Circuit board connecting structure and manufacturing method thereof

Abstract

A circuit board connecting structure and a manufacturing method thereof. The circuit board connecting structure comprises a circuit board and a protection structure arranged on the circuit board. The protection structure comprises a protection film, a first circuit layer embedded in the protection film, and a conductive part electrically connected with the first circuit layer, the conductive part being a first conductive part and a second conductive part. The circuit board comprises a circuit substrate and an electronic component arranged on the surface of the circuit substrate and electrically connected with the circuit substrate, the electronic component being provided with a third conductive part away from the top surface of the circuit substrate, and the circuit substrate comprising a solder pad. The protection film is arranged on the top surface and side surface of the electronic component and the surface of the circuit substrate, so that the electronic component is covered in the protection film; the first circuit layer is arranged on the top surface and side surface of the electronic component and the surface of the circuit substrate with the electronic component, and the first conductive part is connected with the third conductive part, and the second conductive part is connected with the solder pad, so that the electronic component is electrically connected with the circuit substrate through the first circuit layer.

Description

Technical Field

[0001] This application relates to a circuit board connection structure and a method for manufacturing the circuit board connection structure. Background Technology

[0002] Circuit boards typically consist of circuit layers and electronic components (such as chips) electrically connected to those layers. These electronic components are connected to the circuit layers via solder balls or wire bonding. To protect these components, electromagnetic shielding films or protective coatings are usually applied. However, solder balls increase the thickness of the circuit board, and subsequent coatings cannot completely fill the gaps around the solder balls, leading to a popcorn effect. Wire bonding increases the lateral dimensions occupied by the chip, and the wires are prone to breakage after coating, causing short circuits. Summary of the Invention

[0003] In view of this, it is necessary to provide a circuit board connection structure and its manufacturing method that can solve the above problems.

[0004] This application provides a method for manufacturing a circuit board connection structure, comprising the following steps: providing a protective structure, the protective structure including a protective film, a first circuit layer embedded in the protective film, and a conductive portion electrically connected to the first circuit layer, the conductive portion protruding from the protective film, the conductive portion including a first conductive portion and a second conductive portion; providing a circuit board, the circuit board including a circuit substrate and an electronic component disposed on the surface of the circuit substrate and electrically connected to the circuit substrate, the electronic component having a third conductive portion on its top surface away from the circuit substrate, the circuit substrate including solder pads; covering the circuit board with the protective structure, such that the electronic component is located between the circuit substrate and the protective structure, and such that the first conductive portion corresponds to the third conductive portion, to obtain an intermediate body; pressing the intermediate body, such that the first conductive portion connects to the third conductive portion, and further bending the protective film to the side of the electronic component and the surface of the circuit substrate having the electronic component, thereby encapsulating the electronic component therein, and further bending the first circuit layer to the side of the electronic component and the surface of the circuit substrate having the electronic component so that the second conductive portion connects to the solder pads, to obtain the circuit board connection structure.

[0005] In some possible implementations, the first circuit layer includes multiple circuits, each of which has a first conductive portion and a second conductive portion at its two ends, and each circuit is curved.

[0006] In some possible implementations, the method for manufacturing the protective structure includes: providing a substrate comprising a first release layer, a first protective layer, and a second release layer stacked together; forming a circuit groove in the first release layer; forming a first circuit layer in the circuit groove; forming a second protective layer on the first protective layer having the first circuit layer, such that the first circuit layer is embedded in the second protective layer, the first protective layer and the second protective layer together constituting the protective film; forming a third release layer on the second protective layer; forming an opening in the third release layer and the second protective layer, with a portion of the first circuit layer exposed in the opening; forming the conductive portion in the opening; and removing the second release layer and the third release layer to obtain the protective structure.

[0007] In some possible implementations, the first circuit layer is fabricated by printing, electroplating, sputtering, or vapor deposition.

[0008] In some possible implementations, the conductive portion is fabricated by printing conductive paste, electroplating, sputtering, or vapor deposition.

[0009] In some possible implementations, the circuit board includes a base layer, at least one second circuit layer disposed on the surface of the base layer, and an insulating layer disposed on the outermost second circuit layer. The electronic components are bonded to the insulating layer by an adhesive layer, and the outermost portion of the second circuit layer is exposed to the insulating layer to form the solder pads.

[0010] This application also provides a circuit board connection structure, including a circuit board and a protective structure disposed on the circuit board. The protective structure includes a protective film, a first circuit layer embedded in the protective film, and a conductive portion electrically connected to the first circuit layer. The conductive portion is a first conductive portion and a second conductive portion. The circuit board includes a circuit substrate and an electronic component disposed on the surface of the circuit substrate and electrically connected to the circuit substrate. A third conductive portion is disposed on the top surface of the electronic component away from the circuit substrate. The circuit substrate includes solder pads. The protective film is disposed on the top and side surfaces of the electronic component and the surface of the circuit substrate, so that the electronic component is covered in the protective film. The first circuit layer is disposed on the top and side surfaces of the electronic component and the surface of the circuit substrate with the electronic component. The first conductive portion is connected to the third conductive portion, and the second conductive portion is connected to the solder pads, so that the electronic component is electrically connected to the circuit substrate through the first circuit layer.

[0011] In some possible implementations, the first circuit layer includes multiple circuits, each of which has a first conductive portion and a second conductive portion at its two ends, and each circuit is curved.

[0012] In some possible implementations, the circuit board includes a base layer, at least one second circuit layer disposed on the surface of the base layer, and an insulating layer disposed on the outermost second circuit layer, wherein a portion of the outermost second circuit layer is exposed to the insulating layer to form the solder pad.

[0013] In some possible implementations, the electronic components are bonded to the insulating layer via an adhesive layer.

[0014] In this application, electronic components are electrically connected to the circuit board through a first circuit layer in the protective structure, and the electronic components are embedded in the protective structure to provide protection. Since the electronic components do not need to be soldered to the circuit board pads via solder balls or wire bonding, this reduces the overall size of the circuit board connection structure and improves product integration. Furthermore, omitting the metal wires avoids short circuits caused by wire breakage during the lamination process. Attached Figure Description

[0015] Figure 1 This is a cross-sectional schematic diagram of the substrate provided in one embodiment of this application.

[0016] Figure 2 Is Figure 1 The diagram shows a cross-sectional view of the substrate after the circuit grooves have been cut.

[0017] Figure 3 Is Figure 2 The diagram shows a cross-sectional view of the first circuit layer after it has been fabricated in the circuit groove.

[0018] Figure 4a It is Figure 3 The diagram shows a cross-sectional view of the substrate after the first release layer has been removed.

[0019] Figure 4b yes Figure 4a Top view.

[0020] Figure 5 Is Figure 4a The diagram shows a cross-sectional view after the second protective layer is formed on the first line layer.

[0021] Figure 6 Is Figure 5 The diagram shows a cross-sectional view after the third release layer is formed on the second protective layer.

[0022] Figure 7 Is Figure 6 The diagram shows a cross-sectional view of the openings in the third release layer and the second protective layer.

[0023] Figure 8 Is Figure 7A cross-sectional view showing the formation of a conductive portion within the opening.

[0024] Figure 9a It is Figure 8 The diagram shows a cross-sectional view of the protective structure obtained after the removal of the second and third release layers.

[0025] Figure 9b yes Figure 9a Top view.

[0026] Figure 10 It is Figure 9a The diagram shows a cross-sectional view of the intermediate body obtained after the protective structure is applied to the circuit board.

[0027] Figure 11 It is pressing Figure 10 The diagram shows a cross-sectional view of the circuit board connection structure obtained after the intermediate body is shown.

[0028] Explanation of main component symbols

[0029] Circuit board connection structure 1

[0030] Substrate 10

[0031] First release layer 11

[0032] First protective layer 12

[0033] Second release layer 13

[0034] First Line Layer 14

[0035] Second protective layer 15

[0036] Protective film 16

[0037] Third release layer 17

[0038] Conductive part 18

[0039] Circuit board 20

[0040] Grassroots 21

[0041] Second line layer 22

[0042] Insulation layer 23

[0043] Electronic Components 30

[0044] Third conductive part 31

[0045] Adhesive layer 40

[0046] Protective structure 100

[0047] Line groove 110

[0048] Line 140

[0049] Opening 170

[0050] First conductive part 181

[0051] Second conductive part 182

[0052] Circuit board 200

[0053] solder pad 220

[0054] Surface treatment layer 221

[0055] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0056] The following description will refer to the accompanying drawings to provide a more complete picture of the present application. The drawings illustrate exemplary embodiments of the present application. However, the present application may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals denote the same or similar components.

[0057] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the application. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, when used herein, “comprising” and / or “including” or “including” or “having” and / or “having,” integers, steps, operations, components, and / or components, but does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, components, components, and / or groups thereof.

[0058] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Furthermore, unless expressly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as they have in the relevant art and in the content of this application, and will not be interpreted as having an idealized or overly formal meaning.

[0059] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments. It should be noted that components depicted in the drawings are not necessarily shown to scale; and identical or similar components will be designated with the same or similar reference numerals or similar technical terms.

[0060] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0061] One embodiment of this application provides a circuit board connection structure 1 (see reference). Figure 11 The method for making ) includes the following steps:

[0062] Step 1, please refer to Figure 1 A substrate 10 is provided, which includes a first release layer 11, a first protective layer 12 and a second release layer 13 stacked together.

[0063] In some embodiments, the first release layer 11 and the second release layer 13 may be made of polyethylene terephthalate (PET) or polycarbonate (PC). The material of the first release layer 11 may be the same as that of the second release layer 13. The first protective layer 12 may be made of epoxy resin or polyurethane (PU).

[0064] Step 2, please refer to Figure 2 A line groove 110 is formed in the first release layer 11.

[0065] In some embodiments, the line groove 110 can be formed by laser drilling, punching, or exposure development.

[0066] Step 3, please refer to Figure 3 The first circuit layer 14 is fabricated in the circuit groove 110.

[0067] In some embodiments, a first circuit layer 14 may be fabricated in the circuit groove 110 by means of printing, electroplating, sputtering, or vapor deposition. The top surface of the first circuit layer 14 may be flush with the top surface of the first release layer 11.

[0068] Step four, please refer to Figure 4a and Figure 4b Remove the first release layer 11.

[0069] Step 5, please refer to Figure 5 A second protective layer 15 is formed on a first protective layer 12 having a first line layer 14, such that the first line layer 14 is embedded in the second protective layer 15.

[0070] In some embodiments, the thickness of the second protective layer 15 is greater than the thickness of the first circuit layer 14, such that the first circuit layer 14 is completely embedded in the second protective layer 15. The material of the second protective layer 15 may be the same as that of the first protective layer 12. The first protective layer 12 and the second protective layer 15 may together form a protective film 16.

[0071] Step Six, please refer to Figure 6A third release layer 17 is formed on the second protective layer 15.

[0072] In some embodiments, the material of the third release layer 17 may be the same as that of the first release layer 11 or the second release layer 13.

[0073] Step 7, please refer to Figure 7 An opening 170 is made in the third release layer 17 and the second protective layer 15. The opening 170 is used to expose a portion of the first circuit layer 14.

[0074] Step 8, please refer to Figure 8 A conductive portion 18 electrically connected to the first circuit layer 14 is formed in the opening 170. The conductive portion 18 is divided into a first conductive portion 181 and a second conductive portion 182. The first conductive portion 181 is subsequently used to connect electronic components, and the second conductive portion 182 is subsequently used to connect circuit boards.

[0075] In some embodiments, the conductive part 18 may be fabricated by means of printing conductive paste, electroplating, sputtering or vapor deposition.

[0076] Step nine, please refer to Figure 9a and Figure 9b Remove the second release layer 13 and the third release layer 17 so that the conductive part 18 protrudes from the protective film 16, thereby obtaining the protective structure 100.

[0077] Step 10, please refer to Figure 10 A circuit board 200 is provided, which includes a circuit substrate 20 and an electronic component 30 disposed on the surface of the circuit substrate 20 and electrically connected to the circuit substrate 20. The electronic component 30 has a third conductive portion 31 on its top surface away from the circuit substrate 20. The circuit substrate 20 includes solder pads 220. Then, a protective structure 100 is covered on the circuit board 200, such that the electronic component 30 is located between the circuit substrate 20 and the protective structure 100, and such that the first conductive portion 181 of the protective structure 100 corresponds to the third conductive portion 31 of the electronic component 30. At this time, an intermediate body (not shown in the figure) is obtained.

[0078] In some embodiments, the circuit board 20 includes a base layer 21, two second circuit layers 22 disposed on opposite surfaces of the base layer 21, and an insulating layer 23 disposed on each of the second circuit layers 22. That is, the circuit board 20 can be a double-sided board. The electronic component 30 is bonded to one of the insulating layers 23 by an adhesive layer 40. The second circuit layer 22 closest to the electronic component 30 is partially exposed on the insulating layer 23 to form the solder pad 220. In some specific embodiments, the insulating layer 23 can be a solder resist or a CVL (containerless glass layer).

[0079] It is understood that the circuit board 20 of this application is not limited to a double-sided board, meaning the number of second circuit layers 22 can be varied according to specific needs. For example, in some embodiments, the circuit board 20 may include more than two second circuit layers 22, with an insulating layer 23 disposed on the outermost second circuit layer 22. The electronic component 30 is bonded to one of the insulating layers 23 via an adhesive layer 40. Furthermore, in yet another embodiment, the circuit board 20 may include only one second circuit layer 22, with an insulating layer 23 disposed on that second circuit layer 22.

[0080] Furthermore, a surface treatment can be performed on the solder pad 220 to obtain a surface treatment layer 221, in order to prevent oxidation of the solder pad 220 surface, which would affect its electrical characteristics. The surface treatment layer 221 can be a chemical plating layer formed by chemical gold plating, chemical nickel plating, or an organic solder resist protective layer.

[0081] In some embodiments, the base layer 21 may be made of one of the following: polyimide (PI), liquid crystal polymer (LCP), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). The adhesive layer 40 may be made of an adhesive resin, and more specifically, the resin may be selected from at least one of the following: polypropylene (PP), epoxy resin, polyurethane (PU), phenolic resin, urea-formaldehyde resin (UF), melamine-formaldehyde resin, and polyimide (PI).

[0082] In some embodiments, the third conductive part 31 may be a pin of the electronic component 30.

[0083] Step 11, please refer to Figure 11 The intermediate body is pressed together to obtain the circuit board connection structure 1.

[0084] In this process, the first conductive portion 181 of the first circuit layer 14 of the protective structure 100 connects to the third conductive portion 31 of the electronic component 30, and the first circuit layer 14 is bent to the side of the electronic component 30 and the surface of the circuit board 20 where the electronic component 30 is located, so that the second conductive portion 182 connects to the solder pad 220 of the circuit board 20. Thus, the electronic component 30 can be electrically connected to the circuit board 20 through the first circuit layer 14. Since the electronic component 30 is bonded to the circuit board 20, and then electrically connected to the circuit board 20 through the first circuit layer 14 via the pressing of the protective structure 100, the high-temperature reflow process required for electrically connecting the electronic component 30 to the circuit board 20 is omitted, reducing the impact of the thermal process on the electronic component 30. Therefore, this method is suitable for connecting high-temperature-sensitive electronic components 30 to the circuit board 20. Furthermore, the pressing process causes the protective film 16 of the protective structure 100 to bend to the side of the electronic component 30 and the surface of the circuit board 20 containing the electronic component 30, thereby encapsulating the electronic component 30 therein for protection.

[0085] Meanwhile, the electronic component 30 does not need to be soldered to the pads 220 of the circuit board 20 by solder balls or wire bonding, which helps to reduce the overall size of the circuit board connection structure 1 and also helps to improve product integration. Moreover, since the metal wires are omitted, the short circuit problem caused by wire breakage during the lamination process is avoided.

[0086] In some embodiments, the pressing can be performed under vacuum conditions. After pressing, baking can be performed to fully cure the protective film 16.

[0087] In some embodiments, such as Figure 4b As shown, the first circuit layer 14 obtained in step three includes multiple circuits 140, with a first conductive portion 181 and a second conductive portion 182 at each end of each circuit 140. Each circuit 140 is curved, thereby improving the stretchability of the first circuit layer 14. Thus, during the pressing process in step eleven, the first circuit layer 14 can undergo sufficient stretching deformation, causing the first circuit layer 14 to bend to the side of the electronic component 30 and the surface of the circuit board 20.

[0088] Please see Figure 11 One embodiment of this application also provides a circuit board connection structure 1, including a circuit board 200 and a protective structure 100 disposed on the circuit board 200.

[0089] The protective structure 100 includes a protective film 16, a first circuit layer 14 embedded in the protective film 16, and a conductive portion 18 electrically connected to the first circuit layer 14. The conductive portion 18 is divided into a first conductive portion 181 and a second conductive portion 182.

[0090] The circuit board 200 includes a circuit substrate 20 and an electronic component 30 disposed on the surface of the circuit substrate 20 and electrically connected to the circuit substrate 20. The electronic component 30 has a third conductive portion 31 on its top surface away from the circuit substrate 20. The circuit substrate 20 includes solder pads 220.

[0091] A protective structure 100 covers the circuit board 200. A protective film 16 is provided on the top and side surfaces of the electronic component 30 and the surface of the circuit board 20, thereby encapsulating the electronic component 30 for protection. A first circuit layer 14 is provided on the top and side surfaces of the electronic component 30 and the surface of the circuit board 20 where the electronic component 30 is located, and a first conductive portion 181 is connected to a third conductive portion 31 of the electronic component 30, and a second conductive portion 182 is connected to a solder pad 220 of the circuit board 20, so that the electronic component 30 is electrically connected to the circuit board 20 through the first circuit layer 14.

[0092] In this application, electronic component 30 is electrically connected to circuit board 20 through the first circuit layer 14 in protective structure 100, and electronic component 30 is embedded in protective structure 100 for protection. Since electronic component 30 does not need to be soldered to the pads 220 of circuit board 20 by solder balls or wire bonding, it is beneficial to reduce the overall size of circuit board connection structure 1 and improve product integration. Furthermore, by omitting the metal wires, short circuits caused by wire breakage during the lamination process are avoided.

[0093] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A method for manufacturing a circuit board connection structure, characterized in that, Includes the following steps: A protective structure is provided, the protective structure including a protective film, a first circuit layer embedded in the protective film, and a conductive portion electrically connected to the first circuit layer, the conductive portion protruding from the protective film, the conductive portion including a first conductive portion and a second conductive portion; A circuit board is provided, the circuit board including a circuit substrate and an electronic component disposed on the surface of the circuit substrate and electrically connected to the circuit substrate, the electronic component having a third conductive portion on its top surface away from the circuit substrate, and the circuit substrate including solder pads. The protective structure is covered on the circuit board, such that the electronic component is located between the circuit board and the protective structure, and the first conductive part corresponds to the third conductive part, thus obtaining an intermediate body; The intermediate body is pressed together such that the first conductive part connects to the third conductive part, and the protective film is bent to the side of the electronic component and the surface of the circuit board having the electronic component, thereby covering the electronic component therein. The first circuit layer is also bent to the side of the electronic component and the surface of the circuit board having the electronic component so that the second conductive part connects to the solder pad, thus obtaining the circuit board connection structure.

2. The method for manufacturing the circuit board connection structure as described in claim 1, characterized in that, The first circuit layer includes multiple circuits, each of which has a first conductive part and a second conductive part at its two ends, and each circuit is curved.

3. The method for manufacturing the circuit board connection structure as described in claim 1, characterized in that, The method for manufacturing the protective structure includes: A substrate is provided, the substrate comprising a first release layer, a first protective layer and a second release layer stacked together; Line grooves are formed in the first release layer; The first circuit layer is fabricated in the circuit groove; A second protective layer is formed on the first protective layer having the first circuit layer, such that the first circuit layer is embedded in the second protective layer, and the first protective layer and the second protective layer together constitute the protective film. A third release layer is formed on the second protective layer; An opening is made in the third release layer and the second protective layer, and a portion of the first circuit layer is exposed through the opening; The conductive portion is formed in the opening; The second release layer and the third release layer are removed to obtain the protective structure.

4. The method for manufacturing the circuit board connection structure as described in claim 3, characterized in that, The first circuit layer is fabricated by printing, electroplating, sputtering, or vapor deposition.

5. The method for manufacturing the circuit board connection structure as described in claim 3, characterized in that, The conductive part is manufactured by printing conductive paste, electroplating, sputtering or vapor deposition.

6. The method for manufacturing the circuit board connection structure as described in claim 1, characterized in that, The circuit board includes a base layer, at least one second circuit layer disposed on the surface of the base layer, and an insulating layer disposed on the outermost second circuit layer. The electronic components are bonded to the insulating layer by an adhesive layer, and the outermost portion of the second circuit layer is exposed to the insulating layer to form the solder pad.

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