenario where the metal pattern layer M is completely removed using an etchant, but the implementation is not limited to this. In another implementation, such as... Figure 13 As shown, during the process, a portion Ma of the edge of the metal pattern layer M can be retained and the lower portion of the stepped portion 365' can be formed. Even as Figure 13The portion Ma that retains the metal pattern M is shown, but as those skilled in the art will understand, the lower width W1' of the stepped portion 365' is smaller than the upper width W2'.

[0131] Figures 7 to 10 The pixel circuit 200 and insulating layer 110 in the above reference may have the above reference. Figure 4 or Figure 5 The structure described above. For example, pixel circuit 200 and insulating layer 110 may have the same structure as described above. Figure 4 or Figure 5 The structure corresponding to the described implementation method or its variant implementation method is described, but the specific description is not repeated.

[0132] Figure 14 This is a magnified plan view of the display area surrounding the through portion in the display device 3 according to another embodiment. Figure 15 It is along Figure 14 The cross-sectional view taken by line XV-XV, and Figures 16 to 18 It shows Figure 15 A view of a variant implementation.

[0133] because Figure 14 and Figure 15 The display device 3 shown in the figure has the same characteristics as the above reference. Figure 1 and Figure 2 The display device 1 described is basically the same in structure and construction, so the main differences are described below.

[0134] refer to Figure 14 and Figure 15 The pattern portion 300C includes a groove 310C and a covering layer 320C covering the groove 310C.

[0135] The groove 310C is recessed along the thickness direction of the insulating layer 110 located on the substrate 100, and the depth d2 of the groove 310C is less than the thickness t of the insulating layer 110.

[0136] The covering layer 320C overlaps with and covers the groove 310C. The covering layer 320C is disposed directly above the portion of the insulating layer 110 that includes the groove 310C so as to directly contact the groove 310C, and a portion of the covering layer 320C may be disposed inside the groove 310C.

[0137] In one implementation, such as Figure 15 As shown, the covering layer 320C may have a multilayer structure 321 and 323 comprising the same material as the first functional layer 521 and the second functional layer 523. In another embodiment, the covering layer 320C may be a single layer 321 comprising the same material as the first functional layer 521, or it may be a single layer 323 comprising the same material as the second functional layer 523.

[0138] In another embodiment, such as Figure 16 As shown, the coating layer 320C may further include a layer 322 having the same material as the emitter layer 522. Alternatively, the coating layer 320C may be a multilayer 321 and 322 comprising the same material as the first functional layer 521 and the emitter layer 522, or it may be a multilayer 322 and 323 comprising the same material as the second functional layer 523 and the emitter layer 522. In another embodiment, the coating layer 320C may be a single layer 322 comprising the same material as the emitter layer 522.

[0139] For ease of description, the following description is as follows: Figure 15 The shown covering layer 320C has a multilayer structure 321 and 323 containing the same material as the first functional layer 521 and the second functional layer 523.

[0140] A covering layer 320C of the patterned portion 300C can be formed during the process of removing the first functional layer 521 and the second functional layer 523 formed in the second sub-non-display area NDA2 of the substrate 100. During the manufacturing process of the display device 3, the first functional layer 521 and the second functional layer 523 can be formed to cover not only the display area DA but also the second sub-non-display area NDA2 surrounding the through portion TH. Before forming the sealing layer 400, a portion of the first functional layer 521 and the second functional layer 523 corresponding to the second sub-non-display area NDA2 can be removed by laser etching. When the portion of the first functional layer 521 and the second functional layer 523 corresponding to the second sub-non-display area NDA2 is removed by laser etching, the covering layer 320C is formed by retaining a portion of the covering groove 310C of the first functional layer 521 and the second functional layer 523.

[0141] The metal pattern 360 is arranged below the groove 310C and the depth d2 of the groove 310C is adjusted. The upper surface of the metal pattern 360 corresponds to the bottom of the groove 310C.

[0142] As referenced above Figure 4 As described, a groove 310C can be formed simultaneously during the process of forming contact holes for connecting the semiconductor layer 211 to the source electrode 215s and drain electrode 215d of the TFT 210. During the etching process of forming the groove 310C, the depth d2 of the groove 310C is controlled to be less than the depth of the contact hole because the metal pattern 360 functions as an etching stop.

[0143] If the metal pattern 360 is absent, the depth d2 of the groove 310C increases and the flatness of the upper surface of the patterned portion 300C may deteriorate. For example, according to one embodiment, even if the covering layer 320C includes a layer 321 containing the same material as the first functional layer 521 and a layer 323 containing the same material as the second functional layer 523, the thickness of the covering layer 320C may be less than approximately If the depth d2 of groove 310C is greater than approximately The covering layer 320C is located inside the groove 310C and does not cover the groove 310C. If the groove 310C is not completely covered, the flatness of the upper surface of the pattern portion 300C deteriorates, and therefore, the possibility of cracks in the inorganic sealing layers 410 and 430 on the pattern portion 300C increases.

[0144] However, according to one embodiment, a metal pattern 360 is provided, and the depth of its adjusting groove 310C is adjusted to prevent deterioration of the flatness of the patterned portion 300C. In one embodiment, the depth d2 of the groove 310C may be less than the thickness of the covering layer 320C, and may be approximately... The following are examples, but the implementation methods are not limited to these.

[0145] refer to Figure 17 A layer 340 comprising the same material as the opposing electrode 530 may be further formed on the patterned portion 300C. The layer 340 may be formed during a process in which a portion of the opposing electrode 530 formed on the substrate 100 is completely removed via a laser etching process, and its description is consistent with reference to... Figure 9 The descriptions are the same.

[0146] In another embodiment, the opposing electrode 530 can be formed after the laser etching process. In this case, since there is no need for a process to remove the opposing electrode 530, as... Figure 18 As shown, the stepped portion 365 can be arranged in the second sub-non-display area NDA2. Because the stepped portion 365 has an undercut shape, it can cause the opposite electrode 530 to be disconnected. (See above reference.) Figures 10 to 13 The formation of the step portion 365 and the disconnection of the relative electrode 530 through the step portion have been described.

[0147] Figures 15 to 18 The pixel circuit 200 and insulating layer 110 in the above reference may have the above reference. Figure 4 or Figure 5 The structure described above. For example, pixel circuit 200 and insulating layer 110 may have the same structure as described above. Figure 4 or Figure 5 The structure corresponding to the described implementation method or its variant implementation method is described, but the specific description is not repeated.

[0148] Figure 19 This is a plan view showing a display device 4 according to another embodiment. Figure 20 It was extracted Figure 19 The plan view around the through section, and Figures 21A to 21G According to one implementation method, along Figure 20 A cross-sectional view taken from line XXI-XXI.

[0149] refer to Figure 19 and Figure 20 Except for the pixel array 10 partially surrounding the through portion TH, the display device 4 and the above reference Figure 1 The display devices described are the same. Similarities are omitted, and the main differences are described below.

[0150] According to one embodiment, since the pixel P of the display device 4 partially surrounds the through portion TH, the first sub-non-display area NDA1 surrounding the outer edge of the display area DA can be connected to the second sub-non-display area NDA2 that partially surrounds the outer edge of the through portion TH.

[0151] Display device 4 includes a patterned portion 1300 surrounding the through portion TH. The patterned portion 1300 may have Figures 21A to 21G The structure shown in the figure.

[0152] In one implementation, such as Figure 21A As shown, the patterned portion 1300A includes a recess 1310A recessed along the thickness direction of the insulating layer 110 and a covering layer 1320A covering the recess 1310A. Since the structure of the patterned portion 1300A including the recess 1310A and the covering layer 1320A is similar to that described above... Figures 3 to 5 Since the structures described are the same, repeated descriptions are omitted.

[0153] In another embodiment, such as Figures 21B to 21D As shown, the patterned portion 1300B includes a recess 1310B recessed along the thickness direction of the insulating layer 110 and a covering layer 1320B covering the recess 1310B. The covering layer 1320B includes a first material layer 1320B1 and a second material layer 1320B2. The first material layer 1320B1 is consistent with the above reference. Figures 7 to 9 The first material layer described is the same as 320B1.

[0154] like Figure 21B As shown, the second material layer 1320B2 may have a first functional layer 521 containing organic light-emitting diodes (OLEDs) disposed for pixels (see [reference]). Figures 7 to 9 ) and second functional layer 523 (see Figures 7 to 9 Multilayer structures 1321 and 1323 made of the same material.

[0155] Alternatively, such as Figure 21C As shown, the second material layer 1320B2 may further include the first functional layer 521, the emission layer 522, and the second functional layer 523 (see [reference]). Figures 7 to 9 Multilayer structures 1321, 1322, and 1323 made of the same material. (Example) Figure 21D As shown, the second material layer 1320B2 can be used with the opposite electrode 530 (see...). Figure 9 and Figure 10 A layer 1340 of the same material is used for covering. The number of stacked second material layers 1320B2 is not limited to the above embodiment and can be varied. For example, the second material layer 1320B2 can have a multi-layer or single-layer structure depending on the number of the first functional layer, the emission layer and the second functional layer, and its specific description is consistent with the above reference. Figures 7 to 9 The descriptions are the same.

[0156] In another embodiment, such as Figures 21E to 21G As shown, the patterned portion 1300C includes a recess 1310C recessed along the thickness direction of the insulating layer 110 and a covering layer 1320C covering the recess 1310C. The metal pattern 1360 can be disposed below the recess 1310C and the depth d2 of the recess 1310C can be controlled.

[0157] The cladding layer 1320C can have a multi-layer or single-layer structure. The cladding layer 1320C is not limited to... Figures 21E to 21G The stacked structure shown herein may have multiple or single-layer structures depending on the number of the first functional layer, the emitter layer, and the second functional layer, and its specific description is consistent with the above reference. Figures 15 to 17 The descriptions are the same.

[0158] Figure 22 This is a plan view showing a display device 5 according to another embodiment. Figure 23 It was extracted Figure 22 The plan view around the through section, and Figures 24A to 24F According to one implementation method, along Figure 22 The cross-sectional view taken from line XXIV-XXIV.

[0159] refer to Figure 22 and Figure 23 Display device 5 and above reference Figure 1 The display device described is the same, except that the pixel array 10 partially surrounds the through portion TH and that the through portion TH is not the same as the one described above. Figures 1 to 19 The single closed curve described extends beyond the edge of the display device 5. In the following text, similarities are omitted and the main differences are described.

[0160] According to one embodiment, since the pixel P of the display device 5 partially surrounds the through portion TH, the first sub-non-display area NDA1 surrounding the outer edge of the display area DA can be connected to the second sub-non-display area NDA2 that partially surrounds the outer edge of the through portion TH.

[0161] The display device 5 includes a patterned portion 2300 that partially surrounds the through portion TH. The patterned portion 2300 may have Figures 24A to 24F The structure shown in the figure.

[0162] In one implementation, such as Figures 24A to 24C As shown, the patterned portion 2300B includes a recess 2310B recessed along the thickness direction of the insulating layer 110 and a covering layer 2320B covering the recess 2310B. The covering layer 2320B includes a first material layer 2320B1 and a second material layer 2320B2. The first material layer 2320B1 is consistent with the above reference. Figures 7 to 9 The first material layer described is the same as 320B1.

[0163] like Figure 24A As shown, the second material layer 2320B2 may have a first functional layer 521 of the OLED containing the pixels (see [reference]). Figures 7 to 9 ) and second functional layer 523 (see Figures 7 to 9 Multilayer structures 2321 and 2323 made of the same material.

[0164] Alternatively, such as Figure 24B As shown, the second material layer 2320B2 may further include the first functional layer 521, the emission layer 522, and the second functional layer 523 (see [reference]). Figures 7 to 9 Multilayers of the same material, such as 2321, 2322, and 2323. Figure 24C As shown, the second material layer 2320B2 can be comprised of an electrode 530 (see Figure 1). Figure 9 and Figure 10 The same material layer 2340 covers the surface. The number of stacked second material layers 2320B2 is not limited to the above embodiment and can be varied. For example, the second material layer 2320B2 can have a multi-layer or single-layer structure depending on the number of the first functional layer, the emission layer and the second functional layer, and its specific description is consistent with the above reference. Figures 7 to 9 The descriptions are the same.

[0165] In another embodiment, such as Figures 24D to 24F As shown, the pattern portion 2300C includes a groove 2310C recessed along the thickness direction of the insulating layer 110 and a covering layer 2320C covering the groove 2310C. The metal pattern 2360 can be disposed below the groove 2310C and the depth d2 of the groove 2310C can be controlled.

[0166] The cladding layer 2320C can have a multi-layer or single-layer structure. The cladding layer 2320C is not limited to... Figures 24D to 24F The stacked structure shown herein may have multiple or single-layer structures depending on the number of the first functional layer, the emitter layer, and the second functional layer, and its specific description is consistent with the above reference. Figures 15 to 17 The descriptions are the same.

[0167] Although the inventive concept has been described with reference to embodiments shown in the accompanying drawings, this is merely exemplary, and those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the inventive concept as defined by the appended claims.

Claims

1. A display device, the display device comprising: A substrate having a through portion configured to pass through the substrate; A light-emitting element is provided on the substrate, the light-emitting element comprising a pixel electrode, a counter electrode facing the pixel electrode, and an emitting layer disposed between the pixel electrode and the counter electrode; as well as Multiple grooves are located between the through portion and the light-emitting element. The opposing electrode is disconnected by a stepped portion between the through portion and the light-emitting element, and the stepped portion is between adjacent grooves in the plurality of grooves.

2. The display device according to claim 1, further comprising: At least one of the first and second functional layers is located below the opposing electrode.

3. The display device according to claim 2, wherein, The first functional layer includes at least one of a hole injection layer and a hole transport layer, and The second functional layer includes at least one of an electron transport layer and an electron injection layer.

4. The display device according to claim 1, wherein, The stepped portion has an undercut shape.

5. The display device according to claim 4, further comprising: An insulating layer, wherein the undercut shape is defined within the insulating layer.

6. The display device according to claim 1, wherein, The stepped portion has a lower width and an upper width that is larger than the lower width.

7. The display device according to claim 1, further comprising: A covering layer that covers at least some of the plurality of grooves.

8. The display device according to claim 7, wherein, The coating layer comprises organic materials.

9. The display device according to claim 8, wherein, The upper surface of the coating layer is flat.

10. The display device according to claim 1, further comprising: A neighboring light-emitting element is adjacent to the light-emitting element, wherein the light-emitting element and the neighboring light-emitting element define a display area, and The opposing electrodes are continuously formed in the display area.

11. A display device, the display device comprising: A substrate having a through portion configured to pass through the substrate; A pixel array is provided on the substrate, the pixel array comprising a plurality of pixels, each of the plurality of pixels including a light-emitting element, the light-emitting element including a pixel electrode, a counter electrode facing the pixel electrode, and an emitting layer disposed between the pixel electrode and the counter electrode, the plurality of pixels being adjacent to the through portion; A sealing layer is placed over the pixel array; A first groove is located between the through portion and the pixel array, wherein the first groove has a first side surface having an undercut shape; and A second groove, adjacent to the first groove, wherein the second groove has a second side surface having an undercut shape. The opposing electrode is broken by the undercut shape and has a stepped portion between the first groove and the second groove.

12. The display device according to claim 11, further comprising: An insulating layer is provided above the substrate and below at least a portion of the pixel electrode, wherein the first groove and the second groove are defined within the insulating layer.

13. The display device according to claim 12, wherein, The insulating layer comprises multiple sub-insulating layers.

14. The display device according to claim 11, in, The stepped portion between the first groove and the second groove has a lower width and an upper width that is larger than the lower width.

15. The display device according to claim 11, wherein, The pixel array defines a display area, and the opposing electrodes are continuously formed in the display area.

16. The display device according to claim 11, further comprising: The third groove is closer to the through portion than the first and second grooves; as well as A covering layer that covers the third groove.

17. The display device according to claim 16, wherein, The coating layer comprises organic materials.

18. The display device according to claim 11, wherein, The sealing layer includes an inorganic sealing layer and an organic sealing layer, wherein the inorganic sealing layer extends toward the through portion to cover the first groove.

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