含二苯并八元环结构的改性环氧树脂及其制备方法、底部填充胶

A method for preparing modified epoxy resin by introducing a dibenzo-eight-membered ring structure into the main chain structure of epoxy resin reduces the thermal expansion coefficient of the bottom filler by introducing a dibenzo-eight-membered ring structural unit into the main chain structure of epoxy resin. This solves the problems of detachment, peeling, and cracking caused by the difference in thermal expansion coefficient in the prior art, and achieves excellent mechanical properties, insulation properties, and adhesion properties in multiple application environments.

CN115772253BActive Publication Date: 2026-07-17SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
Filing Date
2022-11-29
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The existing underfill adhesive suffers from detachment, peeling, and cracking due to differences in the coefficient of thermal expansion during temperature changes, threatening the lifespan and reliability of the chip. In particular, the existing technology cannot effectively solve the problem of reducing the coefficient of thermal expansion of the underfill adhesive during temperature changes.

Method used

The preparation method of modified epoxy resin by introducing a dibenzo-eight-membered ring structure into epoxy resin involves introducing a dibenzo-eight-membered ring structural unit into the main chain structure of the epoxy resin. At room temperature, this structure is in a chair-like stable structure, but under heating, the structure gradually transforms into a boat-like structure, resulting in the shrinkage of free volume and thus the negative expansion phenomenon inside the molecular structure. This effectively counteracts the thermal expansion effect of the epoxy resin composite material, thereby achieving the purpose of reducing the expansion coefficient of the bottom filler.

Benefits of technology

By introducing a dibenzo-eight-membered ring structural unit into the main chain structure of epoxy resin, the structure undergoes a transformation from a chair structure to a boat structure at room temperature, thus solving a technical problem.

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Abstract

本发明提供了一种含二苯并八元环结构的改性环氧树脂及其制备方法、底部填充胶,属于电子封装材料技术领域。本发明的含二苯并八元环结构的改性环氧树脂,在环氧树脂主链结构中引入了二苯并八元环结构单元,该结构在常温下,处于椅式稳定结构,但是在加温状态下,该结构会逐步转变为船式结构,这种构象转变,会导致自由体积的收缩,从而导致分子结构内部的负膨胀现象。本发明将含二苯并八元环结构的改性环氧树脂应用于底部填充胶中,有效抵冲环氧树脂复合材料由于温升产生的热膨胀效应,从而达到降低底部填充胶热膨胀系数的目的。
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